Plasma treatment equipment for air purifiers

Abstract

A plasma treatment device for an air purifier is provided that can suppress a decrease in the performance of the plasma treatment device in the air purifier. [Solution] A plasma processing device 100 for an air purifier that is placed outside an air purifier 200, characterized in that it has a plasma generation unit 10 that generates plasma and has at least a dielectric layer and a pair of electrode layers provided on both sides of the dielectric layer, a power supply unit 30 that applies an AC voltage to the pair of electrode layers, and a gas flow unit 20 that flows gas into the plasma generation unit to treat the gas with plasma and supplies the gas that has been treated with plasma.

Description

[Technical Field]

[0001] The present invention relates to a plasma treatment apparatus for an air purifier. [Background technology]

[0002] In recent years, a technique called dielectric barrier discharge (DBD) has been developed in plasma processing technology, making it possible to generate low-temperature plasma at atmospheric pressure. As a result, the range of applications of plasma processing has expanded, and it is increasingly being used in a variety of applications. The purposes of plasma processing include sterilization, deodorization, surface modification, and decomposition of chemical substances. Furthermore, the substances that can be subjected to plasma processing can be solid, liquid, or gaseous.

[0003] Various plasma processing apparatuses have been developed to perform continuous plasma processing while flowing air. For example, Patent Document 1 discloses a plasma generating apparatus in which plasma generating units, each having a flat plate-shaped first electrode and a second electrode facing each other across a gap, are stacked in two or more layers. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-190472 Summary of the Invention [Problem to be solved by the invention]

[0005] A plasma generating device (plasma processing device) is used, for example, by being placed inside an air purifier. Such conventional air purifiers utilize the flow of air taken in by the air purifier and passed through a filter to discharge gas treated with plasma. However, if the filter of such an air purifier becomes clogged, the amount of gas supplied to the plasma processing device decreases, resulting in a decrease in the performance of the plasma processing device. Therefore, it is desirable to suppress the decrease in performance of the plasma processing device due to filter clogging.

[0006] In view of the above background, an object of the present invention is to provide a plasma treatment device for an air purifier that can suppress a decrease in the performance of the plasma treatment device in the air purifier. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems, the present invention provides a plasma treatment device for an air purifier that is arranged outside the air purifier, and is characterized by having a plasma generation unit that generates plasma and that has at least a dielectric layer and a pair of electrode layers provided on both sides of the dielectric layer, a power supply unit that applies an AC voltage to the pair of electrode layers, and a gas flow unit that flows gas into the plasma generation unit to treat the gas with plasma and supplies the gas that has been treated with plasma.

[0008] According to the present invention, a gas treated with plasma can be generated and supplied to the inside and surrounding area of ​​an air purifier, thereby reducing germs (e.g., bacteria, mold, etc.) and viruses in and around the air purifier. In addition, it is possible to prevent a decrease in the performance of the plasma treatment device due to clogging of the air purifier filter.

[0009] The gas flow unit may supply the gas treated with plasma into the air purifier.

[0010] According to the present invention, bacteria and viruses in the air purifier can be reduced.

[0011] The gas flow unit may also supply the gas treated with plasma to the outside of the air purifier.

[0012] According to the present invention, bacteria and viruses around the air purifier can be reduced.

[0013] It is also preferable that the gas flow unit has a humidifier, and that the gas is caused to flow into the plasma generation unit through the humidifier.

[0014] According to the present invention, by flowing gas humidified by a humidifier into a plasma generating unit, the gas can be easily treated with plasma. Furthermore, the plasma treatment device for an air purifier can discharge gas treated with plasma at an appropriate humidity.

[0015] It is also preferable to have a sensor that detects the plasma, and a control unit that receives the detection result of the sensor and transmits a signal to apply an AC voltage to the power supply unit based on the detection result.

[0016] According to the present invention, the generation state of the gas treated by plasma is detected by the sensor, so that the gas treated by plasma can be efficiently supplied.

[0017] It is also preferable that the power supply unit has a control unit that transmits a signal to apply an AC voltage to the power supply unit based on a timer unit that measures time.

[0018] According to the present invention, by controlling the timing of generating plasma in accordance with the time and information from the sensor, it is possible to supply gas that has been efficiently treated with plasma.

[0019] It is also preferable that the plasma generating device has a wireless interface that provides information to a terminal device and a control unit that transmits a signal to apply an AC voltage to the power supply unit, and that the control unit transmits information regarding plasma generation to the outside via the wireless interface.

[0020] According to the present invention, for example, a user can obtain information regarding plasma generation.

[0021] It is also preferable that the plasma generating unit has a housing that covers the plasma generating unit and is divided into multiple spaces by the dielectric layer, and that the housing has an inlet section through which gas flows into each space and an outlet section through which gas flows out, and that the housing is configured so that gases of different pressures flow into each space.

[0022] According to the present invention, gas treated with a plurality of plasmas at different pressures can be supplied from a single plasma generating unit, i.e., gas treated with plasmas at different pressures can be supplied according to the load of the supply destination. [Effects of the Invention]

[0023] According to the plasma treatment device for an air purifier of the present invention, it is possible to suppress a decrease in the performance of the plasma treatment device in the air purifier. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 2 is a perspective view for explaining a plasma generating unit. [Figure 2] FIG. 2 is a perspective view for explaining a plasma generating unit. [Figure 3] FIG. 2 is a cross-sectional view illustrating a plasma generating unit. [Figure 4] FIG. 10 is a perspective view for explaining a plasma generating unit according to a first modified example. [Figure 5] FIG. 10 is a perspective view for explaining a plasma generating unit according to a second modified example. [Figure 6] FIG. 10 is a perspective view for explaining a plasma generating unit according to a third modified example. [Figure 7] FIG. 10 is a cross-sectional view illustrating a plasma generating unit according to a fourth modified example. [Figure 8] FIG. 10 is a cross-sectional view illustrating a plasma generating unit according to a fifth modified example. [Figure 9]FIG. 13 is a cross-sectional view illustrating a plasma generating unit according to a sixth modified example. [Figure 10] 1 is a cross-sectional view showing an air purifier including a plasma treatment device for an air purifier according to a first embodiment of the present invention. [Figure 11] 1 is a block diagram showing a plasma processing apparatus for an air purifier according to a first embodiment. [Figure 12] 1 is a cross-sectional view showing a plasma processing apparatus for an air purifier according to a first embodiment. [Figure 13] FIG. 10 is a cross-sectional view showing an air purifier including a plasma treatment device for an air purifier according to a second embodiment of the present invention. [Figure 14] FIG. 4 is a cross-sectional view showing a plasma processing apparatus for an air purifier according to a second embodiment of the present invention. [Figure 15] FIG. 10 is a cross-sectional view showing an air purifier including a plasma treatment device for an air purifier according to a third embodiment of the present invention. [Figure 16] FIG. 10 is a cross-sectional view showing a plasma processing apparatus for an air purifier according to a third embodiment of the present invention. [Figure 17] FIG. 10 is a cross-sectional view showing an air purifier including a plasma treatment device for an air purifier according to a fourth embodiment of the present invention. [Figure 18] FIG. 10 is a cross-sectional view showing an air purifier including a plasma treatment device for an air purifier according to a fifth embodiment of the present invention. [Figure 19] FIG. 10 is a cross-sectional view showing an air purifier including a plasma treatment device for an air purifier according to a sixth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0025] Although embodiments of the present invention will be described in detail below, the embodiments of the present invention are not limited to the embodiments described below. Each embodiment and its modified examples can be applied in appropriate combination. Furthermore, directions such as "upper" and "lower" in the description are used for convenience of explanation and do not limit the directions of the present invention. Furthermore, the dimensions, materials, shapes, relative positions, etc. of components described in the embodiments are merely examples, and are not intended to limit the scope of the present invention unless otherwise specified. The sizes and positional relationships of components shown in each drawing may be exaggerated or simplified for clarity. Furthermore, some elements may be omitted to avoid overly complex drawings.

