Multi-layered body with at least one integrated signal conductor and method for manufacturing the multi-layered body

Abstract

The present invention relates to a method for producing a multilayer body (1), wherein the method comprises at least the following steps: providing a base body (10), incorporating at least one base depression (6), filling the at least one base depression (6) with a conductive material, applying at least one first and then a second layer (12, 14) layer by layer, incorporating depressions (8) and recesses (7) along the at least one base depression (6), and filling the depressions (8) and recesses (7) with the conductive material, wherein, after completion of the preceding steps, the at least one base depression (6), as well as the depressions (8) and the recesses (7) in the first and second layers (12, 14), are arranged such that the multilayer body (1) in a cross-sectional view has at least one signal conductor (4) which is completely surrounded by an outer conductor (5).The present invention further relates to a multilayer body (1).

Description

Technical field

[0001] The invention relates to a method for manufacturing a multilayer body with at least one integrated signal conductor for transmitting high-frequency signals, and to a multilayer body with at least one integrated signal conductor for transmitting high-frequency signals. State of the art

[0002] Electromagnetic compatibility (EMC) is a crucial requirement for the transmission of high-frequency signals. The signal conductor must not be affected by interference from other electromagnetic sources, and conversely, the signal conductor should not interfere with other components. EMC-protected transmission of high-frequency signals in confined spaces, such as those found in the automotive industry, presents a particular challenge.

[0003] For data transmission or the transmission of high-frequency signals with EMC protection, shielded round cables are known in the art, for example as antenna cables or 2-wire or multi-wire systems. However, these shielded round cables have a number of disadvantages: 1. The cables have a flexible structure, making them difficult to handle and automate. 2. Furthermore, an additional cable guide is applied to the structure (to which the cable(s) are to be attached), which requires more space. 3. Significant effort is also required to attach the cable to the structure. 4. In addition, the routing options for round cables are limited due to bending radii. 5. Finally, relatively large cable diameters are required due to the (required) mechanical strength for applications in the automotive sector.

[0004] Shielded, flexible flat ribbon cables are also known in the prior art. However, these flat ribbon cables also exhibit the aforementioned disadvantages 1-3 and have the following additional disadvantages: Manufacturing flat ribbon cables from a coil results in a high material consumption (waste). Furthermore, for one-dimensional flat ribbon cables with shallow lateral exits (e.g., 90°), the cable must be bent. Bends in the signal conductor are detrimental to the transmission of high-frequency signals.

[0005] It is also known in the prior art to integrate a conductive trace onto the surface of a three-dimensional (3D) structure. A known method for this is the MID (Molded Interconnect Devices or Mechatronic Integrated Devices) 3D method. Using the MID 3D method, a (single-layer, unshielded) conductive trace is integrated onto or into the surface of the structure on one or both sides. However, EMC-protected transmission is not possible with this design. Description of the invention

[0006] It is therefore an object of the present invention to provide a product and a manufacturing method for the product, for EMC-protected transmission of high-frequency signals, even in areas with small installation space, wherein the product and the manufacturing method enable / allow a high degree of automation.

[0007] The aforementioned problem is solved by a method for producing a multilayer body according to claim 1 and a multilayer body according to claim 7. Further advantageous embodiments of the invention can be found in the dependent claims, the description, and the drawings.

[0008] In particular, the above-mentioned problem is solved by a method for manufacturing a multilayer body with at least one integrated signal conductor for transmitting high-frequency signals, wherein the method comprises at least the following steps: providing a base body with a first side, incorporating at least one base depression between at least one first and one second point on the first side of the base body, filling the at least one base depression with a conductive material, applying at least one first and then a second layer layer by layer to the first side of the base body, incorporating depressions and recesses layer by layer along the at least one base depression and filling the depressions and recesses with the conductive material in the first layer and, after the application of the second layer, in the second layer, wherein, after completion of the preceding steps,which at least one base depression as well as the depressions and the recesses in the first and second layers are arranged such that the multilayer body in a cross-sectional view has at least one signal conductor that is completely surrounded by an outer conductor.

