Game machine
Patent Information
- Application Number
- JP2023082934
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-05-19
- Publication Date
- 2025-11-06
- Estimated Expiration
- 2043-05-19
Abstract
Claims
[Claim 1] A gaming machine having a plurality of boards on which a plurality of electronic components are mounted, The plurality of substrates include: A main board for game progress; A sub-side board for game effects, the sub-side board has a specific sub-side board on which a thermal pattern is formed, connecting a plurality of connection portions to which connection terminals of electronic components are soldered and a solid ground; The main side board is a specific main-side substrate on which a thermal pattern is formed, connecting a plurality of connection portions to which connection terminals of electronic components are soldered and a solid ground; a non-specific main-side board that is provided on the front side of the gaming machine relative to the specific sub-side board and the specific main-side board and on which no thermal pattern is formed; the plurality of electronic components includes at least a plurality of surface-mount electronic components; the plurality of surface-mounted electronic components mounted on the specific sub-side board include a first specific surface-mounted electronic component and a second specific surface-mounted electronic component having two pairs of opposing sides and disposed adjacent to the first specific surface-mounted electronic component; a first specific connection portion to which a first specific connection terminal is soldered among a plurality of connection portions to which a plurality of connection terminals of the first specific surface-mounted electronic component are soldered is electrically connected to a solid ground of the specific sub-side substrate by a thermal pattern formed so as to be positioned around the first specific connection portion; the first specific surface-mounted electronic component is disposed on a specific side of the second specific surface-mounted electronic component; the second specific surface-mount electronic component has a plurality of connection terminals formed along at least one of the pair of opposing sides that does not include the specific side, a second specific connection portion to which a second specific connection terminal of the second specific surface-mounted electronic component is soldered, the second specific connection portion being arranged closer to a special side opposed to the specific side than the specific side among the plurality of connection portions to which the plurality of connection terminals of the second specific surface-mounted electronic component are soldered, is electrically connected to the solid ground of the specific sub-side board by a thermal pattern formed so as to be positioned around the second specific connection portion; Furthermore, the non-specific main side board has a ground as a wiring pattern different from the solid ground. A gaming machine characterized by: