Wafer loading and unloading equipment and wafer aging test system

Abstract

The application relates to the technical field of wafer testing, in particular to a wafer feeding and discharging device and a wafer aging test system; the wafer feeding and discharging device comprises a heat sink carrying assembly, a heat sink carrying slide rail and a heat sink loading platform for carrying a heat sink, the heat sink loading platform is in sliding connection with the heat sink carrying slide rail, one end of the heat sink carrying slide rail is a wafer loading end for wafer feeding, the other end of the heat sink carrying slide rail is a loading feeding end for conveying the wafer after wafer feeding to a next process and for recycling the empty heat sink; the wafer material taking assembly comprises a wafer material taking slide rail and a wafer adsorption device for adsorbing a wafer, the wafer adsorption device is in sliding connection with the wafer material taking slide rail, and the wafer adsorption device is arranged above the heat sink carrying assembly; the wafer adsorption device is arranged in the wafer feeding and discharging device, and the wafer is placed on the heat sink from top to bottom, so that the number of through holes on the surface of the heat sink is reduced, and then the back of the wafer is prevented from whitening.

Description

Technical Field

[0001] This application relates to the field of wafer testing technology, and in particular to a wafer loading and unloading device and a wafer aging test system. Background Technology

[0002] During the wafer loading process, the wafer needs to be loaded onto the heat sink. In the existing technology, a conveyor belt method is usually used to load the wafer and the heat sink. However, this loading method requires a lot of vias on the surface of the heat sink, which can easily cause the back side of the wafer to turn white. Summary of the Invention

[0003] To address the aforementioned problems in the prior art, the purpose of this application is to install a wafer adsorption device in a wafer loading and unloading equipment, and place the wafer on the heat sink from top to bottom, thereby reducing the number of vias on the heat sink surface and thus preventing whitening of the back side of the wafer.

[0004] To address the aforementioned problems, this application provides a wafer loading and unloading device, the wafer loading and unloading device comprising:

[0005] A heat sink handling assembly includes a heat sink handling slide rail and a heat sink loading platform for carrying the heat sink. The heat sink loading platform is slidably connected to the heat sink handling slide rail. One end of the heat sink handling slide rail is a wafer loading end for wafer loading, and the other end of the heat sink handling slide rail is a loading and loading end for conveying the wafer to the next process after loading and for recycling the empty heat sink.

[0006] The wafer picking assembly includes a wafer picking slide rail and a wafer adsorption device for adsorbing wafers. The wafer adsorption device is slidably connected to the wafer picking slide rail and is disposed above the heat sink transport assembly.

[0007] In this embodiment of the application, the wafer loading and unloading equipment further includes:

[0008] An ion rod is fixedly connected to the wafer adsorption device.

[0009] In this embodiment of the application, the heat sink loading platform includes:

[0010] The first clamping structure includes a first movable member that can be movably disposed along a first direction, the first movable member being able to movably abut against the heat sink;

[0011] The second clamping structure includes a second movable member that is movably disposed along a second direction, the second movable member being able to abut against the heat sink.

[0012] In this embodiment of the application, the first clamping structure further includes:

[0013] The first clamping cylinder, the output end of the first clamping cylinder is fixedly connected to the first movable part;

[0014] The second clamping structure also includes:

[0015] The output end of the second clamping cylinder is fixedly connected to the second movable part.

[0016] In this embodiment of the application, the heat sink loading platform includes:

[0017] The first platform is slidably connected to the heat sink transport slide rail;

[0018] A second platform is disposed above the first platform and is slidably connected to the first platform; the heat sink is placed on the second platform;

[0019] A position adjustment drive device is fixedly connected to the first platform;

[0020] One end of the transmission lead screw is connected to the position adjustment drive device, and the other end is fixedly connected to the second platform.

[0021] In this embodiment of the application, the wafer loading and unloading equipment further includes:

[0022] The heat sink cleaning assembly includes at least one air outlet pipe, which is fixedly connected to the wafer pick-up slide rail, and the air outlet of the at least one air outlet pipe corresponds to the platform surface where the heat sink loading platform is located.

[0023] In this embodiment of the application, the heat sink cleaning assembly further includes:

[0024] The cleaning brush structure is fixedly connected to the wafer adsorption device.

