Organic EL display device

Abstract

The present invention provides an organic EL display device having high light-blocking properties, and high light-emission reliability while comprising a pixel division layer having openings with a narrow opening width. The present invention is an organic EL display device comprising a substrate, a planarization layer, a first electrode, a pixel division layer, a luminescent pixel, and a second electrode in this order. In the organic EL display device, the pixel division layer includes a layer (A) and a layer (B), the layer (A) being a layer disposed on the surface of the first electrode with the surface of the first electrode partially exposed, and the layer (B) being a layer disposed on at least a part of the surface of the layer (A). The layer (A) contains a hardened material of a negative photosensitive composition (a) containing a pigment and / or a dye, a compound having two or more ethylenically unsaturated double bond groups in the molecule, and a photoinitiator, and the layer (B) contains a hardened material of a positive photosensitive composition (b) containing a resin and a photoacid generator.

Description

[Technical Field]

[0001] The present invention relates to an organic electroluminescence display device. [Background technology]

[0002] Many products equipped with organic electroluminescence (EL) display devices, such as smartphones, televisions, and in-vehicle monitors, have been developed. In recent years, in order to improve the visibility and contrast of organic EL display devices, techniques for blackening pixel division layers to impart light-blocking properties have attracted attention. These techniques aim to suppress color mixing due to light leakage into adjacent light-emitting pixels and the reflection of external light, such as sunlight, and thus improve the visibility and contrast of organic EL display devices. Furthermore, there is a demand for higher resolution displays by reducing the size of light-emitting pixels. Because red, green, and blue light-emitting pixels are formed in apertures in a patterned pixel division layer that functions as an insulating layer, arranging a large number of small light-emitting pixels within the display surface requires the formation of a pixel division layer with a large number of narrow apertures. The pixel division layer is typically formed by photolithography using a photosensitive composition. Patent Document 1 discloses, for example, a negative-type photosensitive composition containing an organic black pigment as a photosensitive composition for forming a black pixel division layer, and an organic EL display device equipped with a pixel division layer formed using this composition has also been disclosed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2021 / 111860 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when a pixel dividing layer having narrow openings is formed using the negative photosensitive composition disclosed in Patent Document 1, there is a problem that high light emission reliability cannot be obtained. For these reasons, there has been a strong demand for an organic EL display device that has high light-shielding properties, is equipped with a pixel dividing layer having openings with narrow opening widths, and yet has high light-emitting reliability. [Means for solving the problem]

[0005] The present invention is as follows. (1) An organic EL display device comprising, in this order, a substrate, a planarization layer, a first electrode, a pixel division layer, a light-emitting pixel, and a second electrode, wherein the pixel division layer includes a layer (A) and a layer (B); the layer (A) is a layer disposed on the surface of the first electrode such that the surface of the first electrode is partially exposed, and the layer (B) is a layer disposed on at least a portion of the surface of the layer (A); The organic EL display device comprises layer (A) containing a cured product of a negative-type photosensitive composition (a) containing a pigment and / or dye, a compound having two or more ethylenically unsaturated double bond groups in the molecule, and a photopolymerization initiator, and layer (B) containing a cured product of a positive-type photosensitive composition (b) containing a resin and a photoacid generator. (2) The organic EL display device according to (1), wherein the display section has a portion where the area ratio of the surface of the layer (A) covered by the layer (B) is 20 to 100% of the total surface area of ​​the layer (A). (3) The organic EL display device according to (1) or (2), further comprising a color filter on the light extraction side of the light-emitting pixel. (4) The layer (A) has an opening area of ​​30.0 to 260.0 μm in which the light-emitting pixels are arranged in the display section. 2 The organic EL display device according to any one of (1) to (3), having an opening. (5) The organic EL display device according to any one of (1) to (4), wherein the cured product of the positive photosensitive composition (b) contains a resin having an imide bond and / or a benzoxazole skeleton. (6) The organic EL display device according to any one of (1) to (5), wherein the cured product of the negative photosensitive composition (a) contains the pigment, and the pigment contains a benzodifuranone-based black pigment represented by the formula (1) or (2) described below. (7) The organic EL display device according to any one of (1) to (6), wherein the cured product of the negative photosensitive composition (a) further contains at least one perylene-based organic pigment selected from the group consisting of CI Pigment Red 123, CI Pigment Red 149, CI Pigment Red 178, CI Pigment Red 179, CI Pigment Red 190, CI Pigment Violet 29, and 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole. (8) The organic EL display device according to any one of (1) to (7), wherein the cured product of the negative photosensitive composition (a) further contains 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole. (9) The organic EL display device according to any one of (1) to (8), wherein, in a region where the layer (B) is disposed on the surface of the layer (A), the maximum thickness of the layer (A) is 0.5 to 3.0 μm, and the maximum thickness of the layer (B) is 0.1 to 3.0 μm. (10) The organic EL display device according to any one of (1) to (9), wherein the optical density per 1 μm of film thickness of the layer (A) (OD / μm) is 0.5 to 1.5. (11) The organic electroluminescence display device according to any one of (1) to (10), wherein the cured product of the negative photosensitive composition (a) contains silica particles having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis / minor axis) of 1.0 to 1.5. [Effects of the Invention]

[0006] According to the present invention, an organic EL display device is provided which has high light-shielding properties, is provided with a pixel dividing layer having openings with narrow opening widths, and yet has high light-emitting reliability. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a cross-sectional view of a TFT substrate in an organic EL display device that is a specific example of an embodiment of the present invention. [Figure 2] FIG. 1 is a cross-sectional view of a color filter substrate that may be included in an organic EL display device that is a specific example of an embodiment of the present invention. [Figure 3] FIG. 1 shows a cross-sectional view of a pixel dividing layer-forming substrate, which is a specific example of an embodiment of the present invention, in which layer (B) is arranged to cover the entire surface of layer (A), and layer (A) and layer (B) have the same opening width. [Figure 4] FIG. 1 shows a cross-sectional view of a pixel dividing layer-forming substrate having a spacer function, in which a layer (B) is disposed on part of the surface of a layer (A), as a specific example of an embodiment of the present invention. [Figure 5] As a specific example of an embodiment of the present invention, a cross-sectional view of a pixel dividing layer-forming substrate having a spacer function is shown, in which layer (B) is arranged to cover the entire surface of layer (A), and layer (A) and layer (B) have the same opening width. [Figure 6] As a specific example of an embodiment of the present invention, a cross-sectional view of a pixel dividing layer-forming substrate having a spacer function is shown, in which layer (B) is arranged to cover the entire surface of layer (A), and layer (A) and layer (B) have the same opening width. [Figure 7] As a specific example of an embodiment of the present invention, a layer (B) is arranged to cover the surface of layer (A) except for the inclined portion located on the pattern periphery of the opening of layer (A), and layer (A) is a layer arranged on the surface of a first electrode and the surface of a planarizing layer, and a pixel dividing layer-forming substrate having a spacer function is shown. [Figure 8] 1 shows a layer (A) having hole-patterned openings in a display section, in which light-emitting pixels are arranged, with the opening area being within a range of 30.0 to 260.0 μm 2 , as a specific example of an embodiment of the present invention. [Figure 9] 1 shows a layer (A) in a display section, which is a specific example of an embodiment of the present invention, having openings in a square pattern in which light-emitting pixels are arranged and whose opening area is within a range of 30.0 to 260.0 μm 2 . [Figure 10] An example of layer (A), a light-emitting portion, and a non-light-emitting portion when observing a light-emitting pixel portion is shown. [Figure 11] The process for producing an organic EL display device including the step of forming a pixel dividing layer in all examples and comparative examples will be described. DETAILED DESCRIPTION OF THE INVENTION

[0008] The present invention will be described in detail below. A numerical range expressed using "to" means a range that includes the numerical values ​​before and after "to" as the lower and upper limits. The pixel division layer refers to a pixel division layer provided in an organic electroluminescence display device and does not include the black matrix of a liquid crystal display device. Visible light refers to light in the wavelength range of 380 nm or more and less than 780 nm, and near-ultraviolet light refers to light in the wavelength range of 200 nm or more and less than 380 nm. Light-shielding refers to the function of reducing the intensity of transmitted light compared to the intensity of light incident perpendicularly to the cured film, and light-shielding properties refer to the degree to which visible light is blocked. The photosensitive composition refers to a composition that is photosensitive to near-ultraviolet light. The weight-average molecular weight (Mw) refers to a value obtained by analyzing a composition by gel permeation chromatography using tetrahydrofuran as a carrier and converting it using a calibration curve based on standard polystyrene. The solid content refers to the proportion (wt%) of components in the photosensitive composition, excluding solvents and water.

[0009] The abbreviation "CI" used to refer to some colorants is an abbreviation for Colour Index Generic Name, which is based on the Colour Index published by The Society of Dyers and Colourists. For colorants registered in the Colour Index, the Colour Index Generic Name indicates the chemical structure or crystalline form of the pigment or dye.

[0010] As a result of investigating the above-mentioned problem, the present inventors found that when narrow openings (e.g., squares with a vertical width of 7.0 μm and a horizontal width of 7.0 μm) are formed using a negative-type photosensitive composition containing a pigment and / or dye, a compound having two or more ethylenically unsaturated double bond groups in the molecule, and a photopolymerization initiator, the light-emitting reliability of the resulting organic EL display device is inferior to that of when wide openings (e.g., squares with a vertical width of 30.0 μm and a horizontal width of 30.0 μm) are formed. In other words, even when the same negative-type photosensitive composition is used, the smaller the light-emitting pixel size, determined by the opening width of the opening in the pixel dividing layer, the more likely the light-emitting reliability of the organic EL display device is to decrease, which is a trade-off when increasing the resolution of the display area.

[0011] In view of the above, the present inventors have conducted extensive research and come up with the idea of ​​combining a layer containing a cured product of a negative-type photosensitive composition with a layer containing a cured product of a positive-type photosensitive composition, and have found that the following configuration provides an especially remarkable effect in solving the above-mentioned problems. That is, the present invention provides an organic EL display device comprising, in this order, a substrate, a planarizing layer, a first electrode, a pixel dividing layer, a light-emitting pixel, and a second electrode, wherein the pixel dividing layer includes a layer (A) and a layer (B), wherein the layer (A) is a layer disposed on the surface of the first electrode such that the surface of the first electrode is partially exposed, and the layer (B) is a layer disposed on at least a portion of the surface of the layer (A), wherein the layer (A) contains a cured product of a negative-type photosensitive composition (a) containing a pigment and / or dye, a compound having two or more ethylenically unsaturated double bond groups in the molecule, and a photopolymerization initiator, and the layer (B) contains a cured product of a positive-type photosensitive composition (b) containing a resin and a photoacid generator.

[0012] The organic EL display device of the present invention comprises a substrate, a planarizing layer, a first electrode, a pixel dividing layer, a light-emitting pixel, and a second electrode in this order. FIG. 1 shows a cross-sectional view of a TFT substrate in an organic EL display device that is a specific example of an embodiment of the present invention.

[0013] Bottom-gate or top-gate thin film transistors (TFTs) 1 are arranged in a matrix on the surface of a substrate 6, and a TFT insulating layer 3 is formed to cover the TFTs 1 and the wiring 2 connected to the TFTs 1. Examples of TFTs 1 include TFTs made of oxide semiconductors such as In-Ga-Zn-O (IGZO) and Ga-Zn-Sn, or low-temperature polysilicon (LTPS). Furthermore, a planarization layer 4 is formed on the surface of the TFT insulating layer 3, and contact holes 7 are formed in the planarization layer 4 to open the wiring 2. The contact holes 7 may be, for example, circular openings. A first electrode 5 is patterned on the surface of the planarization layer 4 and connected to the wiring 2. A layer (A) 8 is disposed on the surface of the first electrode 5, partially exposing the surface of the first electrode 5. A layer (B) 9 is disposed on a portion of the surface of the layer (A) 8, and the layers (A) 8 and (B) 9 together form a pixel dividing layer 10. An opening is provided in the pixel division layer 10, and a light-emitting pixel 11 containing an organic EL light-emitting material is formed in the opening, and a second electrode 12 is arranged to cover the layer (A) 8, the layer (B) 9, and the light-emitting pixel 11. The shape of the opening in the pixel division layer 10 is not particularly limited and may be a square, rectangle, perfect circle, or ellipse, and the size of the light-emitting pixel 11 is determined by the opening width of the opening in the layer (A) 8 included in the pixel division layer 10. When a TFT substrate having the above-described laminated structure is sealed under vacuum and a voltage is applied to the light-emitting pixel portion, the TFT substrate can be made to emit light as an organic EL display device.

[0014] The organic EL display device of the present invention is not particularly limited and may be a bottom-emission type organic EL display device in which the emitted light emitted from the light-emitting pixel 11 is extracted to the substrate side through the substrate 6, or a top-emission type organic EL display device in which the emitted light is extracted to the opposite side of the substrate 6 through the second electrode 12.

[0015] If a hard plate-like substrate such as glass is used as the substrate 6, a rigid organic EL display device that cannot be bent can be produced. A suitable glass is alkali-free glass containing less than 0.5% alkali metal elements and primarily composed of silicon. Glass with a low thermal expansion coefficient and excellent dimensional stability in high-temperature processes at 250°C or higher is particularly preferred, such as OA-10G and OA-11 (both manufactured by Nippon Electric Glass Co., Ltd.) and AN-100 (manufactured by Asahi Glass Co., Ltd.). The thickness of the glass is typically 0.1 to 0.5 mm from the viewpoint of physical durability.

[0016] On the other hand, flexible substrates can be used to produce flexible organic EL display devices. A suitable flexible substrate is a substrate made of polyimide resin, which has high flexibility and excellent mechanical strength. One method for producing such a flexible substrate is to apply a solution containing polyamic acid to the surface of a temporary support, then heat the polyamic acid to imidize it and convert it into a polyimide resin, and then peel off the temporary support using a laser or other device. Polyamic acid can be synthesized by reacting a tetracarboxylic dianhydride with a diamine compound in an amide solvent such as N-methyl-2-pyrrolidone. Among these, polyamic acid having residues of an aromatic tetracarboxylic dianhydride and an aromatic diamine compound is preferred due to its low coefficient of linear thermal expansion and excellent dimensional stability. A specific example is polyamic acid having residues of 3,3',4,4'-biphenyltetracarboxylic dianhydride and p-phenylenediamine. The thickness is typically 10 to 40 μm, allowing for a thinner substrate 6 than when using the aforementioned alkali-free glass.

[0017] The planarizing layer 4 is not particularly limited as long as it functions as an insulating layer disposed as an underlayer for the first electrode 5, and may be a layer formed so as to cover protrusions resulting from the thickness of the TFT 1, thereby enabling the first electrode 5 to be patterned more smoothly. The planarizing layer 4 can be patterned using, for example, the same photosensitive composition as the negative-type photosensitive composition (a) or the positive-type photosensitive composition (b) described below, and the planarizing layer 4 may consist of a single layer or two or more layers.

[0018] The first electrode 5 may be made of any material as long as it functions as an anode. Examples of suitable materials for the first electrode 5 include conductive metal oxides such as ITO (indium tin oxide), ITZO (indium tin zinc oxide), and IZO (indium zinc oxide). Among these, ITO is preferred due to its excellent transparency and conductivity. A method for patterning ITO involves first forming an ITO film over the entire surface by sputtering, then patterning a positive etching resist material by photolithography to obtain a resist pattern on the ITO film. Next, only the ITO film in the areas where the resist pattern is not formed is removed using an etching solution at a temperature of 20 to 60°C. The resist pattern is then removed using a resist stripper at a temperature of 20 to 60°C, and, if necessary, heat treatment is performed to achieve the desired crystallinity. The term "ITO" as used herein encompasses so-called amorphous ITO. A positive photosensitive composition containing an alkali-soluble novolac resin can be used as a positive etching resist material. The etching solution may be an aqueous solution containing nitric acid and hydrochloric acid or an aqueous solution of oxalic acid. Commercially available products include ITO-101N (manufactured by Kanto Chemical Co., Ltd.), "Sclean" (registered trademark) IS-2, and IS-3 (all manufactured by Sasaki Chemical Co., Ltd.).

