Offset bond lines for reaction-bonded ceramics with reduced internal channels
The offset bond line with separate adhesive ducts addresses the issue of adhesive seepage in reaction-bonded ceramics, ensuring efficient and unobstructed flow in internal channels.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- II VI DELAWARE INC
- Filing Date
- 2025-07-16
- Publication Date
- 2026-06-29
AI Technical Summary
Conventional reaction-bonded ceramics with internal channels are expensive, difficult to handle, and inefficient due to excess adhesive seeping into small channels, affecting flow and volume.
An offset bond line is introduced with separate adhesive ducts positioned away from transport ducts, preventing adhesive seepage and maintaining channel integrity.
The solution ensures unobstructed flow and preserves channel volume by containing adhesive within dedicated ducts, enhancing the efficiency and handling of reaction-bonded ceramics.
Smart Images
Figure 2026106372000001_ABST
Abstract
Description
Technical Field
[0001]
[0001] This disclosure generally relates to an offset bond line for reaction-bonded ceramics with reduced internal channels and a method of fabricating the same.
Background Art
[0002]
[0002] Aspects of this disclosure relate to an offset bond line for reaction-bonded ceramics with reduced internal channels. In this regard, conventional reaction-bonded ceramics with internal channels can be expensive, difficult to handle, and / or inefficient.
[0003]
[0003] The limitations and disadvantages of conventional systems and methods will become apparent to those skilled in the art through a comparison of such approaches with some aspects of the methods and systems described in the remainder of this disclosure with reference to the drawings.
Summary of the Invention
[0004]
[0004] An offset bond line for reaction-bonded ceramics with reduced internal channels is shown in at least one of the figures and / or described in relation to at least one of the figures and is more fully described in the claims.
[0005]
[0005] These and other advantages, aspects, and novel features of this disclosure, as well as details of the illustrated embodiments of this disclosure, will be more fully understood from the following description and the drawings.
[0006]
[0006] The various features and advantages of this disclosure can be more readily understood by reference to the following detailed description in conjunction with the accompanying drawings in which like reference numerals designate like structural elements.
Brief Description of the Drawings
[0007] [Figure 1]
[0007] This is a cross-sectional view of a conventional internal channel reaction-coupled ceramic device. [Figure 2]
[0008] This is a block diagram showing a reaction-coupled ceramic device according to some embodiments of the present disclosure. [Figure 3]
[0009] This flowchart shows a method according to several embodiments of the present disclosure. [Figure 4]
[0010] This is a cross-sectional view showing a reaction-coupled ceramic device according to several embodiments of the present disclosure. [Figure 5]
[0011] This is a cross-sectional view of an exemplary reaction-coupled ceramic device according to several embodiments of the present disclosure. [Modes for carrying out the invention]
[0008]
[0013] The following discussion provides various examples of offset bond lines for reaction-bonded ceramics with reduced internal channels. Such examples are non-limiting, and the scope of the appended claims should not be limited to the specific examples disclosed. In the following discussion, the terms “example” and “e.g.” are non-limiting.
[0009]
[0014] The figures illustrate the general style of the structure, and descriptions and details of well-known features and techniques may be omitted to avoid unnecessarily obscuring this disclosure. Furthermore, elements in the drawings are not necessarily drawn according to a constant proportional scale. For example, the dimensions of some elements in the drawings may be exaggerated relative to others to help improve the understanding of the examples discussed in this disclosure. The same reference numeral in different figures indicates the same element.
[0010]
[0015] The term "or" means any one or more items in a list that are joined by "or". For example, "x or y" means any element of the 3-element set {(x), (y), (x, y)}. Another example is "x, y, or z" meaning any element of the 7-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}.
[0011]
[0016] The terms “comprises,” “comprising,” and / or “comprising” are “open-ended” terms, specifying the presence of the feature being described but not excluding the presence or addition of one or more other features.
[0012]
[0017] The terms “first,” “second,” etc., may be used herein to describe various elements, and these elements should not be limited by these terms. These terms are used solely to distinguish one element from another. For example, the first element discussed in this disclosure may be called the second element without departing from the teachings of this disclosure.
[0013]
[0018] Unless otherwise specified, the term “coupled” may be used to describe two elements that are in direct contact with each other, or two elements that are indirectly connected by one or more other elements. For example, if element A is coupled to element B, element A can be indirectly connected to element B by element C, which is in direct contact with or interposed by element B. Similarly, the terms “over” or “on” may be used to describe two elements that are in direct contact with each other, or two elements that are indirectly connected by one or more other elements.
