Modular production line and process for using the same

Abstract

To provide a modular, flexible process used in confectionery molding lines.SOLUTION: A process for producing confectionery includes a modular cooling step of cooling the confectionery. The cooling step is preferably out of a process line. The cooling is preferably carried out at a temperature of higher than 16.0°C.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to the field of confectionery manufacturing, in particular to a modular and flexible process and its use in combination with the inventive confectionery cooling step. [Background technology]

[0002] Conventional chocolate moulding lines are available in two main variations: fixed mould and non-fixed mould designs. In both types of lines, plastic chocolate moulds are transported around a fixed circuit by a chain conveying system. As the moulds go around the circuit a number of process steps are carried out.

[0003] The disadvantage of this type of line is its relative inflexibility: the process steps must be designed in from the beginning of the design process, or at least space must be reserved in the line for future expansion, and it is not always possible to predict what products will need to be manufactured in the future. Therefore, in the future, engineering modifications to the line may be necessary, which can be costly and time-consuming.

[0004] In addition, the cooling tunnels of conventional molding lines occupy a larger portion of the assets, particularly due to the need to transport the molds continuously and the method of transporting them at a temperature below ambient temperature for at least 20-30 minutes while they are cooled, which necessitates large and mechanically complex cooling tunnels, which are a disadvantage in terms of efficient use of space and which entail a large cost in terms of infrastructure to provide cooling.

[0005] EP 0940086 and US 2011 / 0045155 each disclose a confectionery production line that partially uses robots, while EP 3111768 discloses a non-industrial scale confectionery production apparatus that uses robots. Summary of the Invention

[0006] The present invention allows for the same basic process steps used in conventional confectionery forming lines, and preferably modularizes the process steps so that each process step is accomplished by a self-contained, moveable module.

[0007] Additionally, in a preferred embodiment, the transportation of molds in at least a portion of the manufacturing line of the present invention is replaced with robotic manipulation to eliminate mechanical manipulation of the molds by chain systems that are difficult to construct and maintain.

[0008] The present invention also provides a process in which the cooling tunnel process is replaced by stationary cooling of the mold, preferably at a location off-site from the rest of the production line.

[0009] The present invention also provides a process with longer cooling times at higher temperatures.

[0010] Thus, the present invention allows for longer cooling times at higher temperatures without the need for complex mold transport systems through cooling tunnels and the associated installation, maintenance and cleaning costs.

[0011] Furthermore, the present invention provides sanitation advantages. Thanks to the modular system and the separate and accessible molds and modules, the molds and modules can be cleaned more easily. The smaller footprint and elimination of the conveying system that relies on chain-driven rails in the cooler reduces the cleaning effort in particular. The elimination of large and complex mechanical systems also provides for the elimination of a source of metal shavings and lubricants, and reduces mechanical stress on the molds.

[0012] The present invention also includes a production line comprising the various equipment features defined in the process of the present invention.

[0013] Embodiments of the present invention are defined in claims 1-15.

[0014] The present invention is illustrated by the following non-limiting Figures 1 to 15, which show examples of the invention. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 illustrates a robotic module for use in one embodiment of the present invention. [Diagram 2] FIG. 2 illustrates a housing for a core process module for use in one embodiment of the present invention. [Diagram 3] FIG. 2 illustrates a depositor process module for use in one embodiment of the present invention. [Figure 4] FIG. 2 illustrates a depositor process module for use in one embodiment of the present invention. [Diagram 5] FIG. 1 is a side view of a mold for use in one embodiment of the present disclosure. [Figure 6] FIG. 2 is a bottom view of a mold cavity for use in one embodiment of the present invention. [Figure 7] FIG. 1 illustrates a mold stack on a substrate for use in one embodiment of the present invention. [Figure 8] 1 is a diagram illustrating a manufacturing process in one embodiment of the present invention. [Figure 9] FIG. 1 is a diagram showing a manufacturing line according to an embodiment of the present invention. [Figure 10] FIG. 1 is a diagram showing a manufacturing line according to an embodiment of the present invention. [Figure 11] FIG. 2 illustrates a cooling apparatus and mold stack according to an embodiment of the present invention. [Figure 12] FIG. 1 shows the results of Example 1. [Figure 13] FIG. 13 is a diagram showing a filling position performed in the second embodiment. [Figure 14] FIG. 2 shows DSC curves of chocolate samples cooled by different methods. [Figure 15] FIG. 2 shows DSC curves of chocolate samples cooled by different methods. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Symbols in Figures 1 to 13 [Table 1]

[0017] Process Steps As mentioned above, the present invention relates to a modular process. Within the scope of the present invention, the term modular means that at least one part, preferably at least two parts, of the production line are capable of independent movement, i.e. the production line comprises at least two separate sections that can be combined to form the production line. As mentioned above, preferably at least one part is self-contained and capable of independent movement.

[0018] In a preferred embodiment, separate sections of the production line each include a process module, optionally together with a robotic module, that undertakes a particular process step in the confectionery production process. In a preferred embodiment, the invention involves the use of at least two independent process modules, each capable of performing at least one process step in the production process.

[0019] In the present invention, the term upstream module refers to a module that precedes the current module in the process flow, and the term downstream module refers to a module that comes after the current module in the process flow.

[0020] In a preferred embodiment of the invention, the process comprises the following steps: 1. Filling the mold cavity with the confectionery ingredients 2. Cooling - Cool the mold to harden the confectionery 3. Demolding – Removing the product from the mold

[0021] In a preferred embodiment of the invention, the process comprises the following steps: 1. Chocolate filling - filling the mould cavity with chocolate 2. Cooling - Cool the mould to harden the chocolate 3. Demolding – Removing the product from the mold

[0022] In a preferred embodiment of the invention, the process comprises the following steps: 1.Mold adjustment 2. Chocolate filling – filling the mould cavity with chocolate 3. Shake the mould - Shake the mould to allow the chocolate to settle inside the mould 4. Licking roller - to clean the surface of the mold 5. Cooling - The mould is cooled to harden the chocolate 6. Twisting the mold - Treat the mold and remove the product from the mold 7. Demolding – Removing the product from the mold

[0023] In a preferred embodiment, the cooling step of the process is as described below.

[0024] In a preferred embodiment of the present invention, the demoulded confectionery products are packaged after demoulding, and optionally subsequently secondarily packaged.

[0025] In a preferred embodiment of the invention, at least one robotic module is used to align the molds for mold conditioning, cooling, and subsequent demolding. In a preferred embodiment, at least one robotic module is used to load and unload the molds before mold conditioning, to stack the molds before cooling, and / or to stack the molds after demolding and mold cleaning for reuse.

[0026] In a preferred embodiment, the molds are stacked directly on top of one another so that they are in direct contact. Alternatively, the molds may be placed in a container that includes features (e.g., racks) for holding multiple molds. However, by stacking the molds directly on top of one another, the number of process steps and the number of various pieces of equipment can be reduced.

[0027] In one embodiment, the rack is in-line, i.e., an integrated part of the process line. Alternatively, the rack is off-line. In one embodiment, the rack may support the molds on two or three sides of the mold. For example, two sides of the rack are open so that the molds can be removed from a different side than the side they were originally inserted on, or one side of the rack is open to insert and remove the molds. In one embodiment, the molds may be placed in the individual racks by a robot. Alternatively, or in addition, if the rack is in-line, the rack is filled by moving the molds downstream. For example, once one layer of the rack is filled, a robot is used to fill any other layers. In one embodiment, the molds are removed from the rack by a robot. In an alternative embodiment, the introduction of a subsequent mold into the rack pushes out the preceding mold in the rack.

[0028] In one embodiment of the present invention, additional process steps can be introduced to allow for the production of more complex products. For example, these additional process steps may be selected from a list including inclusion filling, wafer insertion, wafer pressing, baking, filling, etc.

[0029] In a preferred embodiment of the present invention, the process includes filling the confectionery with inclusions. The nature of the inclusions is not particularly limited, and preferably the inclusions are selected from the group including nuts, fruits, dried fruits, caramel, cereals, popcorn, pretzels, marshmallows, popcorn, biscuits (cookies), chocolate, and combinations thereof, and the inclusions may be added in whole or in parts / fragments.

[0030] In one embodiment of the invention, the filling of each of the different inclusions is performed by a separate process module, or alternatively, all inclusions may be filled by a single depositor.

[0031] In a preferred embodiment of the invention, the confectionery products are transferred in moulds between process modules of the production line, i.e. from a current module to an upstream module of the production line, by at least one robotic module. In one embodiment of the invention, a separate robotic module is used to transfer the moulds between two adjacent process modules.

[0032] In one embodiment of the present invention, molds can be transferred between process modules by an upstream robotic module positioning molds such that a succeeding mold pushes a preceding mold further downstream in the process line.

[0033] Thus, in one embodiment of the present invention, a process is provided that includes a robotic module that loads and unloads molds, transfers the molds to a receiving feature of a mold adjustment module, pushes the preceding mold downstream in the process for unloading and positioning of the subsequent mold, and after processing, the robotic module stacks the molds for a cooling process.

[0034] In a preferred embodiment of the invention, receiving features of two or more process modules form a means for transferring molds downstream in the manufacturing line using motive force provided by an upstream robot that utilizes a subsequently placed mold to push the mold down the line. A specific configuration of this embodiment is shown in Figure 9.

[0035] In a preferred embodiment, the receiving features of at least the mould preparation module and the filling module form features that allow the moulds to be transported downstream in the production line. In a preferred embodiment, the receiving features of at least the mould preparation module, the inclusion filling module, the chocolate filling module and the licking module form the means for transporting the modules downstream.

