Storage system, anomaly detection method, and information device

Abstract

This invention provides a storage system, an anomaly detection method, and an information device that can accurately and quickly detect abnormal heat generation in the connector section. [Solution] The storage system comprises a power supply unit having a card edge connector (male), a card edge connector (female), a circuit section including an MCU that supplies power from the power supply unit, a controller, and a drive section. The storage system is electrically connected to the power supply unit via a card edge connector (female) connected to the card edge connector (male) of the power supply unit. The MCU obtains the connector temperature, which is the temperature of the connector section where the card edge connector (male) and the card edge connector (female) are connected, and the power supply path temperature, which is the temperature of the power supply path from the connector section. Based on whether or not the correlation between the connector temperature and the power supply path temperature is broken, the MCU detects the occurrence of abnormal heat generation in the connector section.

Description

Technical Field

[0001] The present invention relates to a storage system, an abnormality detection method, and an information device.

Background Art

[0002] A power supply unit (PSU (Power Supply Unit)) applied to a storage device (storage system) is one of the important components that support the stable operation of the entire system. In a storage device, a dedicated PSU using a dedicated connector structure is adopted. By adopting a dedicated connector structure, the connection is guaranteed, so there are few problems.

[0003] On the other hand, in a storage device, in consideration of costs and the like, instead of a dedicated PSU, a general-purpose PSU such as that used in server products may be adopted. A general-purpose PSU does not use a dedicated connector structure like a dedicated PSU, but adopts a card-edge structure.

[0004] The card-edge connector on the PSU side adopts a structure in which a large number of connection terminals (metals plated with gold) are formed at the edge portion of the substrate. On the other hand, the storage device side adopts a connector having terminals corresponding to the large number of connection terminals. In the card-edge structure, by inserting the card-edge connector into the corresponding connector, they are electrically connected.

[0005] When a general-purpose PSU is used in a storage device, the connector on the storage device side and the card-edge connector on the PSU side are often manufactured by different vendors. Due to inappropriate setting of dimensional tolerances and manufacturing management problems, the reliability of electrical connection and mechanical connection may decrease, resulting in many failures caused by abnormal heat generation in the connector part, which is the connection point between the connectors.

[0006] Patent Document 1 discloses a technique for monitoring the temperature of multiple field replaceable units (FRUs) and determining abnormalities in each FRU based on temperature threshold information. Patent Document 2 discloses a technique in which a microcomputer of a power device determines that there is a connector contact problem if the detected current value during operation of the power device falls below or exceeds a current consumption that is judged to be normal for a certain period of time, and then issues an abnormality notification or stops operation. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2014-191517 [Patent Document 2] Japanese Patent Publication No. 2004-103327 [Overview of the project] [Problems that the invention aims to solve]

[0008] When a PSU with a card edge connector is applied to a storage device, as described above, PSU failure may occur due to abnormal heat generation in the connector area. PSU failure can cause the entire storage device to shut down. Therefore, it is necessary to detect abnormal heat generation in the connector area caused by the card edge structure, which is a cause of PSU failure, early and accurately. Similarly, when a general-purpose PSU with a card edge connector is applied to a server device, it can cause the entire server device to shut down, so it is necessary to detect abnormal heat generation in the connector area caused by the card edge structure early and accurately.

[0009] Furthermore, the technology described in Patent Document 1 detects abnormalities in detachable units based on a temperature threshold, and therefore cannot detect abnormal heat generation in the connector portion at an early stage, as in the present invention. The technology described in Patent Document 2 is a technology for detecting poor contact in the connector of a power device connected to (inserted into) a power outlet, and is not a technology for detecting abnormal heat generation in the connector portion to which the connector of a power supply unit is connected, as in the present invention.

[0010] This invention was made in view of the above problems. Specifically, one of the objects of this invention is to provide a storage system, an anomaly detection method, and an information device that can detect abnormal heat generation in a connector section early and accurately. [Means for solving the problem]

[0011] To solve the above problems, the present invention provides a storage system comprising a power supply unit having a first connector, a circuit unit that supplies power from the power supply unit and includes a second connector connected to the first connector and a control unit, a drive unit that stores data, and a controller, wherein the control unit is configured to acquire a connector temperature, which is the temperature of the connector portion where the first connector and the second connector are connected, acquire a power supply path temperature, which is the temperature of the power supply path from the connector portion, and detect the occurrence of abnormal heat generation in the connector portion based on the connector temperature and the power supply path temperature.

[0012] The present invention provides an anomaly detection method for a storage system comprising a power supply unit having a first connector, a second connector connected to the first connector, and a control unit, which supplies power from the power supply unit, wherein the control unit acquires a connector temperature, which is the temperature of the connector portion where the first connector and the second connector are connected, and a power supply path temperature, which is the temperature of the power supply path from the connector portion, and detects the occurrence of abnormal heat generation in the connector portion based on the connector temperature and the power supply path temperature.

[0013] The information device of the present invention comprises a power supply unit having a first connector, and a circuit unit that supplies power from the power supply unit, including a second connector connected to the first connector and a control unit, wherein the control unit is configured to acquire a connector temperature, which is the temperature of the connector portion where the first connector and the second connector are connected, acquire a power supply path temperature, which is the temperature of the power supply path from the connector portion, and detect the occurrence of abnormal heat generation in the connector portion based on the connector temperature and the power supply path temperature. [Effects of the Invention]

[0014] According to the present invention, abnormal heat generation in the connector portion can be detected early and accurately. [Brief explanation of the drawing]

[0015] [Figure 1] Figure 1 is a diagram showing an example configuration of a storage system according to the first embodiment. [Figure 2] Figure 2 is a block diagram illustrating an example of the power supply unit configuration. [Figure 3] Figure 3 is a diagram illustrating an example of the circuit configuration. [Figure 4] Figure 4 is a flowchart showing the processing flow executed by the MCU in the circuit section. [Figure 5] Figure 5 is a flowchart showing the processing flow that the controller executes when it receives a notification of abnormal overheating. [Figure 6] Figure 6 is a flowchart showing the processing flow that the controller executes when it receives a notification of abnormal overheating. [Figure 7] Figure 7 shows an example of the configuration of a storage system according to the third embodiment. [Figure 8] Figure 8 is a flowchart showing the processing flow that the controller executes when it receives a notification of abnormal overheating. [Figure 9] Figure 9 shows an example of the configuration of a storage system according to the fourth embodiment. [Figure 10]FIG. 10 is a flowchart showing a processing flow executed by the MCU of the circuit unit.

Embodiments for Implementing the Invention

[0016] Hereinafter, each embodiment of the present invention will be described with reference to the drawings. In all the drawings of the embodiments, the same or corresponding parts may be denoted by the same reference numerals. In the following description, the controller may be used as the subject for describing the processing, but the subject of the processing may be the CPU instead of the controller.

[0017] <<First Embodiment>> The storage system according to the first embodiment of the present invention will be described. FIG. 1 is a diagram showing a configuration example of a storage system 100 according to the first embodiment. As shown in FIG. 1, the storage system 100 includes a controller 110, a backup module 120, a channel adapter 130, a drive unit 140, a backplane board 150, a first power supply unit 160a, a second power supply unit 160b, a circuit unit 170, an SVP 180, and a maintenance port 190. Note that the first power supply unit 160a and the second power supply unit 160b may be referred to as the "power supply unit 160" when there is no need to particularly distinguish between them. The storage system 100 is communicably connected to a server 200 and a user terminal 300 via a network.

[0018] The storage system 100 is provided with two power supply units 160. Thereby, the power supply unit 160 is redundant. In the example of FIG. 1, one controller 110 is provided, but two controllers 110 may be provided, and the controller 110 and the power supply unit 160 may be redundantly configured as a set. Also, three or more power supply units 160 may be provided, and three or more controllers 110 may be provided. <0000​The controller 110 is a device that implements the necessary software to provide storage functionality to the server 200. The controller 110 includes a CPU 111, a cache memory 112, a CFM 1113, and an I / F 114.

[0020] The CPU 111 is the hardware responsible for controlling the overall operation of the controller 110. The CPU 111 of the controller 110 reads and writes data to the corresponding drive 141 of the drive unit 140 in response to read and write commands given by the server 200.

[0021] The cache memory 112 temporarily stores data and programs used by the CPU 111. The CPU 111 executes the programs stored in the cache memory 112. The CFM 113 is a non-volatile storage device that can read and write data containing the OS and various programs necessary for the operation of the CPU 111. The CFM 113 is, for example, a cache flash memory. The CFM 113 also functions as a storage device for emergency backup operations, saving data stored in memory to the CFM 113.

[0022] I / F114 is a communication interface that mediates data exchange between the multiple drives 141 of the drive unit 140 and the controller 110.

[0023] The backup module 120 is equipped with a battery, which serves as a backup power source. The backup module 120 is a module for performing emergency backup operations.

[0024] The channel adapter 130 is connected to the server (host) 200 via a network. The channel adapter 130 performs interface processing for various data input and output between the storage system 100 and the server 200.

[0025] The drive unit 140 has multiple drives 141, such as SSDs (Solid State Drives) and HDDs (Hard Disk Drives), and an I / F 142. The multiple drives 141 constitute multiple volumes, which are logical recording areas that are the target of I / O requests from the server (host) 200. The I / F 142 is an interface for connecting the drive unit 140 to the controller 110.

[0026] The backplane board 150 is a circuit board for connecting the controller 110, drive unit 140, SVP 180, and circuit unit 170, etc. The circuit unit 170 may be included in the backplane board 150. The circuit unit 170 may be a circuit board connected to the backplane board 150. The backplane board 150 is provided with circuits for supplying power from the power supply unit 160 to the controller 110, backup module 120, drive unit 140, and SVP 180, as well as communication lines for communication.

[0027] Figure 2 is a block diagram illustrating an example configuration of the power supply unit 160. The power supply unit 160 is a device that converts AC power to DC power. The power supply unit 160 receives AC power as input and outputs DC power to the circuit unit 170. The power output from the power supply unit 160 via the circuit unit 170 is supplied to the controller 110, backup module 120, drive unit 140, and SVP 180, etc., via the backplane board 150.

[0028] The power supply unit 160 is equipped with a card edge connector (male) 1601. The card edge connector (male) 1601 (1601a, 1601b) is connected to the card edge connector (female) 171 (171a, 171b, see Figure 3) of the circuit unit 170. The area where the card edge connector (male) 1601 (1601a, 1601b) and the card edge connector (female) 171 (171a, 171b) are connected may be referred to as the "connector section CN". For convenience, the card edge connector (male) 1601 may be referred to as the "first connector". For convenience, the card edge connector (female) 171 may be referred to as the "second connector".

[0029] The power supply unit 160 supplies DC power to the circuit section 170 via the card edge connector (male) 1601.

[0030] The power supply unit 160 includes an EMI filter 161, a bridge circuit 162, a power factor correction circuit 163, a momentary power interruption protection capacitor 164, an isolation converter 165, a synchronous rectifier circuit 166, an OR circuit 167, a first power supply MCU 168, and a second power supply MCU 169.

[0031] The EMI filter 161 removes electromagnetic noise generated by the power supply unit 160. The bridge circuit 162 converts the input alternating current (AC) voltage to direct current (DC) voltage. The power factor correction circuit 163 is a circuit that brings the power factor of the power supply closer to 1, improving power efficiency by reducing the phase difference between voltage and current.

[0032] The momentary power interruption protection capacitor 164 is a capacitor designed to supply power during momentary power outages (momentary interruptions).

[0033] The isolated converter 165 is a DC-DC converter that electrically isolates the input and output and uses a transformer to transmit power.