[0026] The plasma processing apparatus for an air purifier of this embodiment has a multilayered plasma generating unit having a dielectric layer, an electrode layer, and a mask layer (optional) for continuous plasma processing of gas, a power supply unit capable of applying an AC voltage between the pair of electrode layers, and a gas flow unit capable of flowing gas through the plasma generating unit. In dielectric barrier discharge, a dielectric layer is provided between two electrode layers, and an AC voltage is applied between the two electrode layers to generate plasma within the dielectric layer sandwiched between the two electrode layers. First, the plasma generating unit will be described.

[0027] <Basic structure of the plasma generation unit> As shown in Figures 1 and 2, the plasma generating unit 10 includes a dielectric layer 11, an upper electrode 12, a lower electrode 13, an upper mask layer 14, and a lower mask layer 15. The plasma generating unit 10 is a thin-film member and is flexible. For convenience, the dielectric layer 11 is expressed as a single dielectric, but it may also be a stack of multiple dielectric layers including one or more air layers. The mask layer is provided to protect the electrodes and improve the assembly of the electrodes, and may be omitted. Furthermore, by appropriately selecting the thickness and position of the mask layer, excessive electric field concentration on the electrodes can be prevented, thereby extending the life of the electrodes.

[0028] As shown in Figures 1 to 3, the dielectric layer 11 is a layered member disposed between the upper electrode 12 and the lower electrode 13. The material of the dielectric layer 11 is an insulating material with a large breakdown voltage so as to prevent discharge between the upper electrode 12 and the lower electrode 13. Furthermore, since the material of the dielectric layer 11 is exposed to the generated plasma, it is preferable that the material be durable against the active substances generated in the plasma. The material of the dielectric layer 11 is preferably a material selected from the group consisting of glass, ceramics, and synthetic resins. "Mainly" means that the component composition is 50% by mass or more (the same applies hereinafter). For convenience, the dielectric layer 11 is shown as a single dielectric, but it may also be a layered structure of multiple dielectrics including air.

[0029] Examples of glass include soda-lime glass (soda glass), borosilicate glass, quartz glass, lead glass, oxide glass, etc. Examples of ceramics include alumina, silica, titanium oxide, zinc oxide, etc. Synthetic resins include thermoplastic resins and thermosetting resins. Examples of thermoplastic resins include general-purpose resins such as polyolefin, polystyrene, polyvinyl acetate, polyurethane, polylactic acid, ABS resin, AS resin, acrylic resin, polyvinyl chloride, and polyvinylidene chloride; engineering plastics such as polyamide, polyacetal, polycarbonate, modified polyphenylene ether, polyester, and cyclic polyolefin; polyphenylene sulfide, polysulfone, polyethersulfone, polyarylate, liquid crystal polymer, polyetheretherketone, polyimide, polyamideimide, polyetherimide, fluorine-based resin, unsaturated polyester resin, and polyurethane resin. Among these synthetic resins, silicone-based resins, polyimide-based resins, and Teflon®-based resins, which have excellent durability, are particularly preferred. The thickness of the dielectric layer 11 is not particularly limited, but is preferably 0.1 mm to 5.0 mm, more preferably 0.1 mm to 3.0 mm, and even more preferably 0.1 mm to 1.0 mm, in order to achieve lightweight and compactness.

[0030] As shown in FIGS. 2 and 3, the upper electrode (electrode layer) 12 and the lower electrode (electrode layer) 13 are layer members disposed on the front and back of the dielectric layer 11. The upper electrode 12 and the lower electrode 13 are each provided with a through-hole 16 penetrating in the thickness direction. In this embodiment, the through-holes 16 are oval in shape, and five through-holes 16 are formed, but the shape and number are not limited. The through-holes 16 may be omitted, but the presence of the through-holes 16 in this embodiment makes it easier to generate plasma and facilitates the creation of a power supply circuit. Furthermore, contact with gas at the through-holes 16 enables plasma processing of the gas.

[0031] The upper electrode (electrode layer) 12 and the lower electrode (electrode layer) 13 are formed of a conductive material, and may be a metal plate (including metal foil), a conductive paint, a conductive polymer, a conductive film, etc. The thickness of the upper electrode 12 and the lower electrode 13 is not particularly limited, but is preferably 5 μm to 1.0 mm, more preferably 5 μm to 0.2 mm, and even more preferably 5 μm to 0.1 mm, respectively, in order to provide a flexible, lightweight, and compact processing device.

[0032] The dielectric layer 11, the upper electrode 12, and the lower electrode 13 may be laminated without using an adhesive, or may be bonded with an adhesive. The adhesive is preferably a material that is durable against active substances generated in plasma. Examples of adhesives include epoxy, acrylic, urethane, phenol, urea, silicone, cyanoacrylate, rubber, and vinyl acetate adhesives. Among these, silicone adhesives and UV-curable epoxy adhesives are preferred from the viewpoint of durability, with polyamide adhesives, polyimide adhesives, and silicone adhesives being more preferred. The thickness of the adhesive is preferably 0.01 to 0.2 mm, and more preferably 0.01 to 0.1 mm.

[0033] As shown in FIG. 3 , the upper mask layer (mask layer) 14 and the lower mask layer (mask layer) 15 are members respectively disposed on the outer sides of the upper electrode 12 and the lower electrode 13. More specifically, the upper mask layer 14 is disposed on the upper surface of the upper electrode 12. The lower mask layer 15 is disposed on the lower surface of the lower electrode 13. The upper mask layer 14 and the lower mask layer 15 are each provided with through holes 17. In this embodiment, the through holes 17 are oval and five are formed, but the shape and number are not limited thereto. The through holes 17 may be omitted, but for ease of manufacture, it is preferable that the through holes 17 are the same as the through holes 16, but this is not limited thereto.

[0034] As shown in Figures 2 and 3, the through holes 17 have the same shape as the through holes 16 and are connected to each other. The through holes 16 and 17 expose the dielectric layer 11 to the outside. In other words, the surface of the dielectric layer 11 is exposed to the outside at multiple locations where the through holes 16 and 17 are formed. In addition, the hole walls (cross-sectional portions) 16a and 17a of the through holes 16 and 17 are also exposed to the outside. Furthermore, the through holes 16 and 17 may be provided on only one side.