[0036] The modular manufacturing line used in the present invention simplifies the incorporation of additional process modules, achieving a highly flexible manufacturing process.

[0037] In a preferred embodiment, the process of the present invention operates at an industrial scale. In a preferred embodiment, the process of the present invention processes more than 5 molds per minute per process module, preferably more than 10 molds per minute per process module, more preferably more than 15 molds per minute. In a preferred embodiment, the upper limit of processing is controlled by the equipment used and the confectionery produced, so theoretically there may be no single upper limit. However, for example, the process of the present invention processes less than 100 molds per minute, for example less than 75 molds per minute, less than 60 molds per minute, less than 30 molds per minute, or 25 molds per minute or less.

[0038] product In a preferred embodiment of the invention, the confectionery product produced is a product selected from the group comprising sugar confectionery, chocolate confectionery or baked confectionery. In a preferred embodiment of the invention, the confectionery produced comprises chocolate.

[0039] In one embodiment, the composition produced by the present invention may usefully be a chocolate product (as defined herein), more usefully a chocolate or compound chocolate. Apart from any other legal definition available, a composition of the present invention comprising a cocoa solids content of 25% to 35% by weight together with a dairy ingredient (such as milk powder) may be informally referred to herein as a "milk chocolate" (this term includes similar chocolate products containing similar amounts of cocoa solids or its substitutes). Apart from any other legal definition available, a composition of the present invention comprising a cocoa solids content of more than 35% by weight (up to 100% (i.e. pure cocoa solids)) may be informally referred to herein as a "dark chocolate" (this term includes similar chocolate products containing similar amounts of cocoa solids or its substitutes).

[0040] In a preferred embodiment, before cooling, the chocolate product may be tempered to have a tempering index of 3 to 8, preferably 4 to 8, preferably 4 to 6. To measure this index, a Greer or Sollich tempering meter may be used.

[0041] As used herein, the term "chocolate" means any product (and / or ingredients thereof, if such a product) that meets the legal definition of chocolate in any jurisdiction, and also includes products (and / or ingredients thereof) in which all or part of the cocoa butter (CB) is replaced with cocoa butter equivalents (CBE) and / or cocoa butter substitutes (CBR).

[0042] Although the term "compound chocolate" may in some jurisdictions be legally defined by the presence of a minimum amount of cocoa solids, as used herein (unless the context clearly indicates otherwise) it means a chocolate-like analogue characterized by the presence of any amount of cocoa solids (including cocoa liquor / mass, cocoa butter and cocoa powder).

[0043] As used herein, the term "chocolate product" refers to chocolate, compounds and other related materials that contain cocoa butter (CB), cocoa butter equivalents (CBE), cocoa butter substitutes (CBR) and / or cocoa butter substitutes (CBS). Chocolate products therefore include products based on chocolate and / or chocolate analogues and thus can be based on, for example, dark chocolate, milk chocolate or white chocolate.

[0044] It will be understood that, unless the context clearly indicates, in the present invention, any one chocolate product may be substituted for any other chocolate product, and neither the term chocolate nor the term compound should be considered to limit the scope of the present invention to a particular type of chocolate product. Preferred chocolate products comprise chocolate and / or compound, more preferred chocolate products comprise chocolate, and most preferred chocolate products comprise chocolate as legally defined in the major jurisdictions (such as Brazil, the EU and / or the US).

[0045] As used herein, the term "chocolate coating" (also referred to as "chocolate shell") refers to a coating made from any chocolate product. The terms "chocolate coating" and "compound coating" can be similarly defined by analogy. Similarly, the terms "chocolate composition (or mass)", "chocolate composition (or mass)" and "compound composition (or mass)" refer to a composition (or mass) that includes, in whole or in part, a chocolate product, chocolate and a compound as its component(s), respectively. Depending on those components, the definitions of such compositions and / or masses may of course overlap.

[0046] As used herein, the term "chocolate product confectionery" means any food product that includes a chocolate product and any other ingredients, and may therefore refer to such foods as confectionery, wafers, cakes and / or biscuits, regardless of whether the chocolate product includes a chocolate coating and / or constitutes the majority of the product. The chocolate product confectionery may include any suitable form of chocolate product, such as, for example, inclusions, layers, chunks, pieces and / or drops. The confectionery product may further include any other suitable inclusions, such as, for example, crispy inclusions, such as cereals (e.g., puffed rice and / or toasted rice) and / or dried fruit pieces.

[0047] The chocolate products produced according to the invention can be used to mold tablets and / or bars for coating confectionery articles and / or to prepare more complex confectionery products. Optionally, inclusions according to a desired recipe may be added to the chocolate product before it is used to prepare the chocolate product confectionery product. As will be apparent to those skilled in the art, in some cases, the products of the invention have the same recipe and ingredients as the corresponding composition and / or mass, but in other cases, especially when inclusions are added or in the case of more complex products, the final recipe of the product may differ from the recipe of the composition and / or mass used to prepare it.

[0048] In a highly preferred embodiment of the present invention, the chocolate product confectionery product comprises a substantially solid molded chocolate tablet, chocolate bar, and / or baked product covered with a substantial amount of chocolate product. These products are prepared, for example, by substantially filling a mold with the chocolate product, optionally adding inclusions and / or baked products therein, removing the chocolate product from the mold (so-called wet shelling process), and, if necessary, by topping up the mold with more chocolate product. In such highly preferred products of the present invention, the chocolate product forms a substantial part of the product or the entire part of the product and / or a thick outer layer surrounding the inner baked product (such as wafers and / or biscuit laminates). Such solid products, in which the mold is substantially filled with chocolate, should be contrasted with products comprising a molded thin chocolate shell, which presents a different challenge. To prepare a thinly coated chocolate shell, the mold is coated with a thin layer of chocolate, which is inverted to remove excess chocolate and / or stamped with a cold plunger to define the shell shape and the mold is almost empty. In this way the mould is coated with a thin layer of chocolate to which further ingredients or fillings can be added to form the inner body of the product.

[0049] Unless the context clearly indicates otherwise herein, the term chocolate product confectionery as used herein may be readily substituted by and is equivalent to the term chocolate confectionery as used throughout this application, and in fact, those skilled in the art will understand that the two terms are interchangeable when used informally herein. However, where there is a difference in the meaning of these terms in the context given herein, therefore chocolate confectionery and / or compound confectionery are preferred embodiments of the chocolate product confectionery of the present invention, with the preferred embodiment being chocolate confectionery.

[0050] Preferred chocolate product confectionery may, for example, comprise one or more components selected from the group consisting of chocolate product(s), compound product(s), chocolate coating(s), and / or compound coating(s). The products may comprise uncoated products such as chocolate bar(s) and / or chocolate tablet(s) with or without inclusions, and / or products coated with chocolate products such as coated biscuits, cakes, wafers, and / or other confectionery articles. More preferably and / or alternatively, any of the above may comprise one or more cocoa butter substitute(s) (CBR), cocoa butter equivalent(s) (CBE), cocoa butter substitute(s) (CBS), and / or any suitable mixture(s) thereof.

[0051] In chocolate product confectionery, cocoa butter (CB) may be replaced by fats from other sources. Such products may generally comprise one or more fat(s) selected from the group consisting of lauric fat(s) (e.g. cocoa butter substitutes (CBS) derived from the kernel of the fruit of palm trees); non-lauric vegetable fat(s) (e.g. based on palm or other specialty fats); cocoa butter substitute(s) (CBR); cocoa butter equivalent(s) (CBE) and / or any suitable mixture(s) thereof. Some CBEs, CBRs and especially CBSs may contain mainly saturated fats and very low levels of unsaturated omega-3 and omega-6 fatty acids (which have health benefits). Thus, in one embodiment of the chocolate product confectionery of the present invention, such types of fats are less preferred than CB.

[0052] One embodiment of the present invention provides a multi-layer product, optionally comprising a baked good having a plurality of layers (preferably selected from one or more wafer and / or biscuit layers, and / or one or more filling layers therebetween), with at least one coating layer disposed around these food layers, the coating comprising the chocolate product of the present invention or prepared according to the present invention.

[0053] Further embodiments of the present invention provide a chocolate product confectionery product further coated with chocolate (or its equivalent such as a compound), such as a praline, a chocolate shell product and / or a chocolate coated wafer or biscuit, any of which may or may not be layered. The chocolate coating may be applied or created by any suitable means such as enrobing or moulding. The coating may comprise a chocolate product of the present invention or prepared according to the present invention.

[0054] Another embodiment of the present invention provides a chocolate product confectionery product of and / or for use in the present invention, which comprises a filling covered by an outer layer, such as, for example, a praline, a chocolate shell product, etc.

[0055] In another preferred embodiment of the present invention, the food product comprises a multi-layer coated chocolate product comprising multiple layers of wafers, chocolate products, biscuits and / or baked goods, at least one layer or coating being the chocolate product of the present invention (e.g. chocolate) and sandwiched between fillings. Most preferably, the multi-layer product comprises a confectionery product (e.g. as described herein) of a chocolate product selected from sandwich biscuit(s), cookie(s), wafer(s), muffin(s), extruded snack(s) and / or praline(s). One example of such a product is a multi-layer laminate of baked wafer and / or biscuit layers sandwiched with filling(s) and coated with chocolate.

