Current measuring device and electronic device

Abstract

To provide a current measuring device having a lead frame and a sensor die.SOLUTION: A current measurement device having a lead frame and a sensor die is provided. The lead frame has a first pad, a second pad, a third pad, and a connecting wire. The first pad is coupled to the first power supply and receives the specific current provided by the first power supply. The second pad is coupled to the load. The third pad supplies a data signal to the microcontroller. The connection line is electrically connected to the first and second pads. The sensor die obtains current information of a current flowing through the connecting wire according to an equivalent impedance of the connecting wire and a voltage difference between the first pad and the second pad. The sensor die provides a data signal according to the current information. The lead frame is integrally packaged with the sensor die.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a current sensing device, and more particularly to a current sensing device that combines a lead frame and a sensor die. [Background technology]

[0002] In daily life, electronic devices use power to drive electronic circuits. In order to reduce power consumption, it is important to accurately monitor the voltage and current of this power. Therefore, current monitoring has become an important trend. Summary of the Invention [Problem to be solved by the invention]

[0003] An embodiment of the present invention aims to provide a current measurement device. [Means for solving the problem]

[0004] The current measuring device of the present invention includes a lead frame and a sensor die. The lead frame has a first pad, a second pad, a third pad, and a connecting wire. The first pad is coupled to a first power supply and receives a specific current supplied by the first power supply. The second pad is coupled to a load. The third pad supplies a data signal to the microcontroller. The connecting wire is electrically connected to the first and second pads. The sensor die obtains current information, which is a current flowing through the connecting wire, according to the equivalent impedance of the connecting wire and the voltage difference between the first and second pads. The sensor die supplies a data signal according to the current information. The lead frame is packaged integrally with the sensor die. [Effects of the Invention]

[0005] The present invention can prevent the measurement results of the sensor die from being affected by noise interference. [Brief explanation of the drawings]

[0006] [Figure 1] 1 is a schematic diagram of a current measuring device of the present invention. [Figure 2A] 1 is a schematic diagram of the packaging of the current measuring device of the present invention; [Figure 2B] 1 is an external view of a current measuring device according to the present invention. [Figure 3A] FIG. 2 is a schematic diagram of another packaging for the current measuring device of the present invention. [Figure 3B] FIG. 2 is another external view of the current measuring device of the present invention. [Figure 4A] 2 is another schematic diagram of the current measuring device of the present invention. FIG. [Figure 4B] 2 is another schematic diagram of the current measuring device of the present invention. FIG. [Figure 4C] 2 is another schematic diagram of the current measuring device of the present invention. FIG. [Figure 5A] FIG. 2 is a schematic diagram of another packaging for the current measuring device of the present invention. [Figure 5B] FIG. 2 is a schematic diagram of another packaging for the current measuring device of the present invention. [Figure 6A] FIG. 1 is a schematic diagram of a sensor die of the present invention. [Figure 6B] FIG. 1 is a schematic diagram of a sensor die of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0007] In order to make the objects, features, and advantages of the present invention clearer and easier to understand, the present invention will be described in detail below with reference to the accompanying drawings and examples. In this specification, various examples are provided to explain the technical features of different embodiments of the present invention. Note that the arrangement of each component in the examples is for the purpose of explanation and does not limit the present invention. In addition, although some reference numerals in the figures are used repeatedly in the examples, this is for the purpose of simplifying the explanation and does not imply any relationship between different examples.

[0008] FIG. 1 is a schematic diagram of a current measuring device of the present invention. As shown in the figure, the current measuring device 120 includes a lead frame 121 and a sensor die 122. The lead frame 121 includes contact pads P1 to P3 and a connecting line LN. The present invention does not limit the manufacturing process of the lead frame 121. In one embodiment, the lead frame 121 is formed by a stamping method or an etching method. In another embodiment, in situations where high precision is required, the lead frame 121 is formed by a laser cutting method. In this example, the pads P1 to P3 are less likely to produce burrs. In some embodiments, the material of the lead frame 121 is a nickel-copper alloy.

[0009] Pad P1 is coupled to power source 110 and receives a specific current I_IN provided by the power source. In one embodiment, the specific current I_IN is 3 A to 30 A. Pad P2 is coupled to load 130 and outputs the specific current I_IN to load 130. Pad P3 provides a data signal SD to microcontroller 140. Connecting line LN is electrically coupled to pads P1 and P2. In one embodiment, the equivalent impedance of connecting line LN is 1 mΩ to 20 mΩ. The present invention does not limit the width of connecting line LN. In this embodiment, the width of connecting line LN is smaller than the width of pad P1, but this does not limit the present invention. In one embodiment, the width of connecting line LN is the same as the width of pad P1.

