Method for manufacturing an electronic device housing and electronic device

Abstract

The present invention provides a method for manufacturing an electronic device housing that can suppress the deterioration of external quality caused by microphone holes, and an electronic device itself. [Solution] A method for manufacturing an electronic device housing is a method for manufacturing an electronic device housing, comprising the steps of: forming a first hole from the outer surface side of a wall provided on a metal housing member; performing a surface treatment on at least the outer surface of the wall and the inner surface of the first hole after the step of forming the first hole; fixing a spacer part having a mounting surface for a microphone module to the inner surface of the wall with an adhesive member after the step of performing the surface treatment; and forming a second hole having an inner diameter smaller than the first hole coaxially with the first hole so as to penetrate from the first hole to the mounting surface of the spacer part after the step of fixing the spacer part.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a housing for an electronic device equipped with a microphone module and an electronic device.

Background Art

[0002] An electronic device such as a notebook PC may include a microphone module (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The microphone module as described above acquires sound information outside the housing through a microphone hole that penetrates the wall portion of the housing member. For this reason, minute microphone holes are formed through the wall portion. The housing member may be made of metal. In this case, for example, if the microphone hole is formed after performing a surface treatment such as anodic oxidation treatment on the housing member, the metallic luster is exposed on the inner surface of the microphone hole, which impairs the appearance quality of the electronic device.

[0005] Incidentally, the microphone module needs to be in close contact with the inner surface of the wall through which the microphone hole is formed, ensuring airtightness and preventing sound leakage inside and outside the housing. However, depending on the inner surface shape of the housing members and the installation position of the microphone module, it may not be possible to secure a flat surface on the inner surface of the housing members. In this case, it is necessary to interpose a spacer part with a flat surface between the wall and the microphone module. The spacer part is, for example, a resin part. The spacer part is fixed to the wall with an adhesive member, and the microphone hole is formed through it together with the wall. For this reason, the microphone hole of the spacer part must not be misaligned with the microphone hole of the wall. Furthermore, surface treatments such as anodizing cannot be performed after the spacer part is fixed with an adhesive member, and the metallic luster mentioned above becomes an even greater problem.

[0006] This invention has been made in consideration of the problems of the prior art described above, and aims to provide a method for manufacturing an electronic device housing and an electronic device that can suppress the deterioration of external quality due to microphone holes. [Means for solving the problem]

[0007] A method for manufacturing an electronic device housing according to a first aspect of the present invention is a method for manufacturing an electronic device housing, comprising the steps of: forming a first hole from the outer surface side of a wall provided on a metal housing member; performing a surface treatment on at least the outer surface of the wall and the inner surface of the first hole after the step of forming the first hole; fixing a spacer part having a mounting surface for a microphone module to the inner surface of the wall with an adhesive member after the step of performing the surface treatment; and forming a second hole having an inner diameter smaller than the first hole coaxially with the first hole so as to penetrate from the first hole to the mounting surface of the spacer part after the step of fixing the spacer part.

[0008] An electronic device according to a second aspect of the present invention comprises a metal housing member having a wall portion through which a microphone hole is formed; a microphone module provided on the inner surface side of the wall portion and acquiring sound information through the microphone hole; and a spacer component fixed to the inner surface of the wall portion with an adhesive member and having a mounting surface for the microphone module on the side opposite to the wall portion, wherein the microphone hole has a first hole portion opening to the outer surface of the wall portion and a second hole portion having a smaller inner diameter than the first hole portion and formed coaxially with the first hole portion, and penetrating from the first hole portion to the mounting surface of the spacer component, and the housing member is surface-treated at least on the outer surface of the wall portion and the inner surface of the first hole portion. [Effects of the Invention]

[0009] According to the above embodiment of the present invention, it is possible to suppress the deterioration of appearance quality due to the microphone hole. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a schematic plan view of an electronic device according to one embodiment, viewed from above. [Figure 2] Figure 2 is a schematic plan view showing the internal structure of the first enclosure. [Figure 3A] Figure 3A is an exploded perspective view showing a magnified portion of the housing components. [Figure 3B] Figure 3B is a perspective view showing the housing component shown in Figure 3A with the spacer component and microphone module attached. [Figure 4] Figure 4 is a schematic side cross-sectional view of the first housing with respect to the microphone module and its surrounding area. [Figure 5] Figure 5 is a schematic side cross-sectional view of the housing member immediately before machining the second hole shown in Figure 4. [Figure 6] Figure 6 is a flowchart of a method for manufacturing an electronic device housing according to one embodiment. [Modes for carrying out the invention]

[0011] Hereinafter, preferred embodiments of the method for manufacturing an electronic device housing and the electronic device according to the present invention will be described in detail with reference to the attached drawings.

[0012] Figure 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in Figure 1, the electronic device 10 of this embodiment is a clamshell-type notebook PC, and is configured such that a first housing 11 and a second housing 12 are connected by a hinge 14 so as to be rotatable relative to each other. In this embodiment, a notebook PC electronic device 10 is used as an example, but the electronic device may be other than a notebook PC, for example, a tablet PC, a display device, a smartphone, or a portable game console.

[0013] The second enclosure 12 is a flat box-shaped structure and is adjacent to the first enclosure 11. Inside the second enclosure 12 are various electronic components such as a motherboard equipped with a CPU, a storage device, and a battery unit. The top surface of the second enclosure 12 faces a keyboard 16 and a touchpad 17.

[0014] The first enclosure 11 is a flatter box-shaped body that is thinner than the second enclosure 12. The first enclosure 11 is equipped with a display panel 18. Hereinafter, the first enclosure 11 and each component mounted thereon will be described using the direction as seen from the perspective of an operator viewing the display surface 18a of the display panel 18, with the left and right directions referred to as the X1 and X2 directions, the up and down directions as the Y1 and Y2 directions, and the depth directions as the Z1 and Z2 directions. The X1 and X2 directions may also be collectively referred to as the X direction, and similarly, the Y1 and Y2 directions and the Z1 and Z2 directions may be referred to as the Y direction and the Z direction.

[0015] The display surface 18a of the display panel 18 faces the Z1-side surface (front surface 11a) of the first housing 11. The first housing 11 includes a housing member 20 that forms a back surface 11b (Z2-side surface) and side surfaces 11c on the four sides, and a bezel member 21 that forms the peripheral edge of the front surface 11a. The bezel member 21 is a frame-shaped member that surrounds the outer peripheral edge of the display panel 18. The front surface 11a of the first housing 11 is covered with a glass plate 22 over substantially the entire area including the bezel member 21. The hinge 14 is connected to the Y2-side edge of the first housing 11.

[0016] The display panel 18 is composed of, for example, a liquid crystal display or an organic EL display. The display panel 18 has a structure in which, for example, glass, a liquid crystal layer, a light guide plate, etc. are laminated and the outer peripheral edges of the respective layers are fixed to each other with a double-sided tape, an adhesive, or the like. The glass plate 22 covers the display surface 18a to constitute a touch panel that receives touch operations on the display panel 18.

[0017] FIG. 2 is a plan view schematically showing the internal structure of the first housing 11. In FIG. 2, the illustration of the glass plate 22 is omitted, and only the outer shape of the display panel 18 is shown by a two-dot chain line.

[0018] As shown in FIG. 2, the housing member 20 has a plate portion 24 and a standing wall 25 provided so as to stand up from the outer peripheral edge of the plate portion 24. The plate portion 24 is a rectangular plate and forms the back surface 11b of the first housing 11. The plate portion 24 is, for example, a flat plate or a shallow dome-shaped plate that is slightly curved on the back surface 11b side. The standing wall 25 is a wall portion that stands up in the Z1 direction from the outer peripheral edge of the plate portion 24 and forms each side surface 11c of the first housing 11. The Z1-side surface (upper end surface) of the standing wall 25 serves as the adhering surface of the bezel member 21. The reference numeral 20a in FIGS. 1 and 2 is a protruding portion that projects in the Y1 direction from approximately the center of the Y1-side edge of the housing member 20. The protruding portion 20a expands the installation space for a camera module 34 and a microphone module 36 described later. The protruding portion 20a may be omitted.

