Stacked power supply design in a card-based computing device
DE112022007228T5Pending Publication Date: 2025-03-27NVIDIA CORP
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Patent Information
- Application Number
- DE112022007228
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2022-07-27
- Publication Date
- 2025-03-27
Abstract
According to various embodiments, a processing subsystem comprises a first printed circuit board (PCB); a processor mounted directly on a first side of the first PCB; and one or more power components. The one or more power components are coupled to a second side of the first PCB and electrically coupled to the processor, with the first side of the first PCB facing the second side of the first PCB.
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