Exposure apparatus, exposure method, and method for manufacturing articles

Abstract

This technology offers advantages in suppressing the occurrence of asymmetry in the effective light source. [Solution] The exposure apparatus includes a shutter that switches between blocking and passing the optical path of exposure light by operating a plurality of light-shielding members, a projection optical system that projects the pattern of the master plate onto a substrate using the exposure light, and an adjustment unit that adjusts the amount of defocus, which represents the distance between the best focus position in the direction of the optical axis of the projection optical system and the position on the surface of the substrate, wherein the plurality of light-shielding members have rotational symmetry with respect to the optical axis.

Description

Technical Field

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[0001] The present invention relates to an exposure apparatus, an exposure method, and an article manufacturing method.

Background Art

[0002] With the diversification of products manufactured by exposure apparatuses, exposure apparatuses have come to need to support various processes. One countermeasure is a thick film resist. When exposing a thick film resist, there may arise a problem that the depth of focus is insufficient with a general exposure method. To solve this problem, in a stepper system in which a reticle (original plate) is fixed during exposure, multiple focus exposure is known in which a substrate is moved in the optical axis direction of a projection optical system, that is, while changing the focal length, and multiple exposures are performed (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Conventionally, for an exposure shutter in an exposure apparatus, a rotational drive method has been adopted in which a light shielding member (shutter blade) is opened and closed by rotating it in a direction crossing the optical path of exposure light. This is because it is advantageous in terms of speed increase.

[0005] However, when applying a rotational drive type exposure shutter to the technology of multiple focus exposure, due to the combined effect of an asymmetric defect of an effective light source caused by rotational drive and the drive in the height direction (optical axis direction of a projection optical system) of a substrate for multiple focus exposure, the loss of telecentricity may become remarkable.

[0006] The present invention provides an advantageous technique for suppressing the occurrence of asymmetry of an effective light source.

Means for Solving the Problems

[0007] According to one aspect of the present invention, an exposure apparatus for transferring a pattern from a master plate to a substrate is provided, comprising: a shutter that switches between blocking and passing the optical path of exposure light by operating a plurality of light-shielding members; a projection optical system that projects the pattern from the master plate onto the substrate using the exposure light; and an adjustment unit that adjusts a defocus amount representing the distance between the best focus position in the optical axis direction of the projection optical system and the position on the surface of the substrate, wherein the plurality of light-shielding members have rotational symmetry with respect to the optical axis. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an advantageous technique for suppressing the occurrence of asymmetry in the effective light source. [Brief explanation of the drawing]

[0009] [Figure 1] A diagram showing the configuration of an exposure apparatus. [Figure 2] A diagram illustrating the challenges of conventional technology. [Figure 3] A diagram showing the configuration of the exposure shutter in the embodiment. [Figure 4] A diagram showing the configuration of the exposure shutter according to the first and second modified examples. [Figure 5] A diagram showing the configuration of the exposure shutter according to the third modified example. [Figure 6] A flowchart illustrating the exposure method using multi-focus exposure. [Figure 7] A timing chart for shutter opening and closing operations in multiple focus exposure. [Modes for carrying out the invention]

[0010] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0011] <First Embodiment> Figure 1 shows the configuration of an exposure apparatus 100 for transferring a pattern from a master plate onto a substrate in an embodiment. In this specification and drawings, directions are indicated in an XYZ coordinate system in which the horizontal plane is the XY plane. Generally, the substrate 114 to be exposed is placed on the substrate stage 115 so that its surface is parallel to the horizontal plane (XY plane). Therefore, below, the directions that are orthogonal to each other in the plane along the surface of the substrate 114 are defined as the X axis and the Y axis, and the direction perpendicular to the X axis and the Y axis is defined as the Z axis. Also, below, the directions parallel to the X axis, Y axis and Z axis in the XYZ coordinate system are referred to as the X direction, Y direction and Z direction, respectively.

[0012] The light source 101 housed in the light source unit 102 can emit synchrotron radiation in the far ultraviolet region, for example, at a wavelength of 365 nm. Control for wavelength stabilization and control of the discharge applied voltage in the light source 101 can be performed by the illumination system control unit 125.

