gaming machines

Abstract

To provide a game machine which improves amusement of a game while improving operability in playing the game.SOLUTION: A game machine includes benefit imparting means which imparts a benefit when a predetermined condition is satisfied, a whole area liquid crystal display which has an image display area in which a drawing pattern display window is formed for displaying a plurality of drawing patterns of a reel, and a sub control board which controls the light transmittance in the image display area. When an electric power supply to the game machine is interrupted, the light transmittance of the drawing pattern display window becomes second light transmittance not allowing the drawing patterns of the drawing pattern display window to be visually recognized. The sub control board controls the light transmittance of the drawing pattern display window in rotation of the reel to be first light transmittance allowing the drawing patterns displayed on the drawing pattern display window to be visually recognized, and controls the light transmittance of the drawing pattern display window in the case of a non-game state to be third light transmittance lower than the first light transmittance and higher than second light transmittance. Even if the light transmittance of the drawing pattern display window in the rotation of the reel is in the second light transmittance, when the predetermined condition is satisfied, the benefit imparting means imparts the benefit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to gaming machines such as slot machines and pachinko machines. [Background technology]

[0002] Conventionally, gaming machines include slot machines (reel-type gaming machines), pachinko gaming machines, arrange ball gaming machines, and jankyu gaming machines, and among these types of gaming machines there is, for example, a slot machine as shown in Patent Document 1. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-144015 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional gaming machines, various innovations have been made to improve operability during play, increase the enjoyment of the game, and achieve stable game control, but there is still room for further improvement.

[0005] An object of the present invention is to provide a gaming machine that can improve operability during play and increase the enjoyment of the game. [Means for solving the problem]

[0006] The gaming machine according to the present invention comprises: a main control board for controlling games; a signal receiving integrated circuit mounted on the main control board for shaping input waveforms; a game control integrated circuit mounted on the main control board and storing a control program for controlling games; and a power supply voltage monitoring circuit for monitoring the power supply voltage supplied to the main control board. A plurality of reels on which a plurality of symbols are drawn, and a liquid crystal display device provided on the player side of the plurality of reels and having a display area capable of displaying images. YesThe display area has a symbol visible area in which symbols on the plurality of reels can be seen, and the light transmittance of the symbol visible area at a first timing in a state in which power is not supplied to the liquid crystal display device is a first light transmittance, and the symbols on the plurality of reels are more difficult to see through the symbol visible area at a specific timing after the supply of power to the gaming machine is stopped while the plurality of reels are rotating and before the plurality of reels are completely stopped, than the symbols on the plurality of reels seen through the symbol visible area in a state in which no abnormality is occurring and the plurality of reels can be stopped while rotating, and when a rotation start operation is received even if the light transmittance of the symbol visible area is the first light transmittance, the signal receiving integrated circuit operates stably when the power supply voltage supplied to the signal receiving integrated circuit is within a range from a first voltage value to a second voltage value, the game control integrated circuit operates stably when the power supply voltage supplied to the game control integrated circuit is within a range from a third voltage value to a fourth voltage value, when the voltage value input to the game control integrated circuit is a fifth voltage value, it represents an input value of 0, and when the voltage value input to the game control integrated circuit is a sixth voltage value, it represents an input value of 1, the power supply voltage monitoring circuit outputs a power interruption signal to the game control integrated circuit when the power supply voltage supplied to the power supply voltage monitoring circuit drops from a seventh voltage value to an eighth voltage value, the first voltage value is lower than the sixth voltage value, the second voltage value is higher than the sixth voltage value, the seventh voltage value is higher than the sixth voltage value, and the eighth voltage value is higher than the second voltage value. It is characterized by: [Effects of the Invention]