[0010] In some embodiments, the size of pad P1 is the same as the size of pad P2 and is larger than the size of pad P3. In this example, since a large current flows through pad P1 and pad P2, pads P1 and P2 have a large size to withstand the large current.

[0011] The sensor die 122 acquires current information, which is the current flowing through the connecting line LN, according to the equivalent impedance of the connecting line LN and the voltage difference between the pads P1 and P2. In this embodiment, the sensor die 122 acquires the voltage difference between the pads P1 and P2. The sensor die 122 acquires current information, which is the current flowing through the connecting line LN, according to the equivalent impedance of the connecting line LN and the voltage difference between the pads P1 and P2. In this embodiment, the sensor die 122 provides a data signal SD according to the current information. The microcontroller 140 detects the current flowing through the connecting line LN according to the data signal SD. In one possible embodiment, the data signal SD is an analog signal. In one possible embodiment, the sensor die 122 has an analog-to-digital conversion function. In this case, the data signal SD is a digital signal. In some embodiments, the voltage of the pad P1 is used as the operating voltage of the sensor die 122. That is, the power supply 110 supplies power to the sensor die 122.

[0012] In this embodiment, the lead frame 121 and the sensor die 122 are packaged together to form a single component. In some embodiments, the technology for packaging the lead frame 121 and the sensor die 122 is flip chip packaging technology or wire bonding packaging technology. Because the lead frame 121 and the sensor die 122 are not two independent elements, there is no need to solder the lead frame 121 and the sensor die 122 onto the same printed circuit board (PCB) using soldering technology. Therefore, the contact impedance caused by the additional solder is reduced, and the current measurement accuracy of the sensor die 122 can be improved. The increase in contact impedance caused by the additional soldering can be avoided, reducing the error value of the current measurement of the sensor die 122. Furthermore, because the lead frame 121 and the sensor die 122 are packaged together, the sensor die 122 is very close to the connecting line LN. In the process of measuring the current flowing through the connecting line LN, the measurement results of the sensor die 122 are less susceptible to noise interference.

[0013] During the final test process of the production stage, the power supply 110, the load 130, and the microcontroller 140 sequentially or simultaneously calibrate multiple current measurement devices to obtain error values ​​of the current measurement devices. After calibration is complete, the current measurement devices can be used as current monitoring elements in fields such as servers, industrial computers, smart meters, and USB fast charging. Because the power supply 110, the load 130, and the microcontroller 140 are used as test devices, the current measurement device 120 does not need to be connected to the power supply 110, the load 130, and the microcontroller 140 after the test is completed. Users can apply the current measurement device 120 to any electronic device according to their actual needs.

[0014] 2A is a schematic diagram of packaging for a current measuring device 120 of the present invention. A lead frame 121 has pads P1 to P3. In one embodiment, the lead frame 121 is mounted in a plastic material EPY. The plastic material EPY is used to support the lead frame 121 and fix the pads P1 to P3. The present invention does not limit the type of plastic material EPY. In one embodiment, the plastic material EPY is epoxy. In addition, the present invention does not limit the number of pads on the lead frame 121. In some embodiments, the lead frame 121 further has a pad PA.

[0015] FIG. 2A shows a front view of the sensor die 122. As shown in the figure, the sensor die 122 has pads IO_1 to IO_3. Generally, each wafer produced in a wafer fabrication factory has multiple dies. After a wafer saw process, many individual dies are obtained. In this embodiment, the sensor die 122 is a die cut from a wafer.

[0016] 2A , the front surface of the sensor die 122 faces the lead frame 121 and is in contact with the lead frame 121. In this example, the pad IO_1 of the sensor die 122 contacts and is electrically connected to the pad P2 of the lead frame 121, the pad IO_2 of the sensor die 122 contacts and is electrically connected to the pad P1 of the lead frame 121, and the pad IO_3 of the sensor die 122 contacts and is electrically connected to the pad PA of the lead frame 121. In other embodiments, the front surface of the sensor die 122 further has a pad IO_A that is electrically connected to the pad P3 of the lead frame 121.

