Photosensitive resin composition and method for producing a cured relief pattern

Abstract

The present invention provides a photosensitive polyimide and photosensitive polyimide precursor having low curing shrinkage, high heat resistance, and high flatness required for interlayer insulating films of FOWLP, a photosensitive resin composition thereof, a method for manufacturing a cured film and a cured relief pattern using the same, and a semiconductor device. [Solution] The following ingredients: (A) Polyimides or polyimide precursors having a structure containing a conjugated diene and / or a structure that forms a conjugated diene by heat or light, and (B) Photopolymerization initiator This is a negative-type photosensitive resin composition containing [a specific compound / substance].

Claims

1. The following ingredients: (A) Polyimides or polyimide precursors having a structure containing a conjugated diene and / or a structure that forms a conjugated diene by heat or light, and (B) Photopolymerization initiator A negative-type photosensitive resin composition containing [the specified element].

2. The composition according to claim 1, wherein component (A) has a benzocyclobutene skeleton as a structure that forms a conjugated diene upon heat or light.

3. The aforementioned component (A) is the following general formula (A1) or (A2): 【Chemistry 1】 (In the formula, X １ Y is a tetravalent organic group, １ (where m1 is a divalent organic group, and m1 is an integer greater than or equal to 1.) 【Chemistry 2】 {In the formula, X ２ Y is a tetravalent organic group, ２ It is a divalent organic group, and R １ , and R ２ Each of these is independently a hydrogen atom, and the following general formula (R1): 【Transformation 3】 (wherein, R ３ , R ４ , and R ５ are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms, and p is an integer selected from 2 to 10).) is a monovalent organic group or a saturated aliphatic group having 1 to 10 carbon atoms, and m2 is an integer of 1 or more.} The composition according to claim 1, having a structure represented by the following:

4. The above-mentioned component (A) has a structure that forms a conjugated diene upon heat or light, as shown in the following general formula (1): 【Chemistry 4】 (In the formula, Z １ Each is independently a hydrogen atom or a monovalent organic group, n1 is an integer from 0 to 3, and R ６ (where * is a hydrogen atom or a monovalent organic group, and * is a linking site with polyimide or a polyimide precursor.) The composition according to claim 1, having a structure represented by the following:

5. The composition according to claim 1, wherein the component (A) has a structure represented by the general formula (1) in the side chain of a polyimide or polyimide precursor.

6. The composition according to claim 1, wherein component (A) has a structure represented by the general formula (1) at the main chain end of a polyimide or polyimide precursor.

7. The composition according to claim 1, wherein component (A) has the structure of general formula (1) in the side chain or main chain end of the polyimide precursor.

8. The composition according to claim 1, comprising a polyimide or polyimide precursor, wherein the proportion of the structure of general formula (1) in component (A) is 0.01 to 2 mmol / g.

9. The composition according to claim 1, wherein the proportion of the structure of general formula (1) contained in the polyimide and polyimide precursor in the photosensitive composition is 0.01 to 2 mmol / g.

10. In the aforementioned photosensitive composition, Let W1 be the total weight of the polyimide or polyimide precursor containing the structure of the general formula (1) above. When the total weight of the polyimide or polyimide precursor containing the structure of general formula (1) and the polyimide or polyimide precursor not containing the structure of general formula (1) is W1 + W2, The composition according to claim 1, wherein W1 / (W1+W2) = 0.01 or more.

11. The composition according to claim 1, wherein the weight-average molecular weight (Mw) of component (A) is 9,000 to 45,000.

12. The composition according to claim 1, further comprising a monomer having a polymerizable functional group as component (D).

13. The composition according to claim 1, further comprising as component (E) a thermal crosslinking agent selected from the group consisting of benzocyclobutene compounds (excluding component (A)), bismaleimide compounds, and polyfunctional allyl compounds.

14. The following steps: (1) A step of applying the composition according to any one of claims 1 to 13 onto a substrate, and forming a photosensitive resin layer on the substrate, (2) A step of exposing the photosensitive resin layer, (3) A step of developing the photosensitive resin layer after exposure and forming a relief pattern, (4) A step of heat-treating the relief pattern and forming a hardened relief pattern. A method for manufacturing a hardened relief pattern, including [the specified element].

15. A semiconductor device comprising a semiconductor element, a redistribution layer electrically connected to the semiconductor element, and a sealing material for sealing the semiconductor element, A semiconductor device wherein the interlayer insulating film of the redistribution layer comprises the composition described in any one of claims 1 to 13, and the sealing material is in contact with the interlayer insulating film.

16. (A) Component is the following general formula (1): 【Transformation 5】 (In the formula, Z １ Each is independently a hydrogen atom or a monovalent organic group, n1 is an integer from 0 to 3, and R ６ (where * is a hydrogen atom or a monovalent organic group, and * is a linking site.) A polyimide or polyimide precursor having a structure represented by .

17. The polyimide or polyimide precursor according to claim 16, having a side chain with the structure represented by the general formula (1).

18. The polyimide or polyimide precursor according to claim 16, having a structure represented by the general formula (1) at its terminal end.

19. The polyimide or polyimide precursor according to claim 16, wherein the proportion of the structure of general formula (1) in component (A) is 0.001 to 2 mmol / g.

20. The following general formula (2): 【Transformation 6】 (In the formula, Z １ Each is independently a hydrogen atom or a monovalent organic group, n1 is an integer from 0 to 3, n2 is a positive integer, and R ６ is a hydrogen atom or a monovalent organic group, and R ７ (This refers to a 1- to 4-valent organic group containing an amino group.) A compound represented by the formula.

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