An implant system for a patch capacitor

Abstract

This utility model discloses a chip capacitor implantation system, including a storage mechanism, an implantation mechanism, a leveling mechanism, a transfer mechanism, and a feeding mechanism. The feeding mechanism includes a translation device, an NG storage rack, and a flipping device. The translation device is installed on the edge of the feeding end of the leveling mechanism. The NG storage rack is located below the feeding end of the translation device. The flipping device is located on one side of the NG storage rack, and the loading end of the flipping device is located between the feeding end of the translation device and the NG storage rack. The flipping device is used to adsorb the carrier plate and realize the flipping of the carrier plate. The chip capacitor implantation system proposed in this solution can realize the automatic implantation of chip capacitors during the sealing process, improve the sealing efficiency of chip capacitors, and help reduce the labor cost in the sealing process. In addition, through the ultra-simple structural design, it can realize the classified transportation of two types of products at the feeding end of the leveling mechanism, which helps to improve the overall production cycle of chip capacitors.

Description

Technical Field

[0001] This utility model relates to the technical field of surface mount capacitor production equipment, and in particular to a surface mount capacitor implantation system. Background Technology

[0002] With the rapid development of electronic technology, the types of electronic components are becoming increasingly diverse. As people's requirements for the quality of electronic products continue to improve, capacitors, as a basic and important electronic component, are also widely used in the production of electronic products, and the production and processing technology of capacitors is also constantly improving.

[0003] As one of the key processes in capacitor manufacturing, the sealing process plays a decisive role in the production efficiency, product performance, and quality of capacitors. The sealing process usually requires a sealing machine to complete.

[0004] To facilitate the mass production and sealing of surface mount capacitors, adhesive application and implantation are generally required before sealing. Specifically, the operator first prepares a carrier board, a fixing sticker, and unsealed surface mount capacitors. Then, the fixing sticker is affixed to one side of the carrier board, and the unsealed surface mount capacitors are manually spread on the other side of the carrier board so that they are implanted into the material holes of the carrier board. At the same time, one end of the surface mount capacitor is adhered to the fixing sticker. After the above operations are completed, the sealing machine performs silver printing for sealing.

[0005] As can be seen from the above, existing end-sealing machines can generally only perform the silver printing step in the end-sealing process, while the implantation step before the silver printing step needs to be completed manually, which greatly increases the labor cost in the end-sealing process; in addition, too much manual intervention is not conducive to improving the end-sealing efficiency of surface mount capacitors. Utility Model Content

[0006] The purpose of this invention is to propose a chip capacitor implantation system that enables automatic implantation of chip capacitors during the sealing process, effectively improving the sealing efficiency of chip capacitors and reducing labor costs in the sealing process, thereby overcoming the shortcomings of the prior art.

[0007] To achieve this objective, the present invention adopts the following technical solution: An implantation system for surface mount capacitors includes a storage plate mechanism, an implantation mechanism, a leveling mechanism, a plate transfer mechanism, and a feeding mechanism; The storage plate mechanism, the implantation mechanism, and the leveling mechanism are arranged in sequence. The plate moving mechanism is mounted above the plate mechanism, the implantation mechanism, and the leveling mechanism, and the plate moving mechanism is used to realize the movement of the material carrier plate between the plate mechanism, the implantation mechanism, and the leveling mechanism. The feeding mechanism is located near the feeding end of the leveling mechanism, and the feeding mechanism is used to feed the carrier plate into the leveling mechanism. The feeding mechanism includes a translation device, an NG storage rack, and a flipping device; The translation device is installed on the edge of the unloading end of the leveling mechanism, and the translation device is used to adsorb the material plate and realize the horizontal movement of the material plate; the NG storage rack is arranged below the unloading end of the translation device; the flipping device is arranged on one side of the NG storage rack, and the loading end of the flipping device is located between the unloading end of the translation device and the NG storage rack, and the flipping device is used to adsorb the material plate and realize the flipping of the material plate.