[0019] An organic amine aqueous solution can be used as the resist stripper, and examples of commercially available products include "Anlast" (registered trademark) M6, M6B, TN-1-5, and M71-2 (all from Sanwa Pure Chemical Research Institute). When the organic EL display device of the present invention is a top-emission organic EL display device, in order to increase light extraction efficiency and improve luminance, the first electrode 5 is preferably a laminate film in which a transparent conductive layer is laminated on the surface of a metal reflective layer, and may have a laminate structure of, for example, silver alloy / ITO or ITO / silver alloy / ITO. Examples of silver alloys include an alloy of Ag and Cu, and an alloy of Ag, Pd, and Cu.

[0020] The light-emitting pixel 11 is not particularly limited, and the emitted light may have any peak wavelength. The organic EL light-emitting material constituting the light-emitting pixel 11 can be a material that combines a light-emitting layer with a hole transport layer and / or an electron transport layer. Examples of light-emitting pixels of each color include a red light-emitting pixel having a peak wavelength of 560 to 700 nm, a blue light-emitting pixel having a peak wavelength of 420 to 490 nm, and a green light-emitting pixel having a peak wavelength of 500 to 550 nm. The light-emitting pixel 11 may have a tandem light-emitting layer formed by stacking multiple light-emitting layers with different peak wavelengths. An example of a tandem light-emitting layer is a white light-emitting pixel formed by stacking a total of four light-emitting layers: blue, yellow-green, red, and blue. A mask vapor deposition method can be used to pattern the light-emitting pixel 11. The mask vapor deposition method is a method of vapor-depositing an organic compound using a vapor deposition mask to form a pattern. Specifically, a method of vapor deposition can be used in which a vapor deposition mask having openings in a desired pattern is used in contact with the substrate. An example of a deposition mask that can be used to form high-definition light-emitting pixels 11 is the deposition mask disclosed in Japanese Patent Application Laid-Open No. 2019-163543.

[0021] The second electrode 12 may be made of any material as long as it functions as a cathode electrode. When the organic EL display device of the present invention is a top-emission organic EL display device, a layer made of an alloy of silver and magnesium can be preferably used as the second electrode 12 because of its high light transmittance and excellent light extraction efficiency. It is preferable to form a thin film so that the layer has a higher light transmittance in the visible range than the first electrode 5 described above. On the other hand, when the organic EL display device is a bottom-emission organic EL display device, a layer made of an aluminum alloy can be preferably used because of its high light reflectivity and excellent light extraction efficiency, and it is preferable to form a thick film so that the layer has a higher light reflectance in the visible range than the first electrode 5 described above. The second electrode 12 can be formed by forming a film over the entire surface using a sputtering method.

[0022] The organic EL display device of the present invention may further include a color filter substrate comprising a substrate and a color filter of at least one color. Specifically, the organic EL display device may include a color filter substrate, the cross section of which is shown in Figure 2, attached to the light extraction side of the TFT substrate in the organic EL display device, the cross section of which is shown in Figure 1. The inclusion of a color filter can improve light resistance, particularly to light in the near-ultraviolet to visible light range, and can improve light emission reliability, particularly when used outdoors. The light extraction side is the light-emitting surface side of the organic EL display device. If the organic EL display device is a bottom-emission type organic EL display device that extracts light emitted from the light-emitting pixels 11 to the substrate side through the substrate 6, the light extraction side is the substrate side. If the organic EL display device is a top-emission type organic EL display device that extracts light to the opposite side of the substrate 6 through the second electrode 12, the light extraction side is the opposite side of the substrate 6. That is, the organic EL display device of the present invention preferably further comprises a color filter on the light extraction side of the light-emitting pixel.

[0023] A green color filter 15, a red color filter 16, and a blue color filter 17 are patterned in the openings of a black matrix 14 disposed on the surface of a substrate 13. The width and shape of the openings in the black matrix 14 may be the same as or different from the width and shape of the openings in layer (A) in FIG. 1. The color filter substrate may be highly flexible and can be easily attached to the surface of the substrate 6 or the surface of the second electrode 12 in FIG. 1 using a thermosetting or near-ultraviolet-curing transparent adhesive. Examples of transparent adhesives include "STRUCTOBOND" (registered trademark) (manufactured by Mitsui Chemicals, Inc.).

[0024] The pixel division layer 10 will be described in detail as follows. The pixel division layer of the organic EL display device of the present invention includes a layer (A) and a layer (B). The layer (A) is a layer disposed on the surface of the first electrode, partially exposing the surface of the first electrode, and the layer (B) is a layer disposed on at least a portion of the surface of the layer (A). That is, the pixel division layer of the organic EL display device of the present invention is a laminated film composed of multiple layers. The layer (A) being a layer disposed on the surface of the first electrode, partially exposing the surface of the first electrode, means that the layer (A) may be a layer disposed only on the surface of the first electrode, or may be a layer disposed on the surface of the first electrode and on a layer other than the first electrode. A specific example of a configuration in which multiple layers form the base of the layer (A) is a configuration in which the layer (A) is a layer disposed on the surface of the first electrode and the surface of the planarizing layer.

[0025] The structure in which the layer (B) is disposed on at least a part of the surface of the layer (A) has the effect of improving the light-emitting reliability of the organic EL display device. The structure in which the layer (B) containing the cured product of the positive photosensitive composition (b) containing a resin and a photoacid generator is laminated makes it possible to obtain desirably high light-emitting reliability regardless of the resolution of the layer (A).

[0026] In this specification, high light-emitting reliability means that the area ratio of light-emitting portions to the area of ​​light-emitting pixel portions of an organic EL display device (pixel light-emitting area ratio) is maintained at a high level, i.e., the occurrence of non-light-emitting portions due to pixel shrinkage is reduced. The higher the light-emitting reliability, the longer the light-emitting life, and the higher the value of the display device, since it can be used for a long period of time while maintaining high brightness. The area of ​​non-light-emitting portions, which tends to progress gradually from the periphery of the light-emitting pixel portion toward the center, tends to increase as the light-emitting pixel size becomes smaller. Furthermore, the smaller the light-emitting pixel size, the lower the area of ​​non-light-emitting portions within 1.0 μm 2 The change in pixel light emitting area ratio per pixel becomes large.

[0027] There are several possible mechanisms by which the technical effects of the present invention are achieved. However, it is believed that at least one of the contributing factors is that layer (B) retains, inside the film of layer (A), compounds having two or more ethylenically unsaturated double bond groups in the molecule, unreacted components and / or decomposition products of the photopolymerization initiator, etc., remaining in the cured product of negative-type photosensitive composition (a), and thereby suppresses their release into the light-emitting device.

[0028] The pixel division layer in which layer (B) is disposed on at least a portion of the surface of layer (A) is not particularly limited, and specific examples of preferred embodiments of the organic EL display device of the present invention are shown in Figures 3 to 7. These different pixel division layer configurations may be mixed within the plane of the display unit of the organic EL display device. The display unit of an organic EL display device refers to the area where, when the organic EL display device is driven, light emitted from the light-emitting pixels is recognized by a user of the organic EL display device on the light extraction side. The content displayed by the display unit is not particularly limited, and examples include text information, images, and videos. On the other hand, decorative parts such as a bezel where no light-emitting pixels are disposed are not included in the display unit.

[0029] The pixel division layer of the organic EL display device of the present invention preferably has a stepped shape and functions as a spacer, which can reduce the contact area between the pixel division layer and a deposition mask when forming light-emitting pixels, thereby preventing chipping and damage and improving production yield.

[0030] The area where the layer (A) and the layer (B) are in contact with each other, i.e., the area where the layer (B) covers the layer (A), is preferably 5% or more, and more preferably 20% or more, of the total surface area of ​​the layer (A) in the display section of the organic EL display device, in order to improve the light-emitting reliability. That is, the organic EL display device of the present invention preferably has a portion in the display section where the area ratio of the surface of the layer (A) covered by the layer (B) is 20 to 100% of the total surface area of ​​the layer (A), which is 100%. The area ratio of the surface of the layer (A) covered by the layer (B) is calculated by dividing the area of ​​the surface of the layer (A) covered by the layer (B) in a randomly selected square area of ​​250 μm length x 250 μm width in the display section, i.e., the area (μm 2 ) is the total surface area (μm 2 ) and then multiplying the result by 100 and rounding off the result to the nearest tenth. The area of ​​the display area, which is 250 μm long and 250 μm wide, is 62,500 μm 2 The value obtained by subtracting the area of ​​the openings of layer (A) formed within the same area of ​​250 μm length x 250 μm width in the display section from the total surface area of ​​layer (A) can be regarded as the total surface area of ​​layer (A).

[0031] The optical density of Layer (A) per 1.0 μm of film thickness is preferably 0.5 or more, more preferably 0.7 or more, in order to improve the effect of suppressing external light reflection and to improve light emission reliability, and is preferably 1.5 or less, more preferably 1.4 or less, in order to improve light emission reliability. That is, the layer (A) contained in the pixel dividing layer of the organic EL display device of the present invention preferably has an optical density (OD / μm) per 1.0 μm of film thickness of 0.5 to 1.5.

[0032] The optical density of the layer (B) per 1.0 μm of film thickness is preferably 0.3 or less, more preferably 0.1 or less, in order to improve the light emission reliability. That is, the layer (B) included in the pixel dividing layer of the organic EL display device of the present invention preferably has an optical density (OD / μm) per 1.0 μm of film thickness of 0.0 to 0.3. The optical density per 1.0 μm of film thickness referred to here means the value obtained by measuring the incident light intensity and the transmitted light intensity using an optical densitometer (X-Rite 361T, manufactured by X-Rite Corporation), calculating the value using the following formula, dividing the result by the film thickness, and rounding the result to one decimal place. A higher optical density indicates a higher light-blocking property.

[0033] Optical density = log 10 (I0 / I) I0: Incident light intensity I: transmitted light intensity In the region where layer (B) is disposed on the surface of layer (A), the maximum film thickness of layer (A) is preferably 0.5 μm or more, more preferably 0.8 μm or more, in order to improve light-shielding properties, and is preferably 3.0 μm or less, more preferably 2.0 μm or less, in order to improve light-emitting reliability.

[0034] In the region where layer (B) is disposed on the surface of layer (A), the maximum film thickness of layer (B) is preferably 0.1 μm or more, more preferably 0.3 μm or more, in order to improve light emission reliability, and is preferably 3.0 μm or less, more preferably 2.0 μm or less, in order to improve light emission reliability. That is, the organic EL display device of the present invention preferably has a region where the layer (B) is disposed on the surface of the layer (A), in which the maximum film thickness of the layer (A) is 0.5 to 3.0 μm and the maximum film thickness of the layer (B) is 0.1 to 3.0 μm. The maximum film thickness of layer (A) and the maximum film thickness of layer (B) referred to here can be calculated by rounding off to one decimal place the measured maximum film thickness of layer (A) and the measured maximum film thickness of layer (B) within a randomly selected area of ​​250 μm length x 250 μm width in the display section of the organic EL display device.

[0035] The film thicknesses of layers (A) and (B) can be measured by observing the cross section of the pixel division layer using a scanning electron microscope (hereinafter referred to as "SEM") and taking images of the observed cross section. If layers (A) and (B) are mixed or welded together at the interface where they meet to form an intermediate layer, the area corresponding to the center of the intermediate layer in the film depth direction can be regarded as the interface between layers (A) and (B), and the film thicknesses of each can be measured. An alternative method to SEM is to use a stylus film thickness measuring device.

[0036] The cross-sectional taper angle of the edge of the pixel division layer at the boundary with the opening of the pixel division layer is preferably 50° or less, more preferably 40° or less, in order to improve the film formability of the second electrode and prevent non-illumination of the light-emitting pixel. It is preferably 15° or more, more preferably 20° or more, in order to improve the light-blocking properties of the edge of the opening of the pixel division layer. From the same viewpoint, it is preferable that both layers are arranged so that the opening width of the opening of layer (A) is the same as or narrower than the opening width of the opening of layer (B). In other words, it is preferable that the edge of the opening of the pixel division layer has the light-blocking properties derived from layer (A).

[0037] In order to improve the light-emitting reliability of the organic EL display device, the layer (A) has an opening area of ​​30.0 μm in which the light-emitting pixels are arranged in the display section. 2 Furthermore, it is preferable that the opening area where the light-emitting pixels are arranged is 260.0 μm or more, because this increases the number of light-emitting pixels that can be arranged per unit area and improves the display quality. 2 It is preferable to have the following openings: That is, in the organic EL display device of the present invention, the layer (A) has an opening area of ​​30.0 to 260.0 μm 2 in which light-emitting pixels are arranged in the display section. 2 It is preferable that the opening is

[0038] The shape of each opening is not particularly limited, and may be, for example, a perfect circle with a diameter of 7 to 18 μm, or a square with a side length of 6 to 16 μm. The smaller the area per light-emitting pixel, the more remarkable the excellent technical effect of the present invention, i.e., high light-emitting reliability.

[0039] In a specific example of an embodiment of the present invention, the display unit has an opening area in which light-emitting pixels are arranged of 30.0 to 260.0 μm 2 8 shows a layer (A) having hole-patterned openings in the range of 30.0 to 260.0 μm 2 FIG. 9 shows a layer (A) having openings in a square pattern within the range.

[0040] Layer (A) contains, as an essential component, a cured product of a negative photosensitive composition (a) containing a pigment and / or dye, a compound having two or more ethylenically unsaturated double bond groups in the molecule, and a photopolymerization initiator. A film containing the cured product is sometimes referred to as a cured film. The content of the cured product of negative photosensitive composition (a) in layer (A) is preferably 99% by weight or more in order to improve light-emitting reliability. The negative photosensitive composition refers to a composition having negative photosensitivity that is patterned by pattern exposure through a negative exposure mask to reduce the alkaline solubility of the exposed areas of the film relative to the alkaline solubility of the unexposed areas, thereby removing the unexposed areas of the film with an alkaline developer to form a pattern.

[0041] Layer (B) contains, as an essential component, a cured product of a positive photosensitive composition (b) containing a resin and a photoacid generator. A film containing the cured product is sometimes referred to as a cured film. The content of the cured product of the positive photosensitive composition (b) in layer (B) is preferably 99% by weight or more in order to improve light-emitting reliability. The positive photosensitive composition refers to a composition having positive photosensitivity that is patterned by pattern exposure through a positive exposure mask to increase the alkaline solubility of the exposed areas of the film relative to the alkaline solubility of the unexposed areas, thereby removing the exposed areas of the film with an alkaline developer to form a pattern.

[0042] Here, the cured product of the negative photosensitive composition (a) means a product obtained by a method including at least a step of heat-treating the negative photosensitive composition (a) for at least 10 minutes at a temperature that results in an actual temperature of 200°C or higher. The cured product of the positive photosensitive composition (b) means a product obtained by a method including at least a step of heat-treating the positive photosensitive composition (b) for at least 10 minutes at a temperature that results in an actual temperature of 200°C or higher.

[0043] Layer (A) contains the cured product of negative-working photosensitive composition (a) as an essential component, and layer (B) contains the cured product of positive-working photosensitive composition (b) as an essential component. However, other components may be contained in each layer as long as the technical effect of the present invention is not impaired. Examples of other components include moisture adsorbed to the cured product of negative-working photosensitive composition (a) or the cured product of positive-working photosensitive composition (b). The total amount of other components in layer (A) or layer (B) is preferably 1 wt % or less.