[0009] One of the major advantages of the present manufacturing process is its full automatability. The product manufactured using this process, a multilayer body with at least one integrated signal conductor for transmitting high-frequency signals, can be further processed automatically, for example, automatically assembled in a vehicle. This enables the automated integration of data or high-frequency signal conductors into a vehicle (desired by the automotive industry). The present process extends prior art MID 3D processes, in particular by applying additional layers and creating a signal conductor that is completely surrounded by an outer conductor (except for its endpoints, exit points, or contact points). The outer conductor shields the signal conductor, making it suitable for transmitting high-frequency signals without interference.The at least one shielded signal conductor is integrally formed with the multi-layered body. This eliminates the need for additional steps such as attaching separate signal conductors to the base body. Furthermore, the design is very space-saving.

[0010] Preferably, the step of incorporating at least one base depression between at least one first and one second point on the first side of the base body and / or the step of incorporating depressions and recesses layer by layer along the at least one base depression comprises: incorporating the at least one base depression and / or the depressions and recesses using a MID 3D LDS process. LDS stands for Laser Direct Structuring. Lasers can be used to create very precise depressions and / or recesses very quickly. The process can be automated.

[0011] Preferably, the method further comprises the step of applying a final third layer that has no depressions or recesses. This third layer forms an insulating layer on the outside. The third layer protects the signal conductor from mechanical and / or chemical environmental influences. If the third layer is opaque, it can conceal the signal conductor, so that the multilayered body is indistinguishable from a base body of the prior art. The fact that the third layer has no depressions or recesses makes it easy to clean.

[0012] Preferably, the steps of applying at least one first layer and then a second layer to the first side of the base body, with layer-by-layer incorporation of recesses and indentations along the at least one base recess, and filling the recesses and indentations with the conductive material in the first layer and, after the application of the second layer, in the second layer before the application of the final third layer, can be repeated arbitrarily. The expression 'repeated arbitrarily' can include 'repeated arbitrarily often' and / or 'repeated in any order of the first and second layers'. Through these repetitions, a large number of signal conductors can be created in the multilayer body without requiring significantly more installation space, since the base body remains unchanged.

[0013] Preferably, the steps from the incorporation of at least one basic recess between at least one first and one second point on the first side of the base body are also applied to a second, preferably opposite, side of the base body. This allows the number of signal conductors in the multilayer body to be increased without requiring substantially more installation space, since the base body remains the same.

[0014] Preferably, recesses and / or indentations are filled with a conductive material by electroplating. Electroplating is a very common process in the prior art. Accordingly, electroplating is well-established, leads to high-quality results, and copper in particular is well-suited for electroplating.

[0015] The aforementioned problems are further solved in particular by a multilayer body with at least one integrated signal conductor for transmitting high-frequency signals, comprising: a base body with a first side, at least one base depression between at least one first and one second point on the first side of the base body, wherein the at least one base depression is filled with a conductive material, at least one first and one second layer on the first side of the base body, wherein the first and the second layer have depressions and recesses along the at least one base depression and the depressions and recesses are filled with the conductive material, wherein the at least one base depression and the depressions and recesses of the first and second layer are arranged such that the multilayer body, in a cross-sectional view, has at least one signal conductor.which is completely surrounded by an outer conductor.

[0016] This multi-layered enclosure can be used in many different applications where data or high-frequency signals are transmitted while requiring EMC protection. In the automotive sector, the integration of signal conductors within 3D structures enables (desired) automation in vehicle assembly. Within this multi-layered enclosure, signals can be transmitted without EMC interference via the shielded signal conductor. At least one signal conductor, due to its integration within the base structure, follows the complex 3D support structure of the base body, thus saving installation space. The rigid, or at least non-flexible, support structure allows for automated routing of the signal conductors.

[0017] Preferably, the multi-layered body is formed as a single piece. Due to the one-piece construction, no additional assembly steps are necessary for attaching the signal conductors. This increases the potential for automation during the assembly of the multi-layered body.