[0008] Preferably, the translation device includes a translation mounting platform, a translation connecting rod, and a suction cup fixture; The connecting end of the translation link is rotatably connected to the top of the translation mounting platform, and the rotation axis of the connecting end extends vertically. The mounting end of the translation link is connected to the top of the suction cup fixture, and the bottom of the suction cup fixture is provided with multiple suction cups for adsorbing the material carrier plate. The suction cup fixture swings about the rotation axis via the translation link, and the swing range of the translation link is 90°. The NG storage plate rack is installed on the edge of the unloading end of the leveling mechanism.

[0009] Preferably, the flipping device includes a flipping mounting frame, a flipping motor, and a flipping fixture; The flip-mounting frame and the translational mounting platform are respectively disposed on two adjacent sides of the NG storage plate rack; The flipping motor is mounted on the top of the flipping mounting frame, and the output end of the flipping motor is connected to a flipping fixture. The flipping motor is used to drive the flipping fixture to flip. The flipping axis of the flipping fixture extends horizontally.

[0010] Preferably, the flipping fixture includes a flipping arm, a flipping plate, and a limiting post; The flipping arm and the flipping plate are integrally formed, and the end of the flipping arm is connected to the output end of the flipping motor. The flip plate has multiple suction cups protruding from its surface for adsorbing the material carrier plate. The limiting posts are provided in multiple ways, and the multiple limiting posts are arranged protrudingly around the edge of the flip plate; the suction cup and the limiting posts are located on the same surface of the flip plate.

[0011] Preferably, the feeding ends of the storage plate mechanism, the implantation mechanism, and the leveling mechanism are located on the same straight line; The plate-shifting mechanism includes a gantry frame, a first adsorption fixture, and a second adsorption fixture; The gantry frame is erected above the plate mechanism, the implantation mechanism, and the leveling mechanism; the first adsorption fixture and the second adsorption fixture are installed on the gantry frame, and both the first adsorption fixture and the second adsorption fixture can move horizontally and vertically relative to the gantry frame, and the direction of the horizontal movement is parallel to the extension direction of the straight line. Both the first and second adsorption fixtures have multiple suction cups at their bottoms for adsorbing the material carrier plate.

[0012] Preferably, the storage plate mechanism includes a storage plate support and a lifting platform; The storage plate support has a storage compartment inside, and the lifting platform is installed inside the storage compartment, which can be moved up and down. The lifting platform is used to support the material plate, and the bottom surface of the material plate is covered with a fixing sticker.

[0013] Preferably, the implantation mechanism includes a flipping implantation device and a feeding device, wherein the feeding device is located behind the flipping implantation device and is used to feed the patch capacitor into the flipping implantation device; The flipping implantation device includes an implantation seat, a positioning seat, a feeding seat, and an electromagnet; the positioning seat is installed on the top front side of the implantation seat and is used to install a material carrier plate; the rear end of the implantation seat is connected to the rear end of the feeding seat through a bearing seat, and the feeding seat swings relative to the implantation seat. The feeding seat includes an implantation basket and a receiving box. The rear end of the implantation basket is sway-mounted on the bearing seat, and the receiving box is installed on the top of the rear end of the implantation basket. The receiving box is used to receive the surface mount capacitors fed from the feeding device. The implantation basket has multiple implantation mesh holes, and the implantation mesh holes match the material holes of the carrier plate; the electromagnet is installed inside the implantation base, and the electromagnet is used to cause the chip capacitor to vibrate through the implantation mesh holes and fall into the material holes of the carrier plate.

[0014] Preferably, the leveling mechanism includes a leveling track, a leveling platform, and a leveling frame; the leveling platform is slidably mounted on the leveling track, and the top of the leveling platform is provided with a plurality of suction cups for adsorbing the material carrier plate; the leveling frame is mounted above the middle part of the leveling track. The leveling machine frame includes a gantry support, a brush, and a pressure roller; the gantry support is mounted on top of the leveling track; the brush is installed on the gantry support and can move up and down relative to the gantry support; the pressure roller is rotatably mounted on the gantry support and can move up and down relative to the gantry support, and the axis of rotation of the pressure roller is perpendicular to the sliding direction of the leveling platform.