[0044] The negative photosensitive composition (a) contains a pigment and / or dye. The inclusion of a pigment and / or dye can impart light-blocking properties to the layer (A). Benzodifuranone-based black pigments are preferred as pigments because of their excellent light-blocking properties and luminescence reliability. Benzodifuranone-based black pigments are organic black pigments composed of compounds having one polycyclic structure in the molecule in which two furanone rings are fused to one benzene ring, and examples thereof include bis-oxodihydroindolylene-benzodifuranone described in International Publication No. 2009 / 010521. In particular, in order to improve luminescence reliability, it is preferable that the cured product of the negative photosensitive composition (a) contains a benzodifuranone-based black pigment represented by formula (1) or (2). It is more preferable that the cured product of the negative photosensitive composition (a) contains a benzodifuranone-based black pigment represented by formula (3). Formula (3) is the formula (1) where R 1 ~R 10is a hydrogen atom. Commercially available benzodifuranone black pigments represented by formula (3) include Irgaphor Black (registered trademark) S0100CF and Experimental Black 582 (both manufactured by BASF). To improve the resolution of layer (A), it is preferable that at least a portion of the pigment surface of the benzodifuranone black pigment represented by formula (1) or formula (2) is coated with a coating layer containing silica, a metal oxide, and / or a metal hydroxide. To improve the resolution of layer (A), it is more preferable that the cured product of negative-type photosensitive composition (a) further contains a compound represented by formula (4) or a salt thereof. By incorporating the benzodifuranone black pigment represented by formula (1) or formula (2) into the negative-type photosensitive composition (a), the cured product of the negative-type photosensitive composition (a) can contain the benzodifuranone black pigment represented by formula (1) or formula (2).

[0045] [ka]

[0046] [ka]

[0047] In formula (1) and formula (2), R 1 ~R 10 each independently represents a hydrogen atom, a fluorine atom, an alkyl group having 1 to 12 carbon atoms, a hydroxyl group, or a carboxyl group.

[0048] [ka]

[0049] [ka]

[0050] To improve light-emitting reliability, the cured product of the negative photosensitive composition (a) preferably contains at least one perylene-based organic pigment selected from the group consisting of CI Pigment Red 123, CI Pigment Red 149, CI Pigment Red 178, CI Pigment Red 179, CI Pigment Red 190, CI Pigment Violet 29, and 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole, and more preferably contains 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole. That is, it is more preferable that the cured product of the negative photosensitive composition (a) contained in the layer (A) of the organic EL display device of the present invention further contains 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole. Here, 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole refers to a compound represented by formula (5) in the cis form and a compound represented by formula (6) in the trans form.

[0051] [ka]

[0052] By incorporating the above-mentioned perylene-based organic pigment in the negative photosensitive composition (a), the cured product of the negative photosensitive composition (a) can contain the above-mentioned perylene-based organic pigment.

[0053] Other pigments that may be used in combination include organic pigments such as CI Pigment Yellow 151, 175, 180, 185, and 192, CI Pigment Red 254, 255, and 264, CI Pigment Orange 43, 61, and 72, CI Pigment Blue 15:3, 15:4, 15:6, 25, 26, 60, 65, and 80, and CI Pigment Violet 19, 29, 32, and 37, and inorganic pigments such as carbon black, titanium nitride, and zirconium nitride.

[0054] As the dye, from the viewpoints of solubility in a solvent and developability, oil-soluble dyes and acid dyes are preferred, and examples thereof include red dyes such as CI Solvent Red 46, 72, CI Acid Red 52, 87, 289, and 388, yellow dyes such as CI Solvent Yellow 93, blue dyes such as CI Solvent Blue 35, 45, 97, 104, and 122, and CI Acid Blue 9, 25, 27, 40, 80, 90, 112, 127, 129, and 145, purple dyes such as CI Solvent Violet 9, 13, and 43, and CI Acid Violet 29, 31, 33, 36, 39, 48, 63, and 109, and black dyes such as CI Solvent Black 27, 29, and 34, and CI Acid Black 52. If necessary, the solubility in a solvent may be improved by forming a salt of the acid dye with a basic dye or a cationic component.

[0055] The negative photosensitive composition (a) may contain a pigment and a dye, and the total content thereof is preferably 10 to 50 wt % based on 100 wt % of the solid content of the negative photosensitive composition in order to achieve both the light-blocking properties and resolution of the layer (A). The organic pigments and dyes described above are near-infrared transparent, and enable high-precision automatic alignment of the substrate on which the prebaked film is formed with the exposure mask, i.e., near-infrared alignment, using a near-infrared camera, thereby improving the yield during panel production.

[0056] The negative photosensitive composition (a) contains a compound having two or more ethylenically unsaturated double bond groups in the molecule. The compound having two or more ethylenically unsaturated double bond groups in the molecule undergoes a chain reaction of photocuring reaction due to radical active species generated by a photopolymerization initiator (described later), which reduces the alkali solubility of the film in exposed areas relative to the alkali solubility of the film in unexposed areas, thereby enabling pattern formation by negative photolithography. Specific examples include "KAYARAD" (registered trademark) DPHA, DPCA-20, DPCA-30, DPCA-60, DPCA-120, ZAR-1494H, ZAR-2001H, ZFR-1491H, ZCR-1569H, ZCR-1797H, ZCR-1798H, ZCR-1761H, CCR-1171H, CCR-1291H, CCR-1307H, and CCR-1309H (all manufactured by Nippon Kayaku Co., Ltd.), and "Light Acrylates" (registered trademark). Examples of suitable epoxy resins include "OGSOL" (registered trademark) BP-4EAL and BP-4PA (all manufactured by Kyoeisha Chemical Co., Ltd.), "OGSOL" (registered trademark) EA-0200, EA-0250P, EA-0300, and CR-1030 (all manufactured by Osaka Gas Chemicals Co., Ltd.), an alkali-soluble epoxy acrylate resin containing an unsaturated double bond group having a structural unit represented by formula (7), and an alkali-soluble polyimide precursor containing an unsaturated double bond group having a structural unit represented by formula (8). These may be used alone or in combination. Note that a compound having two or more ethylenically unsaturated double bond groups in the molecule and corresponding to the alkali-soluble resin described below is defined as a component belonging to the group of compounds having two or more ethylenically unsaturated double bond groups in the molecule.

[0057] The content of the compound having two or more ethylenically unsaturated double bond groups in the molecule is preferably 10 to 60% by weight based on 100% by weight of the solid content of the negative photosensitive composition, in order to achieve both good adhesion and high resolution of the film in the development step.

[0058] [ka]

[0059] In formula (7), R 34 , R 35 each independently represents a hydrogen atom or a methyl group. * represents the bonding site to a carbon atom.

[0060] [ka]

[0061] In formula (8), R 36 R represents a tetravalent organic group containing an aromatic ring or a cycloaliphatic ring. 37 R represents a trivalent organic group containing an aromatic ring or a cycloaliphatic ring. 38 represents an alkylene group having 1 to 5 carbon atoms. 39 represents a hydrogen atom or a methyl group. * represents a bonding site.

[0062] The negative-tone photosensitive composition (a) contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited as long as it is a compound that generates radically active species upon exposure to near-ultraviolet light. Examples of photopolymerization initiators include oxime ester-based photopolymerization initiators, alkylphenone-based photopolymerization initiators, and acylphosphine oxide-based photopolymerization initiators. Among these, oxime ester-based photopolymerization initiators are preferred for improving film adhesion in the development process. Examples include "ADEKA CRUISE" (registered trademark) NCI-831E and N-1919T (all manufactured by ADEKA Corporation), "Irgacure" (registered trademark) OXE01, OXE02, OXE03, and OXE04, and compounds represented by formula (9). The content of the photopolymerization initiator is preferably 1 to 10 wt % based on 100 wt % of the solid content of the negative-tone photosensitive composition to achieve both film adhesion and resolution in the development process.

[0063] [ka]

[0064] The negative-working photosensitive composition (a) preferably further contains an alkali-soluble resin to improve the resolution of the layer (A). The alkali-soluble resin here refers to a resin whose dissolution rate in the film depth direction is 50 nm / min or greater, as determined by the film loss after applying a solution of the resin dissolved in γ-butyrolactone to the surface of a silicon wafer, prebaking for 4 minutes on a hot plate at 120°C, forming a prebaked film with a thickness of 10±0.5 μm, immersing the prebaked film in an alkaline developer (2.38 wt % tetramethylammonium hydroxide solution at 23±1°C) for 1 minute, and then rinsing with pure water at 23±1°C for 10 seconds. The resin refers to a compound with a weight-average molecular weight (Mw) of 1000 or greater and a polymer chain consisting of repeating structural units.

[0065] Examples of alkali-soluble resins include alkali-soluble phenolic resins, alkali-soluble (meth)acrylic resins, alkali-soluble polyhydroxystyrenes, alkali-soluble polyimides, alkali-soluble polyimide precursors, alkali-soluble polybenzoxazoles, alkali-soluble polybenzoxazole precursors, alkali-soluble polysiloxanes, and alkali-soluble polyamines. These may be used alone or in combination. The alkali-soluble polyimide precursor referred to here means a resin that is converted into a polyimide by forming imide bonds through heat treatment, and specific examples include polyamic acids and polyamic acid esters.

[0066] Among these, in order to reduce the cross-sectional taper angle of the edge of layer (A) and improve resolution, it is preferable to contain an alkali-soluble phenolic resin, an alkali-soluble (meth)acrylic resin, and / or an alkali-soluble polyimide. Furthermore, it is preferable to contain an alkali-soluble polyamine as a pigment dispersant. (Meth)acrylic resin refers to a methacrylic resin or an acrylic resin. Examples of alkali-soluble phenolic resins include novolac-type phenolic resins, resol-type phenolic resins, and novolac-type phenolic resins having a polymer chain made of polyhydroxystyrene, as described in JP 2010-106278 A, and can be synthesized by known methods. They can be obtained by reacting a compound having a phenol skeleton, such as phenol, o-cresol, m-cresol, p-cresol, 2,5-xylenol, or 3,5-xylenol, with an aldehyde compound, such as formaldehyde or benzaldehyde, in the presence of an acidic or basic catalyst. Examples of commercially available products include TRR5030G, TRR5010G, TR4020G, TR4080G, TR4000B, TRM30B20G, and EP23F10G (all manufactured by Asahi Organic Chemicals Co., Ltd.).

[0067] Preferred examples of alkali-soluble polyamines include resins having two or more tertiary amino groups in the molecule, as described in Patent Document 1. Preferred examples of alkali-soluble polyimides include resins having a structural unit represented by the formula (10) described below.

[0068] The negative photosensitive composition (a) may further contain a solvent. The inclusion of a solvent can adjust the viscosity and thixotropy of the negative photosensitive composition, thereby improving the thickness uniformity of the coating film. Examples of preferred solvents include propylene glycol monomethyl ether (hereinafter referred to as PGME), propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA"), 3-methoxybutyl acetate (hereinafter referred to as "MBA"), methyl lactate, ethyl lactate, γ-butyrolactone, valerolactone, and ε-caprolactone. From the viewpoint of storage stability, the water content of 100 parts by weight of the negative photosensitive composition (a) is preferably 0.01 to 0.5 parts by weight. A leveling agent composed of a nonionic surfactant may be added to achieve higher thickness uniformity.

[0069] To improve light-emitting reliability, the cured product of the negative-type photosensitive composition (a) contained in the layer (A) preferably contains silica particles having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis / minor axis) of 1.0 to 1.5. The term "silica particles" as used herein refers to particles with a pure SiO content of 90% or more by weight (excluding water), particles made of silicon dioxide (anhydrous silicic acid), particles made of silicon dioxide hydrate (hydrated silicic acid, white carbon), or particles made of quartz glass. It also encompasses particles made of orthosilicic acid, metasilicic acid, and / or metadisilicic acid. The particle structure is not particularly limited, and may have internal voids. The aspect ratio as used herein refers to the value obtained by dividing the major axis of a silica particle by the minor axis, rounded to one decimal place. An aspect ratio of 1.0 can be considered to be a spherical silica particle. By incorporating silica particles having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis / minor axis) of 1.0 to 1.5 or a dispersion containing such particles into the negative photosensitive composition (a), the silica particles can be incorporated into the cured product of the negative photosensitive composition (a).

[0070] Commercially available dispersions containing silica particles with a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis / minor axis) of 1.0 to 1.5 include MEK-ST-40 and MEK-ST-L (both manufactured by Nissan Chemical Industries, Ltd.). The primary particle diameter and aspect ratio can be measured by using a thin section of the pixel dividing layer as an observation sample, polishing the cross section by ion milling to enhance smoothness, and observing a region located 0.2 to 0.8 μm deep from the outermost layer of the pixel dividing layer using a transmission electron microscope (TEM) at 50,000x magnification. The image can then be measured using an image analysis particle size distribution analyzer called "Mac-View" (manufactured by MOUNTECH). Furthermore, silica particles can be identified by distinguishing the elements that make up the particles using energy dispersive X-ray spectroscopy (TEM-EDX).

[0071] The negative photosensitive composition (a) may further contain a thermal crosslinking agent. Higher light emission reliability may be achieved by adding an appropriate amount of the thermal crosslinking agent within a range that does not impair resolution. The thermal crosslinking agent is preferably a compound having two or more epoxy groups, and specific examples include TEPIC-L, TEPIC-S, and TEPIC-PAS (all manufactured by Nissan Chemical Industries, Ltd.), NC-3000, XD-1000, and XD-1000H (all manufactured by Nippon Kayaku Co., Ltd.).

[0072] The positive photosensitive composition (b) contains a resin, which is not particularly limited, but may be, for example, the alkali-soluble resin described above.

[0073] To obtain high light-emitting reliability, it is preferable that the cured product of the positive-type photosensitive composition (b) contained in layer (B) contains a resin having an imide bond and / or a benzoxazole skeleton. By incorporating a resin having an imide bond and / or a benzoxazole skeleton or a precursor thereof into the positive-type photosensitive composition (b), the cured product of the positive-type photosensitive composition (b) can contain a resin having an imide bond and / or a benzoxazole skeleton. From the above perspectives, among the above-mentioned alkali-soluble resins, it is preferable that the positive-type photosensitive composition (b) contains an alkali-soluble polyimide, an alkali-soluble polyimide precursor, an alkali-soluble polybenzoxazole, an alkali-soluble polybenzoxazole precursor, and / or a copolymer thereof. It is more preferable that the positive-type photosensitive composition (b) contains a resin having a structural unit represented by formula (10) and / or a structural unit represented by formula (11).

[0074] [ka]

[0075] In formula (10), R 11 represents a tetravalent to decavalent organic group. 12 represents a divalent to octavalent organic group. 13 and R 14 each independently represents a phenolic hydroxyl group or a carboxyl group, and may be a single group or a mixture of different groups. p and q are integers, each independently representing 0 to 6, provided that p+q>0 is satisfied. * represents a bonding site.

[0076] [ka]

[0077] In formula (11), R 15 and R 16 represents a divalent to octavalent organic group. 17 and R 18each independently represents a hydroxyl group, a carboxyl group, or COOA, and may be a single group or a mixture of different groups. A represents a monovalent hydrocarbon group having 1 to 10 carbon atoms. r and s are integers, each independently representing 0 to 6, provided that r+s>2 is satisfied. * represents a bonding site.

[0078] In formula (11), examples of the monovalent hydrocarbon group A having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group, a phenyl group, and a benzyl group.

[0079] The weight average molecular weight (Mw) of the resin having the structural unit represented by formula (10) and / or the structural unit represented by formula (11) is preferably 10,000 or more and 50,000 or less in order to improve the resolution.

[0080] In formula (10), R 11 -(R 13 )p represents a residue of an acid dianhydride. 11is preferably an organic group having 5 to 40 carbon atoms containing an aromatic ring or a cyclic aliphatic group. Examples of the residue of the acid dianhydride include pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,3,3',4'-biphenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, 1,1-bis(3,4-dicarboxyphenyl)ethane dianhydride, 1,1-bis(2,3-dicarboxyphenyl)ethane dianhydride, bis(3,4-dicarboxyphenyl)ethane dianhydride, Examples of the dianhydride include residues of aromatic tetracarboxylic acid dianhydrides such as 9,9-bis(3,4-dicarboxyphenyl)methane dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)ether dianhydride, 1,2,5,6-naphthalenetetracarboxylic acid dianhydride, 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride, 9,9-bis{4-(3,4-dicarboxyphenoxy)phenyl}fluorene dianhydride, and residues of acid dianhydrides having a structure represented by formula (12); and residues of aliphatic tetracarboxylic acid dianhydrides such as residues of butanetetracarboxylic acid dianhydride and 1,2,3,4-cyclopentanetetracarboxylic acid dianhydride.

