Conductive member, method for manufacturing an electronic device, connection structure, and electronic device

Abstract

To provide a conductive member that can form a metal film using a simple process. [Solution] The conductive member 1 comprises an adhesive layer 10 and a metal foil layer 20. The adhesive layer 10 consists of an adhesive composition 14 containing conductive particles 12. The metal foil layer 20 is placed on the adhesive layer 10. This conductive member 1 can be used, for example, to form a predetermined metal film.

Description

【Technical Field】 【0001】 The present disclosure relates to a conductive member, a method for manufacturing an electronic component, a connection structure, and an electronic device. 【Background Art】 【0002】 In an electronic device including an electronic component such as a semiconductor chip, the electronic component or the electronic device may be covered with a shielding member in order to reduce electromagnetic interference (EMI) due to noise. As such a shielding member, for example, as described in Non-Patent Document 1, a sheet metal shield is used, or a shielding material formed by sputtering or the like on the electronic component is used. 【Prior Art Documents】 【Non-Patent Documents】 【0003】 【Non-Patent Document 1】 Masaaki Ishida, Keiju Yamada, Hisashi Yamazaki, "Electromagnetic Wave Shielding Technology in Semiconductor Packages", Toshiba Review Vol.67 No.2 (2012), 2012 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 According to the method of forming a shielding film on an electronic component as described in Non-Patent Document 1, the size reduction and thickness reduction of the electronic device can be achieved as compared with the configuration using a sheet metal shield. However, in the film formation process using sputtering, a lot of time is required to stack a metal film such as a shielding film to a predetermined thickness. Therefore, a new method capable of shortening the formation time of the metal film is desired. 【0005】 One aspect of the present disclosure is to provide a conductive member, a method for manufacturing an electronic device, a connection structure, and an electronic device that can form a metal film by a simple process 【Means for Solving the Problems】 【0006】 This disclosure relates, in one aspect, to a conductive member. This conductive member comprises an adhesive layer made of an adhesive composition containing conductive particles, and a metal foil layer disposed on the adhesive layer. 【0007】 This conductive member comprises an adhesive layer containing conductive particles and a metal foil layer, and is configured so that the metal foil layer can be used as a metal film (e.g., an electromagnetic wave shielding film). In this case, the conductive member with the metal foil layer already formed is attached to the part where the metal film is required via the adhesive layer to form a metal film on the electronic device. Therefore, by using this conductive member, it is possible to form a metal film in a simple process. Furthermore, because the metal foil layer is already formed, a uniform metal film can be formed, providing an electronic device with stable performance (e.g., shielding performance) due to the metal film. This conductive member can also be used as appropriate to form electronic devices where a metal film is required other than a shielding film. 【0008】 In the conductive member described above, the thickness of the metal foil layer may be 1 μm or more and 200 μm or less. In this case, the conductive member can function sufficiently as a metal film, and it is possible to miniaturize and reduce the height of the manufactured electronic device. In this configuration, the thickness of the metal foil layer may be 3 μm or more, 100 μm or less, 25 μm or less, or 18 μm or less. By making the thickness of the metal foil layer 25 μm or less or 18 μm or less, further miniaturization and reduction of the height of the electronic device can be achieved. 【0009】 In the conductive member described above, the surface roughness Rz of the outer surface of the metal foil layer opposite the adhesive layer may be 0.5 μm or more and 17 μm or less. In this case, the outer surface of the metal foil layer, which functions as a metal film, becomes a shiny surface with reduced surface roughness, which can improve the corrosion resistance of the metal film of the manufactured electronic device. 【0010】 The conductive member described above may further have a retaining film on the side of the metal foil layer opposite to the adhesive layer. In this case, the formation process becomes easier when forming a metal film using this conductive member. Also, since the metal foil layer is protected by the retaining film when forming the metal film, it is prevented from damaging the metal foil layer, which functions as a metal film, during the formation process, and an electronic device with superior metal film performance can be provided. Furthermore, even if there are irregularities on the surface of the semi-finished electronic device when forming the metal film, the retaining film functions as a buffer, allowing the conductive member to sufficiently conform to these irregularities and form a metal film with stable performance. Moreover, in the formation of a metal film on the surface of a semi-finished product described later, one example disclosed is a method in which this conductive member is pressed onto the surface of the semi-finished product. In this case, even if there are some irregularities on the surface of the semi-finished product, the retaining film functions as a buffer, allowing the metal foil layer to conform to the irregularities when the surface of the semi-finished product and the adhesive layer adhere, providing stable performance. 【0011】 Another effect of the retaining film mentioned above is that it allows the adhesive composition in the adhesive layer to spread evenly across the uneven surface of the semi-finished electronic device, suppressing the generation of voids caused by these irregularities and improving the reliability of the electronic device with the metal film formed on it. Furthermore, the presence of the retaining film ensures that the adhesive composition spreads sufficiently across the irregularities when pressed, suppressing the generation of irregularities in the metal foil layer due to the irregularities on the surface of the semi-finished product, and enabling the formation of a metal film with stable performance. In other words, even if there are some irregularities on the surface of the semi-finished electronic device, it becomes easier to ensure the flatness of the metal foil layer after pressing, and when the metal film is used as a shielding film, for example, it becomes possible to provide an electronic device with stable shielding performance. When the metal film has high flatness in this way, it becomes easier to design additional processes such as forming a further resin layer on the surface of the metal film or arranging another electronic device, and a stable electronic device can be provided. In addition, even if there are irregularities on the surface of the semi-finished electronic device, the retaining film allows the adhesive layer to spread sufficiently across the irregularities when the conductive member is pressed, thereby suppressing stretching or shrinking of the metal foil layer, or damage such as streaks or cracks. In this way, the retaining film can suppress extreme deformation of the metal foil layer. Furthermore, the conductive member described above may have another retaining film on the side of the adhesive layer opposite to the metal foil layer. This allows for protection of the adhesive layer. 【0012】 In the conductive member described above, the adhesive layer and the metal foil layer may be provided separately, and the adhesive layer may be bonded to the metal foil layer during use. In this case, since the adhesive layer and the metal foil layer can be prepared separately (for example, as a set of conductive members for electromagnetic wave shielding), it becomes possible to select a conductive member with a more optimal material configuration, thereby improving the degree of freedom in the process of manufacturing, for example, an electromagnetic wave shielding film using the conductive member. 