[0034] The synchronous rectifier circuit 166 is a circuit that adjusts the input voltage to a desired voltage (12V in this example) and outputs it. The OR circuit 167 is a circuit that operates the two power supply units 160 (160a, 160b) in parallel. The two power supply units 160 (160a, 160b) operate in parallel by active sharing. The OR circuit 167 helps balance the current by keeping the bus voltage and the internal voltage of the power supply unit 160 (between Drain and Source in OR-MOS) constant. In addition, if a larger-than-expected potential difference occurs between the bus and the inside of the power supply unit 160, such as when one of the power supply units 160 stops, the OR circuit 167 cuts off the reverse flow of current so that power is not supplied to the inside of one power supply unit 160 from the other power supply unit 160.

[0035] The first power supply MCU (Micro Controller Unit) 168 is a computer for controlling the primary side circuit of the power supply unit 160 (the primary side circuit of the circuit divided into two by the isolation converter 165). The second power supply MCU 169 is a computer for controlling the secondary side circuit of the power supply unit 160 (the secondary-secondary side circuit of the circuit divided into two by the isolation converter 165). The first power supply MCU 168 and the second power supply MCU 169 are connected to each other via a communication line so that they can communicate with each other.

[0036] Figure 3 is a diagram illustrating an example configuration of the circuit unit 170. As shown in Figure 3, the circuit unit 170 includes a first card edge connector (female) 171a, a second card edge connector (female) 171b, a first power supply path 172a, a second power supply path 172b, a third power supply path 173, a first power supply switch 174a, a second power supply switch 174b, a first power supply path temperature sensor 175a, a second power supply path temperature sensor 175b, a first connector temperature sensor 176a, a second connector temperature sensor 176b, and an MCU 177. The first connector temperature sensor 176a and the second connector temperature sensor 176b may each be referred to as the "first temperature sensor" for convenience. The first power supply path temperature sensor 175a and the second power supply path temperature sensor 175b may each be referred to as the "second temperature sensor" for convenience. The first power supply path 172a and the second power supply path 172b may be referred to as "power supply path 172" when there is no need to distinguish between them. The MCU 177 may be referred to as the "control unit" for convenience.

[0037] The first card edge connector (female) 171a is mated and connected to the first card edge connector (male) 1601a of the first power supply unit 160a. The second card edge connector (female) 171b is mated and connected to the second card edge connector (male) 1601b of the second power supply unit 160b.

[0038] The first power supply path 172a is a power supply path (current path) from the first connector section CN1 to the connection point P1, and is composed of power supply wiring. The second power supply path 172b is a power supply path (current path) from the second connector section CN2 to the connection point P1, and is composed of power supply wiring. The third power supply path 173 is a power supply path from the connection point P1 to the connection point with BP150 (not shown), and is composed of power supply wiring.

[0039] The first power supply switch 174a is provided in the first power supply path 172a. The first power supply switch 174a is set by the MCU 177 to either a conductive state (ON state) or a disconnected state (OFF state).

[0040] When the first power supply switch 174a is in a conductive state, the first power supply path 172a becomes a conductive state in which current flows, and when the first power supply switch 174a is in a closed state, the first power supply path 172a becomes a non-conductive state in which no current flows.

[0041] The second power supply switch 174b is provided in the second power supply path 172b. The second power supply switch 174b is set by the MCU 177 to either a conductive state (ON state) or a disconnected state (OFF state).

[0042] When the second power supply switch 174b is in a conductive state, the second power supply path 172b becomes a conductive state in which current flows, and when the second power supply switch 174b is in an interrupted state, the second power supply path 172b becomes a non-conductive state in which no current flows.

[0043] The first power supply path temperature sensor 175a is installed in a location where the temperature of the first power supply path 172a can be detected (for example, on the first power supply path 172a), and detects the temperature of the first power supply path 172a.

[0044] The second power supply path temperature sensor 175b is installed in a location where the temperature of the second power supply path 172b can be detected (for example, on the second power supply path 172b), and detects the temperature of the second power supply path 172b.

[0045] The first connector temperature sensor 176a is provided at a location where the temperature of the first card edge connector (female) 171a can be detected (for example, in the vicinity of the first card edge connector (female) 171a), and detects the temperature of the first card edge connector (female) 171a.

[0046] The second connector temperature sensor 176b is provided in a location where the temperature of the second card edge connector (female) 171b can be detected (for example, near the first card edge connector (female) 171b), and detects the temperature of the second card edge connector (female) 171b.

[0047] The MCU177 is a computer for controlling the circuit unit 170.

[0048] MCU177 is connected via communication lines to the first power supply path temperature sensor 175a and the second power supply path temperature sensor 175b so that it can acquire the temperatures detected by them. MCU177 is also connected via communication lines to the first connector temperature sensor 176a and the second connector temperature sensor 176b so that it can acquire the temperatures detected by them. MCU177 is connected to the first power supply MCU168 of the power supply unit 160 so that they can communicate with each other via the connector section CN and communication lines. MCU177 is connected to the controller 110 so that they can communicate with each other via the backplane board 150 and communication lines.

[0049] The MCU177 sets the first power supply switch 174a to either a conductive state (ON state) or a disconnected state (OFF state). The MCU177 sets the second power supply switch 174b to either a conductive state (ON state) or a disconnected state (OFF state). The MCU177 acquires the temperatures detected by the first power supply path temperature sensor 175a, the second power supply path temperature sensor 175b, the first connector temperature sensor 176a, and the second connector temperature sensor 176b. After a predetermined time has elapsed, the MCU177 acquires these temperatures and determines, based on these temperatures, whether or not abnormal heat generation is occurring in the first connector section CN1 and the second connector section CN2, respectively.

[0050] Specifically, the MCU177 obtains the first power supply path temperature TP1 from the first power supply path temperature sensor 175a and the first connector temperature TC1 from the first connector temperature sensor 176a. The MCU177 determines whether the correlation between the first power supply path temperature TP1 and the first connector temperature TC1 has been broken. If the correlation between the first power supply path temperature TP1 and the first connector temperature TC1 has not been broken, the MCU177 determines that no abnormal heat generation has occurred in the first connector section CN1. If the correlation between the first power supply path temperature TP1 and the first connector temperature TC1 has been broken, the MCU177 determines that abnormal heat generation has occurred in the first connector section CN1.

