Electronic devices

Abstract

To provide an electronic device that allows for easy removal of modules while improving EMC resistance. [Solution] The electronic device 10 comprises a substrate 20, a socket 30, a plurality of modules 40, and a pressing member 50 composed of a conductive material. The socket 30 is placed on one surface 21 of the substrate 20 and mounted on the substrate 20. The plurality of modules 40 are electrically connected to the substrate 20 via the socket 30. The pressing member 50 is positioned to overlap the plurality of modules 40 in a plan view in the thickness direction of the substrate 20 and has a base 51 that presses the plurality of modules 40 against the socket 30, and a projection 52 that extends from the base 51 toward the substrate 20. The projection 52 is located between the modules 40 in a plan view.

Description

【Technical Field】 【0001】 The disclosure in this specification relates to an electronic device. 【Background Art】 【0002】 Patent Document 1 discloses an electronic device including a motherboard, a socket mounted on the motherboard, and a central processing unit. The description of the prior art document is incorporated herein by reference as an explanation of the technical elements in this specification. 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 Japanese Patent Application Laid-Open No. 2006-108674 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 In Patent Document 1, the central processing unit is electrically connected to the motherboard via a socket. Therefore, the central processing unit can be easily removed from the motherboard. However, when using a plurality of modules for high functionality or the like, each of the plurality of modules can be a source of electromagnetic wave noise, and each of the plurality of modules can be affected by the electromagnetic wave noise generated by other modules. That is, there is a problem of low EMC resistance. From the above viewpoints or other viewpoints not mentioned, further improvement of the electronic device is required. 【0005】 One object of the present disclosure is to provide an electronic device that can improve EMC resistance while facilitating removal of modules. 【Means for Solving the Problems】 【0006】 An electronic device according to one aspect of the disclosure is a substrate (20) having one surface (21), and A socket (30) is arranged on one surface and mounted on the circuit board, Multiple modules (40) electrically connected to the circuit board via sockets, A pressing member (50) is made of a conductive material and has a base (51) that is arranged to overlap with multiple modules in a plan view in the thickness direction of the substrate and presses multiple modules against the socket, and a protrusion (52) that extends from the base toward the substrate. Equipped with, The protruding portion is located between the modules in a plan view. 【0007】 According to the disclosed electronic device, multiple modules are electrically connected to a substrate via sockets. The pressing of the pressing member ensures good electrical conductivity between the multiple modules and the socket, and consequently, the substrate. Therefore, the modules can be easily removed from the substrate. Furthermore, the pressing member is provided with protrusions that project from the base toward the substrate and are positioned between the modules in a plan view. These protrusions function as shielding against electromagnetic noise between the modules. Therefore, EMC immunity can be improved. 【0008】 The various embodiments disclosed in this specification employ different technical means to achieve their respective objectives. The reference numerals in parentheses in the claims are illustrative in their correspondence with the embodiments described later and are not intended to limit the technical scope. The objectives, features, and effects disclosed in this specification will become clearer by referring to the subsequent detailed description and the accompanying drawings. [Brief explanation of the drawing] 【0009】 [Figure 1] This is a plan view showing an example of an electronic device according to the first embodiment. [Figure 2] This is a plan view with the pressing member omitted. [Figure 3] This is a plan view with modules omitted. [Figure 4]This is a perspective view of the pressing member as seen from the fin side. [Figure 5] This is a plan view of the pressing member as seen from the protruding part side. [Figure 6] This is a cross-sectional view along the line VI-VI in Figure 1. [Figure 7] This is a plan view illustrating a modified example. [Figure 8] This is a cross-sectional view showing a modified example. [Figure 9] This is a plan view of an example of an electronic device according to the second embodiment, in which the pressing member and module are omitted. [Figure 10] This is a cross-sectional view showing an electronic device. [Figure 11] This is a cross-sectional view showing an example of an electronic device according to the third embodiment. [Figure 12] This is a plan view showing the arrangement of the spring components. [Modes for carrying out the invention] 【0010】 Several embodiments will be described below with reference to the drawings. In each embodiment, the same reference numerals are used for corresponding components, and redundant explanations may be omitted. If only a part of the configuration is described in each embodiment, the configuration of other embodiments described earlier can be applied to the other parts of that configuration. Furthermore, in addition to the combinations of configurations explicitly stated in the description of each embodiment, configurations from multiple embodiments can be partially combined even if not explicitly stated, as long as there are no particular problems with the combination. 【0011】 (First Embodiment) First, let's explain the general configuration of the electronic device. The electronic device is sometimes called an electronic control unit (ECU). ECU is an abbreviation for Electronic Control Unit. The electronic device may be mounted on a mobile device, for example. A mobile device can be a vehicle, an aircraft, a ship, construction machinery, agricultural machinery, etc. A mobile device can be manned or unmanned. 【0012】 <Electronic equipment> FIG. 1 is a plan view showing an example of an electronic device. FIG. 1 shows a part of the electronic device, particularly the periphery of a socket, a plurality of modules, and a pressing member. FIG. 2 is a view of FIG. 1 with the pressing member omitted. In FIG. 2, a protruding portion is shown by a dashed-dotted line for showing the positional relationship. FIG. 3 is a view of FIG. 2 with the modules omitted. FIG. 4 is a perspective view of the pressing member as viewed from the fin side. FIG. 5 is a plan view of the pressing member as viewed from the protruding portion side. In FIG. 5, a heat dissipation fin is shown by a broken line for showing the positional relationship. FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. 