[0019] The housing member 20 can be formed of a metal such as an aluminum alloy or magnesium. For such sheet metal, the plate portion 24 and the vertical wall 25 can be formed on the housing member 20 by, for example, machining or press forming. In the present embodiment, a housing member 20 formed by press forming a sheet metal made of an aluminum alloy and forming the plate portion 24 and the vertical wall 25 is used.

[0020] As shown in FIG. 2, on the inside of the housing member 20, a double-sided adhesive tape 26, a bracket 28, a wiring portion 32, a camera module 34, and a microphone module 36 are attached.

[0021] The double-sided adhesive tape 26 is, for example, a pair of left and right strip-shaped double-sided adhesive tapes extending in the Y direction. The double-sided adhesive tape 26 is for fixing the display panel 18 to the housing member 20. The double-sided adhesive tape 26 adhesively fixes the back surface opposite to the display surface 18a of the display panel 18 and the inner surface 24a (the surface on the back side of the back surface 11b) of the plate portion 24.

[0022] The brackets 28 are provided in a pair on the left and right along the Y2 side edge of the first housing 11, for example, and are adhesively fixed to the inner surface 24a respectively. The bracket 28 is a metal part for screwing the hinge 14. The bracket 28 is electrically connected to the second housing 12 via a metal hinge 14.

[0023] As shown in FIG. 2, the wiring portion 32 is composed of a wide flexible substrate. The wiring portion 32 is placed on the inner surface 24a of the plate portion 24. The wiring portion 32 is a part of the wiring for connecting the camera module 34 and the microphone module 36 to the motherboard on the second housing 12 side. The wiring portion 32 is a collection of the flexible substrate 34a of the camera module 34 and the flexible substrate 42 of each microphone module 36, which will be described later. A connector 32a for connecting the Y2 side end of the wiring portion 32 to a predetermined relay board is mounted. The wiring portion 32 is connected to the motherboard via this relay board. The wiring portion 32 may be directly connected to the motherboard without passing through the relay board.

[0024] The camera module 34 is a circuit board (PCB) on which a camera lens and IRLEDs are mounted. The camera lens is a camera that can be used for video recording, etc., and has an image sensor mounted on the back of a light-gathering lens located in the center. The IRLEDs are infrared cameras that can be used for face recognition, etc. The camera module 34 is connected to the wiring section 32 via a flexible circuit board 34a.

[0025] The microphone modules 36 are arranged in pairs, left and right, to form a stereo microphone. Only one microphone module 36 may be used. While the left and right microphone modules 36 may differ in the shape of the flexible circuit board 42 and the arrangement of the microphone elements 40 (described later), their basic configurations may be identical or similar. Therefore, in the following description, the left and right microphone modules 36 will not be distinguished and will be described together using the same reference numerals.

[0026] Figure 3A is an enlarged exploded perspective view of a portion of the housing member 20. Figure 3B is a perspective view of the housing member 20 shown in Figure 3A with the spacer part 43 and the microphone module 36 attached. Figure 4 is a schematic side cross-sectional view of the first housing 11 with the microphone module 36 and its surrounding area.

[0027] As shown in Figures 2 to 4, the microphone module 36 is attached to the vertical wall 25 on the Y1 side of the housing member 20 using a spacer part 43. In this embodiment, the microphone module 36 is attached to the vertical wall 25 of the protruding portion 20a, but the microphone module 36 may be attached to other vertical walls 25. The microphone module 36 can also be attached to the plate portion 24 using a spacer part 43. In this case, the microphone hole 46, which will be described later, will penetrate the plate portion 24 in the Z direction, for example.