【0013】 In the conductive member described above, the average particle size of the conductive particles may be greater than the thickness of the adhesive layer. In this case, when connecting the metal foil layer to the ground member using the conductive particles, the conductive particles are more likely to come into contact with the metal foil layer and the ground member, and by appropriately crushing the conductive particles, the above-mentioned connection can be achieved more reliably. The average particle size used here is the average value obtained by measuring the particle size of 300 arbitrary particles (pcs) by observation using a scanning electron microscope (SEM). If the particle has protrusions or the shape of the particle is not spherical, the particle size is defined as the diameter of the circle circumscribing the particle in the SEM image. The same applies below. 【0014】 In the conductive member described above, the conductive particles may include first conductive particles having a first average particle size and second conductive particles having a second average particle size larger than the first average particle size. In this case, even if the flatness of the semi-finished product on which the conductive member is installed is low, the metal foil layer can be connected to the ground member by either of the conductive particles, and for example, a shield film can be stably formed. Furthermore, in order to ensure good connection via the conductive particles, the conductive member may further have conductive particles with average particle sizes different from the first and second average particle sizes. This makes it easier for the conductive particles to contact each other and for each conductive particle to contact the metal foil layer, making it possible to further improve the connection between the metal foil layer and the ground member. 【0015】 Another aspect of the present invention relates to a method for manufacturing an electronic device. This method for manufacturing an electronic device comprises the steps of: providing a semi-finished product on which at least one electronic component is mounted on a wiring board; forming at least one metal conductive portion on the semi-finished product; sealing the electronic component on the semi-finished product with resin; and arranging a conductive member having any of the above-described forms on the metal conductive portion and electrically connecting the metal conductive portion and the metal foil layer with conductive particles. 【0016】 In this method of manufacturing electronic devices, the metal film of the electronic device is formed using the conductive material described above. In this case, a metal foil layer is formed in advance, and this conductive material is attached to the parts where a metal film is required to form the metal film. Therefore, the metal film can be formed in a simple process. Furthermore, when depositing a metal film by sputtering, the sputtering thickness may be thinner at the corners of the semi-finished product than at other parts. However, with this manufacturing method, since a pre-fabricated metal foil layer is used, it is possible to form a more uniform metal film. As a result, it is possible to provide an electronic device with stable performance (e.g., shielding performance) due to the metal film. It should be noted that when forming a metal film by sputtering, the sputtering time tends to be long in order to ensure a thickness that allows the metal film to perform to its full potential. Also, if the flatness of the surface of the semi-finished electronic device is low, the thickness of the sputtering layer will not be uniform, which tends to reduce the performance of the metal film. Therefore, conventionally, it has been necessary to either increase the sputtering time or perform a polishing process to improve the flatness of the surface of the semi-finished product, which lengthens the entire process. In contrast, the manufacturing method using the conductive material described above involves placing a pre-fabricated metal foil layer on the surface of a semi-finished product, thus enabling the acquisition of stable metal film performance in a simple manner. 【0017】 In the above-described method for manufacturing electronic devices, a sealing step may be performed after the step of forming the metal conductive portion. In this case, since the metal conductive portion is formed on the surface of the ground layer on the semi-finished product before sealing with resin, the connection between the ground layer (ground member) and the metal conductive portion is made good, and a metal conductive portion with sufficient connection strength can be formed. Specific methods for forming the metal conductive portion include a method of forming the metal conductive portion using metal wire with a wire bonding apparatus, a method of connecting metal members such as metal wire, metal foil, or metal plate to the ground layer via solder or metal material paste, a method of providing a light or heat-curable resin on the surface of the ground layer, creating grooves at predetermined positions by laser processing, cutting, or drilling, filling the grooves with metal material paste or plating to form a metal conductive portion, and then removing the curable resin, and a method of forming a photoresist layer so as to cover the ground layer, creating grooves at predetermined positions by exposure development, filling the grooves with metal material paste or plating to form a metal conductive portion, and then removing the photoresist layer. Furthermore, since sealing with resin is performed after forming the metal conductive portion connected to the ground layer by the above-described method, the metal conductive portion can be formed at a desired position. Furthermore, the resin used for sealing has the function of protecting the internal electronic components from humidity, dust, impact, or deformation due to heat, and possesses high moisture resistance and low thermal expansion. Therefore, performing the aforementioned groove processing after sealing would normally require the use of high-energy lasers, high-strength drills, etc., but these are unnecessary with the above method. In addition, when forming grooves using the above method, it is necessary to process without damaging the ground layer, and if residue remains on the ground layer, it may cause problems in the connection with the metal conductive part, but with the above method, these problems are less likely to occur. 【0018】 Furthermore, if the above-described method for manufacturing the electronic device includes a sealing step after the step of forming the metal conductive part, it may further include a step of polishing the surface of the sealed resin so that the tip of the metal conductive part sealed with resin is exposed. The polishing step may be performed using a CMP slurry or a polishing pad. In addition, in the above-described manufacturing method, an electrical connection step may be performed when performing the sealing step. In this case, the step of forming the metal film in the electronic device can be further shortened. For example, when forming the resin on a semi-finished product with a compression mold during sealing, the conductive member described above can be placed on the mold side in advance, the semi-finished product can be covered with the mold, and then molded with resin. 【0019】 In the above-described method for manufacturing electronic devices, a step of forming a metal conductive part may be performed after the sealing step. In this case, for example, a method can be used in which grooves are machined into the resin after the sealing step and the grooves are filled with metal. For example, laser processing, cutting, drilling, or etching can be used for grooving. For filling the grooves with metal, metal material paste, plating, solder, etc., can be used. 