[0056] The baked goods used in the present invention may be sweet or savory. Preferred baked goods may include baked cereal foods, the term including baked foods including cereals and / or legumes. Baked cereal products are more preferred, most preferably baked wheat foods such as wafer(s) and / or biscuit(s). Wafers may be flat or shaped (e.g. into cones or baskets for ice cream) and biscuits may have a variety of shapes, but preferred wafer(s) and / or biscuit(s) are flat so that they can be usefully laminated with the confectionery fillings (and optionally fruit-based fillings) of the present invention. More preferred wafers are non-savory wafers, e.g. wafers with a sweet or plain flavor.

[0057] A non-limiting list of these possible baked goods, which may comprise the chocolate product of the present invention and / or the chocolate composition used in the present invention, are selected from full fat biscuits, cakes, breads, pastries and / or pies, for example selected from the group consisting of: ANZAC biscuits, biscotti, flapjacks, kurabiye, lebkuchen, leckerli, macaroons, bourbon biscuits, butter cookies, digestive biscuits, custard creams, extruded snacks. , florentins, garibaldi gingerbread, koulourakia, kourabiedes, linzer torte, muffins, oreos, nice biscuits, peanut butter cookies, polvoron, pizzelles, pretzels, croissants, shortbread, cookies, fruit pies (e.g., apple pie, cherry pie), lemon drizzle cake, banana bread, carrot cake, pecan pie, apple strudel, baklava, berlina, bichon au citron, and / or similar products.

[0058] Preferably, the chocolate product of the present invention and / or the chocolate product prepared according to the present invention may be suitable for use (as a whole or part of an ingredient) as one or more coatings and / or fillings.

[0059] The coating and / or filling may comprise multiple phases, for example one or more solid and / or liquid phases, such as a fat, and / or an aqueous liquid phase such as an emulsion, dispersion, cream and / or foam, and / or a gaseous phase.

[0060] Broadly speaking, therefore, a further aspect of the invention includes food products comprising the chocolate products described herein.

[0061] A still further aspect of the present invention broadly includes the use of a chocolate product of the present invention or a chocolate product prepared according to the present invention as a chocolate confectionery product and / or as a filling and / or as a coating for the food products of the present invention described herein.

[0062] The modularity of the process and manufacturing line of the present invention allows for more artisanal (e.g., more individual and complex) products to be produced on an industrial scale. The present invention also provides the opportunity to produce many different products on the same production line.

[0063] Furthermore, the current cooling process allows for the production of chocolate with improved bloom characteristics and / or differential crystal morphology distribution compared to typical industrially produced chocolate.

[0064] mold As mentioned above, the present invention relies on the use of moulds which contain the confectionery product and which are conveyed around the production line within these moulds until the demoulding step. In a preferred embodiment, the confectionery is contained within at least one mould during the cooling step which is defined in more detail below.

[0065] In a preferred embodiment, the mold for use in the present invention may be made of any material that can withstand the physical and chemical stresses imposed on the mold during the confectionery manufacturing process and meet the hygiene requirements necessary for use in the food industry. In a preferred embodiment, the mold is made of a thermoplastic polymer. For example, the mold comprises a thermoplastic polymer containing a carbonate group (polycarbonate). In a preferred embodiment, the mold is made of a material that comprises a polymer containing bisphenol A and a carbonate group in the monomer units. Examples of such polymers are sold as Lexan® by SABIC or Makrolon® by Bayer MaterialScience. Alternatively, the mold may be made of a blend of polycarbonate and acrylonitrile butadiene styrene.

[0066] Molds for use in the present invention are not limited to a particular basic shape, i.e., x-axis and y-axis cross-sections when looking down the z-axis in standard axial convention. However, the basic shape of the molds is preferably such that adjacent molds abut, such that any empty space between the molds is minimized. For example, in a preferred embodiment, the molds each have a generally rectangular or generally square base.

[0067] The size of the mold is not particularly limited and depends on the confectionery product to be produced, the scale of the process and the robotic module used in the process. However, in a preferred embodiment of the present invention, the mold has a length in the x direction of 200 mm to 1500 mm, 400 mm to 1200 mm, or 600 mm to 1000 mm. In a preferred embodiment, the mold has a width in the y direction of 50 mm to 500 mm, 150 mm to 450 mm, or 200 mm to 400 mm. In a preferred embodiment, the mold has a height in the z direction of 5 to 100 mm, 10 mm to 75 mm, or 20 mm to 50 mm. Any of the above dimensions for x, y and z may be combined as long as structural integrity is maintained. For example, in one embodiment of the present invention, the x, y and z dimensions of the mold are 600 mm to 1000 mm, 200 mm to 400 mm, and 20 to 50 mm.

[0068] In a preferred embodiment of the invention, the mold has useful dimensions for the cavities (i.e., the portion of the mold in which the cavities may reside) within the following preferred dimensional ranges. In a preferred embodiment of the invention, the mold has a useful length in the x direction of 180 mm to 1400 mm, 350 mm to 1100 mm, or 700 mm to 950 mm. In a preferred embodiment, the mold has a useful width in the y direction of 40 mm to 450 mm, 80 mm to 400 mm, or 150 mm to 360 mm. In a preferred embodiment, the mold has a useful height in the z direction of 4 to 80 mm, 8 mm to 65 mm, or 20 mm to 45 mm. Any of the above dimensions for x, y, and z may be combined as long as structural integrity is maintained. For example, in one embodiment of the invention, the x, y, and z dimensions in which the mold cavities may reside are 550 mm to 1100 mm, 180 mm to 400 mm, and 20 to 45 mm.

[0069] In one embodiment of the present invention, all of the molds used may have approximately the same size (i.e., taking into account minor manufacturing variations). However, it is not necessary that the molds are all the same size. Different sizes of molds can be used as long as the molds can be reliably stacked. In one embodiment of the present invention, if more than one mold stack is required for any process step, molds of different sizes and shapes can be used for each stack. In a preferred embodiment, the present invention utilizes molds of the same size and shape for the production of a particular product batch to ensure ease of mold handling and mold stacking.

[0070] In a preferred embodiment of the present invention, the top surface of the mold includes at least one mold cavity that is used to form the desired confectionery. The at least one mold cavity is formed in the wall of the mold. In a preferred embodiment, where the mold has a generally square or rectangular base, the at least one mold cavity is formed by a pair of opposing side walls extending from the base. In a preferred embodiment, a dividing wall or divider may further be provided between the pair of opposing side walls to form multiple mold cavities.

[0071] The shape, size and number of mold cavities present in the mold are not particularly limited and will depend on the confectionery being produced and the size of the mold used. In preferred embodiments, each mold may contain 1-400 cavities, 1-250 cavities, 10-200 cavities, 25-180 cavities, 50-150 cavities.

[0072] In a preferred embodiment, the x, y, and z dimensions of each cavity may be from 10 mm, 10 mm, and 10 mm to 300 mm, 200 mm, and 50 mm, respectively.

[0073] Thanks to the reduction of mechanical stress on the mold by the method of the present invention, it is possible to minimize the "dead space" in the mold, that is, the part of the mold that does not contain cavities, which is present, for example, to ensure a great structural stability of the mold and to protect it from damage caused by violent movements on the sides of conventional production lines, especially conventional molds. Thus, for example, the cavities cover more than 75%, more than 80%, or more than 90% and / or less than 95% of the upper surface of the mold.

[0074] In a preferred embodiment, molds for use in the present invention include features that allow the grippers of the effectors of the robotic modules to interlock with the molds for reliable transfer of the molds between process modules and during stacking and unloading of the molds.

[0075] In a preferred embodiment of the present invention, these features of the mold may be a plurality of extending or retracting features that are present in the effector of the robotic module and are aligned with corresponding retracting or extending features. These features are preferably on at least one pair of opposing side walls of the mold, e.g., the front and rear of the mold, and / or the sides of the mold, and on the respective corresponding grippers of the effector. The shape of the corresponding extending and retracting features is not particularly limited and may be, for example, cubic, cylindrical, pyramidal, hemispherical, conical, or truncated conical, etc. In a preferred embodiment, when the feature is a retracting feature, the retracting feature is open on both ends, or the retracting feature is open only on the end where the interaction with the effector takes place.

[0076] In a preferred embodiment, the molds include recessed features and the gripping portion of the effector includes corresponding protruding features so that alignment with adjacent molds is not compromised.

[0077] In a preferred embodiment, the number of extension or retraction features on each opposing side wall of the mold and on the corresponding gripping arm of the effector is 1 or more, e.g., 2, 3, 4, or 5. In a preferred embodiment, the number of extension or retraction features is less than 10. The number of extension or retraction features on the side walls of the mold and on the corresponding gripping arm of the effector are the same to allow for accurate and secure mating.

[0078] The exact location and size of the features that enable the fit between the gripping portion of the effector and the mold are not particularly limited - these features simply need to have the necessary properties to enable secure gripping of the mold.

[0079] In a preferred embodiment of the invention, the molds include features that together allow for a flow of fluid, preferably gas, through the molds and / or between two stacked molds sufficient to aid in cooling of the confectionery. In a preferred embodiment, when two molds are stacked one on top of the other, a gap is formed between a portion of the lower mold and a portion of the upper mold. In alternative preferred embodiments, these features are openings formed in the individual molds and / or openings formed between two adjacent stacked molds. In an embodiment of the invention, these openings extend through the molds in the x-axis or y-axis direction. The openings do not interact with the mold cavity in a manner that compromises the structural integrity of the mold cavity. In a preferred embodiment, these openings extend through the entire length of the mold in the x-axis or y-axis direction. In a preferred embodiment, the openings are configured along the longest dimension of the mold, i.e., the x-axis, and across the entire length of the y-axis of the mold.