[0028] As described above, the housing member 20 of this embodiment is a member formed by press-forming an aluminum alloy sheet metal. The vertical wall 25 rises from the edge of the plate portion 24. At the bend between the vertical wall 25 and the plate portion 24, that is, at the base of the vertical wall 25, a curved constricted portion 20b is formed. The constricted portion 20b reduces the apparent thickness of the first housing 11 in the Z direction and further suppresses the exposure of sharp edges.

[0029] The inner surface 25a of such a vertical wall 25 is formed as a curved surface along the constricted portion 20b, making it difficult to secure a flat surface for the microphone module 36 to be in close contact with it. The spacer part 43 is fixed to the inner surface 25a of such a vertical wall 25. The spacer part 43 secures a flat mounting surface 43a on the inner surface 25a side of the vertical wall 25 for the microphone module 36 to be in close contact with it.

[0030] The spacer part 43 is a resin part made of, for example, PC / ABS. The spacer part 43 may also be made of a machined part made of a metal material such as an aluminum alloy. The spacer part 43 has a mounting surface 43a and a fixing surface 43b. The mounting surface 43a is a flat surface on which the microphone module 36 can be attached in close contact. The fixing surface 43b is provided on the opposite side of the mounting surface 43a and is a curved surface that is fixed in close contact with the inner surface 25a of the constricted portion 20b. The fixing surface 43b can be fixed to the inner surface 25a with an adhesive member 45 such as an adhesive or double-sided adhesive tape. In this embodiment, an adhesive is used as the adhesive member 45.

[0031] The spacer component 43 may have a notched portion 43c at the corner of the Z1 side surface on the vertical wall 25 side. The notched portion 43c is used to fix the bezel member 21.

[0032] As shown in Figure 4, a microphone hole 46 extending in the Y direction is formed through the vertical wall 25 and the spacer component 43. The microphone hole 46 communicates with the sound hole 40a of the microphone element 40 and is a through-hole that delivers sound information from outside the first housing 11 to the microphone element 40.

[0033] The microphone hole 46 has a stepped shape formed by the continuation of a first hole portion 46a and a second hole portion 46b with different inner diameters. The first hole portion 46a opens into the outer surface 25b of the vertical wall 25. The first hole portion 46a does not have to penetrate the vertical wall 25 in the plate thickness direction (Y direction). In other words, the first hole portion 46a may have a back surface (bottom surface) formed by a part of the vertical wall 25. The second hole portion 46b penetrates from the back surface of the first hole portion 46a to the mounting surface 43a of the spacer component 43. The second hole portion 46b may include a portion 46b1 that penetrates the vertical wall 25 on the back side of the first hole portion 46a and a portion 46b2 that penetrates the spacer component 43. The holes 46a and 46b are formed coaxially, and the inner diameter of the second hole portion 46b is smaller than that of the first hole portion 46a.

[0034] As shown in Figures 2 to 4, the microphone module 36 may have a microphone element 40 and a flexible substrate 42.

[0035] The microphone element 40 is, for example, a MEMS microphone that shields a MEMS chip or IC chip having a diaphragm mounted on a substrate (PCB: Printed Circuit Board). The sound hole 40a opens on the contact surface of the microphone element 40 with respect to the mounting surface 43a and penetrates the flexible substrate 42. The sound hole 40a communicates with the microphone hole 46 that penetrates the spacer component 43 and the vertical wall 25. The sound hole 40a is the sound input section of the microphone module 36 and communicates with the diaphragm inside the microphone element 40. The microphone element 40 is fixed to the inner surface 25a of the vertical wall 25 via the spacer component 43 and can acquire sound information from outside the first housing 11 through the microphone hole 46.

[0036] The flexible printed circuit board (FPC) 42 has a microphone element 40 mounted on its Y1 side end. The flexible circuit board 42 is the wiring that connects the microphone element 40 to the wiring section 32. The microphone element 40 is mounted on the end of the flexible circuit board 42. This end is upright in the Z direction and is tightly fixed to the mounting surface 43a of the spacer component 43 with double-sided adhesive tape or adhesive.

