Energy storage device
The energy storage device uses insulating plates with grooves and bending points to manage impact stress, preventing connection failures and short circuits by concentrating stress in specific areas, thus improving reliability and safety.
JP2026099120APending Publication Date: 2026-06-18TOYOTA JIDOSHA KK
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TOYOTA JIDOSHA KK
- Filing Date
- 2024-12-06
- Publication Date
- 2026-06-18
AI Technical Summary
Technical Problem
There is a risk of connection failure between the bus bar module and the external terminal of a power storage cell when an impact is applied from below, which can lead to electrical disconnection and potential short circuits.
Method used
The energy storage device incorporates a wiring panel with insulating plates and busbar modules, featuring grooves and bending points to distribute impact stress, reducing the likelihood of connection failure and short circuits by concentrating stress in specific grooves when an impact is applied.
Benefits of technology
The design effectively suppresses connection failures and short circuits between busbar modules and external terminals by distributing impact stress, enhancing the reliability and safety of the energy storage device.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026099120000001_ABST
Abstract
The busbar module suppresses connection failures when an impact is applied from below to the energy storage device, which is located below the energy storage cell. [Solution] The energy storage device comprises an energy storage stack 11 including an energy storage cell 101, an energy storage stack 12 arranged adjacent to the energy storage stack 11 and including an energy storage cell 102, an energy storage stack 13 arranged adjacent to the energy storage stack 12 and including an energy storage cell 103, an insulating plate 51 positioned below the energy storage stacks 11, 12, and 13, and busbar modules 511, 512, and 513 provided on the insulating plate 51. The insulating plate 51 has a first bending point provided between busbar modules 511 and 512, and a second bending point provided between busbar modules 512 and 513.
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