Wafer positioning device with lifting and rotating structure

Abstract

The utility model provides a kind of wafer positioning device with lifting rotary structure, it includes support assembly, lifting guide component, adapter bearing assembly, lifting drive component, adsorption positioning assembly and rotary drive component, the guide column of the lifting guide component of this wafer positioning device and the adapter wheel pair of adapter bearing assembly form precision sliding pair, ensure the vertical motion stability of bearing stand cylinder, driving cylinder pushes bearing stand cylinder to lift along guide column, its position is monitored in real time by lifting position sensor, positioning core column is realized independent rotation relative to bearing stand cylinder by bearing, top adsorption tray is fixed wafer under the action of negative pressure, driving motor is rotated by pulley transmission and drives positioning core column, so that wafer adjusts angle according to detection requirement, it adopts cylinder lifting and motor rotation coaxial layout, can reduce space occupancy, reduce wafer handover time, and can be lowered in non-working period, avoid interference with peripheral equipment, improve system security.

Description

Technical Field

[0001] This utility model relates to integrated circuit manufacturing equipment, and more particularly to a wafer positioning device with a lifting and rotating structure. Background Technology

[0002] Position identification during wafer positioning relies primarily on specific physical features of the wafer edge, including positioning edges or notches and auxiliary edge contours and codes. Positioning edges or notches are pre-defined reference marks used during wafer manufacturing for mechanical alignment and crystal orientation identification, ensuring correct wafer alignment during processing. Patent document CN114334781B discloses a wafer positioning device comprising a support ring, a rotating adsorption device, and a calibration device. The support ring is constructed with at least one radially inwardly extending support ring surface to support the wafer. A plurality of first sensors are arranged in a ring on the support ring surface to collect detection data determined by the wafer-holding first sensors. The calibration device includes a laterally moving adjustment block with a calibration edge. After the support ring surface separates from the wafer, the rotating adsorption device adsorbs the wafer and performs coarse rotation to rotate the flat edge of the wafer to face the calibration edge. The laterally moving adjustment block performs fine rotation on the wafer during the process of the calibration edge aligning with the flat edge of the wafer. However, this wafer positioning device occupies a large space and is prone to interference with surrounding equipment, affecting the operational stability of the equipment. Therefore, it is necessary to optimize its structure to overcome the above-mentioned defects. Utility Model Content

[0003] The purpose of this invention is to provide a wafer positioning device with a lifting and rotating structure.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A wafer positioning device with a lifting and rotating structure, comprising:

[0006] A support assembly assembly is installed in the equipment frame and has an internal assembly space.

[0007] A lifting guide assembly, which is installed in a support assembly assembly and has a guide space inside;

[0008] The adapter load-bearing component works in conjunction with the lifting guide component and can be raised and lowered within the lifting guide component, with the lifting guide component guiding the raising and lowering process of the adapter load-bearing component.

[0009] A lifting drive assembly is installed in a lifting guide assembly and cooperates with a transfer bearing assembly. The lifting drive assembly drives the transfer bearing assembly to move up and down within the lifting guide assembly.

[0010] The adsorption positioning component is installed in the transfer carrier component through a rotating structure. It can be raised and lowered together with the transfer carrier component and can rotate independently in the transfer carrier component. It has a wafer placement space inside, and the adsorption positioning component adsorbs and positions the wafer.

[0011] A rotary drive assembly is installed in the transfer bearing assembly and cooperates with the adsorption positioning assembly through a transmission structure. The rotary drive assembly drives the adsorption positioning assembly to rotate.

[0012] Specifically, the supporting assembly components include:

[0013] Support columns, which are arranged vertically and installed in the equipment frame via connectors;

[0014] The mounting base plate is arranged laterally and installed on the top of the support column by a connector. The support column supports the mounting base plate. The mounting base plate has an assembly notch on its edge, which is an orthogonal double-sided notch shape.

[0015] The lifting guide assembly includes:

[0016] A guide bracket, which is located in the assembly recess, has its two ends bent to form an orthogonal included angle, and is engaged with the assembly base plate by a connector;

[0017] A pair of guide end plates are provided, each guide end plate is installed at both ends of the guide seat frame and arranged vertically;

[0018] The guide column is provided in pairs. Each guide column is a cylindrical structure, arranged vertically, and installed on the side wall of the guide end plate by connecting parts.

