Imaging device

Abstract

This allows for smooth tilting of the image sensor while suppressing an increase in size. [Solution] The image sensor plate 402 has an opening 411 and is provided parallel to the imaging substrate 220. Drive motors 150 and 151 tilt the image sensor 121. Image sensor FPCs 202a and 202b connect the connector on the back of the imaging substrate 220 to the connector on the front of the main substrate 180. The image sensor FPCs 202a and 202b are connected in the non-mounted area 205 near the optical axis on the side (-Z side) of the imaging substrate 220 opposite to the mounting surface of the image sensor 121, and are pulled out through the opening 411.

Description

Technical Field

[0001] The present invention relates to an imaging device.

Background Art

[0002] Conventionally, in imaging devices such as digital cameras, in-vehicle cameras, and surveillance cameras, a configuration has been proposed in which an imaging element is tilted (tilt-driven) to perform so-called panning shooting.

[0003] For example, Patent Document 1 discloses a configuration in which a flexible printed wiring board (hereinafter referred to as FPC) is drawn out outside an imaging element sensor, the repulsive force of the FPC is reduced, and the imaging element is tilted around a rotation axis.

[0004] Patent Document 2 mentions the routing of an FPC of an imaging element that is movable in the imaging plane direction. Patent Document 2 enables improvement of the response characteristics of the driving of a movable member while reducing the power required for driving the movable member.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, the technology disclosed in Patent Document 1 involves a configuration in which the FPC is routed extensively outside the drive unit and camera unit, resulting in a large imaging device. On the other hand, the technology disclosed in Patent Document 2 involves an image sensor FPC that is movable in the direction of the imaging plane, but it is not configured to tilt the image sensor. If a configuration to tilt the image sensor were adopted, the increased repulsive force of the FPC during tilting may make it difficult to smoothly tilt the image sensor.

[0007] The present invention aims to enable smooth tilting of the image sensor while suppressing an increase in size. [Means for solving the problem]

[0008] To achieve the above objective, the imaging apparatus of the present invention comprises an image sensor, an imaging substrate on which the image sensor is mounted, a driving means for tilting the image sensor, a first flexible substrate connected to the imaging substrate, a second flexible substrate connected to the imaging substrate, and an image sensor plate having a through hole and provided parallel to the imaging substrate, wherein a non-mounted area is provided on the surface of the imaging substrate opposite to the surface on which the image sensor is mounted, in a region including the imaging optical axis, and the first flexible substrate and the second flexible substrate are connected to the imaging substrate in the non-mounted area and are also pulled out through the through hole. [Effects of the Invention]

[0009] According to the present invention, it is possible to enable smooth tilting of the image sensor while suppressing an increase in size. [Brief explanation of the drawing]

[0010] [Figure 1] This is a perspective view of the imaging device. [Figure 2] This block diagram shows the main electrical configuration of the imaging device system. [Figure 3] This is a rear perspective view showing the camera body with the outer cover unit removed. [Figure 4] It is a rear perspective view showing the state where the exterior cover unit is removed from the camera body. [Figure 5] It is a partial rear exploded perspective view of the camera body. [Figure 6] It is a front exploded perspective view of the imaging unit and the base plate. [Figure 7] It is a rear exploded perspective view of the imaging unit and the base plate. [Figure 8] It is a cross-sectional view of the imaging unit and the base plate by the YZ cross-section. [Figure 9] It is a bottom view of the imaging unit and the base plate. [Figure 10] It is a view of the imaging unit and the base plate seen from the +Z side. [Figure 11] ) It is a view of the base plate seen from the +Z side and a schematic diagram showing the rotational center and each positional relationship seen from the Z direction. [Figure 12] It is a rear exploded perspective view of the imaging unit and the base plate. [Figure 13] It is a perspective view showing the internal structure of the imaging device. [Figure 14] It is an exploded perspective view showing the internal structure of the imaging device.

MODE FOR CARRYING OUT THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0012] (First Embodiment) FIGS. 1(a) and (b) are external perspective views of an imaging device according to the first embodiment of the present invention.

[0013] Hereinafter, the directions of each part will be referred to based on the X, Y, and Z coordinate axes shown in each figure. Here, for convenience, in the direction parallel to the optical axis 200, the subject side is referred to as the front. Therefore, for example, in FIGS. 1(a) and (b), the +Y direction is upward and the +Z direction is forward. The +X direction is to the right when viewed from the subject side. FIG. 1(a) is a front perspective view, and FIG. 1(b) is a rear perspective view.

[0014] A lens mount portion 103 is provided on the front of the camera body 100 as an imaging device. By attaching a photographing lens unit 104 (see FIG. 2) to the lens mount portion 103, an imaging device system is configured. The photographing lens unit 104 is an interchangeable lens barrel, and FIGS. 1(a) and 1(b) show a state where the photographing lens unit 104 is removed.

[0015] The camera body 100 has a grip portion 101 for the photographer to stably hold the camera body 100. On the upper part of the grip portion 101, a shutter button 102, which is a switch for starting imaging, is provided. An opening 190 is provided inside the lens mount portion 103.

[0016] The mount contact 105 electrically connects the camera body 100 and the photographing lens unit 104, and supplies power to the photographing lens unit 104 and performs communication regarding lens control and lens data by electrical signals. When replacing the photographing lens unit 104, the user releases the locking by pressing the lens release button 106.

[0017] The power switch 107 is used when turning on or off the power of the camera. The main electronic dial 108 and the sub - electronic dial 119 are each rotatable operating members that can be rotated clockwise and counterclockwise. By rotating these, various setting values such as the aperture and shutter speed are changed.

[0018] The mode - switching dial 109 is an operating part for switching the shooting mode. The mode - switching dial 109 is used to switch to various modes such as a shutter - speed - priority shooting mode, an aperture - value - priority shooting mode, a video - shooting mode, etc. The SET button 110 is a push button and is mainly used for determining selected items, etc.

[0019] The LCD monitor 111 displays various settings screens for the camera body 100, captured images, and live view images. The electronic viewfinder 112 is an eyepiece viewfinder that displays various settings screens for the camera body 100, captured images, and live view images.

