High-voltage liquid heater igbt heat dissipation structure

Abstract

The utility model relates to a kind of high-pressure liquid heater for vehicle, especially a kind of high-pressure liquid heater IGBT heat dissipation structure, including the heat conduction platform being set on shell and several heat conduction columns being set in the heating cavity of shell, the heat conduction column is oppositely arranged with the heat conduction platform, the heat conduction platform is contacted with the IGBT, for the heat of the IGBT is conducted to the liquid inside heating cavity by the heat conduction column.The utility model provides a kind of high-pressure liquid heater IGBT heat dissipation structure, and the liquid inside liquid heater is used to dissipate heat to IGBT, and the effect of heat dissipation is good, and liquid can be heated, energy saving is realized, and energy consumption is reduced.

Description

Technical Field

[0001] This utility model relates to a high-pressure liquid heater for vehicles, and more particularly to a heat dissipation structure for an IGBT in a high-pressure liquid heater. Background Technology

[0002] Electric vehicle air conditioning heating mainly uses high-pressure liquid heaters. The liquid heater contains a resistance heater, which is controlled by an IGBT. The IGBT can precisely control the temperature, but the IGBT generates a lot of heat and requires reliable heat dissipation. For example, Chinese patent CN110053453A discloses a PTC liquid heater for new energy vehicles. The IGBT module is fixed to the inner wall of the circuit board mounting cavity by insulating screws. The insulating screws ensure a tight fit between the IGBT module and the inner wall of the circuit board mounting cavity, which helps to quickly transfer the heat of the IGBT module to the inner wall of the circuit board mounting cavity. However, this method has poor heat dissipation effect. Utility Model Content

[0003] To solve the above problems, this utility model provides a heat dissipation structure for a high-pressure liquid heater IGBT, the specific technical solution of which is as follows: A heat dissipation structure for a high-pressure liquid heater IGBT includes a heat-conducting platform disposed on a housing and a plurality of heat-conducting columns disposed in a heating cavity of the housing. The heat-conducting columns are disposed opposite to the heat-conducting platform, and the heat-conducting platform is in contact with the IGBT for conducting the heat of the IGBT to the liquid inside the heating cavity through the heat-conducting columns.

[0004] Preferably, the bottom of the heating cavity is further provided with a heat-conducting groove recessed into the heat-conducting platform, and the heat-conducting column is located at the bottom of the heat-conducting groove.

[0005] Furthermore, the top of the heat-conducting column is not lower than the bottom of the heating cavity.

[0006] Preferably, the heat-conducting platform is symmetrically arranged on both sides of the housing.

[0007] Preferably, it further includes: a clamping device disposed on the housing and abutting against the IGBT, so that the IGBT is pressed tightly against the heat-conducting platform.

[0008] Furthermore, the clamping device includes: a clamping plate, on which a clamping spring is provided, the clamping spring abutting against the IGBT to make the IGBT adhere tightly to the heat-conducting platform; and a clamping screw, the clamping screw being disposed on the housing and connected to both ends of the clamping plate.

[0009] Furthermore, the end of the clamping spring is provided with a clamping arc surface, which abuts against the IGBT.

[0010] Furthermore, the clamping plate has symmetrical reinforcing folds on both sides.

[0011] Compared with the prior art, the present invention has the following beneficial effects: The high-pressure liquid heater IGBT heat dissipation structure provided by this utility model dissipates heat from the IGBT through the liquid inside the liquid heater, resulting in good heat dissipation effect and the ability to heat the liquid, thereby achieving energy saving and reducing energy consumption.

[0012] By placing the heat dissipation structure inside the heating cavity and reducing the thickness between it and the IGBT, the heat dissipation efficiency is improved. At the same time, the heat exchange efficiency is increased by setting up heat conduction pillars. In addition, larger vortices are formed by heat dissipation grooves to further improve heat dissipation efficiency, so that the IGBT is kept at a suitable operating temperature, thereby improving the stability and reliability of IGBT operation. Attached Figure Description

[0013] Figure 1 This is a three-dimensional view of the shell from the first perspective; Figure 2 This is a two-dimensional view of the shell from a second perspective; Figure 3 This is a cross-sectional view of the shell; Figure 4 yes Figure 3 A magnified view of a section at point I; Figure 5 This is a schematic diagram of the clamping device clamping the IGBT. Figure 6 It is hidden Figure 5 A schematic diagram of the structure behind the PCB board; Figure 7 This is a schematic diagram of the clamping plate. Detailed Implementation

[0014] The present invention will now be further described with reference to the accompanying drawings.

[0015] like Figures 1 to 7 As shown, a high-pressure liquid heater IGBT heat dissipation structure includes a heat-conducting platform 13 disposed on a housing 1 and a plurality of heat-conducting columns 12 disposed in a heating cavity 11 of the housing 1. The heat-conducting columns 12 are disposed opposite to the heat-conducting platform 13, and the heat-conducting platform 13 is in contact with the IGBT 2 for conducting the heat of the IGBT 2 to the liquid inside the heating cavity 11 through the heat-conducting columns 12.

