Information processing device and program

Abstract

To make it easier to specify a component or wiring being a cause of a trouble than a case in which pieces of information related to all the components and pieces of wiring contained on a printed wiring board are superposed and displayed on a photographed image of the printed wiring board.SOLUTION: A display control unit 34 acquires trouble information for specifying a content of trouble being occurred in an image forming device 30 being an object device of the trouble analysis, when a field engineer executes the trouble analysis of the image forming device 30. Then, the display control unit 34 makes AR display while superposing information related to a component and wiring having a possibility to cause the trouble specified by a fail code among the plurality of components and pieces of wiring disposed on a printed wiring board, on an image obtained by photographing the printed wiring board constituting the image forming device 30.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to an information processing device and a program. [Background technology]

[0002] Patent document 1 discloses a display device that displays parts that are subject to maintenance and parts that are not subject to maintenance in different display modes when augmented reality information is superimposed on an image of a device that is the subject of maintenance acquired by an imaging unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-160171 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide an information processing device and program that makes it easier to identify the component or wiring causing a malfunction, compared to a case in which information related to all of the components and wiring contained in a printed wiring board is superimposed on an image of the photographed printed wiring board. [Means for solving the problem]

[0005] [Information processing device] The present invention according to claim 1 comprises a processor, The processor, The problem occurred in the target device for which the defect was analyzed. Functionality Defect information to identify the defect By the self-diagnosis function of the target device Get The information processing device displays, on an image of a printed wiring board constituting the target device, information related to the components and wiring that may be the cause of the defect identified by the defect information, among a plurality of components and wiring arranged on the printed wiring board.

[0006] The present invention according to claim 2 is the information processing device according to claim 1, wherein the fault information is a fault code indicating a fault identified by a self-diagnosis function in the target device.

[0007] The present invention according to claim 3 is the information processing device according to claim 2, wherein the processor acquires the fault code from the target device via a wireless communication line.

[0008] The present invention according to claim 4 is the information processing device according to claim 2, wherein the processor acquires the defect code based on an operational input by a user.

[0009] The present invention according to claim 5 further comprises a memory, the memory stores a function corresponding to a defect identified by the defect information for each piece of defect information, and stores, for each component and wiring included in the printed wiring board, a function realized by the component and wiring in association with the component and wiring; The information processing device according to any one of claims 1 to 4, wherein the processor determines that components and wiring that realize a function corresponding to the acquired malfunction information are components and wiring that may be the cause of the malfunction identified by the malfunction information.

[0010] The present invention according to claim 6 is characterized in that the processor receives information on components or wiring to be checked and information on items to be checked for the components or wiring from an external device via a network; 6. The information processing device according to claim 1, wherein the received information on the confirmation item is displayed in a manner superimposed on a component or wiring to be confirmed in the image of the printed wiring board.

[0011] The present invention according to claim 7 is the information processing device according to claim 6, wherein the processor erases the information displayed by superimposing it on the image of the printed wiring board based on an instruction from the external device.

[0012] [program] The present invention according to claim 8 relates to a method for detecting a malfunction of a target device for which a malfunction is to be analyzed. Functionality Defect information to identify the defect By the self-diagnosis function of the target device obtaining the and a step of superimposing and displaying, on an image of a printed wiring board constituting the target device, information related to components and wiring that may be the cause of the defect identified by the defect information, among a plurality of components and wiring arranged on the printed wiring board. Effect of the Invention

[0013] According to the present invention as defined in claim 1, it is possible to provide an information processing device that makes it easier to identify the component or wiring causing a defect, compared to a case in which information related to all of the components and wiring included in a printed wiring board is superimposed and displayed on a photographed image of the printed wiring board.

[0014] According to the present invention as set forth in claim 2, it is possible to acquire fault information by using a self-diagnosis function in the target device for which fault analysis is to be performed.

[0015] According to the present invention as set forth in claim 3, it is possible to acquire fault information without establishing a wired connection with the target device for which fault analysis is to be performed.

[0016] According to the present invention as set forth in claim 4, even when malfunction information cannot be automatically acquired from a target device for which malfunction analysis is to be performed, it is possible to set the malfunction information in an information processing device.