[0037] As shown by the dashed line in Figure 4, the housing member 20 has a surface treatment 48 applied to at least the outer surface 25b of the vertical wall 25 and the inner surface of the first hole 46a. The surface treatment 48 is, for example, anodizing or painting, and is, for example, black. The surface treatment 48 is also applied to the outer surface (back surface 11b) of the plate portion 24. The surface treatment 48 may also be applied to the inner surface 25a of the vertical wall 25 and the inner surface 24a of the plate portion 24.

[0038] As will be described in detail later, in this embodiment, the microphone hole 46 has a first hole portion 46a formed before the surface treatment 48 is applied, and a second hole portion 46b formed after the surface treatment 48 is applied. Therefore, the inner surface of the first hole portion 46a is treated with surface treatment 48. On the other hand, the inner surface of the portion 46b1 of the second hole portion 46b that is formed on the metal vertical wall 25 is not treated with surface treatment 48, and the bare aluminum alloy forming the vertical wall 25 is exposed.

[0039] As shown in Figures 3A to 4, the bezel member 21 can be installed so as to sit on the Z1 side surface (upper end) of the vertical wall 25 and can be fixed to the vertical wall 25 with an adhesive member 45. The bezel member 21 has a flat support surface 21a facing the Z1 side. The edge of the glass plate 22 is fixed to the support surface 21a with double-sided adhesive tape or adhesive.

[0040] The bezel member 21 has a recessed portion 21b that is recessed towards Y1, including the support surface 21a, at the position where it overlaps with the spacer part 43. The spacer part 43 is housed in the recessed portion 21b and is fixed to the bezel member 21 with an adhesive member 45. The protruding portion of the bezel member 21 below the support surface 21a is inserted into the notched portion 43c of the spacer part 43. This protruding portion is fixed to the spacer part 43 and the vertical wall 25 with the adhesive member 45.

[0041] As shown in Figures 3B and 4, the Z1-side surface (end face 43d) of the spacer component 43 is positioned one step lower on the Z2 side than the support surface 21a. That is, the adhesive member 45 that fixes the bezel member 21 and the spacer component 43 may overflow onto the end face 43d side before curing. Even in this case, because the end face 43d is lower than the support surface 21a, the overflowing adhesive member 45 is prevented from protruding Z1 side beyond the support surface 21a and pressing against the glass plate 22.

[0042] Next, the manufacturing method of the first housing 11 will be explained, mainly focusing on the method for forming the microphone hole 46 and its surrounding area.

[0043] Figure 5 is a schematic side cross-sectional view of the housing member 20 immediately before machining the second hole 46b shown in Figure 4. Figure 6 is a flowchart of a method for manufacturing an electronic device housing according to one embodiment.

[0044] First, in step S1 in Figure 6, a first hole 46a is formed in the vertical wall 25 of the housing member 20. In this embodiment, the first hole 46a is a concave hole that does not penetrate the vertical wall 25 (see Figure 5).

[0045] In step S2, a surface treatment 48 is applied to the surface of the housing member 20 as shown in Figure 5. The surface treatment 48 is applied to at least the outer surface 25b of the vertical wall 25 and the inner surface of the first hole 46a. As a result, the same surface treatment 48 is applied to the vertical wall 25 and the inner surface of the first hole 46a formed in the vertical wall 25, making the first hole 46a less noticeable in the appearance of the housing member 20.

[0046] In step S3, as shown in Figure 5, the fixing surface 43b of the spacer part 43 is fixed to the inner surface 25a of the vertical wall 25 with an adhesive member 45. At this time, the spacer part 43 can also be fixed to the inner surface 24a of the plate part 24 with the adhesive member 45 on its lower surface (Z2 side surface). The spacer part 43 is fixed to the inner surface 25a on the far side of the first hole 46a, so that it is installed in a position that overlaps with the first hole 46a in the Y direction.

