Onboard filtering device for connector

Abstract

On-board filtering device for connector. One aspect of the invention relates to a filtering device (10) intended to be connected with an electrical connector (20). The filtering device comprises a layer (11) of dielectric material, which includes a plurality of first vias formed in its thickness. Ferromagnetic ceramic is deposited in each first via on one periphery thereof. The filtering device is intended to cooperate with the electrical connector by inserting a plurality of pins (21) of said electrical connector into the plurality of first vias. Each pin is inserted into the magnetic circuit created by the ferromagnetic ceramic in the corresponding first via. The thickness of the dielectric layer is such that the plurality of pins of the electrical connector protrudes from the dielectric layer when said pins are inserted. Figure to be published with the abbreviation: Figure 2

Description

Title of the invention: On-board filtering device for connector TECHNICAL FIELD OF THE INVENTION

[0001] The technical field of the invention is that of embedded electronic systems.

[0002] The present invention relates to a filtering device intended to cooperate with an electrical connector to filter input signals to an electronic board, a connection system, an electrical assembly, and a method for manufacturing the filtering device. TECHNOLOGICAL BACKGROUND OF THE INVENTION

[0003] The increasing density of embedded electronic systems leads to a greater sensitivity of electrical signals to the environment external to the system. It is therefore necessary to add a filtering device at the equipment input to reduce noise on these signals.

[0004] Filtering is commonly performed in two ways: either directly on the electrical equipment or via an electrical connector with a filter placed at the input of the equipment in question. Several additional components (such as capacitors and ferrites), whose function is to perform the filtering, are then integrated either into the equipment or into the connector, for example inside or outside the housing of the equipment or the connector.

[0005] Integrating the filtering function into electrical equipment, which already has a specific function, increases its specificity and consumes space that could be used to integrate other functions. Therefore, integrating the filtering function into the connector allows for a more compact design. The drawback is that this integration limits the connector to a specific use and filtering function, and makes the equipment dependent on the manufacturer specializing in that connector.

[0006] The implementation of an integrated filter in a commercially available connector relies on the assembly of capacitive loads in parallel and inductive loads in series (to create, for example, LC, CL, C, Pi, T, etc. filters). Most often, these loads are capacitors for the capacitive loads and ferrites for the inductive loads, interconnected by a printed circuit board (PCB). The selection and implementation of these components are often not the core business of connector manufacturers, who, moreover, do not always possess the equipment necessary for the production of these filters, or only for small volumes.

[0007] Furthermore, for these commercially available connectors, the printed circuit board interconnecting the loads often requires a second reflow soldering stage during connector assembly in the equipment, which damages the solder joints and degrades filtering. Since visual inspection is complex or even impossible for these assemblies, it is difficult to quickly and easily verify the condition of the solder joints after assembly on the equipment.

[0008] Furthermore, the presence of these additional electronic components reduces the reliability of the connector. Indeed, these extra components are potential sources of failure for the added filtering function. Moreover, the manufacturing processes for these filters are complex, which increases the risk of filter failure, especially since these components are not designed according to the same manufacturing requirements as the connectors themselves, particularly with regard to resistance to mechanical (shocks, vibrations, etc.) and thermal stresses, which can be very high in certain applications, especially in aeronautics. This is primarily due to the fact that the core business of connector manufacturers is not the design and production of filters.

[0009] In particular, the integration of ferrites poses a problem for these filters, notably due to their assembly. Indeed, the geometry of existing filtered connectors does not allow for any configuration other than placing the ferrites around each contact that requires them. This placement results either in an elongation of the connector body or in the placement of the ferrites outside the connector body. Due to their fragility, which implies a high risk of damage during transport, the ferrites cannot be mounted by the connector manufacturer but must be assembled before integration into the equipment, requiring an additional assembly step.

[0010] Finally, adding the ferrites outside the connector presents several drawbacks. Firstly, this assembly is not suitable for all filter configurations. Secondly, the assembly is mostly carried out manually, resulting in an insufficient repeatability rate due to the handling of fragile ferrites and the use of consumables (adhesives, coating resins, etc.) applied in varying quantities.

[0011] Thus, there is a need for a filtering solution which has a footprint equivalent to or smaller than existing solutions, which is replaceable, less fragile, compatible with a quick and reliable inspection of the assembly, whose manufacturing process is repeatable, controlled and which does not require equipment other than those commonly available on the market. Summary of the invention

[0012] The invention provides a solution to the problems mentioned above by enabling the implementation of a filtering function between a connector and electrical equipment in an embedded system, using a removable printed circuit board specifically designed to be connected between the connector and the equipment via the connector pins. The invention is based in particular on technologies for embedding components in printed circuit boards for electronic use.