[0019] The adapter bearer components include:

[0020] The supporting vertical tube is arranged vertically, with its outer wall being a square column structure and its interior being a cylindrical structure.

[0021] The adapter wheel pair has two sets. Each set of adapter wheel pairs is installed at the diagonal corners of the outer wall of the support column and extends along the axial direction of the support column. Each set of adapter wheel pairs abuts against the outer wall of the guide column. The support column can be raised and lowered along the guide column by the adapter wheel pairs.

[0022] The lifting drive component includes:

[0023] The drive cylinder has its cylinder body mounted on the bottom of the guide frame via a connector. Its piston rod is parallel to the guide column and is connected to the side of the support cylinder via a connector. The drive cylinder drives the support cylinder to move up and down along the guide column.

[0024] The adsorption positioning component includes:

[0025] The positioning core column is located inside the support cylinder and is arranged vertically. Its two ends are respectively connected to the two ends of the support cylinder through bearings. It can be raised and lowered together with the support cylinder and can rotate independently in the support cylinder.

[0026] The adsorption carrier is installed on the top of the positioning core column and can rise, fall and rotate together with the positioning core column. It is connected to the vacuum equipment through a vacuum tube arranged in the positioning core column. The adsorption carrier adsorbs and positions the wafer and adjusts its vertical height and rotation angle.

[0027] The rotary drive assembly includes:

[0028] The mounting plate is installed on the side of the support column and can be raised and lowered together with the support column.

[0029] The drive motor is mounted on the assembly plate and can be raised and lowered together with the assembly plate. Its power output shaft is connected to the bottom of the positioning core column through a pulley transmission structure, and the drive motor drives the positioning core column to rotate.

[0030] The advantages of this utility model are:

[0031] The wafer positioning device supports the support columns and assembly base plate in the assembly assembly to form a basic frame. The orthogonal double-sided notch shape on the edge of the assembly base plate provides installation space for the wafer inspection mechanism. The guide column of the lifting guide assembly and the transfer wheel pair of the transfer bearing assembly form a precision sliding pair to ensure the vertical movement stability of the bearing cylinder. The drive cylinder serves as the lifting power source, pushing the bearing cylinder up and down along the guide column. Its position is monitored in real time by the lifting position sensor. The positioning core column of the adsorption positioning assembly achieves independent rotation relative to the bearing cylinder through bearings. The top adsorption carrier plate is connected to the external air passage through a vacuum tube to fix the wafer under negative pressure. The drive motor of the rotation drive assembly drives the positioning core column to rotate through the pulley transmission, so that the wafer can adjust the angle according to the inspection requirements. It adopts a coaxial layout of cylinder lifting and motor rotation, which can reduce space occupation, reduce wafer handover time, and can descend during non-working periods to avoid interference with surrounding equipment and improve system safety. Attached Figure Description

[0032] Figure 1 This is a front view of the wafer positioning device with a lifting and rotating structure proposed in this utility model.

[0033] Figure 2 This is a schematic diagram of the back structure of the wafer positioning device;

[0034] Figure 3 This is a cross-sectional structural diagram of the wafer positioning device. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0036] like Figures 1-3 As shown, the wafer positioning device with a lifting and rotating structure proposed in this utility model includes a support assembly assembly, a lifting guide assembly, a transfer bearing assembly, a lifting drive assembly, an adsorption positioning assembly, and a rotation drive assembly. The support assembly assembly is installed in the equipment frame and has an assembly space inside. The lifting guide assembly is installed in the support assembly assembly and has a guide space inside. The transfer bearing assembly cooperates with the lifting guide assembly and can be lifted and lowered within the lifting guide assembly. The lifting guide assembly guides the lifting and lowering process of the transfer bearing assembly. The lifting drive assembly is installed in the lifting guide assembly and cooperates with the transfer bearing assembly. The lifting drive assembly drives the transfer bearing assembly to lift and lower within the lifting guide assembly. The adsorption positioning assembly is installed in the transfer bearing assembly through a rotating structure and can be lifted and lowered together with the transfer bearing assembly. It can also rotate independently within the transfer bearing assembly and has a wafer placement space inside. The adsorption positioning assembly adsorbs and positions the wafer. The rotation drive assembly is installed in the transfer bearing assembly and cooperates with the adsorption positioning assembly through a transmission structure. The rotation drive assembly drives the adsorption positioning assembly to rotate.