[0035] The upper mask layer 14 and the lower mask layer 15 are formed of an insulating material. The hardness of the upper mask layer 14 and the lower mask layer 15 is preferably equal to or less than that of the upper electrode 12 and the lower electrode 13. Although the plasma generation unit 10 can be difficult to handle if it is manufactured using a thin material, providing the upper mask layer 14 and the lower mask layer 15 improves ease of handling. Furthermore, the upper mask layer 14 and the lower mask layer 15 protect the thin conductor from mechanical and physical shocks during manufacturing and use, as well as deterioration caused by the surrounding environment. They also provide mechanical protection from scratches that may occur during manufacturing. Considering that the plasma generation unit 10 will be installed on an object to be attached, the upper mask layer 14 and the lower mask layer 15 preferably have a hardness that allows for easy installation along the object and also improves ease of handling. Furthermore, dividing the dielectric layer 11 into two allows the upper and lower structures of the plasma generation unit 10 to be symmetrical. It can be easily manufactured by assembling the upper and lower layers and bonding them together in the center. In this case, the dielectric layer 11 is divided into three layers: the upper layer, the lower layer, and the adhesive layer, but even in this case, it can be considered as a single dielectric from an electrical standpoint. The thicknesses of the upper mask layer 14 and the lower mask layer 15 are not particularly limited, but in order to provide a flexible, lightweight, and compact processing device, they are preferably 5 μm to 1.0 mm, more preferably 5 μm to 0.2 mm, and even more preferably 5 μm to 0.1 mm. The thicknesses of the upper mask layer 14 and the lower mask layer 15 may be set as appropriate, but in this embodiment they are formed to be larger than the thicknesses of the upper-layer electrode 12 and the lower-layer electrode 13.

[0036] The plasma generating unit 10 is very thin and flexible, which can make it difficult to handle during assembly. Furthermore, the upper electrode 12 and the lower electrode 13 are formed of conductive materials, such as conductive metals or conductive dielectrics. Metals, for example, can be corroded by liquids or gases. For example, the upper electrode 12 and the lower electrode 13 are oxidized by highly oxidizing gases and corroded by sulfuric acid or hydrochloric acid. Furthermore, if the upper electrode 12 and the lower electrode 13 are made of a resin-based conductive material, they may be deteriorated by humidity or acid. Furthermore, the plasma generating unit 10 is designed to be installed according to the shape of the object to which it is to be attached. However, if only the upper electrode 12 and the lower electrode 13 are used without the upper mask layer 14 and the lower mask layer 15, problems can arise, such as wrinkles in the metal constituting the electrodes or gaps between the electrodes and the dielectric layer 11, if the electrodes are made of thin metal. If gaps are formed between the upper layer electrode 12 and the lower layer electrode 13 and the dielectric layer 11, this can cause abnormal discharge or partial discharge. In this regard, according to this embodiment, the upper mask layer 14 and the lower mask layer 15 can protect the upper electrode 12 and the lower electrode 13, and the plasma generating unit 10 can be easily handled, improving workability and assembly. Furthermore, the provision of the upper mask layer 14 and the lower mask layer 15 allows installation on an object without forming wrinkles or gaps. Furthermore, when multiple pairs of electrodes are provided to form a multi-stage structure, the upper mask layer 14 and the lower mask layer 15 also serve as part of the dielectric that constitutes the barrier discharge, making it less likely that abnormal discharge will occur even if gaps are formed during installation. Depending on the situation, the same effect can be achieved with either the upper or lower mask layer.

[0037] The outer edges of upper-layer electrode 12 and lower-layer electrode 13 may be sealed with an insulator (not shown) to prevent deterioration over time due to exposure to the outside world and to prevent discharge from occurring via the outer edges other than through-hole 16. When a resin or the like is used as the mask layer, this effect is achieved because the resin thinly spreads over not only upper-layer electrode 12 and lower-layer electrode 13 but also the upper and lower surfaces of dielectric layer 11. Similarly, the outer edges of the upper mask layer 14 and the lower mask layer 15 may be sealed with an insulator (not shown) to prevent their outer edges from being exposed to the outside world and reacting with external substances to deteriorate over time, and to prevent discharge from occurring through the outer edges other than the through holes 17.

[0038] When the longitudinal direction of the through holes 16, 17 is parallel to the gas flow direction, the resistance to the gas flow is small and the gas flows smoothly. On the other hand, when the longitudinal direction of the through holes 16, 17 is perpendicular to the gas flow direction, the resistance to the gas flow is large, the gas flow is disturbed, and the gas is agitated.

[0039] The shape, number, and orientation of the through-holes 16 and 17 relative to the gas flow can be selected appropriately depending on the purpose of the plasma processing, the effect of the plasma processing, and other factors. The through-holes may have different shapes on the front and back sides of the plasma generating unit 10. Alternatively, through-holes may be provided on the front side of the plasma generating unit 10, while no through-holes are provided on the back side. In this example, the through-holes are shown as rectangles with rounded corners, but this shape is not required. Round, oval, square, or triangular shapes are also acceptable. However, shapes with sharp corners tend to concentrate the electric field, so rounded corners are more appropriate. A similar effect can also be achieved with a structure with larger holes, such as a mesh-like shape. While five holes are shown in the figure, there is no limit to the number. Multiple holes may be arranged vertically or horizontally. Furthermore, holes with company logos or initials, etc., can be provided to expose the plasma generated through the holes, allowing for use as a display. Dividing the electrode into multiple sections, each with a differently shaped hole, and continuously switching between electrodes can function as a dynamic display.

[0040] <First Modification of Plasma Generation Unit> 4 is a perspective view for explaining a plasma generating unit according to a first modified example. The plasma generating unit 10A according to the first modified example differs from the basic structure described above in that it does not have an upper mask layer 14. As in the plasma generating unit according to the first modified example, the mask layer may be provided only on one side of the plasma generating unit 10A.

[0041] <Second Modification of Plasma Generation Unit> FIG. 5 is a perspective view illustrating a plasma generating unit according to a second modified example. The plasma generating unit 10B according to the second modified example differs from the basic structure described above in that it does not include the upper mask layer 14 and the lower mask layer 15. As in the plasma generating unit 10B according to the second modified example, the upper mask layer 14 and the lower mask layer 15 may be omitted. In other words, by configuring the plasma generating unit 10B with only the dielectric layer 11, the upper-layer electrode 12, and the lower-layer electrode 13, it is possible to further reduce the size and the number of parts. Furthermore, when using this plasma generating unit in a process for manufacturing printed circuit boards, semiconductors, etc., process steps can be omitted, thereby reducing product costs.

[0042] Furthermore, as in the first and second modified examples, by omitting either or both of the upper mask layer 14 and the lower mask layer 15, the overall thickness can be reduced and flexibility can be increased, which is convenient when creating an ultra-compact plasma generation device.

