Optical element driving mechanism

Abstract

The utility model discloses a kind of optical element driving mechanisms, including base, frame, carrier, first inductive magnet and second inductive magnet, the frame with the base is movably connected, the carrier is located in the frame and is set to be movable along vertical direction.The first magnetic induction stone and the frame and the carrier are connected with one of them.The two first induction chip and the frame and the other of the carrier are connected and aligned with the first inductive magnet, the center of two first induction chip and the center of the first inductive magnet are misaligned, for inducting the magnetic field of the first inductive magnet.The utility model is by inductive chip being set at the position deviating from the center line of inductive magnet, does not affect inductive chip detection carrier or the position of frame, inductive chip's heat production can also be reduced.

Description

Technical Field

[0001] This utility model relates to the field of lens driving technology, and in particular to an optical element driving mechanism. Background Technology

[0002] In existing optical element driving mechanisms, the position of the carrier or frame can be sensed by the cooperation of a sensing chip and a sensing magnet. However, since the center of the sensing chip is generally aligned with the center of the sensing magnet, the sensing chip can receive the maximum magnetic field, but this will cause excessive heat, resulting in heat accumulation inside the electronic device. Therefore, improvements are needed. Summary of the Invention

[0003] The purpose of this invention is to provide an optical element driving mechanism to solve the problems of the prior art.

[0004] To solve the above-mentioned technical problems, the present invention provides an optical element driving mechanism, comprising:

[0005] Base;

[0006] A frame, wherein the frame is movably connected to the base;

[0007] A carrier, which is located within the frame and is configured to move in a vertical direction;

[0008] A first sensing magnet, the first sensing magnet being connected to one of the frame and the carrier;

[0009] At least two first sensing chips are connected to another of the frame and the carrier and aligned with the first sensing magnet. The centers of the two first sensing chips are offset from the center of the first sensing magnet for sensing the magnetic field of the first sensing magnet.

[0010] In one embodiment, the top surface of the frame is provided with a groove, and the first sensing magnet is located in the groove;

[0011] The carrier is provided with a mounting plate on its outer side, and the mounting plate is located in the groove;

[0012] The first sensing chip is mounted on the mounting plate.

[0013] In one embodiment, multiple rows of the first sensing chips are respectively mounted on the mounting plate, and the centers of the multiple rows of the first sensing chips are respectively offset from the center of the first sensing magnet.

[0014] In one embodiment, the bottom wall of the groove is provided with a recessed mounting groove, and the first inductive magnet is located in the mounting groove.

[0015] In one embodiment, the optical element driving mechanism further includes a driving magnet and an AF coil assembly.

[0016] The driving magnet is connected to the frame, and the AF coil group is connected to the carrier and cooperates with the driving magnet to drive the carrier to move in the vertical direction.

[0017] In one embodiment, the mounting groove extends vertically through the frame;

[0018] The frame also includes a metal frame, a portion of which is located within the mounting groove and on the bottom surface of the first inductive magnet.

[0019] The driving magnet is located in the mounting slot and its top surface abuts against the metal frame.

[0020] In one embodiment, the mounting plate is provided with a clearance groove, and a circuit board is installed in the clearance groove;

[0021] The bottom wall of the clearance groove is provided with a clearance opening that penetrates the frame;

[0022] The sensing chip is connected to the circuit board and is located inside the clearance opening.

[0023] In one embodiment, the optical element driving mechanism further includes:

[0024] A second sensing magnet is connected to one of the frame and the base;

[0025] At least two second sensing chips are connected to another of the frame and the base, and the centers of the two second sensing chips are offset from the center of the second sensing magnet for sensing the magnetic field of the second sensing magnet.

[0026] In one embodiment, the optical element driving mechanism further includes:

[0027] An upper spring plate, the upper spring plate being connected to the top of the frame and the carrier;

[0028] A lower spring, which is connected to the bottom of the frame and the carrier;

[0029] A suspension wire, the bottom end of which is connected to the base and the top end of which is connected to the upper spring plate;

[0030] The base has an internal wiring, which is electrically connected to the suspension wire.