[0051] The MCU177 obtains the second power supply path temperature TP2 from the second power supply path temperature sensor 175b and the second connector temperature TC2 from the second connector temperature sensor 176b. The MCU177 determines whether the correlation between the second power supply path temperature TP2 and the second connector temperature TC2 has been broken. If the correlation between the second power supply path temperature TP2 and the second connector temperature TC2 has been broken, the MCU177 determines that no abnormal heat generation has occurred in the second connector section CN2. If the correlation between the second power supply path temperature TP2 and the second connector temperature TC2 has been broken, the MCU177 determines that abnormal heat generation has occurred in the second connector section CN2.

[0052] In this invention, the reason for determining abnormal heat generation based on whether or not the correlation between the power supply path temperature TP and the connector temperature TC has broken down is as follows.

[0053] According to the inventor's findings, the power supply path temperature TP is proportional to the square of the current flowing through the power supply path. The connector temperature TC is similar to the power supply path temperature TP, and is proportional to the square of the current flowing through the connector part CN, relative to the mating resistance of the connector part CN itself.

[0054] Therefore, if the resistance values ​​of the power supply path and the connector section CN are both constant (normal state), the same current will flow, and thus there is a correlation between the connector temperature TC and the power supply path temperature TP.

[0055] In contrast, if abnormal heat generation occurs in the connector section CN, and damage to the connector section CN progresses due to this abnormal heat generation, the resistance value of the connector section CN increases, while the resistance value of the power supply path remains unchanged. As a result, only the temperature of the connector section CN rises compared to the normal case, and the correlation between the connector temperature TC of the connector section CN and the power supply path temperature TP of the power supply path is broken.

[0056] Therefore, by determining whether the correlation between the connector temperature TC of the connector section CN and the power supply path temperature TP of the power supply path has been disrupted, abnormal heat generation in the connector section CN can be detected early and accurately.

[0057] The advantages of detecting abnormal heat generation by utilizing the correlation between connector temperature TC and power supply path temperature TP are explained. The inventors of this application have considered another method for detecting abnormal heat generation, which involves using the derivative of the connector temperature TC of the connector portion CN (for example, comparing the derivative value of the connector temperature TC with a threshold value).

[0058] However, it was found that this method cannot accurately detect abnormal heat generation. For example, when the storage system 100 is operating with a redundant power supply unit 160, if one power supply unit 160 stops while the other power supply unit 160 does not stop, a sharp current fluctuation (increase in current) occurs in the other power supply unit 160, and the connector temperature TC rises rapidly in conjunction with the current fluctuation (increase in current). In this case, the differential value of the connector temperature TC will be above the threshold, and abnormal heat generation will be incorrectly detected as having occurred even though no abnormal heat generation has occurred.

[0059] In contrast, when using the correlation between the connector temperature TC and the power supply path temperature TP, if one power supply unit 160 stops while the other power supply unit 160 does not stop, the same current flows through the connector section CN and the power supply path, so the temperature correlation does not break down. Therefore, in this case, it can be accurately determined that no abnormal heat generation has occurred. That is, if the connector section CN is normal, the connector temperature TC and the power supply path temperature TP will follow the same temperature change in response to current fluctuations when one of the power supply units 160 stops, thus preventing misjudgment.

[0060] Furthermore, the inventors of this invention also considered another method, which involves using the potential difference between the connector section CN and the power supply path. When abnormal heat generation occurs, the resistance of the connector section CN increases due to carbonization. Therefore, by comparing the potential difference with a threshold value, the occurrence of abnormal heat generation can be detected. However, with this method, it is not possible to determine the occurrence of abnormal heat generation until the potential difference increases to a certain extent, making early detection of abnormal heat generation difficult.

[0061] For the reasons stated above, the MCU177 detects abnormal heat generation in the connector section CN based on whether or not the correlation between the power supply path temperature TP and the connector temperature TC is disrupted. Furthermore, the storage system 100 detects abnormal heat generation in the connector section CN via the MCU177 without the need for a decision from the controller 110. As a result, the storage system 100 can detect abnormal heat generation in the connector section CN early and accurately.

[0062] The SVP (Super Visor PC) 180 is a server for building, operating, and managing the storage system 100. The SVP (Super Visor PC) 180 monitors the hardware and software status of the storage system 100 and issues alerts if an anomaly occurs. The maintenance port 190 is a communication port for maintenance.

[0063] Server 200 is a computer (server device) that issues I / O requests. Server 200 may be a physical computer or a virtual computer.

[0064] The user terminal 300 is a terminal used by administrators (users) to access the storage system 100 and perform configuration and monitoring.

[0065] <Specific operation> Figure 4 is a flowchart showing the processing flow of the abnormal heat detection process executed by the MCU 177 of the circuit unit 170. The MCU 177 periodically executes the processing flow shown in Figure 4 (every time the first predetermined period of time has elapsed). The MCU 177 starts processing from step 400, and after sequentially executing the processes of steps 405 and 410 described below, proceeds to step 415.

[0066] Step 405: The MCU 177 obtains the first power supply path temperature TP1 from the first power supply path temperature sensor 175a, the first connector temperature TC1 from the first connector temperature sensor 176a, the second power supply path temperature TP2 from the second power supply path temperature sensor 175b, and the second connector temperature TC2 from the second connector temperature sensor 176b.

[0067] Step 410: The MCU177 verifies the correlation between the first power supply path temperature TP1 and the first connector temperature TC1 by calculating the correlation coefficient. The MCU177 verifies the correlation between the second power supply path temperature TP2 and the second connector temperature TC2 by calculating the correlation coefficient.

[0068] The MCU177 proceeds to step 415 and determines whether or not abnormal heat generation is occurring based on the correlation coefficient. Specifically, if the correlation coefficient is above a predetermined threshold, the MCU177 determines that abnormal heat generation is occurring in the corresponding connector section CN. If the correlation coefficient is below a predetermined threshold, the MCU177 determines that abnormal heat generation is not occurring in the corresponding connector section CN.

[0069] If it is determined that no abnormal heat generation has occurred, the MCU177 determines "NO" in step 415 and proceeds to step 495, terminating this processing flow.

[0070] If abnormal heat generation is detected, the MCU177 determines "YES" in step 415, and after sequentially executing the processes in steps 420 and 425 described below, proceeds to step 495 to terminate this processing flow.

[0071] Step 420: MCU177 stops the power supply unit 160 by sending a stop command to the first power supply MCU168 of the power supply unit 160 corresponding to the connector section CN where abnormal heat generation has been determined. The first power supply MCU168 of the power supply unit 160 stops the power supply unit 160 upon receiving a stop command from MCU177. MCU177 shuts off the power supply switch 174 of the power supply path 172 corresponding to the connector section CN where abnormal heat generation has been determined. Specifically, if abnormal heat generation is determined to be occurring in the first connector section CN1, MCU177 sets the first power supply switch 174a to the shut-off state and makes the first power supply path 172a non-conductive. If abnormal heat generation is determined to be occurring in the second connector section CN2, MCU177 sets the second power supply switch 174b to the shut-off state and makes the second power supply path 172b non-conductive.

[0072] In the event of abnormal heat generation, the MCU 177 can, without requiring a controller's judgment, automatically shut down the power supply unit 160 and cut off the power supply switch 174, enabling an early response to the abnormal heat generation and preventing its progression. Furthermore, by blocking the current flow from the power supply unit 160 corresponding to the connector section CN where abnormal heat generation is occurring (hereinafter sometimes referred to as the "normal power supply unit 160") to the power supply unit 160 corresponding to the connector section CN where abnormal heat generation is occurring (hereinafter sometimes referred to as the "abnormal power supply unit 160"), and by preventing energy from being supplied to the connector section CN where abnormal heat generation is occurring, the acceleration of abnormal heat generation can be prevented.

[0073] Step 425: The MCU 177 sends an abnormal overheating notification to the controller 110. The abnormal overheating notification includes information indicating that abnormal overheating has occurred, information indicating the power supply unit 160 that experienced the abnormal overheating, and an emergency backup command.

[0074] Figure 5 is a flowchart showing the processing flow that the controller 110 executes when it receives an abnormal overheating notification. The controller 110 starts processing from step 500 and sequentially executes the processes described below in steps 505 to 525, and then proceeds to step 595 to terminate this processing flow.

[0075] Step 505: The controller 110 receives an abnormal overheating notification from the MCU 177.

[0076] Step 510: Based on the abnormal heat generation notification, the controller 110 identifies the power supply unit 160 (normal power supply unit) corresponding to the connector section CN where abnormal heat generation has not occurred.

[0077] Step 515: The controller 110 performs shutdown suppression for the power supply unit 160 if no abnormalities are detected. Shutdown suppression for the power supply unit 160 means prohibiting the controller 110 from sending a shutdown command to the power supply unit 160. For example, when the controller 110 is not performing shutdown suppression, if the power supply unit 160 is in a predetermined state (e.g., a state that suggests an abnormality), it will shut down the power supply unit 160 by sending a shutdown command to the first power supply MCU 168. Conversely, when the controller 110 is performing shutdown suppression, it prevents the power supply unit 160 from sending a shutdown command to the first power supply MCU 168, thereby suppressing the shutdown of the power supply unit 160.

[0078] Step 520: The controller 110 transmits abnormal heat information to the SVP 180. This abnormal heat information includes information indicating that abnormal heat has occurred and information indicating the power supply unit 160 that caused the abnormal heat. Upon receiving the abnormal heat information, the SVP 180 transmits the abnormal heat information to the user terminal 300. Upon receiving the abnormal heat information, the user terminal 300 notifies the user (administrator) of the abnormal heat information, such as by displaying the information indicating that abnormal heat has occurred and the power supply unit 160 that caused the abnormal heat on the user terminal 300's display.

[0079] Step 525: In response to the emergency backup command, the controller 110 performs an emergency backup operation. As previously described, the emergency backup operation is the operation in which the backup module 120 backs up the data in the cache memory 112 (data necessary for I / O) to the CFM 113. After that, the controller 110 performs a planned shutdown of the storage system 100 as necessary. The user (administrator) notified in step 520 takes action such as replacing the power supply unit 160.

[0080] <Effects> As described above, the storage system 100 according to the first embodiment of the present invention can accurately and early detect abnormal heat generation in the connector section CN. Furthermore, the storage system 100 according to the first embodiment can early stop the power supply unit 160 corresponding to the connector section CN where abnormal heat generation has been detected on the controller 110 side, and suppress the stopping of power supply units 160 that are not abnormal, thereby allowing the operation of the storage system 100 to continue for as long as possible using the power supply units 160 that are not abnormal.

[0081] <<Second Embodiment>> A storage system 100 according to a second embodiment of the present invention will now be described. The storage system 100 according to the second embodiment differs from the storage system 100 according to the first embodiment only in the following respects.

[0082] In the storage system 100 according to the second embodiment, when the controller 110 receives a notification of abnormal overheating, it stops the normal power supply unit 160, performs an emergency backup operation, and then shuts down the storage system 100 as planned. This allows the storage system 100 to take a more safety-first approach to responding to abnormal overheating.

[0083] The following explanation will focus on these differences.

[0084] <Specific operation> Figure 6 is a flowchart showing the processing flow that the controller 110 executes when it receives an abnormal heat generation notification.

[0085] The controller 110 starts processing from step 600 and sequentially executes the processes described in steps 505 to 510 below, before proceeding to step 610. Upon reaching step 610, the controller 110 stops the power supply unit 160, which is functioning normally. After that, the controller 110 sequentially executes the processes described in steps 520 and 525, before proceeding to step 695 to terminate this processing flow.

[0086] <Effects> As described above, the storage system 100 according to the second embodiment of the present invention can detect abnormal heat generation in the connector portion CN early and accurately, similar to the first embodiment. Furthermore, the storage system 100 according to the second embodiment of the present invention can take more safety-prioritizing measures when abnormal heat generation occurs.

[0087] <<Third Embodiment>> A storage system 100 according to a third embodiment of the present invention will now be described. The storage system 100 according to the third embodiment differs from the storage system 100 according to the first embodiment only in the following respects.