[0025] In this embodiment of the application, the cleaning brush structure includes:

[0026] Cleaning brush,

[0027] A brush drive device is connected to the cleaning brush drive to drive the cleaning brush to move toward the heat sink loading platform.

[0028] In this embodiment of the application, the wafer adsorption device includes:

[0029] Adsorption grippers are used to adsorb onto the surface of wafers;

[0030] An adsorption drive device is connected to the adsorption gripper drive to drive the adsorption gripper to move toward the heat sink loading platform.

[0031] In this embodiment of the application, the adsorption gripper includes:

[0032] Multiple adsorption feet, the ends of which are in contact with the surface of the wafer;

[0033] The gripper chassis is equipped with size adjustment slide rails, the number of which is the same as the number of suction feet;

[0034] The size adjustment device is slidably connected to the size adjustment slide rail and fixedly connected to the adsorption feet; the number of size adjustment slide rails is the same as the number of adsorption feet.

[0035] In this embodiment of the application, the wafer loading and unloading equipment further includes:

[0036] An image acquisition device is fixedly connected to the wafer adsorption device and is positioned above the heat sink support platform.

[0037] In this embodiment of the application, the wafer loading and unloading equipment further includes:

[0038] The first mounting base, wherein the heat sink transport slide rail is disposed on the first mounting base;

[0039] The second mounting base is provided with the wafer pick-up slide rail, which is located above the first mounting base.

[0040] In this embodiment of the application, the wafer loading and unloading equipment further includes an edge-finding mechanism, a robotic arm, and multiple chucks;

[0041] The robotic arm carries the wafer and moves between any chuck, the edge-finding mechanism, and the heat sink loading platform to transfer the wafer.

[0042] The wafer picking assembly picks up wafers from the edge-finding mechanism.

[0043] On the other hand, this application also provides a wafer aging test system, the test system including the wafer loading and unloading equipment and the wafer aging test equipment in the embodiments of this application, wherein the loading and unloading end is the input end of the wafer aging test equipment.

[0044] Due to the above technical solution, the wafer loading and unloading equipment described in this application has the following beneficial effects:

[0045] By setting up a wafer adsorption device and placing it above the heat sink transport assembly, wafers can be picked up from the front side and placed on the heat sink from top to bottom. This reduces the number of vias on the heat sink surface and prevents whitening of the back side of the wafer. Attached Figure Description

[0046] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0047] Figure 1 is a schematic diagram of the structure of the wafer loading and unloading equipment in an embodiment of this application;

[0048] Figure 2 is a schematic diagram of the structure of the heat sink handling component of the wafer loading and unloading equipment in an embodiment of this application;

[0049] Figure 3 is a schematic diagram of the structure of the wafer loading and unloading equipment in the embodiments of this application;

[0050] Figure 4 is a schematic diagram of the first clamping structure and the second clamping structure of the wafer loading and unloading equipment in the embodiments of this application;

[0051] Figure 5 is an assembly schematic diagram of the heat sink loading platform of the wafer loading and unloading equipment in an embodiment of this application;

[0052] Figure 6 is an assembly diagram of the first platform and the second platform of the wafer loading and unloading equipment in an embodiment of this application;

[0053] Figure 7 is a schematic diagram of the cleaning brush structure of the wafer loading and unloading equipment in the embodiments of this application;

[0054] Figure 8 is a schematic diagram of the wafer adsorption device structure of the wafer loading and unloading equipment in the embodiments of this application.

[0055] Among them, 1-heat sink conveying assembly, 11-heat sink conveying slide rail, 12-heat sink loading platform, 121-first platform, 122-second platform, 123-position adjustment drive device, 124-transmission screw, 13-first clamping structure, 131-first moving part, 132-first clamping cylinder, 133-first speed regulating valve, 14-second clamping structure, 141-second moving part, 142-second clamping cylinder, 143-second speed regulating valve, 15-first conveying drive device. 2-Wafer picking assembly, 21-Wafer picking slide rail, 22-Wafer adsorption device, 221-Adsorption gripper, 222-Adsorption drive device, 223-Adsorption foot, 224-Gripper chassis, 225-Size adjustment device, 26-Second handling drive device, 3-Heat sink cleaning assembly, 31-Air outlet duct, 32-Cleaning brush structure, 321-Cleaning brush, 322-Brush drive device, 4-Ion bar, 5-Image acquisition device, 6-First mounting base, 7-Second mounting base. Detailed Implementation

[0056] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0057] The term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of this application. In the description of this application, it should be understood that the terms "upper," "lower," "left," "right," "top," "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.