[0043] <Third Modification of Plasma Generation Unit> FIG. 6 is a perspective view illustrating a plasma generation unit according to a third modified example. The plasma generation unit 10C according to the third modified example differs from the basic structure described above in that an air layer 18 is provided below the dielectric layer 11C. However, if air is considered a dielectric with a relative dielectric constant of 1 and the combined air and dielectric layer 11C are considered a single dielectric, the plasma generation unit 10C can be considered the same as the basic structure shown in FIG. 2. The composite relative dielectric constant (or dielectric constant) can be calculated from the respective relative dielectric constants (or dielectric constants) and thicknesses. The plasma generation unit 10C according to the third modified example includes a dielectric layer 11C, an upper electrode 12, a lower electrode 13, an upper mask layer 14, a lower mask layer 15, and an air layer 18. The air layer 18 is provided between the dielectric layer 11C and the lower electrode 13. In the third modified example, three surfaces can come into contact with gas: the air layer 18 between the upper electrode 12 and the lower electrode 13, the back surface of the lower electrode 13, and the back surface of the upper electrode 12. The back surface here refers to the surface opposite to the air layer 18. This improves the plasma utilization efficiency compared to when only the air layer 18 is used, and allows for plasma processing of a larger amount of gas.

[0044] <Fourth Modification of Plasma Generation Unit> FIG. 7 is a cross-sectional view illustrating a plasma generation unit according to a fourth modification. The plasma generation unit 10D according to the fourth modification differs from the third modification in that it does not include an upper mask layer 14. In this case, too, a dielectric with a relative permittivity of 1 is considered. Furthermore, if the dielectric layer 11C and the dielectric layer 11C are considered as a single dielectric, the composite dielectric portion in this structure can be considered to be the same as the dielectric shown in FIG. 2 for the basic structure. The composite relative permittivity (or dielectric constant) can be calculated from the thickness and dielectric constant of the dielectric layer 11C and the thickness and dielectric constant of the air layer 18 (or the dielectric constant of air if air is permeable). The plasma generation unit 10D includes the dielectric layer 11C, the upper electrode 12, the lower electrode 13, the lower mask layer 15, and the air layer 18. As in the fourth modification, the upper mask layer may be omitted while providing the air layer 18 between the dielectric layer 11C and the lower electrode 13. This configuration can achieve substantially the same effects as the third modification while reducing the number of components. Furthermore, when the plasma generating unit is produced using the processes for printed circuit boards or semiconductor ICs, the process steps can be omitted, thereby reducing costs.

[0045] <Fifth Modification of Plasma Generation Unit> FIG. 8 is a cross-sectional view illustrating a plasma generating unit according to a fifth modification. The plasma generating unit 10E according to the fifth modification differs from the third modification in that it does not include the upper mask layer 14 and the lower mask layer 15. The plasma generating unit 10E also includes a dielectric layer 11Cb on the lower surface of the lower electrode 13. The plasma generating unit 10E includes dielectric layers 11Ca and 11Cb, an upper electrode 12, and a lower electrode 13. The dielectric layer 11Cb on the lower surface of the lower electrode 13 is used to support the lower electrode 13. As in the fifth modification, the upper and lower mask layers may be omitted while providing an air layer 18 between the dielectric layer 11Ca and the lower electrode 13. This configuration achieves substantially the same effects as the third modification while reducing the number of components. This reduces the thickness of the electrodes. Furthermore, when fabricating this plasma generating unit using a printed circuit board or semiconductor IC process, it eliminates process steps, thereby reducing costs. Furthermore, the reduced material thickness improves flexibility.

[0046] The upper dielectric layer 11Ca and the air layer 18 function as a single dielectric. This dielectric constant can be calculated from the relative permittivity (or dielectric constant) and thickness of the upper dielectric layer 11Ca, and, if air is used as the gas, the relative permittivity (or dielectric constant) of the air and the thickness of the air layer 18. The lower dielectric layer 11Cb plays almost no role in plasma generation. However, this structure allows the same material to be used for the upper electrode 12 and the lower electrode 13. This reduces manufacturing costs.

[0047] <Sixth Modification of Plasma Generation Unit> 9 is a cross-sectional view for explaining a plasma generating unit according to the sixth modified example. The plasma generating unit 10F according to the sixth modified example includes, from top to bottom, an air layer 18, an upper electrode 12, a dielectric layer 11Ca, an air layer 18, a lower electrode 13, a dielectric layer 11Cb, an air layer 18, an upper electrode 12, a dielectric layer 11Ca, an air layer 18, a lower electrode 13, and a dielectric layer 11Cb. In other words, it is configured by stacking two plasma generating units 10E according to the fifth modified example in the height direction. The ends of the dielectric layers 11Ca and 11Cb are supported by a box-shaped housing 21F.

[0048] Inside the housing 21F, basic units in which an upper-layer electrode 12 is laminated only on one side (top surface) of a dielectric layer 11Ca and basic units in which a lower-layer electrode 13 is laminated only on one side (top surface) of a dielectric layer 11Cb are alternately arranged with an air layer (gas inlet layer) 18 between them. As a result, electrodes of opposite polarity are alternately laminated, but if a space in which plasma is not generated is desired, the electrodes do not need to be alternately arranged. By designing a space in which plasma is not generated in this way, it is possible to place a sensor, wiring, or other circuits between them. An air layer 18 is formed between each of the electrode layers adjacent in the vertical direction.

[0049] According to this modification, the plasma generating section 10F can be easily formed simply by stacking basic units each consisting of a dielectric layer and an electrode layer (upper electrode 12 or lower electrode 13) at intervals. Furthermore, since plasma can be generated in multiple air layers 18, plasma can be generated efficiently in a small space. Furthermore, since no separate components such as spacers are required to space the basic units, multi-stage construction is easily possible, reducing manufacturing costs and shortening development time. In this way, the number of stacked electrodes can be freely changed, which has the advantage of allowing the amount of contact between plasma and gas to be controlled and devices with different capacities to be easily constructed.

[0050] The functions achieved by treating gas with plasma include sterilization, virus inactivation, deodorization, surface modification, and decomposition of chemical substances.The mechanism by which these functions are achieved is thought to be that plasma treatment generates active species in the gas, such as singlet oxygen, hydrogen peroxide, OH radicals, superoxide anions, peroxide radicals, and ozone, which kill target microorganisms and decompose and modify chemical substances through oxidation reactions.Microorganisms include various bacteria, viruses, and mold.

[0051] The plasma-treated gas is sterilized and deodorized by killing microorganisms present in the gas and decomposing chemical substances due to the activated species generated by the plasma. Furthermore, active species remain in the plasma-treated gas, so by spraying the plasma-treated gas generated by the plasma treatment apparatus of this embodiment onto an object, microorganisms present in the object are killed and chemical substances are decomposed, thereby sterilizing and deodorizing the object.

[0052] First Embodiment Next, a plasma processing apparatus for an air purifier according to a first embodiment of the present invention will be described. As shown in Figures 10 to 12, the plasma processing apparatus for an air purifier 100 according to this embodiment is provided in an air purifier 200. The arrows in the figures indicate the direction of gas flow. The air purifier 200 includes a filter 201 and a blower 202.

[0053] The filter 201 captures dust, dirt, bacteria, etc. in the gas (air) that has flowed into the air purifier 200, and purifies the gas that has flowed into the air purifier 200. The filter 201 is disposed between the gas inlet chamber 210 and the gas processing chamber 220 of the air purifier 200.

[0054] The blower 202 supplies gas to the air purifier 200 and exhausts plasma-treated gas from the air purifier 200. Any known device can be appropriately selected and used. As a driving device for moving the gas, a centrifugal blower (such as a sirocco fan, a radial fan, or a turbo fan), an axial flow blower (such as a propeller fan), a mixed flow blower (such as a line fan), a cross flow blower, a blower, a compressor, or an air pump can be appropriately used. The blower 202 may be operated or stopped, or the blowing volume or gas discharge pressure may be controlled based on a control signal from the control unit 60 of the plasma processing apparatus 100 for an air purifier. Alternatively, the blower 202 may be controlled separately from the operation of the plasma processing apparatus 100 for an air purifier. The blower 202 is disposed between the gas processing chamber 220 and the gas exhaust chamber 230 of the air purifier 200.

[0055] In the air purifier 200, gas flows into the gas inlet chamber 210 from the gas inlet port 211 when the blower 202 is operated. The air that has flowed into the gas inlet chamber 210 has dust, dirt, bacteria, etc. removed by the filter 201, and then flows into the gas processing chamber 220. The gas that has flowed into the gas processing chamber 220 passes through the blower 202 and enters the gas discharge chamber 230, and is then discharged to the outside of the air purifier 200. Meanwhile, air that has been treated with plasma by the plasma treatment device 100 for an air purifier flows into the gas processing chamber 220.

[0056] As shown in Figures 10 and 11, the plasma processing apparatus 100 for an air purifier includes a plasma generating unit 10, a gas flow unit 20, a power supply unit 30, a sensor 40, a wireless interface 50, and a control unit 60. The plasma generating unit 10 of this embodiment has the same basic structure as the plasma generating unit described above, but various modified examples of the plasma generating unit may also be used. One or more plasma generating units 10 may be installed.

[0057] The gas flow unit 20 flows gas into the plasma generating unit 10 to treat the gas with plasma, and supplies the gas treated with plasma into the air purifier 200. As shown in Fig. 12, the gas flow unit 20 includes a housing 21, an inlet tube (inlet section) 22, an outlet tube (outlet section) 23, and a blower 24. The housing 21 is a box-shaped body that covers the plasma generating unit 10.

[0058] The housing 21 is detachably attached to the side of the air purifier 200. The inlet tube 22 is a flexible cylindrical body that connects the blower 24 and the housing 21. The outlet tube 23 is a flexible cylindrical body that connects the housing 21 and the air purifier 200. The tip of the outlet tube 23 is installed in the gas processing chamber 220 inside the air purifier 200. The inlet tube 22 may have any other form as long as it functions as an inlet portion that can supply gas to the plasma generating unit 10. In addition, the outlet tube 23 may have any other form as long as it functions as an outlet portion that discharges the gas that has been treated with plasma in the plasma generating unit 10.

[0059] The blower 24 supplies air to the plasma generating unit 10 and supplies plasma-treated gas to the gas processing chamber 220 of the air purifier 200. Any known device can be appropriately selected and used. The driving device for moving the gas may be a centrifugal blower (such as a sirocco fan, radial fan, or turbo fan), an axial flow blower (such as a propeller fan), a mixed flow blower (such as a line fan), a cross flow blower, a blower, a compressor, or an air pump. The blower 24 operates or stops, or controls the airflow or gas discharge pressure, based on a control signal from the control unit 60. Alternatively, the blower 24 may be replaced by an inlet tube 22 connected to the outlet of a pressurized air hose, for example, to deliver the gas. In this case, the blower 24 is unnecessary.

[0060] The power supply unit 30 applies an AC voltage between the upper electrode 12 and the lower electrode 13, which face each other with the dielectric layer 11 sandwiched therebetween. The power supply unit 30 is connected to, for example, a power connector 31. There are no particular limitations on the power supply unit 30 as long as it can apply an AC voltage of a predetermined voltage at a predetermined frequency to each electrode of the plasma generation unit 10, and any known power supply device can be used. The frequency of the AC voltage is preferably 50 Hz to 30 MHz, and more preferably 50 Hz to 100 kHz. The AC voltage is preferably 0.1 to 50 kV, and more preferably 0.2 to 10 kV.

[0061] The sensor 40 is a sensor that detects the generation state of gas treated by plasma inside the air purifier 200, and is a sensor module that includes sensors for temperature, humidity, light, infrared rays, ozone, PM2.5, CO2, etc. The measurement results are sent to the control unit 60. The sensor 40 is installed inside the air purifier 200, in this case, in the gas treatment chamber 220. Through these sensors, the amount of plasma generation, etc. is determined according to pre-programmed requirements, and the plasma output and air volume are controlled. As part of the sensor 40, there is a sensor that estimates the amount of activated species by referencing the values ​​of an ozone sensor to acquire information such as temperature, humidity, the power and voltage supplied to the plasma generating unit 10, and the plasma emission intensity. The ozone sensor measures the amount of ozone in the air purifier 200. For example, when plasma-treating air, the oxygen concentration in the air remains almost constant, and ozone is generated as a by-product of the plasma-treating oxygen. However, by using the ozone sensor and information such as humidity, temperature, and plasma intensity, the amount of activated species resulting from the plasma treatment can be estimated. The measurement results (detection results) are transmitted to the control unit 60. The plasma intensity can be estimated from the power supplied to the plasma generating unit 10, or, if the shape of the plasma generating unit 10 is constant, from the voltage. Alternatively, the plasma intensity can be measured directly using a photosensor. If the oxygen concentration varies significantly, an oxygen sensor can be added.

[0062] The wireless interface 50 is a component that wirelessly provides information to a mobile terminal device, a terminal device, etc. The control unit 60 transmits information related to plasma generation to the wireless interface 50. The information related to plasma generation includes, for example, the number of plasma occurrences, the amount of plasma generated (plasma density), the plasma strength, the voltage, current, or amount of power, the operating time, the temperature of the power supply unit or controller, the plasma generation unit, humidity, information related to the fan or pump, error information, etc. The wireless interface 50 can use, for example, Bluetooth (registered trademark), Wi-Fi, NFC (Near Field Communication), an induction coil, an optical sensor, etc. The mobile terminal device can use, for example, a smartphone, a mobile phone, etc. The terminal device can use, for example, a personal computer or a tablet.

[0063] The control unit 60 is a part that controls each part of the air purifier plasma processing apparatus 100 by sending control signals to them. The control unit 60 is installed in the housing 21. The control unit 60 includes at least a calculation unit (central processing unit) and a memory unit. The control unit 60 is connected to the power connector 31 via a control unit power supply 61. The control unit power supply 61 is a part that generates and supplies the power required for the operation of the control unit 60. The control unit 60 sends a control signal to the power supply unit 30 via a high-voltage control unit (not shown) provided within the control unit 60, thereby applying an AC voltage to each electrode layer (upper electrode 12 and lower electrode 13). In addition, the control unit 60 sends a control signal to the air blower 24 in accordance with the application of the AC voltage, thereby circulating air through the plasma generation unit 10.

