Game machine
Patent Information
- Application Number
- JP2023082937
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-05-19
- Publication Date
- 2025-11-06
- Estimated Expiration
- 2043-05-19
Abstract
Claims
[Claim 1] A gaming machine having a plurality of boards on which a plurality of electronic components are mounted, The plurality of substrates include: A main board for game progress; A sub-side board for game effects, the sub-side board has a specific sub-side board on which a thermal pattern is formed, the thermal pattern connecting a plurality of connection portions to which connection terminals of electronic components are soldered and a solid ground; The main side board is a specific main-side substrate on which a thermal pattern is formed, connecting a plurality of connection portions to which connection terminals of electronic components are soldered and a solid ground; a non-specific main-side board that is provided on the front side of the gaming machine relative to the specific sub-side board and the specific main-side board and does not have a thermal pattern formed thereon; the plurality of electronic components includes at least a plurality of surface-mount electronic components; the plurality of surface-mounted electronic components mounted on the specific sub-side board include a first specific surface-mounted electronic component and a second specific surface-mounted electronic component having two pairs of opposing sides and disposed adjacent to the first specific surface-mounted electronic component; a first specific connection portion to which a first specific connection terminal is soldered among a plurality of connection portions to which a plurality of connection terminals of the first specific surface-mounted electronic component are soldered is electrically connected to a solid ground of the specific sub-side substrate by a thermal pattern formed so as to be positioned around the first specific connection portion; the first specific surface-mounted electronic component is disposed on a specific side of the second specific surface-mounted electronic component; the second specific surface-mount electronic component has a plurality of connection terminals formed along at least one of the pair of opposing sides that does not include the specific side, a second specific connection portion to which a second specific connection terminal of the second specific surface-mounted electronic component is soldered, the second specific connection portion being arranged closer to a special side opposed to the specific side than the specific side among the plurality of connection portions to which the plurality of connection terminals of the second specific surface-mounted electronic component are soldered, is electrically connected to the solid ground of the specific sub-side board by a thermal pattern formed so as to be positioned around the second specific connection portion; Furthermore, the solid grounds of the specific main-side board are formed on one board surface and the other board surface, and the solid grounds are electrically connected to each other by through holes connected to connection terminals of electronic components, and the connection portion of at least one of the board surfaces is connected to the solid ground by a thermal pattern, and at least a part of the thermal pattern is covered with an insulating coating. A gaming machine characterized by: