Graphical User Interface for Wafer Dicing and Tool Setting in Electronic Devices
CN309435906SActive Publication Date: 2025-08-12SHENZHEN EXX IND AUTOMATION CO LTD
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Patent Information
- Application Number
- CN202430494653.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-06
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2039-08-06
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Figure 000001_ABST
Abstract
1. Name of the product of this design: Graphical user interface for wafer cutting and tool setting for electronic equipment. 2. Purpose of this design product: an electronic device. 3. The key design point of this design product lies in the graphical user interface. 4. The picture or photo that best illustrates the key points of the design: main view. 5.Purpose of the graphical user interface: used to display the graphical user interface for users to perform wafer cutting and tool setting. The main view shows the graphical user interface of the wafer dicing and tool setting application home page. The gray-painted parts in the above picture belong to the content screen.
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