[0020] The multifunction button 113 is a push button. Users can assign various shooting-related settings to the multifunction button 113 as they wish. The display panel 114 displays the status of various camera settings, such as the shooting mode and ISO sensitivity. The display panel 114 also displays information when the camera body 100 is powered off.

[0021] The accessory shoe 115 has an accessory contact 116, allowing various accessories such as external strobes and microphones to be attached. The media slot cover 173 is openable and closable, and when open, the user can insert and remove an external recording medium 148 (see Figure 2), such as an SD card, into the internal media slot (not shown).

[0022] Next, the electrical configuration and operation will be described with reference to Figure 2. Figure 2 is a block diagram showing the main electrical configuration of the imaging device system. The optical axis 200 is the imaging optical axis of the imaging lens unit 104 and is parallel to the Z direction.

[0023] The MPU130 is a small central processing unit built into the camera body 100. The MPU130 is connected to a time measurement unit 131, a shutter drive unit 132, a switch sense unit 133, a power supply unit 134, a battery check unit 135, a video signal processing unit 136, a tilt mechanism drive unit 137, and a piezoelectric element drive unit 145. The MPU130 is responsible for controlling the operation of the entire camera body 100, processing input information and issuing instructions and controls to each element. The MPU130 has an EEPROM that can store time information from the time measurement unit 131 and various setting information.

[0024] Furthermore, the MPU 130 communicates with the lens control unit 138 built into the shooting lens unit 104 via the mount contact 105. This allows the MPU 130 to control the operation of the focus lens 141 and the electromagnetically driven aperture 142 via the AF drive unit 139 and the aperture drive unit 140. Although only one focus lens 141 is shown in Figure 2, the shooting lens unit 104 is actually composed of multiple lens groups.

[0025] The AF drive unit 139 drives the focus lens 141 in the direction of the optical axis 200, for example, by a connected stepping motor (not shown). The MPU 130 calculates the amount of focus lens drive according to the amount of defocus detected using the focus signal read from the image sensor 121, and transmits a focus command including the amount of focus lens drive to the lens control unit 138. Upon receiving the focus command, the lens control unit 138 controls the drive of the focus lens 141 through the AF drive unit 139. This enables autofocus (AF).

[0026] An aperture actuator, such as a stepping motor (not shown), is connected to the aperture drive unit 140. The aperture drive unit 140 drives multiple aperture blades (not shown) that form the aperture opening in the electromagnetically driven aperture 142. By driving the multiple aperture blades, the size (diameter) of the aperture opening changes, and the amount of light is adjusted.

[0027] The MPU 130 calculates the aperture drive amount from the luminance signal read from the image sensor 121 and transmits an aperture command including this aperture drive amount to the lens control unit 138. In other words, the MPU 130 communicates with the lens control unit 138 to control the electromagnetically driven aperture 142. Upon receiving the aperture command, the lens control unit 138 controls the drive of the electromagnetically driven aperture 142 through the aperture drive unit 140. This automatically sets an appropriate aperture value.

[0028] The mechanical focal-plane shutter 149 is driven by the shutter drive unit 132. During imaging, from the moment the photographer presses the shutter button 102 (Figure 1), the front curtain shutter (not shown) moves to open the shutter, and according to the desired exposure time, the rear curtain shutter (not shown) moves to close the shutter, thereby controlling the exposure time to the image sensor 121. In addition, in the focal-plane shutter 149, the front curtain shutter (not shown) is closed when the power is turned off, preventing dust from entering the camera body 100 through the opening 190 (Figure 1).

[0029] The first drive motor 150 and the second drive motor 151 are actuators for tilting the imaging unit 120 around the vertical axis (Y-axis) and horizontal axis (X-axis). The drive motors 150 and 151 are composed of stepping motors. The drive motors 150 and 151 are controlled and driven by the tilting mechanism drive unit 137. The detailed configuration of the tilting drive will be described later with reference to Figure 3 and subsequent figures.

[0030] In this embodiment, when referring to rotation around the vertical axis (Y-axis) and rotation around the horizontal axis (X-axis) collectively or without distinction, both types of rotation are referred to as "tilting." However, as is generally understood, rotation around the vertical axis corresponds to panning, and rotation around the horizontal axis corresponds to tilting.

[0031] The imaging unit 120 mainly consists of an optical low-pass filter 122, an optical low-pass filter holding member 123, a piezoelectric element 124, and an image sensor 121, all integrated into a single unit. The image sensor 121 converts the subject image into photoelectric data. In this embodiment, a CMOS sensor is used, but there are various other forms such as CCD and CID types, and any form of imaging device may be adopted.

[0032] The optical low-pass filter 122, positioned in front of the image sensor 121, is a single birefringent plate made of quartz, and its shape is rectangular. The piezoelectric element 124 is a single-plate piezoelectric element (piezo element) that is excited by the piezoelectric element drive unit 145, which receives instructions from the MPU 130, and is configured to transmit its vibrations to the optical low-pass filter 122. This vibration can shake off fine dust particles that have adhered to the optical low-pass filter 122.

[0033] The video signal processing unit 136 is responsible for all aspects of image processing, including filtering and data compression of electrical signals obtained from the image sensor 121. Image data for monitor display from the video signal processing unit 136 is displayed on the liquid crystal monitor 111 and electronic viewfinder 112 via the liquid crystal drive unit 144. The video signal processing unit 136 can also save image data to the buffer memory 147 via the memory controller 146, according to instructions from the MPU 130. Furthermore, the video signal processing unit 136 can perform image data compression processing such as JPEG. When continuous shooting is performed, such as in continuous shooting, the video signal processing unit 136 can temporarily store the image data in the buffer memory 147 and sequentially read out the unprocessed image data via the memory controller 146. This allows the video signal processing unit 136 to sequentially perform image processing and compression processing regardless of the speed of the incoming image data.

[0034] The memory controller 146 has the function of recording image data to an external recording medium 148 and the function of reading image data stored in the external recording medium 148. As the external recording medium 148, an SD card or CF card that can be attached to and removed from the camera body 100 is used.

