High performance epitaxial growth substrate and manufacturing method thereof

By optimizing the multi-layer film structure and seed crystal layer thickness, the polycrystal defects and high cost of AlN and GaN base crystal base plates are solved, and a high-quality and low-cost III nitride base plate is achieved, improving the performance of deep ultraviolet light and high-frequency equipment.

JP7657530B2Active Publication Date: 2025-04-07SHIN ETSU CHEMICAL CO LTD
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Patent Information

Application Number
JP2021214704
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-12-28
Publication Date
2025-04-07
Estimated Expiration
2041-12-28

AI Technical Summary

Technical Problem

The existing AlN and GaN base crystal base plates have problems of polycrystal defects, low quality and high cost, which limits their wide application in high frequency and deep ultraviolet light.

Method used

By optimizing the difference in thermal expansion coefficients of the multilayer film, adjusting the composition and thickness of the encapsulation layer, flattening layer and seed crystal layer, reducing thermal stress, and adding a stress adjustment layer if necessary to achieve extremely thinning of the seed crystal layer (thickness between 0.04 μm and 0.10 μm), thereby reducing crystal defects and manufacturing costs.

Benefits of technology

A high-quality and low-cost III nitride-based crystal base plate is achieved, reducing crystal defects and manufacturing costs, and improving the performance of deep ultraviolet light and high-frequency equipment.

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Abstract

To provide a substrate for III group nitride based epitaxial growth, capable of inexpensively manufacturing an III group nitride single crystal having high characteristics, and a method for manufacturing the same.SOLUTION: A substrate for III group nitride based epitaxial growth includes: a support substrate having a structure in which a core consisting of nitride ceramics is wrapped by a sealing layer having a thickness of 0.05 μm or more and 1.5 μm or less; a planarization layer provided on the upper surface of the support substrate and having a thickness of 0.5 μm or more and 3.0 μm or less; a single crystal seed crystal layer provided in the upper surface of the planarization layer and having a thickness of 0.04 μm and less than 0.10 μm; and a stress control layer on the lower surface of the support substrate as needed.SELECTED DRAWING: Figure 1
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