[0064] In this embodiment, the control unit 60 sends a control signal to the air blower 24 to operate it, but the control unit 60 may not be configured to send a control signal to the air blower 24, but may be configured to operate the air blower 24 separately when the air purifier 200 is in operation. Also, in this embodiment, the plasma processing device 100 for an air purifier may be operated by turning on the power of the air purifier 200, or the operation of the air purifier 200 and the operation of the plasma processing device 100 for an air purifier may be controlled separately.

[0065] The control unit 60 may also include a timer unit (not shown) that measures the date and time. The timing at which the control unit 60 applies the AC voltage can be set as appropriate. For example, the control unit 60 may be provided with a timer unit that measures time, and plasma may be generated at a desired time period, or may be operated by a predetermined operation, or may be operated continuously. The timer unit may also generate plasma by relating the time to information from the sensor 40.

[0066] Next, the effects of this embodiment will be described. The control unit 60 sends a control signal to the power supply unit 30 to apply an AC voltage, and operates the blower 24 or controls the amount of air blown. As a result, gas flows through the inlet tube 22, the housing 21, and the outlet tube 23, and the gas is treated with plasma in the plasma generating unit 10, and the plasma-treated gas is supplied into the air purifier 200. This allows the inside of the air purifier 200 to be efficiently sterilized, reducing various types of bacteria, viruses, mold, etc.

[0067] In conventional air purifiers equipped with a plasma processing device, the plasma processing device is disposed within the air purifier. Such conventional air purifiers utilize the flow of air taken into the air purifier and passed through a filter to discharge plasma-treated gas. However, in such air purifiers, if dust or fine particles adhere to the filter, the air flow through the filter becomes poor or the filter becomes clogged, reducing the amount of gas supplied to the plasma processing device and degrading the performance of the plasma processing device. Since the plasma processing device 100 for an air purifier of this embodiment is disposed outside the air purifier 200, the gas processing capacity using plasma is not affected by the state of the filter 201 of the air purifier 200. Therefore, even if the air flow through the filter 201 becomes poor or the filter 201 becomes clogged, the performance of the plasma processing device 100 for an air purifier does not deteriorate, and plasma-treated gas can be stably generated.

[0068] Furthermore, by using the sensor 40, it is possible to detect the temperature, humidity, ozone concentration, and the like inside the air purifier 200. Furthermore, when generating gas treated with plasma as in this embodiment, ozone is generated as a by-product because oxygen is processed with plasma. By using an ozone sensor as the sensor 40, it is possible to estimate the amount of plasma-treated active species from the ozone concentration, which is a by-product when generating gas treated with plasma, as well as humidity, plasma power, temperature, and the like. Furthermore, it is possible to control the capacity of the plasma processing, and start or stop operation based on these measurement results. Furthermore, if the measurement results of the sensor 40 show that the calculated active ingredient continues to decrease, the calculated active ingredient remains decreased, or abnormal fluctuations in the calculated active ingredient are detected, it can detect that there is some kind of malfunction and send an error signal, or it can send error information to the user's mobile terminal device, etc. via the wireless interface 50.

[0069] Furthermore, since the system is equipped with a wireless interface 50, information regarding plasma generation can be transmitted to, for example, the user's mobile terminal device. This allows the user to understand the status of plasma generation. Furthermore, the control unit 60 can calculate the electricity charge from the amount of electricity, and this information can also be provided to the user.

[0070] Second Embodiment Next, a plasma processing apparatus for an air purifier according to a second embodiment of the present invention will be described.

[0071] 13 and 14, the plasma processing apparatus 100A for an air purifier differs from the first embodiment in that a plurality of spaces are provided within the housing 21A, allowing gases of different pressures to be extracted. The plasma processing apparatus 100A for an air purifier also differs from the first embodiment in that the gas flow unit 20A includes the housing 21A, inlet tubes (inlet sections) 22A, 22B, and 22C, outlet tubes (outlet sections) 23A, 23B, and 23C, and blowers 24A, 24B, and 24C. The following description of this embodiment will focus on the differences from the first embodiment.

[0072] Inflow tubes 22A, 22B, 22C are flexible cylindrical bodies that connect blowers 24A, 24B, 24C to housing 21A. Outflow tubes 23A, 23B are flexible cylindrical bodies that extend to the outside of air purifier 200. Outflow tube 23C is a flexible cylindrical body that connects housing 21A to air purifier 200. Each inflow tube 22A, 22B, 22C is connected to each blower 24A, 24B, 24C. The tip of outflow tube 23A is located outside air purifier 200, near the periphery of air purifier 200, above air purifier 200 in this example. The tip of outflow tube 23B is located outside air purifier 200, near the lateral side of air purifier 200 in this example. The tip of the outlet tube 23C is located within the gas processing chamber 220 of the air purifier 200. The inlet tubes 22A, 22B, and 22C may have other configurations as long as they function as inlet sections capable of supplying gas to the plasma generating section. The outlet tubes 23A, 23B, and 23C may also have other configurations as long as they function as outlet sections for discharging gas treated by plasma in the plasma generating section. Each of the blowers 24A, 24B, and 24C can deliver gas at different wind speeds (wind pressures). Instead of the blowers 24A, 24B, and 24C, the inlet tubes 22A, 22B, and 22C may be connected to the outlets of pressurized air hoses, for example, to deliver gas. In this case, the blowers 24A, 24B, and 24C are unnecessary.

[0073] The housing 21A includes a dielectric layer 11Aa and a dielectric layer 11Ab, which divide the housing 21A into three spaces: a first space 71, a second space 72, and a third space 73. An upper electrode 12 is provided on the upper surface of the dielectric layer 11Aa, and a lower electrode 13 is provided on the lower surface of the dielectric layer 11Ab. The upper electrode 12 and the lower electrode 13 are electrically connected to a power supply unit 30. The upper electrode 12, the lower electrode 13, the dielectric layer 11Aa, the dielectric layer 11Ab, and the second space 72 (air layer) constitute a "plasma generation unit." By applying an AC voltage to the upper electrode 12 and the lower electrode 13, gas flowing through the first space 71, the second space 72, and the third space 73 can be treated with plasma. The upper electrode 12 and the lower electrode 13 may have holes or a structure with larger holes (e.g., a mesh-like structure) as needed. Furthermore, a mask layer may be provided on the upper layer electrode 12 and the lower layer electrode 13 to protect the electrodes.

[0074] In the first space 71, gas flows in through inlet tube (inlet portion) 22A, and the gas treated with plasma is taken out through outlet tube (outlet portion) 23A. In the second space 72, gas flows in through inlet tube (inlet portion) 22B, and the gas treated with plasma is taken out through outlet tube (outlet portion) 23B. In the third space 73, gas flows in through inlet tube (inlet portion) 22C, and the gas treated with plasma is taken out through outlet tube (outlet portion) 23C.