【0020】 In the above-described method for manufacturing electronic devices, in the step of electrical connection, conductive particles may be brought into contact with the metal foil layer and the semi-finished metal conductive portion by heating and / or pressurizing the conductive member, or the conductive particles may be crushed between the metal foil layer and the semi-finished metal conductive portion, thereby electrically connecting the metal conductive portion and the metal foil layer with the contacted or crushed conductive particles. In this case, it becomes possible to more effectively electrically connect the metal foil layer, which will become a metal film, and the conductive member connected to the ground wiring. Even if the metal conductive portion has multiple independent shapes, in this conductive member, the conductive particles placed in the adhesive layer come into contact with any of the aforementioned metal conductive portions and connect to the metal foil layer, thus enabling stable performance. Furthermore, in the above-described method for manufacturing electronic components, a protective film may be provided on the side of the metal foil layer opposite to the adhesive layer, and pressurization may be applied to the conductive member via the protective film. 【0021】 In the method for manufacturing the above-described electronic device, at least one metal conduction part is a plurality of metal conduction parts, and in the step of forming the metal conduction parts, a plurality of metal conduction parts may be formed so as to surround the electronic component in the planar direction. In this case, the plurality of metal conduction parts can shield an intrusion (for example, electromagnetic wave) from the side part of the electronic device, and it becomes possible to produce an electronic device in which an intrusion from the side part is further suppressed. In the above manufacturing method, the plurality of metal conduction parts may be formed such that adjacent metal conduction parts contact each other or adjacent metal conduction parts are separated from each other. 【0022】 As yet another aspect, the present invention relates to a connection structure. This connection structure includes a conductive member having any of the above-described forms, and a metal conduction part provided on a semi-finished product and extending toward the conductive member. In this connection structure, the metal conduction part and the metal foil layer are electrically connected by conductive particles. In this case, as described above, a metal film can be formed by a simple process. Further, an electronic device with stable performance due to the metal film can be provided. 【0023】 As yet another aspect, the present invention relates to an electronic device. This electronic device includes a semi-finished product on which at least one electronic component is mounted on a wiring board, and the above-described connection structure. In this case, as described above, a metal film can be formed by a simple process. Further, an electronic device with stable performance due to the metal film can be provided. 【Effects of the Invention】 【0024】 According to the present invention, as one aspect, a metal film can be formed by a simple process. 【Brief Description of the Drawings】 【0025】 [Figure 1] FIG. 1 is a cross-sectional view showing a conductive member according to an embodiment of the present invention. [Figure 2] (a) to (c) of FIG. 2 are diagrams for sequentially explaining a first manufacturing method of an electronic device using the conductive member shown in FIG. 1. [Figure 3] Figures 3(a) and 3(b) are diagrams illustrating the first manufacturing method of an electronic device using the conductive material shown in Figure 1, and are diagrams illustrating the process following Figure 2(c). [Figure 4] Figure 4 is a diagram illustrating the first method of manufacturing an electronic device using the conductive material shown in Figure 1, and is a schematic plan view of the process shown in Figure 2(a) from above. [Figure 5] Figures 5(a) and 5(b) are schematic cross-sectional views showing an enlarged view of the process of connecting a metal foil layer to a metal post with conductive particles in the manufacturing method of the electronic device shown in Figures 2 to 4. (a) shows the state in which the conductive members are arranged, and (b) shows the state in which the connection by conductive particles has been made. [Figure 6] Figures 6(a) to 6(c) are diagrams illustrating, in order, a second method for manufacturing an electronic device using the conductive material shown in Figure 1. [Figure 7] Figures 7(a) to 7(c) are diagrams illustrating, in order, a third method of manufacturing an electronic device using the conductive material shown in Figure 1. [Figure 8] Figures 8(a) to (e) are cross-sectional views illustrating, in order, the method of forming a metal layer by sputtering. [Figure 9] Figure 9 is a cross-sectional view showing a modified example of the conductive member shown in Figure 1. [Modes for carrying out the invention] 【0026】 The following description will explain a conductive member according to one embodiment of the present invention, and a method for manufacturing an electronic device using the conductive member, with reference to the drawings. In the following description, the same or equivalent parts will be denoted by the same reference numerals, and redundant explanations will be omitted. Furthermore, unless otherwise specified, positional relationships such as up, down, left, and right will be based on the positional relationships shown in the drawings. In addition, the dimensional ratios in the drawings are not limited to those shown. 【0027】 In this specification, numerical ranges indicated using "~" include the numbers before and after "~" as the minimum and maximum values, respectively. In numerical ranges described stepwise in this specification, the upper or lower limit of one numerical range may be replaced with the upper or lower limit of another numerical range described stepwise. Furthermore, in numerical ranges described in this specification, the upper or lower limit of that numerical range may be replaced with the values ​​shown in the examples. 【0028】 A conductive member according to one embodiment of the present invention comprises an adhesive layer made of an adhesive composition containing conductive particles, and a metal foil layer disposed on the adhesive layer. The thickness of the metal foil layer may be 1 μm or more and 200 μm or less, or 25 μm or less. The conductive member may be used, for example, to form an electromagnetic wave shield. The conductive member may further comprise a retaining film disposed on at least one of the surfaces of the metal foil layer opposite to the adhesive layer and the surface of the adhesive layer opposite to the metal foil layer. In addition, the conductive member may be provided with the adhesive layer and the metal foil layer as separate components, and the adhesive layer may be able to adhere to the metal foil layer during use. The average particle size of the conductive particles may be greater than the thickness of the adhesive layer. The conductive particles may include first conductive particles having a first average particle size and second conductive particles having a second average particle size larger than the first average particle size. 【0029】 A method for manufacturing an electronic device according to one embodiment of the present invention comprises the steps of: providing a semi-finished product on which at least one electronic component is mounted on a wiring board; forming at least one metal conductive portion on the semi-finished product; sealing the electronic component on the semi-finished product with resin; and arranging a conductive member having any of the above-described forms on the metal conductive portion and electrically connecting the metal conductive portion and the metal foil layer with conductive particles. In the manufacturing method, the sealing step may be performed after the step of forming the metal conductive portion. In this case, the manufacturing method may further include a step of polishing the surface of the sealed resin so that the tip of the metal conductive portion sealed with resin is exposed, and the polishing step may be performed using a CMP slurry or a polishing pad. Furthermore, the electrical connection step may be performed when performing the sealing step. Furthermore, in the manufacturing method, the step of forming the metal conductive portion may be performed after the sealing step. Furthermore, in the manufacturing method, in the step of electrically connecting, the conductive member may be electrically connected to the metal conductive portion and the metal foil layer via the conductive particles by applying heat and / or pressure to the conductive member. In the manufacturing method, a protective film is provided on the side of the metal foil layer opposite to the adhesive layer, and pressure may be applied to the conductive member via the protective film. The at least one metal conductive portion is a plurality of metal conductive portions, and in the step of forming the metal conductive portions, the plurality of metal conductive portions may be formed so as to surround the electronic component in a planar direction. In this case, the plurality of metal conductive portions may be formed so as to be in contact with adjacent metal conductive portions, or so as to be spaced apart from adjacent metal conductive portions. 