Semiconductor device manufacturing method

The proposed method addresses the issue of heat transfer and adhesion problems in flip-chip connections by using temporary pressing and air-pressure-assisted heating to form reliable metal bonds and remove voids, thereby improving productivity and connection reliability.

JP7650621B2Active Publication Date: 2025-03-25RESONAC CORP
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Patent Information

Application Number
JP2019513700
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2017-04-21
Filing Date
2018-04-20
Publication Date
2025-03-25
Estimated Expiration
2038-04-20

AI Technical Summary

Technical Problem

In flip-chip connection methods, the high temperature of the crimping tool after crimping can transfer heat to the collet and semiconductor adhesive, causing temperature rise, viscosity increase, and adhesion issues, leading to decreased productivity and reliability.

Method used

A method involving temporary pressing of semiconductor chips at a temperature lower than the melting point of the connection metal, followed by heating the connection portions above the melting point while applying air pressure, to form a reliable metal bond and remove voids in the adhesive.

Benefits of technology

This method enhances productivity by eliminating the need for cooling the crimping tool and improves connection reliability by effectively removing voids and ensuring strong electrical connections.

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Abstract

A method for manufacturing a semiconductor device, comprising: a step of temporarily bonding a first member having a connection portion and a second member having a connection portion via an adhesive at a temperature lower than the melting point of the connection portion of the first member and the melting point of the connection portion of the second member, thereby obtaining a temporarily bonded body in which the connection portion of the first member and the connection portion of the second member are arranged opposite each other; and a step of heating the temporarily bonded body to a temperature equal to or higher than the melting point of at least one of the connection portion of the first member or the connection portion of the second member while pressurizing it with air pressure, thereby joining the oppositely arranged connection portions so that they are electrically connected, wherein the first member is a semiconductor chip or a semiconductor wafer, and the second member is a wiring circuit board, a semiconductor chip, or a semiconductor wafer.
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