[0058] Combination Figure 1-3 This application describes a wafer loading and unloading device provided in an embodiment, the device comprising:

[0059] The heat sink handling assembly 1 includes a heat sink handling slide rail 11 and a heat sink loading platform 12 for carrying the heat sink. The heat sink loading platform 12 is slidably connected to the heat sink handling slide rail 11. One end of the heat sink handling slide rail 11 is a wafer loading end for wafer loading, and the other end of the heat sink handling slide rail 11 is a loading end for conveying the wafer to the next process after loading and for recycling the empty heat sink.

[0060] The wafer picking assembly 2 includes a wafer picking slide rail 21 and a wafer adsorption device 22 for adsorbing wafers. The wafer adsorption device 22 is slidably connected to the wafer picking slide rail 21 and is disposed above the heat sink transport assembly 1.

[0061] In this embodiment, the heat sink loading platform 12 drives the heat sink transport as it slides on the heat sink transport slide rail 11; the wafer adsorption device 22 drives the wafer transport as it slides on the wafer picking slide rail 21.

[0062] In specific embodiments of this application, an empty heat sink can be a heat sink without a wafer loaded, or it can refer to a heat sink with a wafer loaded. It should be noted that when a wafer is loaded on an empty heat sink, the wafer on the empty heat sink has already completed the post-loading process, such as a wafer after the aging test.

[0063] In this embodiment of the application, by setting up a wafer adsorption device 22 for adsorbing wafers and placing the wafer adsorption device 22 above the heat sink transport assembly 1, it is possible to pick up the wafer from the front side and place the wafer on the heat sink from top to bottom, thereby reducing the number of vias on the heat sink surface and thus avoiding whitening of the back side of the wafer.

[0064] In this embodiment of the application, the wafer loading and unloading equipment further includes:

[0065] Ion rod 4 is fixedly connected to wafer adsorption device 22.

[0066] In this embodiment, the ion rod 4 is used to release positive and negative charges to neutralize static electricity on the wafer surface and prevent electrostatic adsorption or discharge interference.

[0067] In a specific embodiment of this application, the ion rod 4 is disposed within a preset range of the wafer adsorption device 22.

[0068] In this embodiment, by fixing the ion rod 4 to the wafer adsorption device 22, the static electricity during the wafer handling process is reduced, thereby improving the reliability of the wafer loading and unloading equipment.

[0069] refer to Figure 4 In this embodiment of the application, the heat sink loading platform 12 includes:

[0070] The first clamping structure 13 includes a first movable member 131 that can be movably disposed along a first direction, and the first movable member 131 can movably abut against the heat sink.

[0071] The second clamping structure 14 includes a second movable member 141 that is movably disposed along a second direction, and the second movable member 141 is capable of moving into contact with the heat sink.

[0072] In a specific embodiment of this application, the second direction is perpendicular to the first direction, and the heat sink loading platform 12 is provided with at least two clamping edges, which correspond to the first clamping structure 13 and the second clamping structure 14 respectively.

[0073] In this embodiment of the application, the heat sink is clamped by setting a first clamping structure 13 and a second clamping structure 14, thereby improving the positioning stability of the heat sink.

[0074] In another specific embodiment of this application, the first direction is opposite to the second direction, that is, the first clamping structure 13 and the second clamping structure 14 are arranged opposite to each other, thereby achieving relative clamping.

[0075] In this embodiment of the application, the first clamping structure 13 further includes a first clamping cylinder 132, the output end of which is fixedly connected to the first movable member 131.

[0076] The second clamping structure 14 further includes a second clamping cylinder 142, the output end of which is fixedly connected to the second movable member 141.

[0077] In a specific embodiment of this application, the first clamping cylinder 132 and the second clamping cylinder 142 are controlled by a solenoid valve.

[0078] In a specific embodiment of this application, the first clamping structure 13 further includes at least one first speed regulating valve 133, which is used to regulate the movement speed of the first clamping cylinder 132; the second clamping structure 14 further includes at least one second speed regulating valve 143, which is used to regulate the movement speed of the second clamping cylinder 142.