【0030】 A connection structure according to one embodiment of the present invention comprises a conductive member having any of the above-described forms, and a metal conductive portion provided on a semi-finished product and extending toward the conductive member. In this connection structure, the metal conductive portion and the metal foil layer are electrically connected via the conductive particles. An electronic device according to one embodiment of the present invention comprises the semi-finished product on which at least one electronic component is mounted on a wiring board, and the connection structure described above. 【0031】 Figure 1 is a cross-sectional view showing a conductive member according to one embodiment of the present invention. As shown in Figure 1, the conductive member 1 comprises an adhesive layer 10, a metal foil layer 20, and a retaining film 30. The conductive member 1 may be used as a member for forming a shielding film of an electronic device 120 (see Figure 3(b)). Details of a method for manufacturing an electronic device using the conductive member 1 will be described later. 【0032】 The adhesive layer 10 consists of an adhesive composition 14 containing conductive particles 12. The adhesive layer 10 has a thickness of, for example, 1 μm to 100 μm. The adhesive composition 14 of the adhesive layer 10 is defined as solid components other than the conductive particles 12. Before the manufacture of the electronic device using the conductive member 1, the adhesive composition 14 may be in a B-stage state with a dried surface, i.e., a semi-cured state. The thickness of the adhesive layer can be measured by the following method. First, the conductive member 1 is sandwiched between two pieces of glass (thickness: approximately 1 mm). Next, a resin composition consisting of 100 g of bisphenol A type epoxy resin (product name: JER811, manufactured by Mitsubishi Chemical Corporation) and 10 g of a hardener (product name: Epomount hardener, manufactured by Refinetech Co., Ltd.) is poured. After that, the cross-section is polished using a polishing machine, and the thickness of the adhesive layer is measured using a scanning electron microscope (SEM, product name: SE-8020, manufactured by Hitachi High-Tech Science Corporation). The thickness of the metal foil layer, described later, is measured in the same way. 【0033】 [Composition of conductive particles] The conductive particles 12 are electrically conductive, substantially spherical particles, and consist of metal particles made of metals such as Au, Ag, Ni, Cu, Fe, Co, Mo, Zn, and solder, or conductive carbon particles made of conductive carbon. The conductive particles 12 may also be coated conductive particles comprising a core containing non-conductive glass, ceramic, or plastic (such as polystyrene), and a coating layer containing the above-mentioned metal or conductive carbon that covers the core. Among these, the conductive particles 12 may also be coated conductive particles comprising a core containing metal particles formed of a heat-meltable metal, or plastic, and a coating layer containing metal or conductive carbon that covers the core. 【0034】 In one embodiment, the conductive particles 12 include a core made of polymer particles (plastic particles) such as polystyrene, and a metal layer covering the core. Preferably, the polymer particles have substantially their entire surface covered with the metal layer, but a portion of the surface of the polymer particles may be exposed without being covered with the metal layer, to the extent that their function as a connecting material is maintained. The polymer particles may also include particles containing a polymer, for example, which contains at least one monomer selected from styrene and divinylbenzene as monomer units. 【0035】 The metal layer may be formed from various metals such as Ni, Ni / Au, Ni / Pd, Cu, NiB, Pd, Ag, Au, and Ru. The metal layer may be an alloy layer made of an alloy of Ni and Au, an alloy of Ni and Pd, etc. The metal layer may be a multilayer structure consisting of multiple metal layers. For example, the metal layer may consist of a Ni layer and an Au layer. The metal layer may be made by plating, vapor deposition, sputtering, soldering, etc. The metal layer may be a thin film (for example, a thin film formed by plating, vapor deposition, sputtering, etc.). When solder is used for the conductive particles 12, or when solder is used for the outermost layer of the multilayer structure, the conductive member 1 can be fused to the metal foil layer 20 and / or the ground member, and a stable connection can be obtained by alloying. Solder containing tin or tin alloys can be used. Examples of tin alloys that can be used include In-Sn alloy, In-Sn-Ag alloy, Sn-Au alloy, Sn-Bi alloy, Sn-Bi-Ag alloy, Sn-Ag-Cu alloy, and Sn-Cu alloy. 【0036】 From the viewpoint of improving insulation, the conductive particles 12 may have an insulating layer. Specifically, for example, in conductive particles that include a core (e.g., polymer particles) and a coating layer such as a metal layer covering the core, an insulating layer may be provided on the outside of the coating layer to further cover the coating layer. The insulating layer may be the outermost layer located on the outermost surface of the conductive particles. The insulating layer may be a layer formed from an insulating material such as silica or acrylic resin. Note that the conductive particles 12 may also have a configuration without an insulating layer. 【0037】 The average particle size Dp of the conductive particles 12 may be 1 μm or more, 2 μm or more, or 5 μm or more, from the viewpoint of excellent dispersibility and conductivity. The average particle size Dp of the conductive particles may be 100 μm or less, 50 μm or less, 30 μm or less, or 20 μm or less, from the viewpoint of excellent dispersibility and conductivity. From the above viewpoint, the average particle size Dp of the conductive particles may be 1 μm or more and 100 μm or less, 5 μm or more and 50 μm or less, 5 μm or more and 30 μm or less, or 5 μm or more and 20 μm or less. 【0038】 The maximum particle size of the conductive particles 12 may be 1 μm or more, 2 μm or more, or 5 μm or more, from the viewpoint of excellent dispersibility and conductivity. The maximum particle size of the conductive particles 12 may be 100 μm or less, 50 μm or less, 30 μm or less, or 20 μm or less, from the viewpoint of excellent dispersibility and conductivity. From the above viewpoint, the maximum particle size of the conductive particles may be 1 μm or more and 50 μm or less, 2 μm or more and 30 μm or less, or 5 μm or more and 20 μm or less. 