Method for processing a sample in a device generating at least two particle jets and device for carrying out the method

DE112014003194B4Active Publication Date: 2025-03-27TESCAN GRP AS
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Patent Information

Application Number
DE112014003194
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2014-07-09
Publication Date
2025-03-27
Estimated Expiration
2034-07-09
Patent Text Reader

Abstract

Method for processing a sample in a device generating at least two particle jets passing through tubes, in which the wall (4.1) of the sample (4) to be atomized is processed in a raster process with a first particle jet and monitored with a second particle jet, wherein the axis (1) of the first particle jet and the axis (2) of the second particle jet are diverging or skew when incident on the sample which is in a central position during the raster process, and wherein first the sample (4), which is in its first position in which the axis (1) of the first particle jet forms an angle (ξ) in the range of 0° to 30° with the plane of the wall to be atomized (4.1) throughout the entire raster process, is atomized raster-wise with the first particle jet, and after this processing the wall (4.1) is inclined about the inclination axis (3) of the sample (4) into its second position, in which second position the second atomization of the same wall (4.1) to be atomized is carried out raster-wise with the first particle jet, wherein this wall continues to be acted upon by the first particle jet (1) such that the axis of this particle jet again forms an angle (ξ) with the plane of the wall (4.1) to be atomized during the entire raster process, characterized in that the inclination axis (3) of the sample (4) intersects the wall (4.1) to be atomized, wherein in all the above-mentioned positions and during all the above-mentioned movements of the sample (4) on the wall (4.1) to be atomized1) During and / or after the atomization carried out with the first particle jet, the second particle jet also occurs, which rasterizes a selected area of ​​the wall to be atomized in such a way that the axis (2) of this second particle jet forms an angle of <90° with the normal (4.1.1) to a plane interpolated in the wall (4.1) to be atomized during the entire rasterization process, thereby making it possible to monitor the atomization process, during which the surface is treated with the first particle jet, continuously or at selected time intervals by means of the second particle jet, this monitoring taking place at the same positions of the sample (4) and the tubes of the device generating the particle jets as the atomizations.
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