An automated silicon wafer unloading apparatus

CN224857747UActive Publication Date: 2026-10-16BOHAI NEW ENERGY (DEYANG) CO LTD
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Patent Information

Application Number
CN202522365105.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-07
Publication Date
2026-10-16
Estimated Expiration
2035-11-07

AI Technical Summary

Technical Problem

现有的许多设备其收料组件的间距是固定的,或者仅能通过繁琐的手动调节、更换零部件来适应不同尺寸的硅片

Benefits of technology

[0020]1. In this utility model, the main synchronous pulley on the main shaft is driven to rotate by the servo motor, and then the synchronous pulley on the slave shaft is driven to move the synchronous belt. The synchronous belt will drive several pallets to move in a cycle. When the pallet moves to the receiving position, the silicon wafers are stacked and received by the pallet. Then the pallet with the full material is moved to the pushing position, and then the pushing component pushes it into the temporary feeding component. The whole structure can realize continuous stacking and feeding without stopping the machine, which effectively improves production efficiency.

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Abstract

The utility model relates to the technical field of silicon wafer manufacturing equipment discloses an automatic silicon wafer blanking equipment, include: frame, screw rod adjusting assembly, the screw rod adjusting assembly is installed on the frame, stacking material receiving assembly, the stacking material receiving assembly is installed on the screw rod adjusting assembly, push material subassembly, push material subassembly is installed on the frame, temporary material discharging assembly, temporary material discharging assembly is installed on the frame, the push material subassembly can push the silicon wafer on the stacking material receiving assembly into the temporary material discharging assembly. The utility model discloses stacking material receiving assembly cooperation push material subassembly can realize continuous non -stop machine stacking blanking, effectively improve production efficiency, and can adjust the spacing between the two stacking material receiving assembly backboard, and then adapt to different width silicon wafer stacking material receiving, improve the adaptability of silicon wafer blanking equipment.
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