[0017] According to the present invention as set forth in claim 5, it is possible to provide an information processing device that makes it easier to identify the component or wiring causing a defect, compared to a case in which information related to all of the components and wiring included in a printed wiring board is superimposed and displayed on a photographed image of the printed wiring board.

[0018] According to the present invention as set forth in claim 6, it is possible to input confirmation items to be confirmed for fault analysis from an external device and have the confirmation items displayed on the information processing device performing the fault analysis.

[0019] According to the seventh aspect of the present invention, it is possible to narrow down the components or wiring for which a failure analysis is to be performed from an external device.

[0020] According to the present invention as set forth in claim 8, it is possible to provide a program that makes it easier to identify the component or wiring causing a defect, compared to a case in which information related to all of the components and wiring included in a printed wiring board is superimposed and displayed on a photographed image of the printed wiring board. [Brief description of the drawings]

[0021] [Figure 1] 1 is a diagram illustrating a system configuration of an information processing system according to an embodiment of the present invention. [Diagram 2] FIG. 13 is a diagram showing a state in which a printed wiring board 60 removed from an image forming apparatus 30 that is the subject of defect analysis is photographed by a camera 20, and AR display is performed on the photographed image of the printed wiring board 60. [Diagram 3] 3 is a diagram showing an example of a printed wiring board 60 shown in FIG. 2. [Figure 4] 1A to 1C are diagrams showing a specific example of AR display performed in the terminal device 10 of one embodiment of the present invention. [Diagram 5] FIG. 11 is a diagram showing another specific example of AR display performed in the terminal device 10 of one embodiment of the present invention. [Figure 6] 1 is a block diagram showing a hardware configuration of a terminal device 10 according to an embodiment of the present invention. [Figure 7] 1 is a block diagram showing a functional configuration of a terminal device 10 according to an embodiment of the present invention. [Figure 8] FIG. 1 is a diagram showing the external appearance of a printed wiring board 70 intended to perform AR display, which is used when explaining the operation of a terminal device 10 according to an embodiment of the present invention. [Figure 9] 9 is a diagram for explaining the names, part numbers, and functional classifications of parts in the printed wiring board 70 shown in FIG. 8. FIG. [Figure 10] 13 is a diagram showing an example of an error list stored in the information storage unit 35. FIG. [Figure 11] 11 is a diagram showing an example of a component and wiring list stored as placement information in the information storage unit 35. FIG. [Figure 12] 10 is a flowchart for explaining the operation of the terminal device 10 when an image of the printed wiring board 70 is captured by the camera 20 of the terminal device 10 and AR display is performed. [Figure 13] FIG. 13 is a diagram showing an example of an operation screen of the terminal device 10 when a field engineer is about to perform a failure analysis. [Figure 14] 11 is a diagram for explaining how a terminal device 10 automatically obtains a fail code from an image forming device 30 via a wireless line. FIG. [Figure 15] 13 is a diagram showing a specific example of how the display control unit 34 specifies components and wiring patterns to be displayed in AR display. FIG. [Figure 16] 13A and 13B are diagrams illustrating an example of AR display when AR display is performed on components and wiring patterns identified as display targets based on fail codes. [Figure 17] 11 is a sequence chart for explaining an operation when an instructor helps a field engineer with a failure analysis operation via a terminal device 40. [Figure 18] FIG. 13 is a diagram showing an example of AR display performed on the terminal device 10 when an instructor helps a field engineer with a defect analysis operation via the terminal device 40. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Next, an embodiment of the present invention will be described in detail with reference to the drawings.

[0023] As shown in FIG. 1, the information processing system of this embodiment is configured such that a terminal device 10 operated by a field engineer who investigates the cause of a malfunction that has occurred in a target device for which malfunction analysis is to be performed, and a terminal device 40 of an instructor who provides advice on analysis methods to assist the field engineer in performing the malfunction analysis are connected via a network 50 such as the Internet.

[0024] In this embodiment, the image forming apparatus 30 is used as the target device for the failure analysis, but various electronic devices incorporating a printed wiring board can be used as the target device for the failure analysis. The terminal devices 10 and 40 are, for example, information processing devices such as personal computers.

