Protective element training device and method for training a protective element

Abstract

Protective element forming device (20) forming a protective element (15) on a front surface (2) of a substrate (1), wherein the substrate (1) has depressions and projections on its front surface (2), wherein the protective element forming device (20) comprises: a plastic film adhesion unit (30) which causes a plastic film (11) to adhere to the front surface (2) of the substrate (1) so that it conforms to the depressions and protrusions on the front surface (2) of the substrate (1); a support table (40) which supports the substrate (1) in a state in which the plastic film (11) adhering to the substrate (1) is exposed upwards; a liquid plastic feed unit (50) that feeds a curable liquid plastic (13) to an upper surface (12) of the plastic film (11) which adheres to the substrate (1) supported on the support table (40); a pressure unit (60) having a flat pressure surface (61) that covers the liquid plastic (13) supplied to the plastic film (11) with a cover film (14) and presses the cover film (14) through the pressure surface (61) to distribute the liquid plastic (13) over the plastic film (11); and a hardening unit (70) that hardens the liquid plastic (13) distributed by the pressure unit (60) and forms a protective element (15) comprising the plastic film (11), the hardened liquid plastic (13) and the cover film (14) on the front surface (2) of the substrate (1), wherein The support table (40) has an annular rim area (42) with a height that does not exceed the thickness of the substrate (1) and which accommodates the substrate (1) therein, the rim area (42) preventing the liquid plastic (13) to be distributed by the pressure unit (60) from flowing away from the substrate (1).

Description

BACKGROUND OF THE INVENTION Area of ​​the invention

[0001] The present invention relates to a protective element formation device and a method for forming the protective element. Description of the state of the art

[0002] Component chips used in electronic devices are manufactured by thinning a substrate from a rear surface, where the substrate, such as silicon, is formed with components on its front surface, dividing the substrate into individual component chips, and then applying a molding plastic to protect each component to the front surface of the substrate.

[0003] Meanwhile, each component exhibits tiny depressions and protrusions formed on it due to a circuit pattern and the like. Particularly in cases where bumps serving as electrodes are attached to the front surface of the substrate, depressions and protrusions measuring several tens of micrometers or more are formed in the component. A rear surface of such a substrate, as described above, could be ground or split into individual pieces to protect the components when an adhesive strip is attached to a front surface of the substrate containing the components.

[0004] If, during these grinding and parting operations, the depressions and protrusions on a component surface of the substrate have a large height difference, the adhesive tape cannot adequately accommodate this height difference. As a result, the depressions and protrusions could be transferred to a wafer that has been ground, or abrasion caused by the cutting process could enter a gap between the adhesive tape and the component. If an adhesive tape is used that has an adhesive layer thick enough to accommodate the depressions and protrusions, a new problem arises: adhesive residue from the adhesive layer remains on the component surface.

[0005] In light of this, a method was devised for forming a protective element capable of adequately accommodating such depressions and protrusions on the front surface of the wafer. The protective element comprises a layer lacking an adhesive layer that adheres to the depressions and protrusions on the front surface of the wafer, and a curable liquid plastic (see, for example, JP 2021-27239A). This method eliminates the gap between the protective element and the depressions and protrusions of the components while simultaneously preventing any residue from the adhesive layer remaining on the wafer. PRESENTATION OF THE INVENTION

[0006] However, in the above-described method, a new problem arises in that when the liquid plastic is pressed along the film adhering to the front surface of the substrate in order to distribute the liquid plastic over the film, the liquid plastic flows away from the substrate near its outer circumference, causing a possible reduction in the thickness of a layer of liquid plastic near the outer circumference of the substrate.

[0007] Accordingly, an objective of the present invention is to provide a protective element formation device capable of preventing the flow of the liquid plastic away from the substrate while distributing the liquid plastic by pressing the liquid plastic over the front surface of the substrate, and a method for forming the protective element.

[0008] According to one aspect of the present invention, a protective element forming device is provided which forms a protective element on a front surface of a substrate, wherein the substrate has depressions and projections on its front surface. The protective element forming device comprises: a plastic film adhesion unit which causes a plastic film to adhere to the front surface of the substrate so that it conforms to the depressions and projections on the front surface of the substrate; a support table which carries the substrate in a state in which the plastic film adhering to the substrate is exposed at the top; a liquid plastic feed unit which feeds a curable liquid plastic to an upper surface of the plastic film adhering to the substrate supported on the support table; and a pressing unit which has a flat pressing surface.The liquid plastic supplied to the plastic film is covered with a cover film, and the cover film is pressed through the printing surface to distribute the liquid plastic over the plastic film. A curing unit cures the liquid plastic distributed by the printing unit, forming a protective element that comprises the plastic film, the cured liquid plastic, and the cover film on the front surface of the substrate. The support table has an annular rim area, the height of which does not exceed the thickness of the substrate, and which houses the substrate. The rim area prevents the liquid plastic to be distributed by the printing unit from flowing away from the substrate.

[0009] Preferably, the wall area has an inclined surface on its upper surface, wherein the inclined surface increases in a radial direction from an inner circumference of the wall area to an outer side thereof.