[0080] In a preferred embodiment of the present invention, each opening is 250 mm 2 ~3000mm 2 , optionally 400mm 2 ~2500mm 2 , optionally 500mm 2 ~2000mm 2 , optionally 500mm 2 ~1500mm 2 , optionally 750mm 2 ~1250mm 2 , optionally 900mm 2 ~1100mm 2 It has a cross section of.

[0081] In a preferred embodiment, the mold has 1 to 25 openings, preferably 2 to 20 openings, optionally 5 to 15 openings, optionally 7 to 12 openings.

[0082] In a preferred embodiment, the total cross-sectional area of ​​the openings is 500 mm 2 ~60000mm 2 , optionally 2000mm 2~30000mm 2 , optionally 8000mm 2 ~20000mm 2 For example, in a preferred embodiment based on a standard size of confectionery product, the opening is 2000 mm 2 ~10000mm 2 , preferably 3000 mm 2 ~9000mm 2 may have a total cross section of

[0083] Increasing the size of the openings can improve the uniformity of the air flow through the mold.

[0084] The shape of the openings is not particularly limited, but in embodiments of the present invention the openings may be square, rectangular, triangular, circular, hexagonal, trapezoidal, any regular polygon, truncated versions of any of the shapes listed above, etc. The openings do not need to be the same size or shape in each mold or in all molds used. In preferred embodiments, the openings are shaped to ensure consistent cooling throughout the mold, for example, by using openings of approximately the same volume and cross-section.

[0085] In a preferred embodiment, the openings for permitting the flow of fluid, preferably gas, through the mold are on a different pair of side walls than the features that interact with the grippers of the effector. In a preferred embodiment, the side of the mold having the features that interact with the grippers does not have openings for permitting the flow of fluid, preferably gas (e.g., escape of gas), i.e., the flow of gas through the mold is generally unidirectional.

[0086] In an alternative embodiment, the only openings in the mold are those that allow the fluid, preferably gas, to flow predominantly in one direction.

[0087] In a preferred embodiment, the openings to allow for the flow of fluid, preferably gas, through the mold are on a pair of side walls of the mold along the x-axis, and the features that interact with the grippers are on a pair of side walls of the mold along the y-axis. In a preferred embodiment of this aspect, there are no openings in the mold that allow for air flow other than those on the y-axis, i.e., the flow of gas is generally along the y-axis through the mold.

[0088] In an alternative preferred embodiment, the gripping portion is on the same side wall as the opening.

[0089] In a preferred embodiment, the mold has protrusions extending from one or both of the upper and lower surfaces of the base, preferably in the z-direction, to form openings between the stacked molds. In one embodiment of the present invention, these features protrude from 5 mm to 50 mm, for example 10 mm to 30 mm, or 15 mm to 25 mm. The protrusions extend from at least a portion of the mold base to allow sufficient gas flow between the secure stack and the molds, for example, the protrusions are more than 5% and less than 90% of the base, more than 10% and less than 75% of the base, or more than 20% and less than 50% of the base, or less than 25% and more than 5% of the base. The size and shape of the protrusions are not particularly limited, so long as they adequately secure the stacking of the molds. Alternatively, magnets can be used to align the array of molds on the mold base by appropriately placing corresponding magnets.

[0090] In one embodiment, the protrusions along two opposing edges of the mold along the y-axis of the mold protrude further along the z-axis, i.e., protrude further from the base of the mold, than the protrusions not along the edges (i.e., the outer protrusions protrude further than the inner protrusions). See, e.g., FIG. 5.

[0091] However, in one embodiment, at least one dimension of the protrusion is minimized to ensure uniform gas flow through the mold. In one embodiment, the width of the protrusion along the x-axis is minimized to ensure uniform gas flow. In one embodiment, the protrusion has a width along the x-axis of 1.5 mm to 15.0 mm, preferably 2.0 mm to 12.5 mm, preferably 2.5 mm to 5.0 mm. In one embodiment, the protrusion has the same width along the y-axis. In an alternative embodiment, the protrusion varies in width along the y-axis.

[0092] In one embodiment, the protrusions extend along the direction of the mold (i.e., the y-axis) to form channels for the openings and allow gas flow through the mold. In one embodiment, the openings, preferably 2-20 openings, are defined by rows of protrusions along the y-axis. In one embodiment, n is the number of openings, and there are n+1 rows of protrusions extending along the y-axis of the mold. For example, if there are 5 openings, there are 6 rows of protrusions along the y-axis forming the openings.

[0093] In a preferred embodiment, when at least two mold stacks are positioned adjacent to one another, the features that allow gas flow are positioned to allow gas to flow through adjacent mold stacks, in a preferred embodiment, adjacent mold stacks are in direct contact to help form a seal such that the efficiency of gas flow between adjacent stacks is maximized.

[0094] cooling process In one aspect, the present invention provides a modular cooling step in a confectionery manufacturing process.

[0095] In one aspect, the present invention provides a cooling step that is carried out at a higher temperature than conventional confectionery cooling processes, for example, cooling is carried out at a higher temperature than that found in a conventional cooling tunnel.

[0096] In one aspect, the present invention provides a cooling step that is performed external to the rest of the manufacturing process. In a preferred embodiment, the term "external" relates to a cooling step that is mechanically and / or spatially independent from the rest of the manufacturing process, i.e. it is a cooling step outside the process line.

[0097] Alternatively, the present invention preferably provides an in-line cooling step. By in-line, preferably, the cooling module is combined, e.g., physically attached, e.g., is an integral part of a process line, with at least one other process module, preferably at least two other process modules. In a preferred embodiment, at least one mold stack is cooled in-line using the cooling process of the present invention.

[0098] In one aspect, the invention provides for the cooling step to be carried out whilst the confectionery is stationary, preferably the confectionery is contained in at least one mould which is stationary, therefore in one embodiment of the invention no cooling tunnel is required which relies on a moving conveyor to ensure the production process is continuous.

[0099] In one aspect, the invention provides a cooling step in which stacking of molds is performed simultaneously with the cooling process of the invention, preferably while the molds are stacked, they are cooled according to the cooling parameters and cooling devices described herein, in a preferred embodiment, stacking is performed by a robotic module as described below.

[0100] In a preferred embodiment of the present invention, the cooling step in the confectionery manufacturing process comprises at least two features selected from: 1. a modular cooling step; 2. a cooling step carried out at a higher temperature than conventional confectionery cooling processes; 3. a cooling step carried out external to the remaining steps of the manufacturing process; and 4. a cooling step carried out while the confectionery is stationary.

[0101] In preferred embodiments of the invention, at least features 1 and 2 are present; at least features 1 and 3 are present; at least features 1 and 4 are present; at least features 1, 2, and 3 are present; at least features 1, 2, and 4 are present; or at least features 1, 2, 3, and 4 are present.

[0102] In a preferred embodiment, the cooling step is carried out at a higher temperature than conventional confectionery cooling processes, preferably at a temperature above 6.0°C, above 8.0°C, above 10.0°C, above 11.5°C, 12.0°C or more, 14.0°C or more, or 15.0°C or more.

[0103] In a preferred embodiment, cooling is carried out at a temperature above 16.0°C, optionally above 16.5°C, above 17.0°C, above 18.0°C, above 18.5°C, or above 19.0°C.

[0104] In a preferred embodiment of the invention, cooling is carried out at a temperature below 25.0°C, optionally below 24.5°C, below 24.0°C, below 23.5°C, below 22.5°C, or below 22.0°C.

[0105] In a preferred embodiment, the cooling is carried out at a temperature between 10.0°C and 25.0°C. In a preferred embodiment, the cooling is carried out at a temperature between 12.0°C and 25.0°C. In a preferred embodiment, the cooling process is carried out at a temperature between 16.0°C and 25.0°C. This temperature relates to the temperature of the gas used in the cooling process, preferably air. In one embodiment, this temperature relates to the gas surrounding the mould and the confectionery in the mould, e.g. the gas in contact with the confectionery in the mould, i.e. used in the cooling process, e.g. the gas that the cooling device blows or sucks through / on / around the mould, if a cooling device is used. In one embodiment, this temperature may be the ambient temperature, or, if the cooling step is carried out in a container, the temperature of the gas in the container. In a preferred embodiment, the temperature is measured from the gas that the cooling device blows or sucks through / on / around the mould, preferably before the gas comes into contact with the mould.

[0106] In a preferred embodiment, the temperature of any process step after the cooling step is controlled to be in the range of less than 25.0°C, preferably between 10.0°C and 25.0°C, preferably between 12.0°C and 22.0°C, preferably between 14.0°C and 21.0°C, preferably between 16.0°C and 20.0°C, or preferably between 18.0°C and 20.0°C.

[0107] In a preferred embodiment, the humidity during the cooling process is between 30% and 70%, more preferably between 40% and 60%, or between 50% and 55%. In one embodiment, this humidity relates to the gases mentioned above, such as the ambient air or the air in the container used in the cooling process. In a preferred embodiment, the humidity is controlled within the above ranges during other process steps, such as demolding.

[0108] In preferred embodiments, the cooling is carried out over a period of more than 15 minutes, more than 20 minutes, more than 30 minutes, more than 40 minutes, more than 50 minutes, more than 60 minutes, or more than 70 minutes. In preferred embodiments of the invention, the cooling is carried out over a period of less than 240 minutes, optionally less than 180 minutes, less than 120 minutes, less than 110 minutes, less than 100 minutes, less than 90 minutes, or less than 75 minutes. In preferred embodiments, the cooling process is carried out over a period of 15 minutes to 240 minutes or 20 minutes to 240 minutes. Preferably, the cooling period is 15 minutes to 120 minutes, 15 minutes to 90 minutes, 20 minutes to 75 minutes, 20 minutes to 60 minutes, or 20 minutes to 45 minutes.