[0088] The storage system 100 according to the third embodiment includes a backup storage system 700 (see Figure 7), and when abnormal heat generation is detected in the connector section CN corresponding to one of the power supply units 160, the storage system 100 that detected the abnormal heat generation performs an operation to back up the data to the backup storage system 700.

[0089] The following explanation will focus on these differences.

[0090] <Structure> Figure 7 is a diagram showing an example configuration of the storage system 100 according to the third embodiment. As shown in Figure 7, the storage system 100 according to the third embodiment includes a backup storage system 700. The backup storage system 700 has the same configuration as the storage system 100. The backup storage system 700 is a backup storage system for storing backup data of the data to be backed up stored in the storage system 100. The backup storage system 700 includes a volume that stores a full backup copy of the volume that the storage system 100 provides to the server 200 (host), and a plurality of volumes that store differential backup data of the parts that have been updated since the previous full backup copy. These volumes are made up of a plurality of drives in the backup storage system 700.

[0091] Even if a failure occurs in the storage system 100, the server 200 can continue operations using the volumes provided by the backup storage system 700.

[0092] The storage system 100 periodically performs a backup operation to store backup data in the backup storage system 700. Furthermore, if abnormal heat generation is detected, the storage system 100 performs an abnormal heat generation backup operation to store backup data in the backup storage system 700. The abnormal heat generation backup operation is a backup operation performed in addition to the regular backup operation.

[0093] <Specific operation> Figure 8 is a flowchart showing the processing flow that the controller 110 executes when it receives an abnormal heat generation notification from the MCU 177 of the circuit unit 170. The controller 110 starts processing from step 800 and sequentially executes the processes described below in steps 805 to 835, and then proceeds to step 895 to terminate this processing flow.

[0094] Step 805: The controller 110 receives an abnormal overheating notification from the MCU 177.

[0095] Step 810: The controller 110 transmits abnormal heat information to the SVP 180. This abnormal heat information includes information indicating that abnormal heat has occurred and information indicating the power supply unit 160 that caused the abnormal heat. Upon receiving the abnormal heat information, the SVP 180 transmits the abnormal heat information to the user terminal 300. Upon receiving the abnormal heat information, the user terminal 300 notifies the user (administrator) of the abnormal heat information, such as by displaying on the user terminal 300's display the information indicating that abnormal heat has occurred and the power supply unit 160 that caused the abnormal heat.

[0096] Step 815: Controller 110 creates a differential backup.

[0097] Step 820: The controller 110 sends the differential backup to the backup storage system 700. The backup storage system 700 receives the differential backup from the storage system 100, and once it has finished receiving the differential backup, it issues an acknowledgment to the storage system 100.

[0098] Step 825: The controller 110 receives a differential backup receipt notification from the storage system 100.

[0099] Step 830: The controller 110 identifies the power supply unit 160 as functioning normally.

[0100] Step 835: The controller 110 stops the power supply unit 160, which is found to be faulty, and performs a planned shutdown of the storage system 100.

[0101] <Effects> As described above, the storage system 100 according to the third embodiment of the present invention can detect abnormal heat generation in the connector portion CN early and accurately, similar to the first embodiment. Furthermore, the storage system 100 according to the third embodiment can improve data availability by storing backup data in the backup storage system 700 when abnormal heat generation occurs in the connector portion CN.

[0102] <<Fourth Embodiment>> A storage system 100 according to the fourth embodiment of the present invention will now be described. The storage system 100 according to the fourth embodiment differs from the storage system 100 according to the first embodiment only in the following respects.

[0103] The circuit section 170 of the storage system 100 according to the fourth embodiment includes a vibration sensor 901 (see Figure 9) and an ambient temperature sensor 902 (see Figure 9) for measuring ambient temperature. The storage system 100 according to the fourth embodiment changes the frequency of abnormal heat generation detection according to either vibration information or ambient temperature. The frequency of abnormal heat generation detection is expressed, for example, by the time interval when the abnormal heat generation detection process shown in Figure 4 is repeatedly executed, and is referred to as the "detection frequency".

[0104] The following explanation will focus on these differences.

[0105] <Structure> Figure 9 shows an example of the configuration of the circuit section 170 of the storage system 100 according to the fourth embodiment. As shown in Figure 9, the circuit section 170 is the same as the circuit section 170 shown in Figure 3, except that it includes a vibration sensor 901 and an ambient temperature sensor 902.

[0106] The vibration sensor 901 is provided to detect vibrations in the connector section CN. The vibration sensor 901 measures vibration information (e.g., vibration frequency, amplitude, vibration velocity, acceleration, etc.). The ambient temperature sensor 902 detects the temperature of the air (ambient temperature) inside the storage system 100.

[0107] The MCU177 is connected via a communication line to the vibration sensor 901 so that vibration information can be acquired from it. The MCU177 is also connected via a communication line to the ambient temperature sensor 902 so that vibration information can be acquired from it.

[0108] The MCU177 acquires vibration information from the vibration sensor 901 and ambient temperature from the ambient temperature sensor 902. The causes of abnormal heat generation include dimensional tolerance defects in the connector part CN and the presence of foreign matter. Therefore, the risk of abnormal heat generation increases when the connector part CN moves (when the vibration of the connector part CN becomes large). In addition, as the ambient temperature rises, heat generation progresses more easily, thus increasing the risk of abnormal heat generation. Consequently, the risk of abnormal heat generation increases as the ambient temperature rises.

[0109] Therefore, the MCU177 determines whether it is necessary to increase the detection frequency based on either the vibration information or the ambient temperature. If it determines that it is necessary to increase the detection frequency, the MCU177 sets the detection frequency to be higher than the normal state. Specifically, if the detection frequency in the normal state is set to a first predetermined time, the MCU177 sets the detection frequency to a second predetermined time, which is shorter than the first predetermined time.

[0110] The MCU177 determines that it is necessary to increase the detection frequency if either the vibration information described below satisfies the predetermined vibration conditions or the ambient temperature satisfies the predetermined ambient temperature conditions.