[0075] Because the plasma-treated gas extracted from each space has a different pressure (air pressure), the supply destination of the plasma-treated gas can be selected depending on the air pressure. For example, since a high pressure is required to send air to a large space within the air purifier 200, the gas treated with the plasma at the highest pressure is supplied to the gas processing chamber 220. Alternatively, the gas treated with the plasma at the next highest pressure may be supplied to the periphery of the air purifier 200, in this case, to the side of the air purifier 200, and the gas treated with the plasma at the lowest pressure may be supplied to the periphery of the air purifier 200, in this case, above the air purifier 200. However, the location to which the gas treated with the plasma at each pressure is supplied may be appropriately adjusted depending on the specifications of the air purifier 200. For example, the tip of the outlet tube 23A may be positioned to the side of the air purifier 200A, and the tip of the outlet tube 23B may be positioned above the air purifier 200. Alternatively, the tip of the outflow tube 23A or the tip of the outflow tube 23B may be positioned in the gas discharge chamber 230 of the air purifier 200.

[0076] Next, the effects of this embodiment will be described, focusing on the differences from the first embodiment.

[0077] According to this embodiment, the gas flow unit 20A can extract gas treated with plasma at a plurality of different pressures (atmospheric pressures) from one plasma generating unit. This allows gas treated with plasma to be efficiently supplied even when the pressure loads of the supply destinations are different, such as the gas processing chamber 220 of the air purifier 200, the side of the air purifier 200, or above the air purifier 200. Furthermore, by supplying gas treated with plasma to the periphery of the air purifier 200, the gas in the periphery of the air purifier 200 can be sterilized, thereby further enhancing the sterilization effect. Note that although three spaces are provided in this embodiment, two, four, or more spaces may be provided.

[0078] The gas load varies depending on the conditions of the supply destination. For example, sending gas to a large space inside the air purifier 200 requires a higher pressure than sending gas into the atmosphere. In such a case, if plasma generating units are provided for different air pressures, each unit would require a high-voltage power supply, pump, and blower, which would increase costs and require more installation space. According to this embodiment, the pressure can be changed for each space, so a single plasma generating unit can distribute gas evenly to multiple different pressure loads.

[0079] Furthermore, according to this embodiment, each space is provided with an inlet tube (inlet section) and an outlet tube (outlet section), and the three spaces are independent of each other. Therefore, even if there is a malfunction in one space, the device can maintain its function as long as the path through the other spaces is still valid. If the device were to operate with only one plasma space, a problem in that space would cause the entire device to lose its function. In contrast, this embodiment can improve the reliability of the device.

[0080] In addition, as in this embodiment, the plasma generating unit may be configured such that a pair of electrode layers are provided on the upper and lower surfaces of a dielectric layer as in the basic structure described above, or such that an air layer (space) is provided between the pair of electrode layers via a dielectric layer as in this embodiment. Even in the latter case, plasma can be generated. Furthermore, the pressure (atmospheric pressure) of the gas treated by the plasma sent to each space need only be different from that of the other spaces in at least one location, and does not have to be different everywhere. Alternatively, the pressure (atmospheric pressure) of the gas treated by the plasma sent to each space may all be the same.

[0081] Third Embodiment Next, a plasma processing apparatus for an air purifier according to a third embodiment of the present invention will be described.

[0082] 15 and 16, in the plasma processing apparatus 100B for an air purifier, the gas flow section 20B is different from the second embodiment in that it includes a housing 21B, inlet tubes (inlet sections) 22Aa, 22Ba, and 22Ca, outlet tubes (outlet sections) 23A, 23B, and 23C, inlet tubes (inlet sections) 26, inlet tubes (inlet sections) 27, and a blower 24. In this embodiment, the differences from the second embodiment will be mainly described.

[0083] The inflow tubes 22Aa, 22Ba, and 22Ca have their respective ends connected to the inflow tube 26 on the side opposite the housing 21B, and the inflow tube 26 is connected to the inflow tube 27. The inflow tube 26 is a flexible cylindrical body that connects the inflow tubes 22Aa, 22Ba, and 22Ca to the inflow tube 27. The inflow tube 27 is a flexible cylindrical body that connects the inflow tube 26 to the blower 24. The end of the inflow tube 27 is connected to the blower 24. The inflow tubes 26 and 27 may have other shapes as long as they function as inflow sections that can supply gas to the inflow tubes 22Aa, 22Ba, and 22Ca. The inflow tube 22Ba is thinner (has a smaller diameter) than the inflow tube 22Ca, and the inflow tube 22Aa is thinner (has a smaller diameter) than the inflow tube 22Ba. However, the relationship between the thicknesses (diameters) of the inflow tubes 22Aa, 22Ba, and 22Ca may be adjusted as appropriate depending on the specifications of the air purifier 200 and the like.

[0084] Next, the effects of this embodiment will be described, focusing on the differences from the second embodiment.

[0085] According to this embodiment, by changing the thickness (diameter) of each of the inflow tubes 22Aa, 22Ba, 22Ca, it is possible to adjust the flow rate of gas flowing into the first space 71, the second space 72, and the third space 73, and it is possible to supply gas treated by plasma with a pressure difference. This eliminates the need to connect a blower to each of the inflow tubes 22Aa, 22Ba, 22Ca, and it is possible to make the pressure (air pressure) of each of the first space 71, the second space 72, and the third space 73 different using a single blower. Therefore, it is possible to reduce the number of installed blowers and thereby reduce equipment costs.

[0086] <Fourth embodiment> Next, a plasma processing apparatus for an air purifier according to a fourth embodiment of the present invention will be described.

[0087] 17, the plasma processing apparatus 100C for an air purifier differs from the third embodiment in that the gas flow unit 20C has a humidifier 25, and the gas flows into the plasma generating unit through the humidifier 25. The plasma processing apparatus 100C for an air purifier also differs from the third embodiment in that it does not have a blower 24. In this embodiment, the differences from the third embodiment will be mainly described.

[0088] The plasma processing apparatus 100C for an air cleaner uses gas supplied by an air system of a factory or the like instead of the air blower 24. The humidifier 25 is a device that humidifies the gas to be supplied to the plasma generation unit. An inlet tube 28 is connected to the humidifier 25, and the humidifier 25 humidifies the gas supplied from the inlet tube 28. The inlet tube 28 is a flexible cylindrical body that connects the humidifier 25 to an air system such as a factory. The inlet tube 28 may have any other form as long as it functions as an inlet that can supply gas to the humidifier 25. The tip of the inlet tube 27 is disposed inside the humidifier 25, and the humidified gas is supplied to the plasma generation unit through the inlet tube 27. As the humidifier 25, any known device can be appropriately selected and used.