[0109] In one embodiment, where the product being produced is a complex product, e.g., where it comprises multiple chocolate product components, where it comprises a chocolate product shell and a filling, where it comprises a chocolate product shell and a baked component, etc., the individual components may be cooled using the process of the present invention, or the entire composition may be cooled using the process of the present invention. When the components are cooled individually, each cooling step may be for a shorter period than those mentioned above. For example, the cooling period for cooling each component, e.g., for cooling the chocolate product shell, may be from 1 minute to 15 minutes, from 2 minutes to 10 minutes, or from 3 minutes to 7 minutes.

[0110] In one embodiment, the cooling period may increase as the cooling temperature increases.

[0111] In a preferred embodiment, the cooling step is carried out within a temperature range of 10.0° C. to 22.5° C. for a period of 20 minutes to 240 minutes, preferably within a temperature range of 12.0° C. to 20.0° C. for a period of 30 minutes to 60 minutes.

[0112] In a preferred embodiment, the cooling step is carried out within a temperature range of 16.0° C. to 25.0° C. for a period of 20 minutes to 240 minutes, preferably within a temperature range of 19.0° C. to 22.0° C. for a period of 30 minutes to 240 minutes.

[0113] Preferred combinations of cooling temperature and cooling period are above 12.0°C and above 15 minutes, below 21.5°C and below 80 minutes, above 14.0°C and above 15 minutes, below 20.5°C and below 60 minutes, above 14.5°C and above 20 minutes, above 20.0°C and below 60 minutes, above 15.0°C and above 20 minutes, and below 19.5°C and below 50 minutes.

[0114] The selection of cooling parameters may be made depending on the confectionery product being cooled. The present invention provides the flexibility that the same equipment can be used to cool different confectionery products in rapid succession, i.e., because the present invention preferably uses ambient air and modular cooling equipment, moulds containing different products can be quickly changed out without requiring lengthy moulding line changes and / or cooling tunnel changes.

[0115] In a preferred embodiment, the cooling temperature is set to a constant temperature within experimental variation (i.e. ±0.5°C or ±0.2°C) during the cooling step. In an alternative preferred embodiment, the cooling temperature is not set to a constant temperature within experimental variation (i.e. ±0.5°C or ±0.2°C) during the cooling step. In a preferred embodiment, the cooling step may include at least two periods with different cooling temperatures. In an embodiment, this means that the cooling step may include an increase or decrease in temperature gradient, which may be continuous or discrete. For example, the cooling step may include a first cooling period with a relatively low temperature and a second cooling period with a relatively high temperature, or vice versa, both temperatures falling within the above ranges and the sum of the first and second periods falling within the above ranges. For example, the cooling step may include an initial temperature, which is then lowered or raised to a final temperature over the entire cooling period, with the initial temperature and the final temperature falling within the above ranges and the total period falling within the above period. For example, the cooling step may comprise at least one separate constant cooling step in combination with at least one variable cooling step, as defined above.

[0116] In a preferred embodiment, there are at least 2-5 periods, preferably 2-3 periods, for the cooling process. These periods provide separate cooling zones. In a preferred embodiment, the temperature is lowered over these periods / zones and then increased to reduce the risk of condensation. For example, in a three zone cooling process, the temperature is higher at the beginning, lower in the middle, and increased at the end to reduce the risk of condensation.

[0117] In the present invention, the fluid leaving the mould after cooling is at a higher temperature than the fluid entering the mould. This temperature difference depends on many factors, such as the temperature of the confectionery, the temperature of the fluid entering the mould, the flow rate of the fluid used for cooling, the amount and type of confectionery, the volume of the fluid used for cooling, etc. However, in one embodiment of the present invention, the temperature of the fluid stimulating the mould is 2°C to 12°C, or 4°C to 12°C, optionally 6°C to 10°C higher than the temperature of the fluid entering the mould. During the cooling step, the temperature difference between the air entering the mould and the air leaving the mould is reduced. In one embodiment, the above temperature difference relates to the temperature difference at the start and / or end of the cooling step.

[0118] In a preferred embodiment, cooling of the mold is performed using a cooling device (cooling module), such as a fan or ventilator, which can push gas through an opening in the mold or draw gas through the opening. In one embodiment of the invention, the cooling device may comprise a fan having a blade diameter of 250 mm to 1000 mm, for example 500 mm. For example, the cooling device may be a Vent Axia model BSP50014, 500 mm fan.

[0119] In a preferred embodiment, the cooling device is equipped with features that allow for its movement and the desired alignment with the mold, for example the cooling device may be on wheels or on guide rails so that it can be moved until it is in the desired alignment with the mold.

[0120] In a preferred embodiment, the cooling device is equipped with features that allow for vertical movement to raise and lower the cooling device to ensure alignment with the molds at various heights. The nature of the lifting device is not particularly limited and may be, for example, mechanical, hydraulic, manual, etc.

[0121] In a preferred embodiment, the cooling device is equipped with features that allow for the formation of a suitable seal between the device and the mold so that flow is not lost to the surrounding area.

[0122] In a preferred embodiment, the gas used in the cooling step is air, however, alternatively, the gas used may be an inert gas, such as nitrogen.

[0123] In a preferred embodiment of the invention, a single cooling device may cool two or more mold stacks. In one embodiment of the invention, each cooling device can be used to cool two or more mold stacks, for example up to five mold stacks.

[0124] In a preferred embodiment, the fan or ventilator is set so that the gas flow through the mold closest to the fan or ventilator is between 4.0 m / s and 20.0 m / s, preferably between 5.0 m / s and 15 m / s, optionally between 5.5 m / s and 12.5 m / s, optionally between 6.0 m / s and 10 m / s, optionally between 6.5 m / s and 8.5 m / s.

[0125] In a preferred embodiment, the flow of gas provided by the cooling device, preferably a fan or ventilator, is preferably less than 1.0 m when measured adjacent to the device, i.e., not through the mold. 3 / s~10.0m 3 / s, optionally 1.5m 3 / s~7.5m 3 / s, optionally 2.0m 3 / s~5.0m 3 / s, optionally 2.0m 3 / s~4.0m 3 / s.

[0126] In a preferred embodiment, the total flow rate of gas through each individual mold (i.e., through all openings) provided by the cooling device is less than 0.004 m 3 / s~0.2m 3 / s, preferably 0.008 m 3 / s~0.14m 3 / s, optionally 0.01m 3 / s~0.12m 3 / s, optionally 0.02m 3 / s~0.09m 3 / s, optionally 0.03m 3 / s~0.07m 3 / s and optionally 0.035m 3 / s~0.065m 3 / s.

[0127] Increasing the gas velocity through the mold increases the heat transfer coefficient, preferably leading to faster cooling.

[0128] Thus, preferred embodiments of the invention include the following combination of features: The gas flow through all the molds to be cooled is 2.0 m / s to 20.0 m / s, preferably 5.0 m / s to 10.0 m / s, or 6.0 m / s to 10.0 m / s. The temperature of the gas is between 10.0℃ and 25.0℃, preferably between 12.0℃ and 225.0℃, before being used as a coolant. The cooling step is preferably carried out for a period of between 15 minutes and 240 minutes. The mold is 2000mm 2 ~30000mm 2 , preferably 2000 mm 2 ~10000mm 2 , preferably 3000 mm 2 ~9000mm 2 The gas flow opening has a total cross-sectional area of

[0129] In a preferred embodiment, the cooling temperature is controlled by the gas flow through the mold. Thus, as described above with respect to the cooling temperature, in one embodiment of the present invention, the gas flow may be constant throughout the cooling process, or the gas flow may be changed throughout the cooling process. In a preferred embodiment, the cooling process may include at least two periods with different gas flows. In one embodiment, this means that the cooling process may include an increase or decrease in the gradient of the gas flow, which may be continuous or discrete. For example, the cooling process may include a first cooling period with a relatively low gas flow and a second cooling period with a relatively high gas flow, or vice versa, both gas flows falling within the above ranges, and the sum of the first and second periods falling within the above ranges. For example, the cooling process may include an initial gas flow, which is then lowered or increased to a final gas flow over the entire cooling period, with the initial and final gas flows falling within the above ranges, and the total period falling within the above period. For example, the cooling step may comprise at least one separate constant cooling step in combination with at least one variable cooling step, as defined above.

[0130] In a preferred embodiment, the gas flow is measured using an airflow meter, such as an Alnor TA5 hot wire airflow meter, In one embodiment, the airflow meter is positioned on the mold such that the gas flow through the opening is measured on the side of the mold furthest from the cooling device.

[0131] In one embodiment of the invention, the gas flow through the subsequent mold falls within the ranges described above for the mold closest to the cooling device. In a preferred embodiment, at least two stacks, preferably 2-4 stacks, are cooled together and the gas flow through all stacks falls within the ranges described above. Note that the gas flow will probably always be greatest in the mold closest to the cooling device, and the gas flow does not increase in stacks furthest from the cooling device.

[0132] Alternatively, in an embodiment of the invention, the gas flow through a first mold adjacent to the mold closest to the cooling device is lower than the gas flow through the mold closest to the cooling device.

[0133] However, most preferably the gas flow rate is as constant as possible through each mould stack, for example all mould stacks have a flow rate of 2.0 to 20.0 m / s, preferably 5.0 m / s to 10.0 m / s, or 6.0 m / s to 10.0 m / s.