1. In FIG. 6, for the sake of convenience, a spring member is shown by a broken line. Also, semiconductor hatching is added to the electronic components constituting the module. In FIG. 6, for the sake of convenience, the lands of the substrate electrically connected to the module through the socket are omitted. Also, only the portion of the contact pins of the socket protruding from the socket body is shown. 【0013】 The exemplary electronic device 10 is an electronic control device mounted on a vehicle. The electronic device 10 may be, for example, an automatic driving ECU or an ADAS ECU that executes control for assisting a driver's driving operation. ADAS is an abbreviation for Advanced Driving Assistant System. For example, levels 3 to 5 defined by the Society of Automotive Engineers (SAE International) in the United States correspond to the automatic driving levels, and levels 1 to 2 correspond to the driving assistance levels. The electronic device 10 may be, for example, an ECU for an infotainment system or a cockpit ECU. The cockpit ECU is an ECU that controls a meter device, a navigation device, an air conditioner device, etc. The electronic device 10 may be, for example, an integrated ECU that integrates a plurality of control functions. 【0014】 Hereinafter, the thickness direction of the substrate (motherboard) is shown as the Z direction. Also, one direction orthogonal to the Z direction is shown as the X direction, and the direction orthogonal to both the Z direction and the X direction is shown as the Y direction. Unless otherwise specified, the shape viewed in plan from the Z direction, in other words, the shape along the XY plane defined by the X direction and the Y direction, is taken as the planar shape. The plan view from the Z direction may be simply shown as a plan view. 【0015】 The electronic device 10 includes a substrate 20, a socket 30, a plurality of modules 40, and a pressing member 50. As illustrated, the electronic device 10 may include a heat conduction member 60, a spring member 70, a screw 80, etc. The electronic device 10 may include a housing not shown in the figure. 【0016】 The substrate 20 may be referred to as a printed circuit board, a wiring board, a printed wiring board, etc. The substrate 20 is a so-called motherboard. The substrate 20 may be referred to as a main board. The substrate 20 has a front surface 21 and a back surface 22. The back surface 22 is the surface opposite to the front surface 21 in the Z direction which is the thickness direction of the substrate 20. The planar shape of the substrate 20 is not particularly limited. The substrate 20 has, for example, a substantially rectangular planar shape. 【0017】 The substrate 20 has an insulating base material and conductors. The insulating base material is formed using a material having electrical insulation properties such as resin. As the insulating base material, for example, a material containing only resin may be used, or a combination of a glass cloth, a non-woven fabric, etc. and resin may be used. The conductors are formed using a metal material having good conductivity such as Cu. At least a part of the conductors constitutes a circuit together with the components arranged on the substrate 20. The components include a plurality of modules 40. The components may include the components mounted on the substrate 20. 【0018】 The conductor includes wiring. The wiring is formed, for example, by patterning metal foil. The wiring is located on at least one surface layer on the side 21. In addition to the surface layer on the side 21, the wiring may also be located on the surface layer on the back side, or it may be located inside the insulating substrate. The substrate 20 may be a single-sided substrate, a double-sided substrate, or a multilayer substrate including three or more layers of wiring. The conductor may include, for example, via conductors or through-hole lands. A via conductor is formed by placing a conductor, such as plating, in a through-hole (via) formed in the insulating layer constituting the insulating substrate. Via conductors electrically connect wiring between different layers. Through-hole lands are formed on the wall surface of through-holes that penetrate the substrate 20 in the Z direction. The conductor may also include conductors that do not provide circuit function (wiring function), such as conductors for heat dissipation. 【0019】 The illustrated substrate 20 is a multilayer substrate including inner layer wiring. The substrate 20 has lands 23 and 24 as conductors. The lands 23 and 24 are electrically connected to the ground layer 25, which is an inner layer wiring. The ground layer 25 is a so-called solid ground. The lands 23 and 24 are conductors that provide a ground potential that serves as a reference for potential in the substrate 20. Land 23 is a portion of the wiring arranged on the surface layer on one side 21 that is exposed from the resist (not shown). Land 23 is provided in correspondence with the protrusion 52 of the pressing member 50. Land 23 is provided so as to overlap at least a part of the protrusion 52 in a plan view. 【0020】 Land 24 is a through-hole land. Land 24 is provided on the wall surface and around the opening of the through-hole 26 formed in the substrate 20. The substrate 20 has four through-holes 26, i.e., four lands 24. The through-holes 26 are located in positions that do not overlap with the modules 40 in a plan view. The substrate 20 has lands (not shown) corresponding to multiple modules 40. 【0021】 The socket 30 electrically connects the module 40 and the circuit board 20. The socket 30 is positioned on one side 21 and mounted on the circuit board 20. The socket 30 comprises a socket body 31 and contact pins 32. The illustrated socket 30 further comprises a metal member 33. 【0022】 The socket body 31 holds a plurality of contact pins 32. The socket body 31 is formed using an electrically insulating material such as resin. The socket body 31 is, for example, a molded resin body. The socket body 31 has a mounting portion 311, a partition portion 312, and an outer peripheral edge portion 313. The mounting portion 311 is the portion where a plurality of modules 40 are arranged. The partition portion 312 divides the mounting portion 311 into a plurality of regions corresponding to the modules 40. The outer peripheral edge portion 313 is provided so as to surround the mounting portion 311 and the partition portion 312. 【0023】 The illustrated socket body 31 is box-shaped with one side open in the Z direction. The socket body 31 has a roughly rectangular shape in plan view. The mounting portion 311 and the partition portion 312 form the bottom, and the outer peripheral edge portion 313 forms the side wall. The outer peripheral edge portion 313 has a roughly rectangular annular shape in plan view. The outer peripheral edge portion 313 has a cylindrical shape. The mounting portion 311 and the partition portion 312 are connected to the inner surface of the outer peripheral edge portion 313 near the lower end of the outer peripheral edge portion. The bottom formed by the mounting portion 311 and the partition portion 312 has a roughly rectangular shape in plan view. 