[0010] According to a further aspect of the present invention, a method for forming a protective element is provided, wherein the substrate has depressions and projections on its front surface. The method comprises: a plastic film adhesion step of causing a plastic film to adhere to the front surface of the substrate so that it conforms to the depressions and projections on the front surface of the substrate; a substrate support step of supporting the substrate on a support table in a state in which the plastic film adhering to the substrate is exposed at the top; and a liquid plastic delivery step of delivering a curable liquid plastic to an upper surface of the plastic film adhering to the substrate supported on the support table.A plastic injection molding step consisting of covering the liquid plastic supplied to the plastic film with a cover sheet and pressing the cover sheet through a flat injection surface to distribute the liquid plastic over the plastic film; a curing step consisting of curing the liquid plastic distributed in the injection molding step and forming a protective element comprising the plastic film, the cured liquid plastic, and the cover sheet on the front surface of the substrate. In the substrate support step, the substrate is supported on the support table, which has an annular rim area whose height does not exceed the thickness of the substrate and which accommodates the substrate, the rim area being caused to prevent the liquid plastic to be distributed in the injection molding step from flowing away from the substrate.

[0011] According to one aspect and another aspect of the present invention, it is possible to prevent the liquid plastic from flowing away from the substrate when the liquid plastic is pressed onto and spread on the substrate.

[0012] The above and other problems, features and advantages of the present invention, as well as the manner of its implementation, will best become clearer by studying the following description and attached claims, with reference to the attached drawings, which show a preferred embodiment of the invention, and the invention itself will be best understood thereby. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a perspective view showing an example of a substrate on which a protective element is to be formed in a protective element formation device, and a method for forming the protective element according to a preferred embodiment; Fig. Figure 2 is a top view showing an embodiment example of the protective element training device according to the embodiment; Fig. Figure 3 is a cross-sectional view that schematically depicts a plastic film adhesion unit of the in Fig. 2 shows the protective element training device; Fig. 4 is a cross-sectional view, schematically showing a support table and a liquid plastic feeding unit of the in Fig. 2 shown protective element training device are shown; Fig. 5 is a cross-sectional view that schematically shows the support table, a pressure unit and a hardening unit of the in Fig. 2 shows the protective element training device; Fig. 6 is a cross-sectional view that schematically depicts a different state of Fig. 5 represents; Fig. Figure 7 is a flowchart of a method for forming the protective element according to the embodiment; Fig. Figure 8 is an enlarged view that schematically shows a cross-section of the substrate, which contains a Fig. has gone through the plastic film adhesion step shown in section 7; Fig. 9 is an enlarged view that schematically shows the cross-section of the substrate, which forms a Fig. has completed the hardening step shown in section 7; Fig. Figure 10 is a cross-sectional view that schematically represents a support table according to a first modification; and Fig. Figure 11 is a cross-sectional view that schematically represents a state of a plastic die-cutting step according to a second modification. DETAILED DESCRIPTION OF THE PREFERRED VERSION

[0013] A preferred embodiment of the present invention will now be described in detail with reference to the drawings. (Form of execution)

[0014] In a protective element formation device 20 and a method for forming a protective element 15 according to the embodiment, the protective element 15 is formed on a front surface 2 of a substrate 1 such as a semiconductor wafer. <Substrat 1>

[0015] First, the substrate 1 is described, on whose front surface 2 the protective element 15 is formed. Fig. Figure 1 is a perspective view showing an example of the substrate 1 on which the protective element 15 is to be formed in the protective element forming device 20, and a method for forming the protective element 15 according to the preferred embodiment. The substrate 1 is, for example, a wafer such as a semiconductor wafer made of a material such as silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), or another semiconductor, or an optical device wafer. Alternatively, the substrate 1 can also be a substantially disk-shaped substrate or the like made of a material such as sapphire (Al₂O₃), glass, or quartz. The glass is, for example, alkali glass, non-alkali glass, soda-lime glass, lead glass, borosilicate glass, quartz glass, or the like.

[0016] The substrate 1 has a component area 3 and a circumferential excess area 4 on the side of the front surface 2. The component area 3 has components 6 formed in corresponding areas subdivided by several intersecting division lines 5, including several parallel division lines extending in a first direction and several parallel division lines 5 extending in a second direction perpendicular to the first direction in a grid-like pattern, the division lines 5 being formed on the front surface 2 of the substrate 1. The component 6 is, for example, an integrated circuit such as an integrated circuit (IC) or a large-scale integration (LSI), an imaging sensor such as a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS), a microelectromechanical system (MEMS), or the like.The excess area 4 is an area that surrounds the entire component area 3 in which the components 6 are not formed.

[0017] A rear surface 7 of the substrate 1, positioned on a side opposite the front surface 2 formed with the components 6, is ground to a final thickness, for example, using a grinding device. For example, the substrate 1 is first thinned and then divided along the division lines 5 into individual component chips 10 by cutting or the like. Note that the component chips 10 are in Fig. 1. Each could have a square shape, but could also have a rectangular shape.

[0018] The substrate 1 has multiple bumps 8 formed on the side of its front surface 2. The bumps 8 are protruding sections extending from the front surface of each of the components 6. Due to the placement of the bumps 8 on its front surface 2, the substrate 1 has depressions and projections. The multiple bumps 8 are electrically connected to the respective components 6, and each bump 8 acts as an electrode when an electrical signal is applied to or output from the component 6 in a state where the component chips 10 are formed by parting the substrate 1. The bumps 8 are, for example, made of a metallic material such as gold, silver, copper, or aluminum. Note that, due to the placement of the bumps 8, the substrate 1 in this embodiment has depressions and projections formed on its front surface 2.However, within the scope of the present invention, the bumps 8 need not necessarily be attached to the front surface 2 of the substrate 1, and it is sufficient if the depressions and projections are formed on the side of the front surface 2.