【0039】 The average particle size Dp of the conductive particles 12 may be greater than the thickness of the adhesive layer 10. In this case, a portion of the conductive particles 12 may be exposed from the surface of the adhesive layer 10 located on the opposite side of the metal foil layer 20, or the surface of the adhesive layer 10 located on the opposite side of the metal foil layer 20 may have a convex shape that follows the shape of the conductive particles 12 only in the portion where the conductive particles 12 are present. With this configuration, when connecting the metal foil layer 20 to the ground member (metal post 110) using the conductive particles 12 in the formation of the metal film described later, the connection can be achieved more effectively by appropriately crushing the conductive particles 12. Furthermore, the conductive particles 12 may consist of first conductive particles having a first average particle size and second conductive particles having a second average particle size larger than the first average particle size. In other words, conductive particles 12 with different particle sizes may be included in the adhesive composition 14. There may be two or more different particle sizes, for example, three or four types. In this case, when manufacturing the electronic device 120, even if the flatness of the area where the conductive member 1 is installed is low, the metal foil layer 20 can be connected to the ground member (metal post 110) by any of the conductive particles, making it possible to stably form the metal film. 【0040】 In this specification, the particle size of any 300 particles (pcs) is measured by observation using a scanning electron microscope (SEM). The average value of the obtained particle sizes is defined as the average particle size Dp, and the largest value obtained is defined as the maximum particle size. If the particle has protrusions or other non-spherical shapes, the particle size is defined as the diameter of the circle circumscribing the particle in the SEM image. 【0041】 The content of conductive particles 12 is determined according to the fineness of the electrodes to be connected. For example, there are no particular restrictions on the amount of conductive particles 12, but it is preferably 0.1 volume% or more, and more preferably 0.2 volume% or more, based on the total volume of the adhesive layer excluding the conductive particles. When the above amount is 0.1 volume% or more, the decrease in conductivity tends to be suppressed. The amount of conductive particles 12 may be 80 volume% or less, 60 volume% or less, 30 volume% or less, or 10 volume% or less, based on the total volume of the adhesive layer excluding the conductive particles. Note that "volume%" is determined based on the volume of each component before curing at 23°C, but the volume of each component can be converted from weight to volume using specific gravity. Alternatively, instead of dissolving or swelling the component in a graduated cylinder, the component can be added to a suitable solvent (water, alcohol, etc.) that thoroughly wets the component, and the increased volume can be determined as the volume of that component. 【0042】 [Composition of adhesive layer / adhesive composition] The adhesive composition 14 constituting the adhesive layer 10 contains a curing agent, a monomer, and a film-forming material. When epoxy resin monomers are used, imidazole-based, hydrazide-based, boron trifluoride-amine complex, sulfonium salt, amineimide, polyamine salt, dicyandiamide, etc. can be used as curing agents. Microencapsulating the curing agent by coating it with polyurethane-based or polyester-based polymers, or masking it with isocyanate, is preferable because it extends the pot life. On the other hand, when acrylic monomers are used, peroxide compounds, azo compounds, etc., that decompose upon heating to generate free radicals can be used as curing agents. 【0043】 When epoxy monomers are used, the curing agent is appropriately selected depending on the desired bonding temperature, bonding time, storage stability, etc. From the viewpoint of high reactivity, it is preferable that the gel time with the epoxy resin composition is 10 seconds or less at a predetermined temperature, and from the viewpoint of storage stability, it is preferable that there is no change in the gel time with the epoxy resin composition after being stored in a constant temperature bath at 40°C for 10 days. From these points, the curing agent is preferably a sulfonium salt type, a microencapsulated imidazole type curing agent, or an isocyanate mask imidazole type. 【0044】 When using acrylic monomers, the curing agent is appropriately selected based on the desired curing temperature, curing time, storage stability, etc. From the viewpoint of high reactivity and storage stability, organic peroxides or azo compounds with a half-life of 10 hours at 40°C or higher and a half-life of 1 minute at 180°C or lower are preferred, and organic peroxides or azo compounds with a half-life of 10 hours at 60°C or higher and a half-life of 1 minute at 170°C or lower are more preferred. These curing agents can be used alone or in combination, and may also be used in combination with decomposition accelerators, inhibitors, etc. 【0045】 In both cases, when using epoxy monomers and acrylic monomers, if the connection time is 10 seconds or less, the amount of curing agent added is preferably 0.1 parts by mass or more and 40 parts by mass or less, and more preferably 1 part by mass or more and 35 parts by mass or less, per 100 parts by mass of the total of the monomer and film-forming material described later, in order to obtain a sufficient reaction rate. If the amount of curing agent added is less than 0.1 parts by mass, a sufficient reaction rate cannot be obtained, and it tends to be difficult to obtain good adhesive strength and low connection resistance. On the other hand, if the amount of curing agent added exceeds 40 parts by mass, the fluidity of the adhesive tends to decrease, the connection resistance tends to increase, and the storage stability of the adhesive tends to decrease. 【0046】 Furthermore, when using epoxy resin monomers, bisphenol-type epoxy resins derived from epichlorohydrin with bisphenol A, bisphenol F, bisphenol AD, etc., epoxy novolac resins derived from epichlorohydrin with phenol novolac or cresol novolac, and various epoxy compounds having two or more glycidyl groups in one molecule, such as glycidylamine, glycidyl ether, biphenyl, and alicyclic compounds, can be used as monomers. 【0047】 When using acrylic monomers, the radical polymerizable compound is preferably a substance having a functional group that polymerizes by radicals. Examples of such radical polymerizable compounds include (meth)acrylates, maleimide compounds, and styrene derivatives. Furthermore, the radical polymerizable compound can be used in either monomer or oligomer form, and the monomer and oligomer may be used in mixture form. These monomers may be used individually or in mixture of two or more. 【0048】 The film-forming material is a polymer that facilitates the handling of the low-viscosity composition containing the above-mentioned curing agent and monomer. By using the film-forming material, the adhesive layer 10 is obtained that is easy to handle, as it suppresses the film from easily tearing, cracking, or becoming sticky. 【0049】 Suitable film-forming materials include thermoplastic resins and thermosetting resins, such as phenoxy resins, polyvinyl formal resins, polyimide resins, polystyrene resins, polyvinyl butyral resins, polyester resins, polyamide resins, xylene resins, polyurethane resins, polyacrylic resins, polyester urethane resins, and polybismaleimide resins. Furthermore, these polymers may contain siloxane bonds or fluorine substituents. These resins can be used individually or in mixtures of two or more. Among the above resins, phenoxy resin is preferred from the viewpoint of adhesive strength, compatibility, heat resistance, and mechanical strength. In particular, when epoxy monomers are used, polybismaleimide is preferred as the film-forming material because it yields a stronger cured product, thus providing better heat resistance or mechanical strength. 【0050】 The larger the molecular weight of the film-forming material, the easier it is to obtain film-forming properties, and the wider the range of melt viscosity that affects the fluidity of the film can be set. The molecular weight of the film-forming material is preferably 5,000 to 150,000 in weight-average molecular weight, and particularly preferably 10,000 to 80,000. A weight-average molecular weight of 5,000 or more makes it easier to obtain good film-forming properties, and a weight-average molecular weight of 150,000 or less makes it easier to obtain good compatibility with other components. 