[0014]
[0019] Many reaction-bonded silicon carbide (RB-SiC) ceramic components for the semiconductor capital equipment industry house internal channels. Examples include water-cooled wafer tables, water-cooled focusing mirrors, and water-cooled high-energy laser mirrors. The ceramic components may be formed by joining two preform halves with channels using a silicon carbide-based adhesive (caulking-like material), and then ceramic firing to produce a one-piece ceramic body with internal channels.
[0015]
[0020] During preform bonding, excess adhesive bead may seep into the channel. With larger channel sizes, this problem does not exist. However, many next-generation designs use ultra-small channel sizes (e.g., less than 1 mm). Excess adhesive bead can clog such small channels, potentially affecting flow and thus impacting available volume. Alternative bonding methods may be advantageous in such cases.
[0016]
[0021] This disclosure provides an offset bond line from the channel / duct to prevent excess adhesive from seeping into the channel. The channel may be machined into the preform so that the cavity is formed on the assembly.
[0017]
[0022] Embodiments of the present disclosure may include a reaction-bonded ceramic device, the device comprising a first half having a first surface. Embodiments may also include a second half having a second surface. In some embodiments, the first half and the second half may be configured to form a matching half pair.
[0018]
[0023] Embodiments may also include a plurality of cavities formed between the first surface and the second surface when the first half abuts against the second half, the plurality of cavities may comprise a transport duct and an adjacent adhesive duct. In some embodiments, the transport duct may comprise a first transport duct surface formed by the first surface. Embodiments may also comprise a second transport duct surface formed by the second surface. In some embodiments, the adhesive duct may comprise a first adhesive duct surface formed by the first surface. Embodiments may also comprise a second adhesive duct surface formed by the second surface. Embodiments may also comprise an adhesive. In some embodiments, the adhesive may be capable of acting to bond the first half to the second half. In some embodiments, the adhesive partially fills the adhesive duct.
[0019]
[0024] In some embodiments, the first and second halves may be made from reaction-bonded silicon carbide. In some embodiments, the transport duct may be capable of transporting liquids or gases. In some embodiments, the first surface and / or the second surface may be formed by protrusions or recesses. In some embodiments, the adhesive may consist of silicon carbide and, optionally, a carbon-based additive.
[0020]
[0025] In some embodiments, the first half may be the body and the second half may be a cover. In some embodiments, the transport duct cross section has a height or width of less than 1 mm. In some embodiments, none of the adhesives are present inside the transport duct. In some embodiments, the transport duct may be capable of acting for cooling.
[0021]
[0026] Embodiments of the present disclosure may also include a method for manufacturing a reaction-bonded ceramic device, the method comprising taking a first half having a first surface and a second half having a second surface. In some embodiments, the first half and the second half may be configured to form a matching half pair.
[0022]
[0027] The embodiment may also include abutting the first half against the second half to form a plurality of cavities between the first surface and the second surface. In some embodiments, the plurality of cavities may comprise a transport duct and an adjacent adhesive duct. In some embodiments, it may comprise a first transport duct surface formed by the first surface and a second transport duct surface formed by the second surface.
[0023]
[0028] The embodiment may also include joining the first half to the second half using an adhesive. In some embodiments, the adhesive partially fills an adhesive duct.
[0029] Referring now to FIG. 1, FIG. 1 is a cross-sectional view of a conventional internal channel reaction bonded ceramics device. A ceramics device 1 is shown comprising a first half 10, a second half 20, a duct 31, a bonding zone 5, and bleed-out adhesive 2. Such an approach is particularly useful for forming internal cavities that may serve as internal channels. The internal channels may be useful, for example, for forming ducts that may carry a cooling liquid or a cooling gas. The internal ducts or channels may be used for water-cooled wafer tables, water-cooled condenser mirrors, and water-cooled high energy laser mirrors.
[0024]
[0030] In some cases, a reaction bonded silicon carbide (RB-SiC) device is formed from joining two halves together. The two halves may be a first half 10 and a second half 20. The halves may also be referred to as preforms. In FIG. 1, a cavity, namely a duct 31, is formed between the first half 10 and the second half 20.