[0031] The upper spring is electrically connected to the first sensing chip.

[0032] In one embodiment, at least a portion of the metal frame is bent multiple times.

[0033] This invention places the sensing chip at a position off-center from the center line of the sensing magnet, which does not affect the position of the sensing chip's detection carrier or frame, and can also reduce the heat generated by the sensing chip. Attached Figure Description

[0034] Figure 1 , Figure 2 and Figure 3 These are exploded views of the optical element driving mechanism of one embodiment of this utility model.

[0035] Figure 4 yes Figure 1 The illustrated embodiment shows an assembly diagram of the frame, circuit board, first sensing chip, and carrier.

[0036] Figure 5 and Figure 6 yes Figure 1 Exploded view of the frame, circuit board, first sensing chip and carrier in the embodiment shown.

[0037] Figure 7 yes Figure 6 Exploded view of the carrier, mounting plate, circuit board and first sensing chip in the embodiment shown.

[0038] Figure 8 yes Figure 6 An exploded view of the frame, driving magnet, and first induction magnet in the embodiment shown.

[0039] Figure 9 yes Figure 6 The illustrated embodiment shows an assembly diagram of the driving magnet, the first sensing magnet, and the metal frame.

[0040] Figure 10 yes Figure 1 Assembly diagram of the optical element driving mechanism in the illustrated embodiment.

[0041] Figure 11 yes Figure 10 A cross-sectional view of the optical element driving mechanism along line AA in the embodiment shown.

[0042] Figure 12 This is a coordinate diagram of the first sensing chip sensing the first sensing magnet, where Hall1 and Hall2 lines represent the installation positions of the two rows of first sensing chips in the prior art.

[0043] Figure 13 This is a coordinate diagram of the first sensing chip sensing the first sensing magnet, where Hall1 and Hall2 lines represent the installation positions of the two rows of first sensing chips in this invention.

[0044] Reference numerals: 100, Optical element driving mechanism; 1, Base; 11, Base plate; 12, Drive circuit board; 2, Frame; 21, First sensing magnet; 22, Drive magnet; 23, Metal frame; 24, Metal plate; 25, Groove; 26, Mounting groove; 3, Carrier; 31, Mounting plate; 32, Clearance groove; 33, Clearance hole; 34, Circuit board; 35, First sensing chip; 36, Coil group; 4, Upper spring; 5, Lower spring; 6, Suspension wire; 7, Housing; Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of this utility model clearer, the various embodiments of this utility model will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this utility model to facilitate a better understanding of this application. However, the technical solutions claimed in the claims of this application can be implemented even without these technical details and with various variations and modifications based on the following embodiments.

[0046] Unless the context requires otherwise, throughout the specification and claims, the word “comprising” and its variations, such as “including” and “having”, shall be understood to have an open, inclusive meaning, that is, to be interpreted as “including, but not limited to”.

[0047] The embodiments of this utility model will be described in detail below with reference to the accompanying drawings to provide a clearer understanding of the purpose, features, and advantages of this utility model. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of this utility model, but are merely illustrative of the essential spirit of the technical solution of this utility model.

[0048] Throughout this specification, references to "an embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the appearance of "in an embodiment" or "an embodiment" in various places throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any manner in one or more embodiments.

[0049] The singular forms “a” and “the” used in this specification and the appended claims include plural references unless otherwise expressly stated herein. It should be noted that the term “or” is generally used to mean “and / or” unless otherwise expressly stated herein.

[0050] In the following description, in order to clearly demonstrate the structure and working method of this utility model, a number of directional terms will be used. However, terms such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and not as limiting terms.

[0051] This utility model relates to an optical element driving mechanism 100, which includes a base 1, a frame 2, a carrier 3, an upper spring 4, a lower spring 5, multiple suspension wires 6, a first sensing magnet 21, a second sensing magnet, at least two first sensing chips, at least two second sensing chips, and a housing 7.