[0015] Preferably, the leveling mechanism further includes a flatness detection component, which is installed on the gantry bracket and located between the brush and the pressure roller. The flatness detection assembly includes a detection seat, a detection roller, and a displacement detector. The detection seat is installed on both sides inside the gantry bracket. The detection roller is rotatably installed between the detection seats via a bearing seat, and the detection roller moves up and down relative to the detection seat. The detection roller is used to contact and roll over the surface of the material carrier plate. The displacement detector is installed on the top of the detection seat, and the detection end of the displacement detector abuts against the top of the bearing seat. The displacement detector is used to detect whether the shaft of the detection roller is horizontal. The displacement detector is electrically connected to the pressure roller and / or the flipping device.

[0016] The technical solution provided by this utility model can include the following beneficial effects: 1. The proposed solution provides a chip capacitor implantation system that enables automated implantation of chip capacitors during the sealing process, improving the sealing efficiency of chip capacitors and reducing labor costs in the sealing process.

[0017] 2. This solution, through its ultra-simple structural design, enables the separate conveying of two types of products at the unloading end of the leveling mechanism, which helps to improve the overall production cycle of surface mount capacitors. Attached Figure Description

[0018] Figure 1 This is a top view of a chip capacitor implantation system according to this utility model.

[0019] Figure 2 This is a schematic diagram of the implantation system for a surface mount capacitor according to this utility model.

[0020] Figure 3 This is a structural schematic diagram from another perspective of the chip capacitor implantation system of this utility model.

[0021] Figure 4 This is a structural schematic diagram of one state of the feeding mechanism in this utility model.

[0022] Figure 5This is a structural schematic diagram of another state of the feeding mechanism in this utility model.

[0023] Figure 6 This is a schematic diagram of the implantation mechanism in this utility model.

[0024] Figure 7 This is a partial structural schematic diagram of the implantation mechanism in this utility model.

[0025] Figure 8 This is a partial structural schematic diagram of the leveling mechanism in this utility model.

[0026] Figure 9 This is a partial structural schematic diagram of the leveling mechanism in this utility model.

[0027] Among them: storage plate mechanism 1, storage plate support 11; Implantation mechanism 2, flipping implantation device 21, implantation seat 211, positioning seat 212, feeding seat 213, implantation basket 2131, receiving box 2132, electromagnet 214, feeding device 22; Leveling mechanism 3, leveling track 31, leveling platform 32, leveling frame 33, gantry support 331, brush 332, pressure roller 333, flatness detection component 334, detection seat 3341, detection roller 3342, displacement detector 3343; 4. Transfer plate mechanism; 41. Gantry frame; 42. First adsorption fixture; 43. Second adsorption fixture Material feeding mechanism 5, translation device 51, translation mounting platform 511, translation connecting rod 512, suction cup fixture 513, NG storage rack 52, flipping device 53, flipping mounting frame 531, flipping motor 532, flipping fixture 533, flipping arm 5331, flipping plate 5332, limiting post 5333; Material carrier plate 6. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0029] This technical solution provides a chip capacitor implantation system, including a storage plate mechanism 1, an implantation mechanism 2, a leveling mechanism 3, a plate transfer mechanism 4, and a material unloading mechanism 5; The storage plate mechanism 1, the implantation mechanism 2, and the leveling mechanism 3 are arranged in sequence. The plate moving mechanism 4 is mounted above the plate mechanism 1, the implantation mechanism 2, and the leveling mechanism 3, and the plate moving mechanism 4 is used to realize the movement of the material carrier plate 6 between the plate mechanism 1, the implantation mechanism 2, and the leveling mechanism 3. The feeding mechanism 5 is located near the feeding end of the leveling mechanism 3, and the feeding mechanism 5 is used to feed the carrier plate 6 into the leveling mechanism 3. The feeding mechanism 5 includes a translation device 51, an NG storage rack 52, and a flipping device 53; The translation device 51 is installed on the edge of the unloading end of the leveling mechanism 3, and the translation device 51 is used to adsorb the material carrier plate 6 and realize the horizontal movement of the material carrier plate 6; the NG storage rack 52 is disposed below the unloading end of the translation device 51; the flipping device 53 is disposed on one side of the NG storage rack 52, and the loading end of the flipping device 53 is located between the unloading end of the translation device 51 and the NG storage rack 52, and the flipping device 53 is used to adsorb the material carrier plate 6 and realize the flipping of the material carrier plate 6.

