Composite Structures and Related Manufacturing Processes

JP2025507250A5Pending Publication Date: 2025-12-10SOITEC SA
0 Cites 0 Cited by

Patent Information

Application Number
JP2024541671
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-02-18
Filing Date
2023-01-31
Publication Date
2025-12-10

AI Technical Summary

Technical Problem

Substrates made from polycrystalline silicon carbide (p-SiC) are difficult to polish due to their hardness and polycrystalline structure, resulting in residual roughness that complicates direct bonding processes for composite structure fabrication.

Method used

A manufacturing process involving a starting substrate with a surface film made of glassy carbon, achieved by depositing a polymer resin layer with preformed carbon-carbon bonds, followed by annealing to form a crosslinked polymer resin layer and then converting it into a glassy carbon film, which is then polished to achieve low surface roughness.

Benefits of technology

The process results in a support substrate with significantly improved surface smoothness and electrical conductivity, facilitating the transfer of thin single crystal layers onto the glassy carbon film for the fabrication of high-quality composite structures suitable for power electronics.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention relates to a manufacturing process for a composite structure comprising a thin layer made of a first monocrystalline material arranged on a support substrate, the manufacturing process comprising the steps of: a) providing a starting substrate made from a second polycrystalline material; b) depositing, by centrifugal coating, a polymeric resin layer comprising three-dimensional preformed carbon-carbon bonds on at least the front surface of the starting substrate; c) subjecting the starting substrate provided with the polymer resin layer to a first annealing at a temperature between 120° C. and 180° C. to form a crosslinked polymer resin layer; d) applying a second annealing at a temperature above 600° C. under a neutral atmosphere to convert the crosslinked polymer resin layer into a glassy carbon film; Includes. The invention also relates to a composite structure comprising a thin layer made of a first monocrystalline material arranged on a support substrate, said support substrate comprising: a starting substrate made from a second polycrystalline material; a glassy carbon film in contact with the front surface of the starting substrate; Includes.
Need to check novelty before this filing date? Find Prior Art