[0013] A first aspect of the invention relates to a filtering device intended to be connected with an electrical connector, the filtering device comprising a layer of dielectric material, the dielectric layer comprising a plurality of first vias opening into a thickness of said dielectric layer, ferromagnetic ceramic being deposited in each first via of the plurality of first vias on a periphery of said first via, the filtering device being intended to cooperate with the electrical connector by the insertion of a plurality of pins of said electrical connector into the plurality of first vias, each pin of the plurality of pins being inserted into the magnetic circuit formed by the ferromagnetic ceramic in the relevant first via of the plurality of first vias,the thickness of the dielectric layer being such that the plurality of pins of the electrical connector protrudes from the dielectric layer when said pins are inserted.

[0014] Thanks to the invention, it is possible to have a filtering device that is both separate from the electrical connector and the electrical equipment, thus performing its filtering function independently of the other elements of the embedded system.

[0015] This separation of functions also allows the filtering device to be easily installed, disassembled and / or replaced, for example in the event of filter failure, to replace it with another, to change the filter if the one installed is not suitable or no longer suitable, or if the equipment or connector is to be replaced by other models, or if the application for which the embedded system which includes these three elements is used changes.

[0016] Advantageously, the proposed filtering device is perfectly usable on embedded systems already comprising a connector with integrated filtering, in particular by replacing the filtered connector with a standard connector (i.e., without a filter) and adding the filtering device between the standard connector and the electrical equipment. It should be noted that it is also possible to add the proposed filtering device between a connector with an integrated filter and the electrical equipment of the embedded system, for example, to add a filtering function not implemented by the filter of the filtered connector.

[0017] The size of the device is directly related to the thickness of the dielectric layer, typically a printed circuit board. This allows for compactness The filtering device has a height that is equivalent to, or even smaller than, commonly used filtered connectors.

[0018] Such a filtering device is also easy to manufacture since its production requires only manufacturing equipment commonly used in production and offers good manufacturing repeatability. The manufacturing of the filtering device can thus become independent of the specialized connector manufacturer, increasing the compatibility of embedded systems with equipment and connectors from different manufacturers (thereby reducing the risks of production disruptions, additional costs, or obsolescence). It is also entirely conceivable that such a filtering device could make a connector compatible with the electrical equipment of the embedded system where this was not previously the case, typically by serving as an electrical adaptation interface between these two elements. More specifically, this allows the embedded system equipment manufacturer, or even its user, to design and manufacture the filtering device themselves.

[0019] Consequently, such a filtering device makes it possible to control each component of the embedded system's connectivity individually in order to optimize their respective functions.

[0020] Furthermore, the proposed filtering device is readily compatible with quick, simple, and repeatable inspection methods, such as visual inspection (for surface components of the filter) or X-ray inspection (for buried components of the filter—which is not possible with commercially available products because the metal body of the connector prevents any inspection of it when the filter is integrated into it), including when the filtering device is assembled with the electrical connector and / or the electrical equipment. This makes it possible to verify the condition of the filtering device to assess its ability to perform its function, but also to verify the assembly itself, in particular any solder joints that may exist between the connector and the filter and / or between the filter and the electrical equipment. This is especially relevant when the dielectric layer is a printed circuit board.

[0021] Finally, the proposed filtering solution reduces the fragility of the ferrites because they are inserted or embedded in the resin of the dielectric layer, typically a printed circuit board.

[0022] It is noted that, without the use of the dielectric layer (such as a printed circuit board), the implementation of a separable device including inductive components is difficult or does not offer all the advantages listed above.

[0023] In addition to the characteristics just mentioned, the filtering device according to the first aspect of the invention may have one or more characteristics complementary from the following, considered individually or according to all technically possible combinations.

[0024] In one embodiment, the dielectric layer is made of polymerized dielectric laminated material.

[0025] In one embodiment, the dielectric layer comprises an upper surface and a lower surface opposed to each other by the thickness of the dielectric layer, the dielectric layer comprising at least one capacitive component in the thickness of and / or on said dielectric layer, the capacitive component being formed on the upper surface and the lower surface and in each first via of the plurality of first vias between the ferromagnetic ceramic and the periphery of said first via, and wherein a sheet of dielectric material, referred to as the first sheet, is assembled on the capacitive component deposited on the upper surface and a sheet of dielectric material, referred to as the second sheet, is assembled on the capacitive component deposited on the lower surface, holes being made in the first and second sheets as well as in the capacitive component deposited on the upper and lower surfaces,said holes opening into the plurality of first vias of the dielectric layer and allowing the insertion of the plurality of pins into the plurality of first vias.

[0026] In one embodiment, the device according to the first aspect comprises a plurality of second vias formed in the thickness of the dielectric layer and opening out of the first and second sheets, a conductor being further deposited in each second via of the plurality of second vias on a periphery of said second via and on at least a portion of the surface of the second sheet.

[0027] It is noted that the capacitive component then also has a conductive function. Furthermore, the second vias can serve various functions, such as carrying electrical signals between the conductive layers potentially present in the dielectric material.

[0028] In one embodiment, an electrically conductive medium is deposited at the output of each second via of the plurality of second vias in contact with the conductor on at least a portion of the surface of the second sheet, the electrically conductive medium being intended to assemble in an electrically conductive manner the filtering device on an electronic equipment to which the electrical connector is intended to be connected.

[0029] A second aspect of the invention relates to a connection system comprising an electrical connector and a filtering device according to the first aspect, the filtering device being assembled with the electrical connector by inserting a plurality of pins of said electrical connector into the plurality of first vias, each pin of the plurality of pins being inserted into the magnetic circuit formed by the ferromagnetic ceramic in the first afferent via of the plurality of first vias.

[0030] A third aspect of the invention relates to an electrical assembly comprising a connection system according to the second aspect and electronic equipment, in which each pin of the plurality of pins of the connector inserted into the plurality of first vias passes through the filtering device and is inserted into one of the first vias of the electrical equipment.

[0031] A fourth aspect of the invention relates to a method for manufacturing a filtering device, the filtering device comprising a layer of dielectric material, the method comprising: • Provide a plurality of first vias in a thickness of the dielectric layer; • Deposit ferromagnetic ceramic in each first via of the plurality of first vias on a periphery of said first via; the filtering device being intended to be connected with an electrical connector by the insertion of a plurality of pins of said electrical connector into the plurality of first vias, each pin of the plurality of pins being inserted into the magnetic circuit formed by the ferromagnetic ceramic in the first afferent via of the plurality of first vias, the thickness of the dielectric layer being such that the plurality of pins of the electrical connector protrudes from the dielectric layer when said pins are inserted.

[0032] In one embodiment, the dielectric layer comprises an upper surface and a lower surface opposed to each other by the thickness of the dielectric layer, the method comprising: • Deposit a capacitive component on the upper surface and lower surface of the dielectric layer and in each first via of the plurality of first vias on the periphery of said first via, the ferromagnetic ceramic being deposited on the capacitive component in each first via of the plurality of first vias after deposition of the capacitive component in said plurality of first vias; • Place a sheet of dielectric material, called the first sheet, on the lower surface of the dielectric layer and a sheet of dielectric material, called the second sheet, on the upper surface of the dielectric layer; • Assemble the first and second sheets onto the dielectric layer by polymerization; • Drill through holes in the first and second sheets and in the capacitive component deposited on the upper and lower surfaces in the plurality of first vias of the dielectric layer and permitting the insertion of the plurality of pins of the electrical connector into the plurality of first vias.

[0033] In one embodiment, the process according to the first aspect comprises: • Provide a plurality of second vias in the thickness of the dielectric layer and opening out of the first and second sheets; • Place a conductor in each second via of the plurality of second vias on a periphery of said second via and on at least a portion of the lower surface of the dielectric layer.

[0034] In one embodiment, the process according to the first aspect comprises: • Deposit an electrically conductive medium at the output of each second via of the plurality of second vias in contact with the conductor on at least a portion of the lower surface of the dielectric layer, the electrically conductive medium being intended to assemble the filtering device in an electrically conductive manner onto an electronic equipment to which the electrical connector is intended to be connected.

[0035] The invention and its various applications will be better understood by reading the following description and examining the accompanying figures. BRIEF DESCRIPTION OF THE FIGURES

[0036] The figures are presented for illustrative purposes only and are in no way limiting of the invention. • Fig. 1 is a schematic representation of a filtering device according to one embodiment of the invention. • Fig. 2 is a schematic representation of a system comprising the filtering device according to one embodiment. • Fig. 3 is a schematic representation of the filtering device according to another embodiment. • Fig. 4 is a schematic representation of the filtering device according to another embodiment. • Fig. 5 is a schematic representation of the filtering device according to another embodiment. • Fig. 6 is a schematic representation of a connection system according to one embodiment, comprising a connector and a filtering device. • Fig. 7 is a schematic representation of an electrical assembly comprising, according to one embodiment, a connector, a filtering device and equipment of an embedded system. • Fig. 8 is a synoptic diagram of a manufacturing process for a filtering device according to one embodiment. • Fig. 9 is a schematic representation of a filtering device at one stage of its manufacture, according to one embodiment. • The [Fig. 10] is a schematic representation of a filtering device at another stage of its manufacture, according to one embodiment. • The [Fig. 11] is a schematic representation of a filtering device at another stage of its manufacture, according to one embodiment. • The [Fig. 12] is a schematic representation of a filtering device at another stage of its manufacture, according to one embodiment. • The [Fig. 13] is a schematic representation of a filtering device at another stage of its manufacture, according to one embodiment. DETAILED DESCRIPTION

[0037] Unless otherwise specified, the same element appearing on different figures presents a unique reference.

[0038] The invention relates to a filtering device for reducing noise on signals transmitted through an electrical connector to an electrical component of an embedded system. This filtering device functions to filter electrical signals, in particular by reducing background noise related to the embedded system environment. This filter is intended to be positioned between the electrical connector and the electrical component of the embedded system.

[0039] The invention is particularly suited for use in critical systems with extreme operating conditions, such as in aeronautics, for example for an aircraft, where the temperature and pressure constraints, as well as their respective gradients, are significantly high.

[0040] As illustrated in [Fig. 1], a first aspect of the invention relates to a filtering device 10. This filtering device 10 is intended to be connected with an electrical connector.

[0041] The filtering device 10 comprises a layer of dielectric material, also called the dielectric layer 11. This is, for example, a printed circuit board (PCB). The dielectric layer 11 is, for example, made of a polymerized dielectric laminate material.

[0042] The dielectric layer comprises one or more (i.e., at least one) inductive components 14. The inductive components 14, typically ferromagnetic ceramic 14 or ferrite 14, are arranged in parallel with each other and so as to be individually electrically connected in series with the pins of the electrical connector used to connect said connector to the electrical equipment of the embedded system, in order to create a series inductive behavior.

[0043] The dielectric layer 11 may also include one or more capacitive components 13 (or also or alternatively one or more resistive components, or other electronic or electronic components), arranged so as to achieve the desired filtering function.

[0044] In particular, the capacitive components 13 (and / or resistive components) may be embedded within the thickness e of the dielectric layer 11 and / or located on the dielectric layer 11. The number and position of the capacitive (or resistive) components depend on the desired filtering function, which is, for example, implemented using techniques known in the prior art, particularly those involving the use of an integrated electrical filter on a printed circuit board.

[0045] Whatever the desired filtering function of the filter, the dielectric layer 11 comprises a plurality of first through-throughs 12 formed, i.e., created, in the thickness e of this dielectric layer 11. These first through-throughs, commonly called vias, can be formed by any known technique, for example by drilling or milling. Preferably, the first through-throughs 12 are parallel to each other.

[0046] In each of these first vias 12, ferromagnetic ceramic 14, for example ferrite, is deposited on the walls of the cavity formed by said first via 12. That is to say, the ferromagnetic ceramic 14 (in the form of a preformed volume or not) is deposited on a periphery 12-1 of each first via 12 of the plurality of first vias 12. In other words, ferromagnetic ceramic 14 covers, in the volume delimited by each first via 12, the dielectric layer 11.

[0047] As illustrated in [Fig. 2], the filtering device 10 can be assembled to an electrical connector 20 by inserting pins 21 of the electrical connector 20 into the first vias 12 of the dielectric layer 11. The filtering device 10 is thus intended to cooperate with the electrical connector 20 by inserting a plurality of pins 21 of said electrical connector 20 into the plurality of first vias 12. Each pin 21 of the plurality of pins 21 of the connector 20 is inserted into the magnetic circuit formed by the ferromagnetic ceramic 14 deposited in the first afferent via 12 of the plurality of first vias 12, i.e., the first via 12 into which the pin 21 is inserted.

[0048] The thickness of the dielectric layer 11 is such that the pins 21 of the electrical connector 20 protrude from the dielectric layer 11 when said pins 21 are inserted (into the first vias 12), i.e., when the filtering device 10 is connected to the electrical connector 20. The thickness e of the dielectric layer 11 is therefore less than the length of the pins 21 of the electrical connector 20.

[0049] Also in relation to [Fig. 2], the connection system 40 formed by the assembly of the electrical connector 20 with the filtering device 10 can be connected to the electrical equipment 30. For this purpose, the pins 21 of the connector 20 can pass through the filtering device 10 and, at the output of the filtering device 10, be inserted into the electrical equipment 30, in particular into the first vias of this equipment 30 provided for this purpose. The assembly of the connection system 40 and the electrical equipment 30 is called the electrical assembly 50.

[0050] In some embodiments, the dielectric layer 11 includes additional vias (not shown), formed in the thickness e, in which there is no deposited ferromagnetic ceramic 14. These additional vias are also used for the insertion of the pins 21 of the connector 20. Indeed, for certain applications, it is possible to have only a portion of the pins 21 of the connector 20 come into electrical contact with the ferromagnetic ceramic 14.

[0051] In other words, the dielectric layer 11 may include one or more additional vias not comprising ferromagnetic ceramic 14, into which are inserted one or more pins 21 of the connector 20, in addition to the pins 21 inserted into the first vias 12 comprising ferromagnetic ceramic 14.

[0052] In one embodiment, the dielectric layer 11 includes additional vias (not shown) formed in the thickness e, in which there is no deposited ferromagnetic ceramic 14. These vias may also not be intended for the insertion of pins 21 of the connector 20, but may serve other functions, such as carrying electrical signals between the conductive layers potentially present in the dielectric material 11.

[0053] In one embodiment, as shown in Figure 3, the dielectric layer 11 comprises an upper surface 11-2 and a lower surface 11-1. These two surfaces are opposite each other by a thickness e of the dielectric layer 11. That is to say, these two surfaces are separated from each other by a distance equal to the thickness e of the dielectric layer 11.

