Docking station

By combining the heat shield and composite circuit board design, a three-level heat zoning mechanism is constructed, which solves the problem of heat transfer to the user contact surface in traditional expansion docks, and achieves efficient heat dissipation and improved user safety.

CN224553721UActive Publication Date: 2026-07-24SHENZHEN VELOCITY TECH INNOVATIONS CO LTD
0 Cites 0 Cited by

Patent Information

Application Number
CN202521560624.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-24
Publication Date
2026-07-24
Estimated Expiration
2035-07-24

AI Technical Summary

Technical Problem

In traditional docking station designs, the housing serves as the primary heat dissipation medium, which cannot effectively prevent heat transfer to the user's contact surface. This leads to an increase in the housing surface temperature, affecting user touch comfort and potentially causing device overheating, decreased interface stability, and shortened lifespan.

Method used

The design employs a combination of a heat shield, a housing, and a composite circuit board. By physically isolating the outer periphery of the heat shield, creating an air gap layer through the raised support at the bottom of the housing, and establishing a vertical heat dissipation path within the composite circuit board, a three-level heat zoning mechanism is constructed to block heat conduction and guide heat flow along the axial direction.

Benefits of technology

Significantly improves heat dissipation efficiency, ensures low temperature at user contact surfaces, eliminates the risk of overheating, reduces the temperature of the housing sidewalls, extends equipment life, and improves interface stability.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The utility model provides a docking station which comprises a heat shield, a shell and a composite circuit board, the shell and the heat shield form a gap through a heightening support, the composite circuit board forms a heat dissipation channel through an upper layer circuit board and a lower layer circuit board, a heating area directly faces a first heat dissipation groove in the top of the shell, and the gap, the heat dissipation channel and the heat dissipation groove are communicated to form a heat dissipation path. Heat conduction is blocked through gaps, axial circulation of heat is limited through the vertical alignment design, airflow is guided to be sucked from the bottom and discharged from the top through the chimney effect, a heating area and a non-contact area are isolated, the heat dissipation efficiency is effectively improved, and hands are prevented from being scalded.
Need to check novelty before this filing date? Find Prior Art