[0079] refer to Figure 5-6 In this embodiment of the application, the heat sink loading platform 12 includes:

[0080] The first platform 121 is slidably connected to the heat sink transport slide rail 11.

[0081] The second platform 122 is located above the first platform 121 and is slidably connected to the first platform 121; the heat sink is placed on the second platform 122.

[0082] The position adjustment drive device 123 is fixedly connected to the first platform 121.

[0083] One end of the transmission lead screw 124 is connected to the position adjustment drive device 123, and the other end is fixedly connected to the second platform 122.

[0084] In a specific embodiment of this application, the position adjustment drive device 123 drives the first platform 16 to slide relative to the second platform 15 through the transmission screw 124, thereby adjusting the position of the heat sink and improving the assembly flexibility of the heat sink and the wafer.

[0085] In a specific embodiment of this application, the sliding direction of the first platform 121 and the second platform 122 forms a preset angle with the sliding direction of the first platform 121 and the heat sink transport slide rail 11. Preferably, the preset angle is 90°, so as to form an xy axis to adjust the position of the heat sink.

[0086] In a specific embodiment of this application, the heat sink transport assembly 1 further includes a first transport drive device 15, which is driven to connect with the heat sink loading platform 12 to drive the heat sink loading platform 12 to slide on the heat sink transport slide rail 11; the wafer picking assembly 2 further includes a second transport drive device 26, which is driven to connect with the wafer adsorption device 22 to drive the wafer adsorption device 22 to slide on the wafer picking slide rail 21.

[0087] In a specific embodiment of this application, the first transport drive device 15 may be a drive motor or a drive cylinder; the second transport drive device 26 may be a drive motor or a drive cylinder.

[0088] In this embodiment of the application, the wafer loading and unloading equipment further includes:

[0089] The heat sink cleaning assembly 3 includes at least one air outlet 31, which is fixedly connected to the wafer pick-up slide rail 21, and the air outlet of the at least one air outlet 31 corresponds to the platform surface where the heat sink loading platform 12 is located.

[0090] In a specific embodiment of this application, there may be two air outlet pipes 31.

[0091] In this embodiment of the application, a heat sink cleaning component 3 is set in the wafer loading and unloading equipment, and the air outlet of the air outlet 31 in the heat sink cleaning component 3 is aligned with the platform surface where the heat sink loading platform 12 is located, so that the air blown out by the air outlet 31 can blow towards the heat sink loading platform 12 to clean the surface of the heat sink, blow away foreign objects on the heat sink, improve the cleanliness of the heat sink surface, avoid the influence of foreign objects on the wafer aging test, and thus improve the accuracy of the wafer aging test.

[0092] refer to Figure 7 In this embodiment, the heat sink cleaning assembly 3 further includes:

[0093] The cleaning brush structure 32 is fixedly connected to the wafer adsorption device 22.

[0094] In this embodiment, the cleaning brush structure 32 is used to clean the heat sink surface.

[0095] In this embodiment, by setting the cleaning brush structure 32, the surface of the heat sink can be further cleaned, the cleanliness of the heat sink surface can be improved, the influence of foreign objects on the wafer aging test can be avoided, and the accuracy of the wafer aging test can be improved.

[0096] In this embodiment, the cleaning brush structure 32 includes:

[0097] Cleaning brush 321.

[0098] The brush drive device 322 is connected to the cleaning brush 321 to drive the cleaning brush 321 to move toward the heat sink loading platform 12.

[0099] In this embodiment, the cleaning brush 321 moves relative to the heat sink loading platform 12 under the drive of the brush driving device 322; specifically, the cleaning brush 321 moves toward the heat sink loading platform 12, so that the cleaning brush 321 contacts the heat sink surface to clean the heat sink surface; the cleaning brush 321 moves away from the heat sink loading platform 12, so that the cleaning brush 321 disengages from the heat sink surface.

[0100] In this embodiment of the application, by providing a brush drive device 322, the cleaning brush 321 is driven to move away from or towards the heat sink loading platform 12, thereby improving the flexibility of cleaning the heat sink surface.

[0101] In a specific embodiment of this application, the brush driving device 322 may be a drive motor or a drive cylinder.

[0102] refer to Figure 8 In this embodiment, the wafer adsorption device 22 includes:

[0103] Adsorption gripper 221 is used to adsorb the surface of a wafer.

[0104] The adsorption drive device 222 is connected to the adsorption gripper 221 to drive the adsorption gripper 221 to move toward the heat sink loading platform 12.

[0105] In this embodiment, the adsorption gripper 221 moves relative to the heat sink loading platform 12 under the drive of the adsorption driving device 222. Specifically, the adsorption gripper 221 moves toward the heat sink loading platform 12, thereby adsorbing the front side of the wafer or placing the wafer on the surface of the heat sink; the adsorption gripper 221 moves away from the heat sink loading platform 12, thereby lifting and transporting the wafer or detaching from the wafer and returning it to its original position.

[0106] In this embodiment of the application, by setting an adsorption driving device 222, the adsorption gripper 221 is driven to adsorb or place the wafer on the surface of the heat sink, thereby improving the flexibility of wafer loading and picking up the wafer from the front side and placing the wafer on the heat sink from top to bottom, thereby reducing the number of vias on the heat sink and thus avoiding whitening of the back side of the heat sink.

[0107] In a specific embodiment of this application, the adsorption driving device 222 can be a drive motor or a drive cylinder.

[0108] In this embodiment of the application, the adsorption gripper 221 includes:

[0109] Multiple adsorption feet 223, with their ends in contact with the surface of the wafer.

[0110] The gripper chassis 224 is equipped with size adjustment slide rails, and the number of size adjustment slide rails is the same as the number of suction feet 223.

[0111] The size adjustment device 225 is slidably connected to the size adjustment slide rail and fixedly connected to the suction feet 223; the number of size adjustment slide rails is the same as the number of suction feet 223.

[0112] In a specific embodiment of this application, the size adjustment device 225 adjusts its position on the size adjustment slide rail, thereby changing the position of multiple adsorption feet 223 to adapt to wafers of different sizes. For example, the two ends of the size adjustment slide rail are a first end and a second end, respectively. When the size adjustment device 225 slides to the first end, the multiple adsorption feet 223 can adapt to a 6-size wafer; when the size adjustment device 225 slides to the second end, the multiple adsorption feet 223 can adapt to an 8-size wafer, thereby achieving multi-size wafer matching.

[0113] In this embodiment, by setting a size adjustment device 225 and a size adjustment slide rail, the adsorption gripper 221 can be adapted to wafers of multiple sizes, thereby increasing the application range of the wafer loading and unloading equipment and reducing the cost of wafer aging test.

[0114] In a specific embodiment of this application, the adsorption foot 223 can be a toothed fork structure, and the contact end of the adsorption foot 223 with the wafer is provided with a rubber suction nozzle, thereby reducing damage to the wafer surface during the adsorption process.

[0115] In this embodiment of the application, the wafer loading and unloading equipment further includes:

[0116] The image acquisition device 5 is fixedly connected to the wafer adsorption device 22 and is positioned above the heat sink support platform.

[0117] In this embodiment of the application, the image acquisition device 5 is used to monitor the cleanliness of the heat sink surface to determine whether there are foreign objects on the heat sink surface; the image acquisition device 5 can also be used to monitor the loading status of the wafer and the heat sink to determine whether the wafer is within the preset range of the heat sink.

[0118] In this embodiment of the application, by setting up an image acquisition device 5, the cleanliness of the heat sink surface is monitored, as well as the assembly accuracy of the wafer and the heat sink, thereby improving the reliability of wafer loading and the accuracy of wafer aging test.

[0119] In this embodiment of the application, by setting up an image acquisition device 5 to determine the specific loading position of the wafer and the heat sink, that is, to realize the positioning of the wafer and the heat sink, thereby improving the positioning accuracy of the wafer or heat sink during the aging test and reducing the rotation distance of the wafer or heat sink during the aging test, thus improving the reliability of the aging test.

[0120] In this embodiment of the application, the wafer loading and unloading equipment further includes:

[0121] The first mounting base 6 and the heat sink transport slide rail 11 are mounted on the first mounting base 6.

[0122] The second mounting base 7 has a wafer pick-up slide rail 21 mounted on it, and the wafer pick-up slide rail 21 is located above the first mounting base 6.