[0013] Synchrotron radiation emitted from the light source 101 is incident on the optical integrator 140 via the synchrotron radiation shaping optical system 104 and the mirror 105. The synchrotron radiation shaping optical system 104 adjusts the shape and size of the light incident on the optical integrator 140. The optical integrator 140 has the function of making the illuminance distribution of the illuminated surface uniform. For example, it can be configured as a fly-eye lens array. The fly-eye lens array consists of a collection of multiple microlenses, and multiple secondary light sources are formed near its light emission surface. The light emitted from the optical integrator 140 is guided via the illumination optical system 106 to the master plate 109 held by the master plate stage 110, thereby illuminating the master plate 109. The illumination optical system 106 may include an illumination light adjustment unit 107, a half-mirror 108, and a light intensity sensor 118. The illumination light adjustment unit 107 has the function of a wavelength selector that selectively passes light of the wavelength used for exposure of the substrate 114 from the light incident on the illumination optical system 106. The illumination light adjustment unit 107 as a wavelength selector may have, for example, a plurality of waveplates that allow light of different wavelengths to pass through. The illumination light adjustment unit 107 can selectively pass light of the wavelength used for exposure of the substrate 114 by changing the waveplates arranged in the optical path from among the plurality of waveplates. The plurality of waveplates may be arranged, for example, in a turret. The illumination light adjustment unit 107 may be controlled by the illumination system control unit 125. The light beam that leaves the illumination light adjustment unit 107 is also guided to the light intensity sensor 118 via the half mirror 108. The detection result from the light intensity sensor 118 may be provided to the main control unit 130 via the illumination system control unit 125. In addition, the illumination system control unit 125 can control the illumination light adjustment unit 107 according to the desired effective light source distribution specified by the main control unit 130. Furthermore, "effective light source distribution" refers to the light intensity distribution at the pupil plane of the illumination optical system that illuminates the original plate.

[0014] The master plate 109 has, for example, a circuit pattern for a semiconductor element formed on it. The master plate stage 110, which holds the master plate 109, can be controlled by the master plate stage drive unit 119 via the master plate stage control unit 126.

[0015] The projection optical system 111 guides the exposure light that has passed through the original plate 109 to the substrate 114 placed on the substrate stage 115. Thereby, the pattern of the original plate 109 is image-projected onto the substrate 114 (one shot region thereon) coated with photoresist. A field lens 112 is provided in the projection optical system 111. The lens driving unit 120 can move the field lens 112 in the direction of the optical axis (optical axis direction). By the projection system control unit 127 controlling the position of the field lens 112 in the optical axis direction via the lens driving unit 120, various aberrations of the projection optical system 111 can be suppressed. Further, the projection optical system 111 includes an aperture unit 113 for aperture control. The aperture driving unit 121 drives the aperture unit 113. The aperture driving unit 121 is controlled by the projection system control unit 127. The projection system control unit 127 issues a driving command to the aperture driving unit 121 so that a desired aperture number specified by the main control unit 130 is achieved. The aperture driving unit 121 drives the aperture unit 113 in response to the driving command.

[0016] The substrate stage 115 holds the substrate 114 and can move in the X direction and the Y direction that are orthogonal to each other in the plane perpendicular to the optical axis direction (Z direction) of the projection optical system 111. The laser interferometer 124 can measure the position of the substrate stage 115 in the XY plane by measuring the distance to the moving mirror 116 fixed to the substrate stage 115. The substrate stage control unit 128 controls the substrate stage driving unit 129 composed of a motor or the like based on the position of the substrate stage 115 measured by the laser interferometer 124, thereby moving the substrate stage 115 to a predetermined position in the XY plane.

[0017] The laser interferometer 123 can measure the position of the substrate stage 115 in the Z direction by measuring the distance to the moving mirror 116. The substrate stage control unit 128 can move the substrate stage 115 in the Z direction by controlling the substrate stage driving unit 129 based on the position of the substrate stage 115 in the Z direction measured by the laser interferometer 123.

[0018] The focus unit 122 has a focus plane detection function. The focus unit 122 projects a plurality of light beams composed of non-exposure light that does not expose the photoresist on the substrate 114 through the projection optical system 111. These light beams are respectively condensed and reflected on the substrate 114 and are incident on the detection optical system of the focus unit 122. A plurality of light receiving elements for position detection are arranged in the detection optical system corresponding to each reflected light beam. The light receiving surface of each light receiving element and the reflection point of each light beam on the substrate 114 are configured to be substantially conjugate by the imaging optical system. The positional deviation of the surface of the substrate 114 in the optical axis direction of the projection optical system 111 is measured as the positional deviation of the incident light beam on the light receiving element for position detection in the focus unit 122.