[0019] Note that the substrate 1 on which the protective element 15 is formed is not limited to this embodiment. For example, the substrate 1 on which the protective element 15 is formed could be a packing substrate. The packing substrate has several bumps, which serve as electrodes for individual components, formed on its front surface, and is formed by sealing several components arranged on a front surface with a plastic. The packing substrate is thinned by grinding the sealing plastic on the side of the rear surface of the packing substrate, and the packing substrate is thus divided on a component-by-component basis. Consequently, the packing substrate is divided into individual component chips 10, each having a predetermined thickness, with the component chips being sealed by the sealing plastic. <Schutzelement-Ausbildungsvorrichtung 20>

[0020] Next, the protective element training device 20, which trains the protective element 15 on the substrate 1, is described. Fig. Figure 2 is a top view showing an embodiment example of the protective element training device 20 according to the embodiment. Fig. 3 is a cross-sectional view that schematically shows a plastic film adhesion unit 30 of the in Fig. 2 shows the protective element training device 20. Fig. Figure 4 is a cross-sectional view, schematically showing a support table 40 and a liquid plastic feeding unit 50 of the in Fig. The protective element training device 20 shown in the illustrations are shown. Fig. Figure 5 is a cross-sectional view that schematically shows the support table 40, a pressure unit 60 and a hardening unit 70 of the in Fig. 2 shows the protective element training device 20. Fig. 6 is a cross-sectional view that schematically depicts a different state of Fig. 5 represents.

[0021] As in Fig. As shown in Figure 2, the protective element training device 20 has a base 21 that supports each component. The protective element training device 20 includes the plastic film adhesion unit 30, the support table 40, the liquid plastic feed unit 50, the pressing unit 60, the hardening unit 70, a cassette mounting base 90, and a transfer unit 100.

[0022] The plastic film adhesion unit 30 causes the in Fig. The plastic film 11, as shown in Figure 3, adheres to the front surface 2 of the substrate 1 so that it conforms to the depressions and protrusions on the front surface 2 of the substrate 1. The plastic film 11 is, for example, a polyolefin-based film, a polyethylene-based film, or the like, with a thickness of 20 µm or more and 80 µm or less. The plastic film 11 could be formed from a single layer or be layered. As shown in Figure 3, the plastic film 11 is designed to adhere to the front surface 2 of the substrate 1, conforming to the depressions and protrusions on the front surface 2 of the substrate 1. Fig. 2 and Fig. As shown in Figure 3, the plastic film adhesion unit 30 has a lower main body 31 in a hollow box element that opens upwards, an upper main body 32 in a hollow cover element that is arranged above the lower main body 31 and opens downwards, a clamping table 34, a plastic film feed unit 35 and exhaust units 36 and 38.

[0023] An opening in the lower main body 31 and an opening in the upper main body 32 have the same shape and are larger than the substrate 1. The upper main body 32 can be moved vertically up and down relative to the lower main body 31, and when the upper main body 32 is lowered towards the lower main body 31 so that the openings align, a space 33, insulated from the outside, can be formed within the upper main body 32 and the lower main body 31. In other words, in this embodiment, the plastic film adhesion unit 30 is designed in such a chamber-like shape that it accommodates the substrate 1 within the inner space 33.

[0024] The clamping table 34 is provided on a bottom wall of the lower main body 31. The clamping table 34 has a flat holding surface on its upper surface to support the substrate 1. When the substrate 1 is placed on the holding surface of the clamping table 34, the height of the front surface 2 of the substrate 1 is adjusted so that it is substantially the same height as, or lower than, the height of the opening of the lower main body 31. By adjusting the height of the clamping table 34 in this way, when the plastic film 11 is placed on the lower main body 31 as described below, so that the plastic film 11 adheres to the substrate 1, the clamping table prevents the plastic film 11 from adhering unnecessarily far to the side surfaces of the substrate 1.

[0025] The plastic film feeder 35 feeds the plastic film 11. The plastic film feeder 35 is positioned next to the lower main body 31 and the upper main body 32. Specifically, the plastic film feeder 35 is arranged such that the plastic film feeder 35, the lower main body 31, the upper main body 32, and the support table 40 (to be described later) are aligned in a line. The plastic film feeder 35 contains several plastic films 11 prepared within it. The multiple plastic films 11 prepared in the plastic film feeder 35 are individually transferred by the transfer unit 100 (to be described later) to the front surface 2 of the substrate 1, which is held on the clamping surface of the clamping table 34.

[0026] When the plastic film 11 covers the front surface 2 of the substrate 1 held on the clamping surface of the clamping table 34, and the upper main body 32 is lowered onto the lower main body 31 so that the openings align, the plastic film 11 defines the space 33 in a space 33-1 on the side of the lower main body 31 and a space 33-2 on the side of the upper main body 32. In particular, the plastic films 11, which are larger than the opening of the lower main body 31, are prepared in the plastic film feed unit 35 such that the space 33-1, which is enclosed by the lower main body 31 and the plastic film 11, is formed.After the plastic film 11 has been transferred to the front surface 2 of the substrate 1, the upper main body 32 is lowered onto the lower main body 31, and the opening of the upper main body 32 is brought into contact with an upper surface 12 of the plastic film 11, so that the space 33-2 enclosed by the upper main body 32 and the plastic film 11 is formed.

[0027] The exhaust unit 36 ​​has an exhaust duct, one end of which is connected to a side wall or the bottom wall of the lower main body 31, and the other end of which is connected to an intake source 37. The exhaust unit 36 ​​can extract air from space 33-1, which is surrounded by the lower main body 31 and the plastic film 11 covering the substrate 1, and decompress space 33-1. The exhaust unit 38 has a duct, one end of which is connected to a side wall or the ceiling of the upper main body 32, and the other end of which is connected to an intake source 39. The exhaust unit 38 can extract air from space 33-2, which is surrounded by the lower main body 31 and the plastic film 11 covering the substrate 1, and decompress space 33-2.