[0030] To achieve effective implantation of surface mount capacitors within the six vias of the carrier board, this technical solution proposes a surface mount capacitor implantation system, such as... Figure 1-3 As shown, the device includes a storage mechanism 1 for storing a carrier plate 6 to be implanted (with a fixing sticker attached to its bottom surface), an implantation mechanism 2 for implanting a chip capacitor into the material hole of the carrier plate 6, a leveling mechanism 3 for effectively attaching the chip capacitor to the fixing sticker and making the ends of the chip capacitor flush, a moving mechanism 4 for moving the carrier plate 6 between the plate mechanism 1, the implantation mechanism 2 and the leveling mechanism 3, and a feeding mechanism 5 for feeding the carrier plate 6 out of the leveling mechanism 3.

[0031] The implantation process of the implantation system in this solution includes the following steps: First, the carrier plate 6 with a fixed sticker on the bottom is stored in the storage mechanism 1; the carrier plate 6 located in the storage mechanism 1 is moved to the implantation mechanism 2 by the transfer mechanism 4 for implantation of the chip capacitor; after implantation, the carrier plate 6 located in the implantation mechanism 2 is moved to the leveling mechanism 3 by the transfer mechanism 4 for leveling; after leveling, the unloading mechanism 5 is used to unload the carrier plate 6 from the leveling mechanism 3 to proceed to the next process.

[0032] Since NG (non-conforming) products may appear after the leveling step of leveling mechanism 3, in order to prevent NG products from flowing into the next process and to improve the sealing quality of surface mount capacitors, this solution also adds an NG storage rack 52 to the unloading mechanism 5 for storing NG products. Figure 4-5 As shown, specifically: When the product at the unloading end of the leveling mechanism 3 is a qualified product, the loading end of the flipping device 53 is positioned between the unloading end of the translation device 51 and the NG storage rack 52. The translation device 51 is used to horizontally move the carrier plate 6 at the unloading end of the leveling mechanism 3 to above the loading end of the flipping device 53. Then, the flipping device 53 is used to flip the material to the next process (based on the requirements of the process flow, the next process requires the unsealed chip capacitors in the carrier plate 6 to be placed with the ends facing down).

[0033] When the product at the unloading end of the leveling mechanism 3 is an NG product, the loading end of the flipping device 53 is moved to the top of the NG storage rack 52, and the material plate 6 at the unloading end of the leveling mechanism 3 is moved horizontally to the NG storage rack 52 for collection and recycling.

[0034] This solution, through its ultra-simple structural design, enables the separate conveying of two types of products at the unloading end of the leveling mechanism 3, which helps to improve the overall production cycle of surface mount capacitors. It should be noted that the classification of qualified and NG products in this solution can be determined by technicians through visual inspection.

[0035] To further explain, the translation device 51 includes a translation mounting platform 511, a translation connecting rod 512, and a suction cup fixture 513; The connecting end of the translation link 512 is rotatably connected to the top of the translation mounting platform 511, and the rotation axis of the connecting end extends vertically. The mounting end of the translation link 512 is connected to the top of the suction cup fixture 513, and the bottom of the suction cup fixture 513 is provided with a plurality of suction cups for adsorbing the material carrier plate 6. The suction cup fixture 513 swings about the rotation axis via the translation link 512, and the swing range of the translation link 512 is 90°. The NG storage rack 52 is installed on the edge of the unloading end of the leveling mechanism 3.

[0036] Specifically, the translation device 51 of this solution includes a translation mounting platform 511, a translation link 512, and a suction cup fixture 513. The suction cup fixture 513 swings around the rotation axis via the translation link 512, thereby realizing the horizontal movement of the material carrier plate 6. Furthermore, the swing range of the translation link 512 in this solution is 90°, which allows the translation device 51 and the NG storage rack 52 to be arranged side by side at the edge of the unloading end of the leveling mechanism 3, which helps to save the equipment space occupied by the implantation system.