[0081] [ka]

[0082] In formula (12), R 19 represents a single bond, an oxygen atom, C(CF3)2, C(CH3)2, or SO2. 20 and R 21 each independently represents a hydrogen atom or a hydroxyl group.

[0083] In formula (11), R 15 -(R 17 )r represents the residue of an acid. 15is preferably an organic group having 5 to 40 carbon atoms and containing an aromatic ring or a cycloaliphatic group.

[0084] Examples of acid residues include residues of dicarboxylic acids, tricarboxylic acids, and tetracarboxylic acids. Examples of dicarboxylic acids include terephthalic acid, isophthalic acid, diphenyl ether dicarboxylic acid, bis(carboxyphenyl)hexafluoropropane, biphenyl dicarboxylic acid, benzophenone dicarboxylic acid, and triphenyl dicarboxylic acid. Examples of tricarboxylic acids include residues of trimellitic acid, trimesic acid, diphenyl ether tricarboxylic acid, and biphenyl tricarboxylic acid. The residues of tetracarboxylic acids include pyromellitic acid, 3,3',4,4'-biphenyltetracarboxylic acid, 2,3,3',4'-biphenyltetracarboxylic acid, 2,2',3,3'-biphenyltetracarboxylic acid, 3,3',4,4'-benzophenonetetracarboxylic acid, 2,2',3,3'-benzophenonetetracarboxylic acid, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane, 2,2-bis(2,3-dicarboxyphenyl)hexafluoropropane, 1,1-bis(3,4-dicarboxyphenyl)ethane, 1,1-bis(2,3 Examples of the tetracarboxylic acid residues include residues of aromatic tetracarboxylic acids such as residues of 1,2,5,6-naphthalenetetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid, 2,3,5,6-pyridinetetracarboxylic acid, and 3,4,9,10-perylenetetracarboxylic acid, and residues of aliphatic tetracarboxylic acids such as residues of butanetetracarboxylic acid and 1,2,3,4-cyclopentanetetracarboxylic acid.

[0085] R in equation (10) 12 -(R 14 )q and R in formula (11) 16 -(R 18 )s represents a residue of a diamine. 12 and R 16is preferably an organic group having 5 to 40 carbon atoms and containing an aromatic ring or a cycloaliphatic group.

[0086] Examples of the diamine residue include 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 1,4-bis(4-aminophenoxy)benzene, m-phenylenediamine, p-phenylenediamine, 1,5-naphthalenediamine, 2,6-naphthalenediamine, bis(4-aminophenoxy)biphenyl, bis{4-(4-aminophenoxy)phenyl}ether, 1,4-bis(4-aminophenoxy)benzene, 2, Examples of the compound include residues of 2'-dimethyl-4,4'-diaminobiphenyl, 2,2'-diethyl-4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminobiphenyl, 3,3'-diethyl-4,4'-diaminobiphenyl, 9-bis(4-aminophenyl)fluorene, and compounds in which at least a portion of the hydrogen atoms in these aromatic rings have been substituted with alkyl groups or halogen atoms, as well as residues of compounds represented by formula (13), formula (14), formula (15), and formula (16).

[0087] [ka]

[0088] In formula (13), R 22 represents a single bond, an oxygen atom, C(CF3)2, C(CH3)2, or SO2. 23 and R 24 each independently represents a hydrogen atom or a hydroxyl group.

[0089] [ka]

[0090] In formula (14), R 25 represents a single bond, an oxygen atom, C(CF3)2, C(CH3)2, or SO2. 26and R 27 each independently represents a hydrogen atom or a hydroxyl group.

[0091] [ka]

[0092] In formula (15), R 28 , R 29 , R 30 and R 31 each independently represents a hydrogen atom or a hydroxyl group.

[0093] [ka]

[0094] In formula (16), R 32 and R 33 each independently represents a hydrogen atom or a hydroxyl group.

[0095] Furthermore, by capping the ends of these resins with monoamines, it becomes easier to adjust the weight average molecular weight (Mw) during synthesis, and the storage stability of the resin as an alkali-soluble resin can be improved.

[0096] Examples of monoamines include 1-hydroxy-4-aminonaphthalene, 2-hydroxy-7-aminonaphthalene, 2-hydroxy-6-aminonaphthalene, 2-hydroxy-5-aminonaphthalene, 1-carboxy-7-aminonaphthalene, 1-carboxy-6-aminonaphthalene, 1-carboxy-5-aminonaphthalene, 2-carboxy-7-aminonaphthalene, 2-carboxy-6-aminonaphthalene, 2-aminophenol, 3-aminophenol, and 4-aminophenol.

[0097] In formula (11), the group represented by COOA can be obtained by converting the carboxyl group with an esterifying agent, such as N,N-dimethylformamide dimethyl acetal or N,N-dimethylformamide diethyl acetal.

[0098] Resins having a structural unit represented by formula (10) and / or a structural unit represented by formula (11) can be obtained by known methods, and can be synthesized by the methods disclosed in, for example, Japanese Patent No. 4341293, International Publication No. 2014 / 097992, and International Publication No. 2019 / 181782.

[0099] In order to improve the light emission reliability, the content of the resin is preferably 50 to 90% by weight based on 100% by weight of the solid content of the positive photosensitive composition (b).

[0100] The positive photosensitive composition (b) contains a photoacid generator. The photoacid generator is not particularly limited as long as it is a compound that decomposes upon irradiation with near-ultraviolet light and generates an acid. The generated acid has the effect of increasing the alkaline solubility of the film in exposed areas relative to the alkaline solubility of the film in unexposed areas, making it possible to form a pattern by positive photolithography. Examples of the acid that can be generated include indenecarboxylic acid, methanesulfonic acid, ethanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, and naphthalenesulfonic acid.

[0101] Examples of photoacid generators include quinone diazide compounds, imide sulfonate compounds, and oxime sulfonate compounds. Among them, quinone diazide compounds that generate carboxylic acid and / or sulfonic acid as acids upon irradiation with near-ultraviolet light are preferred in terms of improving light-emitting reliability. Examples of quinone diazide compounds include 4-naphthoquinone diazide sulfonyl ester compounds, which are compounds obtained by an esterification reaction between a compound having a phenolic hydroxyl group and 1,2-naphthoquinone-2-diazide-4-sulfonyl chloride (hereinafter sometimes referred to as "4-naphthoquinone diazide sulfonyl chloride"); 5-naphthoquinone diazide sulfonyl ester compounds, which are compounds obtained by an esterification reaction between a compound having a phenolic hydroxyl group and 1,2-naphthoquinone-2-diazide-5-sulfonyl chloride (hereinafter sometimes referred to as "5-naphthoquinone diazide sulfonyl chloride"); and naphthoquinone diazide sulfonic acid derivatives described in JP 2019-174793 A. Examples of compounds having a phenolic hydroxyl group include TrisP-HAP, TrisP-PA, TekP-4HBPA, TrisP-SA, TrisOCR-PA, BisP-AP, BisP-NO, BisP-PR, BisP-B, BisP-DE, BisP-DP, BisP-DP, BisRS-2P, BisRS-3P, and BisP-DEK (all manufactured by Honshu Chemical Industry Co., Ltd.). Commercially available 5-naphthoquinone diazide sulfonyl ester compounds include 4NT-250 and 4NT-300 (manufactured by Toyo Gosei Co., Ltd.). The content of the photoacid generator is preferably 1 to 40 wt % based on 100 wt % of the solid content of the positive photosensitive composition (b) in order to improve exposure sensitivity.

[0102] The positive photosensitive composition (b) may further contain a thermal crosslinking agent. By containing a thermal crosslinking agent, better light emission reliability can be obtained. As the thermal crosslinking agent, a compound having two or more alkoxyalkyl groups in the molecule is preferred. Examples of the alkoxyalkyl group include a methoxymethyl group, an ethoxymethyl group, a propoxymethyl group, and a butoxymethyl group. Preferred examples of the compound having two or more alkoxymethyl groups in the molecule include a compound represented by formula (17), a compound represented by formula (18), and a compound represented by formula (19).

[0103] [ka]

[0104] [ka]

[0105] The positive photosensitive composition (b) may further contain the above-mentioned solvent. By containing a solvent, the viscosity, thixotropy, etc. of the positive photosensitive composition can be adjusted, and the thickness uniformity of the coating film can be improved.

[0106] The organic EL display device of the present invention may contain a pigment and / or dye in layer (B) similarly to layer (A) within the scope that does not impair the effects of the present invention. However, in order to obtain high luminescence reliability, the total content of the pigment and dye is preferably 5 parts by weight or less, more preferably 0 part by weight, per 100 parts by weight of layer (B). That is, the organic EL display device of the present invention is an organic EL display device comprising, in this order, a substrate, a planarizing layer, a first electrode, a pixel dividing layer, a light-emitting pixel, and a second electrode, wherein the pixel dividing layer includes a layer (A) and a layer (B), wherein the layer (A) is a layer disposed on the surface of the first electrode so as to partially expose the surface of the first electrode, and the layer (B) is a layer disposed on at least a part of the surface of the layer (A), the layer (A) containing a cured product of a negative-type photosensitive composition (a) containing a pigment and / or dye, a compound having two or more ethylenically unsaturated double bond groups in the molecule, and a photopolymerization initiator, the layer (B) containing a cured product of a positive-type photosensitive composition (b) containing a resin and a photoacid generator, and the total content of the pigment and / or dye in the layer (B) is preferably 5 parts by weight or less per 100 parts by weight of the layer (B).

[0107] A method for forming the layer (A) using the negative photosensitive composition (a) preferably includes the following steps: a coating step of applying the negative photosensitive composition (a) to obtain a coating film; an exposure step of patternwise exposing the composition to actinic radiation including near-ultraviolet rays through a negative exposure mask to obtain an exposed film having exposed areas and unexposed areas within its surface; a development step of developing the composition using an alkaline developer to obtain a developed film; and a curing step of thermally curing the composition by heating to obtain a cured film.

[0108] A method for forming the layer (B) using the positive photosensitive composition (b) preferably includes the following steps: a coating step of applying the positive photosensitive composition (b) to obtain a coating film; an exposure step of patternwise exposing the composition to actinic rays including near-ultraviolet rays through a positive exposure mask to obtain an exposed film having exposed and unexposed areas within its surface; a development step of developing the composition using an alkaline developer to obtain a developed film; and a curing step of thermally curing the composition by heating to obtain a cured film.

[0109] As the coating device used in the coating step, a spin coater or slit coater is preferably used because of its excellent thin film coating properties. After coating, pin gap pre-baking or contact pre-baking may be performed. The pre-baking temperature is preferably 50 to 150°C, and the pre-baking time is preferably 30 seconds to 5 minutes.

[0110] Examples of exposure equipment used in the exposure process include steppers, mirror projection mask aligners (MPA), and parallel light mask aligners (PLA). Examples of actinic radiation, including near-ultraviolet radiation, used during exposure include the j-line (wavelength 313 nm), i-line (wavelength 365 nm), h-line (wavelength 405 nm), or g-line (wavelength 436 nm) from a mercury lamp. Preferably, the i-line or a mixture of g-line, h-line, and i-line is used. Examples of negative and positive exposure masks include a mask in which a near-ultraviolet-transmitting portion of a substrate, such as glass, quartz, or film, is coated on one side with a pattern of light-shielding portions made of a metal such as chromium. By allowing only the openings to transmit actinic radiation for pattern exposure, an exposed film having exposed and unexposed regions within its surface can be obtained. Alternatively, pattern exposure can be performed using a halftone exposure mask having fully transmitting and semi-transmitting portions within its surface, which have different transmittances for actinic radiation, to simultaneously form convex thick film portions, thereby providing spacer functionality to at least a portion of the pixel dividing layer.

[0111] Examples of the development method used in the development step include showering, dipping, and puddling, and examples of the method include immersing the exposed film for 10 seconds to 3 minutes. The puddling method is preferred to improve the in-plane uniformity of the opening width of the opening. The alkaline developer is preferably a 1.0 to 2.5 wt % aqueous solution of tetramethylammonium hydroxide (hereinafter referred to as TMAH), and a commercially available product is 2.38 wt % aqueous TMAH solution (manufactured by Tama Chemicals Co., Ltd.). After the development step, a washing treatment using a shower of deionized water and / or a water removal treatment using an air jet may be performed.

[0112] In the curing step, the developed film is thermally cured by heating, and at the same time, moisture, the developer, etc. are evaporated. Examples of heating devices include a hot air oven and an IR oven. The heating temperature is preferably 200 to 350°C under atmospheric pressure, and more preferably 220 to 280°C.

[0113] A method for preparing a pigment-containing negative photosensitive composition (a) includes preparing a pigment dispersion by wet dispersion treatment, then mixing a compound having two or more ethylenically unsaturated double bond groups in the molecule with a photopolymerization initiator, and optionally other ingredients such as a solvent, and then adding the mixture to the pigment dispersion, mixing and stirring, and optionally filtering through a filter. For wet dispersion treatment, a wet media disperser such as a bead mill is preferred because of its excellent dispersion processing speed, strong disintegration power, and economical advantages. The cumulative 50% particle diameters of the pigment in the pigment dispersion and in the negative photosensitive composition (a) prepared therefrom are preferably 20 nm or more, more preferably 40 nm or more, in order to improve light emission reliability. From the same perspective, they are preferably 100 nm or less, more preferably 80 nm or less. The cumulative 50% particle diameter refers to the particle diameter corresponding to the cumulative 50% in the cumulative particle diameter distribution curve based on the light scattering intensity from a light source (a semiconductor-pumped solid-state laser with a wavelength of 532 nm / 10 mW). The cumulative 50% particle size can be calculated using the dynamic light scattering particle size distribution analyzer "SZ-100" with the smallest particle size as the base point (0%). In order to improve the luminescence reliability, the maximum particle size is preferably 400 nm or less, and more preferably 300 nm or less. On the other hand, the method for preparing the dye-containing negative photosensitive composition (a) does not require the wet dispersion treatment step described above, and the composition may be prepared in the same manner as in the case of incorporating a pigment, except for the step of adding and dissolving the dye in a resin or a resin solution.

[0114] The positive photosensitive composition (b) can be prepared by mixing and stirring a resin, a photoacid generator, and, if necessary, other components such as a solvent, and filtering the mixture using a filter, if necessary. [Example]

[0115] The present invention will be described in detail below with reference to examples and comparative examples, but the aspects of the present invention are not limited to these. First, the evaluation methods used in the examples and comparative examples will be described.

[0116] <Measurement of Optimum Exposure Amount (A) of Negative Photosensitive Composition When Forming Layer (A)> A first electrode-forming substrate having a first electrode made of a laminated pattern of silver alloy film / low-crystalline ITO was produced in the same manner as in Example 1 described below.