[0028] Furthermore, a heating unit, capable of supplying heated gas to chamber 33-2, could be connected to the side wall or ceiling of the upper main body 32 in the plastic film adhesion unit 30. The gas could be, for example, air, nitrogen gas, or a similar substance. If, for instance, the plastic film 11 is made of a material whose flexibility increases upon heating, the heated air supplied to chamber 33-2 will raise the temperature of the plastic film 11, thereby softening it. Once softened, the plastic film 11 can be easily deformed to conform to the shape of the front surface 2 of the substrate 1, and thus adheres readily to the front surface 2 of the substrate 1.The plastic film adhesion unit 30 could be designed such that, in order to heat and soften the plastic film 11 so that the plastic film 11 adheres easily to the substrate, the clamping table 34 has a heat source, so that the plastic film 11 is heated and softened by the substrate 1 through the holding surface heated by the heat source.

[0029] As in Fig. As shown in Figure 4, the support table 40 carries the substrate 1 in a state where the plastic film 11 adhering to the substrate 1 is exposed at the top. The support table 40 is positioned next to the plastic film adhesion unit 30 at the base 21. The substrate 1, to which the plastic film 11 is induced to adhere by the plastic film adhesion unit 30, is transferred from the plastic film adhesion unit 30 to the support table 40 by the transfer unit 100, which will be described later.

[0030] The support table 40 has an annular rim 42 surrounding a support surface 41, which supports the substrate 1. The substrate 1 is housed within the rim 42. In other words, the rim 42 surrounds the substrate 1, which is supported by the support surface 41. An upper surface 43 of the rim 42 is at least higher than the support surface 41 and has a height that does not exceed the thickness of the substrate 1. The upper surface 43 of the rim 42 supports a section of the plastic film 11 that covers the substrate 1, with this section being located outside the circumferential edge 9 of the substrate 1.

[0031] While the substrate 1 is supported by the support table 40, the liquid plastic feed unit 50, which will be described later, supplies a liquid plastic 13 to the upper surface 12 of the plastic film 11, which is adhered to the side of the front surface 2. The liquid plastic 13 supplied to the upper surface 12 of the plastic film 11 is then covered by a cover film 14 and forced from above by the pressure unit 60, which will be described later, to distribute it over the plastic film 11. The distributed liquid plastic 13 is then hardened by the curing unit 70, which will be described later.

[0032] The wall area 42 carries the section of the plastic film 11 covering the substrate 1, which is arranged outside the circumferential edge 9 of the substrate 1, and accordingly, when the liquid plastic 13 is pressed from above by the pressure unit 60 to be described later, the liquid plastic 13 pressed onto and distributed on the plastic film 11 is prevented from flowing away from the substrate 1.

[0033] More precisely, to prevent the liquid plastic 13 from flowing away from the substrate 1, the height of the upper surface 43 of the wall region 42 could preferably be set to correspond to the height of the substrate 1 in the construction. In practice, however, the thickness of the substrate 1 varies substantially by several hundred micrometers, so the height of the upper surface 43 of the wall region 42 could substantially be several hundred micrometers smaller than the thickness of the substrate 1.

[0034] The liquid plastic feed unit 50 delivers the curable liquid plastic 13 to the upper surface 12 of the plastic film 11, which adheres to the substrate 1 supported by the support table 40. In this embodiment, the curable liquid plastic 13 is a plastic curable by irradiation with ultraviolet rays; however, it could also be a thermosetting plastic, which, for example, can be cured by heating within the scope of the present invention. The liquid plastic feed unit 50 is positioned next to the support table 40 of the base 21.

[0035] In this embodiment, the liquid plastic feeding unit 50 is a tubular unit comprising a shaft section 51 extending vertically, an arm section 52 extending horizontally from an upper end of the shaft section 51, and a nozzle 53 directed downwards from a distal end of the arm section 52. The shaft section 51 is rotatable in the vertical direction. In the liquid plastic feeding unit 50, the nozzle 53 moves along an arc-shaped path with the arm section 52 as its radius when the shaft section 51 is rotated. The length of the arm section 52 is defined such that the nozzle 53 can be positioned above the center of the support table 40 by rotating the shaft section 51.

[0036] As in Fig. 5 and Fig. As shown in Figure 6, the pressure unit 60 covers the liquid plastic 13, which is fed onto the plastic film 11, with the cover film 14 and presses the cover film 14 with a flat pressure surface 61, so that the liquid plastic 13 is distributed over the plastic film 11 by being pressed from above. The cover film 14 is an element that forms the protective element 15, as are the plastic film 11 and the liquid plastic 13. The pressure unit 60 is located above the support table 40. The pressure unit 60 has a pair of support columns 62, a pair of connecting sections 63, a pair of support sections 64, a pressure section 65 which contains the pressure surface 61, and a cover film feed unit 66.

[0037] The pair of support columns 62 extends along the vertical direction. The pair of connecting sections 63 can be raised and lowered along the vertical direction along the support columns 62 by a lifting and lowering mechanism (not shown). The pair of support sections 64 extends from the connecting sections 63 in the horizontal direction. The pressure section 65 is supported by the pair of support sections 64. The pressure section 65 has the pressure surface 61 as its lower surface. The orientation of the pressure surface 61 is set such that it runs parallel to the support surface 41 of the support table 40 with high accuracy. The pressure section 65 can hold the cover film 14 against the pressure surface 61.