[0019] The main control unit 130 comprehensively controls the illumination system control unit 125, the reticle stage control unit 126, the projection system control unit 127, and the substrate stage control unit 128. The main control unit 130 may be configured by an information processing device (computer) including a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory. In the exposure apparatus 100 shown in FIG. 1, various control units (illumination system control unit 125, reticle stage control unit 126, projection system control unit 127, substrate stage control unit 128) controlled by the main control unit 130 are provided individually. However, the main control unit 130 and each control unit may be provided as one control unit. Further, the main control unit 130 may be arranged inside the housing of the exposure apparatus 100 or may be arranged outside the exposure apparatus 100. The main control unit 130 arranged outside the exposure apparatus 100 may be realized by a computer that functions as a control server network-connected to the exposure apparatus 100, for example.

[0020] Also, in the present embodiment, an exposure shutter 103 is arranged between the light source unit 102 and the radiation light shaping optical system 104. The opening and closing drive of the exposure shutter 103 can be performed by the exposure shutter drive unit 117. The main control unit 130 can control exposure / non-exposure via the exposure shutter drive unit 117.

[0021] The substrate stage control unit 128 uses the focus plane detection function of the focus unit 122 described above to issue a command to the substrate stage 115 to the desired position specified by the main control unit 130. The substrate stage drive unit 129 drives the substrate stage 115 in accordance with the command. In this way, the focal length can be changed by driving the substrate stage 115 by the substrate stage drive unit 129. The substrate stage 115 is continuously moved in a direction parallel to the optical axis A of the projection optical system 111 (Z direction; hereinafter referred to as the "optical axis direction"), so that the substrate 114 can be continuously exposed at different focal positions.

[0022] Note that the focal length may be changed by means other than driving the substrate stage 115. For example, the projection system control unit 127 can change the focal length by controlling the position of the field lens 112 in the optical axis direction via the lens drive unit 120. Alternatively, the focal length may be changed by driving the master plate stage 110 that holds the master plate 109, selecting the wavelength of the exposure light, etc. In the following, it will be assumed that the focal length is changed by driving the substrate stage 115 in the Z direction.

[0023] As described above, the substrate stage drive unit 129, the master plate stage drive unit 119, and the lens drive unit 120 can function as adjustment units that adjust the amount of defocus, which represents the distance between the best focus position in the optical axis direction of the projection optical system 111 and the position on the surface of the substrate 114.

[0024] The configuration of the exposure apparatus 100 in the embodiment is generally as described above. Next, with reference to Figures 2(a) and 2(b), we will point out the specific problems of conventional exposure shutters. Here, we consider a conventional exposure shutter that switches between blocking and passing the optical path of exposure light (opening and closing the shutter) by rotating a light shielding member (shutter blades) in a direction that crosses the optical path of the exposure light. Furthermore, in order to perform multiple focus exposure, we consider that the substrate 114 is driven from a first position above the best focus position 204 to a second position below the best focus position 204. Figure 2(a) shows the state in which the substrate 114 is in the first position, and Figure 2(b) shows the state in which the substrate 114 is in the second position. Also, as indicated by arrow 203, the shutter 202 is assumed to rotate clockwise. In Figure 2(a), when the shutter 202 is half open, the right side of the effective light source 201 is shielded from light. In this case, since the substrate 114 is above the best focus position 204, the image formation position 206 is to the left of the original image formation position 207. In Figure 2(b), when the shutter 202 is half-open, the left side of the effective light source 201 is blocked from light. In this case, since the substrate 114 is below the best focus position 204, the image formation position 206 is again to the left of the original image formation position 207. Thus, when the shutter 202 is opened and closed, the substrate 114 is in an out-of-focus position on the opposite side of the best focus position 204, which changes the image formation position and causes image shift and differences in left-right (up-down) line width.

[0025] The configuration of the exposure shutter 103 in the embodiment will be described with reference to Figures 3(a) and 3(b). The exposure shutter 103 switches between blocking and passing the optical path of exposure light by operating a plurality of light shielding members, and the plurality of light shielding members have rotational symmetry with respect to the optical axis A. The exposure shutter 103 comprises a plurality of light shielding members 302. The plurality of light shielding members 302 form a light-passing section through which exposure light passes. The plurality of light shielding members 302 are configured to maintain rotational symmetry during operation. The plurality of light shielding members 302 comprises a plurality of light shielding members 302 that open and close in the direction indicated by arrow 303 while the shape of the effective light source 301 maintains symmetry with respect to the X and Y axes. The exposure shutter drive unit 117, under the control of the main control unit 130, translates each of the plurality of light shielding members 302 in the direction indicated by arrow 303.

[0026] In the examples shown in Figures 3(a) and 3(b), the multiple light-shielding members are two light-shielding members. The two light-shielding members are positioned so as to be 2 rotationally symmetric with respect to the optical axis A. The two light-shielding members are then driven to translate in opposite directions, as indicated by arrows 303.

[0027] Here, in order to perform multiple focus exposure, we consider that the substrate 114 is driven from a first position above the best focus position 304 to a second position below the best focus position 304. Figure 3(a) shows the state in which the substrate 114 is in the first position when the exposure shutter 103 is half open, and Figure 3(b) shows the state in which the substrate 114 is in the second position when the exposure shutter 103 is half closed.

[0028] Through the opening and closing operation of the exposure shutter 103, the shape of the effective light source 301 maintains symmetry with respect to the X and Y axes. Therefore, in the state shown in Figure 3(a) where the substrate 114 is defocused upwards when the exposure shutter 103 is half-open, the image center 306 in the horizontal direction (XY direction) does not shift relative to the image point 307 at the best focus position 304. Similarly, in the state shown in Figure 3(b) where the substrate 114 is defocused downwards when the exposure shutter 103 is half-closed, the image center 306 in the horizontal direction (XY direction) does not shift relative to the image point 307 at the best focus position 304.

[0029] Thus, with the configuration shown in Figures 3(a) and 3(b), even when the substrate 114 is driven in the direction of the optical axis of the projection optical system 111, the driving of the multiple light-shielding members 302 and the shape change (missing) of the effective light source 301 proceed while maintaining symmetry with respect to the X and Y axes. In other words, the multiple light-shielding members 302 operate while maintaining rotational symmetry so that the exposure light passing through the light-passing portion formed by the multiple light-shielding members 302 does not become eccentric, regardless of the amount of defocusing. Therefore, no breakdown of telecentricity occurs, and no image shift or left-right (up-down) linewidth difference occurs.

[0030] Figure 4(a) shows a first modified example of the exposure shutter 103. The exposure shutter 103 according to the first modified example comprises a plurality of light-shielding members 404 arranged around the optical axis A. An effective light source 401 is formed by the space, which is a light-passing portion, surrounded by the plurality of light-shielding members 404. Each of the plurality of light-shielding members 404 is supported by a rotation axis 402 so that it can rotate around the rotation axis 402. The exposure shutter drive unit 117 rotates each of the plurality of light-shielding members 404 under the control of the main control unit 130. As a result, each of the plurality of light-shielding members 404 moves in the direction indicated by the arrow 403 so that the shape of the effective light source 301 maintains symmetry with respect to the X and Y axes. The shutter opening and closing operation is performed by the rotational drive of each of the plurality of light-shielding members 404. That is, the shape of the effective light source 401 is controlled by the rotational drive of each of the plurality of light-shielding members 404.

[0031] Figure 4(b) shows a second modified example of the exposure shutter 103. The configuration shown in Figure 4(b) is similar to that in Figure 4(a), comprising a plurality of light-shielding members 404 arranged around the optical axis A, and the effective light source 401 is formed by the space, which is a light-passing portion, surrounded by the plurality of light-shielding members 404. In Figure 4(b), a single rotation axis 402 is shared by a pair of light-shielding members. Each of the pair of light-shielding members rotates in opposite directions around the rotation axis 402. That is, the pair of light-shielding members open and close like scissors, and as a result, each of the plurality of light-shielding members 404 moves in the direction indicated by the arrow 403 so that the shape of the effective light source 301 maintains symmetry with respect to the X and Y axes, thereby controlling the shape of the effective light source 401.

[0032] The configurations shown in Figures 4(a) and 4(b), in which each of the multiple light-shielding members 404 is rotated, are advantageous compared to the configurations shown in Figures 3(a) and 3(b), in which the light-shielding member 302 is translated, because they allow for faster shutter opening and closing operations.

[0033] Figure 5 shows a third modified example of the exposure shutter 103. The exposure shutter 103 according to the third modified example includes a plurality of light-shielding members 502 arranged around the optical axis A. The space, which is a light-passing portion surrounded by the plurality of light-shielding members 502, forms the effective light source 501. The plurality of light-shielding members 502 constitute an iris diaphragm. The iris diaphragm is configured to change its aperture diameter concentrically and steplessly with respect to the optical axis A. By adopting the iris diaphragm configuration, the XY axis symmetry of the effective light source 501 due to shutter opening and closing is maintained, so image shift and left / right (up / down) line width differences do not occur. Note that rotational symmetry in this embodiment refers to rotational symmetry of two or more times.