[0089] The humidifier 25 can receive power from the power supply unit 30 of the plasma processing apparatus 100C for an air purifier. Alternatively, the humidifier 25 may receive power from, for example, an electrical power facility of an air system in a factory or the like. The humidifier 25 may be driven as needed. For example, the humidifier 25 may be driven under preset conditions. For example, a humidity sensor that detects humidity may be disposed inside the air purifier 200, and the humidifier 25 may be driven based on the measurement results (detection results) of the humidity sensor.

[0090] Next, the effects of this embodiment will be described, focusing on the differences from the third embodiment.

[0091] According to this embodiment, the gas supplied to the plasma generating unit of the plasma processing apparatus 100C for an air purifier can be humidified. The gas in air systems used in factories and the like is often dry. According to this embodiment, the humidifier 25 can maintain the gas supplied from the air system at an appropriate humidity. This makes it easier to process the gas with plasma. In addition, the gas discharged from the plasma processing apparatus 100C for an air purifier can be humidified, which can reduce, for example, bacteria, viruses, and mold in and around the air purifier 200.

[0092] Fifth Embodiment Next, a plasma processing apparatus for an air purifier according to a fifth embodiment of the present invention will be described.

[0093] 18, in the plasma processing apparatus 100D for an air purifier, the gas flow unit 20D is different from the third embodiment in that it includes a housing 21C, inlet tubes (inlet portions) 22Aa and 22Ca, outlet tubes (outlet portions) 23A and 23C, inlet tube (inlet portion) 26, inlet tube (inlet portion) 27, and a blower 24. The present embodiment is also different from the third embodiment in that the tip of outlet tube 23A is located to the side of the air purifier 200. In this embodiment, the differences from the third embodiment will be mainly described.

[0094] The plasma processing apparatus 100D for an air purifier supplies gas treated with plasma using two of the three spaces in the housing 21C. Here, the inlet tube 22Ba and the outlet tube 23B are not connected to the second space 72 (see FIG. 16). Alternatively, the gas treated with plasma may be supplied using one of the three spaces in the housing 21C. Furthermore, for example, the inlet tube and the outlet tube may be detachable, and the location of the space used for plasma processing may be adjusted as needed. Furthermore, the position of the tip of the outlet tube may be adjusted as needed. In this embodiment, the gas flow section having three spaces in the housing 21C is used as an example, but a gas flow section having two spaces may also be used.

[0095] Sixth Embodiment Next, a plasma processing apparatus for an air purifier according to a sixth embodiment of the present invention will be described.

[0096] 19, the plasma processing apparatus 100E for an air purifier differs from the fifth embodiment in that the gas flow unit 20E has a humidifier 25, and gas is passed through the humidifier 25 to the plasma generation unit. The plasma processing apparatus 100E for an air purifier also differs from the fifth embodiment in that it does not have the air blower 24. As in the fourth embodiment, the plasma processing apparatus for an air purifier according to the fifth embodiment may be provided with the humidifier 25, or gas supplied by an air system such as a factory may be used instead of the air blower 24.

[0097] Although the embodiments of the present invention have been described above, appropriate design changes are possible within the scope of the present invention. For example, the control unit 60 may be provided with an input unit (such as a touch panel) and a display unit (monitor). For example, plasma may be generated based on instructions input from the input unit. Furthermore, information related to plasma generation, the amount of electricity, etc. may be displayed on the display unit. In the second embodiment, air blowers with different air speeds (air pressures) are provided for the first space 71, the second space 72, and the third space 73, respectively, so that the pressure (air pressure) in each space is different, but for example, a single air blower may be used, and valves may be provided in the air flow paths through which the pressure in each space may be adjusted by the valves. This reduces the number of installed air blowers, thereby lowering equipment costs.

[0098] Furthermore, in the first embodiment, the gas treated by plasma is supplied to the gas treatment chamber 220 of the air purifier 200, but it may be supplied to the periphery of the air purifier 200. Furthermore, in the second to fourth embodiments, gases of different pressures are supplied to the gas treatment chamber 220 of the air purifier 200, the side of the air purifier 200, and above the air purifier 200, but it may be supplied to any one or two of these locations. Furthermore, in the fourth and sixth embodiments, gas from an air system in a factory or the like is used instead of a blower, but it is also possible to supply gas to the humidifier 25 using a blower.

[0099] Furthermore, for example, the plasma treatment device for an air purifier may be provided with a sensor for detecting the concentration of fine particles in the air purifier, or a sensor for detecting temperature, humidity, etc., in addition to the ozone sensor. If other devices are present in the air purifier, their control terminals can be connected to the control unit of the plasma treatment device for an air purifier to enable them to operate in coordination with each other. For example, a dust filter may be provided at the air intake of the blower, if necessary. [Explanation of symbols]

[0100] 10 Plasma generation unit 11 Dielectric layer 12 Upper layer electrode (electrode layer) 13 Lower electrode (electrode layer) 14 Upper mask layer (mask layer) 15 Lower mask layer (mask layer) 20 Gas flow section 21. Cabinet 22 Inlet tube (inlet section) 23 Outlet tube (outlet section) 24 Blower 25 Humidifier 26 Inlet tube (inlet section) 27 Inlet tube (inlet section) 28 Inlet tube (inlet section) 30 Power supply section 40 sensors 50 Wireless Interface 60 Control Unit 100 Plasma treatment device for air purifier 200 Air Purifier

Claims

1. A plasma treatment device for an air purifier that is arranged outside the air purifier, a plasma generating unit that generates plasma and includes at least a dielectric layer and a pair of electrode layers provided on both sides of the dielectric layer; a power supply unit that applies an AC voltage to the pair of electrode layers; A plasma treatment device for an air purifier, comprising: a gas flow unit that flows a gas into the plasma generating unit to treat the gas with plasma, and supplies the gas that has been treated with plasma.

2. The plasma treatment device for an air purifier according to claim 1 , wherein the gas flow unit supplies the gas treated with plasma into the air purifier.

3. The plasma treatment device for an air purifier according to claim 1 , wherein the gas flow unit supplies the gas treated with plasma to the outside of the air purifier.

4. The plasma processing apparatus for an air purifier according to claim 1, wherein the gas flow unit has a humidifier, and the gas flows to the plasma generating unit through the humidifier.

5. a sensor for detecting the plasma; 2. The plasma processing apparatus for an air purifier according to claim 1, further comprising: a control unit that receives a detection result from the sensor and transmits a signal to apply an AC voltage to the power supply unit based on the detection result.

6. 2. The plasma processing apparatus for an air cleaner according to claim 1, further comprising a control unit that transmits a signal to apply an AC voltage to the power supply unit based on a timer unit that measures time.

7. a wireless interface for providing information to a terminal device; a control unit that transmits a signal to apply an AC voltage to the power supply unit, The plasma processing apparatus for an air purifier according to claim 1 , wherein the control unit transmits information about plasma generation to an external device via the wireless interface.

8. a housing that covers the plasma generating unit and is divided into a plurality of spaces by the dielectric layer; 2. The plasma processing apparatus for an air purifier according to claim 1, wherein the housing is provided with an inlet portion through which gas flows into each of the spaces and an outlet portion through which gas flows out, and is configured so that gases of different pressures flow into each of the spaces.

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