[0052] The base 1 includes a base plate 11, built-in wiring, and a drive circuit board 12. The base plate 11 is rectangular and its edges are connected to the bottom ends of the four side plates of the outer casing 7. The top plate of the outer casing 7 and the base plate 11 are provided with corresponding light-shielding holes to prevent light from entering and transmitting to the outside. The built-in wiring is located inside the base plate 11 and is used to connect to an external power source.

[0053] The drive circuit board 12 is located on the top surface of the base plate 11 and has an OIS coil group 36 inside. The built-in circuit board 34 is electrically connected to the built-in circuit in the base plate 11.

[0054] Four suspension wires 6 are located inside the outer casing 7 and their bottom ends are connected to the four corners of the base plate 11 and electrically connected to the built-in circuit. Their top ends extend vertically.

[0055] The frame 2 is suspended above the drive circuit board 12 by four suspension wires 6 and an upper spring 4. Specifically, the frame 2 is a rectangular ring and is equipped with a drive magnet 22. The drive magnet 22 cooperates with the OIS coil group 36 to drive the frame 2 to move in two directions perpendicular to the optical axis. The optical axis direction is... Figures 1-3 In the vertical direction, the horizontal movement of frame 2 can play a role in preventing shaking.

[0056] The carrier 3 is located inside the ring of the frame 2 and is equipped with an AF coil assembly 36. The lens is mounted inside the carrier 3. The AF coil assembly 36 and the drive magnet 22 work together to drive the carrier 3 to move the lens along the optical axis to adjust the focal length.

[0057] The upper spring 4 and the lower spring 5 are located at the top and bottom of the frame 2 and the carrier 3, respectively. The upper spring 4 is elastically connected to the top of the frame 2 and the carrier 3, and the lower spring 5 is elastically connected to the bottom of the frame 2 and the carrier 3. The upper spring 4 and the lower spring 5 work together to drive the carrier 3 to move and then return to its original position.

[0058] The upper spring plate 4 is also electrically connected to the suspension wire 6 and the AF coil group 36. After the built-in circuit is energized, it can supply power to the AF coil group 36 and the drive circuit board 12.

[0059] The first sensing magnet 21 is connected to the frame 2. Four first sensing chips 35 are mounted on a circuit board 34 in two rows. The circuit board 34 has multiple integrated components and is connected to the carrier 3. The four first sensing chips 35 and the first sensing magnet 21 are aligned vertically, but the center of each row of first sensing chips 35 is not aligned with the center of the first sensing magnet 21. That is, the two rows of first sensing chips 35 are located on both sides of the center line of the first sensing magnet, and the center of the line connecting the two first sensing chips in each row is misaligned with the center line of the horizontal plane of the first sensing magnet 21.

[0060] For the effect of this setting, please refer to Figure 12 and Figure 13 , Figure 12 The horizontal axis represents the distance between the centers of the first sensing chip and the first sensing magnet, which is the distance between the vertical projection of the first sensing chip 35 and the vertical projection of the center of the first sensing magnet 21. A value of 0 on the horizontal axis indicates that the center projections of the first sensing chip 35 and the first sensing magnet 21 overlap, while positive and negative values ​​represent the two first sensing chips being on opposite sides of the first sensing magnet 21. The vertical axis represents the amount of magnetic field sensed by the first sensing chip 35 from the first sensing magnet 21.

[0061] Figure 12 and Figure 13 The illustrated embodiment is an improved embodiment of the invention. In this embodiment, parabolas a, b, and c represent the vertical heights of the first sensing chip 35 and the first sensing magnet 21 at the upper mechanical position, neutral position, and lower mechanical position, respectively. The first sensing chip 35 senses changes in the magnetic field lines; that is, parabolas a, b, and c represent the magnetic flux sensed by the first sensing chip at three different height intervals between the first sensing chip and the first sensing magnet. In other words, the closer the center of the first sensing chip 35 is to the center of the first sensing magnet 21 in the horizontal direction, the greater the magnetic field it senses.

