SEMICONDUCTOR ELEMENT TRANSFER DEVICE AND TRANSFER METHOD USING THE SAME
DE102024201444A1Pending Publication Date: 2025-03-27HYUNDAI MOTOR CO LTD +1
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Patent Information
- Application Number
- DE102024201444
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-21
- Filing Date
- 2024-02-16
- Publication Date
- 2025-03-27
Abstract
An apparatus for transferring a semiconductor element comprises a support base, a plurality of adsorption sections provided on a lower surface of the support base, a vacuum section coupled to the support base and providing a vacuum to the plurality of adsorption sections, and a heating section coupled to the support base and heating a semiconductor element to be fixed to the plurality of adsorption sections, wherein the heating section comprises a heating plate arranged on the lower surface of the support base, and the heating plate is arranged to be surrounded by the plurality of adsorption sections on the lower surface of the support base.
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