[0134] In a preferred embodiment of the invention, the passing gas through the first adjacent mold (e.g., mold B in FIG. 13) is between 3.0 m / s and 18.0 m / s, optionally between 4.0 m / s and 12 m / s, optionally between 5.0 m / s and 8 m / s.

[0135] In an embodiment of the invention, the gas flow to the first adjacent mold through the next adjacent mold (e.g., mold C in FIG. 13) is lower than the gas flow through the first adjacent mold. In a preferred embodiment of the invention, the passing gas through the first adjacent mold is between 2.0 m / s and 15.0 m / s, optionally between 3.0 m / s and 10 m / s, optionally between 4.0 m / s and 7.0 m / s.

[0136] In one embodiment of the invention, the flow of gas through the mold stack can be controlled by at least one of: changing the direction of gas flow during the cooling step (i.e., from suction to blowing or vice versa); using cooling devices on both sides of the mold, preferably alternating the devices used (e.g., one device adjacent to stack C and one device adjacent to stack A, and these devices are used in alternation); and / or changing the orientation of the mold during the cooling step, preferably using a robotic module to rotate the mold 180 degrees at least once during the cooling step.

[0137] In a preferred embodiment, the gas flow may alternate during the cooling step, optionally every 2 to 25 minutes, optionally every 2.5 to 15 minutes, and optionally every 3.0 to 10.0 minutes. The change in direction of the gas flow preferably provides a more uniform cooling profile throughout the mold, i.e., offsetting the effects of placing the mold at various distances from the cooling device.

[0138] In a preferred embodiment, the passive cooling at high temperatures is controlled so as not to damage the product. With regard to the definition of the term passive cooling, this cooling is performed before the cooling step (i.e. the active cooling step described above), for example during the filling process while other mold cavities are being filled, during stacking of molds, during transportation of molds after filling, etc. In a preferred embodiment, the duration of any passive cooling is less than 1 hour, more preferably less than 45 minutes, more preferably less than 30 minutes, most preferably less than 20 minutes.

[0139] In one embodiment of the invention, the time period from filling the mold with the raw material to the cooling step of the process is greater than 1 minute, greater than 5 minutes, for example 8-15 minutes.

[0140] The term high temperature with respect to passive cooling is greater than 20.5° C., greater than 22.5° C., greater than 25° C., for example, between 27° C. and 35° C. Active cooling is performed at lower temperatures than passive cooling.

[0141] In a preferred embodiment, the molds used in the present invention may be stacked together, i.e., arranged vertically. The height of the stack used depends on the process conditions used and the desired throughput of the production line. In a preferred embodiment, the molds may be stacked in 2 or more mold stacks, 5 or more mold stacks, 10 or more mold stacks, or 20 or more mold stacks. In a preferred embodiment, the molds are stacked in 60 or less mold stacks, 50 or less mold stacks, or 40 or less mold stacks.

[0142] In one embodiment of the invention, at least two mold stacks can be positioned laterally of each other, i.e., face to face, back to back, oriented in one direction, or side by side, during the cooling process. In one embodiment of the invention, the stacks are positioned as close as possible to each other, possibly in direct contact.

[0143] In a preferred embodiment, the gap between the mold stacks is 1 cm or less, preferably less than 0.75 cm, more preferably less than 0.5 cm, more preferably less than 0.25 cm, most preferably less than 0.1 cm. In a preferred embodiment, the mold stacks are in direct contact or the gap between the stacks is more than 0.05 cm. When a cooling device is used, it is beneficial to reduce the gap between the stacks to minimize the slowdown of the gas flow between the stacks. The same parameters apply to the distance between the cooling device and the stack closest to the cooling device, i.e., it is beneficial to place the cooling device as close as possible to the mold stack to ensure efficient cooling. However, this distance can be controlled to prevent material from transferring between the molds when soiled.

[0144] In a preferred embodiment, the at least one mold stack is placed on a suitable substrate that can transport the at least one mold stack to a suitable location for cooling. In one embodiment, the substrate can be a pallet of suitable size. In an alternative embodiment, cooling is performed in the absence of a substrate.

[0145] In one embodiment of the invention, the substrate is of a suitable size such that 2-10 mold stacks can be mounted, optionally 2-6 mold stacks, and optionally 3 or 4 mold stacks can be mounted.

[0146] In one embodiment of the invention, the substrate includes protrusions extending vertically and horizontally from the top surface of the pallet, the protrusions being positioned to ensure accurate alignment of the molds when placed on the pallet, the protrusions being positioned to correspond to the size of the molds with which they will be used.

[0147] In one embodiment of the present invention, the substrate carrying at least one mold stack may be transported using a vehicle suitable for the task depending on the size and weight of the mold stack and substrate being used. For example, in one embodiment, a forklift truck operated by a human operator or an unmanned autonomous forklift truck (automated guided vehicle) may be used.

[0148] In one embodiment of the present invention, the cooling process occurs at ambient temperature (i.e. the confectionery is exposed to ambient conditions, e.g. ambient air temperature and humidity).

[0149] In an alternative embodiment, the cooling process can take place within a container, which is preferably sealed after insertion of the mold, to create an environment that is substantially sealed from the surrounding environment.

[0150] In one embodiment of the invention, the container is sized to accommodate at least one mold stack, preferably at least two mold stacks, preferably at least three mold stacks, hi one embodiment, the container holds less than 10 mold stacks, preferably 5 or less mold stacks.

[0151] In one embodiment, the container comprises a heat exchanger suitable for cooling the ambient air around at least one mold stack. The nature of the heat exchanger is not particularly limited, it is important that it is capable of lowering the temperature of the ambient air to within the temperature ranges mentioned above for the cooling process. In one embodiment, the heat exchanger comprises a double tube heat exchanger, a shell and tube heat exchanger, a plate heat exchanger, a plate and shell heat exchanger, a plate and fin heat exchanger, a fluid heat exchanger, or a direct contact heat exchanger, or a combination of the above.

[0152] In one embodiment, the container is equipped with a cooling device as described above. In one embodiment, the container is connected to or contains a fan that can blow or suck air at least one of through the cabinet and on / through / between / around / etc. the molds present in the container.

[0153] In one embodiment, the cooling device draws air into the container, over the heat exchanger, and over / through / between / around / etc. at least one mold stack.

[0154] In one embodiment, the container comprises channels that allow recirculation of air from around the mold to the heat exchanger. In one embodiment, the container comprises openings that allow air flow between the environment and the cooling device through the container. In one embodiment, these openings may be openable and closable. In one embodiment, the container comprises both reopenable openings and recirculation channels.

[0155] During alignment of the mold, there may be issues leading to alignment errors, such as, for example, errors in the substrate position, errors in the substrate structure, and / or stacking tolerances of the mold itself. Therefore, in one embodiment of the present invention, for every lifting cycle, the robotic module uses sensors to detect the position of the mold to ensure accurate picking. In a preferred embodiment, at least two laser sensors can be used to detect the edges and surface angles of the mold. Alternatively, known 3D vision systems may be used.

[0156] Robot Module In the present invention, at least one robotic module is used to perform at least one process step in the confectionery production process. To enable each robotic module to perform a process step, the robot comprises a robotic arm and at its end an effector designed to interact with the environment. In one embodiment, for different process steps, two or more types of effectors are defined depending on the specific requirements of the process.

[0157] In the present invention, one example of an effector is an effector that allows for holding at least one mold in a manner sufficient to allow a robotic module to properly align the mold during the process.

[0158] In a preferred embodiment of the invention, the robotic module can hold 1 to 5 molds simultaneously, e.g., 1, 2, 3, 4, or 5 molds. In embodiments where more than one mold is held by the robotic module, depending on the process step, the robotic module places all of the molds into the process module and then separates the stacked molds into single layers for processing.

[0159] In a preferred embodiment, the effector includes a gripper. The gripper may be of any of the standard categories known in the art, i.e., impactive (jaws or claws), invasive (pins, needles, or hackles), astrictive (vacuum, magnetic adhesion, or electrical adhesion), or contiguitive. In a preferred embodiment, the gripper is impactive and preferably includes two, three, or five fingers.

[0160] In a preferred embodiment, one robot would be used for each distinct step of the process, as described above in the preferred embodiments of the present invention.

[0161] However, for lower throughput lines, one robot can be used to perform two or more processing steps.

[0162] In a preferred embodiment, the robot module, optionally together with its control box, is mounted on a movable stand unit. The robot stand preferably has locking wheels that allow the robot to be moved to any position when building a line. In a preferred embodiment, the robot module has a feature that allows it to be docked and locked to its associated process module.

[0163] In a preferred embodiment, each robot module will have a standard electrical and mechanical interface with any of the process modules so that the robot module can be used anywhere on the line.

[0164] In the preferred embodiment, there is a standard robot program that resides on all robots on the line. The program has several subprograms that handle each process step, and depending on which process module the robot is connected to, the relevant subroutine is called.

[0165] In a preferred embodiment, the robot module includes a sensor capable of detecting the presence of the process module. In a preferred embodiment, the process module includes a tag that can be read by a scanner, and preferably the tag is used to determine which step the robot module will perform when docked with that process module. With regard to the nature of the scanner and tag system, any system that allows for the transfer of information from the process module to the robot module can be used. In a preferred embodiment, the process module includes a radio frequency identification (RFID) scanner that reads the RFID tag on the mold. Alternatively, the process module includes the sensor and the robot module includes the tag.