[0025] In general, in the maintenance and inspection of electronic devices such as image forming devices installed at customer sites, a field engineer actually visits the location of the electronic device to perform defect analysis. In this defect analysis, a printed wiring board is removed from the electronic device to be analyzed, and the parts causing the defect are identified.

[0026] However, in recent years, the area of ​​printed wiring boards built into electronic devices has tended to become smaller, and the density of mounted components has increased. As a result, although information such as part numbers of mounted components was previously printed on printed wiring boards by silk screen printing, there is now less space on printed wiring boards for silk screen printing. Even if it were possible to print information such as part numbers, it would be necessary to omit the information or make the characters smaller, making it difficult to obtain sufficient information directly from the printed wiring board.

[0027] Therefore, in the information processing system of this embodiment, a camera 20 is connected to a terminal device 10 operated by a field engineer, and the camera 20 photographs the printed wiring board to be subjected to defect analysis and displays it on the display of the terminal device 10. Then, information regarding a specified component or wiring pattern among a plurality of components and wiring patterns arranged on the printed wiring board is superimposed on the photographed image of the printed wiring board on the display of the terminal device 10 to perform AR (short for Augmented Reality) display. By referring to such an AR display, the field engineer can grasp information regarding the components and wiring patterns on the printed wiring board.

[0028] In this embodiment, the terminal device 10 and the image forming device 30 that is the target of the defect analysis are connected to each other via a wireless line such as Bluetooth (registered trademark) or Wi-Fi (registered trademark).

[0029] FIG. 2 shows how a printed wiring board 60 removed from an image forming apparatus 30 that is the subject of defect analysis is photographed by a camera 20 and AR display is performed on the photographed image of the printed wiring board 60.

[0030] As shown in FIG. 2, a marker 62 for identifying a reference position is provided on printed wiring board 60, and terminal device 10 detects marker 62 from an image of printed wiring board 60 captured by camera 20, and based on the position of the detected marker 62, displays an image of information regarding components and wiring patterns superimposed on the image of printed wiring board 60 on the display.

[0031] Terminal device 10 stores information on the distance from a reference position of the components and wiring patterns mounted on printed wiring board 60 and information on each component and wiring pattern. Terminal device 10 also has a function of detecting the position of marker 62 from the captured image of printed wiring board 60 and executing a calculation process for superimposing and displaying information on the components and wiring patterns.

[0032] An example of the printed wiring board 60 shown in Fig. 2 is shown in Fig. 3. Referring to Fig. 3, components 63 and 65 are mounted on the printed wiring board 60, and a wiring pattern 64 is shown connecting a terminal of the component 63 to a terminal of the component 65. Note that, for simplicity of explanation, Fig. 3 illustrates a case where only two components 63 and 65 and one wiring pattern are arranged on the printed wiring board 60, but in reality, many components and many wiring patterns for connecting these components are mounted on the printed wiring board.

[0033] Referring to FIG. 3, a reference point 61, which is a reference position in design, is provided on a printed wiring board 60, and the positions of components 63, 65 and a marker 62 are specified by the X-coordinate distance and the Y-coordinate distance from this reference point 61.

[0034] Further, the marker 62 is provided with identification information for identifying the type of the printed wiring board and the front / back side, and the marker 62 shown in Fig. 3 is provided with identification information "01234F". Of this identification information, "01234" is information for identifying the type of board, and "F" is the initial letter of "Front side", meaning the front side. The back side of the printed wiring board is provided with identification information in which "B", the initial letter of "Back side", meaning the back side, is added to the information for identifying the type of board. In other words, the marker "01234R" is provided on the back side of this printed wiring board 60.

[0035] The terminal device 10 of this embodiment has a function of displaying information about a specified component or wiring pattern in AR when the component or wiring pattern on the printed wiring board 60 displayed on the display is specified. Specific examples of AR display performed in the terminal device 10 of this embodiment are shown in Figs. 4 and 5.