[0117] The negative photosensitive composition was applied to the ITO surface of the first electrode-forming substrate using a spin coater, adjusting the rotation speed so that the final cured film would have the desired film thickness, to obtain a coating film. The coating film was then prebaked at 110°C under atmospheric pressure for 120 seconds using a hot plate to obtain a prebaked film. The negative square pattern exposure mask was aligned using a near-infrared camera, and a double-sided alignment single-sided exposure device was used to expose the negative square pattern exposure mask (1,000 square light-shielding areas, each 7.0 μm long and 7.0 μm wide) to an exposure dose of 10 to 100 mJ (mJ / cm). 2The exposure dose was varied in 5 mJ increments within the range of 1000 nm (i-line equivalent), and a pattern of mixed g, h, and i rays from an ultra-high pressure mercury lamp was used to expose the prebaked film. This resulted in an exposed film with exposed and unexposed areas within the film. The pattern exposure was performed by contacting a negative square pattern exposure mask with the surface of the prebaked film. The film was then developed using a small photolithography developing device (AD-2000; manufactured by Takizawa Sangyo Co., Ltd.) using a puddle method with a 2.38 wt% aqueous solution of TMAH, an alkaline developer. The puddle method refers to a 10-second shower application of the developer onto the exposed film surface, followed by allowing the substrate to stand for the required development time. The development time was calculated by multiplying the time it takes for the unexposed film to dissolve and be removed in the film depth direction by 1.5. The substrate was then rinsed with deionized water for 30 seconds using a shower, and then dried at 200 rpm for 30 seconds, yielding a substrate with a patterned developed film. The developed film was then heated in an air atmosphere at 250°C for 1 hour using a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo Systems Co., Ltd.) to obtain a cured film containing a cured product of the negative photosensitive composition. The cured film was observed using an FPD inspection microscope (MX-61L; manufactured by Olympus Corporation), and the minimum exposure dose (mJ / cm) was determined when the average opening width of 10 openings in each exposure dose region was opened so that the bias relative to the width of the light-shielding portion of the exposure mask was within ±0.1µm (i.e., 7.0±0.1µm). 2 The optimum exposure dose (A) of the negative photosensitive composition used to form the layer (A) was determined as follows: i-line equivalent value.

[0118] <Measurement of Optimum Exposure Amount (B) of Positive Photosensitive Composition When Forming Layer (B)> A positive photosensitive composition was applied to the surface of the cured film containing the cured product of the negative photosensitive composition obtained with the above-mentioned optimal exposure dose using a spin coater, adjusting the rotation speed so that the final cured film would have the desired thickness, to obtain a coated film. The coated film was then prebaked at 110°C under atmospheric pressure for 120 seconds using a hot plate to obtain a prebaked film. The positive square pattern exposure mask was aligned using a near-infrared camera, and a double-sided alignment single-sided exposure device was used to expose the film to an exposure dose of 50 to 150 mJ (mJ / cm) through a positive square pattern exposure mask (1,000 square transparent areas, vertical width: 7.0 μm, horizontal width: 7.0 μm). 2 The exposure dose was changed stepwise in 5 mJ increments within the range of 1000 Hz (equivalent to the i-ray value), and the pattern was exposed to a mixture of g, h, and i rays from an ultra-high pressure mercury lamp to obtain an exposed film having exposed and unexposed areas within the surface. The pattern exposure was performed by contacting a positive square pattern exposure mask with the surface of the prebaked film.

[0119] Next, using a small photolithography developing device, the substrate was developed for 80 seconds using a puddle method with a 2.38 wt% TMAH aqueous solution. The thicknesses of the prebaked film and the developed film of the positive photosensitive composition were calculated from the difference between the thickness of the laminated film and the thickness of the cured film containing the cured product of the negative photosensitive composition. The substrate was then rinsed with deionized water for 30 seconds using a shower method, and then dried by rotating at 200 rpm for 30 seconds to obtain a developed film-formed substrate having a patterned developed film. The developed film was then heated in a high-temperature inert gas oven at 250°C for 1 hour in an air atmosphere to obtain a cured film containing the cured product of the positive photosensitive composition. The cured film was observed using an FPD inspection microscope, and the minimum exposure dose (mJ / cm) was calculated when the average opening width of 10 openings in each exposure dose region was opened so that the bias relative to the width of the transparent portion of the exposure mask was within ±0.1 μm (i.e., 7.0 ± 0.1 μm). 2 The optimum exposure dose (B) of the positive photosensitive composition used to form the layer (B) was determined as follows: i-line equivalent value.

[0120] <Measurement of Optimum Exposure Amount (A) of Positive-Working Photosensitive Composition in Forming Layer (A) and Optimum Exposure Amount (B) of Negative-Working Photosensitive Composition in Forming Layer (B)> When a cured film containing a cured product of a negative photosensitive composition was formed on the surface of a cured film containing a cured product of a positive photosensitive composition, the order of the above-mentioned pattern formation was reversed, and the optimum exposure dose (A) of the positive photosensitive composition used to form the layer (A) and the optimum exposure dose (B) of the negative photosensitive composition used to form the layer (B) were measured in this order.

[0121] <Measurement of Optimum Exposure Amount (B) of Negative-Working Photosensitive Composition When Forming Layer (B)> When a cured film containing a cured product of a negative photosensitive composition is formed on the surface of a cured film containing a cured product of a negative photosensitive composition, the optimum exposure dose (B) of the negative photosensitive composition used to form the layer (B) was measured in the same manner as the optimum exposure dose (A) of the negative photosensitive composition used to form the layer (A).

[0122] In measuring the optimal exposure dose using a negative or positive square pattern exposure mask for the various configurations described above, if the opening shape of the cured film was not square, the short side of the opening was considered to be the opening width, and the average opening width of 10 openings in each exposure dose region was calculated to determine the optimal exposure dose (A) and optimal exposure dose (B). However, cured films containing openings with an aspect ratio of 1.1 or greater were excluded from the measurement. The aspect ratio here refers to the value obtained by dividing the length of the long side of the opening (μm) by the length of the short side (μm), rounded to one decimal place. The film thickness of the cured film was determined by observing the cross-sections of the film corresponding to layers (A) and (B) using an SEM and measuring the respective lengths based on the images.

[0123] The optimal exposure dose was measured using a negative or positive hole pattern exposure mask in the same manner as the optimal exposure dose measured using a negative or positive square pattern exposure mask. The diameter of the openings in the cured film was considered to be the opening width when the opening was circular, and the minor axis of the openings when the opening was elliptical. The average opening widths of 10 openings in each exposure dose region were calculated to determine the optimal exposure dose (A) and optimal exposure dose (B). However, cured films containing openings with an aspect ratio of 1.1 or more were excluded from the measurement. The aspect ratio here refers to the value obtained by dividing the major axis length (μm) of the opening by the minor axis length (μm), rounded to one decimal place.

[0124] (1) Evaluation of the optical density (OD / μm) of the cured film For the substrates for optical density evaluation obtained in Examples 1 to 11 on which a cured film with a thickness of 1.5 μm was formed, the total optical density (total OD value) was measured at three locations on the film surface using an optical densitometer (X-Rite 361T, manufactured by X-Rite Corporation), and the average value was calculated. The average value was divided by 1.5, and the value was rounded to one decimal place to obtain the OD value per 1.0 μm of cured film thickness (OD / μm). Evaluation was based on the criterion that the higher the OD / μm, the better the light-blocking property of the cured film. The OD value of Tempax without a cured film was separately measured and found to be 0.00, so the OD value of the substrate for optical density evaluation was considered to be the OD value of the cured film. The thickness of the cured film was determined by rounding to one decimal place the average value measured at three locations on the surface using a stylus film thickness measuring device (Tokyo Seimitsu Co., Ltd.). Note that if the aforementioned optimal exposure dose could not be measured due to insufficient resolution, it was deemed impossible to evaluate.

[0125] (2) Evaluation of the display resolution of organic EL display devices The organic EL display devices obtained in Examples 1 to 15, Comparative Examples 1 and 2, and Comparative Examples 4 to 14 were placed with the light-emitting surface facing upward and irradiated with 10 mA / cm 2The organic EL display device was left standing at room temperature while emitting light by DC drive, and the light-emitting pixel located in the center of the light-emitting pixel was enlarged and displayed on a monitor and measured. If the average minor axis (diameter if the pixel was a perfect circle, or minor axis if the pixel was elliptical) of 20 light-emitting pixel sections was less than 20.0 μm, the organic EL display device had excellent resolution and was judged to have passed. On the other hand, if it was 20.0 μm or more, the organic EL display device had insufficient resolution and was judged to have failed. Furthermore, if one or more unlit pixels were observed, the organic EL display device was judged to have failed, regardless of resolution.

[0126] (3) Evaluation of the light-emitting reliability of organic EL displays (high-temperature continuous driving test) The organic EL display devices obtained in Examples 1 to 12, Comparative Examples 1 and 2, and Comparative Examples 4 to 11 were placed with the light-emitting surface facing up on a hot plate maintained at a temperature of 85°C, and a current of 10 mA / cm 2 The device was left to emit light by DC driving at 1000 kJ / s. Twenty light-emitting pixels located in the center of the light-emitting pixel area were enlarged and observed on a monitor, and the area ratio of the light-emitting portion to the area of ​​the light-emitting pixel area (pixel light-emitting area ratio) was measured 1 hour and 200 hours after the start of driving. Pixel shrinkage (non-light-emitting areas) is unlikely to occur, and the higher the pixel light-emitting area ratio is maintained after 200 hours, based on the pixel light-emitting area ratio after 1 hour, the more reliable the light-emitting reliability is. Figure 10 shows an example of layer (A), light-emitting areas, and non-light-emitting areas when observing a light-emitting pixel area. The evaluation was based on the following criteria, with AA and A to C being considered acceptable, and D to F being considered unacceptable. Note that if an opening having the desired opening width could not be formed in the measurement of the optimum exposure dose described above, it would be difficult to give a fair evaluation, and therefore the evaluation was given as F. AA: The pixel light-emitting area ratio is 95% or more. A: The pixel light-emitting area ratio is 90% or more and less than 95%. B: The pixel light-emitting area ratio is 85% or more and less than 90%. C: The pixel light-emitting area ratio is 80% or more and less than 85%. D: The pixel light-emitting area ratio is 75% or more and less than 80%. E: The pixel light-emitting area ratio is less than 75%. F: It is difficult to evaluate the pixel luminous area ratio due to insufficient resolution.

[0127] (4) Evaluation of the light-emitting reliability of organic EL display devices (light resistance test) The organic EL display devices obtained in Examples 13 to 15 and Comparative Examples 12 to 14 were placed with the light-emitting surface facing upward and irradiated with 10 mA / cm 2 The display unit of the organic EL display device was kept in the emitting state, and the display was irradiated with a wavelength of 420 nm and an illuminance of 3.0 W / cm using a xenon lamp as a light source for simulated sunlight containing near-ultraviolet rays. 2 The light was continuously irradiated at 20 ... AA: The pixel light-emitting area ratio is 95% or more. A: The pixel light-emitting area ratio is 90% or more and less than 95%. B: The pixel light-emitting area ratio is 85% or more and less than 90%. C: The pixel light-emitting area ratio is 80% or more and less than 85%. D: The pixel light-emitting area ratio is 75% or more and less than 80%. E: The pixel light-emitting area ratio is less than 75%. F: It is difficult to evaluate the pixel luminous area ratio due to insufficient resolution.

[0128] Below is information about the various raw materials used in the examples and comparative examples. "Benzodifuranone-based black pigment A": A black pigment consisting of 100 parts by weight of a benzodifuranone-based black pigment represented by formula (3) as a core and 10 parts by weight of silica as a coating material. This corresponds to benzodifuranone-based black pigment 2 described in Synthesis Example 3 of Patent Document 1 (WO 2021 / 111860), which has a silica coating layer on its surface. Specific surface area measured by the BET method: 40 m 2 / g. "CI Pigment Red 179": "PALIOGEN" (registered trademark) RED L3875 (manufactured by BASF) was used as a commercially available product. "CI Pigment Violet 29": "PALIOGEN" (registered trademark) REDVIOLET K5411 (manufactured by BASF) was used as a commercially available product. "Pigment Dispersant 1": A compound represented by formula (20). Alkali-soluble polyamine (solid content 100% by weight). Corresponds to Dispersant 5 described in Patent Document 1 (WO 2021 / 111860).

[0129] [ka]

[0130] "TR4020G": Novolac type phenolic resin, an alkali-soluble phenolic resin that does not have an ethylenically unsaturated double bond group. Solid content: 100% by weight (manufactured by Asahi Organic Chemicals Co., Ltd.). "ZCR-1569H": PGMEA solution of alkali-soluble epoxy acrylate with a biphenyl skeleton. Solid content 70% by weight (manufactured by Nippon Kayaku Co., Ltd.). A compound with two or more ethylenically unsaturated double bond groups in the molecule. "DPCA-20": "KAYARAD" (registered trademark) DPCA-20 (manufactured by Nippon Kayaku Co., Ltd.). A compound having six ethylenically unsaturated double bond groups in the molecule. Solid content: 100% by weight. "DPCA-60": "KAYARAD" (registered trademark) DPCA-60 (manufactured by Nippon Kayaku Co., Ltd.). A compound having six ethylenically unsaturated double bond groups in the molecule. Solid content: 100% by weight. "EA-0250P": "OGSOL" (registered trademark) EA-0250P (manufactured by Osaka Gas Chemicals Co., Ltd.). A compound having two ethylenically unsaturated double bond groups in the molecule. A PGMEA solution with a solid content of 50% by weight. "BP-4EAL": "Light Acrylate" (registered trademark) BP-4EAL (manufactured by Kyoeisha Chemical Co., Ltd.). A compound having two ethylenically unsaturated double bond groups in the molecule. Solid content: 100% by weight. "Photopolymerization initiator 1": a compound represented by formula (21). This is the same compound as the compound represented by structural formula (31) described in Patent Document 1 (WO 2021 / 111860).

[0131] [ka]

[0132] "MEK-ST-40": A silica particle dispersion (manufactured by Nissan Chemical Industries, Ltd.) containing silica particles with a primary particle size distribution of 10 to 15 nm and an aspect ratio of 1.0 to 1.1, and an average primary particle size of 12 nm. The silica particle content is 40% by weight, the solid content is 40% by weight, and the solvent is methyl ethyl ketone. "HMOM-TPHAP": a compound represented by formula (17) (manufactured by Honshu Chemical Industry Co., Ltd.) (Synthesis Example 1: Synthesis of hydroxyl group-containing diamine compound A) 18.3 g (0.05 mol) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane was dissolved in 100 mL of acetone and 17.4 g (0.3 mol) of propylene oxide and cooled to -15°C. A solution of 0.11 mol (20.4 g) of 3-nitrobenzoyl chloride dissolved in 100 mL of acetone was added dropwise. After the addition was complete, the reaction was allowed to proceed at -15°C for 4 hours and then returned to room temperature. The precipitated white solid was filtered and dried under vacuum at 50°C. 30 g of the solid was placed in a 300 mL stainless steel autoclave and dispersed in 250 mL of methyl cellosolve. 2 g of 5% palladium-carbon was added. Hydrogen was introduced via a balloon, and the reduction reaction was carried out at room temperature. After approximately 2 hours, the reaction was terminated by confirming that the balloon was no longer deflating. After the reaction was completed, the catalyst palladium compound was removed by filtration, and the mixture was concentrated by a rotary evaporator to obtain a hydroxyl group-containing diamine compound A represented by formula (22).

[0133] [ka]

[0134] (Synthesis Example 2: Synthesis of alkali-soluble polyimide precursor A) Under a dry nitrogen stream, 31.0 g (0.10 mol) of 3,3',4,4'-diphenylethertetracarboxylic dianhydride was dissolved in 500 g of N-methylpyrrolidone (hereinafter abbreviated as "NMP") as a solvent. 45.35 g (0.075 mol) of hydroxyl group-containing diamine compound A obtained in Synthesis Example 1 and 1.24 g (0.005 mol) of 1,3-bis(3-aminopropyl)tetramethyldisiloxane were added together with 50 g of NMP, and the mixture was reacted at 20 °C for 1 hour, followed by 2 hours at 50 °C. 4.36 g (0.04 mol) of 4-aminophenol as an end-capping agent was added together with 5 g of NMP, and the mixture was reacted at 50 °C for 2 hours. Then, 50 g of 28.6 g (0.24 mol) of N,N-dimethylformamide dimethyl acetal was added. After the addition, the mixture was stirred at 50°C for 3 hours. After stirring was completed, the solution was cooled to room temperature and then added to 3 L of water to obtain a white precipitate. The above procedure was repeated five times, and the resulting white precipitate was collected as a filter cake, washed five times with water, and then dried in a vacuum dryer at 80°C for 24 hours to obtain alkali-soluble polyimide precursor A. Alkali-soluble polyimide precursor A was in the form of a powder with a solid content of 100% by weight, had a weight-average molecular weight (Mw) of 25,000, and was a resin having a structural unit represented by formula (11).