[0037] To further explain, the flipping device 53 includes a flipping mounting bracket 531, a flipping motor 532, and a flipping fixture 533; The flip-mounting frame 531 and the translational mounting platform 511 are respectively disposed on two adjacent sides of the NG storage rack 52; The flipping motor 532 is mounted on the top of the flipping mounting bracket 531, and the output end of the flipping motor 532 is connected to the flipping fixture 533. The flipping motor 532 is used to drive the flipping fixture 533 to flip. The flipping axis of the flipping fixture 533 extends horizontally.

[0038] Furthermore, the flipping device 53 of this solution includes a flipping mounting frame 531, a flipping motor 532, and a flipping fixture 533. Since the flipping fixture 533 rotates around a horizontally extending flipping axis, it can easily avoid the top of the NG storage rack 52, thereby achieving rapid sorting and processing of qualified and NG products.

[0039] To further explain, the flipping fixture 533 includes a flipping arm 5331, a flipping plate 5332, and a limiting post 5333; The flipping arm 5331 and the flipping plate 5332 are integrally formed, and the end of the flipping arm 5331 is connected to the output end of the flipping motor 532. The flip plate 5332 has multiple suction cups protruding from its surface for adsorbing the material carrier plate 6. Multiple limiting posts 5333 are provided, and the multiple limiting posts 5333 are arranged to protrude around the edge of the flip plate 5332; the suction cup and the limiting posts 5333 are located on the same plate surface of the flip plate 5332.

[0040] Furthermore, in order to prevent the material carrier plate 6 from shifting during the flipping process and to ensure the consistency of material feeding in the next process, this solution also adds multiple limiting posts 5333 around the edge of the flipping plate 5332 to limit the material carrier plate 6.

[0041] To further clarify, the feeding ends of the storage plate mechanism 1, the implantation mechanism 2, and the leveling mechanism 3 are located on the same straight line; The plate-shifting mechanism 4 includes a gantry frame 41, a first adsorption fixture 42, and a second adsorption fixture 43; The gantry frame 41 is mounted above the plate mechanism 1, the implantation mechanism 2, and the leveling mechanism 3; the first adsorption fixture 42 and the second adsorption fixture 43 are installed on the gantry frame 41, and both the first adsorption fixture 42 and the second adsorption fixture 43 can move horizontally and vertically relative to the gantry frame 41, and the direction of the horizontal movement is parallel to the extension direction of the straight line. The bottom of both the first adsorption fixture 42 and the second adsorption fixture 43 is provided with a plurality of suction cups for adsorbing the material carrier plate 6.

[0042] This solution adds two sets of adsorption fixtures to the plate transfer mechanism 4, which helps to eliminate waiting time between process steps and improve the overall production cycle of surface mount capacitors.

[0043] To further explain, the storage plate mechanism 1 includes a storage plate support 11 and a lifting platform; The storage plate support 11 has a storage compartment inside, and the lifting platform is installed inside the storage compartment and can be moved up and down. The lifting platform is used to support the material carrier plate 6, and a fixing sticker is pasted on the bottom surface of the material carrier plate 6.

[0044] In this way, the storage plate mechanism 1 can work in conjunction with the implantation mechanism 2. The lifting platform, through height positioning, can ensure that the material carrier plate 6 is in a matching position that allows the transfer mechanism 4 to easily pick up and put in the material, thereby further improving the overall production cycle of the chip capacitor.

[0045] To further explain, the implantation mechanism 2 includes a flipping implantation device 21 and a feeding device 22. The feeding device 22 is located behind the flipping implantation device 21 and is used to feed the chip capacitor into the flipping implantation device 21. The flipping implantation device 21 includes an implantation seat 211, a positioning seat 212, a feeding seat 213, and an electromagnet 214; the positioning seat 212 is installed on the top front side of the implantation seat 211, and the positioning seat 212 is used to install the material carrier plate 6; the rear end of the implantation seat 211 is connected to the rear end of the feeding seat 213 through a bearing seat, and the feeding seat 213 swings relative to the implantation seat 211; The feeding seat 213 includes an implantation basket 2131 and a receiving box 2132. The rear end of the implantation basket 2131 is sway-mounted on the bearing seat, and the receiving box 2132 is mounted on the top of the rear end of the implantation basket 2131. The receiving box 2132 is used to receive the chip capacitors fed from the feeding device 22. The implantation basket 2131 has multiple implantation mesh holes, and the implantation mesh holes match the material holes of the carrier plate 6; the electromagnet 214 is installed inside the implantation base 211, and the electromagnet 214 is used to cause the chip capacitor to vibrate through the implantation mesh holes and fall into the material holes of the carrier plate 6.