[0166] In a preferred embodiment, at least one robot module used is a collaborative robot (i.e. a robot intended to physically interact with humans in a shared workspace, or alternatively referred to as a force-limited robot). Collaborative robots have a simple setup and use, and a relatively large working envelope. The fact that the robot modules work together is also useful for reducing the need for fixed, interlocked guarding devices on the line. In a preferred embodiment, the robot module is based on the Universal Robots UR10 Collaborative Robot. Alternative preferred robots may be the Universal Robots UR3 and UR5, Rethink Robots Baxter and Sawyer, Kuka LBRiiwa, ABB Yumi or Fanuc CR-35iA. A definition of a collaborative robot may be given in ISO10218 Parts 1 and 2.

[0167] Alternatively, in one embodiment, the robot may be an industrial robot. The industrial robot may increase the throughput of the manufacturing process. Examples of industrial robots include vertical articulated industrial robots, such as a FANUC R-2000iB / 165F, a Staubli-TX2-90, or a Kuka Agilus Sixx, optionally configured for pick-and-place activities.

[0168] In a preferred embodiment, each robot module includes features that allow upstream and downstream interface signals to manage the transfer of payloads between modules. In a preferred embodiment, each process module includes a receiving feature (preferably an infeed shelf) where the mold is placed by the upstream robot, and the current robot module picks the mold from this feature and sends it to the process module where the required process steps are performed and then the mold is placed on the receiving feature (preferably an infeed shelf) of the downstream module.

[0169] In a preferred embodiment, each module includes a feature that allows for the assessment of the presence of a mold on the receiving feature. In a preferred embodiment, the process includes the following steps: The current module signals the upstream robot that the receiving feature is empty and the current module robot is clear. The upstream robot module then places a mold on the receiving feature of the current module. Once the upstream module has placed the mold on the receiving feature of the current module, the upstream robot clears the way to avoid colliding with the robot of the current module and signals the current module accordingly. The robot of the current module picks the mold from the receiving feature and sends it to a processing module for processing.

[0170] In a preferred embodiment, each robot module has a basic signal interface with a process module, and when the robot has picked up a mold from the receiving feature and the mold is ready to be processed, the robot module sends a signal to the process module to start processing, and when the process module has completed processing the mold, a process complete signal is sent back to the robot.

[0171] In a preferred embodiment, the robot module can directly control devices on the process module. In a preferred embodiment, a Modbus or similar I / O (input / output) bus connection from the robot module to the process module allows the robot module to directly control devices on the process module, allowing process operation without the need for a PLC.

[0172] General Process Module In a preferred embodiment of the present invention, a core process module template defines the basic outline of each process module and its interface with the rest of the manufacturing line. The specific configuration of a process module depends on its functionality.

[0173] In one embodiment of the invention, the core process module comprises a frame with locking wheels that allow the module to move and also fix its position. In a preferred embodiment, the core process module has a receiving feature, preferably an infeed shelf, to receive molds ready for processing from either the left or right, depending on the line handling.

[0174] In a preferred embodiment, the process module includes a sensor capable of detecting the presence of a mold. In a preferred embodiment, the mold includes a tag that can be read by the sensor. Preferably, the tag is used to determine which step the process module will perform on a particular mold. With regard to the nature of the scanner and tag system, any system that allows for the transfer of information from the mold to the process module can be used. In a preferred embodiment, the process module incorporates a radio frequency identification (RFID) scanner to read the RFID tag on the mold.

[0175] In a preferred embodiment, the core process module includes a vertical frame member on which the necessary functional equipment for the associated processing step can be mounted, and may also include a control panel, preferably mounted on the lower half of the vertical pillar, which is preferably a programmable logic controller (PLC).

[0176] In a preferred embodiment, the robot module may be docked to a process module, hi a preferred embodiment, the process module may be docked to an adjacent process module in line.

[0177] In a preferred embodiment, the width of the core process modules is standardized according to the working envelope of the robot modules. For example, a module pitch of 1200mm to 2000mm, preferably 1300mm to 1700mm, for example 1500mm may be adopted. The above dimensions result in a working space between vertical members of 1100mm, which is sufficient space for an 800mm wide mould and robot gripper.

[0178] In a preferred embodiment, the electrical interfaces between the modules are as defined above for the robotic module.

[0179] Although more detailed specifications for specific process modules are provided below, in preferred embodiments of the present invention, the specific process modules are based on the core process modules described above that have been modified to perform appropriate processes.

[0180] Mold Adjustment Module The function of this module is to preheat the mold to a suitable temperature for filling.

[0181] In a preferred embodiment, this function is accomplished by passing the mold (preferably long edge first) under an infrared heater unit.

[0182] In a preferred embodiment, the molds are placed on a conveyor section, for example by a robot capable of stacking the molds, which transports the molds under a heater, at the end of the belt where a robot in the next module in the line will pick up the mold for processing.

[0183] In the preferred embodiment the infrared heater unit is a commercially available standard design unit and is mounted 80-100mm above the surface of the mould. The heater unit will be supplied with its own control panel which should also be specified to control in order any additional functions associated with the mould conditioning module.

[0184] In a preferred embodiment of the invention the mould is preheated, preferably to a temperature of between 25° C. and 35° C., most preferably to about 30° C. In a preferred embodiment this step involves heating the mould to + / - 1° C. of the filled chocolate temperature.

[0185] Moulded stacking / unloading module In a preferred embodiment, the present invention uses modules that allow stacking and unloading of molds at desired points in the manufacturing process, such as during the cooling step of the manufacturing process, and / or during the initial and final stages of the process of the present invention (i.e., before mold conditioning and after demolding and mold cleaning).

[0186] In a preferred embodiment, this module comprises a robot capable of stacking and / or unloading molds from a substrate, e.g., a pallet, and placing the molds in a receiving feature of a process module (depalletizer), and / or removing the molds from their own receiving feature where the last process module in the line places them, and placing them on a substrate (repalletizer).

[0187] In a preferred embodiment, the module has at least two substrate positions, where a first substrate is handled by the robot module and a second substrate can be changed by an operator.

[0188] In a preferred embodiment, the same system described above for the cooling process can be used for the stacking and unloading processes.

[0189] Depositor Module In one embodiment of the present invention, the depositor module is used to deposit at least one component of the confectionery into the mold.

[0190] In one embodiment of the present invention, a standard commercially available depositor system may be used that has been modified to include the receiving features of the core process module defined above, or a standard commercially available depositor may be attached to the core process module described above.

[0191] In one embodiment of the present invention, a depositor can be used for filling with chocolate.

[0192] For example, if only an approximate chocolate filling is required for filling or lining a wet shell, a simpler depositor can be used compared to situations where a precise dose per cavity is required.

[0193] Alternatively, in one embodiment of the invention, the filling process module comprises a filling feature (e.g., a plenum chamber or depositor plate) having openings corresponding to the cavities on the mold. In embodiments where the confectionery comprises chocolate, the depositor comprises a heated hopper through which the chocolate is drawn into the filling feature. In one embodiment, a standard gear pump driven by at least one servo motor that controls the speed and dosage controls the chocolate flow rate. A typical time for filling is about 1-3 seconds depending on the amount of chocolate being dosed.

[0194] Note that unlike conventional depositors where the depositor head is moved along one or more axes to perform ribbon filling, etc., in this case the depositor is in a fixed position so that a robot can manipulate the mold to perform the same functions normally performed by a moving depositor.

[0195] In a preferred embodiment of the present invention, the depositor process module is synchronized with the corresponding robot module. Synchronization of the robot to the depositor module may be done by a start command from the robot to the depositor. Both the robot and the depositor then execute pre-planned operations to achieve the required result, which may include various speeds and tool paths and waiting points of the robot as well as various dosing movements of the depositor gear to place precise amounts of confectionery ingredients at precise locations on the mold.

[0196] In a typical chocolate making process, it is common practice to vibrate the mould after filling to allow the chocolate to settle.

[0197] In one embodiment of the invention, shaking can be performed by a separate process module. Alternatively, the filling module may perform shaking, as shaking is often performed after filling. In this case, the robotic module passes the molds under the depositor and then places them on a shaking conveyor located under the depositor. This allows the molds to be shaken, freeing up time for the robotic module to start processing the next mold. When the molds reach the end of the shaking conveyor, they are picked up by the next robotic module in the line for further processing.

[0198] Cooling Module In a preferred embodiment, the present invention provides a modular production line comprising the features defined in any of the above embodiments.

[0199] A preferred embodiment of this manufacture is a cooling module capable of performing any of the cooling process steps described above and / or including any of the features defined above with respect to the cooling process.

[0200] In a preferred embodiment, the cooling module comprises at least one robot, preferably capable of stacking the moulds in the manner defined above, and a cooling device, preferably capable of cooling the confectionery products in the moulds using any of the process steps defined above. In a preferred embodiment, the robot module may be as defined above and / or the cooling device may be defined as above.

[0201] In a preferred embodiment, the cooling modules may be connected or separate from the physically interconnected modular manufacturing lines.

[0202] Unless otherwise defined, all technical and scientific terms used herein have and should be given the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.

[0203] Unless the context clearly indicates otherwise, as used herein, plural forms of the terms herein should be construed to include the singular and, where the singular is used, the plural should also be included.

[0204] In all of the ranges defined above, the endpoints are included within the stated ranges. In addition, the endpoints of the broadest ranges and the endpoints of the narrower ranges in an embodiment may be combined.

[0205] Embodiments of the present invention are illustrated in greater detail by the following specific, non-limiting examples. EXAMPLES

[0206] Example 1 To test the effect of the cooling process of the present invention on the final chocolate product, the following test was carried out.