[0017] Next, a packaging case is used to package the lead frame 121 and the sensor die 122 together. Figure 2B is a schematic diagram of the appearance of the current measurement device 120 of Figure 2A. The packaging case CS encapsulates the lead frame 121 and the sensor die 122 after packaging. In some embodiments, the packaging case CS has a heat dissipation function and dissipates heat energy generated by the current flowing through the connecting line LN.

[0018] In some embodiments, the current measurement device 120 further includes multiple external pins electrically connecting the sensor die 122. For simplicity, only external pins PN_1 and PN_2 are shown in FIG. 2B. External pin PN_1 is electrically connected to pad IO_1. External pin PN_2 is electrically connected to pad IO_2. External pins PN_1 and PN_2 are exposed from the package case CS.

[0019] In this embodiment, the packaging technology for packaging the lead frame 121 and the sensor die 122 is flip-chip packaging technology. After packaging, the lead frame 121 and the sensor die 122 function as the current measuring device 120. The current measuring device 120 is soldered onto a printed circuit board PCB. In this example, the external pin PN_1 is coupled to the power supply 110 by a trace (not shown) on the printed circuit board PCB, and the external pin PN_2 is coupled to the load 130 by another trace on the printed circuit board PCB.

[0020] 3A is another schematic diagram of packaging the current measurement device of the present invention. In this embodiment, the packaging technology for packaging the lead frame 121 and the sensor die 122 is wire bonding packaging technology. FIG. 3A shows the front side of the sensor die 122. First, the back side of the sensor die 122 faces the lead frame 121. Then, the contact pads on the front side of the sensor die 122 and the lead frame 121 are electrically connected by bonding wires W_1 to W_3 and W_A.

[0021] As shown in the figure, bonding wire W_1 is electrically connected to pad IO_1 of sensor die 122 and pad P1 of lead frame 121. Bonding wire W_2 is electrically connected to pad IO_2 of sensor die 122 and pad P2 of lead frame 121. Bonding wire W_3 is electrically connected to pad IO_3 of sensor die 122 and pad P3 of lead frame 121. Bonding wire W_A is electrically connected to pad IO_A of sensor die 122 and pad PA of lead frame 121.

[0022] FIG. 3B is an external view of the current measurement device of FIG. 3A. FIG. 3B is the same as FIG. 2B except that the connection between the sensor die 122 and the lead frame 121 in the current measurement device of FIG. 3B uses bonding wires W_1 to W_3 and W_A. For simplicity, FIG. 3B only shows external pins PN_3 and PN_4. External pin PN_3 is electrically connected to pad IO_2 via bonding wire W_2. External pin PN_4 is electrically connected to pad IO_1 via bonding wire W_1.

[0023] FIG. 4A is another schematic diagram of a current measuring device of the present invention. The current measuring device 220 includes a lead frame 221 and a sensor die 222. The lead frame 221 is the same as the lead frame 121 of FIG. 1, except that the lead frame 221 further includes pads P4 to P7. The pad P4 is electrically connected to the pad P1 and the sensor die 222. The pad P5 is electrically connected to the pad P2 and the sensor die 222. In this example, the sensor die 222 measures the voltages of the pads P4 and P5 to obtain the voltage difference between the pads P1 and P2. The sensor die 222 obtains current information, which is the current flowing through the connecting line LN, according to the voltage difference between the pads P1 and P2 and the equivalent impedance of the connecting line LN. The sensor die 222 outputs a data signal SD according to the current information. The features of the sensor die 222 are similar to those of the sensor die 122 and will not be described in detail.

[0024] In one embodiment, the sensor die 222 directly uses the current flowing through the connecting line LN as the data signal SD. In another embodiment, the sensor die 222 converts the current flowing through the connecting line LN and uses the conversion result as the data signal SD. In this example, the data signal SD is an analog signal or a digital signal.

[0025] The pad P6 is coupled to the power supply 230 and receives the operating voltage VCC supplied by the power supply 230. The pad P6 supplies the operating voltage VCC to the sensor die 222. The pad P7 receives the ground voltage GND and supplies the ground voltage GND to the sensor die 222. After receiving the operating voltage VCC and the ground voltage GND, the sensor die 222 starts measuring the voltage difference between the pads P1 and P2 and obtains information about the current flowing through the connecting line LN.