【0024】 The partitioned section 312 has a roughly cross shape in plan. The partitioned section 312 includes a portion extending in the X direction and a portion extending in the Y direction. In the partitioned section 312, the portion extending in the X direction and the portion extending in the Y direction intersect. The bottom of the partitioned section 312 is divided into four mounting sections 311 corresponding to the module 40. The mounting sections 311 are located at each of the four corners. At the bottom of the socket body 31, the partitioned section 312 is thinner than the mounting sections 311. The partitioned section 312 is connected to the mounting sections 311 such that its surface facing the substrate 20 is flush. The mounting sections 311 are thick-walled, and the partitioned section 312 is thin-walled. 【0025】 The shape and size of some of the mounting portions 311 may differ from the shape and size of other parts of the mounting portion 311. The shapes and sizes of the mounting portions 311 may be the same as each other. In the example socket body 31, the shapes and sizes (areas) of the four mounting portions 311 are equal to each other. 【0026】 The contact pins 32 are wiring members formed from a highly conductive metallic material such as Cu. Each contact pin 32 is partially covered by the socket body 31, while other parts are exposed from the socket body 31. The contact pins 32 include at least a plurality of contact pins 321. The contact pins 321 electrically connect the module 40 to the substrate 20. The contact pins 321 are located on the mounting portion 311. The contact pins 321 are exposed from the upper surface of the mounting portion 311 and extend in the Z direction. The contact pins 321 are provided corresponding to the lands 43 of the module 40. 【0027】 The contact pin 32 further includes contact pins 322. The contact pins 322 electrically connect the projection 52 of the pressing member 50 to the substrate 20. The contact pins 322 are arranged in the compartment 312. The number of contact pins 322 is not particularly limited. There may be one or more per projection 52. The example contact pin 32 includes multiple contact pins 322 arranged along the compartment 312. The multiple contact pins 322 are arranged over substantially the entire length of the compartment 312 in the extending direction. 【0028】 Contact pin 32 is connected to the corresponding land on the substrate 20 via solder 35 located on the underside of socket 30. The solder 35 is, for example, ball-shaped. Contact pin 321 is electrically connected to the corresponding land via solder 35. Contact pin 322 is electrically connected to the corresponding land 23 via solder 35. 【0029】 The metal member 33, which is an element of the socket 30, is provided for purposes such as improving the strength and heat dissipation of the socket 30. The metal member 33 is located on the outside of the socket body 31. The metal member 33 is located adjacent to the outer peripheral edge of the socket body 31. The metal member 33 is mechanically connected to the socket body 31 at a location not shown in the figure. 【0030】 The illustrated metal member 33 supports the pressing member 50 on one surface 21 of the substrate 20. The upper end of the metal member 33 is located approximately at the same level as, or above, the upper end of the outer peripheral edge 313 in the Z direction. The metal member 33 has a roughly rectangular annular shape in plan so as to surround the socket body 31. The metal member 33 is fixed to the substrate 20 directly or indirectly. The metal member 33 may be fixed to the substrate 20 by, for example, soldering or by screw fastening. The metal member 33 has through holes 331 formed therein for fixing the pressing member 50 to the substrate 20. The through holes 331 are provided corresponding to through holes 26 in the substrate 20. The illustrated through holes 331 are provided at each of the four corners of the rectangle of the metal member 33. 【0031】 Module 40 is placed on one side 21 of the substrate 20 via a socket 30. Module 40 is electrically connected to the substrate 20 via the socket 30. Module 40 forms a circuit together with the substrate 20. Module 40 may be a circuit board on which electronic components are mounted, or it may be a semiconductor package having at least one semiconductor chip. Module 40 may also be an IC chip such as a microcontroller. The electronic device 10 has multiple modules 40. 【0032】 The example module 40 includes modules 40A, 40B, 40C, and 40D. Modules 40A, 40B, 40C, and 40D are modularized by functional unit. The four modules 40 are circuit boards. These circuit boards are sometimes referred to as sub-boards. Each module 40 comprises a substrate 41 and electronic components 42 mounted on the substrate 41. Module 40 is located on the mounting section 311 of the socket body 31. The substrate 41 has lands 43 on its lower surface, which is the surface facing the mounting section 311. The lands 43 are arranged in a grid pattern on the lower surface of the substrate 41. The electronic components 42 are located on the upper surface of the substrate 41. Module 40 is an LGA type module. LGA is an abbreviation for Land Grid Array. 【0033】 The pressing member 50 is made of a conductive material. The pressing member 50 is formed using a metallic material such as Al, Cu, or Mg. The pressing member 50 presses multiple modules 40 to ensure good electrical conductivity through contact between the modules 40 and the socket 30 (contact pins 321). The pressing member 50 presses the multiple modules 40 toward the socket 30, i.e. toward the substrate 20, in the Z direction. In addition to the function of pressing the modules 40, the pressing member 50 may also have other functions, such as dissipating heat generated by the modules 40. 【0034】 The pressing member 50 comprises at least a base 51 and a projection 52. The exemplary pressing member 50 further comprises a heat dissipation fin 53. The base 51 is positioned to overlap with the multiple modules 40 in a plan view. The base 51 presses the multiple modules 40 against the socket 30. The projection 52 extends from the base 51 toward the substrate 20. The projection 52 is located between the modules 40 in a plan view. 【0035】 The illustrated base 51 is a flat plate with a substantially rectangular shape in plan view. The base 51 is provided so as to enclose the socket body 31 in plan view. The base 51 is provided so as to substantially match the outer contour of the socket 30, which includes the metal member 33, in plan view. The lower surface of the base 51, which is the surface facing the substrate 20, is in direct or indirect contact with the electronic component 42 of the module 40. The illustrated base 51 is in contact with the electronic component 42 via the heat conductive member 60. Under pressure from the base 51, the land 43 of the module 40 ensures good conductivity with the corresponding contact pin 321. 【0036】 The lower surface of the base 51 is in direct or indirect contact with the upper end of the metal member 33. In the example, the base 51 is in direct contact with the upper end of the metal member 33. The outer peripheral edge of the lower surface of the base 51 is supported by the metal member 33. In the supported state, the base 51 presses against the module 40. The base 51 has through holes 511 formed therein for fixing the pressing member 50 to the substrate 20. Multiple through holes 511 are provided in the base 51. In the example, the through holes 511 are provided at each of the four corners of the rectangle. The through holes 511 are provided corresponding to the through holes 331 in the metal member 33. 【0037】 The projection 52 is connected to the lower surface of the base 51 and extends toward the substrate 20. The projection 52 is in direct or indirect contact with the socket 30. In the example, the projection 52 is in direct contact with the contact pins 322 of the socket 30. In plan view, the projection 52 is positioned so as to overlap with the partition 312 but not with the mounting portion 311. The projection 52 has a roughly cross shape in plan view. The projection 52 has a first extension 521 extending in the X direction and a second extension 522 extending in the Y direction. In plan view, the projection 52 is approximately the same size as the partition 312, or slightly smaller than the partition 312. The tip 523 of the projection 52 is in contact with all the contact pins 322 protruding from the partition 312. When pressed, the projection 52 contacts the contact pins 322, ensuring good electrical conductivity between it and the contact pins. 【0038】 The protrusion 52 demarcates the arrangement area for multiple modules 40, one module 40 at a time. The protrusion 52 separates the mounting section 311 from the modules 40. The protrusion 52 blocks the space between adjacent modules 40. In the example, the protrusion 52 extends in the Z direction to a position closer to the substrate 20 than to the modules 40. The tip 523 is located below the land-forming surface of the substrate 41. The tip 523 is located below the upper surface of the mounting section 311. In the direction of the arrangement of modules 40, the protrusion 52 completely blocks the space between adjacent modules 40. 【0039】 The heat dissipation fins 53 are connected to the base 51. By providing the heat dissipation fins 53, the heat exchange area can be increased. The shape, number, and arrangement of the heat dissipation fins 53 are not particularly limited. The example heat dissipation fins 53 extend from the upper surface of the base 51 in the Z direction, away from the substrate 20. The pressing member 50 has a plurality of heat dissipation fins 53. The heat dissipation fins 53 have a substantially rectangular shape in plan, with the Y direction as the longitudinal direction and the X direction as the short direction. The plurality of heat dissipation fins 53 are arranged in the X direction at a predetermined pitch. The heat dissipation fins 53 are provided such that at least a portion of the heat dissipation fins 53 overlap with the module 40. 【0040】 The cooling method may be air cooling or water cooling. For example, a heat dissipation fin 53 may be placed in the flow path of a cooler (not shown), and heat exchange may occur between the heat dissipation fin 53 and the refrigerant. The base 51 may form part of a cooler having a flow path. Pin fins may be used instead of flat heat dissipation fins 53. 【0041】 The heat conduction member 60 is positioned to enhance heat dissipation when the pressing member 50 functions as a heat dissipation member. The heat conduction member 60 is interposed between the base 51 and the electronic component 42 and is in contact with the base 51 and the electronic component 42. The heat conduction member 60 transfers the heat generated by the electronic component 42 to the pressing member 50. The heat conduction member 60 is a TIM such as a heat dissipation gel or a heat conductive sheet. TIM is an abbreviation for Thermal Interface Material. The heat conduction member 60 is provided so as to overlap with at least some of the electronic components 42 provided in the multiple modules 40. The heat conduction member 60 is provided in a position that overlaps with the electronic components 42 that generate particularly large amounts of heat among the multiple electronic components 42. The heat conduction member 60 thermally connects the electronic component 42 and the base 51. 【0042】 The spring member 70 applies a force to the base 51 of the pressing member 50 that presses the module 40 against it. The spring member 70 applies a reaction force of spring deformation to the base 51 as the force pressing the module 40 against it. The example spring member 70 includes a metal spring member 70A positioned between the head 801 of the screw 80 and the base 51. The spring member 70A is positioned separately from the screw 80. When the pressing member 50 is fixed to the substrate 20 by the screw 80, the spring member 70A generates a reaction force due to deformation in the Z direction. This maintains the pressing state of the module 40 by the base 51. 【0043】 The screw 80 is a fastening member that fixes the pressing member 50 to the base plate 20. The screw 80 has a head 801 and a column portion 802 that is connected to the head 801 and extends in the Z direction. The illustrated electronic device 10 includes a bush 81 fixed to the base plate 20. The bush 81 is inserted through a through hole 26 in the base plate 20. The bush 81 is fixed to the base plate 20 by press-fitting or the like. The end of the bush 81 is locked to the back surface 22. The bush 81 has a portion that protrudes toward one side 21. At least a part of the protruding portion of the bush 81 is inserted into a through hole 331 in the metal member 33. The bush 81 has a screw hole 811 that opens at its upper end. The screw 80 is inserted into the screw hole 811 through the through hole 511 in the base 51 and the through hole 331 in the metal member 33, and is screwed into the screw hole 811. In this screwed-in state, i.e., fixed state, the spring member 70A is compressed between the head 801 and the base 51. The base 51 is electrically connected to the land 24 via the screw 80 and the bush 81. The base 51 is electrically connected to the land 24 via the metal member 33. 【0044】 <Summary of the First Embodiment> The electronic device 10 of this embodiment comprises a substrate 20, a socket 30, a plurality of modules 40, and a pressing member 50 composed of a conductive material. The socket 30 is positioned on one surface 21 of the substrate 20 and is mounted on the substrate 20. The plurality of modules 40 are electrically connected to the substrate 20 via the socket 30. The pressing member 50 is positioned to overlap the plurality of modules 40 in a plan view in the thickness direction of the substrate 20 and has a base 51 that presses the plurality of modules 40 against the socket 30, and a projection 52 that extends from the base 51 toward the substrate 20. The projection 52 is positioned between the modules 40 in a plan view. 【0045】 As described above, instead of directly mounting the multiple modules 40 to the substrate 20, the multiple modules 40 are electrically connected to the substrate 20 via sockets 30. The pressing member 50 ensures good electrical conductivity between the multiple modules 40 and the sockets 30, and consequently, the substrate 20. Therefore, the modules 40 can be easily removed from the substrate. The pressing member 50 is also provided with a projection 52 that protrudes from the base 51 toward the substrate 20 and is located between the modules 40 in a plan view. The projection 52 functions as a shield against electromagnetic noise between the modules 40. Compared to a configuration without the projection 52, the influence of electromagnetic noise generated by any module 40 on other modules 40 can be reduced. Therefore, EMC immunity can be improved. 【0046】 Since the pressing member 50 is made of a conductive material, it can dissipate the heat generated by the multiple modules 40 through the pressing member 50. However, the base 51 that presses the multiple modules 40 together needs to be of a certain size, which makes the base 51 prone to warping. However, by providing the protrusion 52, the rigidity of the pressing member 50 can be increased, and the warping of the base 51 can be suppressed. This allows the heat generated by the multiple modules 40 to be dissipated efficiently. In addition, good electrical conductivity between the modules 40 and the socket 30 can be ensured. 【0047】 As illustrated, the protrusions 52 may be provided to demarcate the arrangement area of ​​multiple modules 40 for each module 40. This reduces the impact of electromagnetic noise generated by one module 40 on another module 40, compared to a configuration in which the protrusions 52 are placed only in a small portion of the opposing area between adjacent modules 40. In other words, EMC immunity can be further improved. 【0048】 As illustrated, the protrusion 52 may be provided such that the tip 523 is located closer to the substrate 20 than the multiple modules 40 in the thickness direction. This reduces the influence of electromagnetic noise generated by one module 40 on another module 40 compared to a configuration where the tip 523 is located further from the substrate 20 than the modules 40. In other words, EMC immunity can be further improved. 【0049】 As illustrated, the protrusion 52 may come into contact with the socket 30. Compared to a configuration in which the protrusion 52 does not come into contact with the socket 30, i.e., a configuration in which the tip 523 is located above the socket 30, EMC resistance can be improved. 【0050】 As illustrated, the protrusion 52 may be electrically connected to a conductor on the substrate 20 that provides a predetermined potential. In the illustrated electronic device 10, the protrusion 52 is electrically connected to a land 23 that provides a ground potential via a socket 30. This fixes the pressing member 50 at the predetermined potential, thereby enhancing the shielding effect against electromagnetic noise. Electromagnetic noise can be shielded by the pressing member 50 and the conductor on the substrate 20. Note that the predetermined potential is not limited to the ground potential. For example, it may be the power supply potential. 【0051】 As illustrated, a spring member 70 may be provided. The spring member 70 applies a force to the base 51 of the pressing member 50 that presses the module 40. By utilizing the reaction force of spring deformation, the base 51 can press the module 40 with a simple configuration. 【0052】 As illustrated, the electronic device 10 may be provided with a fastening member to fix the pressing member 50 to the substrate 20. The illustrated electronic device 10 is provided with a screw 80 as a fastening member. In a configuration that includes a fastening member to fix to the substrate 20, the pressing member 50 may be electrically connected to a conductor on the substrate 20 that provides a predetermined potential. In the illustrated electronic device 10, the pressing member 50 is electrically connected to a land 24 that provides a ground potential. As a result, the pressing member 50 is fixed at a predetermined potential, thereby enhancing the shielding effect against electromagnetic noise. Note that the predetermined potential is not limited to the ground potential. For example, it may be the power supply potential. 【0053】 As illustrated, a heat conductive member 60 may be provided interposed between at least one of the multiple modules 40 and the pressing member 50. The heat conductive member 60 contributes, for example, to increasing the contact area and improving adhesion. Therefore, heat dissipation can be improved compared to a configuration in which the module 40 is in direct contact with the pressing member 50 (base 51). 【0054】 As illustrated, heat dissipation fins 53 connected to the base 51 may be provided on the pressing member 50. By providing heat dissipation fins 53, for example, the surface area (heat dissipation area) can be increased, thereby improving heat dissipation. 【0055】 <Variation> Although an example has been shown in which the socket 30 includes a metal member 33, it is not limited to this. A separate metal member that has a support function for the pressing member 50 may be provided in addition to the socket 30. The socket 30 may also be configured without the metal member 33. 【0056】 The number of modules 40 and the number of mounting sections 311 are not limited to the examples described above. The shape of the compartment section 312 and the shape of the protruding section 52 are not limited to the examples described above. For example, as shown in Figure 7, module 40 may include modules 40E and 40F. In other words, it may have two modules 40. Figure 7 corresponds to Figure 2. Modules 40E and 40F have a roughly rectangular shape in plan with the Y direction as the longitudinal direction and the X direction as the transverse direction. Modules 40E and 40F are aligned in the X direction. The socket body 31 has two mounting sections 311 and one compartment section 312. The compartment section 312 has a roughly I-shape in plan extending in the Y direction. The protruding section 52 also has a roughly I-shape in plan, similar to the compartment section 312. Although an example of two modules 40 has been shown, it may have three modules 40, or five or more modules 40. 【0057】 An example of screwing the pressing member 50 to the substrate 20 has been shown, but the invention is not limited to this. For example, as shown in Figure 8, the pressing member 50 may be screwed to the socket 30. Figure 8 corresponds to Figure 6. The electronic device 10 is equipped with a screw 82 as a fastening member for fixing the pressing member 50 to the socket 30. In Figure 8, the metal member 33 has a screw hole 332 that opens at its upper end. The screw 82 has a head 821 and a column 822. The column 822 is inserted into the screw hole 332 through a through hole 511 in the base 51 and is screwed into the screw hole 332. The land 24 is located on the surface layer of one side 21 of the substrate 20. The base 51 is electrically connected to the land 24 via the metal member 33. 