[0035] The switch sense unit 133 transmits input signals to the MPU 130 according to the operating state of each switch. Switch 102a (SW1) is turned ON by the first stroke (half-press) of the shutter button 102. Switch 102b (SW2) is turned ON by the second stroke (full-press) of the shutter button 102. When switch 102b (SW2) is turned ON, an instruction to start shooting is sent to the MPU 130. The switch sense unit 133 is also connected to the main electronic dial 108, mode selection dial 109, power switch (SW) 107, SET button 110, multifunction button 113, etc.

[0036] The MPU 130 communicates information via the accessory contact 116 through the accessory communication control unit 118 to utilize the functions of an accessory unit (not shown). The power supply unit 134 distributes and supplies power from the battery 143 to each element of the camera. A battery check unit 135 is also connected to the battery 143, and information such as the remaining charge of the battery 143 obtained by the battery check unit 135 is transmitted to the MPU 130.

[0037] The MPU130 and other circuit ICs mentioned above, as well as the buffer memory 147 and external recording media 148, are arranged and mounted on the main board 180.

[0038] Figures 3 and 4 are rear perspective views showing the camera body 100 with the outer cover unit removed. In Figure 4, the main circuit board 180 is not shown.

[0039] The main body 201 is the main part of the camera body 100 excluding the outer cover unit, and includes the main structure (chassis) that holds the internal structure of the camera body 100. The outer cover unit and the lens mount section 103 (Figure 1(a)) are attached to the main body 201.

[0040] As shown in Figure 3, the base plate 210 (base member) of the tilting mechanism drive unit 137 (Figure 2) is attached to the main body 201 of the device. The main circuit board 180 is attached to the main body 201 behind the base plate 210. The main circuit board 180 has connectors mounted on it to which the MPU, various circuit ICs, and flexible printed circuit boards (hereinafter referred to as FPCs) from the exterior cover unit, as described in Figure 2, are connected.

[0041] As shown in Figure 4, the base plate 210 is attached to the main body of the device 201 so as to be adjustable in the direction of the imaging optical axis using three screws, triaxial adjustment screws 203a, 203b, and 203c.

[0042] The first drive motor 150 and the second drive motor 151 are mounted on the base plate 210 and are electrically connected to the main board 180 (Figure 3) by the first motor FPC (not shown) and the second drive FPC (not shown), respectively.

[0043] An image sensor 121 (Figures 2 and 6) is mounted on the front of the imaging board 220, and analog signals from the image sensor 121 are converted to digital signals. The image sensor FPC202a (first flexible board) and the image sensor FPC202b (second flexible board) are flexible printed circuit boards for electrically connecting the imaging board 220 and the main board 180. Details of the configuration of the image sensor FPC202a and the image sensor FPC202b will be described later.

[0044] Next, we will explain flange back adjustment with reference to Figure 5. Figure 5 is a rear exploded perspective view of the camera body 100 shown in Figure 4, with the imaging unit 120 and base plate 210 separated from the device body 201.

[0045] The base plate 210 is fixed to the device body 201 by three-axis adjustment screws 203a, 203b, and 203c that pass through screw holes 210a, 210b, and 210c. In addition, the positioning hole 210d of the base plate 210 is fitted with the positioning boss 201d of the device body 201, and the vibration-preventing hole 210e is fitted with the vibration-preventing boss 201e. This ensures that the device body 201 and the base plate 210 are positioned so that their positions do not shift in the planar direction perpendicular to the optical axis 200.

[0046] The three-axis adjustment springs 211a, 211b, and 211c are composed of compression coil springs and are installed around the screw seats 201a, 201b, and 201c, and are compressed between them and the base plate 210. As a result, the base plate 210 is biased in the direction away from the lens mount portion 103 (-Z direction) in the direction of the optical axis 200. By tightening or loosening the three-axis adjustment screws 203a, 203b, and 203c, the flange back can be adjusted and the tilt angle of the image sensor 121 relative to the optical axis 200 can be adjusted (so-called three-axis adjustment).

[0047] Here, the imaging unit 120 is attached to the front of the base plate 210, and these are adjusted and moved together when the flange back is adjusted. With this configuration, it is possible to provide an imaging device equipped with a tilting drive mechanism in which the flange back of the imaging unit 120 is correctly adjusted.

[0048] Next, the tilting mechanism will be explained in detail with reference to Figures 6 to 9.

[0049] Figure 6 is a front exploded perspective view of the imaging unit 120 and base plate 210. Figure 7 is a rear exploded perspective view of the imaging unit 120 and base plate 210.

[0050] The imaging unit 120 includes an imaging substrate 220 and an image sensor plate 402. The image sensor plate 402 is positioned aligned with the base plate 210 in the optical axis direction (+Z side). The image sensor 121 is held in place by adhesive fixing of either the image sensor 121 or the imaging substrate 220 to the image sensor plate 402. This unitizes the imaging unit 120.

[0051] A first drive motor 150 and a second drive motor 151 are mounted on the base plate 210. The first drive motor 150 and the second drive motor 151 are provided with protrusions 150p and 151p, respectively, that can move back and forth in the direction of the optical axis 200 (Figure 6).

[0052] Near the optical axis 200, which is approximately the center of the base plate 210, there are first spherical portions 310a, 310b, and 310c that form part of a sphere. On the other hand, near the optical axis 200, which is approximately the center of the image sensor plate 402, there are also second spherical portions 410a, 410b, and 410c that form part of a sphere (Figure 7). The first spherical portions 310a, 310b, and 310c correspond to the second spherical portions 410a, 410b, and 410c.

[0053] One end of a biasing spring 315, which is a tension coil spring, is locked to the base plate 210, and the other end of the biasing spring 315 is locked to a hook portion 415 on the image sensor plate 402 of the imaging unit 120.

[0054] The imaging unit 120 is biased toward the base plate 210 side (-Z side) in the optical axis direction by the tensile force of the biasing spring 315. As a result, the imaging unit 120 is always in contact with three locations: the spherical portions 310a, 310b, and 310c of the base plate 210, the convex portion 150p of the first drive motor, and the convex portion 151p of the second drive motor. The biasing spring 315 biases the imaging unit 120 in the direction in which the first spherical portions 310a, 310b, and 310c and the second spherical portions 410a, 410b, and 410c are in contact in the optical axis direction.