[0123] In a specific embodiment of this application, the second mounting base 7 is shaped like a "Z", wherein the first mounting base 6 is located inside the second mounting base 7, and the wafer pick-up slide rail 21 is disposed on the "Z" shaped crossbeam.

[0124] In this embodiment of the application, by setting the first mounting base 6 and the second mounting base 7, the structural assembly of the wafer loading and unloading equipment is stabilized, thereby improving the reliability of wafer loading.

[0125] In a specific embodiment of this application, the wafer loading and unloading equipment further includes a controller, which is electrically connected to the first transport drive device and the second transport drive device, respectively.

[0126] In a specific embodiment of this application, the controller is also electrically connected to the first clamping cylinder and the second clamping cylinder, respectively.

[0127] In a specific embodiment of this application, the controller is also electrically connected to the brush drive device 322.

[0128] In a specific embodiment of this application, the controller is also electrically connected to the adsorption drive device 222.

[0129] In a specific embodiment of this application, the controller is also electrically connected to the image acquisition device 5.

[0130] In this embodiment, the wafer loading and unloading equipment further includes an edge-finding mechanism, a robotic arm, and multiple chucks; the robotic arm carries the wafer to transfer the wafer between any of the chucks, the edge-finding mechanism, and the heat sink loading platform.

[0131] In a specific embodiment of this application, the cassette is a structure for storing wafers.

[0132] In a specific embodiment of this application, by setting multiple chucks, the robotic arm can pick up materials from multiple chucks in a cross-cutting manner, thereby reducing the wafer loading time interval and improving wafer loading efficiency.

[0133] The working principle of the wafer loading and unloading equipment in the embodiments of this application is described below:

[0134] First, the relative position of the size adjustment device 225 and the size adjustment slide rail is adjusted based on the size of the wafer to adapt to the wafer size. This adjustment process can be done manually or by sending a control signal from the controller. Then, after the unloaded heat sink is loaded onto the heat sink loading platform 12 from the loading end, the unloaded heat sink is clamped by the first clamping structure 13 and the second clamping structure 14. Then, the heat sink loading platform 12 is controlled to slide on the heat sink transport slide rail 11.

[0135] When the heat sink loading platform 12 reaches the wafer loading end, the heat sink cleaning device is activated to clean the surface of the heat sink. Specifically, the cleaning brush structure 32 brushes the surface of the heat sink, and the air outlet 31 blows away foreign objects on the surface of the heat sink by blowing air, thereby achieving the cleaning of the surface of the heat sink. During this process, the cleanliness of the surface of the heat sink can be judged by the image acquired by the image acquisition device 5.

[0136] After cleaning is completed, the wafer adsorption device 22 is controlled to slide on the wafer pick-up slide rail 21. After the wafer adsorption device 22 reaches the preset position, the adsorption drive device 222 is controlled to move towards the heat sink loading platform 12 so that the multiple adsorption feet 223 contact the wafer surface and adsorb the wafer onto the wafer adsorption device 22.

[0137] After the wafer adsorption device 22 adsorbs the wafer, the adsorption drive device 222 is controlled to move away from the heat sink loading platform 12. Then, the wafer adsorption device 22 is controlled to slide on the wafer picking slide rail 21 so that the wafer adsorption device 22 is positioned above the heat sink loading platform 12. Specifically, the position of the heat sink can be adjusted by the position adjustment drive device 123 and the transmission screw 124 so that the wafer is positioned above the heat sink.

[0138] When the wafer is above the heat sink, the adsorption drive is controlled to move towards the heat sink loading platform 12 so that the wafer falls onto the heat sink, and then the adsorption of the wafer adsorption device 22 is released; then the adsorption drive device 222 is controlled to move away from the heat sink loading platform 12; during this period, the relative position of the wafer and the heat sink can be determined by the image acquired by the image acquisition device 5, and when the wafer is within the preset range of the heat sink, the wafer is removed from the adsorption.

[0139] The wafer loading and unloading equipment in this application embodiment has the following beneficial effects:

[0140] By setting up a wafer adsorption device and placing the wafer adsorption device 22 above the heat sink transport assembly 1, it is possible to pick up the wafer from the front side and place the wafer on the heat sink from top to bottom, thereby reducing the number of vias on the heat sink surface and preventing whitening of the back side of the heat sink.