[0036] FIG. 4 shows the case where a component 65 on a printed wiring board 60 is specified with a pointing device such as a mouse. The specified component is highlighted, for example, with a thick red dotted line, and information on the component name, such as "Logic IC," and component classification information, such as "I / O, PWR, Other," are displayed in a pop-up.

[0037] FIG. 5 also shows a case where wiring pattern 64 on printed wiring board 60 is specified by a pointing device such as a mouse, and the specified wiring pattern is highlighted, for example, by a thick red line, and connection information such as "from pin 2 of TR123 to pin 1 of IC101" is displayed in a pop-up.

[0038] In addition, Figures 4 and 5 show a case where a specific component or wiring pattern is specified by a pointing device such as a mouse on the image of printed wiring board 60 displayed on the display of terminal device 10, but an object pointed to by a specific object such as a user's finger or a ballpoint pen on printed wiring board 60 photographed by camera 20 may be identified by image processing, and the identified component or wiring pattern may be displayed as being specified in AR.

[0039] When identifying the part, etc., specified by the user's finger, etc. in this manner, image processing is performed to detect the user's finger in the image captured by camera 20, and the part, etc., that the detected finger is pointing at is determined.

[0040] In the terminal device 10 of this embodiment described above, when a field engineer specifies a component or wiring pattern on a printed wiring board for which defect analysis is to be performed, information about the specified component or wiring pattern can be displayed in AR and understood.

[0041] However, the number of components placed on a printed wiring board tends to increase, and in some cases, 4,000 to 5,000 components may be placed on a single printed wiring board. Since field engineers are not circuit designers, if they have little experience in defect analysis, they often cannot identify which components or wiring patterns to check. In such cases, they end up replacing the entire printed wiring board with the components still mounted.

[0042] Therefore, in the information processing system of this embodiment, by adopting the following configuration, it is possible to easily identify the component or wiring causing the malfunction, compared to a case where information related to all of the components and wiring included in the printed wiring board is superimposed and displayed on an image of the printed wiring board photographed by camera 20.

[0043] Next, the hardware configuration of the terminal device 10 in the information processing system of this embodiment is shown in FIG.

[0044] 6, the terminal device 10 has a CPU 11, a memory 12, a storage device 13 such as a hard disk drive, a communication interface (abbreviated as IF) 14 for transmitting and receiving data to and from external devices via a network 50, and a user interface (abbreviated as UI) device 15 including a touch panel or liquid crystal display and a keyboard. These components are connected to each other via a control bus 16.

[0045] The CPU 11 is a processor that executes a predetermined process based on a control program stored in the memory 12 or the storage device 13 to control the operation of the terminal device 10. Note that, in this embodiment, the CPU 11 is described as reading and executing the control program stored in the memory 12 or the storage device 13, but it is also possible to provide the program to the CPU 11 by storing it on a storage medium such as a CD-ROM.

[0046] FIG. 7 is a block diagram showing the functional configuration of the terminal device 10 realized by executing the above control program.

[0047] As shown in FIG. 7, the terminal device 10 of this embodiment includes an operation input unit 31, a display unit 32, a data transmission / reception unit 33, a display control unit , an information storage unit 35, and an image acquisition unit .

[0048] Various pieces of operational information performed by a user are inputted into the operation input unit 31. The display unit 32 is controlled by the display control unit 34 and displays various pieces of information to the user.

[0049] The data transmission / reception unit 33 transmits and receives data to and from external devices such as the camera 20. The image acquisition unit 36 ​​acquires, via the data transmission / reception unit 33, images of the printed wiring board captured by the camera 20, and the like.

[0050] The information storage unit 35 stores layout information related to components mounted on the printed wiring board and the layout locations of wiring patterns connecting terminals of each component. This layout information is generated by extracting only necessary information from a CAD (Computer-Aided Design) design information file generated when designing the printed wiring board. Alternatively, the CAD design information file itself may be stored in the information storage unit 35 as the layout information.