[0034] Figure 6 is a flowchart showing the exposure method by multi-focus exposure in this embodiment. Figure 7 is a timing chart of the shutter opening and closing operation in multi-focus exposure for a single-shot area. The exposure method includes a first step of changing the amount of defocus within a predetermined range including the best focus position in the optical axis direction of the projection optical system 111. While the amount of defocus is being changed within the predetermined range, a second step of controlling the exposure shutter 103 is performed. In the second step, the shutter is controlled to transition in the following order: shutter closed state where the optical path of exposure light is blocked by a plurality of light shielding members, shutter open state where the optical path is not blocked by a plurality of light shielding members, and shutter closed state.

[0035] In the following example, the predetermined range is defined as the range between the first position shown in Figure 3(a) and the second position shown in Figure 3(b) of the substrate 114. In the following example, multiple focus exposure is performed by adjusting the amount of defocus by driving the substrate 114 from the first position shown in Figure 3(a) to the second position shown in Figure 3(b).

[0036] At time t1, the main control unit 130 controls the substrate stage drive unit 129, which is an adjustment unit, to start changing the defocus amount (S601), and controls the exposure shutter drive unit 117 to start opening the exposure shutter 103 (S602). This starts the exposure of the shot area on the substrate 114 (S603). In Figure 7, the horizontal axis represents time, i.e., the Z position of the substrate. The vertical axis represents the light intensity on the substrate surface.

[0037] At time t2, the exposure shutter 103 is fully open. In this state, the Z position of the substrate 114 passes through the best focus position and moves towards the second position shown in Figure 3(b).

[0038] At time t3, the main control unit 130 controls the exposure shutter drive unit 117 to start the closing operation of the exposure shutter 103 (S604). At time t4, the exposure shutter 103 is fully closed and exposure is completed. At that time, the main control unit 130 controls the substrate stage drive unit 129, which is the adjustment unit, to finish changing the defocus amount (S605).

[0039] <Embodiment of Article Manufacturing Method> The following describes a method for manufacturing articles using the above-described exposure apparatus. The article manufacturing method may include: an exposure step of exposing a substrate using the above-described exposure apparatus or in accordance with the above-described exposure method; a developing step of developing the substrate after the exposure step; and a step of obtaining an article from the substrate after the developing step. The substrate provided to the exposure apparatus is coated with a photosensitive material (photoresist). In the exposure step, the pattern of the master plate is transferred to the photosensitive material as a latent image pattern. In the developing step, this latent image pattern is converted into a physical device pattern. The step of obtaining an article from the substrate after the developing step may include, for example, a step of patterning the underlying layer using the device pattern. The step of obtaining an article from the substrate after the developing step may also include a step of dicing the substrate.

[0040] The disclosures herein include at least the following technologies: (Item 1) An exposure apparatus for transferring the pattern of the original plate onto a substrate, A shutter that switches between blocking and passing the light path of exposure light by operating multiple light-shielding members, A projection optical system that projects the pattern of the original plate onto the substrate using the exposure light, An adjustment unit for adjusting the defocus amount, which represents the distance between the best focus position in the direction of the optical axis of the projection optical system and the position on the surface of the substrate, It has, The plurality of light-shielding members have rotational symmetry with respect to the optical axis. An exposure apparatus characterized by the following features. (Item 2) The exposure apparatus according to item 1, characterized in that the plurality of light-shielding members maintain the rotational symmetry during operation. (Item 3) The exposure apparatus according to item 2, characterized in that the plurality of light shielding members operate while maintaining the rotational symmetry so that the exposure light passing through the light-transmitting portion formed by the plurality of light shielding members does not become eccentric, regardless of the amount of defocusing. (Item 4) The aforementioned plurality of light-shielding members consist of two light-shielding members, The two light-shielding members are positioned so as to be 2 rotationally symmetrical with respect to the optical axis. The two light-shielding members are driven to translate in opposite directions. An exposure apparatus according to any one of items 1 to 3, characterized by the above. (Item 5) The exposure apparatus according to any one of items 1 to 3, characterized in that each of the plurality of light-shielding members is rotationally driven. (Item 6) The plurality of light-shielding members include a pair of light-shielding members that share a single axis of rotation, The two light-shielding members are driven to rotate in opposite directions around the rotation axis. The exposure apparatus according to item 5, characterized by the features described herein. (Item 7) The exposure apparatus according to any one of items 1 to 3, characterized in that the shutter includes an iris diaphragm that changes the aperture diameter concentrically with respect to the optical axis by driving each of the plurality of light-shielding members. (Item 8) The system further includes a control unit that controls the shutter and the adjustment unit, The control unit performs multi-focus exposure by adjusting each of the multiple defocus amounts by the adjustment unit to expose the substrate, and controls the operation of the shutter during the multi-focus exposure. An exposure apparatus according to any one of items 1 to 7, characterized by the above. (Item 9) An exposure method for exposing a substrate, A step of changing the amount of defocus within a predetermined range including the best focus position in the direction of the optical axis of the projection optical system, The process of controlling the shutter so as to transition in the following order while the amount of defocus is changed within the predetermined range: a shutter closed state in which the optical path of exposure light is blocked by a plurality of light-shielding members, a shutter open state in which the optical path is not blocked by the plurality of light-shielding members, and the shutter closed state. It has, The plurality of light-shielding members have rotational symmetry with respect to the optical axis. A method of exposure characterized by the following features. (Item 10) An exposure step in which the substrate is exposed by the exposure method described in item 9, A developing step for developing the substrate exposed in the exposure step, A step of obtaining an article from the substrate that has undergone the development step, A method for manufacturing articles, characterized by including the following:

[0041] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of symbols]

[0042] 100: Exposure device, 103: Exposure shutter, 109: Original plate, 111: Projection optical system, 114: Substrate, 115: Substrate stage, 117: Exposure shutter drive unit, 129: Substrate stage drive unit, 130: Main control unit

Claims

1. An exposure apparatus for transferring the pattern of the original plate onto a substrate, A shutter that switches between blocking and passing the light path of exposure light by operating multiple light-shielding members, A projection optical system that projects the pattern of the original plate onto the substrate using the exposure light, An adjustment unit for adjusting the defocus amount, which represents the distance between the best focus position in the direction of the optical axis of the projection optical system and the position on the surface of the substrate, It has, The plurality of light-shielding members have rotational symmetry with respect to the optical axis. An exposure apparatus characterized by the following features.

2. The exposure apparatus according to claim 1, characterized in that the plurality of light-shielding members maintain the rotational symmetry during operation.

3. The exposure apparatus according to claim 2, characterized in that the plurality of light shielding members operate while maintaining the rotational symmetry so that the exposure light passing through the light-transmitting portion formed by the plurality of light shielding members does not become eccentric, regardless of the amount of defocusing.

4. The aforementioned plurality of light-shielding members consist of two light-shielding members, The two light-shielding members are positioned so as to be 2 rotationally symmetrical with respect to the optical axis. The two light-shielding members are driven to translate in opposite directions. The exposure apparatus according to feature 1.

5. The exposure apparatus according to claim 1, characterized in that each of the plurality of light-shielding members is rotationally driven.

6. The plurality of light-shielding members include a pair of light-shielding members that share a single axis of rotation, The two light-shielding members rotate in opposite directions around the rotation axis. The exposure apparatus according to feature 5.

7. The exposure apparatus according to claim 1, wherein the shutter includes an iris diaphragm that changes the aperture diameter concentrically with respect to the optical axis by driving each of the plurality of light-shielding members.

8. The system further includes a control unit that controls the shutter and the adjustment unit, The control unit performs multi-focus exposure by adjusting each of the multiple defocus amounts by the adjustment unit to expose the substrate, and controls the operation of the shutter during the multi-focus exposure. The exposure apparatus according to any one of claims 1 to 7.

9. An exposure method for exposing a substrate, A step of changing the amount of defocus within a predetermined range including the best focus position in the direction of the optical axis of the projection optical system, The process of controlling the shutter so as to transition in the following order while the amount of defocus is changed within the predetermined range: a shutter closed state in which the optical path of exposure light is blocked by a plurality of light-shielding members, a shutter open state in which the optical path is not blocked by the plurality of light-shielding members, and the shutter closed state. It has, The plurality of light-shielding members have rotational symmetry with respect to the optical axis. A method of exposure characterized by the following features.

10. An exposure step of exposing a substrate by the exposure method described in claim 9, A developing step for developing the substrate exposed in the exposure step, A step of obtaining an article from the substrate that has undergone the development step, A method for manufacturing articles, characterized by including the following:

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