[0025]
[0031] The preforms may be joined by a silicon carbide-based adhesive, which is typically a coking-like mixture of silicon carbide particles and carbon-based additives. After firing, the preform halves are joined through the solidified adhesive to produce a one-piece ceramic body with internal channels, as shown in Figure 1.
[0026]
[0032] To prevent gaps in the bond line, sufficient adhesive is applied to the interface between the two halves. However, this excess adhesive 2 may seep into the duct 31, forming an adhesive bead 2. The adhesive bead 2 affects the flow characteristics and may affect the duct volume when the duct 31 is very small. The duct may also be called a channel, tunnel, cavity, well, conduit, canal, tube, or culvert. Therefore, it may be desirable to place the adhesive far away from the duct 31 to prevent it from seeping into the channel.
[0027]
[0033] Figure 2 is a block diagram illustrating a reaction-bonded ceramic device 100 according to several embodiments of the present disclosure. In some embodiments, the reaction-bonded ceramic device 100 may comprise a first half 110, a second half 120, and an adhesive 140. The reaction-bonded ceramic device 100 may also comprise a plurality of cavities 130 formed between a first surface 112 and a second surface 122 when the first half 110 abuts against the second half 120. The first half 110 may comprise a first surface 112. The second half 120 may comprise a second surface 122.
[0028]
[0034] In some embodiments, the first half 110 and the second half 120 may be configured to form a matching half pair. The multiple cavities 130 may comprise a transport duct 131 and an adjacent adhesive duct 134. The transport duct 131 may comprise a first transport duct surface 132 formed by a first surface 112 and a second transport duct surface 133 formed by a second surface 122. The adjacent adhesive duct 134 may comprise a first adhesive duct surface 135 formed by the first surface 112 and a second adhesive duct surface 136 formed by the second surface 122. The adhesive 140 may be capable of acting to bond the first half 110 to the second half 120. The adhesive 140 partially fills the adhesive duct 134.
[0029]
[0035] In some embodiments, the first half 110 and the second half 120 may be made of reaction-bonded silicon carbide. In some embodiments, the transport duct 131 may be capable of acting to transport liquid or gas. In some embodiments, the first surface 112 and / or the second surface 122 may be formed by protrusions or recesses. In some embodiments, the adhesive may contain silicon carbide and, optionally, carbon-based additives. In some embodiments, the first half 110 may be the body and the second half 120 may be the cover. In some embodiments, none of the volume of the adhesive 140 may be inside the transport duct 131. In some embodiments, the transport duct 131 may be capable of acting for cooling.
[0030]
[0036] Figure 3 is a flowchart illustrating a method according to several embodiments of the present disclosure. In some embodiments, at 310, the method may include taking a first half having a first surface and a second half having a second surface. At 320, the method may include joining the first half to the second half using an adhesive. The first half and the second half may be configured to form a matching half pair. The method may further include abutting the first half against the second half to form a plurality of cavities between the first surface and the second surface.
[0031]
[0037] Figure 4 is a cross-sectional view showing a reaction-bonded ceramic device according to several embodiments of the present disclosure. The reaction-bonded ceramic device 100 may comprise a first half 110 (inclined pattern fill), a second half 120 (vertical line pattern fill), and an adhesive 140 (horizontal line pattern fill). The reaction-bonded ceramic device 100 may also comprise a plurality of cavities 130 (ducts 131, 134) formed between a first surface 112 (solid line) and a second surface 122 (dash-dotted line) when the first half 110 abuts against the second half 120. The first half 110 may comprise the first surface 112. The second half 120 may comprise the second surface 122.
[0032]
[0038] In some embodiments, the first half 110 and the second half 120 may be configured to form a matching half pair. The multiple cavities 130 may comprise a transport duct 131 and an adjacent adhesive duct 134. The transport duct 131 may comprise a first transport duct surface 132 formed by a first surface 112 and a second transport duct surface 133 formed by a second surface 122. The adjacent adhesive duct 134 may comprise a first adhesive duct surface 135 formed by the first surface 112 and a second adhesive duct surface 136 formed by the second surface 122. The adhesive 140 may be capable of acting to bond the first half 110 to the second half 120. The adhesive 140 partially fills the adhesive duct 134.
[0033]
[0039] By placing a separate adhesive duct 134 near the transport duct 131 and configuring the adhesive duct 134 to have a volume greater than the volume of the adhesive 140, the adhesive 140 can be completely contained within the adhesive duct 134 and will not seep into the transport duct 131.