[0046] In existing chip capacitor implantation mechanisms, the chip capacitors to be implanted are generally poured into the top of the implantation basket from the feeding port of the feeding mechanism and piled up to a certain height on the top of the implantation basket. This causes the chip capacitors to be dispersed from the piled state into a single layer flat state before falling into the material hole of the loading tray. This makes the implantation process take a lot of time, which not only reduces the implantation efficiency, but also increases the energy consumption of the vibrator and / or oscillator that realizes the shape change of the chip capacitor.

[0047] Specifically, compared to existing surface mount capacitor implantation mechanisms, the flip-type implantation device 21 of this solution mainly sets the feeding seat 213, including the implantation basket 2131, as a flip-type feeding structure, such as... Figure 6-7 As shown. That is, when the feeding device 22 delivers the chip capacitors to the flipping implantation device 21, the receiving box 2132 first receives the preset implantation quantity (i.e., the number of chip capacitors) for one implantation process; then the feeding seat 213 is oscillating relative to the implantation seat 211, causing the implantation basket 2131 to rotate and cover the positioning seat 212 on which the carrier plate 6 is installed. During the oscillation, the chip capacitors can be relatively evenly laid on the surface of the implantation basket 2131 under the combined action of oscillation and their own gravity. Then, by changing the magnetic field inside the implantation basket 2131 through the switching on and off of the electromagnet 214, the chip capacitors are changed in position and shape under the action of the magnetic field, thus achieving rapid implantation. Compared to existing chip capacitor implantation mechanisms that use a vibrator to disperse the chip capacitors from a stacked state into a single, flat layer during implantation, this solution utilizes a mechanical tilting action to quickly lay the chip capacitors flat on the surface of the implantation basket 2131. This effectively shortens the implantation time and reduces the energy consumption of the electromagnet used to change the shape of the chip capacitors. Furthermore, it also effectively reduces the size of the implantation mechanism, making its structure more compact.

[0048] It should be noted that the feeding mechanism 22 in this solution is a conventional feeding mechanism in this technical field, and its specific structure will not be described in detail here.

[0049] To further explain, the leveling mechanism 3 includes a leveling track 31, a leveling platform 32, and a leveling frame 33; the leveling platform 32 is slidably mounted on the leveling track 31, and the top of the leveling platform 32 is provided with a plurality of suction cups for adsorbing the material carrier plate 6; the leveling frame 33 is mounted above the middle part of the leveling track 31. The leveling frame 33 includes a gantry support 331, a brush 332, and a pressure roller 333. The gantry support 331 is mounted on top of the leveling track 31. The brush 332 is installed on the gantry support 331 and can move up and down relative to the gantry support 331. The pressure roller 333 is rotatably mounted on the gantry support 331 and can move up and down relative to the gantry support 331. The axis of rotation of the pressure roller 333 is perpendicular to the sliding direction of the leveling platform 32.

[0050] To ensure effective adhesion between the surface mount capacitors and the mounting stickers, and to align the ends of the surface mount capacitors to guarantee the sealing quality, the leveling mechanism 3 in this design includes a leveling platform 32 for placing and moving the carrier plate 6, a brush 332 for cleaning the surface of the carrier plate 6, and a pressure roller 333 for pressing the surface mount capacitors and mounting stickers firmly onto the carrier plate 6. Figure 8-9 As shown, this helps to ensure that the ends of the surface mount capacitors in the material holes of the carrier plate 6 are flush, thereby improving the consistency of the sealing of the surface mount capacitors and ensuring the sealing quality of the surface mount capacitors.

