Conductive paste, electronic components, and multilayer ceramic capacitors
The conductive paste, featuring a rosin derivative and a butyral resin, addresses the adhesion issues in multilayer ceramic capacitors by improving substrate adhesion, thereby enhancing manufacturing efficiency and reducing misalignment.
Patent Information
- Application Number
- JP2024512631
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2022-03-28
- Filing Date
- 2023-03-28
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2043-03-28
AI Technical Summary
Conductive pastes used in the manufacturing of multilayer ceramic capacitors do not provide sufficient adhesion between the dry film and the substrate when the pressing time is shortened or pressure is reduced during the heating and pressing process, leading to misalignment and decreased yield.
An electrically conductive paste containing a conductive powder, a rosin derivative with a hydroxyl group or an amine group, a binder resin, and an organic solvent, which improves adhesion with the substrate by inhibiting resin interaction and moderately softening the dry film.
The conductive paste enhances adhesion between the dry film and the green sheet, reducing misalignment and increasing yield, even under conditions of reduced pressing time and pressure.