[0026] FIG. 4B is another schematic diagram of the current measurement device of the present invention. FIG. 4B is the same as FIG. 4A except that the sensor die 222 in FIG. 4B receives the operating voltage VCC provided by the power supply 110 via pad P4. In this example, pad P6 can be omitted. In one embodiment, the sensor die 222 includes a power supply circuit 240. The power supply circuit 240 converts the operating voltage VCC and then supplies the converted voltage to other components within the sensor die 222. This disclosure does not limit the manner in which the power supply circuit 240 receives the operating voltage VCC. In one embodiment, the power supply circuit 240 receives the operating voltage VCC via pad P1. In another embodiment, the power supply circuit 240 receives the operating voltage VCC via pad P4. In yet another embodiment, the power supply circuit 240 receives the operating voltage VCC via connection line LN and pad P2. In some embodiments, the power supply circuit 240 is a low-dropout regulator (LDO).

[0027] FIG. 4C is another schematic diagram of the current measurement device of the present invention. FIG. 4C is the same as FIG. 4A except that lead frame 221 further includes pad P8. Pad P8 is coupled to microcontroller 140 and receives control signal SC from microcontroller 140. Sensor die 222 adjusts data signal SD according to control signal SC and then provides the adjusted data signal SD to microcontroller 140. The present invention does not limit how sensor die 222 adjusts data signal SD. In one embodiment, sensor die 222 generates a calibration signal and combines the calibration signal into data signal SD according to control signal SC.

[0028] The microcontroller 140 determines whether the adjusted data signal SD reaches a predetermined value. If the data signal SD does not reach the predetermined value, the microcontroller 140 again sends a control signal SC to request the sensor die 222 to readjust the data signal SD. In one embodiment, the sensor die 222 combines another calibration signal with the data signal SD until the data signal SD reaches the predetermined value. When the data signal SD reaches the predetermined value, the microcontroller 140 requests the sensor die 222 to record the amount of adjustment to the data signal SD and use that adjustment as a reference value (called an offset). For future current measurements, the sensor die 222 adds this reference value to the measurement result to determine the final current measurement.

[0029] For example, assume that the data signal SD output by the sensor die 222 indicates that the current flowing through the connecting line LN is 9.8 A. Because the current flowing through the connecting line LN (9.8 A) does not match a predetermined value (e.g., 10 A), the microcontroller 140 sends a control signal SC to request the sensor die 222 to adjust the data signal SD. In one embodiment, the sensor die 222 increases the data signal SD in accordance with the control signal SC, so that the data signal SD corresponds to a current of 9.9 A. Because the current of 9.9 A indicated by the data signal SD does not match the predetermined value (e.g., 10 A), the microcontroller 140 resends the control signal SC. The sensor die 222 continues to increase the data signal SD, so that the data signal SD corresponds to a current of 10 A. Because the current (10 A) corresponding to the data signal SD matches the predetermined value (e.g., 10 A), the microcontroller 140 stops sending the control signal SC. The sensor die 222 records an increase (0.2 A) in the data signal SD.

[0030] After being shipped, the current measurement device 220 can be used in a server. Assume that the current measured by the measurement chip 222 and flowing through the connecting line LN is 5 A. In this example, the sensor die 222 adds the actual measurement result (e.g., 5 A) to the previously recorded adjustment value (e.g., 0.2 A), and then generates a data signal SD according to the adjusted current value (e.g., 5.2 A) and supplies it to an external test instrument or a microprocessor.

[0031] The data signal SD generated by the current measuring device 220 is adjusted to compensate for errors caused by any factors within the package, thereby providing accurate current monitoring results. Furthermore, the connecting line LN measured by the sensor die 222 is part of the lead frame 221, so no additional components are required, and the current monitoring function can be achieved without increasing component costs.

[0032] In some embodiments, the lead frame 221 further includes a pad P9. The pad P9 is coupled to the microcontroller 140 and receives a clock signal CLK from the microcontroller 140. In this example, the sensor die 222 receives a control signal SC according to the clock signal CLK. In one embodiment, the clock signal CLK and the control signal SC comply with the Inter-Integrated Circuit (I2C) protocol.

[0033] The present invention does not limit the size of pads P1 to P9. In one embodiment, pads P1 to P9 have the same size. In another embodiment, pads P1 and P2 have the same size, and pads P1 and P2 have a larger size than pads P3 to P9. In some embodiments, pads P1, P2, P4, and P5 have the same size, and are larger than pads P3 and P6 to P9.