[0054] In this embodiment, the capacitive component 13 can be made, non-exclusively, from conductive material surfaces such as copper. This capacitive component 13 is present on the lower surface 11-1, on the upper surface 11-2, and in the first vias 12, between the ferrite and the wall of the cavity formed by said first via 12 (i.e., the periphery 12-1 of said first via 12). In other words, the capacitive component 13 is deposited on the upper surface 11-2 and the lower surface 11-1 and in each first via 12 of the plurality of first vias 12 between the ferromagnetic ceramic 14 and the periphery 12-1 of said first via 12.

[0055] Furthermore, in this embodiment, a sheet of dielectric material is assembled onto the capacitive component 13 located on the upper surface 11-2. This assembly can be carried out on a dielectric material 11, based on crosslinked polymers or baked ceramic, combined with a capacitive component 13 based on a sheet of electrical conductor, or by electrolysis, chemical reaction, or vapor phase deposition of generally metallic deposits. This sheet is hereafter referred to as the first sheet 15a. Similarly, a sheet of dielectric material is assembled, for example by the same assembly technique, onto the capacitive component 13 located on the lower surface 11-1. This sheet is hereafter referred to as the second sheet 15b.

[0056] In other words, the first sheet 15a is assembled on the capacitive component 13 deposited on the upper surface 11-2 of the dielectric layer 11, and the second sheet 15b is assembled on the capacitive component 13 deposited on the lower surface 11-1 of the dielectric layer 11.

[0057] The first and second sheets are, for example, made of a material whose polymerization is between 0.1% and 20%, for example between 5% and 15%.

[0058] These first and second sheets 15a and 15b have an insulation function for the capacitive component deposited on the upper and lower surfaces, respectively.

[0059] Each of these first and second sheets 15a and 15b, as well as the capacitive component 13 on which each of them rests, have holes through these elements so as to open into the plurality of first vias 12. These holes are adapted to allow the insertion of the pins 21 of the connector 20 into the first vias 12 of the dielectric layer 11, in particular to allow the pins to pass through the first and second sheets 15a and 15b, as well as through the capacitive component 13 which covers the upper surface 11-2 and the one which covers the lower surface 11-1. These holes are preferably provided directly above said first vias 12.

[0060] In other words, these holes are made in the first and second sheets 15a and 15b as well as in the capacitive component 13 deposited on the upper 11-2 and lower 11-1 surfaces, said holes opening into the plurality of first vias 12 of the dielectric layer 11 and allowing the insertion of the plurality of pins 21 into the plurality of first vias 12.

[0061] This embodiment typically corresponds to an LC type filter.

[0062] In an alternative embodiment, related to Figure 4, of the second vias 16 Openings are made, that is to say provided, along the thickness e of the dielectric layer 11 and through the first and second sheets 15a and 15b, as well as through the component 13 deposited on the upper surface 11-2 and lower surface 11-1. These second vias 16 are therefore opening on both sides of the filtering device 10.

[0063] In this embodiment, a conductor, comprising for example a conductive material such as copper, is deposited on the wall of the cavity formed by each second via 16 in the filtering device 10. That is to say, it is deposited on a periphery 16-1 of each second via 16. In other words, this conductor also covers, within the volume delimited by each second via 16, the dielectric layer 11 in said second via. Preferably, the conductor is deposited in each second via so as to be electrically connected with the component 13 which is deposited on the upper and lower surfaces 11-2 and 11-1. In an alternative embodiment, as illustrated in [Fig. 4], the conductor is the capacitive component 13. In this case, the capacitive component 13 deposited in each second via 16 is no longer used in a capacitive function (which it nevertheless intrinsically remains) but in a conductive function.

[0064] In this embodiment, the conductor (such as the capacitive component 13) is also deposited on a portion of the second sheet 15b, in particular on its lower surface, i.e., the surface that is not in contact with the capacitive component 13 deposited on the lower surface 11-1. Preferably, the conductor is thus deposited around the opening of each second via 16 that emerges from the second sheet 15b. On this second sheet 15b, the conductor deposited around a second via is preferably deposited such that it extends over a surface that does not reach the opening of another second via or of a first via 12.

[0065] In other words, in this embodiment, the filtering device 10 comprises a plurality of second vias 16 formed in the thickness e of the dielectric layer 11 and opening out of the first and second sheets 15a and 15b. The conductor is further deposited in each second via 16 of the plurality of second vias 16 on the periphery 16-1 of said second via 16 and on at least a portion of the surface of the second sheet 15b.