[0055] Referring to Figures 8 and 9, the operation of the imaging unit 120 in which it is driven to tilt vertically and pan horizontally will be described in detail.

[0056] Figures 8(a) to 8(c) are cross-sectional views of the imaging unit 120 and base plate 210 in the YZ section on the optical axis 200. Figure 8(a) shows the imaging unit 120 in a state where it is not tilted vertically, Figure 8(b) shows it tilted in the +θv direction, and Figure 8(c) shows it tilted in the -θv direction. The θv direction is the direction of rotation around the X axis, the +θv direction is counterclockwise when viewed from the +X side, and the -θv direction is clockwise when viewed from the +X side.

[0057] Figures 9(a) to 9(c) are bottom views of the imaging unit 120 and the base plate 210. Figure 9(a) shows the imaging unit 120 in a state where it is not tilted horizontally, Figure 9(b) shows it tilted in the +θh direction, and Figure 9(c) shows it tilted in the -θh direction. The θh direction is the direction of rotation around the Y axis, with the +θh direction being clockwise when viewed from the -Y side, and the -θh direction being counterclockwise when viewed from the -Y side.

[0058] Note that the imaging unit 120 is not tilted horizontally in Figures 8(a) to (c), and is not tilted vertically in Figures 9(a) to (c).

[0059] Let Q be a virtual sphere that encompasses the surfaces where the first spherical parts 310a, 310b, 310c and the second spherical parts 410a, 410b, 410c abut. Let P be the center of rotation of the virtual sphere Q. The +Z-side surfaces of the first spherical parts 310a, 310b, 310c are concave surfaces that are aligned with the virtual sphere Q (forming part of the virtual sphere Q). The -Z-side surfaces of the second spherical parts 410a, 410b, 410c are convex surfaces that are aligned with the virtual sphere Q (forming part of the virtual sphere Q).

[0060] The drive motors 150 and 151, acting as driving means, drive the imaging unit 120, causing the second spherical portions 410a, 410b, and 410c to move (slide) relative to the first spherical portions 310a, 310b, and 310c while in contact with them. This allows the imaging unit 120 to tilt. In other words, the sliding between the concave and convex surfaces causes the imaging unit 120 to rotate around the rotation center P relative to the base plate 210.

[0061] The rotation center P is configured to coincide with a point on the optical axis 200 and on the imaging surface 121a of the image sensor 121 (the intersection point of the optical axis 200 and the imaging surface 121a).

[0062] When the contact point between the spherical parts is considered as a single central point, the imaging unit 120 is biased to contact the spherical parts together and the convex parts 150p and 151p at three points. Therefore, by moving the convex parts 150p and 151p back and forth in the direction of the optical axis, the imaging unit 120 can be driven to tilt around the X axis (horizontal axis) and the Y axis (vertical axis).

[0063] The drive motors 150 and 151 drive the imaging unit 120 in the direction of the optical axis 200 at two different locations. Therefore, by combining the amount of drive and the direction of drive by the drive motors 150 and 151, it is possible to achieve tilting that has components around both the horizontal axis and the vertical axis (tilting around two axes).

[0064] Specifically, in the state shown in Figure 8(a), the amount of rotation of the imaging unit 120 around the horizontal axis is zero. In the state shown in Figure 9(a), the amount of rotation of the imaging unit 120 around the vertical axis is zero. That is, in Figures 8(a) and 9(a), the amount of rotation of the imaging unit 120 around the horizontal axis and the vertical axis is zero, and the imaging unit 120 is not tilted relative to the base plate 210 in either the X-axis or Y-axis direction. This protruding state of the protrusions 150p and 151p is referred to as the "origin state".

[0065] As described above, the image sensor 121 included in the imaging unit 120 is tilted relative to the base plate 210. In the origin state described above, the flange back of the image sensor 121 is adjusted by adjusting the fixing position of the base plate 210 relative to the device body 201 using the three-axis adjustment screws 203a, 203b, and 203c.

[0066] Furthermore, as shown in Figures 8(b) and (c), when the driving direction and amount of drive by the drive motors 150 and 151 are the same, the imaging unit 120 is tilted only around the horizontal axis. In Figure 8(b), both protrusions 150p and 151p are retracted towards the -Z side, and the imaging unit 120 is tilted in the +θv direction around the rotation center P1. In Figure 8(c), both protrusions 150p and 151p protrude in the +Z direction, and the imaging unit 120 is tilted in the -θv direction around the rotation center point P.

[0067] In Figure 9(b), the convex portion 150p protrudes in the -Z direction and the convex portion 151p is retracted in the +Z direction, and the imaging unit 120 is tilted in the +θh direction around the rotation center point P. In Figure 9(c), the convex portion 150p protrudes in the +Z direction and the convex portion 151p is retracted in the -Z direction, and the imaging unit 120 is tilted in the -θh direction around the rotation center point P.

[0068] Thus, the imaging unit 120 can tilt in either the vertical or horizontal direction, or both, around a rotation center P that substantially coincides with the intersection of the optical axis 200 and the imaging surface 121a. This tilting drive makes it possible to suppress changes in the field of view and focus.

[0069] Figure 10 shows the imaging unit 120 and base plate 210 as viewed from the +Z side. The positioning configuration of the imaging unit 120 around the Z axis (around the imaging optical axis) will be explained below.

[0070] A positioning pin 213 is positioned on the base plate 210. An elongated hole 408 is formed in the image sensor plate 402. One end of a rotation biasing spring 403 is fixed to the image sensor plate 402 with a screw 404. The other end of the rotation biasing spring 403 is engaged with the positioning pin 213.

[0071] The rotational biasing spring 403 biases the positioning pin 213 in the -R direction (counterclockwise when viewed from the +Z side), causing the positioning pin 213 to abut against the +Y end of the elongated hole 408. On the other hand, the portion of the imaging unit 120 to which the rotation biasing spring 403 is fixed by the screw 404 is rotationally biased in the R direction (clockwise when viewed from the +Z side) around the rotation center P. Therefore, the positioning pin 213 is always in contact with the +Y side end of the elongated hole 408. This determines the relative rotational position of the image sensor plate 402 and the base plate 210 around the rotation center P.