[0135] (Synthesis Example 3: Synthesis of alkali-soluble polyimide B) Under a dry nitrogen stream, 58.60 g (0.16 mol) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane and 8.73 g (0.08 mol) of 3-aminophenol as an end-capping agent were dissolved in 300.00 g of NMP. To this solution, 62.04 g (0.20 mol) of 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride was added along with 100.00 g of NMP. The mixture was stirred at 20°C for 1 hour and then at 50°C for 4 hours. Then, 15 g of xylene was added, and the mixture was stirred at 150°C for 5 hours while azeotropically distilling water with the xylene. After stirring, the solution was poured into 5 L of water and a white precipitate was collected. The precipitate was collected by filtration, washed three times with water, and then dried in a vacuum dryer at 80°C for 24 hours to obtain alkali-soluble polyimide B. The alkali-soluble polyimide B is in the form of powder with a solid content of 100% by weight, has a weight-average molecular weight (Mw) of 28,000, and is a resin having a structural unit represented by formula (10).

[0136] (Synthesis Example 4: Synthesis of quinone diazide compound C) Under a dry nitrogen stream, 21.22 g (0.05 mol) of TrisP-PA (Honshu Chemical Industry Co., Ltd.) and 36.27 g (0.135 mol) of 5-naphthoquinone diazide sulfonyl chloride were dissolved in 450 g of 1,4-dioxane and the solution was allowed to cool to room temperature. To this solution, 15.18 g of triethylamine dissolved in 50.00 g of 1,4-dioxane was added dropwise so that the system temperature remained below 35°C. After the addition, the mixture was stirred at 30°C for 2 hours. The triethylamine salt was filtered, and the filtrate was poured into water. The precipitate was then filtered and collected. The precipitate was dried in a vacuum dryer to obtain quinone diazide compound C represented by formula (23).

[0137] [ka]

[0138] In formula (23), * represents the bonding site with the oxygen atom.

[0139] (Synthesis Example 5: Synthesis of Alkali-Soluble Methacrylic Resin Solution D) A mixed solution of 65.07 g of 2-hydroxyethyl methacrylate (0.50 mol), 211.45 g of benzyl methacrylate (1.20 mol), 25.83 g of methacrylic acid (0.30 mol), 5.00 g of 2,2'-azobis(isobutyronitrile) as a thermal polymerization initiator, and 200.00 g of PGMEA was prepared. This mixture was added dropwise over 1 hour using a funnel to 261.02 g of PGMEA, which was stirred and maintained at 90°C under a dry nitrogen stream. The solution was then heated to 120°C and maintained there. The copolymerization was continued with stirring until the weight-average molecular weight (Mw) of the resulting copolymer reached 8,000, yielding a resin solution. The resulting solution was cooled to 25°C and diluted with PGMEA to a solids content of 30 wt% to yield alkali-soluble methacrylic resin solution D. Alkali-soluble methacrylic resin solution D is a PGMEA solution containing a copolymer composed of 2-hydroxyethyl methacrylate / benzyl methacrylate / methacrylic acid in a mol % ratio of 25 / 60 / 15.

[0140] (Synthesis Example 6: Synthesis of Alkali-Soluble Acrylic Resin Solution E) Under a dry nitrogen stream, a mixture of 72.10 g of 4-hydroxybutyl acrylate (0.50 mol), 92.15 g of 2-ethylhexyl acrylate (0.50 mol), 1.47 g of acrylic acid (0.02 mol), and 8.16 g of polymerization initiator t-butylperoxy-2-ethylhexanoate was added dropwise over 1 hour to 260.83 g of PGMEA while stirring and maintaining the liquid temperature at 120 ° C. The mixture was stirred at 120 ° C. until the weight average molecular weight of the resulting copolymer reached 10,000, resulting in a resin solution. After cooling to 25 ° C., the mixture was diluted with PGMEA to a solids content of 30 wt % to obtain alkali-soluble acrylic resin solution E. Alkali-soluble acrylic resin solution E is a PGMEA solution containing a copolymer composed of 4-hydroxybutyl acrylate:2-ethylhexyl acrylate:acrylic acid in a mol % ratio of 49:49:2.

[0141] (Synthesis Example 7: Synthesis of fluorene acrylate solution F) A flask was charged with 400.00 g of methyl isobutyl ketone solvent, followed by 350.00 g of 9,9-bis(6-glycidyloxy-2-naphthyl)fluorene, 112.10 g of acrylic acid, 1.50 g of methoquinone (a polymerization inhibitor), and 0.30 g of tetraethylammonium bromide (a catalyst). The mixture was stirred at 120 °C for 10 hours, after which the reaction was stopped and cooled to room temperature. The reaction mixture was washed with water by liquid separation and then dried under reduced pressure to obtain fluorene acrylate (compound represented by formula (24):compound represented by formula (25) = mol% ratio 91:9). Next, PGMEA was added to the mixture to obtain a solids content of 30 wt% and stirred to obtain fluorene acrylate solution F.

[0142] [ka]

[0143] [ka]

[0144] (Synthesis Example 8: Synthesis of fluorene acrylate solution G) A flask was charged with 200.00 g of PGMEA, and 275.33 g (0.50 mol) of a fluorene compound represented by formula (26) (manufactured by Osaka Gas Chemicals Co., Ltd.), 72.06 g of acrylic acid (1.00 mol), 0.50 g of methoquinone, and 0.15 g of tetraethylammonium bromide were added thereto, and the mixture was stirred for 2 hours while maintaining the liquid temperature at 100° C. The liquid temperature was then raised to 120° C., and the mixture was reacted for 10 hours while stirring.

[0145] [ka]

[0146] Furthermore, 96.10 g (0.25 mol) of the acid dianhydride represented by formula (27) synthesized according to Example 1 of WO 2011 / 099518 was added and the mixture was stirred for 5 hours to react. 30.43 g (0.20 mol) of 1,2,3,6-tetrahydrophthalic anhydride was added and the mixture was stirred at 90°C for 5 hours, after which heating was stopped and the mixture was cooled to room temperature.

[0147] [ka]

[0148] Next, PGMEA was added to the mixture so that the solid content was 30% by weight, and the mixture was stirred to obtain a fluorene acrylate solution G containing an alkali-soluble epoxy acrylate having a structural unit represented by formula (28).

[0149] [ka]

[0150] In formula (28), * indicates a binding site.

[0151] (Production Example 1: Production of Pigment Dispersion Liquid 1) 37.50 g of pigment dispersant 1 and 53.57 g of ZCR-1569H (solids content 70.00 wt%) were mixed with 783.93 g of PGMEA solvent and stirred for 10 minutes. Then, 125.00 g of benzodifuranone-based black pigment A was added and stirred for 30 minutes to obtain a pre-mixed solution. The pre-mixed solution was sent to a bead mill filled with 0.4 mm diameter zirconia beads (Toray Industries, Inc., "Treceram"®) and subjected to a wet media dispersion treatment using a circulation system for 30 minutes. The solution was then sent to a bead mill filled with 0.05 mm diameter zirconia beads (Toray Industries, Inc., "Treceram"®) and subjected to a wet media dispersion treatment using a circulation system until the cumulative 50% particle size in the pigment particle size distribution reached 99 nm, obtaining pigment dispersion 1 with a solids content of 20.00 wt%. The blend weight (g) of each raw material, cumulative 50% particle size, and maximum particle size are shown in Table 1. The cumulative 50% particle size and maximum particle size were measured by adding 99.90 g of PGMEA to 0.10 g of each pigment dispersion sampled at each dispersion time and diluting it, and setting the measurement sample in the particle size distribution analyzer "SZ-100" (manufactured by Horiba, Ltd.). The cumulative 50% particle size was automatically output to determine the endpoint of the wet media dispersion process. The maximum particle size was also determined as the largest particle size detected in the particle size distribution.

[0152] [Table 1]

[0153] (Production Example 2: Production of Pigment Dispersion Liquid 2) Wet media dispersion treatment was carried out in the same manner as in Production Example 1, except that the dispersion time was extended using a circulation system until the cumulative 50% particle size in the pigment particle size distribution reached 60 nm, thereby obtaining pigment dispersion liquid 2 with a solid content of 20.00 wt %. The blend weight (g), cumulative 50% particle size, and maximum particle size of each raw material are shown in Table 1.

[0154] (Production Example 3: Production of Pigment Dispersion 3) Wet media dispersion treatment was carried out in the same manner as in Production Example 1, except that CI Pigment Red 179 was used instead of benzodifuranone black pigment A, and the dispersion time was extended using a circulation system until the cumulative 50% particle size in the pigment particle size distribution reached 60 nm, thereby obtaining pigment dispersion liquid 3 with a solids content of 20.00 wt %. The blend weight (g), cumulative 50% particle size, and maximum particle size of each raw material are shown in Table 1.

[0155] (Production Example 4: Production of Pigment Dispersion Liquid 4) Wet media dispersion treatment was carried out in the same manner as in Production Example 1, except that CI Pigment Violet 29 was used instead of benzodifuranone black pigment A, and the dispersion time was extended using a circulation system until the cumulative 50% particle size in the pigment particle size distribution reached 60 nm, thereby obtaining pigment dispersion liquid 4 with a solids content of 20.00 wt %. The blend weight (g), cumulative 50% particle size, and maximum particle size of each raw material are shown in Table 1.

[0156] (Production Example 5: Production of Pigment Dispersion Liquid 5) (a) Preparation of perylene-based dark purple pigment B 1,000.00 g of "Spectrasense (registered trademark)" Black K0087 (manufactured by BASF) was heated in an oven at 250°C under atmospheric pressure / air for 1 hour, cooled to room temperature, and then deagglomerated in a ball mill to obtain a dark purple pigment.

[0157] 500.00 g of dark purple pigment was mixed with 2.5 kg of grinding agent (sodium chloride particles) and 250.00 g of dipropylene glycol, and the mixture was placed in a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho) and kneaded for 8 hours at 90°C. This mixture was added to 5 L of warm water and stirred for 1 hour while maintaining the temperature at 70°C to form a slurry. The grinding agent and dipropylene glycol were then removed by repeated filtration and water washing. The mixture was then dried in an oven at 100°C under atmospheric pressure / air for 6 hours, after which the dried aggregates were deagglomerated in a ball mill to obtain a perylene-based dark purple pigment B consisting of an isomer mixture of 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole, a compound represented by formula (5), and a compound represented by formula (6).

[0158] (b) Preparation of Perylene-Based Pigment Dispersant C 50.00 g of CI Pigment Red 178, a perylene-based organic pigment, was dissolved in 500.00 g of 80 wt % concentrated sulfuric acid, heated, and stirred at 70°C for 6 hours to allow the sulfonation reaction to proceed. The resulting mixture was then poured into 5 kg of ice water to obtain a slurry containing a precipitate, which was then filtered. The filtered product was then washed with ethanol and then with water, and dried under reduced pressure at 80°C for 24 hours. The resulting mixture was then subjected to a dry pulverization process using a Nanojetmizer (manufactured by Aisin Nano Technologies Co., Ltd.) to obtain perylene-based pigment-type dispersant C, which is a mixture of monosulfonic acid, disulfonic acid, and trisulfonic acid and is represented by formula (29).

[0159] [ka]

[0160] (c) Preparation of Pigment Dispersion 5 Pigment dispersion 5 with a solids content of 20.00 wt % was obtained by wet media dispersion treatment in the same manner as in Production Example 1, except that perylene-based dark purple pigment B, perylene-based dye-type dispersant C, and fluorene acrylate solution G as the dispersing resin were used in the amounts of each raw material shown in Table 1. The cumulative 50% particle size and maximum particle size are shown in Table 1.

[0161] (Production Example 6: Production of Pigment Dispersion Liquid 6) We attempted wet media dispersion processing using the same method as in Production Example 1, except that perylene-based dark purple pigment B was used instead of benzodifuranone-based black pigment A. However, a significant increase in viscosity occurred before the cumulative 50% particle size in the pigment particle size distribution reached 99 nm, causing the internal pressure of the pump to rise and making it difficult to send the liquid to the bead mill, and it was therefore not possible to obtain pigment dispersion 6. Table 1 shows the blending amounts of each raw material.

[0162] (Production Example 7: Production of Pigment Dispersion Liquid 7) 142.22 g of acrylic dispersant "DISPERBYK®" 2001 (manufactured by BYK Japan K.K.; solids content: 45 wt. % solution) was added to 721.78 g of mixed solvent (PGME:PGMEA = weight ratio 20:80) and stirred for 10 minutes. Next, 94.00 g of CI Pigment Green 59 (manufactured by DIC Corporation) and 42.00 g of CI Pigment Yellow 150 (manufactured by LANXESS AG) were mixed and stirred for 30 minutes to obtain a pre-mixed solution. The pre-mixed solution was sent to a bead mill filled with 0.4 mm diameter zirconia beads ("Treceram®" manufactured by Toray Industries, Inc.) and subjected to wet media dispersion treatment using a circulation system for 5 hours to obtain Pigment Dispersion Solution 7 with a solids content of 20.00 wt. %.

[0163] (Preparation Example 1: Preparation of Positive Photosensitive Composition 1) Under yellow light, 7.50 g of alkali-soluble polyimide precursor A, 2.25 g of quinone diazide compound C, and 5.25 g of thermal crosslinker HMOM-TPHAP were added to 85.00 g of a mixed solvent (PGME: ethyl lactate: γ-butyrolactone = weight ratio 50:40:10) and stirred for 30 minutes to dissolve, yielding a positive-type photosensitive composition 1 with a solids content of 15.00 wt %. The blend weights of each raw material are shown in Table 2.

[0164] [Table 2]

[0165] (Preparation Examples 2 and 3: Preparation of Positive Photosensitive Compositions 2 and 3) Positive-type photosensitive compositions 2 and 3 were prepared in the same manner as in Preparation Example 1, except that alkali-soluble polyimide B or alkali-soluble phenolic resin TR4020G (manufactured by Asahi Organic Chemicals Co., Ltd.) was used instead of alkali-soluble polyimide precursor A. The blend weights of each raw material are shown in Table 2.

[0166] (Preparation Example 4: Preparation of Negative Photosensitive Composition 1) Under yellow light, 0.60 g of photopolymerization initiator 1 was added to a mixed solvent of 8.50 g of MBA and 43.03 g of PGMEA and stirred for 3 minutes to dissolve. To this, 3.15 g of ZCR-1569H and 10.00 g of alkali-soluble methacrylic resin solution D were added. Next, 0.75 g of DPCA-60 (manufactured by Nippon Kayaku Co., Ltd.) and 3.90 g of EA-0250P (PGMEA solution with a solids content of 50% by weight, manufactured by Osaka Gas Chemicals Co., Ltd.) were added. Furthermore, 0.60 g of TEPIC-L (manufactured by Nissan Chemical Industries, Ltd.), a thermal crosslinker, was added and stirred for 10 minutes to obtain a prepared solution. This prepared solution was mixed with 29.48 g of pigment dispersion 1 and stirred for 30 minutes to obtain negative-type photosensitive composition 1 with a solids content of 15.00% by weight. The amount (g) of each raw material is shown in Table 3.

[0167] [Table 3]

[0168] (Preparation Example 5: Preparation of Negative Photosensitive Composition 2) Under yellow light, 0.60 g of NCI-831E was added to a mixed solvent of 4.25 g of MBA and 42.21 g of PGMEA and stirred for 3 minutes to dissolve. To this, 4.29 g of ZCR-1569H and 2.00 g of alkali-soluble acrylic resin solution E were added. Next, 0.75 g of DPCA-20, 2.40 g of EA-0250P, and 0.75 g of "Light Acrylate" (registered trademark) BP-4EAL (Kyoeisha Chemical Co., Ltd.) were added. Furthermore, 3.00 g of a 5 wt% solids solution of Emulgen A-60 in PGMEA was added and stirred for 10 minutes to obtain a formulation. This formulation was mixed with 39.75 g of pigment dispersion 1 and stirred for 30 minutes to obtain negative-tone photosensitive composition 2 with a solids content of 15.00 wt%. The amount (g) of each raw material is shown in Table 3. The 5 wt % PGMEA solution of Emulgen A-60 was prepared by dissolving 5 parts by weight of "Emulgen" (registered trademark) A-60 (manufactured by Kao Corporation), a nonionic surfactant, in 95 parts by weight of PGMEA.