[0051] Furthermore, the leveling mechanism 33 also includes a flatness detection component 334, which is installed on the gantry bracket 331 and is located between the brush 332 and the pressure roller 333. The flatness detection assembly 334 includes a detection seat 3341, a detection roller 3342, and a displacement detector 3343. The detection seat 3341 is installed on both sides inside the gantry bracket 331. The detection roller 3342 is rotatably installed between the detection seats 3341 via bearing seats, and the detection roller 3342 moves up and down relative to the detection seat 3341. The detection roller 3342 is used to adhere to and roll over the surface of the material carrier plate 6. The displacement detector 3343 is installed on the top of the detection seat 3341, and the detection end of the displacement detector 3343 abuts against the top of the bearing seat. The displacement detector 3343 is used to detect whether the rotating shaft of the detection roller 3342 is horizontal. The displacement detector 3343 is electrically connected to the pressure roller 333 and / or the flipping device 53.

[0052] To further ensure the flatness of the chip capacitor ends, this solution also adds a flatness detection component 334 to the leveling mechanism 33 for detecting whether the ends of the chip capacitors are flat. The flatness detection component 334 includes a detection seat 3341, a detection roller 3342, and a displacement detector 3343. Since the detection end of the displacement detector 3343 abuts against the top of the bearing seat, the placement of the two displacement detectors 3343 at both ends can accurately detect whether the displacement at both ends of the detection roller 3342 is the same, thereby determining whether the shaft of the detection roller 3342 is horizontal, and further determining whether the ends of the chip capacitors are flat.

[0053] In one specific embodiment, if the flatness detection component 334 detects that the end of the chip capacitor is still not flat, the surface of the carrier plate 6 is compacted again by the pressure roller 224, or the carrier plate 6 is placed on the NG storage rack 52 by the overturning device 53.

[0054] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0055] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0056] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0057] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0058] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0059] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0060] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A chip capacitor implantation system, characterized in that: This includes a storage mechanism, an insertion mechanism, a leveling mechanism, a transfer mechanism, and a feeding mechanism; The storage plate mechanism, the implantation mechanism, and the leveling mechanism are arranged in sequence. The plate moving mechanism is mounted above the plate mechanism, the implantation mechanism, and the leveling mechanism, and the plate moving mechanism is used to realize the movement of the material carrier plate between the plate mechanism, the implantation mechanism, and the leveling mechanism. The feeding mechanism is located near the feeding end of the leveling mechanism, and the feeding mechanism is used to feed the carrier plate into the leveling mechanism. The feeding mechanism includes a translation device, an NG storage rack, and a flipping device; The translation device is installed on the edge of the unloading end of the leveling mechanism, and the translation device is used to adsorb the material plate and realize the horizontal movement of the material plate; the NG storage rack is arranged below the unloading end of the translation device; the flipping device is arranged on one side of the NG storage rack, and the loading end of the flipping device is located between the unloading end of the translation device and the NG storage rack, and the flipping device is used to adsorb the material plate and realize the flipping of the material plate.

2. The implantation system for a surface mount capacitor according to claim 1, characterized in that: The translation device includes a translation mounting platform, a translation connecting rod, and a suction cup fixture; The connecting end of the translation link is rotatably connected to the top of the translation mounting platform, and the rotation axis of the connecting end extends vertically. The mounting end of the translation link is connected to the top of the suction cup fixture, and the bottom of the suction cup fixture is provided with multiple suction cups for adsorbing the material carrier plate. The suction cup fixture swings about the rotation axis via the translation link, and the swing range of the translation link is 90°. The NG storage plate rack is installed on the edge of the unloading end of the leveling mechanism.

3. The implantation system for a surface mount capacitor according to claim 2, characterized in that: The flipping device includes a flipping mounting frame, a flipping motor, and a flipping fixture; The flip-mounting frame and the translational mounting platform are respectively disposed on two adjacent sides of the NG storage plate rack; The flipping motor is mounted on the top of the flipping mounting frame, and the output end of the flipping motor is connected to a flipping fixture. The flipping motor is used to drive the flipping fixture to flip. The flipping axis of the flipping fixture extends horizontally.