[0072] In this respect, the rotational biasing spring 403, the positioning pin 213, and the elongated hole 408 work together to regulate the relative rotational position of the imaging unit 120 with respect to the base plate 210 around the optical axis 200.

[0073] Figure 11(a) is a view of the base plate 210 from the +Z side. Referring to Figures 11(a) and (b), the positional relationship between the rotation center P, the drive motors 150 and 151, and the biasing spring 315 will be explained. Viewed from the Z direction, the biased position due to the biasing spring 315 is S1, the position of the protrusion 150p of the first drive motor 150 is M11, and the position of the protrusion 151p of the second drive motor 151 is M12.

[0074] Figure 11(b) is a schematic diagram showing the relationship between the rotation center P and positions S1, M11, and M12 as viewed from the Z direction. The imaging range of the image sensor 121 is denoted as E. When viewed from the Z direction, if the contact point between the first spherical parts 310a, 310b, 310c and the second spherical parts 410a, 410b, 410c is considered to be a single central point, this contact point is the same as the position of the rotation center P.

[0075] As shown in Figure 11(b), the position S1 of the biasing spring 315 is located within the range inside a virtual triangle T1 whose vertices are the rotation center P, position M11, and position M12, when viewed from the Z direction. With this arrangement, the biasing in the -Z direction by the biasing spring 315 causes the imaging unit 120 to tilt while maintaining stable contact with the base plate 210 at the rotation center P and with the protrusions 150p and 151p at positions M11 and M12.

[0076] The image sensors FPC202a and FPC202b will be described in detail with reference to Figures 4 and 7.

[0077] Image sensor FPC202a transmits differential signals, and image sensor FPC202b transmits power. Connectors (not shown) for connecting image sensors FPC202a and 202b are mounted on the back of the imaging board 220. Image sensors FPC202a and 202b connect the connector on the back of the imaging board 220 to the connector (not shown) on the front of the main board 180.

[0078] On the side of the imaging substrate 220 opposite to the mounting surface of the image sensor 121 (the -Z side), a non-mounted area 205 is provided near the optical axis. The non-mounted area 205 is an area where no electrical components other than connectors (capacitors, resistors, ICs, etc.) are mounted, and it includes the optical axis 200.

[0079] The image sensors FPC202a and FPC202b are connected in the non-mounted area 205 and are pulled out perpendicular to the surface of the imaging substrate 220 in the -Z direction. Therefore, by connecting FPC202a and 202b to their corresponding connectors near the optical axis of the imaging substrate 220, the amount of movement of FPC202a and 202b when the imaging unit 120 is tilted is minimized. As a result, it is possible to shorten the length of FPC202a and 202b and make them smaller. In addition, the repulsive force generated by the deformation of FPC202a and 202b between the imaging substrate 220 and the main substrate 180 can be reduced, and the drive power of the drive motors 150 and 151 that perform the tilting drive can be suppressed.

[0080] Furthermore, the FPC is divided into image sensor FPC202a and image sensor FPC202b, with FPC202a and 202b having relatively small widths in the horizontal and vertical directions, respectively. Therefore, compared to a configuration in which the FPC is not divided and has a large width, the repulsive force caused by the deformation of the FPC when the imaging unit 120 is tilted can be dispersed and suppressed.

[0081] As described above, the image sensor 121 is tiltable at least in the Y-axis direction (first direction; tilt direction) and the X-axis direction (second direction; pan direction), which are orthogonal to each other. The image sensors FPC202a and FPC202b are arranged orthogonally to each other. The width direction of image sensor FPC202a is parallel to the X-axis direction. The width direction of image sensor FPC202b is parallel to the Y-axis direction. The width of image sensor FPC202a is wider than the width of image sensor FPC202b.

[0082] In general, the repulsive force due to the deformation of the FPC is greater when the FPC has a larger width in the direction perpendicular to the rotation axis of deformation than when it has a larger width in the same direction as the rotation axis of deformation. In this embodiment, the amount of tilt of the image sensor 121 is greater in the direction of Y-axis (around the X-axis) (θv) than in the direction of X-axis (around the Y-axis) (θh). Therefore, from the viewpoint of reducing repulsive force, it is preferable to have the wider image sensor FPC 202a in an arrangement with a larger width in the X-axis direction.

[0083] By setting the widths of the image sensors FPC202a and 202b and their relative widths as described above, the repulsive force generated during tilting drive can be minimized, thereby reducing the drive power of the drive motors 150 and 151.

[0084] The image sensor plate 402 is positioned parallel to the imaging substrate 220. The first spherical portion is divided into three spherical portions 310a, 310b, and 310c. The second spherical portion is divided into three spherical portions 410a, 410b, and 410c. An opening 411 is formed in the second spherical portions 410a, 410b, and 410c of the image sensor plate 402 (Figure 7). The opening 411 is a through-hole surrounded by the three divided spherical portions 410a, 410b, and 410c. The image sensor FPCs 202a and 202b (Figure 4), which are connected to the image sensor 121, are pulled out through the opening 411 toward the -Z side in the optical axis direction. The pulled-out image sensor FPCs 202a and 202b are connected to the main substrate 180.

[0085] As shown in Figure 7, a heat dissipation member 204a (first heat dissipation member) is positioned between the imaging substrate 220 and the image sensor plate 402 to dissipate heat from the imaging substrate 220. The heat dissipation member 204a is made of a graphite sheet or heat dissipation rubber. The image sensor plate 402 also plays a role in heat dissipation. The heat dissipation member 204a is in partial contact with the imaging substrate 220. The heat dissipation member 204a has a heat dissipation surface in a region 206a adjacent to the image sensor FPC 202a and image sensor FPC 202b. This makes it possible to efficiently dissipate heat from the image sensor 121.

[0086] According to this embodiment, the image sensor FPCs 202a and 202b are connected to the imaging substrate 220 in an unmounted area 205 near the optical axis of the imaging substrate 220, and are also led out through the opening 411. As a result, the FPCs do not have to be routed extensively outside the drive unit or camera unit, thus avoiding an increase in the size of the device. Furthermore, the increase in the repulsive force of the FPCs during tilting drive of the image sensor 121 can be suppressed, enabling smooth tilting of the image sensor 121. Thus, it is possible to enable smooth tilting of the image sensor while suppressing an increase in size.