【0051】 In this embodiment, the weight-average molecular weight refers to the value measured using a calibration curve with standard polystyrene from a gel permeation chromatograph (GPC) according to the following conditions. (Measurement conditions) Equipment: GPC-8020 manufactured by Tosoh Corporation Detector: RI-8020 manufactured by Tosoh Corporation Column: Gelpack GLA160S + GLA150S manufactured by Showa Denko Materials Co., Ltd. Sample concentration: 120mg / 3mL Solvent: tetrahydrofuran Injection volume: 60μL Pressure: 2.94 × 10⁶ Pa (30 kgf / cm²) 2 ) Flow rate: 1.00mL / min 【0052】 Furthermore, the content of the film-forming material is preferably 5% by weight or more and 80% by weight or less, and more preferably 15% by weight or more and 70% by weight or less, based on the total amount of the curing agent, monomer, and film-forming material. A content of 5% by weight or more makes it easier to obtain good film-forming properties, and a content of 80% by weight or less tends to result in a curable composition exhibiting good fluidity. In addition, the adhesive composition 14 that forms the adhesive layer 10 may further contain fillers, softeners, accelerators, antioxidants, colorants, flame retardants, thixotropic agents, coupling agents, and phenolic resins, melamine resins, isocyanates, etc. 【0053】 If a filler is included, further improvement in connection reliability can be expected. The maximum diameter of the filler is preferably less than the particle size of the conductive particles 12, and the filler content is preferably 5 to 60 parts per 100 parts per volume of the adhesive layer. When the filler content is 5 to 50 parts per volume, good connection reliability tends to be obtained. 【0054】 [Composition of the metal foil layer] The metal foil layer 20 is formed from, for example, copper foil, aluminum foil, nickel foil, stainless steel, titanium, or platinum. The metal foil layer 20 has a thickness of, for example, 1 μm to 200 μm, and may have a thickness of 10 μm to 20 μm. The thickness of the metal foil layer 20 may be 3 μm or more, 100 μm or less, 25 μm or less, or 18 μm or less. The thickness of the metal foil layer referred to here includes the surface roughness Rz. Since the metal foil layer 20 is formed in advance, its film thickness is made uniform. 【0055】 The surface roughness of one surface 20a and the opposite surface 20b of the metal foil layer 20 is not particularly limited. The surface roughness Rz of surface 20b of the metal foil layer 20 on which the adhesive layer 10 is formed may be smaller than the average particle size of the conductive particles 12. This makes the connection via the conductive particles 12 more stable. The surface roughness Rz of surfaces 20a and 20b of the metal foil layer 20 may be the same or different. In this case, surfaces 20a and 20b of the metal foil layer 20 may be a shiny surface and a matte surface, respectively. The surface roughness Rz of surface 20a, which is the shiny surface, is smaller than the surface roughness Rz of surface 20b, which is the matte surface. The metal foil layer 20 may be positioned so that the shiny surface is on the side of the retaining film 30 opposite to the adhesive layer 10. In other words, the smooth surface of the metal foil layer 20 may be positioned so that it becomes the outer surface of the electronic device 120. The surface roughness Rz of the shiny surface may be 0.01 μm or more, 0.5 μm or more, or 1.0 μm or more. The surface roughness Rz of the shiny surface may be 17 μm or less, 10 μm or less, 8.0 μm or less, 5.0 μm or less, or 3.0 μm or less. The surface roughness Rz of the shiny surface may be, for example, 0.01 μm or more and 17 μm or less, or 0.5 μm or more and 3.0 μm or less. The surface roughness Rz of the matte surface of the metal foil layer 20 may be, for example, 17 μm or more. Surface roughness Rz refers to the ten-point average roughness Rzjis measured in accordance with the method specified in the JIS standard (JIS B 0601-2001), and refers to the value measured using a commercially available surface roughness shape measuring instrument. For example, it can be measured using a nanosearch microscope (Shimadzu Corporation "SFT-3500"). 【0056】 [Retaining film] The retaining film 30 protects the adhesive layer 10 and the metal foil layer 20, and is a component that facilitates the formation process when forming a metal film using the conductive member 1. The retaining film 30 is configured to be placed on the metal foil layer 20, for example by adhesive, and protects the metal foil layer 20. Another retaining film may be placed on the back surface of the adhesive layer 10 to protect the adhesive layer 10. The retaining film 30 and the other retaining film are made of, for example, a resin such as fluororesin, polyethylene terephthalate or polyimide, or paper. The conductive member 1 may also be configured without the retaining film 30, in which case the surface 20a of the metal foil layer 20 of the conductive member 1 will be exposed. 【0057】 Next, a method for forming a metal film of the electronic device 120 using the conductive member 1 will be described with reference to Figures 2 and 3. Figures 2(a) to (c) and 3(a) and (b) are diagrams illustrating the first method of manufacturing the electronic device 120 using the conductive member 1. In the following description of the manufacturing method, each step may be performed separately, or other steps may be performed in parallel while step 1 is being carried out. 【0058】 First, as shown in Figure 2(a), a semi-finished product 100 is prepared (provided) on which electronic components 102, 103, and 104 are mounted on a wiring board 101. The wiring board 101 is composed of, for example, a multilayer board, a core board, a coreless multilayer board, a flexible multilayer board, a build-up multilayer board, and a multilayer redistribution layer. The electronic components 102 to 104 are, for example, semiconductor devices such as semiconductor chips, or small electronic components such as chip capacitors or chip resistors. The electronic components 102 to 104 may be other electronic components. Then, metal posts 110 (metal conductive parts) are formed on the wiring board 101 so as to surround electronic components 102 and electronic components 103 and 104 in the planar direction (see Figure 4). The metal posts 110 are, for example, cylindrical in shape and made of copper or the like. The metal posts 110 can be formed, for example, by plating and filling holes (vias) formed with photoresist, by filling the aforementioned vias with metal paste, or by arranging metal wires in a post shape, arc shape, multiple overlapping arc shapes, or random arrangement using a wire bonding apparatus. In the example shown in Figure 4, the metal posts 110 are formed in contact with adjacent metal posts 110, but they may also be formed spaced apart from each other. At least a portion of the metal posts 110 are connected to ground wiring provided on the wiring board 101. In Figure 4, the metal posts 110 have independent shapes in plan view, but the spacing between the metal posts can be adjusted as appropriate depending on the desired electromagnetic shielding effect. It is preferable that the metal posts 110 are connected to each other without gaps, as this ensures reliable shielding when a metal film is used, for example, as a shielding film. On the other hand, if there is space between the metal posts 110, the mold resin fills the gaps, which has the advantage of increasing strength in the lateral direction. 【0059】 Next, as shown in Figure 2(b), the electronic components 102-104 and the metal posts 110 on the semi-finished product 100 are sealed with resin to form a resin sealing layer 105. The sealing resin constituting the resin sealing layer 105 is, for example, epoxy resin. The sealing resin may also contain inorganic materials such as silica and alumina. After that, as shown in Figure 2(c), after the resin sealing layer 105 is formed, the surface of the resin sealing layer 105 is polished so that the tips of each metal post 110 are exposed from the surface of the resin sealing layer 105 to form the resin sealing layer 105a. For polishing, for example, CMP slurry or a polishing pad can be used as the polishing agent. Through this polishing, the surface of the resin sealing layer 105a and each metal post 110 become coplanar, and when the conductive member 1 is placed and pressurized, each metal post 110 and the metal foil layer 20 can be stably connected via the conductive particles 12. Furthermore, by ensuring flatness, the flatness of the metal foil layer 20 is also ensured, making it less prone to stretching or breakage and ensuring stable performance. Furthermore, if a chemically reactive (etching) abrasive is used during polishing, the metal post 110 may become recessed compared to the resin encapsulation layer 105a. Even in this case, the conductive member 1 connects the metal post 110 (metal conductive portion) and the metal foil layer 20 with conductive particles 12, and the resin of the adhesive layer 10 fills the step between the metal post 110 and the resin encapsulation layer 105a, preventing extreme deformation or damage to the metal foil layer 20 and enabling stable performance. 