[0038] The printing section 65 could have a holding mechanism (not shown) to retain the cover film 14 on the printing surface 61. The holding mechanism may, for example, have a suction hole provided in the printing surface 61 and a suction source connected to the suction hole, and the cover film 14 could be held on the printing surface 61 by being drawn in through the suction hole. Additionally, the holding mechanism could, for example, have an electrostatic clamping mechanism located near the printing surface 61, which holds the cover film 14 on the printing surface 61 by means of an electrostatic force.

[0039] However, the pressing section 65 might not necessarily have the holding mechanism. In a case where the pressing section 65 does not have the holding mechanism, for example, an adhesive layer could be provided on an upper surface of the cover film 14, and the cover film could be bonded to the pressing surface 61 by the adhesive layer, or by applying an adhesive to the upper surface of the cover film 14 or to the pressing surface 61, the cover film 14 could be bonded to the pressing surface 61 by the adhesive.

[0040] The cover film feed unit 66 (see Fig. 2) Feeds the cover film 14. The cover film feed unit 66 is located next to the support table 40. The cover film feed unit 66 has several cover films 14 prepared in it. The several cover films 14 prepared in the cover film feed unit 66 are loaded individually onto the support table 40 as needed, and the pressure section 65 is lowered so that the upper surface of the loaded cover film 14 is brought into contact with the pressure surface 61, thus holding the cover film 14 against the pressure surface 61.

[0041] As in Fig. As shown in Figure 6, the pressure section 65 moves up and down along the connecting sections 63 and the support sections 64 in the vertical direction, corresponding to a vertical movement of the connecting sections 63 relative to the support columns 62. The pressure section 65 is lowered onto the support table 40 in a state where the cover film 14 is held against the pressure surface 61, so that the liquid plastic 13 is covered by the cover film 14 on the plastic film 11, which covers the substrate 1 supported by the support table 40. The pressure section 65 is lowered further so that the liquid plastic 13 is forced from above through the cover film 14 by the pressure surface 61 to be distributed over the plastic film 11.

[0042] The hardening unit 70 hardens the liquid plastic 13, which is pressed and distributed by the pressing unit 60, and accordingly the protective element 15, comprising the plastic film 11, the hardened liquid plastic 13 and the cover film 14, is formed on the front surface 2 of the substrate 1. The hardening unit 70 is positioned near the pressing surface 61 in the pressing section 65 of the pressing unit 60.

[0043] As in the embodiment, in a case where the liquid plastic 13 is an ultraviolet curable plastic that can be cured by irradiation with ultraviolet rays, the curing unit 70 has several ultraviolet light-emitting diodes (LEDs) or the like that apply the ultraviolet rays to the liquid plastic 13, which has been pressed and spread. In this case, a lower end of the pressing section 65, which has the pressing surface 61, is formed from an element through which the ultraviolet rays can pass. Note that, for example, in a case where the liquid plastic 13 is a thermosetting plastic that can be cured by heating, the curing unit 70 has a heating device or the like that heats the liquid plastic 13, which has been pressed and spread.

[0044] In the protective element training device 20, the protective element 15 formed on the front surface 2 of the substrate 1 is transferred, for example, by the transfer unit 100 (to be described later) from the support table 40 to a support surface 81 of another support table 80, and an unnecessary section of the protective element 15 outside the circumferential edge 9 of the substrate 1 is cut off by a cutting unit (not shown). In this way, the superfluous section of the protective element 15 is cut off by the cutting unit (not shown), and the substrate 1 is brought into a state in which grinding of the rear surface 7 is possible.

[0045] As in Fig. As shown in Figure 2, the cassette mounting base 90 is attached to one end of the base 21. A cassette 91, in which several substrates 1 are housed, is mounted on the cassette mounting base 90. In the protective element training device 20 of the present embodiment, two cassette mounting bases 90-1 and 90-2 are mounted. The substrate 1, on which the protective element 15 has not yet been formed, is housed, for example, in the cassette 91-1, which is transported on the cassette mounting base 90-1, and is loaded into the protective element training device 20. The substrate 1, on whose front surface 2 the protective element 15 is formed in the protective element training device 20, is housed, for example, in the cassette 91-2, which is attached to the cassette mounting base 90-2, and is unloaded from the protective element training device 20.

[0046] The transfer unit 100 of the embodiment comprises substrate transfer robots 110 and 120 and linear motion transfer units 130 and 140. The substrate transfer robots 110 and 120 are, for example, each articulated robot having several arm sections continuously connected to one another so that they can be rotated at common end sections. The substrate transfer robots 110 and 120 of the present embodiment can hold the substrate 1 by means of holding sections 111 and 121, which are provided at the respective distal ends of the arm sections at the most distal end face, and the holding sections 111 and 121 can be moved when the arm sections are rotated together.

[0047] The substrate transfer robot 110 is mounted on base 21 next to the cassette mounting base 90-1. The substrate transfer robot 110 inserts the holding section 111 into the cassette 91-1, which is located, for example, on the cassette mounting base 90-1, and unloads one of the stored substrates 1 to transfer the substrate 1 to the plastic film adhesion unit 30. The substrate transfer robot 120 is positioned next to the cassette mounting base 90-2 on base 21. The substrate transfer robot 120 unloads, for example, the substrate 1 from the support table 80 and inserts the holding section 121 into the cassette 91-2, which is located on the cassette mounting base 90-2, to load and hold the substrate 1.