[0016] The heat conduction platform 13 is located in the electrical groove 14 at the top of the housing 1, the PCB board 5 is fixed in the electrical groove 14, and the IGBT2 is soldered onto the PCB board 5.

[0017] By using liquid to dissipate heat from the IGBT, the liquid's temperature is significantly lower than the IGBT's temperature, thus ensuring sufficient heat dissipation and providing a stable operating temperature for the IGBT, enabling stable operation. In electric vehicles with air conditioning heating mode, the heating temperature of the ethylene glycol coolant inside the high-pressure liquid heater is typically controlled between 50°C and 85°C. The optimal operating temperature of the IGBT2 is below 125°C. Therefore, the liquid effectively dissipates heat from the IGBT2, ensuring reliable heat dissipation while fully utilizing its heat, reducing energy consumption and achieving energy savings.

[0018] To further improve heat dissipation, a heat-conducting groove 15 recessed into the heat-conducting platform 13 is provided at the bottom of the heating chamber 11, with heat-conducting pillars 12 located at the bottom of the heat-conducting groove 15. The heat-conducting groove 15 causes turbulent flow of the liquid, increasing the residence time of the liquid in the heating groove and thus improving the heat dissipation effect. The heat-conducting groove 15 also reduces the thickness of the heat-conducting platform, decreasing the distance between the IGBT and the liquid, further enhancing the heat dissipation effect.

[0019] The top of the heat-conducting column 12 is not lower than the bottom of the heating cavity 11, and the top of the heat-conducting column 12 is higher than the bottom of the heating cavity 11, so that the heat-conducting column 12 can fully contact the liquid, improve the heat exchange effect, and thus improve the heat dissipation effect of IGBT2.

[0020] To achieve balanced heat dissipation, the heat conduction platform 13 is symmetrically arranged on both sides of the housing 1. The multiple IGBT2s are divided into two groups and installed on both sides of the housing 1 respectively, avoiding the problem of concentrated heat generation from the IGBT2s leading to poor heat dissipation, thus ensuring balanced and effective heat dissipation.

[0021] To further ensure reliable heat dissipation of IGBT2, a clamping device is also included. This device is mounted on the housing 1 and abuts against IGBT2 to ensure it is firmly pressed against the heat-conducting platform 13. Specifically, the clamping device includes a clamping plate 3 and clamping screws 4. Both ends of the clamping plate 3 are fixed to the housing 1 by the clamping screws 4, and the clamping plate 3 is positioned above IGBT2. The clamping plate 3 has clamping springs 31 that abut against IGBT2 to ensure it is firmly pressed against the heat-conducting platform 13. Furthermore, to protect IGBT2 and prevent damage, the ends of the clamping springs 31 have clamping arc surfaces 32 that abut against IGBT2. The clamping plate 3 has symmetrically arranged reinforcing flanges 33 on both sides. These flanges increase the strength of the clamping plate 3, preventing deformation and ensuring that IGBT2 is reliably clamped onto the heat dissipation platform.

[0022] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without inventive effort, and these embodiments will all fall within the protection scope of the claims of this utility model.

Claims

1. A heat dissipation structure for a high-pressure liquid heater IGBT, characterized in that, It includes a heat-conducting platform (13) disposed on the housing (1) and a plurality of heat-conducting columns (12) disposed in the heating chamber (11) of the housing (1). The heat-conducting columns (12) are disposed opposite to the heat-conducting platform (13), and the heat-conducting platform (13) is in contact with the IGBT (2) for conducting the heat of the IGBT (2) to the liquid inside the heating chamber (11) through the heat-conducting columns (12).

2. The high-pressure liquid heater IGBT heat dissipation structure according to claim 1, characterized in that, The bottom of the heating chamber (11) is also provided with a heat-conducting groove (15) that is recessed into the heat-conducting platform (13), and the heat-conducting column (12) is located at the bottom of the heat-conducting groove (15).

3. The high-pressure liquid heater IGBT heat dissipation structure according to claim 2, characterized in that, The top of the heat-conducting column (12) is not lower than the bottom of the heating cavity (11).

4. A high-pressure liquid heater IGBT heat dissipation structure according to any one of claims 1 to 3, characterized in that, The heat-conducting platform (13) is symmetrically arranged on both sides of the shell (1).

5. A high-pressure liquid heater IGBT heat dissipation structure according to any one of claims 1 to 3, characterized in that, Also includes: A clamping device is provided on the housing (1) and abuts against the IGBT (2) so that the IGBT (2) is pressed against the heat-conducting platform (13).

6. The high-pressure liquid heater IGBT heat dissipation structure according to claim 5, characterized in that, The clamping device includes: A clamping plate (3) is provided with a clamping spring (31), which abuts against the IGBT (2) to make the IGBT (2) adhere tightly to the heat-conducting platform (13); and A clamping screw (4) is provided on the housing (1) and connected to both ends of the clamping plate (3).

7. The high-pressure liquid heater IGBT heat dissipation structure according to claim 6, characterized in that, The end of the clamping spring (31) is provided with a clamping arc surface (32), which abuts against the IGBT (2).

8. The high-pressure liquid heater IGBT heat dissipation structure according to claim 6, characterized in that, The clamping plate (3) has symmetrical reinforcing folds (33) on both sides.

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