[0047] In step S4, the bezel member 21 is fixed to the vertical wall 25 and the spacer part 43 as shown in Figure 5. The bezel member 21 is a frame-shaped member formed to surround the frame-shaped vertical wall 25. As described above, the bezel member 21 is installed so that the concave portion 21b fits over the spacer part 43.

[0048] In this embodiment, the bezel member 21 is made of the same PC / ABS resin as the spacer part 43. Therefore, the spacer part 43 can be integrally molded with a part of the bezel member 21, reducing the number of parts. In this case, the fixing process for the spacer part 43 (step S3) and the fixing process for the bezel member 21 (step S4) are the same process.

[0049] Depending on the type of electronic device, it is conceivable that the housing for mounting the microphone module 36 may not be the housing for mounting the display panel 18. In this case, the bezel member 21 is omitted, and step S4 is omitted.

[0050] In step S5, as shown in Figure 5, a second hole 46b is formed using a predetermined drilling tool T to create the microphone hole 46. Examples of drilling tools T include machining tools such as drills and laser drilling machines. As described above, the inner diameter of the second hole 46b is smaller than the inner diameter of the first hole 46a. This allows the drilling tool T to drill the second hole 46b along the direction (Y2 direction) from the outer surface 25b side of the vertical wall 25 toward the back surface of the first hole 46a. The second hole 46b is formed so as to penetrate the vertical wall 25 from the back surface of the first hole 46a and further penetrate the adhesive member 45 and the spacer part 43. Reference numeral 43e in Figure 5 indicates a counterbore-shaped recess. The recess 43e prevents burrs from protruding onto the mounting surface 43a when the second hole 46b is formed.

[0051] Through the above steps, the formation of the microphone hole 46 and its surrounding area in the housing member 20 constituting the first housing 11 is completed. The first housing 11 manufactured in this way has the microphone module 36 fixed to the mounting surface 43a of the spacer part 43 with double-sided adhesive tape or the like, and the sound hole 40a is connected to the second hole 46b. This completes the mounting of the microphone module 36. After that, the bracket 28, display panel 18, glass plate 22, etc. are attached as appropriate to complete the first housing 11.

[0052] As described above, the manufacturing method of the first housing 11 according to this embodiment includes the step of forming a first hole 46a from the outer surface 25b side of a wall portion (vertical wall 25 in this embodiment) provided on a metal housing member 20. After the step of forming the first hole 46a, the manufacturing method includes the step of applying a surface treatment 48 to at least the outer surface 25b of the vertical wall 25 and the inner surface of the first hole 46a. After the step of applying the surface treatment 48, the manufacturing method includes the step of fixing a spacer part 43 having a mounting surface 43a for the microphone module 36 to the inner surface 25a of the vertical wall 25 with an adhesive member 45. After the step of fixing the spacer part 43, the manufacturing method includes the step of forming a second hole 46b having an inner diameter smaller than the first hole 46a, coaxially with the first hole 46a so as to penetrate from the first hole 46a to the mounting surface 43a of the spacer part 43.

[0053] According to this manufacturing method, the microphone hole 46 is formed in two stages, a first hole 46a and a second hole 46b, on the metal housing member 20. In this case, the first hole 46a is formed before the surface treatment 48 is applied, and the second hole 46b is formed after the surface treatment 48 is applied. As a result, the inner surface of the first hole 46a, which opens to the outer surface 25b, remains in a state where the surface treatment 48 has been applied. On the other hand, the metallic luster of the metal forming the housing member 20 is exposed on the inner surface of the second hole 46b. However, the second hole 46b has a smaller diameter than the first hole 46a and is located deeper than the first hole 46a. Therefore, even if the metallic luster is exposed on the inner surface of the second hole 46b, this metallic luster is less noticeable on the appearance of the first housing 11. As a result, this manufacturing method makes it possible to suppress the deterioration of the appearance quality of the first housing 11 due to the microphone hole 46.