[0048] The linear motion transfer unit 130 transfers the plastic film 11 from the plastic film feed unit 35 of the plastic film adhesion unit 30 to the lower main body 31 and the clamping table 34. The linear motion transfer unit 130 transfers the substrate 1, to which the plastic film 11 is pressed by the plastic film adhesion unit 30, in a state where a section of the plastic film 11 is distributed outside the circumferential edge 9 of the substrate 1, from the clamping table 34 to the support table 40. The linear motion transfer unit 140 transfers the substrate 1, on which the protective element 15 is formed, from the support table 40 to the support table 80.

[0049] The linear motion transfer units 130 and 140 comprise guide rails 131 and 141, arm sections 132 and 142, base sections 133 and 143, suction pad support sections 134 and 144, and motion mechanisms (not shown). The guide rails 131 and 141 extend in the direction in which the substrate 1 is transported. The arm sections 132 and 142 can move along the guide rails 131 and 141. The base sections 133 and 143 are attached to the distal portions of the arm sections 132 and 142. Several suction pads are attached to the lower surfaces of the outer circumferential portions of the base sections 133 and 143. The suction pad support sections 134 and 144 are attached to the respective central lower surfaces of the base sections 133 and 143. Several non-contact suction pads are attached to each of the lower surfaces of the suction pad support sections 134 and 144.The movement mechanisms cause the arm sections 132 and 142 to move along the guide rails 131 and 141 together with the base sections 133 and 143 and the suction pad support sections 134 and 144. <Methode zum Ausbilden des Schutzelements 15>

[0050] Next, a method for forming the protective element 15 according to the embodiment is described.

[0051] Fig. Figure 7 is a flowchart illustrating the process for forming the protective element 15 according to the embodiment. The process for forming the protective element 15 according to the embodiment comprises a plastic film adhesion step 201, a substrate support step 202, a liquid plastic feeding step 203, a plastic pressing step 204, and a curing step 205.

[0052] Fig. Figure 8 is an enlarged view that schematically shows a cross-section of the substrate 1, which contains the in Fig. Figure 7 shows the plastic film adhesion step 201. The plastic film adhesion step 201 causes the plastic film 11 to adhere to the front surface 2 of the substrate 1, so that it conforms to the depressions and projections (bumps 8) on the front surface 2 of the substrate 1. In this embodiment, the plastic film adhesion step 201 is activated by the Fig. 2 and Fig. 3 plastic film adhesion unit 30 shown.

[0053] In the plastic film adhesion step 201, one of the substrates 1 in the cassette 91-1, which is mounted on the cassette mounting base 90-1, is first held by the substrate transfer robot 110 in a state in which the upper main body 32 of the plastic film adhesion unit 30 is raised. The substrate transfer robot 110 then loads the held substrate 1 onto the holding surface of the clamping table 34 in the lower main body 31. At this point, the front surface 2 with the recesses and projections is oriented upwards, and the substrate 1 is loaded such that the side of the rear surface 7 faces the holding surface of the clamping table 34.

[0054] Next, the linear motion transfer unit 130 removes one of the plastic films 11 from the plastic film feed unit 35, and the plastic film 11 is placed on the lower main body 31 to cover the front surface 2 of the substrate 1, so that the opening of the lower main body 31 is closed by the plastic film 11. Next, the upper main body 32 is lowered and, with the plastic film 11 interposed, is placed on the lower main body 31.

[0055] Next, in the plastic film adhesion step 201, the exhaust unit 36 ​​is actuated to decompress the space 33-1 defined by the lower main body 31 and the plastic film 11, while the exhaust unit 38 is actuated to decompress the space 33-2 defined by the upper main body 32 and the plastic film 11. Following the decompression of the exhaust unit 38, space 33-2 is then opened to the atmosphere. Consequently, a rapidly occurring pressure differential between the upper and lower sides of the plastic film 11 causes the plastic film 11 to adhere to the front surface 2 of the substrate 1, as shown, for example, in Fig. 8 shown, so that the plastic film 11 adapts to the depressions and protrusions on the front surface 2 of the substrate 1.

[0056] In the plastic film adhesion step 201, the plastic film 11 could be heated before or after the chamber 33-2 is decompressed by supplying heated gas to the chamber 33-2. Alternatively, in the plastic film adhesion step 201, the plastic film 11 could be heated by the substrate 1 if the heat source provided in the clamping table 34 heats the holding surface of the clamping table 34. Since the plastic film 11 softens as a result of the heating, it can easily follow the indentations and protrusions on the front surface 2 of the substrate 1, and thus the plastic film 11 can more easily adhere to the front surface 2 of the substrate 1. After the plastic film 11 adheres to the substrate 1, the exhaust unit 36 ​​is stopped and the upper main body 32 is raised. The substrate 1, on which the plastic film 11 is attached, is transferred from the linear motion transfer unit 130 to the support table 40.

[0057] Note that before the substrate 1, to which the plastic film 11 adheres, is transferred to the support table 40, the pressing surface 61 of the pressing unit 60 holds the cover film 14 in place beforehand. More precisely, after one of the cover films 14 has been pulled from the cover film feed unit 66 to the support table 40, which has not yet carried the substrate 1, the pressing section 65 is lowered so that the pressing surface 61 comes into contact with the upper surface of the cover film 14, and the pressing surface 61 holds the cover film 14. After the pressing surface 61 holds the cover film 14, the pressing section 65 is raised again before the substrate 1 is transferred to the support table 40.

[0058] Substrate carrying step 202 is a step in carrying substrate 1 at the point where it is located. Fig. Figure 4 shows the support table 40 in a state in which the plastic film 11 adhering to the substrate 1 is exposed at the top. In this embodiment, the support table 40 has an annular rim area 42, the height of which does not exceed the thickness of the substrate 1, and which receives the substrate 1 inside.

