Laser Processing Equipment

The laser processing apparatus improves positional accuracy and processing quality by simultaneous photography and measurement of laser spots and grooves, addressing issues of temperature fluctuations and laser abnormalities in wafer processing.

JP7735649B2Active Publication Date: 2025-09-09TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
JP2021008549
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-02-19
Filing Date
2021-01-22
Publication Date
2025-09-09
Estimated Expiration
2041-01-22

AI Technical Summary

Technical Problem

Existing laser processing devices struggle with maintaining positional accuracy and processing quality due to temperature fluctuations, assembly errors, and laser light abnormalities, which affect the formation of grooves in wafers with low-k films, and cannot perform real-time kerf checks on hollow grooves.

Method used

A laser processing apparatus that simultaneously photographs the laser spot and grooves using cameras, measures positional accuracy and processing quality, and employs a system with different wavelength illumination light to prevent overexposure, along with a mirror mechanism to adjust optical paths and condenser lenses to reduce takt time.

Benefits of technology

Enhances positional accuracy and processing quality by allowing real-time kerf checks and immediate detection of abnormalities, improving the precision of groove formation in wafers with low-k films.

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Abstract

To provide a laser processing device capable of further improving the position accuracy and processing quality of laser processing.SOLUTION: A laser processing device that performs laser processing to form a groove along a street by irradiating the street with laser light from a laser head while moving a table that holds a wafer and the laser head with a condenser lens that concentrates the laser light on the street of the wafer held on the table relative to the processing feed direction along the street of the wafer includes a camera that simultaneously captures a laser spot and a groove of a laser beam concentrated on the street through the condenser lens while the laser processing is being performed, and a measuring unit that measures the position accuracy and processing quality of laser processing on the basis of the captured image taken by the camera.SELECTED DRAWING: Figure 5
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