[0051] First, when a field engineer attempts to perform a fault analysis of the image forming apparatus 30, the display control unit 34 acquires fault information that identifies the content of the fault that has occurred in the image forming apparatus 30, which is the target device for the fault analysis. Here, the fault information is, for example, a fail code that indicates a fault that has been identified by a self-diagnosis function in the image forming apparatus 30. This fail code is, for example, a six-digit number, and is a fault code that identifies the content of the fault that has occurred in the image forming apparatus 30 by using this six-digit number.

[0052] Here, when the defect analysis is performed, the display control unit 34 acquires a fail code from the image forming apparatus 30 via a wireless communication line. Alternatively, the display control unit 34 may acquire the fail code based on an operational input by a user such as a field engineer.

[0053] Then, the display control unit 34 superimposes information related to the components and wiring patterns that may be the cause of the malfunction identified by the fail code, among the multiple components and wiring patterns arranged on the printed wiring board that constitutes the image forming device 30, on the captured image of the printed wiring board, and displays it in AR.

[0054] In addition to the above-mentioned arrangement information, the information storage unit 35 stores, for each fail code, a function corresponding to a malfunction identified by the fail code, and also stores, for each component and wiring pattern included in the printed wiring board, a function realized by the component and wiring pattern in association with the component and wiring pattern.

[0055] Then, the display control unit 34 determines that the components and wiring patterns that realize the function corresponding to the acquired fail code are the components and wiring that may be the cause of the malfunction identified by the fail code.

[0056] When the instructor gives advice on fault analysis to the field engineer via the terminal device 40, the data transmitter / receiver 33 of the terminal device 10 receives information on the parts or wiring patterns to be checked and information on the items to be checked for those parts or wiring patterns from the terminal device 40, which is an external device, via the network 50.

[0057] The display control unit 34 then displays the information on the items to be checked received by the data transmission / reception unit 33 in AR, superimposing it on the component or wiring pattern to be checked in the image of the printed wiring board.

[0058] Furthermore, as the field engineer progresses with the confirmation work, when the instructor sequentially erases the information on the confirmation items displayed in AR on the display unit 32 of the terminal device 10 via the terminal device 40, the display control unit 34 erases the information on the confirmation items displayed superimposed on the image of the printed wiring board based on an instruction from the terminal device 40.

[0059] Next, the operation of the terminal device 10 of this embodiment will be described in detail with reference to the drawings.

[0060] First, the appearance of a printed wiring board 70 intended for AR display, which will be used when explaining the operation of the terminal device 10 of this embodiment, is shown in Fig. 8. Referring to Fig. 8, it can be seen that a plurality of components are arranged on the printed wiring board 70, and these components are connected to each other by wiring patterns.

[0061] Next, the names, part numbers, and functional classifications of the parts in the printed wiring board 70 shown in FIG. 8 will be described with reference to FIG.

[0062] 9, component numbers IC101 to IC104 and TR123 are associated with components 71 to 75 arranged on a printed wiring board 70. The component name of component 71 is "Logic IC," and the items "I / O, PWR, Other" are set as the functional classification. The meanings of the names of these functional classifications will be described later.

[0063] Additionally, part 72 has the part name "Communication IC" and the functional classification is set to "I / O". Part 73 has the part name "Power Supply IC" and the functional classification is set to "PWR". Part 74 has the part name "General-purpose IC" and the functional classification is set to "Other". Finally, part 75 has the part name "Transistor" and the functional classification is set to "I / O".

[0064] Next, an example of the error list stored in the information storage unit 35 is shown in Fig. 10. Referring to Fig. 10, it can be seen that in the error list, a fail code, a fault type indicated by the fail code, and a function classification corresponding to this fault type are associated with each other. For example, it can be seen that fault information with a fail code of "123-456" corresponds to a fault type of "power supply error" and is associated with a function classification of "PWR." Here, "PWR" means a power supply function, and "I / O" means a communication function.

[0065] In this embodiment, for simplicity, only three specific error codes and the defect types and functional classifications corresponding to these error codes are used, but in reality, many more fail codes are provided and more detailed functional classifications are associated with them.

[0066] Next, an example of a component and wiring list stored as placement information in information storage unit 35 is shown in Fig. 11. Referring to Fig. 11, a component name, a functional classification, and a component number are stored in association with each other for each component. It can also be seen that for each wiring pattern, connection points indicating which components are connected to which other components are stored in association with their functional classification.