[0059] In substrate support step 202, the support surface 41 inside the wall area 42 carries the substrate 1. At this time, the upper surface 43 of the wall area 42 carries the section of the plastic film 11 that covers the substrate 1 outside the circumferential edge 9 of the substrate 1.

[0060] The liquid plastic feeding step 203 is a step for feeding the curable liquid plastic 13 to the upper surface 12 of the plastic film 11, which adheres to the substrate 1 supported on the support table 40. In this embodiment, the liquid plastic feeding step 203 is carried out by the Fig. 4 Liquid plastic feeding unit 50 shown.

[0061] In liquid plastic feeding step 203, the shaft section 51 of the liquid plastic feeding unit 50 is first rotated so that the nozzle 53 is positioned above the center of the support table 40. Next, the liquid plastic 13 is applied from the nozzle 53 of the liquid plastic feeding unit 50 to the front surface 2 of the substrate 1. After a predetermined quantity of the liquid plastic 13 has been fed, the shaft section 51 is rotated again, and the nozzle 53 is positioned so that it does not overlap with any area above the support table 40.

[0062] The plastic injection molding step 204 is a step of covering the liquid plastic 13 supplied to the plastic film 11 with the cover film 14, pressing the cover film 14 through the flat injection surface 61, and distributing the liquid plastic 13 over the plastic film 11. In this embodiment, the plastic injection molding step 204 is carried out by the in Fig. 5 and Fig. The pressure unit 60 shown in section 6 is executed.

[0063] In the plastic injection molding step 204, the injection section 65 is lowered, and accordingly, the liquid plastic 13 is forced from above through the cover film 14 by the injection surface 61, which covers the cover film 14. This forces and distributes the liquid plastic 13 towards the circumferential edge 9 of the substrate 1. More precisely, the liquid plastic 13 flows towards the circumferential edge 9 of the substrate 1 between the cover film 14, held by the flat injection surface 61, and the plastic film 11, which adheres to the front surface 2 of the substrate 1 along the depressions and projections (bumps 8) on the side of the front surface 2 of the substrate 1.

[0064] In the plastic injection molding step 204, the upper surface 43 of the wall area 42 of the support table 40 carries the section of the plastic film 11 that is positioned outside the circumferential edge 9 of the substrate 1. This prevents the liquid plastic 13 to be injected and distributed from flowing out of the substrate 1. When the liquid plastic 13 has been injected and distributed to cover the entire area of ​​the front surface 2 of the substrate 1, the plastic injection molding step 204 ends, and the curing step 205 is performed.

[0065] Fig. 9 is an enlarged view that schematically shows the cross-section of substrate 1, which contains the in Fig. The curing step 205 shown in Figure 7 has been completed. Curing step 205 is a step for curing the liquid plastic 13, which was spread after pressing in the plastic pressing step 204, and for forming the protective element 15, which comprises the plastic film 11, the cured liquid plastic 13, and the cover film 14 on the front surface 2 of the substrate 1. In this embodiment, curing step 205 is performed by the curing unit 70.

[0066] In the curing step 205, the curing unit 70, in a state in which the vertical movement of the pressing section 65, which was lowered in the plastic pressing step 204, is stopped, directs the ultraviolet rays, which pass through the pressing surface 61 and the cover film 14, onto the liquid plastic 13, thereby curing the liquid plastic 13.

[0067] After performing hardening step 205, when the hardening unit 70 is stopped and the pressure section 65 is raised, as in Fig. As shown in Figure 9, the cover film 14 remains on the hardened liquid plastic 13. More precisely, the protective element 15, which is obtained by joining the plastic film 11, the hardened liquid plastic 13, and the cover film 14, is formed on the front surface 2 of the substrate 1. The bearing surface 41 of the support table 40 and the pressing surface 61 of the pressing unit 60 are parallel to each other, and accordingly, the rear surface 7 of the substrate 1 and the upper surface of the protective element 15 are also parallel to each other.

[0068] As described above, in the protective element formation device 20 and the method for forming the protective element 15 according to the embodiment, the support table 40, which carries the substrate 1, has a wall area 42 surrounding the substrate 1. The upper surface 43 of the wall area 42 carries the section of the plastic film 11 that covers the substrate 1, this section being arranged outside the circumferential edge 9 of the substrate 1. Accordingly, when pressing and distributing the liquid plastic 13 on the plastic film 11, the outflow of the liquid plastic 13 from the substrate 1 can be prevented.

[0069] Note that the present invention is not limited to the embodiment described above. In other words, various changes and modifications could be made without exceeding the scope of the invention. (First modification)

[0070] For example, the wall area 42 of the support table 40 is not limited to a shape described in the embodiment. Fig. Figure 10 is a cross-sectional view schematically depicting a support table 40-1 according to a first modification. A wall area 42-1 has an upper surface 43-1 that is at least higher than the support surface 41 and has a height that does not exceed the thickness of the substrate 1, as in the embodiment. In the modification, the upper surface 43-1 of the wall area 42-1 is lower than the height of the substrate 1 supported by the support table 40. More precisely, in the modification, the wall area 42-1 has an upper surface 43-1 with a height that is less than the thickness of the substrate 1, and with a height that is several hundred micrometers less than the thickness of the substrate 1. In the modification, the support table 40-1 has a wall area 42-1 with an inclined surface 44 as a section of the upper surface 43-1 of the wall area 42-1.The inclined surface 44 is designed such that it increases in height from an inner circumference of the wall area 42-1 towards the outer side in the radial direction.