【0058】 (Second Embodiment) This embodiment is a modification based on the prior embodiment, and the description of the prior embodiment can be referenced. In the prior embodiment, the protrusion was in contact with the socket. Alternatively, the protrusion may be in contact with the substrate. 【0059】 Figure 9 is a plan view showing an example of an electronic device according to this embodiment. In Figure 9, as in Figure 3, the pressing member and module are omitted. Figure 10 is a cross-sectional view showing the electronic device. Figure 10 corresponds to Figure 6. 【0060】 In the electronic device 10 of this embodiment, the structure of the socket 30 differs from that of the prior embodiment. The socket body 31 has four mounting portions 311, an outer peripheral edge portion 313, and an opening 314. The opening 314 penetrates the bottom of the socket body 31 in the Z direction. The illustrated opening 314 is a through hole provided in the portion corresponding to the partition portion 312 described in the prior embodiment. The opening 314 has a substantially cross shape in plan. At the bottom of the socket body 31, the opening 314 partitions the mounting portion 311 into four sections. The contact pins 32 include a contact pin 321 arranged on the mounting portion 311, but do not include a contact pin 322. 【0061】 The projection 52 has a substantially cross shape in plan, similar to the prior embodiment. In the Z direction, the projection 52 is longer than the projection 52 shown in the prior embodiment. The projection 52 passes through the opening 314. The tip 523 of the projection 52 is in contact with one surface 21 of the substrate 20. The projection 52 is electrically connected to the land 23 by contacting the land 23. In Figure 10, the projection 52 is in direct contact with the land 23, but it may be indirectly in contact via a conductive gasket or the like. The other configurations are the same as those described in the prior embodiment. 【0062】 <Summary of the second embodiment> In this embodiment as well, the protrusion 52 is provided such that the tip 523 is located closer to the substrate 20 than the multiple modules 40 in the thickness direction of the plate. Therefore, EMC resistance can be further improved. In addition, the protrusion 52 is electrically connected to the land 23 that provides ground potential. This enhances the shielding effect against electromagnetic noise. 【0063】 As illustrated, the protrusion 52 may come into contact with the substrate 20. By increasing the length of the protrusion 52, EMC resistance can be improved compared to a configuration in which it comes into contact with the socket 30. 【0064】 As illustrated, the protrusion 52 may be brought into contact with the substrate 20 through an opening 314 provided in the socket 30. This improves EMC resistance without increasing the number of components. 【0065】 (Third embodiment) This embodiment is a modification based on the prior embodiment, and the description of the prior embodiment can be referenced. In the prior embodiment, a screw member was placed on the base. Alternatively, a spring member may be placed on the back surface of the substrate. 【0066】 Figure 11 is a cross-sectional view showing an example of an electronic device according to this embodiment. Figure 11 corresponds to Figure 6. Figure 12 is a plan view showing the electronic device. Figure 12 corresponds to Figure 2. In Figure 12, the spring member is shown with a dashed line to indicate its positional relationship, and the protruding part is shown with a dashed-dotted line. The support part of the pressing member is also shown. 【0067】 In the electronic device 10 of this embodiment, the socket 30 does not have a metal member 33. Instead of a metal member 33, the pressing member 50 has a support portion 54. The support portion 54 extends from the base 51 toward the substrate 20. The support portion 54 only needs to be structured to support the other part of the pressing member 50 on one surface 21 of the substrate 20. The support portion 54 may be provided, for example, so as to surround the socket 30 in a plan view. Multiple support portions 54 may be arranged in a distributed configuration. The illustrated support portion 54 has a substantially rectangular ring shape in plan so as to surround the socket 30. 【0068】 The support portion 54 has a screw hole 55 opening at its lower end for fixing the pressing member 50 to the substrate 20. The screw hole 55 is provided corresponding to the through hole 26 in the substrate 20. In the example, the screw holes 55 are provided at each of the four corners of the rectangle. The lower end of the support portion 54 is in contact with one surface 21 of the substrate 20. The support portion 54 is electrically connected to the land 24 by contacting the land 24. 【0069】 The spring member 70 includes a metal back plate 70B in place of the spring member 70A. The back plate 70B is positioned on the back surface 22 side of the substrate 20. The back plate 70B pulls the pressing member 50 toward the substrate 20 side by the reaction force due to spring deformation, thereby generating a pressing force on the pressing member 50 that presses the module 40. 【0070】 The backplate 70B has a main body 71 and a plurality of legs 72. The main body 71 is provided so as to overlap at least a portion of each module 40 in a plan view. The main body 71 is in contact with the back surface 22 when the backplate 70B is fixed to the substrate 20. The legs 72 are connected to the main body 71. When the backplate 70B is fixed to the substrate 20, at least a portion of the legs 72 are positioned away from the back surface 22. To ensure stable fixation, it is preferable to have three or more legs 72. 【0071】 In the example backplate 70B, the main body 71 is frame-shaped. The main body 71 has a roughly rectangular ring shape in plan view. The main body 71 is positioned to overlap with the substrate 41 of each module 40 in plan view. The legs 72 extend from the four corners of the main body 71. The backplate 70B has four legs 72. The backplate 70B has bends at the boundary between the main body 71 and the legs 72, and at intermediate positions of the legs 72. The legs 72 are provided to be spring-deformable in the Z direction. The legs 72 are positioned away from the back surface 22 for almost their entire length. 【0072】 The end of each leg portion 72 is provided with a through hole 73 for fixing a screw 83 to the support portion 54. Between two adjacent leg portions 72, the distance between their ends is greater than the distance between the connecting ends with the main body portion 71. The leg portions 72 extend diagonally from the main body portion 71. When screwed together, the spring reaction force of the leg portion 72 pulls the pressing member 50 towards the base plate 20, and the base 51 presses the module 40 against the socket 30. The screw 83 has a head 831 and a column portion 832. The column portion 832 of the screw 83 passes through the through hole 73 in the leg portion 72 and the through hole 26 in the base plate 20, and is screwed into the screw hole 55 of the support portion 54. The other configurations are the same as those described in the prior embodiment. 