Substrate processing apparatus
JP2024106316A5Active Publication Date: 2025-03-27TOKYO ELECTRON LTD
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Patent Information
- Application Number
- JP2023214822
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-12-20
- Publication Date
- 2025-03-27
- Estimated Expiration
- 2043-01-26
AI Technical Summary
Technical Problem
Existing substrate processing equipment faces challenges in improving exhaust efficiency while maintaining a compact footprint.
Method used
A substrate processing apparatus with a processing module featuring adjacent first and second processing containers, a common maintenance opening, and expanded exhaust boxes, allowing for increased pipe diameters and reduced maintenance opening width.
Benefits of technology
Enhances exhaust efficiency and reduces the apparatus' footprint, improving processing speed and gas flow rates while maintaining operational flexibility.
✦ Generated by Eureka AI based on patent content.
Abstract
To provide techniques capable of improving the exhaust efficiency while reducing the footprint.SOLUTION: A substrate processing apparatus includes a processing module including a first sidewall and a second sidewall that are separated in a first horizontal direction, and a transferring module that is configured to transfer a substrate to the processing module and that is disposed adjacently to the first sidewall. The processing module includes a first processing container and a second processing container that are adjacent to each other in a second horizontal direction perpendicular to the first horizontal direction. A maintenance opening common for performing maintenance on the first processing container and the second processing container is provided in the second sidewall.SELECTED DRAWING: Figure 1
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