SUBSTRATE PROCESSING APPARATUS AND ABNORMALITY DETECTION METHOD

JP7652485B2Active Publication Date: 2025-03-27TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2021036649
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-03-08
Publication Date
2025-03-27
Estimated Expiration
2041-03-08
Patent Text Reader

Abstract

To provide a technique for monitoring whether the processed substrate is being adsorbed to the mounting table by means of an electrostatic chuck.SOLUTION: In a semiconductor manufacturing equipment, the substrate processing system 5 comprises a mounting table 60 having an electrostatic chuck 65 that adsorbs substrates, a measurement unit such as a temperature sensor 64 that measures the temperature of the mounting table, and a control unit 4 that is a detection unit that detects abnormalities caused by the adsorption of substrates by the electrostatic chuck based on an integral value that integrates the difference between the variation of the temperature of the mounting table, for example, a reference standard temperature value and a temperature value of the mounting table during a step of processing a substrate.SELECTED DRAWING: Figure 3
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