[0018] Preferably, the base body is made of an elastic plastic. This makes the entire multi-layered body more flexible in its structure and allows it to be adapted to other surfaces, for example, a vehicle body.

[0019] Preferably, the base body and the first and second layers, and preferably the third layer, are made of a non-conductive material. Therefore, not the entire structure or the entire multilayer body is conductive, but only specific signal conductors. At predetermined points, contact for signal transmission can be made outside the multilayer body.

[0020] The following description of embodiments is given with reference to the accompanying figures. These show: Fig. 1 a cross-sectional view of an embodiment of a multi-layered body with a signal conductor for transmitting high-frequency signals; Fig. 2 a cross-sectional view of an embodiment of a basic body; Fig. 3 the cross-sectional view of the embodiment of the base body with a base recess; Fig. 4 the cross-sectional view of the embodiment of the base body with the base recess filled with a conductive material; Fig. 5 the cross-sectional view of the embodiment of the base body with a first layer; Fig. 6 the cross-sectional view of the embodiment of the base body with the first layer and two recesses as well as a depression in the first layer; Fig. 7 the cross-sectional view of the embodiment of the base body with the first layer and two recesses as well as the depression in the first layer filled with a conductive material; Fig. 8 the cross-sectional view of the embodiment of the base body with a second layer on the first layer; Fig. 9 the cross-sectional view of the embodiment of the base body with the second layer and two recesses as well as a depression in the second layer; Fig. 10 the cross-sectional view of the embodiment of the base body with the second layer and two recesses as well as the depression in the second layer filled with a conductive material; Fig. 11 the cross-sectional view of the embodiment of the base body with a third layer on the second layer; Fig. 12 a cross-sectional view of a second embodiment of a multilayer body with a plurality of signal conductors for transmitting high-frequency signals on a first and second side of the base body; Fig. 13 a cross-sectional view of a third embodiment of a multilayer body with a plurality of signal conductors for transmitting high-frequency signals, wherein the signal conductors are arranged multiple times along a first and a second direction; Fig. 14 a cross-sectional view of a fourth embodiment of a multilayer body with a plurality of signal conductors for transmitting high-frequency signals and at least one control line; Fig. 15 a cross-sectional view of a fifth embodiment of a multilayer body with a plurality of signal conductors for transmitting high-frequency signals and a plurality of control lines; and Fig. 16 a perspective (cross-sectional) view of a sixth embodiment of a multilayer body with at least one signal conductor for transmitting high-frequency signals.

[0021] Preferred embodiments are described in detail below with reference to the accompanying figures.

[0022] Fig. 1 and Fig. Figures 16 show a first and a sixth embodiment of a multilayer body 1, 106 with at least one integrated signal conductor 4 for transmitting high-frequency signals. The multilayer body 1, 106 shown has a base body 10 with a first and an opposing second side 2, 3. The base body 10 can have any three-dimensional shape (see Figure 16). Fig. 16) In a preferred embodiment, the base body 10 is produced by injection molding of a thermoplastic. The base body 10 further incorporates at least one base recess 6 between at least one first and one second point P1, P2 on the first side 2, in particular in the surface on the first side 2, of the base body 10, wherein the at least one base recess 6 is filled with a conductive material. The filled base recess 6 forms part of the outer conductor 5, which surrounds the signal conductor 4 in the finished product.

[0023] Furthermore, at least a first and a second layer 12, 14 are arranged on the base body 10 on the first side 2, in particular on the surface of the first side 2, of the base body 10. The first and the second layer 12, 14 have depressions 8 and recesses 7 along the at least one base depression 6. Depressions 8 represent a partial removal of the respective first and / or second layer 12, 14 in the (removed) area. Recesses 7 represent a complete removal of the respective first and / or second layer 12, 14 in the (removed) area. The depressions 8 and recesses 7 are filled with the conductive material and ultimately form the signal conductor(s) 4, or the outer conductor(s) 5, or sections thereof. In a preferred embodiment, the conductive material comprises copper and / or copper alloys, for example, brass or bronze. In alternative embodiments, silver or gold are also possible.