[0037] In this embodiment, the support assembly includes a support column 110 and an assembly base plate 120. The support column is arranged vertically and installed in the equipment frame via connectors. The assembly base plate is arranged horizontally and installed on the top of the support column via connectors. The support column supports the assembly base plate. The assembly base plate has an assembly notch on its edge, which is an orthogonal double-sided notch shape. In this embodiment, a wafer inspection mechanism can be installed on the assembly base plate to detect the positioning edges or positioning notches of the wafer in the adsorption positioning assembly.

[0038] The lifting guide assembly includes a guide frame 210, a guide end plate 220, and a guide column 230. The guide frame is located in the assembly recess, and its two ends are bent to form an orthogonal angle and are connected to the assembly base plate through connectors. There is a pair of guide end plates, each of which is installed at both ends of the guide frame and arranged vertically. There is a pair of guide columns, each of which is a cylindrical structure, arranged vertically, and installed on the side wall of the guide end plate through connectors.

[0039] The transition bearing assembly includes a bearing cylinder 310 and transition wheelsets 320. The bearing cylinder is arranged vertically, with a square column structure on its outer wall and a cylindrical structure on its interior. Two sets of transition wheelsets are provided, each set installed diagonally on the outer wall of the bearing cylinder and extending axially along the bearing cylinder. Each set of transition wheelsets abuts against the outer wall of a guide column, allowing the bearing cylinder to rise and fall along the guide column via the transition wheelsets. In this embodiment, each transition wheelet consists of a pair of bearing rollers, installed on the outer wall of the bearing cylinder and forming an orthogonal angle. Each bearing roller abuts against the outer wall of the guide column, providing axial guidance and circumferential positioning for the bearing cylinder.

[0040] The lifting drive assembly includes a drive cylinder 400. The cylinder body of the drive cylinder is installed at the bottom of the guide frame via a connector. Its piston rod is parallel to the guide column and is connected to the side of the support cylinder via a connector. The drive cylinder drives the support cylinder to rise and fall along the guide column.

[0041] The adsorption positioning assembly includes a positioning core column 510 and an adsorption carrier plate 520. The positioning core column is located inside the support cylinder and is arranged vertically. Its two ends are respectively connected to the two ends of the support cylinder through bearings. It can rise and fall together with the support cylinder and can rotate independently in the support cylinder. The adsorption carrier plate is installed on the top of the positioning core column and can rise and fall and rotate together with the positioning core column. It is connected to the vacuum equipment through the vacuum cavity arranged in the positioning core column and the air pipe connector 511 located at the bottom of the positioning core column. The adsorption carrier plate adsorbs and positions the wafer and adjusts its vertical height and rotation angle.

[0042] The rotary drive assembly includes an assembly carrier plate 610 and a drive motor 620. The assembly carrier plate is installed on the side of the support cylinder and can be raised and lowered together with the support cylinder. The drive motor is installed on the assembly carrier plate and can be raised and lowered together with the assembly carrier plate. Its power output shaft is connected to the bottom of the positioning core column through a pulley transmission structure, and the positioning core column is driven to rotate by the drive motor.

[0043] In this embodiment, a lifting position sensor 211 is installed on the side of the guide frame, and a matching sensing plate 621 is installed on the side of the drive motor to sense the lifting position of the drive motor and the supporting cylinder, so as to prevent overtravel. Its structure and operating principle adopt existing technology, so they are not described in detail.

[0044] When the device is running, the drive cylinder first lifts the adsorption carrier to the wafer transfer height. After the wafer is vacuum adsorbed and fixed, the drive motor starts and works with the detection mechanism to complete the wafer edge scanning and angle calibration. After the detection is completed, the wafer is either released or lifted to the recycling station according to the results.