4. The implantation system for a surface mount capacitor according to claim 3, characterized in that: The flipping fixture includes a flipping arm, a flipping plate, and a limiting post; The flipping arm and the flipping plate are integrally formed, and the end of the flipping arm is connected to the output end of the flipping motor. The flip plate has multiple suction cups protruding from its surface for adsorbing the material carrier plate. The limiting posts are provided in multiple ways, and the multiple limiting posts are arranged protrudingly around the edge of the flip plate; the suction cup and the limiting posts are located on the same surface of the flip plate.

5. The implantation system for a surface mount capacitor according to claim 1, characterized in that: The loading ends of the storage plate mechanism, the implantation mechanism, and the leveling mechanism are located on the same straight line; The plate-shifting mechanism includes a gantry frame, a first adsorption fixture, and a second adsorption fixture; The gantry frame is erected above the plate mechanism, the implantation mechanism, and the leveling mechanism; the first adsorption fixture and the second adsorption fixture are installed on the gantry frame, and both the first adsorption fixture and the second adsorption fixture can move horizontally and vertically relative to the gantry frame, and the direction of the horizontal movement is parallel to the extension direction of the straight line. Both the first and second adsorption fixtures have multiple suction cups at their bottoms for adsorbing the material carrier plate.

6. The implantation system for a surface mount capacitor according to claim 1, characterized in that: The storage plate mechanism includes a storage plate support and a lifting platform; The storage plate support has a storage compartment inside, and the lifting platform is installed inside the storage compartment, which can be moved up and down. The lifting platform is used to support the material plate, and the bottom surface of the material plate is covered with a fixing sticker.

7. The implantation system for a surface mount capacitor according to claim 1, characterized in that: The implantation mechanism includes a flipping implantation device and a feeding device. The feeding device is located behind the flipping implantation device and is used to feed the chip capacitor into the flipping implantation device. The flipping implantation device includes an implantation seat, a positioning seat, a feeding seat, and an electromagnet; the positioning seat is installed on the top front side of the implantation seat and is used to install a material carrier plate; the rear end of the implantation seat is connected to the rear end of the feeding seat through a bearing seat, and the feeding seat swings relative to the implantation seat. The feeding seat includes an implantation basket and a receiving box. The rear end of the implantation basket is sway-mounted on the bearing seat, and the receiving box is installed on the top of the rear end of the implantation basket. The receiving box is used to receive the surface mount capacitors fed from the feeding device. The implantation basket has multiple implantation mesh holes, and the implantation mesh holes match the material holes of the carrier plate; the electromagnet is installed inside the implantation base, and the electromagnet is used to cause the chip capacitor to vibrate through the implantation mesh holes and fall into the material holes of the carrier plate.

8. The implantation system for a surface mount capacitor according to claim 1, characterized in that: The leveling mechanism includes a leveling track, a leveling platform, and a leveling frame; the leveling platform is slidably mounted on the leveling track, and the top of the leveling platform is provided with multiple suction cups for adsorbing the material carrier plate; the leveling frame is mounted above the middle part of the leveling track. The leveling machine frame includes a gantry support, a brush, and a pressure roller; the gantry support is mounted on top of the leveling track; the brush is installed on the gantry support and can move up and down relative to the gantry support; the pressure roller is rotatably mounted on the gantry support and can move up and down relative to the gantry support, and the axis of rotation of the pressure roller is perpendicular to the sliding direction of the leveling platform.

9. The implantation system for a surface mount capacitor according to claim 1, characterized in that: The leveling mechanism also includes a flatness detection component, which is installed on the gantry bracket and located between the brush and the pressure roller. The flatness detection assembly includes a detection seat, a detection roller, and a displacement detector. The detection seat is installed on both sides inside the gantry bracket. The detection roller is rotatably installed between the detection seats via a bearing seat, and the detection roller moves up and down relative to the detection seat. The detection roller is used to contact and roll over the surface of the material carrier plate. The displacement detector is installed on the top of the detection seat, and the detection end of the displacement detector abuts against the top of the bearing seat. The displacement detector is used to detect whether the shaft of the detection roller is horizontal. The displacement detector is electrically connected to the pressure roller and / or the flipping device.

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