[0024] When a cavity 8 is filled with the conductive material, an electrical conductor forms in the cavity 8 between the first and second points P1, P2 in the respective first or second layer 12, 14. The electrical conductor of the cavity 8 is at least insulated from the layer 12, 14 below it. The electrical conductor of the cavity 8 forms the signal conductor 4 in the first layer 12, and a portion of the outer conductor 5 in the second layer 14. When a recess 7 is filled with the conductive material, an electrical conductor forms in the recess 7. Through the electrical conductor in the recess 7, an electrical connection is made from the adjacent layers 12, 14 (above and below) or the base body 10 through the respective first or second layer 12, 14 in the area of ​​the recess 7. The electrical conductor in the recess 7 forms the outer conductor 5 or a portion thereof.The recesses 8 or indentations 7 can be of any shape. In alternative embodiments, they can, for example, have oblique shapes, so that the closed outer conductor 5 has the shape of a hexagon, octagon, polygon or an (approximately) rounded shape, such as an ellipse or a circle.

[0025] If the described multilayer body 1, 106 is viewed in a cross-sectional view with a section plane XY that is oriented transversely, in particular perpendicularly, to the course of the signal conductor 4 between the first and second points P1, P2, then at least a base depression 6 in the base body 10 as well as the depressions 8 and recesses 7 of the first and second layers 12, 14 are arranged such that the multilayer body 1 in this cross-sectional view has at least one signal conductor 4 which is completely surrounded by an outer conductor 5.

[0026] Fig. 14 and Fig. Figure 15 shows a fourth and fifth embodiment of a multilayer body 104, 105. In addition to a plurality of shielded signal conductors 4, the illustrated multilayer bodies 104, 105 have at least one control line 9. The at least one control line 9 can be shielded or unshielded. The at least one control line 9 is designed to transmit control signals. In the fourth and fifth embodiments shown, the control lines are incorporated into the base body 10. In alternative embodiments, a control line 9 can be formed in the first and / or second layer 12, 14 (or any layer). In the fifth embodiment, it is further shown that the base recess 6 can also be incorporated in a layer applied to the first side of the base body 10.

[0027] In all illustrated embodiments, the multilayer body 1, 102, 103, 104, 105, 106 is formed in one piece. In the automotive sector, the multilayer body 1, 102, 103, 104, 105, 106 can, for example, comprise an interior trim panel (or a part thereof) in the vehicle. The base body 10 is preferably made of an elastic, in particular dimensionally stable, plastic. Preferably, the base body 10 is made of an elastic material such as TPU or TPE, etc. Elastic or flexible plastics exhibit better conformability to opposing contours. In particular, the base body 10 can comprise any object or component known in the prior art. This makes the method very versatile, and multilayer bodies 1 can be produced in a wide variety of forms and also applied to existing / known shapes or base bodies 10.In particular, the base body 10 and the first and second layers 12, 14, and preferably the third layer 16, are formed from a non-conductive material.

[0028] It follows with reference to Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Fig. 10, Fig. 11, Fig. 12, Fig. 13, Fig. 14, Fig. 15 to Fig. 16 A description of preferred embodiments of a method for manufacturing a multilayer body 1 with at least one integrated signal conductor 4 for transmitting high-frequency signals. The method comprises at least the following steps: providing a base body 10 with a first and an opposing second side 2, 3 (see Figure 16). Fig. 2) and incorporating at least one basic depression 6 between at least one first and one second point P1, P2 on the first side 2, in particular in the surface of the first side 2, of the basic body 10 (cf. Fig. 3 and Fig. 16) The two points P1, P2 can be located at any position on the base body 10. Preferably, the first and second points P1, P2 are located at the edge of the base body 10 or the multilayer body 1. An edge arrangement allows for easy contact with adjacent components or contacts. At least between the first and second points P1, P2, there is a predetermined path for transmitting high-frequency signals on the base body 10. The path can be straight or non-straight (see Figure 16). Fig. 16) The path can connect two or more points and branch out arbitrarily. The incorporation of at least one basic depression 6 is preferably carried out using a MID 3D LDS process. The LDS process stands for Laser Direct Structuring. The incorporation of the basic depression 6 can additionally take place in the surface of the second side 3 (see...). Fig. 12). As in Fig. As shown in Figure 15, with reference to the fifth embodiment of the multilayer body 105, the base recess 6 can also be incorporated into a layer that is arranged or applied above the base body 10. The base recess 6 defines the predetermined path for the transmission of high-frequency signals. The base recess 6 has a first width B1, which defines the (or at least part of the) outer circumference of the outer conductor 5.