[0067] Next, the operation of the terminal device 10 when the printed wiring board 70 shown in FIG. 8 is photographed by the camera 20 of the terminal device 10 and AR display is performed will be described with reference to the flowchart of FIG.

[0068] First, in step S101, when the model information of the model for which a defect analysis is to be performed is inputted into the terminal device 10, information on the components and wiring patterns of the printed wiring board mounted on the model corresponding to the inputted model information is downloaded from a server device (not shown) etc. If the field engineer has previously obtained model information of the image forming device 30 for which a defect analysis is to be performed, the information on the components and wiring patterns of the printed wiring board mounted on the image forming device 30 may be stored in the terminal device 10 in advance.

[0069] An example of the operation screen of the terminal device 10 when a field engineer is about to perform a failure analysis is shown in Fig. 13. In the example of the operation screen shown in Fig. 13, it can be seen that the field engineer is prompted to input the model name for which the failure analysis is to be performed, and to obtain the fail code obtained from the device to be analyzed.

[0070] Here, when a field engineer operates a button labeled "Automatically obtain fail code" on the operation screen shown in Fig. 13, a fail code is automatically obtained from image forming apparatus 30 via a wireless line, as shown in Fig. 14. Fig. 14 shows how a request for obtaining a fail code is made from terminal device 10 to image forming apparatus 30, and how image forming apparatus 30, in response to this request, transmits a fail code obtained by a self-diagnosis function or the like to terminal device 10.

[0071] In this way, as shown in step S102, if the terminal device 10 is capable of automatically receiving the fail code from the image forming apparatus 30, the terminal device 10 acquires the fail code from the image forming apparatus 30 via a wireless line.

[0072] Alternatively, if the terminal device 10 is not capable of automatically receiving the fail code from the image forming apparatus 30, the terminal device 10 acquires the fail code through manual operation by the user.

[0073] Then, in the terminal device 10, the display control unit 34 extracts components and wiring patterns of the functional classification corresponding to the acquired fail code in step S104.

[0074] Then, in step S105, the display control unit 34 performs AR display for the extracted components and wiring patterns.

[0075] FIG. 15 shows a specific example of how the display control unit 34 extracts components and wiring patterns of a functional classification corresponding to the acquired fail code, thereby specifying the components and wiring patterns to be displayed in the AR display.

[0076] FIG. 15 shows a state in which the display control unit 34 receives a fail code "111-222" from the image forming apparatus 30. In FIG.

[0077] 10, it can be seen that the failure type of the fail code "111-222" is an "I / O communication error" and the function classification is "I / O." Therefore, the display control unit 34 extracts the components and wiring patterns having the function classification "I / O" from the component and wiring list shown in FIG 11 as the components and wiring patterns to be displayed in the AR display.

[0078] As a result, as shown in FIG. 15, the display control unit 34 specifies three components having part numbers 1C101, TR123, and IC102, and two wiring patterns connecting these three components, as the display targets.

[0079] FIG. 16 shows an example of AR display when AR display is performed on the components and wiring patterns thus specified as display targets.

[0080] 16, the parts and wiring patterns specified as the display targets are highlighted with thick lines, and the part names and part classification information for these parts are displayed in AR as text information. It is also possible to display the part numbers of each part together in AR.

[0081] Next, a case will be described in which an instructor helps a field engineer with the failure analysis work via the terminal device 40. In this case, AR display is not performed for all the parts and wiring patterns identified by the fail code, but for some of the parts and wiring patterns selected by the instructor.

[0082] The details of the operations carried out between the image forming apparatus 30 and the terminal apparatuses 10 and 40 in such a case will be described with reference to the sequence chart of FIG.

[0083] First, in step S201, the fail code of the image forming apparatus 30 is acquired by the terminal device 10. Then, in step S202, the terminal device 10 extracts components and wiring patterns for performing AR display based on the acquired fail code.

[0084] Then, data on the parts and wiring patterns to be displayed in AR is transmitted from the terminal device 10 to the terminal device 40 in step S203.