[0054] In this manufacturing method, the step of fixing the spacer part 43 with the adhesive member 45 is performed after the surface treatment 48 is applied and before the second hole 46b is formed. This prevents the adhesive member 45 for fixing the spacer part 43 from peeling off during the surface treatment 48. Furthermore, if the spacer part 43 is made of resin, there is a concern that it may deform during the surface treatment 48, such as anodizing, but this problem can also be prevented. Moreover, in this manufacturing method, the second hole 46b is formed through the spacer part 43 after it has been fixed with the adhesive member 45. This allows the second hole 46b to penetrate smoothly from the vertical wall 25 to the spacer part 43 without any steps. In other words, it prevents the microphone hole 46 from being misaligned between the vertical wall 25 and the spacer part 43.

[0055] In this embodiment, for example, the inner diameter of the first hole 46a is set to about 1.2 mm, and the inner diameter of the second hole 46b is set to about 0.8 mm. This makes it possible to more reliably suppress damage to the surface treatment 48 applied to the inner surface of the first hole 46a and exposure of the metallic luster when forming the second hole 46b through the hole T. The inner diameters of the holes 46a and 46b are not limited to these. It is preferable that the inner diameter of the first hole 46a is, for example, 0.2 mm or more larger than the inner diameter of the second hole 46b. This makes it possible to more reliably suppress damage to the surface treatment 48 of the first hole 46a when the second hole 46b is formed with a general drilling tool T.

[0056] Preferably, the first hole 46a is formed so as not to penetrate the vertical wall 25, and the second hole 46b is formed so as to penetrate from the vertical wall 25 remaining behind the first hole 46a to the spacer part 43. This prevents the adhesive member 45 from leaking into the first hole 46a when fixing the spacer part 43. This prevents the adhesive member 45 from blocking the first hole 46a or contaminating the surface treatment 48 provided on the inner surface of the first hole 46a.

[0057] It is preferable that the depth of the first hole 46a be greater than the depth of at least the portion 46b1 formed in the vertical wall 25 of the second hole 46b. If the depth of the portion 46b1 in which the metallic luster appears is smaller than the depth of the first hole 46a, the metallic luster will be even less noticeable on the appearance of the first housing 11.

[0058] Furthermore, the electronic device 10 according to this embodiment includes a metal housing member 20 through which a microphone hole 46 is formed in a wall (vertical wall 25 in this embodiment), a microphone module 36 that acquires sound information through the microphone hole 46, and a spacer part 43 fixed to the inner surface 25a of the vertical wall 25 with an adhesive member 45 and having a mounting surface 43a on the side opposite to the vertical wall 25. The microphone hole 46 has a first hole 46a that opens into the outer surface 25b of the vertical wall 25, and a second hole 46b that is formed coaxially with a smaller inner diameter than the first hole 46a and penetrates from the first hole 46a to the mounting surface 43a of the spacer part 43. The housing member 20 is surface-treated 48 on at least the outer surface 25b of the vertical wall 25 and the inner surface of the first hole 46a.

[0059] In this electronic device 10, the microphone hole 46 is formed in two stages: a first hole 46a and a second hole 46b. The electronic device 10 has a surface treatment 48 applied to at least the outer surface 25b of the vertical wall 25 and the inner surface of the first hole 46a. As a result, the housing member 20 constituting the electronic device 10 can be manufactured by forming the second hole 46b through the back of the first hole 46a after the surface treatment 48 has been applied. This prevents the metallic luster of the housing member 20 from being noticeable on the appearance of the first housing 11, even if the metallic luster of the housing member 20 is exposed on the inner surface of the second hole 46b. As a result, the electronic device 10 can suppress the deterioration of the appearance quality of the first housing 11 due to the microphone hole 46.