[0029] Once the base recess 6 has been incorporated, at least one base recess 6 is filled with a conductive material (see below). Fig. 4) Filling the base recess 6 and, subsequently, the filling of recesses 8 and / or indentations 7 with a conductive material can be done by electroplating. This and the following steps can also be carried out additionally on the second side 3 of the base body 10. Filling means completely filling recesses 8 and / or indentations 7, especially along the predetermined path.

[0030] Subsequently, at least a first and then a second layer 12, 14 is applied layer by layer to the first side 2, in particular the surface of the first side 2, of the base body 10. The base body 10 has a first thickness D1 in a second direction Y (height). The applied layers 12, 14, 16 each have a second thickness D2, which can vary for each layer. In particular, the second thickness D2 is significantly smaller than the first thickness D1. Thus, the base body 10 gives the multilayered body 1 a (basic) shape and stability (see figure). Fig. 5).

[0031] By applying the at least one first and second layer 12, 14 layer by layer, recesses 8 and indentations 7 are formed layer by layer along the at least one base recess 6 and filled with the conductive material in the first layer 12 and, after the application of the second layer 14, in the second layer 14. The formation of the recesses 8 and indentations 7 is preferably carried out using a MID 3D LDS process.

[0032] First, the first layer 12 is applied to the base body 10 (see below). Fig. 5) Applying or adding a further (substrate) layer, such as the first layer 12, can be achieved, for example, by gluing on a film. After the first layer 12 has been completely applied to the base body 10, recesses 8 and / or indentations 7 are incorporated into the first layer 12 along the base recess 6 (see figure). Fig. 6) Finally, the at least two recesses 7 and the at least one depression 8 in the first layer 12 are filled with the conductive material (see Fig. 7) The filling can be carried out, for example, by mask electroplating, whereby different conductor thicknesses can be produced. The first layer 12, preferably referred to as the intermediate layer, comprises the subsequent signal conductor 4 as well as parts of the outer conductor 5.

[0033] Once the first layer 12 has been completely processed, the second layer 14 is applied to the first layer 12 (see below). Fig. 8) The application of the second layer 14 can, for example, also be achieved by applying a foil. After the second layer 14 has been completely applied to the first layer 12, depressions 8 and / or recesses 7 are incorporated into the second layer 14 along the base depression 6 (see figure). Fig. 9). Finally, the at least two recesses 7 and the at least one depression 8 in the second layer 14 are filled with the conductive material (see. Fig. 10) The filling can be carried out, for example, by electroplating or mask electroplating. The second layer 14, preferably referred to as the cover layer, comprises only parts of the subsequent outer conductor 5. The application and processing of the first and second layer(s) 12, 14 can be repeated any number of times and / or in any sequence of layers. By repeating these steps, multilayer conductor structures, as shown in the third embodiment within the multilayer body 103, can be realized (see Figure 10). Fig. 13).

[0034] After all predetermined first and second layers 12, 14 have been applied and fully processed, a third layer 16 can optionally be applied (see Fig.11) The third layer 16 is a final layer. The third layer 16 has no depressions 8 or recesses 7 relevant to the signal and outer conductors 4, 5. The third layer 16 serves as an insulating, covering, or protective layer with respect to the outer conductor 5. The third layer 16 can be applied, for example, in the form of a film or a protective lacquer.