[0085] In step S204, the instructor operates terminal device 40 to select components and wiring patterns to be displayed in AR. In step S205, the instructor inputs instructions for the analysis procedure, including the analysis procedure, such as the order in which the analysis should be performed, and confirmation items, such as what confirmations should be performed.

[0086] Then, in step S206, the terminal device 40 transmits information on the components and wiring patterns to be AR-displayed, information on the analysis procedure, and the like, to the terminal device 10 as data for AR display. Then, in step S207, the terminal device 10 performs AR display based on the data transmitted from the terminal device 40.

[0087] An example of the AR display thus performed on the terminal device 10 is shown in Fig. 18. Referring to Fig. 18, it can be seen that the components and wiring patterns to be analyzed are highlighted with thick lines or the like, and the AR display shows the order in which items should be checked for each component, such as "1. Check for damage to the terminals" and "2. Check the voltage of the first item."

[0088] By following the analysis steps displayed in AR in this way, the field engineer can carry out analysis work using advice from an instructor in a remote location.

[0089] In each of the above embodiments, the term "processor" refers to a processor in a broad sense, including general-purpose processors (e.g., CPU: Central Processing Unit, etc.) and dedicated processors (e.g., GPU: Graphics Processing Unit, ASIC: Application Specific Integrated Circuit, FPGA: Field Programmable Gate Array, programmable logic device, etc.).

[0090] In addition, the operations of the processor in each of the above embodiments may be performed not only by one processor, but also by multiple processors located at physically separate locations working together. Furthermore, the order of the operations of the processor is not limited to the order described in each of the above embodiments, and may be changed as appropriate. [Explanation of symbols]

[0091] 10 Terminal Equipment 11 CPU 12. Memory 13 Storage device 14 Communication Interface 15 User Interface Device 16 Control Bus 20 Camera 31 Operation input section 32 Display section 33 Data transmission and reception unit 34 Display control section 35 Information storage section 36 Image acquisition section 40 Terminal Equipment 50 Network 60 Printed Wiring Board 61 Reference point 62 Marker 63 parts 64 Wiring Pattern 65 parts 70 Printed Wiring Board 71~75 parts

Claims

1. A processor is provided. The processor, acquiring, by a self-diagnosis function of the target device, fault information for identifying the content of a fault occurring in the target device, and and displaying, on an image of a printed wiring board constituting the target device, information related to a part and wiring that may be the cause of the malfunction identified by the malfunction information, among a plurality of parts and wirings arranged on the printed wiring board. Information processing device.

2. 2. The information processing apparatus according to claim 1, wherein the fault information is a fault code indicating a fault identified by a self-diagnosis function of the target device.

3. The information processing apparatus according to claim 2 , wherein the processor acquires the defect code from the target device via a wireless communication line.

4. The information processing apparatus according to claim 2 , wherein the processor acquires the defect code based on an operational input by a user.

5. Further comprising a memory; the memory stores a function corresponding to a defect identified by the defect information for each piece of defect information, and stores, for each component and wiring included in the printed wiring board, a function realized by the component and wiring in association with the component and wiring; 5. The information processing device according to claim 1, wherein the processor determines that components and wiring that realize a function corresponding to the acquired defect information are components and wiring that may be the cause of the defect identified by the defect information.

6. The processor receives information on a component or wiring to be checked and information on items to be checked for the component or wiring from an external device via a network; 6. The information processing apparatus according to claim 1, wherein the received information on the confirmation items is displayed so as to be superimposed on a component or wiring to be confirmed in the image of the printed wiring board.

7. The information processing apparatus according to claim 6 , wherein the processor erases the information superimposed and displayed on the image of the printed wiring board based on an instruction from the external device.

8. acquiring, by a self-diagnosis function of the target device, malfunction information for identifying a malfunction occurring in the target device and related to a function of the target device; a step of superimposing and displaying information related to a component and wiring that may be a cause of the malfunction identified by the malfunction information, among a plurality of components and wirings arranged on the printed wiring board constituting the target device, on an image of the printed wiring board; A program for causing a computer to execute the following.

Images