[0111] The predetermined vibration conditions are set to be appropriate for determining the intensity of vibration. For example, the predetermined vibration conditions may include "the amplitude of the vibration information is above a predetermined threshold" or "the acceleration of the vibration information is above a predetermined threshold." For example, the predetermined ambient temperature conditions may include "the ambient temperature is above a predetermined threshold temperature."

[0112] <Specific operation> Figure 10 is a flowchart showing the processing flow executed by the MCU 177 of the circuit unit 170. The MCU 177 periodically executes the processing flow shown in Figure 10 (every predetermined time).

[0113] MCU177 starts processing from step 1000, then sequentially executes the processes described in steps 1005 and 1010 below, and then proceeds to step 1015.

[0114] Step 1005: MCU177 acquires vibration information from vibration sensor 901.

[0115] Step 1010: MCU177 obtains the ambient temperature from ambient temperature sensor 902.

[0116] When the MCU177 proceeds to step 1015, it determines whether it is necessary to increase the detection frequency based on the ambient temperature and vibration information. In this example, if either the vibration information meets the predetermined vibration conditions or the ambient temperature meets the predetermined ambient temperature conditions, it is determined that it is necessary to increase the detection frequency.

[0117] If it is necessary to increase the detection frequency, the MCU177 determines "YES" in step 1015 and proceeds to step 1020, where it sets the detection frequency to a second predetermined time, which is shorter than the first predetermined time. Once the MCU177 sets the detection frequency to a second predetermined time, which is shorter than the first predetermined time, it repeatedly executes the flow in Figure 4 for the set second predetermined time. As a result, the abnormal heat detection process according to the processing flow in Figure 4 is executed for a second predetermined time, which is shorter than the first predetermined time, so the detection frequency can be increased compared to the normal case (when it is not necessary to increase the detection frequency). After that, the MCU177 proceeds to step 1095 and terminates this processing flow.

[0118] If it is not necessary to increase the detection frequency, the MCU177 determines "NO" in step 1015 and proceeds to step 1025, where it sets the detection frequency to the first predetermined time, and then proceeds to step 1095 to terminate this processing flow. Once the detection frequency is set to the first predetermined time, the MCU177 repeatedly executes the flow shown in Figure 4 for the set first predetermined time. After that, the MCU177 proceeds to step 1095 to terminate this processing flow.

[0119] <Effects> As described above, the storage system 100 according to the fourth embodiment of the present invention can increase the sensitivity of abnormal heat detection by increasing the monitoring frequency (detection frequency) when there is a high risk of abnormal heat generation. As a result, the storage system 100 according to the fourth embodiment can detect abnormal heat generation in the connector portion CN earlier and with greater accuracy.

[0120] <<Variation>> The present invention is not limited to the embodiments described above, and various modifications can be adopted within the scope of the invention. Furthermore, the embodiments described above can be combined with each other as long as they do not depart from the scope of the invention.

[0121] In the first embodiment described above, the power supply unit 160 of the storage system 100 is redundant, but the storage system 100 may be configured to have only one power supply unit 160. In this case, the controller 110 of the storage system 100 executes a processing flow that omits the processing in steps 510 and 515 of Figure 5. Furthermore, the features of the fourth embodiment may be applied to this modified example.

[0122] In the fourth embodiment described above, the storage system 100 may omit either the vibration sensor 901 or the ambient temperature sensor 902. In the configuration in which the ambient temperature sensor 902 is omitted, the storage system 100 determines whether it is necessary to increase the detection frequency based on the vibration information obtained from the vibration sensor 901. In the configuration in which the vibration sensor 901 is omitted, the storage system 100 determines whether it is necessary to increase the detection frequency based on the ambient temperature obtained from the ambient temperature sensor 902.

[0123] The storage system of the present invention can also adopt the following configuration.

[0124] [1] A storage system comprising a power supply unit having a first connector, a circuit unit that supplies power from the power supply unit and includes a second connector connected to the first connector and a control unit, a drive unit for storing data, and a controller, The control unit acquires the connector temperature, which is the temperature of the connector portion where the first connector and the second connector are connected, and the power supply path temperature, which is the temperature of the power supply path from the connector portion, and detects the occurrence of abnormal heat generation in the connector portion based on the connector temperature and the power supply path temperature. It is configured in such a way. Storage system.

[0125] [2] In the storage system described in [1], The aforementioned circuit section is A first temperature sensor for measuring the connector temperature, A second temperature sensor for measuring the temperature of the power supply path, Equipped with, The control unit measures the correlation between the connector temperature and the power supply path temperature for each connector portion corresponding to the power supply unit using the first temperature sensor and the second temperature sensor, and detects the occurrence of abnormal heat generation in the connector portion based on whether or not the correlation has broken down. It is configured in such a way. Storage system.

[0126] [3] In the storage system described in [2], Equipped with multiple of the aforementioned power supply units, The control unit performs an abnormal heat determination to determine whether or not abnormal heat generation is occurring in the connector part based on whether or not the correlation relationship has been broken. If abnormal heat generation is detected in the connector section by determining that abnormal heat generation has occurred through the abnormal heat generation detection method, a stop command is sent to the power supply unit corresponding to the connector section where abnormal heat generation was detected, thereby stopping the operation of the power supply unit. It is configured in such a way. Storage system.

[0127] [4] In the storage system described in [3], The circuit section includes, for each of the multiple power supply units, the power supply path between the connector section and the controller, and a switch provided in the power supply path. The control unit stops the power supply unit by sending the stop command to the power supply unit corresponding to the connector part where abnormal heat generation was detected, and the power supply path is interrupted by the connector part where abnormal heat generation was detected and the switch. It is configured in such a way. Storage system.

[0128] Although the above embodiments have described a storage system 100, the features of each embodiment of the present invention are also applicable to information devices (servers) other than storage systems. The information device of the present invention can also take the following configuration.