[0035] After completion of the preceding steps, the multilayer body 1, 102, 103, 104, 105, 106 has at least one base depression 6 in the base body 10, or in a layer above it, as well as depressions 8 and recesses 7 in the first and second layer(s) 12, 14, which are filled with a conductive material. The arrangement (of the base depression 6, the depressions 8, and the recesses 7) is chosen such that the multilayer body 1, 102, 103, 104, 105, 106, in a cross-sectional view on a section plane XY, has at least one signal conductor 4, which is completely surrounded by an outer conductor 5. The signal conductor(s) 4 is / are shielded by the spaced-ahead circumferential conductor 5 (along the predetermined path) (EMC protection) and is suitable for the transmission of high-frequency signals. REFERENCE MARK LIST 1 multi-layered body 2 first page 3 second page 4 signal conductors 5 external conductors 6 Basic In-Depth Training 7 Exclusion 8 In-depth study 9 Control line 10 basic shapes 12 first layer (intermediate layer) 14 second layer (top layer) 16 third layer (insulation) 102 second embodiment 103 third embodiment 104 fourth embodiment 105 fifth embodiment 106 sixth embodiment B1 first width D1 first thickness D2 second thickness P1 first point P2 second point X first direction Y second direction

Claims

[1] Method for manufacturing a multilayer body (1) with at least one integrated signal conductor (4) for transmitting high-frequency signals, the method comprising at least the following steps: a. Providing a basic body (10) with a first side (2); b. Incorporating at least one basic depression (6) between at least one first and one second point (P1, P2) on the first side (2) of the basic body (10); c. Filling at least one of the base depressions (6) with a conductive material; d. layer-by-layer application of at least a first and then a second layer (12, 14) on the first side (2) of the base body (10); with e. layer by layer incorporating depressions (8) and recesses (7) along the at least one base depression (6) and filling the depressions (8) and recesses (7) with the conductive material in the first layer (12) and, after the application of the second layer (14), in the second layer (14); wherein f. after completion of the preceding steps, the at least one base depression (6) as well as the depressions (8) and the recesses (7) in the first and second layers (12, 14) are arranged such that the multilayer body (1) has in a cross-sectional view at least one signal conductor (4) which is completely surrounded by an outer conductor (5). [2] Method according to claim 1, wherein step b. and / or in step e. comprises the layer-by-layer incorporation of depressions (8) and recesses (7) along the at least one base depression (6): Incorporating at least one basic depression (6) and / or the depressions (8) and recesses (7) using a MID 3D LDS method. [3] Method according to claim 1 or 2, further comprising the step: Applying a final third layer (16) which has no depressions (8) or recesses (7). [4] Method according to claim 3, wherein steps d. and e. can be repeated arbitrarily before applying the final third layer (16). [5] Method according to one of claims 1-4, wherein steps b. to f. are further applied on a second, preferably opposite, side (3) of the base body (10). [6] Method according to any one of claims 1-5, wherein the filling of depressions (8) and / or recesses (7) with a conductive material is carried out by electroplating. [7] Multilayer body (1) with at least one integrated signal conductor (4) for transmitting high-frequency signals, comprising: a. a basic body (10) with a first side (2); b. at least one base depression (6) between at least one first and one second point (P1, P2) on the first side (2) of the base body (10), wherein the at least one base depression (6) is filled with a conductive material; c. at least a first and a second layer (12, 14) on the first side (2) of the base body (10); wherein the first and the second layer (12, 14) have depressions (8) and recesses (7) along the at least one base depression (6), and the depressions (8) and recesses (7) are filled with the conductive material, wherein d. the at least one base depression (6) as well as the depressions (8) and recesses (7) of the first and second layer (12, 14) are arranged such that the multilayer body (1) has in a cross-sectional view at least one signal conductor (4) which is completely surrounded by an outer conductor (5). [8] Multilayer body according to claim 7, wherein the multilayer body (1) is formed in one piece. [9] Multilayer body according to claim 7 or 8, wherein the base body (10) is formed from an elastic plastic. [10] Multilayer body according to one of claims 7-9, wherein the base body (10) and the first and second layers (12, 14), and preferably the third layer (16), are formed from a non-conductive material.

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