Heating substrate for thin film thermal print head

CN224856598UActive Publication Date: 2026-10-16SHANDONG HUALING ELECTRONICS
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Patent Information

Application Number
CN202522446593.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-18
Publication Date
2026-10-16
Estimated Expiration
2035-11-18

AI Technical Summary

Technical Problem

[0003]然而由于纯铝电极导线在生产过程中受热后应力发生变化，导致纯铝电极导线内部应力释放而产生小丘(hillock)

Benefits of technology

[0011] The beneficial effects of this invention are that by forming a thin aluminum-tantalum alloy layer on the upper region of the pure aluminum conductor, the conductivity of the aluminum electrode conductor is preserved, and the formation of the aluminum-tantalum alloy layer on the upper layer of the aluminum electrode conductor strengthens the grain boundaries of aluminum atoms, forming a transition layer with higher hardness on the upper layer of the pure aluminum conductor. This can suppress the diffusion of aluminum atoms at the grain boundaries and absorb the compressive stress generated by the aluminum film, thereby suppressing the formation of hillocks and improving the coverage and adhesion of the upper insulating protective layer of the electrode conductor, thus improving the service life and printing effect of the thin-film thermal printhead.

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Abstract

The utility model relates to the technical field of thermal printing head manufacturing, specifically to a kind of film thermal printing head heating substrate capable of inhibiting the generation of small hillock of pure aluminium electrode wire near heating resistor, and further improve the adhesion of electrode wire upper layer insulation protective layer, the upper surface of electrode wire is also provided with aluminium-tantalum alloy layer, electrode wire one end covers heating resistor, the other end extends to the edge of substrate and sequentially forms lead-out electrode, bonding electrode, aluminium-tantalum alloy layer extends along the edge of ceramic substrate and covers to the upper of lead-out electrode, does not cover bonding electrode, can inhibit the grain boundary diffusion of aluminium atom and the compression stress generated by absorption aluminium film, and further inhibit the generation of small hillock and improve the coverage and adhesion of electrode wire upper layer insulation protective layer, improve the service life and printing effect of film thermal printing head.
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