[0034] 5A is a schematic diagram of the packaging of the current measuring device 220 of FIG. 4A. The lead frame 221 has pads P1 to P7. The pads P1 to P7 are fixed by a plastic material EPY. FIG. 5A shows the front surface of the sensor die 222. As shown in the figure, the front surface of the sensor die 222 has pads IO_1 to IO3, IO_A, and IO_B.

[0035] Next, the front surface of the sensor die 222 is placed facing the lead frame 221. In this example, the pad IO_1 of the sensor die 222 contacts and is electrically connected to the pad P5 of the lead frame 221. In addition, the pad IO_2 of the sensor die 222 contacts and is electrically connected to the pad P4 of the lead frame 221. The pad IO_3 of the sensor die 222 contacts and is electrically connected to the pad P6 of the lead frame 221. The pad IO_A of the sensor die 222 contacts and is electrically connected to the pad P7 of the lead frame 221. The pad IO_B of the sensor die 222 contacts and is electrically connected to the pad P3 of the lead frame 221.

[0036] Finally, the lead frame 221 and the sensor die 222 are packaged together using a package case. In this embodiment, the packaging technology for the lead frame 221 and the sensor die 222 is flip-chip packaging technology. After packaging, the lead frame 221 and the sensor die 222 function as a current measuring device 220. The current measuring device 220 is soldered onto a printed circuit board to measure the current between two elements on the printed circuit board. The external view after packaging in FIG. 5A is the same as FIG. 2B, so it will not be described in detail.

[0037] FIG. 5B is a schematic diagram of another packaging of the current measuring device 220 of the present invention. In this embodiment, the packaging technology of the lead frame 221 and the sensor die 222 is a wire bonding packaging technology. The back side of the sensor die 222 faces the lead frame 221. Then, the sensor die 222 is electrically connected to the lead frame 221 via bonding wires W_1 to W_5. As shown in the figure, the bonding wire W_1 is electrically connected to the pad IO_1 of the sensor die 222 and the pad P4 of the lead frame 221. The bonding wire W_2 is electrically connected to the pad IO_2 of the sensor die 222 and the pad P5 of the lead frame 221. The bonding wire W_3 is electrically connected to the pad IO_B of the sensor die 222 and the pad P3 of the lead frame 221. The bonding wire W_4 is electrically connected to the pad IO_3 of the sensor die 222 and the pad P7 of the lead frame 221. The bonding wire W_5 is electrically connected to the pad IO_A of the sensor die 222 and the pad P6 of the lead frame 221. Finally, a package case is used to package the lead frame 221 and the sensor die 222 together. The current measuring device 220 is soldered onto a printed circuit board (not shown). The external view after packaging in Figure 5B is the same as Figure 3B, so it will not be described in detail.

[0038] 6A is a schematic diagram of a sensor die 222 of the present invention. In this embodiment, the sensor die 222 includes an operational amplifier 310, a processing circuit 320, switches SW1-SW4, and resistors R1-R4. The non-inverting input terminal of the operational amplifier 310 is coupled to pad P5. The inverting input terminal of the operational amplifier 310 is coupled to pad P4. The output terminal of the operational amplifier 310 is coupled to pad P3 and provides a data signal SD. In this embodiment, the operational amplifier 310 outputs a voltage difference between pads P4 and P5. In other embodiments, the operational amplifier 310 outputs a current corresponding to the voltage difference between pads P4 and P5.

[0039] The switch SW1 and resistor R1 are connected in series between the pads P4 and P3 and receive the switch signal SS1. The switch SW2 and resistor R2 are connected in series between the pads P4 and P3 and receive the switch signal SS2. The switch SW3 and resistor R3 are connected in series between the pads P4 and P3 and receive the switch signal SS3. The switch SW4 and resistor R4 are connected in series between the pads P4 and P3 and receive the switch signal SS4. The present invention does not limit the number of switches and resistors. The number of switches is the same as the number of resistors. In other embodiments, the sensor die 122 has more or fewer switches and resistors.

[0040] The processing circuit 320 generates switch signals SS1-SS4 according to the control signal SC to turn on or off the corresponding switches. Taking the switch SW1 as an example, the switch SW1 switches from an on state to an off state or from an off state to an on state according to the switch signal SS1. The present invention does not limit the type of the switches SW1-SW4. In one embodiment, the switches SW1-SW4 are electronic fuses (eFuses). Taking the switch SW1 as an example, the switch SW1 switches from a short-circuit state to an open-circuit state or from an open-circuit state to a short-circuit state according to the switch signal SS1.