[0066] In an alternative embodiment, related to [Fig. 5], solder paste 17 is deposited at the outlet of each second via 16 of the plurality of second vias 16. This solder paste 17 is in contact with the conductor (such as the capacitive component 13) on at least a portion of the surface of the second sheet 15b. The purpose of the solder paste 17 is to assemble and secure by soldering the filtering device 10 to the electronic equipment 30 to which the electrical connector 20 is intended to be connected.The soldering paste 17 can be advantageously replaced by alternatives such as bonding with a conductive glue, metal sintering, or any other electrically conductive medium 17 allowing the filtering device 10 to be assembled and joined in an electrically conductive manner to the electronic equipment 30 to which the electrical connector 20 is intended to be connected, when this electrically conductive medium 17 is deposited at the output of each second via 16. of the plurality of second vias 16 in contact with the conductor (such as the capacitive component 13) on at least a portion of the surface of the second sheet 15b.

[0067] The solder paste 17 may comprise beads of an alloy that melts at a temperature below 230 degrees, and a soldering flux that bonds the beads together. It may be deposited through a mask or silkscreen.

[0068] It is noted that the filtering device 10 according to the invention is fully compatible with backshell assembly devices for assembling said filtering device 10 with the electrical connector 20. This backshell configuration also allows the use of pins 21 of the connector 20 dedicated to a wire assembly, for example crimp pins, winding pins, or solder pins.

[0069] Another aspect of the invention relates, in connection with [Fig. 6], to the connection system 40, comprising the electrical connector 20 and the filtering device 10 described above. The filtering device 10 is assembled with the electrical connector 20 by inserting the plurality of pins of said electrical connector 20 into the plurality of first vias 12 of the filtering device 10. Each pin 21 of the plurality of pins 21 is inserted into the magnetic circuit formed by the ferromagnetic ceramic 14 in the corresponding first via 12 of the plurality of first vias 12.

[0070] Another aspect of the invention, related to Figures 2 and 7, concerns the electrical assembly 50 comprising the connection system 40 and the electronic equipment 30. Each pin 21 of the plurality of pins 21 of the connector 20 is inserted into the plurality of first vias 12 and passes through the filtering device 10 so as to also be inserted into vias provided in the electrical equipment 30.

[0071] By way of illustration, [Fig.7] represents the electrical assembly 50 where the filtering device 10 includes the first vias 12, the capacitive component 13, the ferrite 14, the first and second sheets 15a and 15b, the second vias 16 and the solder paste 17.

[0072] It is noted that the pins 21 of the connector can also pass through and extend beyond the electrical equipment 50 and be held by soldering a solder paste 17 deposited at the through end of these pins 21, typically on the surface of the equipment 50 which is adjacent to these pins, for example by coating these pins 21 in said solder paste 17.

[0073] Another aspect of the invention, related to [Fig. 8], concerns a method 100 for manufacturing the filtering device 10 described above. The filtering device 10 comprises the dielectric layer 11.

[0074] The process 100 includes a step 110, related to Figure 9, for providing the plurality of first vias 12 in the thickness e of the dielectric layer 11. The first vias are made by any known technique, for example by drilling or milling in said dielectric layer 11.

[0075] The dielectric layer 11 may optionally comprise one or more dielectric layers that are layered together. Usually, in this case, the plurality of dielectric layers comprises one or more already polymerized layers and one or more barely polymerized layers, the layering of which forms the dielectric layer 11.

[0076] The process 100 also includes a step 120 of depositing the ferromagnetic ceramic 14, related to [Fig. 10], in the first vias 12, in particular in each first via of the dielectric layer 11. Specifically, the deposit is carried out in each first via 12 of the plurality of first vias, on the periphery 12-1 of said first via. Said periphery 12-1 is delimited by the cavity formed by each first via 12.

[0077] Typically, this step corresponds to the deposition of ferromagnetic ceramic cores 14, such as ferrite, in the first vias 12, i.e. on the wall inside each first via 12. The ferromagnetic ceramic 14 is typically deposited by any known method.

[0078] The filtering device 10 is therefore made to be connected with the electrical connector 20 by the insertion of the plurality of pins 21 of said electrical connector 20 into the plurality of first vias 12, each pin 21 of the plurality of pins 21 being inserted into the magnetic circuit formed by the ferromagnetic ceramic 14 in the first afferent via 12 of the plurality of first vias 12.

[0079] In one embodiment, the process 100 may include a preliminary step 105 of polymerizing the material of the dielectric layer 11. This polymerization may be carried out by any known technique.

[0080] This polymerization step allows, in particular, the insertion of the capacitive component 13 into the thickness e of the dielectric layer 11, if the desired filtering function requires it. The dielectric layer 11 is then polymerized around the capacitive component 13, which thus becomes embedded, judiciously positioned to achieve the desired filtering function.

[0081] It is noted that this step 105 can alternatively be implemented before the implementation of process 100, independently of said process 100.

[0082] In one embodiment, the dielectric layer 11 comprises the upper surface 11-2 and the lower surface 11-1, and the process 100 also includes, in connection with [Fig. 11], a step 115 of deposition of the capacitive component 13 on the upper surface 11-2 and the lower surface 11-1 of the dielectric layer 11.

