Electrostatic discharge protection device and application circuit thereof
CN224863312UActive Publication Date: 2026-10-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- CN202521914622.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-09
- Filing Date
- 2025-09-05
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2035-09-05
AI Technical Summary
Benefits of technology
[0005] Based on the above, the PN junction of the electrostatic discharge protection device in the embodiments of this utility model is non-planar. This advantageously provides a larger effective area of the PN junction without simultaneously increasing the die area or occupied area of the electrostatic discharge protection device. The larger effective area of the non-planar PN junction also advantageously increases the on-state current.
✦ Generated by Eureka AI based on patent content.
Abstract
Embodiments of the present application provide an electrostatic discharge (ESD) protection device and an application circuit thereof. The ESD protection device includes a P-type layer and an N-type layer in contact with the P-type layer, and a PN junction is formed at the interface between them. The PN junction is non-planar. In one method of manufacture, dopant implantation is performed to form an N-type well in the P-type layer, the N-type well overlapping or adjacent to the N-type layer, and to increase the surface area of the PN junction. The ESD protection diode can also have an anode and a cathode. An integrated circuit (IC) to be protected can have first and second power distribution networks disposed on opposite sides of the IC, connected to the IC to power the IC, and the ESD protection diode is disposed between the power distribution networks, with the cathode being part of one power distribution network and the anode being part of the other power distribution network. The non-planar PN junction of the ESD protection device advantageously provides a larger effective area of the PN junction without simultaneously increasing the die area or footprint of the ESD protection device.
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