【0060】 Furthermore, in conventional metal layer formation using sputtering, it is necessary to ensure a high level of flatness through polishing in order to obtain a metal layer thickness that provides sufficient performance (e.g., shielding) in a short time. In other words, if the surface has irregularities, the isotropic metal layer formation characteristic of sputtering results in areas where the metal layer thickness is thin, so polishing to ensure high flatness is necessary. In contrast, with the method using conductive member 1, a stable metal layer can be obtained even if the surface polishing after resin encapsulation is rough. That is, the adhesive layer 10 of conductive member 1 fills in the irregularities caused by rough polishing, and the conductive particles 12 ensure good connection between the metal post 110 (metal conductive part) and the metal foil layer 20, so a metal foil layer 20 with a predetermined thickness (e.g., having electromagnetic shielding function) can be formed, and stable performance can be obtained. Therefore, by using conductive member 1, the polishing process can be simplified and shortened. Specifically, it becomes possible to reduce the number of polishing cycles in multi-stage precision polishing using CMP slurry or polishing pads, thereby shortening the time required, or to simplify and shorten the process by using mechanical cutting or other methods instead of multi-stage precision polishing. 【0061】 Next, as shown in Figure 3(a), the conductive member 1 for forming a metal film is placed on the metal post 110 and the resin encapsulation layer 105a. At this time, the conductive member 1 is positioned so that the adhesive layer 10 faces the metal post 110 and the resin encapsulation layer 105a. The conductive member 1 is attached to the metal post 110 and the resin encapsulation layer 105a by the adhesive layer 10. Then, the conductive member 1 is heated and pressurized to laminate it onto the resin encapsulation layer 105a. 【0062】 During lamination, the pressure applied through the retaining film 30 crushes the conductive particles 12 of the conductive member 1 that are located between the conductive particles 12 and the metal post 110, as shown in Figures 5(a) and (b). These crushed conductive particles 12a electrically connect the metal post 110 and the metal foil layer 20. Furthermore, the heating and pressure applied during lamination harden the adhesive layer 10 of the conductive member 1, fixing it to the resin sealing layer 105a. Thus, in the connection structure shown in Figure 5, the conductive member 1 described above and the metal post 110 extending toward the conductive member 1 are provided, and the metal post 110 and the metal foil layer 20 are electrically connected by conductive particles 102a. At this time, the retaining film 30 functions as a cushioning material, allowing the conductive member 1 to sufficiently conform to the surface irregularities of the semi-finished product. 【0063】 Next, when the metal foil layer 20 is mechanically and electrically connected to the metal post 110 by conductive particles 12a (see Figure 5(b)), the holding film 30 is peeled off from the metal foil layer 20, as shown in Figure 3(b). This completes the formation of an electronic device 120 comprising the metal foil layer 20 as a metal film. In the electronic device 120, the metal foil layer 20 suppresses noise intrusion from, for example, above, and the metal post 110 suppresses noise intrusion from the sides. 【0064】 Here, we will explain the advantages of the manufacturing method described above compared to the method of forming a metal film by sputtering. First, we will explain the method of forming a metal film by sputtering with reference to Figure 8. Figures 8(a) to (e) are cross-sectional views illustrating the method of forming a metal film by sputtering in sequence. 【0065】 As shown in Figure 8(a), in the method of forming a metal film by sputtering, first, a semi-finished product 100 is prepared with electronic components 102-104 mounted on a wiring board 101. Then, as shown in Figure 8(b), the electronic components 102-104 are sealed with resin to form a resin sealing layer 505. Next, as shown in Figure 8(c), holes 506 are formed in the resin sealing layer 505 using a laser. As shown in Figure 8(d), a metal paste such as silver paste is injected into these holes 506 and solidified to form metal conductive parts 510. After that, as shown in Figure 8(e), a metal film 520 is formed by sputtering on the resin sealing layer 505 so as to be electrically connected to the metal conductive parts 510. In this sputtering process, for example, it takes about 60 minutes to form a metal film with a thickness of about 5 μm to 10 μm, and if multiple different metal layers are to be formed for purposes such as improving the adhesion between the sealing material and the organic material, an additional 60 minutes or more of work time is required. 【0066】 In contrast, in the manufacturing method according to the above embodiment, the metal film of the electronic device 120 is formed using the conductive member 1. That is, in this manufacturing method, the conductive member 1, which has a metal foil layer 20 formed on it in advance, is attached to the parts where a metal film is required (on the resin encapsulation layer 105a and the metal post 110) to form the metal film. Therefore, the time required to form the metal film can be significantly reduced compared to the sputtering method described above. Furthermore, when depositing a metal film by sputtering, the sputtering thickness may be thinner at the corners of the semi-finished product 100 than at other parts. However, according to the manufacturing method according to this embodiment, since a pre-fabricated metal foil layer 20 is used, it is possible to form a more uniform metal film. As a result, an electronic device 120 with stable performance as a metal film (e.g., shielding performance) can be provided. 【0067】 Furthermore, in the manufacturing method of the electronic device according to this embodiment, the thickness of the metal foil layer 20 of the conductive member 1 used may be 1 μm or more and 200 μm or less. In this case, the conductive member 1 can function sufficiently as a metal film, and it is possible to make the manufactured electronic device 120 smaller and lower in profile. 【0068】 Furthermore, in the manufacturing method of the electronic device according to this embodiment, the surface roughness Rz of the outer surface of the metal foil layer 20 opposite to the adhesive layer 10 of the conductive member 1 used may be 0.5 μm or more and 17 μm or less. In this case, the outer surface of the metal foil layer 20, which functions as a metal film, becomes a shiny surface with reduced surface roughness, and the corrosion resistance of the metal film of the manufactured electronic device 120 can be improved. 【0069】 Furthermore, in the manufacturing method of the electronic device according to this embodiment, the conductive member 1 used may further include a retaining film 30 that is adhered to the side of the metal foil layer 20 opposite to the adhesive layer 10. In this case, the formation work becomes easier when forming a metal film using the conductive member 1. Also, since the metal foil layer 20 is protected by the retaining film 30 when forming the metal film, it is prevented from damaging the metal foil layer 20, which functions as a metal film, during the formation work, and an electronic device 120 with excellent performance as a metal film can be provided. Another advantage of the retaining film is that it functions as a cushioning material when pressed. 