[0087] Furthermore, the X-direction width of the FPC202a image sensor, which flexes in the Y-axis direction where the amount of tilting is large, is wider than the Y-direction width of the FPC202b image sensor. This suppresses the repulsive force against tilting, making the tilting drive smoother.

[0088] Furthermore, since the heat dissipation member 204a has a heat dissipation surface in the region 206a adjacent to the image sensor FPC 202a and the image sensor FPC 202b, the heat dissipation efficiency of the image sensor 121 can be improved.

[0089] (Second embodiment) In the second embodiment of the present invention, the difference from the first embodiment is that an image sensor FPC202c (third flexible substrate) and a heat dissipation member 204b (second heat dissipation member) are added, but the other configurations are the same.

[0090] Figure 12 is a rear exploded perspective view of the imaging unit 120 and base plate 210. The image sensor FPC 202c is an FPC for electrically connecting the imaging substrate 220 and the main substrate 180. The image sensor FPC 202c transmits power. The image sensor FPC 202c connects the connector on the back of the imaging substrate 220 to the connector on the front of the main substrate 180.

[0091] The image sensor FPC202c, like the image sensors FPC202a and 202b, is connected in the non-mounted area 205 and extends perpendicularly in the -Z direction relative to the surface of the imaging substrate 220. This minimizes the amount of movement of FPC202a, 202b, and 202c when the imaging unit 120 is tilted. As a result, the image sensor FPC202c can also be made shorter and smaller, and the drive power of the drive motors 150 and 151 can be reduced by reducing the repulsive force.

[0092] The width of the image sensor FPC202c is the same as that of the image sensor FPC202b. The FPC is divided into image sensors FPC202a, 202b, and further divided into image sensor FPC202c, with FPC202a, 202b, and 202c having relatively small widths in the horizontal, vertical, and vertical directions, respectively. Therefore, compared to a configuration in which the FPC is not divided and has a large width, the repulsive force due to the deformation of the FPC when the imaging unit 120 is tilted can be dispersed and suppressed.

[0093] The width of the image sensor FPC202c is narrower than the width of the image sensor FPC202a and is approximately the same as the width of the image sensor FPC202b. The image sensor FPC202c is drawn out parallel to the image sensor FPC202b through the aperture 411 toward the -Z side in the optical axis direction and connected to the main board 180.

[0094] Between the imaging substrate 220 and the image sensor plate 402, in addition to the heat dissipation member 204a, a heat dissipation member 204b is placed to dissipate heat from the imaging substrate 220. The heat dissipation member 204b is made of a graphite sheet or heat dissipation rubber. The heat dissipation member 204b is in partial contact with the imaging substrate 220. The heat dissipation member 204b has a heat dissipation surface in the region 206b adjacent to the image sensor FPC 202a and the image sensor FPC 202c. This makes it possible to efficiently dissipate heat from the image sensor 121.

[0095] According to this embodiment, the same effects as in the first embodiment can be achieved in terms of enabling smooth tilting of the image sensor while suppressing an increase in size.

[0096] Furthermore, the width of the FPC202c image sensor is narrower than the width of the FPC202a image sensor, which flexes in the Y-axis direction where the amount of tilting is greater. This suppresses the repulsive force against tilting, making the tilting drive smoother.

[0097] Furthermore, since the heat dissipation member 204c has a heat dissipation surface in region 206b, the heat dissipation efficiency of the image sensor 121 can be improved.

[0098] Furthermore, the present invention can also be realized by adopting the configurations shown in Figures 13 and 14 in the first and second embodiments.

[0099] Figure 13(a) is a perspective view showing the internal structure of the imaging device 1100 with the outer cover removed. Figure 13(b) is a perspective view showing the internal structure of the imaging device 1100 with the main circuit board 1180 shown in Figure 13(a) omitted.

[0100] In the imaging device 1100, the main structure to which the exterior cover and lens mount section 1103 are attached and which also holds various components will be hereinafter referred to as the "main body 1201". The FB tilt drive unit 1160 is attached to the main body 1201 by main body fixing screws 1203a, 1203b, and 1203c.

[0101] The main board 1180 is mounted on the main body 1201 at the rear (rear side (-Z side)) of the FB tilt drive unit 1160. Various electronic components, electrical components, and connectors to which FPCs (flexible printed circuit boards) are connected are mounted on the main board 1180. The first drive motor 1150, the second drive motor 1151, and the third drive motor 1152, which constitute the FB tilt drive unit 1160, are electrically connected to the main board 1180 by the first FPC 1206, the second FPC 1207, and the third FPC 1208, respectively.

[0102] The imaging unit 1120 has an imaging substrate 1220 on which an image sensor 1121 is mounted. Various electrical and electronic components for converting the analog signal output from the image sensor 1121 into a digital signal are mounted on the imaging substrate 1220. The outer periphery of the back of the imaging substrate 1220 is bonded and fixed to a metal imaging substrate plate 1301.

[0103] The imaging board 1220 and the main board 1180 are electrically connected by image sensor FPCs 1202a and 1202b. In this configuration, the image sensor FPCs 1202a and 1202b connect a connector mounted on the back of the imaging board 1220 to a connector mounted on the front of the main board 1180. Image sensor FPC 1202a mainly transmits differential signals, while image sensor FPC 1202b mainly transmits power.

[0104] The image sensor FPCs 1202a and 1202b are connected near the optical axis of the imaging substrate 1220, which minimizes the amount of movement of the image sensor FPCs 1202a and 1202b when the imaging unit 1120 is tilted. This makes it possible to miniaturize the image sensor FPCs 1202a and 1202b (by shortening their excess length). In addition, the repulsive force generated by the deformation of the image sensor FPCs 1202a and 1202b between the imaging substrate 1220 and the main substrate 1180 can be reduced, and as a result, the drive power of the drive motors 1150 to 1152 can be suppressed. Furthermore, by using two image sensor FPCs 1202a and 1202b instead of one FPC, the image sensor FPCs 1202a and 1202b have small widths in the horizontal and vertical directions, respectively. Therefore, compared to the case where a single large-width FPC is used, it is possible to reduce and disperse the repulsive force caused by the deformation of the FPC when the imaging unit 1120 is tilted.