[0034]
[0040] In some embodiments, the transport duct 131 may be capable of transporting liquids or gases. Since the adhesive does not seep into the transport duct 131, the flow may not be obstructed and the volume may not be affected.
[0035]
[0041] Figure 5 shows a cross-section of an exemplary reaction-bonded ceramic device according to several embodiments of the present disclosure. In the figure, the first half 110 having a first surface 112 may form a protrusion. The second half 120 having a second surface 122 may form a matching recess. The shown interlock design may be advantageous for assembly and may provide good separation between the transport duct 131 and the adhesive duct 134 with small horizontal separation. The interlock design may be desirable to further reduce the risk of adhesive seeping into the transport channel 131.
[0036]
[0042] According to various embodiments, two adhesive ducts 134 are shown. The adhesive 140 may be considered to partially fill the two adhesive ducts 134. It may be observed that the adhesive is not present in the transport duct 131.
[0037]
[0043] This disclosure includes references to specific examples, however, it will be understood by those skilled in the art that various modifications may be made and equivalents may be used without departing from the scope of this disclosure. Furthermore, variations may be made to the disclosed examples without departing from the scope of this disclosure. Thus, this disclosure is not limited to the disclosed examples, however, it is intended to include all examples that fall within the scope of the appended claims.
Claims
1. Reaction-bonded ceramic devices, The first half that obtains the first surface, A second half having a second surface, wherein the first half and the second half are configured to form a matching pair of halves, A plurality of cavities are formed between the first surface and the second surface when the first half abuts against the second half, wherein the plurality of cavities are Transport ducts, and, Adjacent adhesive duct Equipped with, The transport duct comprises a first transport duct surface formed by the first surface and a second transport duct surface formed by the second surface. The adhesive duct comprises a first adhesive duct surface formed by the first surface and a second adhesive duct surface formed by the second surface. Multiple cavities, An adhesive, wherein the adhesive is capable of acting to join the first half to the second half, and the adhesive partially fills the adhesive duct, and A device equipped with the following features.
2. A device according to claim 1, wherein the first half and the second half are made of reaction-bonded silicon carbide.
3. A device according to claim 1, wherein the transport duct is capable of transporting a liquid or gas.
4. A device according to claim 1, wherein one or both of the first surface and the second surface may be formed by protrusions or recesses.
5. A device according to claim 1, wherein the adhesive comprises silicon carbide and optionally a carbon-based additive.
6. A device according to claim 1, wherein the first half is a body and the second half is a cover.
7. A device according to claim 1, wherein the cross-section of the transport duct has a height or width of less than 1 mm.
8. A device according to claim 1, wherein none of the volume of the adhesive is located inside the transport duct.
9. A device according to claim 1, wherein the transport duct is capable of acting for cooling.
10. A method for manufacturing reaction-bonded ceramic devices, A step of taking a first half having a first surface and a second half having a second surface, wherein the first half and the second half are configured to form a matching half pair, A step of bringing the first half into contact with the second half in order to form a plurality of cavities between the first surface and the second surface, wherein the plurality of cavities include transport ducts and adjacent adhesive ducts. The transport duct comprises a first transport duct surface formed by the first surface and a second transport duct surface formed by the second surface. The adhesive duct comprises a first adhesive duct surface formed by the first surface and a second adhesive duct surface formed by the second surface. The step of bringing it into contact, A step of joining the first half to the second half using an adhesive, wherein the adhesive partially fills the adhesive duct; and a step of joining. A method that includes this.
11. A method according to claim 10, wherein the first half and the second half are made from reaction-bonded silicon carbide.
12. A method according to claim 10, wherein the transport duct is capable of acting to transport a liquid or gas.
13. A method according to claim 10, wherein one or both of the first surface and the second surface may be formed by protrusions or recesses.
14. A method according to claim 10, wherein the adhesive comprises silicon carbide and optionally a carbon-based additive.
15. A method according to claim 10, wherein the first half is a body and the second half is a cover.
16. A method according to claim 10, wherein the cross-section of the transport duct has a height or width of less than 1 mm.
17. A method according to claim 10, wherein none of the volume of the adhesive is inside the transport duct.
18. A method according to claim 10, wherein the transport duct is capable of acting for cooling.