[0062] Hall1 and Hall2 represent two rows of first sensing chips 35 mounted on opposite sides of the center of the first sensing magnet 21. Figure 12 In the middle, the magnetic flux values ​​of the first sensing magnets sensed by the two rows of first sensing chips are about the same, and the magnetic quantity sensed by the two rows of first sensing chips is relatively large. By monitoring the magnetic flux of the first sensing magnets by the two rows of first sensing chips, the movement position of the carrier 3 and the optical axis of the lens can be determined.

[0063] However, it was found during use that the first sensing chip would heat up after prolonged use. When the temperature was too high, the sensing accuracy would decrease, affecting the position monitoring effect of the carrier 3.

[0064] And in Figure 13 In the illustrated embodiment, the first sensing chip 35 represented by Hall 1 line and the first sensing chip 35 represented by Hall 2 line are not symmetrically arranged on both sides of the first sensing magnet. That is to say, the center of the line connecting the first sensing chip 35 represented by Hall 1 line and the first sensing chip 35 represented by Hall 2 line does not overlap with the center of the first sensing magnet, but is offset. Figure 13 It can be seen that the magnetic flux monitored by the first sensing chip 35 represented by Hall 1 line is significantly different from that monitored by the first sensing chip 35 represented by Hall 2 line. After differential processing, the position monitoring effect can be achieved by the difference in magnetic flux monitored by the two rows of first sensing chips 35. After the first sensing chip 35 heats up, the monitored magnetic flux of both rows of first sensing chips 35 will decrease rapidly, thereby reducing heat generation and not affecting the position monitoring accuracy of the carrier 3.

[0065] Based on the experiment, the center of the first sensing chip 35 needs to be offset from the center line of the first sensing magnet 21, but it cannot be completely separated from the bottom of the integrated components of the circuit board 34. That is, the first sensing magnet 21, either as a whole or in part, needs to be within the planar projection range of the integrated components on the circuit board 34.

[0066] This technical solution uses four first sensing chips 35 arranged in two rows for position monitoring. In fact, as long as two rows of monitoring structures are formed, the number of first sensing chips 35 can be 2, 4, 6, 8, etc., and they will have the same technical effect as in this technical solution.

[0067] exist Figure 5 In the specific embodiment shown, the top surface of the frame 2 is provided with a groove 25, and the bottom wall of the groove 25 is provided with a recessed mounting groove 26, which penetrates the frame 2 in the vertical direction.

[0068] The frame 2 also includes a metal frame 23, which is a rectangular frame structure and has multiple metal plates 24, one of which is located in the mounting groove 26.

[0069] The metal frame features multiple bends at its corners, which can be bent in multiple directions without restriction on the specific bending state. Alternatively, except for the metal plates which are plate-shaped, the rest of the frame can be bent to increase its stability.

[0070] The first induction magnet 21 is located in the mounting groove 26 and on the top surface of the metal plate 24.

[0071] The driving magnets 22 are in three sets, two of which are magnetically attracted to the two metal plates 24. The other set of driving magnets 22 is also installed in the mounting groove 26 and located on the bottom surface of the metal plate 24. The metal plate 24 can attract the driving magnets 22 and the first sensing magnet 21 and stably mount them on the frame 2.

[0072] The outer side of the carrier 3 is provided with a protruding mounting plate 31, which is located in the groove 25 and can move vertically with the carrier 3. The top surface of the mounting plate 31 is provided with a recessed clearance groove 32, and the bottom wall of the clearance groove 32 is provided with a clearance hole 33 that penetrates the mounting plate 31.

[0073] The circuit board 34 is installed inside the clearance slot 32, and the two rows of first sensing chips 35 of the circuit board 34 are located at the clearance opening. The circuit board 34 is also electrically connected to the upper spring 4 and is energized through the upper spring 4.

[0074] Of course, in other embodiments, the circuit board 34 can also be disposed on the frame 2, and the first sensing magnet 21 can be disposed on the carrier 3 to sense the position of the carrier 3.