[0105] Next, we will explain the adjustment of the flange back in the imaging device 1100 by the FB tilt drive unit 1160 and the tilt drive of the imaging unit 1120.

[0106] Figure 14(a) is an exploded perspective view showing the FB tilt drive unit 1160 removed from the main body 1201 of the imaging device 1100. Figure 14(b) is a rear perspective view of the FB tilt drive unit 1160 and the imaging unit 1120.

[0107] The FB tilt drive unit 1160 has a base plate 1210. The base plate 1210 is fixed to the main body 1201 by passing the main body fixing screws 1203a, 1203b, and 1203c through screw holes provided in the base plate 1210 and fixing it to the main body 1201. The drive motors 1150, 1151, and 1152 are fixed to the base plate 1210 using fixing members 1401a, 1401b, and 1401c, respectively.

[0108] The FB tilt drive unit 1160 has three lead screws 1402a, 1402b, and 1402c. The front (+Z side) shaft of lead screw 1402a is inserted into an engagement recess 1201a provided in the main body 1201 and is rotatably supported by the main body 1201. The rear (-Z side) shaft of lead screw 1402a is inserted into a through hole provided in the base plate 1210. This shaft is engaged with a worm wheel 1403a located on the back surface of the base plate 1210 at the portion that protrudes rearward from the base plate 1210. Meanwhile, a worm gear 1501a is press-fitted and fixed to the rotating shaft of the drive motor 1150, and the worm gear 1501a meshes with the worm wheel 1403a. Therefore, when the drive motor 1150 is driven, the worm gear 1501a rotates the worm wheel 1403a, which in turn rotates the lead screw 1402a.

[0109] The lead screws 1402b and 1402c are held rotatably in the same configuration as the lead screw 1402a. Specifically, the front shaft portion of the lead screw 1402b is rotatably inserted into an engagement recess 1201b provided in the main body 1201. The rear shaft portion of the lead screw 1402b is inserted into a through hole provided in the base plate 1210, and the portion protruding rearward from the base plate 1210 engages with the worm wheel 1403b located on the back surface of the base plate 1210. On the other hand, a worm gear 1501b is press-fitted and fixed to the rotating shaft of the drive motor 1151, and the worm gear 1501b meshes with the worm wheel 1403b. Therefore, when the drive motor 1151 is driven, the worm gear 1501b rotates the worm wheel 1403b, thereby rotating the lead screw 1402b.

[0110] Furthermore, the front shaft portion of the lead screw 1402c is rotatably inserted into an engagement recess 1201c provided in the main body 1201. The rear shaft portion of the lead screw 1402c is inserted into a through hole provided in the base plate 1210, and the portion protruding rearward from the base plate 1210 engages with the worm wheel 1403c located on the back surface of the base plate 1210. On the other hand, a worm gear 1501c is press-fitted and fixed to the rotating shaft of the drive motor 1152, and the worm gear 1501c meshes with the worm wheel 1403c. Therefore, when the drive motor 1152 is driven, the worm gear 1501c rotates the worm wheel 1403c, thereby rotating the lead screw 1402c.

[0111] The imaging substrate plate 1301 has a roughly rectangular shape when viewed from the optical axis direction, and through holes are provided near three of its four corners through which the lead screws 1402a, 1402b, and 1402c are inserted. On the back surface of the imaging substrate plate 1301, followers 1404a, 1404b, and 1404c are fixed near the through holes through which the lead screws 1402a, 1402b, and 1402c are inserted, respectively. The three followers 1404a, 1404b, and 1404c are engaged with the screw portion (spiral portion) of the lead screws 1402a, 1402b, and 1402c, respectively. Thus, engagement points between the lead screws 1402a, 1402b, and 1402c and the followers 1404a, 1404b, and 1404c are provided near the three corners of the imaging substrate plate 1301.

[0112] When the FB tilt drive unit 1160 is viewed from the rear side (-Z side), rotating the worm gear 1501a counterclockwise (CCW) moves the follower 1404a, which is engaged with the screw portion of the lead screw 1402a, in the +Z direction. Conversely, rotating the worm gear 1501a clockwise (CW) moves the follower 1404a in the -Z direction. The movement of the followers 1404b and 1404c in the Z direction can be performed in the same way as the movement of the follower 1404a in the Z direction.

[0113] In this way, the drive motors 1150, 1151, and 1152 individually rotate the three lead screws 1402a, 1402b, and 1402c. By rotating all or part of the lead screws 1402a, 1402b, and 1402c, the front-to-back position of the imaging unit 1120 (flange back adjustment) and the tilt of the imaging surface of the image sensor 1121 can be adjusted. The position data of the drive motors 1150 to 1152 when the flange back adjustment is performed is stored in the FB memory 1161 as adjustment position data. Therefore, after tilting, the imaging unit 1120 can be returned to the position after flange back adjustment, which is the state before tilting, using the adjustment position data stored in the FB memory 1161. In order to determine the tilt of the imaging substrate plate 1301 with respect to the optical axis, it is sufficient to determine the positions of three points on the imaging substrate plate 1301. Three lead screws are used to determine these three points. Furthermore, the base plate 1210 has an opening 1210a, which is a through hole (Figure 14). The image sensors FPC 1202a and 1202b are drawn out towards the -Z side in the optical axis direction through the opening 1210a.

[0114] Furthermore, the imaging device to which the present invention is applied may be an imaging device with an integrated lens.

[0115] Although the present invention has been described in detail above based on its preferred embodiments, the present invention is not limited to these specific embodiments, and various forms that do not depart from the spirit of the invention are also included in the present invention. Some of the above embodiments may be combined as appropriate.

