Workpiece processing sheet

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The workpiece processing sheet with an electron beam-irradiated substrate and benzophenyl-containing adhesive layer addresses the issues of chip generation and uneven adhesive strength by hardening the adhesive layer, enhancing dicing efficiency and consistency.

JP2025142861APending Publication Date: 2025-10-01LINTEC CORP

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Patent Information

Application Number: JP2024042453
Authority / Receiving Office: JP · JP
Patent Type: Applications
Current Assignee / Owner
Filing Date: 2024-03-18
Publication Date: 2025-10-01

Application Information

Patent Timeline

18 Mar 2024

Application

JP2024042453

01 Oct 2025

Publication

JP2025142861A

IPC: C09J7/30; C09J133/00; C09J201/02; H01L21/301

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Application Domain

Film/foil adhesives Semiconductor/solid-state device manufacturing

Technology Topics

Hydrogen atom Adhesive

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AI Technical Summary

Technical Problem

Existing workpiece processing sheets generate thread-like scraps during dicing and exhibit uneven adhesive strength between the central and peripheral regions due to electron beam irradiation treatment.

Method used

A workpiece processing sheet with a substrate irradiated by an electron beam and an adhesive layer containing a benzophenyl structure, which hardens through a hydrogen abstraction reaction upon irradiation with active energy rays, reducing adhesive strength and minimizing uneven adhesive strength.

Benefits of technology

The sheet effectively suppresses the generation of cutting chips during dicing and ensures consistent adhesive strength across the sheet, preventing uneven adhesive regions.

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Abstract

To provide a workpiece processing sheet which can suppress generation of a cut piece in dicing and suppress unevenness of adhesive force.SOLUTION: There is provided a workpiece processing sheet comprising: a substrate; and an adhesive layer laminated on one surface side on the substrate. The substrate is subjected to electron beam (EB) radiation processing, and the adhesive layer is constituted by an adhesive formed of an adhesive composition including a component having a benzo phenyl structure expressed by the following formula (1). (In formula (1), R1's express a hydrogen atom, or an alkyl group having C1-C18.) The content of a component having a polymerizable carbon-carbon double bond in the adhesive composition is 0.1 mass% or lower in the workpiece processing sheet.SELECTED DRAWING: None

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