[0083] This step 115 also includes the deposition of the capacitive component 13 in the first vias 12 made in the dielectric layer 11. In particular, the deposition is carried out in each first via 12 of the plurality of first vias, on the periphery 12-1 of said first via. This deposition can be implemented by any known technique, for example by a chemical technique such as electrolysis, thus giving an electrical conductivity characteristic to the capacitive component 13.

[0084] The ferromagnetic ceramic 14 deposited in step 120 is thus deposited on the capacitive component 13 in each first via 12 of the plurality of first vias 12, once the deposition of the capacitive component 13 has been carried out in said plurality of first vias 12.

[0085] In this embodiment, the process 100 also includes a step 125, related to [Fig. 12], of depositing the first sheet 15a onto the lower surface 11-1 of the dielectric layer 11, and of depositing the second sheet 15b onto the upper surface 11-2 of the dielectric layer 11. The sheets are thus deposited onto the capacitive component 13 which has been deposited onto these surfaces.

[0086] In this embodiment, the process 100 also includes a step 130 of assembling the first and second sheets 15a and 15b onto the dielectric layer 11 by polymerization. The first and second sheets 15a and 15b are therefore made of a polymerizable material for assembling these sheets onto the filtering device 10. This polymerization can be carried out by any technique known per se.

[0087] In this embodiment, the method 100 also includes a step 135 for drilling holes, in relation to [Fig. 3], in the first and second sheets 15a and 15b, in particular so as to allow the first vias 12 to open out of said sheets 15a and 15b. These holes are also drilled in the capacitive component 13 deposited on the upper and lower surfaces 11-2 and 11-1. These holes are drilled by any known technique, for example by drilling or milling.

[0088] These holes thus made allow the insertion of the plurality of pins 21 of the electrical connector 20 into the plurality of first vias 12 of the dielectric layer 11.

[0089] In one embodiment, the process 100 also includes a step 140, related to [Fig. 13], for providing the plurality of second vias 16 in the dielectric layer 11. The plurality of second vias 16 are thus made within the thickness of the dielectric layer 11, to pass through the first and second sheets 15a and 15b. These second vias thus open out of the first and second sheets, and therefore out of the filtering device 10.

[0090] The second vias are made by any known technique, for example by drilling or milling.

[0091] In this embodiment, the process 100 also includes a step 145, related to [Fig.4], of depositing the conductor (such as the capacitive component 13) in the second vias 16, in particular in each second via 16 of the plurality of second vias 16, on a perimeter 16-1 of said second via 16. Said perimeter 16-1 is delimited by the cavity formed by the second via 16 concerned.

[0092] The conductor (such as the capacitive component 13) is also deposited on at least a portion of the lower surface 15b, mentioned above, of the dielectric layer 10.

[0093] The deposition of the capacitive component 13 can be implemented by any known technique, for example by the same technique as previously used for the deposition of the capacitive component 13 in the first vias 12 and on the upper 11-2 and lower 11-1 surfaces.

[0094] In one embodiment, the method 100 also includes a step 150, related to [Fig. 5], of depositing the electrically conductive medium 17, for example solder paste 17, onto the filtering device 10. As stated above, the electrically conductive medium 17 is deposited at the output of each second via 16 of the plurality of second vias 16, in contact with the capacitive component 13 located on at least a portion of the surface of the second sheet 15b of the dielectric layer 11. The electrically conductive medium 17 is thus intended to electrically conductively assemble the filtering device 10 onto the electronic equipment 30 to which the electrical connector 20 is intended to be connected.

Claims

1.

2. Demands Filtering device (10) intended to be connected with an electrical connector (20), the filtering device (10) comprising a layer (11) of dielectric material, the dielectric layer (11) comprising a plurality of first vias (12) opening into a thickness (e) of said dielectric layer (11), ferromagnetic ceramic (14) being deposited in each first via (12) of the plurality of first vias (12) on a periphery of said first via (12), the filtering device (10) being intended to cooperate with the electrical connector (20) by the insertion of a plurality of pins (21) of said electrical connector (20) into the plurality of first vias (12), each pin (21) of the plurality of pins (21) being inserted into the magnetic circuit formed by the ferromagnetic ceramic (14) in the relevant first via (12) of the plurality of first vias (12),the thickness (e) of the dielectric layer (11) being such that the plurality of pins (21) of the electrical connector (20) protrudes from the dielectric layer (11) when said pins (21) are inserted. A filtering device (10) according to claim 1, wherein the dielectric layer (11) comprises an upper surface (11-2) and a lower surface (11-1) opposed to each other by the thickness (e) of the dielectric layer (11), the dielectric layer (11) comprising at least one capacitive component (13) in the thickness (e) of and / or on said dielectric layer (11), the capacitive component (13) being formed on the upper surface (11-2) and the lower surface (11-1) and in each first via (12) of the plurality of first vias (12) between the ferromagnetic ceramic (14) and the periphery of said first via (12), and wherein a sheet of dielectric material, referred to as the first sheet (15a), is assembled onto the capacitive component (13) deposited on the upper surface (11-2) and a sheet of dielectric material, referred to as the second sheet (15b), is assembled on the capacitive component (13) deposited on the lower surface (11-1),holes being made in the first and second sheets (15a, 15b) as well as in the capacitive component (13) deposited on the upper and lower surfaces (11-2, 11-1), said holes opening into the plurality of first vias (12) of, the dielectric layer (11) and allowing the insertion of the plurality of pins (21) into the plurality of first vias (12).

3. Filtering device (10) according to claim 2, comprising a plurality of second vias (16) formed in the thickness (e) of the dielectric layer (11) and opening out of the first and second sheets (15a, 15b), a conductor being further deposited in each second via (16) of the plurality of second vias (16) on a periphery of said second via (16) and on at least a portion of the surface of the second sheet (15b).

4. Filtering device (10) according to claim 3, wherein an electrically conductive medium (17) is deposited at the output of each second via (16) of the plurality of second vias (16) in contact with the conductor on at least a portion of the surface of the second sheet (15b), the electrically conductive medium (17) being intended to electrically conductively assemble the filtering device (10) onto an electronic equipment (30) to which the electrical connector (20) is intended to be connected.

5. Connection system (40) comprising an electrical connector (20) and a filtering device (10) according to any one of the preceding claims, the filtering device (10) being assembled with the electrical connector (20) by inserting a plurality of pins (21) of said electrical connector (20) into the plurality of first vias (12), each pin (21) of the plurality of pins (21) being inserted into the magnetic circuit formed by the ferromagnetic ceramic (14) in the first afferent via (12) of the plurality of first vias (12).

6. Electrical assembly (50) comprising a connection system (40) according to claim 5 and an electronic equipment (30), wherein each pin (21) of the plurality of pins (21) of the connector (20) inserted into the plurality of first vias (12) passes through the filtering device (10) and is inserted into one of the first vias (12) of the electrical equipment (30).

7. Method (100) of manufacturing a filtering device (10), the filtering device (10) comprising a layer (11) of dielectric material, the method (100) comprising: - Providing (110) a plurality of first vias (12) in a thickness (e) of the dielectric layer (11);

8. - Deposit (120) of ferromagnetic ceramic (14) in each first via (12) of the plurality of first vias (12) on a periphery of said first via (12); the filtering device (10) being intended to be connected with an electrical connector (20) by the insertion of a plurality of pins (21) of said electrical connector (20) into the plurality of first vias (12), each pin (21) of the plurality of pins (21) being inserted into the magnetic circuit formed by the ferromagnetic ceramic (14) in the first afferent via (12) of the plurality of first vias (12), the thickness (e) of the dielectric layer (11) being such that the plurality of pins (21) of the electrical connector (20) protrudes from the dielectric layer (11) when said pins (21) are inserted. Method (100) according to claim 7, wherein the dielectric layer (11) comprises an upper surface (11-2) and a lower surface (11-1) opposed to each other by the thickness (e) of the dielectric layer (11), the method (100) comprising: - Depositing (115) a capacitive component (13) on the upper surface (11-2) and the lower surface (11-1) of the dielectric layer (11) and in each first via (12) of the plurality of first vias (12) on the periphery of said first via (12), the ferromagnetic ceramic (14) being deposited on the capacitive component (13) in each first via (12) of the plurality of first vias (12) after deposition of the capacitive component (13) in said plurality of first vias (12); - Deposit (125) a sheet of dielectric material, called first sheet (15a), on the lower surface (11-1) of the dielectric layer (11) and a sheet of dielectric material, called second sheet (15b), on the upper surface (11-2) of the dielectric layer (11); - Assemble (130) by polymerization the first and second sheets (15a, 15b) on the dielectric layer (11); - To drill (135), in the first and second sheets (15a, 15b) and in the capacitive component (13) deposited on the upper and lower surfaces, through holes in the plurality of first vias (12) of the dielectric layer (11) and permitting the insertion of the plurality of pins (21) of the electrical connector (20) into the plurality of first vias (12).

9. Method (100) according to claim 8 comprising: - Providing (140) a plurality of second vias (16) in the thickness (e) of the dielectric layer (11) and opening out of the first and second sheets (15a, 15b); - Depositing (145) a conductor in each second via (16) of the plurality of second vias (16) on a periphery of said second via (16) and on at least a portion of the lower surface (11-1) of the dielectric layer (11).

10. Method (100) according to claim 9, comprising: - Depositing (160) an electrically conductive medium (17) at the output of each second via (16) of the plurality of second vias (16) in contact with the conductor on at least a portion of the lower surface (11-1) of the dielectric layer (11), the electrically conductive medium (17) being intended to electrically conductively assemble the filtering device (10) on an electronic equipment (30) to which the electrical connector (20) is intended to be connected.

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