【0070】 Furthermore, in the method for manufacturing the electronic device according to this embodiment, the average particle size Dp of the conductive particles 12 in the conductive member 1 used may be larger than the thickness of the adhesive layer 10. In this case, when connecting the metal foil layer 20 to the metal post 110 using the conductive particles 12, the above-mentioned connection can be achieved more effectively by appropriately crushing the conductive particles 12. 【0071】 Furthermore, in the method for manufacturing the electronic device according to this embodiment, the conductive particles 12 in the conductive member 1 used may include first conductive particles having a first average particle size and second conductive particles having a second average particle size larger than the first average particle size. In this case, even if the flatness of the resin encapsulation layer 105a, etc., in the semi-finished product 100 on which the conductive member 1 is installed is low, the metal foil layer 20 can be connected to the metal post 110 by either of the conductive particles 12, and the metal film can be stably formed, for example, as a shield film. 【0072】 Although embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments and can be applied to various embodiments. For example, in the above embodiments, one method of forming a metal film on an electronic device 120 using a conductive member 1 has been described, but the invention is not limited thereto. For example, a metal film may be formed on the electronic device 120 by the method shown in Figure 6 or Figure 7. The metal film formed by these methods may be, for example, a metal film for electromagnetic wave shielding. Figures 6(a) to 6(c) are diagrams illustrating, in order, a second method of manufacturing an electronic device 120 using a conductive member 1. Figures 7(a) to 7(c) are diagrams illustrating, in order, a third method of manufacturing an electronic device 120 using a conductive member 1. 【0073】 As shown in Figure 6(a), in the second manufacturing method, a semi-finished product 100 with electronic components 102-104 mounted on a wiring board 101 is prepared, similar to the first manufacturing method, and metal posts 110 are formed on the wiring board 101 (see Figure 4). Then, when forming the resin encapsulation layer 105a, a conductive member 1 is placed in a mold (not shown) and compression molding is performed. At this time, the conductive particles 12 connect the metal foil layer 20 and the metal posts 110, and the adhesive layer 10 adheres to the resin encapsulation layer 105a. In this manufacturing method, since compression molding is used, polishing of the resin encapsulation layer is unnecessary. After that, similar to the first manufacturing method, as shown in Figure 6(c), the retaining film 30 is peeled off from the metal foil layer 20 to form the electronic device 120. According to this manufacturing method, the same effects as the first manufacturing method can be obtained, and the metal film can be formed in an even simpler process. 【0074】 In the third manufacturing method, a semi-finished product 100 is prepared with electronic components 102-104 mounted on a wiring board 101, similar to the first manufacturing method (see Figure 2(a)). Then, as shown in Figure 7(a), the electronic components 102-104 on the wiring board 101 are sealed with resin to form a resin sealing layer 106. The resin sealing layer 106 can be formed from the same resin as the resin sealing layers 105 and 105a. Subsequently, holes 107 are formed at positions corresponding to the metal posts 110 in the first manufacturing method by imprinting, laser processing, cutting, drilling, or etching. The holes 107 are formed, for example, to surround electronic components 102 and electronic components 103 and 104 in the planar direction. Then, a metal paste such as copper paste is injected into the holes 107 and solidified to form a metal conductive portion 111. Instead of metal paste, plating or solder may be used to form the metal conductive portion 11. At least a portion of the metal conductive portion 111 is connected to a ground wire provided on the wiring board 101. 【0075】 Next, as shown in Figure 7(c), the conductive member 1 is placed on the metal conductive portion 111 and the resin sealing layer 106, similar to the first manufacturing method. At this time, the conductive member 1 is positioned so that the adhesive layer 10 faces the metal conductive portion 111 and the resin sealing layer 106. The conductive member 1 is attached to the metal conductive portion 111 and the resin sealing layer 106 by the adhesive layer 10. Then, the conductive member 1 is heated and pressurized to laminate it onto the resin sealing layer 106. At this time, due to the pressurization via the retaining film 30, as shown in Figures 5(a) and (b), the conductive particles 12 of the conductive member 1 that are located between the conductive particle 12 and the metal conductive portion 111 are crushed, and these crushed conductive particles 12a electrically connect the metal conductive portion 111 and the metal foil layer 20. In addition, the adhesive layer 10 of the conductive member 1 hardens due to the heating and pressurization during lamination and is fixed to the resin sealing layer 106. After that, the retaining film 30 is peeled off from the metal foil layer 20. As described above, an electronic device 120 having a metal film can also be formed using the conductive member 1 by the third manufacturing method. This manufacturing method provides the same effects as the first manufacturing method, and the metal film can be formed in an even simpler process. 【0076】 Furthermore, the conductive members used in the various manufacturing methods described above may be conductive members 1A, 1B comprising adhesive layers 10A, 10B, which include a first adhesive layer 15 made of conductive particles 12 and an adhesive composition, and a second adhesive layer 16 made of an adhesive composition, as shown in Figures 9(a) and 9(b). In conductive members 1A, 1B, the first adhesive layer 15 and the second adhesive layer 16 may be made of the aforementioned adhesive composition 14. The adhesive compositions in the first adhesive layer 15 and the second adhesive layer 16 may be the same or different. As shown in Figure 9(a), the conductive member 1A may be constructed by laminating a metal foil layer 20, a second adhesive layer 16, and a first adhesive layer 15 in that order, or as shown in Figure 9(b), it may be constructed by laminating a metal foil layer 20, a first adhesive layer 15, and a second adhesive layer 16 in that order. 【0077】 Furthermore, in the above-described embodiment, the conductive member 1 was explained as an example in which an adhesive layer 10 and a metal foil layer 20 are bonded together. However, the conductive member 1 in this embodiment may be composed of a set in which the adhesive layer 10 and the metal foil layer 20 are provided separately, and the adhesive layer 10 can be bonded to the metal foil layer 20 when in use. In this case, since the adhesive layer 10 and the metal foil layer 20 can be prepared separately (as a set of conductive members for forming a metal film), it becomes possible to select a conductive member with a more optimal material configuration, thereby improving the degree of freedom in the work when forming a metal film using the conductive member. [Explanation of Symbols] 【0078】 1, 1A, 1B...conductive member, 10, 10A, 10B...adhesive layer, 12, 12a...conductive particles, 14...adhesive composition, 15...first adhesive layer, 16...second adhesive layer, 20...metal foil layer, 20a...surface, 20b...surface, 30...holding film, 100...semi-finished product, 101...wiring board, 102, 103, 104...electronic component, 105, 105a, 106...resin encapsulation layer, 107...hole, 110...metal post (metal conductive part), 111...metal conductive part, 120...electronic device.

Claims

[Claim 1] An adhesive layer comprising an adhesive composition containing conductive particles, A conductive member comprising a metal foil layer disposed on the adhesive layer.

Images