【0073】 <Summary of the third embodiment> The electronic device 10 of this embodiment also includes a spring member 70. By utilizing the reaction force of the spring deformation, the base 51 can press against the module 40 with a simple configuration. 【0074】 As illustrated, the spring member 70 may include a back plate 70B positioned on the back surface 22 of the substrate 20. The back plate 70B is provided so as to overlap at least a portion of each module 40 in a plan view and has a main body portion 71 positioned in contact with the back surface 22, and a plurality of legs 72 connected to the main body portion 71, positioned away from the back surface 22, and mechanically connected to the pressing member 50 through through holes 26. The base 51 is pulled towards the substrate 20 by the reaction force due to the spring deformation of the back plate 70B, and presses the modules 40. 【0075】 This design allows for easy removal of the module 40, improves EMC resistance, and reduces the number of components in the electronic device 10. Furthermore, the backplate 70B suppresses warping of the substrate 20. This ensures good electrical conductivity between the module 40 and the socket 30, and consequently, the substrate 20. For example, it maintains good thermal connection between the electronic component 42 and the base 51, improving heat dissipation. For example, it ensures good electrical conductivity between the protrusion 52 and the land 23. And it ensures good electrical conductivity between the support portion 54 and the land 24. 【0076】 The configuration shown in the second embodiment, specifically the configuration in which the socket 30 has an opening 314 and the protruding portion 52 contacts the substrate 20 through the opening 314, may be combined with the configuration shown in this embodiment. 【0077】 (Other embodiments) The disclosures in this specification and drawings are not limited to the exemplary embodiments. The disclosures include the exemplary embodiments and variations thereof by those skilled in the art. For example, the disclosures are not limited to combinations of parts and / or elements shown in the embodiments. The disclosures are implementable in a variety of combinations. The disclosures may have additional parts that can be added to the embodiments. The disclosures include those in which parts and / or elements of the embodiments have been omitted. The disclosures include substitutions or combinations of parts and / or elements between one embodiment and another. The scope of the disclosed technical areas is not limited to the descriptions of the embodiments. Some of the scope of the disclosed technical areas are indicated by the claims and should be understood to include all modifications within the meaning and scope equivalent to the claims. 【0078】 The disclosures in the specification and drawings are not limited by the claims. The disclosures in the specification and drawings encompass the technical ideas described in the claims and extend to a wider and more diverse range of technical ideas than those described in the claims. Therefore, a variety of technical ideas can be extracted from the disclosures in the specification and drawings without being bound by the claims. 【0079】 When an element or layer is referred to as “on top of,” “connected to,” “linked to,” or “joined,” it may be directly on top of, connected to, or joined to another element or layer, and there may also be an intervening element or layer. In contrast, when an element is referred to as “directly on top of,” “directly connected to,” “directly linked to,” or “directly joined to” another element or layer, there is no intervening element or layer. Other words used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” vs. “directly between,” “adjacent” vs. “directly adjacent,” etc.). As used in this specification, the term “and / or” includes any combination and all combinations relating to one or more of the enumerated items relating to each other. That is, the statement A and / or B means at least one of A and B. 【0080】 Spatially relative terms such as "inside," "outside," "back," "below," "low," "above," and "high" are used here to facilitate descriptions of the relationship between one element or feature and other elements or features, as illustrated. Spatially relative terms may be intended to encompass different orientations of the device in use or operation, in addition to the orientation depicted in the drawings. For example, if the device in the drawing is turned upside down, an element described as "below" or "directly below" another element or feature will be oriented "above" the other element or feature. Thus, the term "below" can encompass both up and down orientations. The device may also be oriented in other directions (it may be rotated 90 degrees or in other directions), and the spatially relative descriptors used in this specification will be interpreted accordingly. 【0081】 (Disclosure of technical ideas) This specification discloses several technical concepts, as listed in the following paragraphs. Some paragraphs are written in a multiple dependent form, where subsequent paragraphs optionally refer to preceding paragraphs. Furthermore, some paragraphs are written in a multiple dependent form, referring to other multiple dependent forms. These paragraphs written in multiple dependent forms define several technical concepts. 【0082】 <Technical philosophy 1> A substrate (20) having one surface (21), A socket (30) is arranged on the aforementioned surface and mounted on the substrate, Multiple modules (40) electrically connected to the substrate via the aforementioned socket, A pressing member (50) is made of a conductive material and has a base (51) that is arranged to overlap with the plurality of modules in a plan view of the substrate in the thickness direction and presses the plurality of modules against the socket, and a protrusion (52) that extends from the base toward the substrate. Equipped with, The aforementioned protrusion is located between the modules in the plan view of the electronic device. 【0083】 <Technical philosophy 2> The electronic device according to technical concept 1, wherein the protruding portion partitions the arrangement area of ​​the multiple modules for each module. 【0084】 <Technical philosophy 3> The electronic device according to technical concept 1 or technical concept 2, wherein the tip (523) of the protrusion is closer to the substrate than the plurality of modules in the plate thickness direction. 【0085】 <Technical philosophy 4> The aforementioned protruding portion is in contact with the substrate, as described in technical concept 3 of the electronic device. 