[0045] In the description of this utility model, it should be noted that when terms such as "upper," "lower," "inner," "outer," "left," and "right" appear to indicate orientation or positional relationships, they should be understood as being based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the product of this utility model is in use, or the orientation or positional relationships commonly understood by those skilled in the art. These terms are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, when terms such as "first" and "second" appear, they are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, it should also be noted that unless otherwise explicitly specified and limited, terms such as "installation," "setting," and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

Claims

1. A wafer positioning device with a lifting and rotating structure, characterized in that, include: A support assembly assembly is installed in the equipment frame and has an internal assembly space. A lifting guide assembly, which is installed in a support assembly assembly and has a guide space inside; The adapter load-bearing component works in conjunction with the lifting guide component and can be raised and lowered within the lifting guide component, with the lifting guide component guiding the raising and lowering process of the adapter load-bearing component. A lifting drive assembly is installed in a lifting guide assembly and cooperates with a transfer bearing assembly. The lifting drive assembly drives the transfer bearing assembly to move up and down within the lifting guide assembly. The adsorption positioning component is installed in the transfer carrier component through a rotating structure. It can be raised and lowered together with the transfer carrier component and can rotate independently in the transfer carrier component. It has a wafer placement space inside, and the adsorption positioning component adsorbs and positions the wafer. A rotary drive assembly is installed in the transfer bearing assembly and cooperates with the adsorption positioning assembly through a transmission structure. The rotary drive assembly drives the adsorption positioning assembly to rotate.

2. The wafer positioning device with a lifting and rotating structure according to claim 1, characterized in that, Support assembly components include: Support columns, which are arranged vertically and installed in the equipment frame via connectors; The mounting base plate is arranged laterally and installed on the top of the support column by a connector. The support column supports the mounting base plate. The mounting base plate has an assembly notch on its edge, which is an orthogonal double-sided notch shape.

3. A wafer positioning device with a lifting and rotating structure according to claim 2, characterized in that, The lifting guide assembly includes: A guide bracket, which is located in the assembly recess, has its two ends bent to form an orthogonal included angle, and is engaged with the assembly base plate by a connector; A pair of guide end plates are provided, each guide end plate is installed at both ends of the guide seat frame and arranged vertically; The guide column is provided in pairs. Each guide column is a cylindrical structure, arranged vertically, and installed on the side wall of the guide end plate by connecting parts.

4. A wafer positioning device with a lifting and rotating structure according to claim 3, characterized in that, The adapter bearer assembly includes: The supporting vertical tube is arranged vertically, with its outer wall being a square column structure and its interior being a cylindrical structure. The adapter wheel pair has two sets. Each set of adapter wheel pairs is installed at the diagonal corners of the outer wall of the support column and extends along the axial direction of the support column. Each set of adapter wheel pairs abuts against the outer wall of the guide column.

5. A wafer positioning device with a lifting and rotating structure according to claim 4, characterized in that, The lifting drive component includes: The drive cylinder has its cylinder body mounted on the bottom of the guide frame via a connector. Its piston rod is parallel to the guide column and is connected to the side of the support cylinder via a connector.

6. A wafer positioning device with a lifting and rotating structure according to claim 4, characterized in that, The adsorption positioning component includes: The positioning core column is located inside the support cylinder and is arranged vertically. Its two ends are respectively connected to the two ends of the support cylinder through bearings. It can be raised and lowered together with the support cylinder and can rotate independently in the support cylinder. The adsorption carrier is installed on the top of the positioning core column and can rise, fall and rotate together with the positioning core column. It is connected to the vacuum equipment through a vacuum tube arranged in the positioning core column.

7. A wafer positioning device with a lifting and rotating structure according to claim 6, characterized in that, The rotary drive assembly includes: The mounting plate is installed on the side of the support column and can be raised and lowered together with the support column. The drive motor is mounted on the assembly plate and can be raised and lowered together with the assembly plate. Its power output shaft is connected to the bottom of the positioning core column through a pulley transmission structure.

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