[0169] Preparation Example 6: Preparation of Negative Photosensitive Composition 3 Under yellow light, 0.60 g of the photopolymerization initiator "Irgacure" (registered trademark) OXE03 ("OXE03" in Table 4) was added to a mixed solvent of 8.50 g of MBA and 39.94 g of PGMEA and stirred for 3 minutes to dissolve. To this mixture, 11.00 g of alkali-soluble methacrylic resin solution D and 1.60 g of alkali-soluble phenolic resin TR4020G were added. Next, 0.75 g of DPCA-60, 7.50 g of fluorene acrylate solution F, and 0.60 g of TEPIC-L were added. Furthermore, 0.03 g of a 5 wt % PGMEA solution of BYK-333 (manufactured by BYK Japan Co., Ltd.), a silicone leveling agent, was added and stirred for 10 minutes to obtain a formulation. This preparation and 29.48 g of Pigment Dispersion Liquid 2 were mixed and stirred for 30 minutes to obtain Negative Photosensitive Composition 3 with a solid content of 15.00 wt %. Table 4 shows the amount (g) of each raw material added.

[0170] [Table 4]

[0171] (Preparation Examples 7 to 9: Preparation of Negative Photosensitive Compositions 4 to 6) Furthermore, negative photosensitive compositions 4 to 6 with a solid content of 15.00 wt % were obtained using the same procedures as in Preparation Example 6, except that MEK-ST-40 or pigment dispersions 3 to 4 were used, with the blending amounts (g) of each raw material shown in Table 4.

[0172] Preparation Example 10: Preparation of Negative Photosensitive Composition 7 Under yellow light, 1.20 g of CI Solvent Blue 97 (an anthraquinone dye), 0.60 g of CI Solvent Yellow 93 (a methine dye), and 1.20 g of CI Acid Red 52 (a xanthene dye) were added to 67.55 g of a mixed solvent (PGME:PGMEA:γ-butyrolactone = 30:60:10 weight ratio) and stirred for 2 hours. Next, 0.60 g of "Irgacure"® OXE03 ("OXE03" in Table 5) was added and dissolved by stirring for 3 minutes. To this mixture, 1.71 g of ZCR-1569H, 16.65 g of alkali-soluble methacrylic resin solution D, and 1.60 g of TR4020G were added. Next, 0.75 g of DPCA-60, 7.50 g of fluorene acrylate solution F, and 0.60 g of TEPIC-L were added. Furthermore, 0.03 g of a 5 wt % PGMEA solution of BYK-333, a silicon-based leveling agent, was added, and the mixture was stirred for 30 minutes to obtain negative-type photosensitive composition 7 with a solids content of 15.00 wt %. The blending amounts (g) of each raw material are shown in Table 5.

[0173] [Table 5]

[0174] Preparation Example 11: Preparation of Negative Photosensitive Composition 8 Negative-type photosensitive composition 8 having a solids content of 15.00 wt % was obtained in the same manner as in Preparation Example 4, except that alkali-soluble polyimide B was used instead of alkali-soluble methacrylic resin solution D, and the blending amounts (g) of each raw material shown in Table 6 were used.

[0175] [Table 6]

[0176] Preparation Example 12: Preparation of Negative Photosensitive Composition 9 Negative-type photosensitive composition 9 having a solids content of 15.00 wt % was obtained in the same manner as in Preparation Example 4, except that pigment dispersion liquid 1 and EA-0250P were not used, and the blending amounts (g) of each raw material shown in Table 6 were used.

[0177] Preparation Example 13: Preparation of Negative Photosensitive Composition 10 A negative photosensitive composition 10 having a solids content of 15.00 wt % was obtained in the same manner as in Preparation Example 4, except that pigment dispersion 5 was used instead of pigment dispersion 1 and fluorene acrylate solution F was used instead of EA-0250P, and the blending amounts (g) of each raw material shown in Table 6 were used.

[0178] Preparation Example 14: Preparation of negative photosensitive green composition for color filter Under yellow light, in 34.26 g of mixed solvent (PGME:PGMEA = weight ratio 20:80), 0.60 g of "Irgacure" (registered trademark) OXE03 was added and stirred for 5 minutes to dissolve. Furthermore, 31.71 g of alkali-soluble methacrylic resin solution D and 4.00 g of DPCA-60 were added and stirred for 10 minutes to obtain a prepared solution. This prepared solution was mixed with 29.43 g of pigment dispersion 7 and stirred for 30 minutes to obtain a negative photosensitive green composition for color filters with a solids content of 20.00 wt %.

[0179] Example 1 Negative-type photosensitive composition 1 was applied to the surface of a transparent glass substrate, "Tempax" (manufactured by AGC Technoglass Co., Ltd.), using a spin coater, adjusting the rotation speed so that the final thickness of the cured film would be 1.5 μm, to obtain a coating film. The coating film was prebaked at 110°C under atmospheric pressure for 120 seconds using a hot plate (SCW-636; manufactured by Dainippon Screen Mfg. Co., Ltd.) to obtain a prebaked film. Using a double-sided alignment single-sided exposure device, the optimal exposure dose was determined by the above-mentioned method using the g, h, and i mixed rays of an ultra-high pressure mercury lamp. The entire surface of the prebaked film was irradiated with light (A) to obtain an exposed film. The film was then developed, rinsed, and dried in the same manner as in the measurement of the optimal exposure dose (A), yielding a solid developed film. The developed film was heated in an air atmosphere at 250°C for 1 hour using a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo Systems Co., Ltd.) to obtain a substrate for optical density evaluation with a solid cured film having a film thickness of 1.5 μm. The optical density (OD / μm) per 1.0 μm of film thickness of the cured product of negative-type photosensitive composition 1 was evaluated using the method described above.

[0180] Next, a substrate for optical density evaluation having a solid cured film with a thickness of 1.5 μm was obtained using the same method as in the measurement of the optimal exposure dose (B), except that positive photosensitive composition 1 was used instead of negative photosensitive composition 1, no exposure was performed, and the development time was the same as in the measurement of the optimal exposure dose (B) described above.The optical density per 1.0 μm of film thickness (OD / μm) of the cured product of positive photosensitive composition 1 was evaluated using the same method.The evaluation results are shown in Table 7.Furthermore, a substrate in which the same cured film was formed on a silicon wafer instead of a transparent glass substrate was analyzed by infrared absorption spectroscopy, and it was confirmed that the cured product of positive photosensitive composition 1 had an imide bond and a benzoxazole skeleton.

[0181] Furthermore, an organic EL display device having a pixel dividing layer was fabricated by the following method: Figure 11 shows the fabrication process of an organic EL display device, including the step of forming a pixel dividing layer.

[0182] The positive photosensitive composition 1 was applied to the surface of a 100 mm long x 100 mm wide alkali-free glass substrate 55 using a spin coater, adjusting the rotation speed so that the final planarization layer would have a thickness of 1.0 μm, to obtain a coating film. The coating film was then prebaked at 110°C under atmospheric pressure for 120 seconds using a hot plate to obtain a prebaked film. Using a double-sided alignment single-sided exposure device, the coating was exposed to light at an exposure dose of 100 mJ / cm through a positive square pattern exposure mask (having one square light-shielding area in the center, 30 mm long and 30 mm wide). 2 The prebaked film was exposed to a pattern using a 2.38 wt % TMAH aqueous solution to obtain an exposed film. The exposed film was developed for 60 seconds using a 2.38 wt % TMAH aqueous solution, rinsed for 30 seconds using deionized water, and then dried with an air blower to obtain a patterned developed film. The developed film was heated in an air atmosphere at 250°C for 1 hour using a high-temperature inert gas oven to obtain a square planarization layer 56 with a vertical width of 30 mm and a horizontal width of 30 mm.

[0183] Next, a silver alloy (an alloy consisting of 99.00 wt. % silver and 1.00 wt. % copper) was formed over the entire surface by sputtering. Using the patterned cured film of the positive-type photosensitive composition 3 as an etching resist film, the substrate was immersed in a silver alloy etching solution SEA-1 at a liquid temperature of 30°C and etched to obtain a patterned silver alloy film with a thickness of 50 nm. Furthermore, an ITO film was formed over the entire surface by sputtering. Using the positive-type photosensitive composition 3 as a resist film, the substrate was immersed in a 5 wt. % oxalic acid aqueous solution at a liquid temperature of 50°C for 5 minutes, shower-washed with deionized water for 2 minutes, and then dried with an air blower to obtain a patterned ITO film with a thickness of 10 nm. Through the above steps, a first electrode-forming substrate having a first electrode 57 consisting of a laminated pattern of a silver alloy film and an ITO film was obtained.

[0184] Negative photosensitive composition 1 was applied to the surface of a first electrode-forming substrate using a spin coater, adjusting the rotation speed so that the final thickness of the layer (A) was 1.5 μm, to obtain a coating film. The coating film was then prebaked at 110°C for 120 seconds under atmospheric pressure using a hot plate to obtain a prebaked film. Using a double-sided alignment single-sided exposure device, the prebaked film was pattern-exposed through a negative square pattern exposure mask (arranged with 1,000 square light-shielding areas, each 7.0 μm long and 7.0 μm wide) at the optimal exposure dose (A) determined by the method described above to obtain an exposed film. The pattern exposure was performed by contacting the negative square pattern exposure mask with the surface of the prebaked film. The film was then developed, rinsed, and dried in the same manner as in the measurement of the optimal exposure dose (A), to obtain a patterned developed film. The developed film was heated in an air atmosphere at 250° C. for 1 hour using a high-temperature inert gas oven to obtain a layer (A) containing a cured product of negative photosensitive composition 1 and having a thickness of 1.5 μm.

[0185] The positive photosensitive composition 1 was applied to the surface of layer (B) using a spin coater, adjusting the rotation speed so that the final thickness of layer (B) was 0.3 μm, to obtain a coating film. The coating film was then prebaked at 110°C for 120 seconds under atmospheric pressure using a hot plate to obtain a prebaked film. A positive square pattern exposure mask was aligned using a near-infrared camera, and the prebaked film was pattern-exposed using a double-sided alignment single-sided exposure device through a positive square pattern exposure mask (1,000 square transparent areas, vertical width: 7.0 μm, horizontal width: 7.0 μm) at the optimal exposure dose (B) determined by the above-mentioned method to obtain an exposed film. The pattern exposure was performed by contacting the positive square pattern exposure mask with the surface of the prebaked film. The film was then developed, rinsed, and dried in the same manner as in the measurement of the optimal exposure dose (B), to obtain a patterned developed film. The developed film was heated in an air atmosphere at 250° C. for 1 hour using a high-temperature inert gas oven to obtain a layer (B) containing a cured product of the positive-type photosensitive composition 1 and having a thickness of 0.3 μm.

[0186] As a result, a pixel division layer-forming substrate was obtained, which had 1,000 openings with an opening width of 7.0 μm within an area of ​​30 mm vertically and 30 mm horizontally in the center of the first electrode-forming substrate, and which included a pixel division layer 58 in which layer (B) was disposed on the surface of layer (A). In the pixel division layer 58, in the portion where layer (B) was disposed on the surface of layer (A), the maximum film thickness of layer (A) was 1.5 μm, and the maximum film thickness of layer (B) was 0.3 μm. The area ratio of layer (B) covering the surface of layer (A) was 100% of the total surface area of ​​layer (A) (Figure 3). For the portion where the second electrode 60 (described later) was not formed, the film thickness after the formation of layer (A) and the film thickness after the formation of layer (B) were measured at three locations within the surface using a stylus film thickness measuring device (Tokyo Seimitsu Co., Ltd.; Surfcom), and the average value was rounded to one decimal place to determine the film thickness of layer (A) and the sum of the film thicknesses of layer (A) and layer (B). The film thickness of layer (B) was determined by subtracting the film thickness of layer (A) from the sum of the film thicknesses of layer (A) and layer (B). Separately, the maximum film thickness of layer (A) was determined by rounding to one decimal place of the maximum film thickness measured at the three locations within the surface. The maximum film thickness of layer (B) was determined by subtracting the minimum film thickness of layer (A) from the maximum sum of the film thicknesses of layer (A) and layer (B).

[0187] Next, the organic EL layer 59 including the light-emitting layer is formed in the opening of the pixel dividing layer 58 by vacuum deposition under a vacuum of 1×10 -3 Under evaporation conditions of 0.1 Pa or less, the pixel dividing layer forming substrate was rotated relative to the evaporation source. First, a 10 nm thick film of compound (HT-1) represented by formula (30) was formed as a hole injection layer, and a 50 nm thick film of compound (HT-2) represented by formula (31) was formed as a hole transport layer. Next, a 40 nm thick film of compound (GH-1) represented by formula (32) was evaporated onto the emitting layer as a host material, and a 40 nm thick film of compound (GD-1) represented by formula (33) was evaporated onto the emitting layer. Next, a 1:1 volume ratio of compound (ET-1) represented by formula (34) and compound (LiQ) represented by formula (35) were laminated as electron transport materials to a thickness of 40 nm.

[0188] [ka]

[0189] [ka]

[0190] [ka]

[0191] [ka]

[0192] [ka]

[0193] [ka]

[0194] Next, a 2-nm thick compound (LiQ) was vapor-deposited, followed by a 150-nm thick layer of a silver-magnesium alloy (volume ratio: 10:1) to form the second electrode 60. The substrate was then sealed by attaching a cap-shaped glass plate using an epoxy resin adhesive under a low-humidity nitrogen atmosphere, resulting in an organic EL display device with an array of green light-emitting pixels. Because the layers constituting the organic EL layer 59 are significantly thinner than the pixel dividing layer described above, each was measured using a quartz crystal oscillator film thickness monitor, which is suitable for thin films less than 100 nm thick. The film thickness was determined by rounding the average of three in-plane measurements to one decimal place. The organic EL display devices fabricated by the above procedure were evaluated for light emission reliability (high-temperature continuous driving test) using the method described above. The evaluation results are shown in Tables 7-1 and 7-2.

[0195] [Table 7-1]

[0196] [Table 7-2]

[0197] Example 2 The optical density (OD / μm) of the cured film and the luminescence reliability (high-temperature continuous driving test) of the organic EL display device were evaluated in the same manner as in Example 1, except that negative-type photosensitive composition 3 was used instead of negative-type photosensitive composition 1. The evaluation results are shown in Tables 7-1 and 7-2.

[0198] Examples 3 and 4 The optical density (OD / μm) of the cured film and the light-emitting reliability (high-temperature continuous driving test) of the organic EL display device were evaluated in the same manner as in Example 1, except that negative-type photosensitive composition 3 was used instead of negative-type photosensitive composition 1, and positive-type photosensitive compositions 2 and 3 were used instead of positive-type photosensitive composition 1. The evaluation results are shown in Tables 7-1 and 7-2.

[0199] (Examples 5 to 8) The optical density (OD / μm) of the cured film and the luminescence reliability (high-temperature continuous driving test) of the organic EL display device were evaluated in the same manner as in Example 1, except that negative-type photosensitive compositions 4 to 7 were used instead of negative-type photosensitive composition 1. The evaluation results are shown in Tables 7-1, 7-2, 8-1, and 8-2.