[0141] This application also provides a wafer aging test system, which includes the wafer loading and unloading equipment and the wafer aging test equipment described in this application embodiment, wherein the loading and unloading end is the input end of the wafer aging test equipment.

[0142] In a specific embodiment of this application, after the wafer and heat sink are loaded, they are sent to the wafer aging test equipment for wafer aging test; at the same time, the unloaded heat sink that has completed the wafer aging test is placed on the heat sink loading platform 12 from the loading end.

[0143] The foregoing description has fully disclosed the specific embodiments of this application. It should be noted that any modifications made to the specific embodiments of this application by those skilled in the art do not depart from the scope of the claims. Accordingly, the scope of the claims is not limited to the foregoing specific embodiments.

Claims

1. A wafer loading and unloading device, characterized in that, include: A heat sink handling assembly includes a heat sink handling slide rail and a heat sink loading platform for carrying the heat sink. The heat sink loading platform is slidably connected to the heat sink handling slide rail. One end of the heat sink handling slide rail is a wafer loading end for wafer loading, and the other end of the heat sink handling slide rail is a loading and loading end for conveying the wafer to the next process after loading and for recycling the empty heat sink. The wafer picking assembly includes a wafer picking slide rail and a wafer adsorption device for adsorbing wafers. The wafer adsorption device is slidably connected to the wafer picking slide rail and is disposed above the heat sink transport assembly.

2. The wafer loading and unloading equipment according to claim 1, characterized in that, The heat sink loading platform includes: The first clamping structure includes a first movable member that is movably disposed along a first direction, and the first movable member movably abuts against the heat sink. The second clamping structure includes a second movable member that is movably disposed along a second direction, the second movable member being in active contact with the heat sink.

3. The wafer loading and unloading equipment according to claim 2, characterized in that, The first clamping structure further includes: The first clamping cylinder, the output end of the first clamping cylinder is fixedly connected to the first movable part; The second clamping structure also includes: The output end of the second clamping cylinder is fixedly connected to the second movable part.

4. The wafer loading and unloading equipment according to claim 1, characterized in that, The heat sink loading platform includes: The first platform is slidably connected to the heat sink transport slide rail; A second platform is disposed above the first platform and is slidably connected to the first platform; the heat sink is placed on the second platform; A position adjustment drive device is fixedly connected to the first platform; One end of the transmission lead screw is connected to the position adjustment drive device, and the other end is fixedly connected to the second platform.

5. The wafer loading and unloading equipment according to claim 1, characterized in that, Also includes: The heat sink cleaning assembly includes at least one air outlet pipe, which is fixedly connected to the wafer pick-up slide rail, and the air outlet of the at least one air outlet pipe corresponds to the platform surface where the heat sink loading platform is located.

6. The wafer loading and unloading equipment according to claim 1, characterized in that, The wafer adsorption device includes: Adsorption grippers are used to adsorb onto the surface of wafers; An adsorption drive device is connected to the adsorption gripper drive to drive the adsorption gripper to move toward the heat sink loading platform.

7. The wafer loading and unloading equipment according to claim 6, characterized in that, The adsorption gripper includes: Multiple adsorption feet, the ends of which are in contact with the surface of the wafer; The gripper chassis is equipped with size adjustment slide rails, the number of which is the same as the number of suction feet; The size adjustment device is slidably connected to the size adjustment slide rail and fixedly connected to the adsorption feet; the number of size adjustment slide rails is the same as the number of adsorption feet.

8. The wafer loading and unloading equipment according to claim 1, characterized in that, Also includes: An image acquisition device is fixedly connected to the wafer adsorption device and is positioned above the heat sink support platform.

9. The wafer loading and unloading equipment according to claim 1, characterized in that, Also includes: The first mounting base, wherein the heat sink transport slide rail is disposed on the first mounting base; The second mounting base is provided with the wafer pick-up slide rail, which is located above the first mounting base.

10. The wafer loading and unloading equipment according to claim 1, characterized in that, It also includes an edge-finding mechanism, a robotic arm, and multiple clips; The robotic arm carries the wafer and moves between any chuck, the edge-finding mechanism, and the heat sink loading platform to transfer the wafer.

11. A wafer aging test system, characterized in that, Includes the wafer loading / unloading equipment and the wafer aging test equipment as described in any one of claims 1-10, wherein the loading / unloading end is the input end of the wafer aging test equipment.

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