[0071] In a case where the substrate 1, to which the plastic film 11 is caused to adhere, is supported by the bearing surface 41 of the support table 40-1, the section of the plastic film 11 located outside the circumferential edge 9 of the substrate 1 is supported by the upper surface 43-1 of the wall area 42-1. In this case, a sag 11-1 occurs on a section of the plastic film 11 that corresponds to a lower section of the inclined surface 44 of the wall area 42-1.

[0072] When the liquid plastic 13 is pressed and distributed by the pressing unit 60 onto the plastic film 11 of the substrate 1, which is supported by such a support table 40-1, the pressed and distributed liquid plastic 13 is collected in the lower section of the wall area 42-1. The liquid plastic 13, which has a certain viscosity, is likely to remain in the lower section of the wall area 42-1 and is less likely to flow out of the wall area 42-1. Therefore, even if the height of the wall area 42-1 does not substantially correspond to the thickness of the substrate 1, and especially even if the height of the wall area 42-1 is less than the thickness of the substrate 1, the outflow of the liquid plastic 13 can be prevented.Note that it is sufficient if the height of the upper surface 43-1 of the wall area 42-1, which has the inclined surface 44, does not exceed the thickness of the substrate 1, and in the present invention the height of the upper surface 43-1 with respect to the construction can be equal to the height (thickness) of the substrate 1 which is supported by the support table 40. (Second modification)

[0073] Additionally, the plastic film 11 could, for example, be connected to the ring-shaped frame 16 by thermocompression bonding. Fig.Figure 11 is a cross-sectional view schematically showing a state of the plastic injection molding step 204 according to a second modification. The annular frame 16 has an opening whose diameter is larger than the outer diameter of the wall area 42. Additionally, the thickness of the frame 16 is greater than the height of the wall area 42. The frame 16 is made of a material such as metal or plastic. The outer circumference of the plastic film 11 is connected to the upper surface 17 of the frame 16 by thermocompression bonding.

[0074] The substrate 1 is positioned in a predetermined position within the opening of the frame 16, and the front surface 2 of the substrate 1 is caused by the plastic film adhesion unit 30 to adhere to the plastic film 11, thus securing the substrate 1 to the frame 16. In a case where the plastic film 11 is connected to the frame 16 by thermocompression bonding, the substrate 1, adhering to the plastic film 11, is transferred together with the frame 16 onto the support table 40.

Claims

[1] Protective element forming device (20) forming a protective element (15) on a front surface (2) of a substrate (1), wherein the substrate (1) has depressions and projections on its front surface (2), wherein the protective element forming device (20) comprises: a plastic film adhesion unit (30) which causes a plastic film (11) to adhere to the front surface (2) of the substrate (1) so that it conforms to the depressions and protrusions on the front surface (2) of the substrate (1); a support table (40) which supports the substrate (1) in a state in which the plastic film (11) adhering to the substrate (1) is exposed upwards; a liquid plastic feed unit (50) that feeds a curable liquid plastic (13) to an upper surface (12) of the plastic film (11) which adheres to the substrate (1) supported on the support table (40); a pressure unit (60) having a flat pressure surface (61) that covers the liquid plastic (13) supplied to the plastic film (11) with a cover film (14) and presses the cover film (14) through the pressure surface (61) to distribute the liquid plastic (13) over the plastic film (11); and a hardening unit (70) that hardens the liquid plastic (13) distributed by the pressure unit (60) and forms a protective element (15) comprising the plastic film (11), the hardened liquid plastic (13) and the cover film (14) on the front surface (2) of the substrate (1), wherein The support table (40) has an annular rim area (42) with a height that does not exceed the thickness of the substrate (1) and which accommodates the substrate (1) therein, the rim area (42) preventing the liquid plastic (13) to be distributed by the pressure unit (60) from flowing away from the substrate (1). [2] Protective element forming device (20) according to claim 1, wherein the wall area (42) has an inclined surface (44) on its upper surface (43), wherein the inclined surface (44) increases in a radial direction from an inner circumference of the wall area (42) to an outer side thereof. [3] Method for forming a protective element (15) which forms a protective element (15) on a front surface (2) of a substrate (1), wherein the substrate (1) has depressions and projections on its front surface (2), wherein the method comprises: a plastic film adhesion step (201) of causing a plastic film (11) to adhere to the front surface (2) of the substrate (1) so that it conforms to the depressions and protrusions on the front surface (2) of the substrate (1); a substrate carrying step (202) of carrying the substrate (1) on a carrying table (40) in a state in which the plastic film (11) adhering to the substrate (1) is exposed upwards; a liquid plastic feeding step (203) of feeding a curable liquid plastic (13) to an upper surface (12) of the plastic film (11) which adheres to the substrate (1) supported on the support table (40); a plastic pressing step (204) of covering the liquid plastic (13) supplied to the plastic film (11) with a cover film (14) and pressing the cover film (14) through a flat pressing surface (61) to distribute the liquid plastic (13) over the plastic film (11); and a curing step (205) of curing the liquid plastic (13) which is distributed in the plastic printing step (204), and of forming a protective element (15) which comprises the plastic film (11), the cured liquid plastic (13) and the cover film (14) on the front surface (2) of the substrate (1), wherein In the substrate support step (202), the substrate (1) is supported on the support table (40), which has an annular bulge area (42) with a height that does not exceed the thickness of the substrate (1), and which accommodates the substrate (1) therein, the bulge area (42) being caused to prevent the liquid plastic (13), which is to be distributed in the plastic injection step (204), from flowing away from the substrate (1).

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