[0200] [Table 8-1]

[0201] [Table 8-2]

[0202] Example 9 An organic EL display device was fabricated in the same manner as in Example 5, except that negative-type photosensitive composition 4 was used instead of negative-type photosensitive composition 1, the area ratio of the surface of 1.5 μm-thick layer (B) to cover 20% of the total surface area of ​​layer (A), which was 100%, was formed to impart photospacer functionality to the pixel dividing layer (Figure 4), and a positive-type square pattern exposure mask (20.0 μm long x 500 20.0 μm wide) was used in the formation of layer (B) instead of a positive-type square pattern exposure mask (7.0 μm long x 7.0 μm wide, 1000 square transparent areas), and the light-emitting reliability (high-temperature continuous drive test) was evaluated. The evaluation results are shown in Tables 8-1 and 8-2. In the region where layer (B) was disposed on the surface of layer (A), the maximum thickness of layer (A) was 1.5 μm, and the maximum thickness of layer (B) was 1.5 μm.

[0203] Example 10 An organic EL display device was produced in the same manner as in Example 9, except that negative photosensitive composition 5 was used instead of negative photosensitive composition 4, and the light-emitting reliability (high-temperature continuous driving test) was evaluated. The evaluation results are shown in Tables 8-1 and 8-2.

[0204] Example 11 The optical density (OD / μm) of the cured film and the luminescence reliability (high-temperature continuous driving test) of the organic EL display device were evaluated in the same manner as in Example 1, except that negative-type photosensitive composition 10 was used instead of negative-type photosensitive composition 1. The evaluation results are shown in Tables 8-1 and 8-2.

[0205] (Comparative Example 1) An organic EL display device was produced in the same manner as in Example 1 except that the layer (B) was not formed, and the light-emitting reliability (high-temperature continuous driving test) was evaluated. The evaluation results are shown in Tables 9-1 and 9-2.

[0206] [Table 9-1]

[0207] [Table 9-2]

[0208] (Comparative Example 2) An organic EL display device was fabricated in the same manner as in Example 1, except that layer (A) was formed using positive-type photosensitive composition 1 instead of negative-type photosensitive composition 1, and layer (B) was formed using negative-type photosensitive composition 1 instead of positive-type photosensitive composition 1. The light-emitting reliability (high-temperature continuous drive test) was evaluated. The evaluation results are shown in Tables 9-1 and 9-2. The pixel-dividing layer provided in the organic EL display device fabricated in Comparative Example 2 was a pixel-dividing layer in which layer (A) containing a cured product of positive-type photosensitive composition 1 containing a resin and a photoacid generator was disposed on the surface of layer (A) containing a cured product of negative-type photosensitive composition 1 containing a pigment, a compound having two or more ethylenically unsaturated double bond groups in its molecule, and a photopolymerization initiator. The maximum film thickness of layer (A) was 0.3 μm, and the maximum film thickness of layer (B) was 1.5 μm.

[0209] (Comparative Example 3) An attempt was made to form layer (A) in the same manner as in Example 1 using negative photosensitive composition 2 instead of negative photosensitive composition 1, but due to insufficient resolution, an opening with an opening width of 7.0±0.1 μm could not be formed in the measurement of the optimum exposure dose (A). Therefore, an organic EL display device could not be produced.

[0210] Comparative Example 4 An organic EL display device was produced in the same manner as in Example 1, except that layer (B) was formed using negative photosensitive composition 1 instead of positive photosensitive composition 1, and the luminescence reliability (high-temperature continuous driving test) was evaluated. The evaluation results are shown in Tables 9-1 and 9-2.

[0211] (Comparative Example 5) An organic EL display device was fabricated in the same manner as in Example 1, except that layer (A) was formed using negative photosensitive composition 8 instead of negative photosensitive composition 1, and layer (B) was not formed, and the light-emitting reliability (high-temperature continuous driving test) was evaluated. The evaluation results are shown in Tables 9-1 and 9-2.

[0212] (Comparative Example 6) An organic EL display device was produced in the same manner as in Example 1, except that layer (B) was formed using negative photosensitive composition 9 instead of positive photosensitive composition 1, and the luminescence reliability (high-temperature continuous driving test) was evaluated. The evaluation results are shown in Tables 10-1 and 10-2.

[0213] [Table 10-1]

[0214] [Table 10-2]

[0215] (Comparative Example 7) An organic EL display device was fabricated in the same manner as in Example 1, except that layer (A) was formed using positive photosensitive composition 3 instead of negative photosensitive composition 1, and positive photosensitive composition 3 was used instead of positive photosensitive composition 1, and the light-emitting reliability (high-temperature continuous driving test) was evaluated. The evaluation results are shown in Tables 10-1 and 10-2.

[0216] (Comparative Example 8) When measuring the optimum exposure dose (A) of the negative photosensitive composition 1 used to form the layer (A), a mixed ray of g, h, and i rays of an ultra-high pressure mercury lamp was irradiated at 1000 mJ (mJ / cm) from the developed film side on the obtained developed film-formed substrate. 2 The second exposure step was added, in which the entire surface was exposed to an exposure amount of 1000 mJ (mJ / cm : i-line equivalent value), and the same method was used when preparing the pixel division layer formation substrate. 2 An organic EL display device was fabricated in the same manner as in Example 1, except that a second exposure step of exposing the entire surface to an exposure amount of 1000 uV (i-line equivalent value) was added and layer (B) was not formed, and the luminescence reliability (high-temperature continuous driving test) was evaluated. The evaluation results are shown in Tables 10-1 and 10-2.

[0217] (Comparative Example 9) Instead of a negative square pattern exposure mask (1000 square light-shielding areas, each 7.0 μm long and 7.0 μm wide), a lower-resolution negative square pattern exposure mask (50 rectangular light-shielding areas, each 50.0 μm long and 260.0 μm wide) was used to obtain openings with an opening width of 50.0 ± 0.1 μm. The optimal exposure dose (A) of the negative photosensitive composition 1 used to form layer (A) was measured, and a pixel division layer-forming substrate was prepared. An organic EL display device was fabricated in the same manner as in Example 1, except that layer (B) was not formed, and the light-emitting reliability (high-temperature continuous driving test) was evaluated. The evaluation results are shown in Tables 10-1 and 10-2.

[0218] (Comparative Example 10) Instead of a negative square pattern exposure mask (1000 square light-shielding areas, each 7.0 μm long and 7.0 μm wide), a lower-resolution negative square pattern exposure mask (100 rectangular light-shielding areas, each 30.0 μm long and 30.0 μm wide) was used to obtain openings with an opening width of 30.0 ± 0.1 μm. The optimal exposure dose (A) of the negative photosensitive composition 1 used to form layer (A) was measured, and a pixel division layer-forming substrate was prepared. An organic EL display device was fabricated in the same manner as in Example 1, except that layer (B) was not formed, and its luminescence reliability (high-temperature continuous driving test) was evaluated. The evaluation results are shown in Tables 10-1 and 10-2.

[0219] Example 12 The negative photosensitive composition 4 was used instead of the negative photosensitive composition 1, and a negative hole pattern exposure mask (500 circular light-shielding areas with a diameter of 17.0 μm) was used instead of a negative square pattern exposure mask (1000 square light-shielding areas with a vertical width of 7.0 μm and a horizontal width of 7.0 μm) to obtain openings with an opening width of 17.0±0.1 μm. The optimum exposure dose (A) of the negative photosensitive composition 4 used in forming the layer (A) was measured, and a pixel division layer formation substrate was produced. An organic EL display device was fabricated in the same manner as in Example 1, except that a positive hole pattern exposure mask (500 circular transparent areas, 30.0 μm in diameter) was used instead of a pattern exposure mask (1,000 square transparent areas, each 7.0 μm in length and width) to obtain openings with an opening width of 30.0±0.1 μm. The optimal exposure dose (B) of the positive photosensitive composition 1 used to form layer (B) was measured, and a pixel division layer-forming substrate was fabricated. The luminescence reliability (high-temperature continuous drive test) was evaluated. The area ratio of the surface of layer (A) covered by layer (B) was 92% of the total surface area of ​​layer (A), which was 100%. The evaluation results (high-temperature continuous drive test) are shown in Tables 11-1 and 11-2.

[0220] [Table 11-1]

[0221] [Table 11-2]

[0222] (Comparative Example 11) An organic EL display device was produced in the same manner as in Example 12 except that the layer (B) was not formed, and the light-emitting reliability (high-temperature continuous driving test) was evaluated. The evaluation results are shown in Tables 11-1 and 11-2.

[0223] Example 13 An organic EL display device was produced in the same manner as in Example 12, except that layer (B) was formed to a film thickness of 0.5 μm, and the luminescence reliability (light resistance test) was evaluated. The evaluation results are shown in Tables 12-1 and 12-2.

[0224] [Table 12-1]

[0225] [Table 12-2]

[0226] (Comparative Example 12) Organic EL display devices were fabricated in the same manner as in Example 12, except that layer (B) was formed to a thickness of 0.5 μm, or that layer (B) was not formed, and the luminescence reliability (light resistance test) was evaluated. The evaluation results are shown in Tables 12-1 and 12-2.

[0227] Example 14 An organic EL display device was fabricated in the same manner as in Example 12, except that layer (B) was formed to a thickness of 0.5 μm. A color filter substrate fabricated by the following method was attached to the light extraction side using an epoxy adhesive to obtain an organic EL display device equipped with the color filter substrate, and the luminescence reliability (light resistance test) was evaluated. The evaluation results are shown in Tables 12-1 and 12-2. <Production of color filter substrate> A negative photosensitive green composition for color filters was applied to the surface of Tempax, a transparent glass substrate, using a spin coater, adjusting the rotation speed so that the final cured film would have a thickness of 1.0 μm, to obtain a coating film. The coating film was prebaked using a hot plate at 110°C under atmospheric pressure for 120 seconds to obtain a prebaked film. Using a double-sided alignment single-sided exposure device, a mixed line of g, h, and i rays from an ultra-high pressure mercury lamp was applied at an exposure dose of 100 mJ / cm. 2The entire surface of the prebaked film was exposed to light at 1000 W. The substrate on which the exposed film had been formed was heated in an air atmosphere at 230° C. for 30 minutes using a high-temperature inert gas oven to obtain a green color filter substrate.

[0228] (Comparative Example 13) An organic EL display device including a color filter substrate was produced in the same manner as in Example 14, except that layer (B) was not formed, and the luminescence reliability (light resistance test) was evaluated. The evaluation results are shown in Tables 12-1 and 12-2.

[0229] Example 15 The light-emitting reliability (light resistance test) of an organic EL display device equipped with a color filter substrate prepared in the same manner as in Example 14 was evaluated, except that negative-type photosensitive composition 10 was used instead of negative-type photosensitive composition 4. The evaluation results are shown in Tables 12-1 and 12-2.

[0230] (Comparative Example 14) An organic EL display device including a color filter substrate was produced in the same manner as in Example 15, except that layer (B) was not formed, and the luminescence reliability (light resistance test) was evaluated. The evaluation results are shown in Tables 12-1 and 12-2.

[0231] From the above results, it can be seen that the organic EL display devices produced in Examples 1 to 15 have high light-blocking properties compared to the organic EL display devices produced in Comparative Examples 1 to 2 and 4 to 14, and yet have pixel dividing layers with openings having narrow opening widths, and yet achieve excellent light-emitting reliability. Therefore, it is clear that the organic EL display device of the present invention is useful. [Industrial Applicability]

[0232] The organic EL display device of the present invention can be preferably used in applications requiring high resolution and light emission reliability in the display section, such as electronic devices such as small wristwatch-type wearable devices used outdoors and foldable smartphones. [Explanation of symbols]

[0233] 1:TFT 2: Wiring 3: TFT insulating layer 4: Flattening layer 5:First electrode 6: Circuit board 7: Contact hole 8: Layer (A) 9: Layer (B) 10: Pixel division layer 11: Light-emitting pixel 12:Second electrode 13: Circuit board 14: Black matrix 15: Green color filter 16: Red color filter 17: Blue color filter 18: Circuit board 19: Flattening layer 20:First electrode 21: Layer (A) 22: Layer (B) 23: Circuit board 24: Flattening layer 25:First electrode 26: Layer (A) 27: Layer (B) 28: Circuit board 29: Flattening layer 30:First electrode 31: Layer (A) 32: Layer (B) 33: Circuit board 34: Flattening layer 35:First electrode 36: Layer (A) 37: Layer (B) 38: Circuit board 39: Flattening layer 40:First electrode 41: Layer (A) 42: Layer (B) 43:TFT 44: Layer (A) 45: Opening of layer (A) where blue light-emitting pixels are arranged 46: Opening of layer (A) where red light-emitting pixels are arranged 47: Opening of layer (A) where green light-emitting pixels are arranged 48: Layer (A) 49: Opening of layer (A) where blue light-emitting pixels are arranged 50: Opening of layer (A) in which red light-emitting pixels are arranged 51: Opening of layer (A) in which green light-emitting pixels are arranged 52: Layer (A) 53: Light-emitting part 54: Non-luminous area 55: Alkali-free glass substrate 56: Flattening layer 57:First electrode 58: Pixel division layer 59: Organic EL layer 60:Second electrode

Claims

1. An organic EL display device comprising, in this order, a substrate, a planarization layer, a first electrode, a pixel division layer, a light-emitting pixel, and a second electrode, wherein the pixel division layer includes a layer (A) and a layer (B); the layer (A) is a layer disposed on the surface of the first electrode such that the surface of the first electrode is partially exposed, and the layer (B) is a layer disposed on at least a portion of the surface of the layer (A); The organic EL display device comprises: layer (A) containing a cured product of a negative-type photosensitive composition (a) containing a pigment and / or dye, a compound having two or more ethylenically unsaturated double bond groups in the molecule, and a photopolymerization initiator; and layer (B) containing a cured product of a positive-type photosensitive composition (b) containing a resin and a photoacid generator.

2. 2. The organic EL display device according to claim 1, wherein the display section has a portion where the area ratio of the surface of the layer (A) covered by the layer (B) is 20 to 100% of the total surface area of ​​the layer (A).

3. 3. The organic EL display device according to claim 1, further comprising a color filter on the light extraction side of the light-emitting pixel.

4. The layer (A) has an opening area of ​​30.0 to 260.0 μm in which the light-emitting pixels are arranged in the display section. ２ 3. The organic electroluminescence display device according to claim 1, wherein the organic electroluminescence display device has an opening.

5. 3. The organic EL display device according to claim 1, wherein the cured product of the positive photosensitive composition (b) contains a resin having an imide bond and / or a benzoxazole skeleton.

6. 3. The organic EL display device according to claim 1, wherein the cured product of the negative photosensitive composition (a) contains the pigment, and the pigment contains a benzodifuranone-based black pigment represented by formula (1) or formula (2). 【Chemistry 1】 【Chemistry 2】 (In formula (1) and formula (2), R １ ~R １０ each independently represents a hydrogen atom, a fluorine atom, an alkyl group having 1 to 12 carbon atoms, a hydroxyl group, or a carboxyl group.

7. The organic EL display device according to claim 1 or 2, wherein the cured product of the negative photosensitive composition (a) further contains at least one perylene-based organic pigment selected from the group consisting of C.I. Pigment Red 123, C.I. Pigment Red 149, C.I. Pigment Red 178, C.I. Pigment Red 179, C.I. Pigment Red 190, C.I. Pigment Violet 29, and 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole.

8. 3. The organic EL display device according to claim 1, wherein the cured product of the negative photosensitive composition (a) further contains 3,4,9,10-perylenetetracarboxylic acid bisbenzimidazole.

9. 3. The organic EL display device according to claim 1, wherein the layer (B) has a region where the maximum film thickness of the layer (A) is 0.5 to 3.0 μm and the maximum film thickness of the layer (B) is 0.1 to 3.0 μm in a region where the layer (B) is disposed on the surface of the layer (A).

10. 3. The organic EL display device according to claim 1, wherein the optical density per 1 μm of film thickness of the layer (A) (OD / μm) is 0.5 to 1.

5.

11. 3. The organic EL display device according to claim 1, wherein the cured product of the negative photosensitive composition (a) contains silica particles having a primary particle diameter of 5 to 30 nm and an aspect ratio (major axis / minor axis) of 1.0 to 1.5.

Images