[0116] This embodiment includes the following configuration. (Configuration 1) Image sensor and, A photographic substrate on which the aforementioned image sensor is mounted, A driving means for tilting the image sensor, A first flexible substrate connected to the aforementioned imaging substrate, A second flexible substrate connected to the aforementioned imaging substrate, It has an image sensor plate having a through hole and provided parallel to the imaging substrate, On the surface of the imaging substrate opposite to the mounting surface of the image sensor, a non-mounted area is provided in the region including the imaging optical axis, where no electrical components are mounted. The imaging apparatus is characterized in that the first flexible substrate and the second flexible substrate are connected to the imaging substrate in the non-mounted area and are drawn out through the through hole. (Configuration 2) The image sensor is tiltable in at least two mutually orthogonal directions, The amount of tilt possible in the first direction is greater than the amount of tilt possible in the second direction. The width of the first flexible substrate is wider than the width of the second flexible substrate. The imaging apparatus according to configuration 1, characterized in that the width direction of the first flexible substrate is parallel to the second direction, and the width direction of the second flexible substrate is parallel to the first direction. (Configuration 3) The first flexible substrate transmits differential signals, The imaging apparatus according to configuration 2, characterized in that the second flexible substrate transmits power. (Configuration 4) The configuration includes a first heat dissipation member positioned between the imaging substrate and the image sensor plate so as to be in contact with the imaging substrate, The imaging apparatus according to any one of configurations 1 to 3, characterized in that the first heat dissipation member has a heat dissipation surface in a region adjacent to the first flexible substrate and the second flexible substrate. (Configuration 5) Further comprising a third flexible substrate connected to the imaging substrate, The width of the third flexible substrate is narrower than the width of the first flexible substrate. The imaging apparatus according to configuration 2 or 3, characterized in that the third flexible substrate is drawn out parallel to the second flexible substrate through the through hole. (Configuration 6) The configuration includes a second heat dissipation member positioned between the imaging substrate and the image sensor plate so as to be in contact with the imaging substrate, The imaging apparatus according to configuration 5, characterized in that the second heat dissipation member has a heat dissipation surface in a region adjacent to the first flexible substrate and the third flexible substrate. (Configuration 7) The main body of the device and It has a base member having a first spherical portion and fixed to the main body of the device, The image sensor plate has a second spherical portion, The imaging apparatus according to any one of configurations 1 to 6, characterized in that the driving means tilts the image sensor by moving the second spherical portion relative to the first spherical portion while keeping it in contact with the first spherical portion. (Configuration 8) The main body of the device and The device has a base member fixed to the main body of the device, The image sensor is tilted relative to the base member, The imaging apparatus according to any one of configurations 1 to 7, characterized in that the flange back of the image sensor is adjusted by adjusting the fixing position of the base member with respect to the main body of the apparatus when the image sensor is in a home state where it is not tilted. (Configuration 9) an imaging unit having the image sensor, It has three lead screws that engage with the imaging unit, The drive means individually rotates the three lead screws, The imaging apparatus according to configuration 1, characterized in that the image sensor is tilted as the engagement portion with the three lead screws in the imaging unit moves in the optical axis direction in accordance with the rotation of the three lead screws. [Explanation of Symbols]

[0117] 121, 1121 Image sensor 150, 151, 1150, 1151, 1152 drive motors 220, 1220 imaging substrate 202a~202c, 1202a~1202c Image sensor FPC 205 Unimplemented area 411, 1210a opening 402 Image sensor plate 210, 1210 base plate

Claims

1. Image sensor and A photographic substrate on which the aforementioned image sensor is mounted, A driving means for tilting the image sensor, A first flexible substrate connected to the aforementioned imaging substrate, A second flexible substrate connected to the aforementioned imaging substrate, It has an image sensor plate having a through hole and provided parallel to the imaging substrate, On the surface of the imaging substrate opposite to the mounting surface of the image sensor, a non-mounted area is provided in the region including the imaging optical axis, where no electrical components are mounted. The imaging apparatus is characterized in that the first flexible substrate and the second flexible substrate are connected to the imaging substrate in the non-mounted area and are drawn out through the through hole.

2. The image sensor is tiltable in at least two mutually orthogonal directions, The amount of tilt possible in the first direction is greater than the amount of tilt possible in the second direction. The width of the first flexible substrate is wider than the width of the second flexible substrate. The imaging apparatus according to claim 1, characterized in that the width direction of the first flexible substrate is parallel to the second direction, and the width direction of the second flexible substrate is parallel to the first direction.

3. The first flexible substrate transmits differential signals, The imaging apparatus according to claim 2, characterized in that the second flexible substrate transmits power.

4. The imaging substrate and the image sensor plate are positioned with a first heat dissipation member that is in contact with the imaging substrate, The imaging apparatus according to claim 1, characterized in that the first heat dissipation member has a heat dissipation surface in a region adjacent to the first flexible substrate and the second flexible substrate.

5. The system further comprises a third flexible substrate connected to the aforementioned imaging substrate, The width of the third flexible substrate is narrower than the width of the first flexible substrate. The imaging apparatus according to claim 2, characterized in that the third flexible substrate is drawn out parallel to the second flexible substrate through the through hole.

6. The photographic substrate and the image sensor plate are separated by a second heat dissipation member that is in contact with the photographic substrate, The imaging apparatus according to claim 5, characterized in that the second heat dissipation member has a heat dissipation surface in a region adjacent to the first flexible substrate and the third flexible substrate.

7. The main body of the device, It has a base member having a first spherical portion and fixed to the main body of the device, The image sensor plate has a second spherical portion, The imaging apparatus according to claim 1, characterized in that the driving means tilts the image sensor by moving the second spherical portion relative to the first spherical portion while keeping it in contact with the first spherical portion.

8. The main body of the device, The device has a base member fixed to the main body of the device, The image sensor is tilted relative to the base member, The imaging apparatus according to claim 1, characterized in that the flange back of the image sensor is adjusted by adjusting the fixing position of the base member with respect to the main body of the apparatus when the image sensor is in an origin state where it is not tilted.

9. An imaging unit having the aforementioned image sensor, It has three lead screws that engage with the imaging unit, The drive means individually rotates the three lead screws, The imaging apparatus according to claim 1, characterized in that the image sensor is tilted as the engagement portion with the three lead screws in the imaging unit moves in the optical axis direction in accordance with the rotation of the three lead screws.

Images