[0041] Assume that the specific current I_IN supplied by the power supply 110 is 10 A. When the microcontroller 140 obtains that the current flowing through the connecting line LN is 9.8 A according to the data signal SD, the current measuring device 220 indicates that it has an error of 0.2 A. Thus, the microcontroller 140 requests the sensor die 222 to perform an error calibration using the control signal SC. In this example, the sensor die 222 adjusts the data signal SD according to the control signal SC.

[0042] For example, the processing circuit 320 enables the switch signal SS1 and disables the switch signals SS2 to SS4 according to the control signal SC. This turns on the switch SW1 and turns off the switches SW2 to SW4. A negative feedback loop is formed by the switch SW1 and the resistor R1, and the calibration signal CR1 is added to the data signal SD. At this time, the microcontroller 140 obtains that the current of the connecting line LN is 9.9 A according to the data signal SD. Since the current of the connecting line LN does not match the specific current I_IN, the microcontroller 140 resends the control signal SC. The processing circuit 320 enables the switch signal SS2 and disables the switch signals SS1, SS3, and SS4 according to the control signal SC. This turns on the switch SW2 and turns off the switches SW1, SW3, and SW4. A negative feedback loop is formed by the switch SW2 and the resistor R2, and the sensor die 222 adds the calibration signal CR2 to the data signal SD. At this time, the microcontroller 140 determines that the current of the connecting line LN is 10 A according to the data signal SD. Since the current of the connecting line LN matches a predetermined value (i.e., the specific current I_IN), the microcontroller 140 uses the control signal SC to request the sensor die 222 to add the calibration signal CR2 to the data signal SD in a fixed manner. This causes the processing circuit 320 to maintain the switch signal SS2 in an enabled state and the switch signals SS1, SS3, and SS4 in an disabled state.

[0043] In one embodiment, when switches SW1-SW4 are electronic fuses, processing circuit 320 burns switches SW1, SW3, and SW4 so that switches SW1, SW3, and SW4 are in an open-circuit state. In this example, only switch SW2 is in a short-circuit state, so calibration signal CR2 is coupled to data signal SD.

[0044] In other embodiments, the sensor die 122 further includes a memory (not shown) for storing the calibration signal CR2. In this example, the sensor die 222 adjusts the data signal SD according to the calibration signal stored in the memory. In some embodiments, the processing circuit 320 further includes an I2C interface 321. The I2C interface 321 is coupled to pads P8 and P9 to receive the control signal SC and the clock signal CLK.

[0045] FIG. 6B is a schematic diagram of a sensor die 122 according to another embodiment. FIG. 6B is similar to FIG. 6A except that an analog-to-digital converter (ADC) 330 is added. The ADC 330 converts the combination of the output of the operational amplifier 310 and the calibration signals (at least one of CR1-CR4) from analog form to a digital signal. The conversion result generated by the ADC 330 is provided to pad P3 as a data signal SD. In this case, the conversion result is a digital signal.

[0046] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Furthermore, terms defined in common dictionaries should be interpreted as meanings consistent with the context of the relevant technical field, and should not be interpreted as idealized or overly formal unless specifically defined otherwise in this specification. Furthermore, terms such as "first" and "second" may be used to describe various elements, but these terms are not intended to limit the elements. These terms are merely used to distinguish one element from another.

[0047] While the present disclosure has been described in terms of exemplary and preferred embodiments, it is to be understood that the present disclosure is not limited to those embodiments. Rather, the present disclosure is intended to cover various modifications and similar arrangements. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements. [Explanation of symbols]

[0048] 110, 230...Power equipment 120, 220…Current measuring device 121, 221...Lead frame 122, 222...sensor die 130...Load 140...microcontroller 240…Power circuit P1~P9, IO_1~IO_3, IO_A, IO_B...Pad LN…connection line W_1~W_5, W_A...bonding wire EPY: plastic material PN_1~PN_4...pins CS...Package case I_IN…Specific current SD: Data signal SC...Control signal CLK: Clock signal VCC: Operating voltage GND: Ground voltage 310...Amplifier 320...Processing circuit 321...I2C interface SW1~SW4...Switches R1~R4…Resistance SS1~SS4...Switch signal CR1~CR4...Calibration signals

Claims

1. A current measuring device, a lead frame having a first pad coupled to a first power source and receiving a particular current provided by the first power source, a second pad coupled to a load, a third pad providing a data signal to a microcontroller, and connecting wires electrically coupled to the first and second pads; a sensor die that acquires current information, which is a current flowing through the connection line, according to an equivalent impedance of the connection line and a voltage difference between the first pad and the second pad, and supplies the data signal according to the current information; and The lead frame is packaged together with the sensor die.