[0075] The second sensing magnet is connected to the frame 2, and the two second sensing chips are connected to the base 1. The implementation method is the same as that of the first sensing chip 35 and the first sensing magnet 21. The center of the connection between the two second sensing chips and the center of the second sensing magnet are also staggered. The two second sensing chips detect the position of the frame 2 by sensing the magnetic field lines of the second sensing magnet. The specific implementation method will not be described in detail.

[0076] This invention sets the center of the sensing chip at a position offset from the center line of the sensing magnet, which does not affect the position of the sensing chip detection carrier 3 or frame 2, and can also reduce the heat generated by the sensing chip.

[0077] The preferred embodiments of the present invention have been described in detail above, but it should be understood that, if necessary, aspects of the embodiments can be modified to utilize aspects, features, and concepts from various patents, applications, and publications to provide other embodiments.

[0078] In light of the detailed description above, these and other changes can be made to the embodiments. Generally, the terminology used in the claims should not be considered limited to the specific embodiments disclosed in the specification and claims, but should be understood to include all possible embodiments together with the full scope of equivalents enjoyed by these claims.

[0079] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention, and in practical applications, various changes can be made to them in form and detail without departing from the spirit and scope of the present invention.

Claims

1. An optical element driving mechanism, characterized in that, include: Base; A frame, wherein the frame is movably connected to the base; A carrier, which is located within the frame and is configured to move in a vertical direction; A first sensing magnet, the first sensing magnet being connected to one of the frame and the carrier; At least two first sensing chips are connected to another of the frame and the carrier and aligned with the first sensing magnet. The centers of the two first sensing chips are offset from the center of the first sensing magnet for sensing the magnetic field of the first sensing magnet.

2. The optical element driving mechanism according to claim 1, characterized in that, The top surface of the frame is provided with a groove, and the first sensing magnet is located in the groove; The carrier is provided with a mounting plate on its outer side, and the mounting plate is located in the groove; The first sensing chip is mounted on the mounting plate.

3. The optical element driving mechanism according to claim 2, characterized in that, Multiple rows of the first sensing chips are respectively mounted on the mounting plate, and the centers of the multiple rows of the first sensing chips are respectively offset from the center of the first sensing magnet.

4. The optical element driving mechanism according to claim 2, characterized in that, The bottom wall of the groove is provided with a recessed mounting groove, and the first inductive magnet is located in the mounting groove.

5. The optical element driving mechanism according to claim 4, characterized in that, The optical element driving mechanism also includes a driving magnet and an AF coil assembly. The driving magnet is connected to the frame, and the AF coil group is connected to the carrier and cooperates with the driving magnet to drive the carrier to move in the vertical direction.

6. The optical element driving mechanism according to claim 5, characterized in that, The mounting groove extends vertically through the frame; The frame also includes a metal frame, a portion of which is located within the mounting groove and on the bottom surface of the first inductive magnet. The driving magnet is located in the mounting slot and its top surface abuts against the metal frame.

7. The optical element driving mechanism according to claim 2, characterized in that, The mounting plate is provided with a clearance groove, and a circuit board is installed in the clearance groove; The bottom wall of the clearance groove is provided with a clearance opening that penetrates the frame; The sensing chip is connected to the circuit board and is located inside the clearance opening.

8. The optical element driving mechanism according to claim 1, characterized in that, The optical element driving mechanism further includes: A second sensing magnet is connected to one of the frame and the base; At least two second sensing chips are connected to another of the frame and the base, and the centers of the two second sensing chips are offset from the center of the second sensing magnet for sensing the magnetic field of the second sensing magnet.

9. The optical element driving mechanism according to claim 1, characterized in that, The optical element driving mechanism further includes: An upper spring plate, the upper spring plate being connected to the top of the frame and the carrier; A lower spring, which is connected to the bottom of the frame and the carrier; A suspension wire, the bottom end of which is connected to the base and the top end of which is connected to the upper spring plate; The base has an internal wiring, which is electrically connected to the suspension wire. The upper spring is electrically connected to the first sensing chip.

10. The optical element driving mechanism according to claim 6, characterized in that, At least a portion of the metal frame is bent multiple times.

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