【0086】 <Technical philosophy 5> The socket has an opening (314), The electronic device according to technical concept 4, wherein the protruding portion is in contact with the substrate through the opening. 【0087】 <Technical philosophy 6> The aforementioned protrusion is in contact with the socket, as described in technical concept 3 of the electronic device. 【0088】 <Technical philosophy 7> The substrate has a conductor (23) that provides a predetermined potential, The aforementioned protrusion is electrically connected to the conductor, as described in any one of the technical concepts 3 to 6 of the electronic device. 【0089】 <Technical philosophy 8> An electronic device according to any one of technical concepts 1 to 7, comprising a spring member (70) that applies a force to press the module to the base of the pressing member. 【0090】 <Technical philosophy 9> The substrate has a plurality of through holes (26) provided in positions that do not overlap with the plurality of modules in the plan view, The spring member includes a back plate (70B) positioned on the back surface of the substrate. The backplate is provided so as to overlap at least a portion of each of the modules in the plan view and has a main body portion (71) that is in contact with the back surface and a plurality of legs (72) that are connected to the main body portion, provided away from the back surface, and mechanically connected to the pressing member through the through holes. The base is attracted to the substrate side by the reaction force due to the spring deformation of the back plate, and presses against the module, as described in technical concept 8 of the electronic device. 【0091】 <Technical Thought 10> An electronic device according to any one of technical concepts 1 to 9, comprising fastening members (80, 83) for fixing the pressing member to the substrate. 【0092】 <Technical Thought 11> An electronic device according to any one of technical ideas 1 to 9, comprising a fastening member (82) for fixing the pressing member to the socket. 【0093】 <Technical Thought 12> The substrate has a conductor (24) that provides a predetermined potential, The pressing member is electrically connected to the conductor in a fixed state, as described in the electronic device according to technical concept 10 or technical concept 11. 【0094】 <Technical Thought 13> An electronic device according to any one of technical ideas 1 to 12, comprising a heat conductive member (60) interposed between at least one of the plurality of modules and the pressing member. 【0095】 <Technical Thought 14> The pressing member has a heat dissipation fin (53) connected to the base, as described in any one of the technical concepts 1 to 13. [Explanation of Symbols] 【0096】 10...Electronic device, 20...Substrate, 21...One side, 22...Back side, 23,24...Land, 25...Ground layer, 26...Through hole, 30...Socket, 31...Socket body, 311...Mounting part, 312...Compartment part, 313...Outer edge, 314...Opening, 32,321,322...Contact pin, 33...Metal component, 331...Through hole, 332...Screw hole, 35...Solder, 40,40A,40B,40C,40D...Module, 41...Substrate, 42...Electronic component, 43 ...land, 50...pressing member, 51...base, 511...through hole, 52...projection, 521...first extension, 522...second extension, 523...tip, 53...heat dissipation fin, 54...support part, 55...screw hole, 60...heat conducting member, 70, 70A...spring member, 70B...back plate, 71...main body, 72...leg part, 73...through hole, 80, 82, 83...screw, 801, 821, 831...head, 802, 822, 832...column part, 81...bush, 811...screw hole

Claims

[Claim 1] A substrate (20) having one surface (21), A socket (30) is arranged on the aforementioned surface and mounted on the substrate, A plurality of modules (40) electrically connected to the substrate via the socket, A pressing member (50) is provided, comprising a base (51) positioned to overlap with the plurality of modules in a plan view of the substrate in the thickness direction and pressing the plurality of modules against the socket, and a protruding portion (52) extending from the base toward the substrate, and comprising a conductive material, Equipped with, The aforementioned protrusion is located between the modules in the plan view of the electronic device. [Claim 2] The electronic device according to claim 1, wherein the protruding portion partitions the arrangement area of ​​the plurality of modules for each module. [Claim 3] The electronic device according to claim 2, wherein the tip (523) of the protrusion is closer to the substrate than the plurality of modules in the plate thickness direction. [Claim 4] The electronic device according to claim 3, wherein the protruding portion is in contact with the substrate. [Claim 5] The socket has an opening (314), The electronic device according to claim 4, wherein the protruding portion is in contact with the substrate through the opening. [Claim 6] The electronic device according to claim 3, wherein the protruding portion is in contact with the socket. [Claim 7] The substrate has a conductor (23) that provides a predetermined potential, The electronic device according to claim 3, wherein the protruding portion is electrically connected to the conductor. [Claim 8] The electronic device according to any one of claims 1 to 7, further comprising a spring member (70) that applies a force to press the module to the base of the pressing member. [Claim 9] The substrate has a plurality of through holes (26) provided in positions that do not overlap with the plurality of modules in the plan view, The spring member includes a back plate (70B) positioned on the back surface of the substrate. The backplate is provided so as to overlap at least a portion of each of the modules in the plan view and has a main body portion (71) that is in contact with the back surface and a plurality of legs (72) that are connected to the main body portion, provided away from the back surface, and mechanically connected to the pressing member through the through holes. The electronic device according to claim 8, wherein the base is attracted to the substrate side by the reaction force due to the spring deformation of the back plate, and presses against the module. [Claim 10] The electronic device according to claim 1, further comprising fastening members (80, 83) for fixing the pressing member to the substrate. [Claim 11] The electronic device according to claim 1, further comprising a fastening member (82) for fixing the pressing member to the socket. [Claim 12] The substrate has a conductor (24) that provides a predetermined potential, The electronic device according to claim 10 or 11, wherein the pressing member is electrically connected to the conductor in a fixed state. [Claim 13] The electronic device according to any one of claims 1 to 7, further comprising a heat conductive member (60) interposed between at least one of the plurality of modules and the pressing member. [Claim 14] The electronic device according to any one of claims 1 to 7, wherein the pressing member has a heat dissipation fin (53) connected to the base.

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