[0129] [5] An information device comprising a power supply unit having a first connector, and a circuit unit that supplies power from the power supply unit, including a second connector connected to the first connector and a control unit, The control unit acquires the connector temperature, which is the temperature of the connector portion where the first connector and the second connector are connected, and the power supply path temperature, which is the temperature of the power supply path from the connector portion, and detects the occurrence of abnormal heat generation in the connector portion based on the connector temperature and the power supply path temperature. It is configured in such a way. Information device. [Explanation of Symbols]

[0130] 100...Storage system, 110...Controller, 111...CPU, 112...Cache memory, 114...I / F, 120...Backup module, 130...Channel adapter, 140...Drive unit, 141...Drive, 142...I / F, 150...Backplane board, 160a...First power supply unit, 160b...Second power supply unit, 170...Circuit unit, 172a...First power supply path, 172b...Second power supply path, 173...Third power supply path, 174a...First power supply switch, 174b...Second power supply switch, 175a...First power supply path temperature sensor, 175b...Second power supply path temperature sensor, 176a...First connector temperature sensor, 176b...Second connector temperature sensor, 901...Vibration sensor, 902...Ambient temperature sensor

Claims

1. A storage system comprising a power supply unit having a first connector, a circuit unit that supplies power from the power supply unit and includes a second connector connected to the first connector and a control unit, a drive unit for storing data, and a controller, The control unit acquires the connector temperature, which is the temperature of the connector portion where the first connector and the second connector are connected, and the power supply path temperature, which is the temperature of the power supply path from the connector portion, and detects the occurrence of abnormal heat generation in the connector portion based on the connector temperature and the power supply path temperature. It is configured in such a way. Storage system.

2. In the storage system according to claim 1, The aforementioned circuit section is A first temperature sensor for measuring the connector temperature, A second temperature sensor for measuring the temperature of the power supply path, Equipped with, The control unit measures the correlation between the connector temperature and the power supply path temperature for each connector corresponding to the power supply unit using the first temperature sensor and the second temperature sensor, and detects the occurrence of abnormal heat generation in the connector based on whether or not the correlation has broken down. It is configured in such a way. Storage system.

3. In the storage system according to claim 2, Equipped with multiple of the aforementioned power supply units, The control unit performs an abnormal heat determination to determine whether or not abnormal heat generation is occurring in the connector part based on whether or not the correlation relationship has been broken. If abnormal heat generation is detected in the connector section by determining that abnormal heat generation has occurred through the abnormal heat generation detection method, a stop command is sent to the power supply unit corresponding to the connector section where abnormal heat generation was detected, thereby stopping the operation of the power supply unit. It is configured in such a way. Storage system.

4. In the storage system according to claim 3, The circuit section includes, for each of the plurality of power supply units, the power supply path between the connector section and the controller, and a switch provided in the power supply path. The control unit stops the power supply unit by sending the stop command to the power supply unit corresponding to the connector part where abnormal heat generation was detected, and the power supply path is interrupted by the connector part where abnormal heat generation was detected and the switch. It is configured in such a way. Storage system.

5. In the storage system according to claim 4, The control unit, If abnormal heat generation is detected, the controller is notified of the abnormal heat generation. The controller notifies the administrator terminal of the abnormal heat generation. It is configured in such a way. Storage system.

6. In the storage system according to claim 4, Equipped with a backup module, The control unit, If abnormal heat generation is detected, an abnormal heat generation detection notification including an emergency backup command is sent to the controller. When the controller receives the abnormal heat detection notification, the backup module initiates an emergency backup operation. A storage system configured in such a way.

7. In the storage system according to claim 4, If abnormal heat generation is detected, the controller will suppress the shutdown of power supply units other than the power supply unit corresponding to the connector section where the abnormal heat generation was detected. It is configured in such a way. Storage system.

8. In the storage system described in claim 6, If abnormal heat generation is detected by the controller, it will shut down the power supply units other than the power supply unit corresponding to the connector section for which abnormal heat generation has not been detected, and start the emergency backup operation. It is configured in such a way. Storage system.

9. In the storage system according to claim 4, The circuit unit includes a third temperature sensor for measuring the ambient temperature within the storage system. The control unit obtains the ambient temperature from the third temperature sensor and changes the frequency of the abnormal heat generation determination based on the ambient temperature. A storage system configured in such a way.

10. In the storage system according to claim 4, The circuit unit includes a vibration sensor for measuring vibrations within the storage system. The control unit acquires vibration information indicating the vibration from the vibration sensor and changes the frequency of the abnormal heat generation determination based on the vibration information. A storage system configured in such a way.

11. In the storage system according to claim 4, The aforementioned controller, The system performs a backup operation to back up the data stored in the drive unit to another storage system. It is configured in such a way, If abnormal heat generation is detected, the controller will perform the backup operation using power supplied by a power supply unit other than the power supply unit corresponding to the connector portion where the abnormal heat generation was detected. It is configured in such a way. Storage system.

12. In the storage system according to claim 11, The aforementioned controller, After performing the backup operation using power supplied by a power supply unit other than the power supply unit corresponding to the connector part where abnormal heat generation was detected, the power supply units other than the power supply unit corresponding to the connector part are shut down. It is configured in such a way. Storage system.

13. In the storage system according to claim 1, The first and second connectors are card edge connectors. Storage system.

14. An anomaly detection method in a storage system comprising a power supply unit having a first connector, and a circuit unit that supplies power from the power supply unit, including a second connector connected to the first connector and a control unit, wherein The control unit acquires the connector temperature, which is the temperature of the connector portion where the first connector and the second connector are connected, and the power supply path temperature, which is the temperature of the power supply path from the connector portion, and detects the occurrence of abnormal heat generation in the connector portion based on the connector temperature and the power supply path temperature. Anomaly detection method.

15. An information device comprising a power supply unit having a first connector, and a circuit unit that supplies power from the power supply unit, including a second connector connected to the first connector and a control unit, The control unit acquires the connector temperature, which is the temperature of the connector portion where the first connector and the second connector are connected, and the power supply path temperature, which is the temperature of the power supply path from the connector portion, and detects the occurrence of abnormal heat generation in the connector portion based on the connector temperature and the power supply path temperature. It is configured in such a way. Information device.

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