2. 2. The current measuring device according to claim 1, wherein the equivalent impedance of the connecting wire is 1 mΩ to 20 mΩ.

3. The lead frame is 2. The current measurement device of claim 1, further comprising a fourth pad coupled to a second power supply for receiving an operating voltage provided by the second power supply and for providing the operating voltage to the sensor die.

4. The lead frame is a fifth pad coupled to the microcontroller and configured to receive a control signal provided by the microcontroller; 2. The current measuring device according to claim 1, wherein the sensor die generates a calibration signal in accordance with the control signal and combines the calibration signal with the data signal.

5. 5. The current measurement device of claim 4, wherein when the data signal reaches a predetermined value, the microcontroller requests the sensor die to maintain the calibration signal.

6. 6. The current measuring device of claim 5, wherein the sensor die has a plurality of electronic fuses, and the microcontroller controls the electronic fuses using the control signal.

7. The current measuring device of claim 5 , wherein the sensor die includes a memory for storing the calibration signal.

8. 7. The current measuring device according to claim 6, wherein the size of the first pad is larger than the size of the third pad.

9. The lead frame is a sixth pad coupled to the microcontroller and configured to receive a clock signal provided by the microcontroller; The current measuring device according to claim 4 , wherein the sensor die receives the control signal in accordance with the clock signal.

10. 10. The current measuring device of claim 9, wherein the sensor die has an I2C interface coupled to the fifth pad and the sixth pad.

11. an operational amplifier having an inverting input terminal electrically coupled to the first pad, a non-inverting input terminal electrically coupled to the second pad, and an output terminal electrically coupled to the third pad; a first switch coupled to the first pad and configured to receive a first switching signal; a first resistor connected between the first switch and the third pad; a second switch coupled to the first pad and configured to receive a second switching signal; a second resistor connected between the second switch and the third pad; 10. The current measuring device according to claim 9, further comprising a processing circuit for generating the first switching signal and the second switching signal according to the control signal.

12. In response to the first switch being turned on, the second switch is turned off; 12. The current measuring device according to claim 11, wherein the first switch is turned off in response to the second switch being turned on.

13. 12. The current measurement device of claim 11, further comprising an analog-to-digital converter coupled to the output terminal of the operational amplifier, the first resistor, and the second resistor, and providing a digital signal to the third pad.

14. a power supply circuit that converts an operating voltage supplied by the first power supply to generate a converted voltage and supplies the converted voltage to the sensor die; 2. The current measuring device according to claim 1, wherein the first pad supplies the power supply circuit with an operating voltage supplied by the first power supply.

15. a power supply circuit that converts an operating voltage supplied by the first power supply to generate a converted voltage and supplies the converted voltage to the sensor die; 2. The current measuring device according to claim 1, wherein the second pad supplies the operating voltage supplied by the first power supply to the load.

16. 2. The current measuring device according to claim 1, wherein the lead frame is formed by laser cutting, stamping, or etching.

17. 2. The current measuring device according to claim 1, wherein the technology for packaging the lead frame and the sensor die is flip-chip packaging technology or wire-bonding packaging technology.

18. The current measuring device of claim 1 , wherein the lead frame and the sensor die are sealed in a package case.

19. 1. An electronic device, comprising: a printed circuit board (PCB) comprising a first element and a second element; a current measuring device soldered onto the PCB for measuring a current between the first element and the second element; The current measuring device is a first pad coupled to the first element; a second pad coupled to the second element; a third pad for providing a data signal to a microcontroller, and a lead frame having connecting lines electrically coupled to the first pad and the second pad; a sensor die that acquires current information, which is a current flowing through the connection line, according to an equivalent impedance of the connection line and a voltage difference between the first pad and the second pad, and provides the data signal according to the current; The lead frame is packaged together with the sensor die.

20. a memory for storing a calibration signal; a processing circuit for combining the calibration signal and the data signal; 20. The electronic device of claim 19, comprising:

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