[0060] It should be noted that the present invention is not limited to the embodiments described above, and can be freely modified without departing from the spirit of the invention. [Explanation of Symbols]

[0061] 10 Electronic equipment 11. First cabinet 18 Display Panels 20 Housing components 21 Bezel component 24 Plate section 25 Vertical wall 36 Microphone Modules 40 microphone elements 43 Spacer parts 43a Mounting surface 43b Fixed surface 45 Adhesive material 46 microphone holes 46a 1st hole 46b 2nd hole 48 Surface treatment

Claims

1. A method for manufacturing an electronic device housing, A step of forming a first hole from the outer surface side of a wall portion provided on a metal housing member, After the step of forming the first hole, the process involves surface treatment of at least the outer surface of the wall and the inner surface of the first hole, After the surface treatment step, the spacer component having a mounting surface for the microphone module is fixed to the inner surface of the wall portion with an adhesive member. After the step of fixing the spacer component, a second hole having a smaller inner diameter than the first hole is formed coaxially with the first hole so as to penetrate from the first hole to the mounting surface of the spacer component, has A method for manufacturing an electronic device housing, characterized by the following features.

2. A method for manufacturing an electronic device housing according to claim 1, In the step of forming the first hole, the first hole is formed so as not to penetrate the wall. In the step of forming the second hole, the second hole is formed so as to penetrate from the wall portion at the back of the first hole to the spacer component. A method for manufacturing an electronic device housing, characterized by the following features.

3. A method for manufacturing an electronic device housing according to claim 2, The depth of the first hole is greater than the depth of at least the portion of the second hole formed in the wall. A method for manufacturing an electronic device housing, characterized by the following features.

4. A method for manufacturing an electronic device housing according to any one of claims 1 to 3, The housing member has a plate portion and a vertical wall that rises from the edge of the plate portion. The aforementioned wall portion is the vertical wall. A method for manufacturing an electronic device housing, characterized by the following features.

5. A method for manufacturing an electronic device housing according to claim 4, The housing member is formed by press-forming sheet metal to create the plate portion and the vertical wall. A method for manufacturing an electronic device housing, characterized by the following features.

6. A method for manufacturing an electronic device housing according to claim 4, The aforementioned electronic device housing is a housing for a display panel, The process of fixing the spacer component and the process of forming the second hole involves fixing a bezel member for supporting the edge of the surface plate covering the surface of the display panel to the vertical wall and the spacer component with an adhesive member after the process of fixing the spacer component and the spacer component, after the process of fixing the spacer component and the spacer component and the bezel member for supporting the edge of the surface plate covering the surface of the display panel. A method for manufacturing an electronic device housing, characterized by the following features.

7. It is an electronic device, A metal housing member having a wall portion, with a microphone hole formed through the wall portion, A microphone module provided on the inner surface of the wall portion, which acquires sound information through the microphone hole, A spacer component fixed to the inner surface of the wall portion with an adhesive member, having a mounting surface for the microphone module on the side opposite to the wall portion, Equipped with, The aforementioned microphone hole is The first hole opening to the outer surface of the wall portion, A second hole having an inner diameter smaller than the first hole and formed coaxially with the first hole, and penetrating from the first hole to the mounting surface of the spacer part, It has, The housing member is surface-treated at least on the outer surface of the wall portion and the inner surface of the first hole portion. An electronic device characterized by the following features.

8. The electronic device according to claim 7, The first hole does not penetrate the wall, The second hole extends from the wall portion located at the back of the first hole to the spacer component. An electronic device characterized by the following features.

9. The electronic device according to claim 7 or 8, The aforementioned surface treatment is not applied to the inner surface of the second hole. An electronic device characterized by the following features.

10. The electronic device according to claim 7 or 8, The housing member has a plate portion and a vertical wall that rises from the edge of the plate portion. The aforementioned wall portion is the vertical wall. An electronic device characterized by the following features.

11. The electronic device according to claim 10, A display panel supported by the aforementioned housing member, A surface plate that covers the surface of the display panel, A bezel member is fixed to the vertical wall and the spacer component with an adhesive member and supports the edge of the surface plate, Equipped with An electronic device characterized by the following features.

Images