[0207] The chocolate selected for the following study was Dessert Noir Natural Mass by La Panilla, consisting of 42.2% cocoa paste, 11.5% cocoa butter, 46.2% sugar, 0.3% sunflower lecithin, no milk fat, and containing at least 52% cocoa. The chocolate mass showed a particle size of 21 μm as measured with a Malvern Mastersizer.

[0208] The samples were molded manually in molds preheated to 30°C. First, the 6 cavities of a 42g KitKat Chunky mold were filled with an amount of chocolate to cover the base of the mold. Then, pre-counted hazelnut portions of 13 whole nuts per cavity were filled manually from a plastic pot per cavity. During homogenization of the bar, the nuts were gently pressed into the chocolate to avoid migration of the nuts to one side of the cavity. The remaining volume of the cavity was then filled with chocolate and the bar was homogenized using a chocolate scraper. The filled mold was then placed on a vibrating table to expel air bubbles from the chocolate and to allow the nuts to rise to the surface of the bar, visible as a filling covered by the chocolate but protruding from the surface.

[0209] The percentage of bloom was measured by counting all nuts and expressing the level of bloom as a percentage of the total nuts that had bloom. Bloom was assessed visually, taking an average across the six moulds.

[0210] Four samples were cooled for 0.5, 1, 2, 4, and 72 hours. After 9 weeks of storage (ambient temperature 20°C, relative humidity 50%), all cooling periods of 0.5, 1, 2, 4, and 72 hours showed an average of 68±3% bloom. The standard deviation between samples was less than 5%, so the differences between bloom incidence rates cannot be considered significant.

[0211] The effect of cooling temperature on the bloom incidence of the samples was then tested. Since previous studies on cooling duration showed no significant effect on bloom behavior, samples were cooled at 10° C., 17° C., and 20° C. for 1, 2, and 3 hours, respectively. Figure 12 shows the results of this study.

[0212] The cooling process of the present invention has been shown to reduce bloom over conventional cooling parameters.

[0213] Example 2 Milk chocolate was tempered in a Sollich Minitemper Turbo to a crystallization temperature of 22.0-22.4°C (measured after the depositor) and a tempering index of 4-6 (targeting 5). 40 kg of chocolate was pumped into the depositor via a heating line and depositor jacket set at 30°C but later increased to 31°C so that the chocolate flowed well to the end of the depositor opposite the inlet. The mould was adjusted to 30°C.

[0214] The mould has dimensions 1122 x 283 x 30 mm with a usable cavity area of ​​1070 x 270 mm centrally located. The trapezoidal cavities have inner dimensions of 26.6 x 16.5 mm and a depth of 9.8. The cavities are spaced 2 mm apart in the x direction and 10.4 mm apart in the y direction. The mould is made of polycarbonate.

[0215] The mould has a profile as shown in Figure 5 and contains seven openings of trapezoidal cross section (x, z axes) through the y axis. The inner protrusions have a depth of 7 mm from the base of the mould and the outer protrusions (i.e. outermost along the x axis) have a depth of 12 mm from the base, i.e. the outer protrusions extend further. The total cross-sectional area of ​​the openings is approximately 2500 mm 2 The cross-sectional area of ​​each opening is approximately 275 mm 2 (×2), 375mm 2 (×4), and 525mm 2 (×1).

[0216] The prepared molds were filled by the depositor and backed manually.

[0217] A MadgeTech data logger (OctTemp / Quadtemp thermocouple temperature recorder) was used to measure the temperature within the chocolate across the three mould stacks at centre and side positions at two different levels within the stack (bottom row 1 of 6 + centre row 3 of 6).

[0218] Six moulds placed in the centre of the whole stack were filled with solids three times. Six moulds were filled with chocolate and placed in the centre of section C of the pallet, furthest from the ventilator. Six moulds were filled with chocolate and placed in the centre of section A of the pallet, closest to the ventilator. Six moulds were filled in the centre section B. This is shown in Figure 13. 18 moulds were filled with solids in about 25 minutes, i.e. 0.7 moulds filled per minute.

[0219] The mold stacks were placed on a pallet in three stacks of 30 molds.

[0220] The mold was attached to the ventilator, with the three stacks touching each other and the ventilation gaps in the mold flush with the ventilator hood, forming a seal. The ventilator (Vent Axia model BSP50014, 500 mm fan) was set to draw air through the mold. The speed setting was at its maximum (2.45 m / s). 3 / s). The ambient temperature was 23.0°C.

[0221] The airflow was measured and found to be 7.5 m / s after stack A, 5.6 m / s after stack B, and 4.5 m / s after stack C.

[0222] The top row (row 6) was demolded after 30 minutes, row 5 after 35, 45, 60, 65, 70 and finally 75 minutes. Demolding involved manually twisting the ends of the mold three times and tapping the center of the mold three times.

[0223] For solids, there was no correlation between mold sticking and cooling time and stacking position on the pallet.

[0224] Example 3 Example 2 was repeated with the following exceptions.

[0225] The chocolate was tempered in a Sollich Turbo Temper Champ with the depositor jacket set at 32°C.

[0226] 10 moulds were filled twice with solids and placed in the centre of the stacks closest and furthest from the ventilator, 10 moulds were filled with chocolate and placed in the centre of section C of the pallet furthest from the ventilator, 10 moulds were filled with chocolate and placed in the centre of section A of the pallet closest to the ventilator.

[0227] The molds with temperature probes were demolded starting with a 20 minute dwell time, with 5 minute increments up to 45 minutes cooling time, with the last filled molds being demolded first, i.e., in stacking order. For Stack C, there were 4 tacked areas after 20 minutes and none thereafter. For Stack A, there were 6 tacked areas after 20 minutes, 3 tacked areas after 25 minutes, and none thereafter.

[0228] Examples 4 to 12 The following experiments were performed with the following parameters (using the same equipment as above unless specified): [Table 2-1] [Table 2-2]

[0229] All samples were taken from 3 stacks of 33 molds.

[0230] Each example was 100% milk chocolate and demoulded with 100% success.

[0231] Example 13 To evaluate the impact of the cooling process of the present invention compared to chocolate samples prepared using the industry standard cooling tunnel Differential Scanning Calorimetry (DSC) test, the following experimental protocol was used.

[0232] DSC results were obtained using a heat shock method: hold at 15°C for 5 min, cool at 200°C / min to -30°C, hold at -30°C for 10 min, heat from -30°C to 33°C at 200°C / min, recool at 200°C / min to -33°C, hold at -30°C for 10 min, heat from -30°C to 70°C at 40°C / min.

[0233] Samples 1 and 2 were milk chocolate as above but cooled in a commercial Aasted cooling tunnel operating at 10°C.

[0234] In FIG. 14, the y-axis is normalized heat flow endotherm (W / g) from −0.404 to 3.433 in 0.5 increments between 0 and 3, and the x-axis is temperature from −2.26° C. to 46.5° C. in 5° C. increments between 0 and 45.

[0235] In FIG. 15, the y-axis is normalized heat flow endotherm (W / g) in 0.5 increments from -1 to 3, and the x-axis is temperature in 10° C. increments from -10° C. to 60° C.

[0236] Figure 14 shows two industrially prepared chocolate samples and Figure 15 shows an overlay of eight samples, four each from Examples 11 and 12, taken from positions distributed among the stack to provide an accurate average. The term "fresh" refers to samples that are two days old and the term "mature" refers to samples that are two weeks old at temperatures between 18°C ​​and 20°C.

[0237] As can be seen, the present invention provides favorable ratios of β' and βV for fresh samples compared to previously demonstrated industrial examples.

[0238] Example 14 The computational fluid dynamics simulations were based on molds with opening heights of 21 mm and 26 mm and total opening width of 320 mm, and the opening cross-sectional area was determined as the product of these dimensions for different gas flow velocities. The results are shown below. [Table 3]

[0239] It has been shown that an increase in pressure drop occurs at higher flow rates. A higher flow rate increases the mass flow rate, but also increases the heat transfer coefficient, so the outlet air temperature does not decrease significantly. This can be taken to mean that the cooling process is faster, but does not result in a significantly more uniform cooling time between different locations in the mold. Increasing the opening size is believed to have a more significant effect on reducing the outlet air temperature, resulting in a more uniform cooling process.

Claims

1. 1. A confectionery manufacturing process comprising a modular cooling step for cooling confectionery, said process comprising: stacking the molds on one another in direct contact, the molds comprising openings formed in each mold and / or between two adjacent stacked molds, the openings allowing gas flow between the two molds when stacked on one another sufficient to assist in cooling the confectionery, the openings extending in the y-axis direction through the entire length of the molds; cooling the mold stack while the confectionery is stationary, said cooling comprising propelling or drawing gas through said openings in the molds.

2. 10. The process of claim 1, wherein the cooling is carried out at a temperature above 16.0°C and the process is carried out at a temperature below 25.0°C.

3. 10. The process of claim 1, wherein the cooling is carried out for a period of more than 15 minutes and the process is carried out for a period of less than 240 minutes.

4. The process described in claim 1, wherein the confectionery is cooled in at least one mold stack containing 2 to 60 molds.

5. The process of claim 1 , wherein the cooling is performed using a cooling device.

6. The process described in claim 5, wherein the cooling device is capable of cooling two or more mold stacks together.

7. The process described in claim 6, wherein the cooling device is contained in a container that is sealed after insertion of the mold.

8. The process described in claim 1, wherein at least two mold stacks are positioned laterally of each other during the cooling step.

9. The process of claim 8, wherein the at least two mold stacks are in direct contact during the cooling step.

10. 10. The process of claim 1, wherein the gas flow has a velocity of 2.0 to 20.0 m / s.

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