[0007] According to the gaming machine having the above configuration, it is possible to improve the operability when playing the game and increase the enjoyment of the game. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a front view of a slot machine according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view of the slot machine. [Figure 3] FIG. 2 is a front view showing the internal structure of the slot machine. [Figure 4] This is a view of the front door of the above slot machine as seen from behind. [Figure 5] A front view showing the main control device installed inside the cabinet of the above slot machine. [Figure 6] FIG. 2 is a front view showing the slot machine with the front door open. [Figure 7] FIG. 2 is a perspective view of a main control device of the slot machine. [Figure 8] FIG. 2 is an exploded perspective view of the main control device of the slot machine. [Figure 9] FIG. 2 is a cross-sectional view of the main control device of the slot machine. [Figure 10] FIG. 2 is a perspective view of the case body of the slot machine. [Figure 11] FIG. 2 is a front view of the circuit board case mounting mechanism in the slot machine. [Figure 12] FIG. 2 is a perspective view of a circuit board case mounting mechanism in the slot machine. [Figure 13] FIG. 2 is a front view of the main control board in the slot machine. [Figure 14] FIG. 10 is a front view showing a modified example of the main control board in the above-mentioned slot machine. [Figure 15] This is a diagram showing multiple types of electrical elements mounted in a specified area on the surface of another main control board in the above-mentioned slot machine, as viewed from the surface side of the board. [Figure 16] This is a diagram showing the lead wires of multiple types of electrical elements mounted in the specified area of ​​the other main control board, as viewed from the back side of the board. [Figure 17] This is a diagram showing multiple types of electrical elements mounted in another specified area on the surface of the above-mentioned other main control board, as seen from the surface side of the board. [Figure 18] This is a diagram showing the lead wires of multiple types of electrical elements mounted in the other specified area on the back surface of the other main control board, as viewed from the back surface of the board. [Figure 19] A diagram showing the relationship between the distance between the conductive layers of the above-mentioned other main control board and the thickness of the gaming medal. [Figure 20] A figure showing the state in which a game medal abuts on the edge of the above-mentioned other main control board. [Figure 21] A diagram showing a state in which a pachinko ball abuts on the edge portion of the above-mentioned other main control board. [Figure 22] FIG. 10 is a diagram showing the relationship between the protruding heights of lead wires of multiple types of electronic components mounted on the other main control board. [Figure 23] FIG. 10 is a diagram showing how the other specified area of ​​the other main control board appears when viewed from the front. [Figure 24]FIG. 10 is a diagram showing how the other specified area of ​​the other main control board looks when viewed with the head tilted to the side. [Figure 25] 10A and 10B are diagrams showing examples of component names printed on the surface of the other main control board. [Figure 26] 10A and 10B are diagrams showing examples of component frame lines printed on the surface of the other main control board. [Figure 27] 10 is a diagram showing the relationship between the height of the information display lamp and the LED element mounted on the surface of the other main control board. FIG. [Figure 28] A front view of the sub-control board in the above-mentioned slot machine. [Figure 29] FIG. 2 is a front view of the power supply board in the slot machine. [Figure 30] This is a diagram showing the state of multiple types of electrical elements mounted on the sub-control board and power supply board in the above-mentioned slot machine, as viewed from the front and side of the board. [Figure 31] This is a diagram showing the state of multiple types of electrical elements mounted on the sub-control board and power supply board in the above-mentioned slot machine, as viewed from the front and side of the board. [Figure 32] This is a diagram showing the state of multiple types of electrical elements mounted on the sub-control board and power supply board in the above-mentioned slot machine, as viewed from the front and side of the board. [Figure 33] This is a diagram showing the state of multiple types of electrical elements mounted on the sub-control board and power supply board in the above-mentioned slot machine, as viewed from the front and side of the board. [Figure 34] FIG. 2 is a perspective view of a reel unit in the slot machine. [Figure 35] FIG. 2 is a perspective view of a reel module in the slot machine. [Figure 36] FIG. 2 is a side view of a reel module in the slot machine. [Figure 37] 3A and 3B are a perspective view and a front view of a back lamp unit in the reel module. [Figure 38] 10A and 10B are a perspective view and a front view showing a modified example of the back lamp unit in the reel module. [Figure 39] FIG. 2 is an exploded perspective view of the reels in the slot machine. [Figure 40] 10 is an explanatory diagram of the symbols displayed on the reel tape that constitutes the reels in the slot machine. FIG. [Figure 41] FIG. 2 is a side view showing the above slot machine installed on an island equipment. [Figure 42] An explanatory diagram of the signal paths exchanged between the main control board and various devices in the above-mentioned slot machine. [Figure 43] 10 is an explanatory diagram for explaining the display contents of the information display lamp in the above-mentioned slot machine. FIG. [Figure 44] FIG. 10 is an explanatory diagram for explaining the contents written on the monitor LED list sticker in the slot machine. [Figure 45] A front view showing the component mounting surface of the main control board in the above-mentioned slot machine. [Figure 46] A cross-sectional view of a board case that houses a main control board in the above-mentioned slot machine. [Figure 47] 10 is a perspective view showing the appearance of a portion of the sub-board case in the slot machine. FIG. [Figure 48] An oblique view showing the appearance of various lead components and mounting screws mounted on the sub-control board in the above-mentioned slot machine. [Figure 49] 10 is an explanatory diagram for explaining the space formed inside the sub-board case in the above-mentioned slot machine. FIG. [Figure 50] An explanatory diagram for explaining the distance between the sub-control board and the components mounted on the sub-control board and the sub-board case in the above-mentioned slot machine. [Figure 51] An explanatory diagram to explain the inclination of the sub-board case attached to the front door of the above-mentioned slot machine. [Figure 52] An explanatory diagram to explain the inclination of the sub-board case attached to the front door of the above-mentioned slot machine. [Figure 53]FIG. 2 is a diagram showing the operating voltage ranges and operating temperature ranges of the control chip and driver IC mounted on the main control board of the slot machine. [Figure 54] FIG. 10 is a front view of a pachinko gaming machine according to a second embodiment. [Figure 55] FIG. 2 is a rear view of the pachinko gaming machine. [Figure 56] FIG. 2 is a control block diagram of the pachinko gaming machine. [Figure 57] This is a functional block diagram of the main control board and presentation control board of the above-mentioned pachinko game machine. [Figure 58] FIG. 10 is a schematic diagram showing a special symbol winning / losing lottery table. [Figure 59] (A) is a schematic diagram showing the first special symbol jackpot symbol table, and (B) is a schematic diagram showing the second special symbol jackpot symbol table. [Figure 60] This is a schematic diagram showing a special pattern variation pattern table 1. [Figure 61] This is a schematic diagram showing the special pattern variation pattern table 2. [Figure 62] This is a schematic diagram showing the special pattern variation pattern table 3. [Figure 63] 10 is a schematic diagram showing the pattern attributes of decorative patterns. FIG. [Figure 64] This is a schematic diagram showing the correspondence between the type of jackpot, the jackpot pattern combination of decorative patterns, and the performance pattern during the jackpot. [Figure 65] This is a schematic diagram showing an overview of the Choju jackpot presentation. [Figure 66] This is a schematic diagram showing an overview of the Kotobuki jackpot A presentation. [Figure 67] This is a schematic diagram showing an overview of the Kotobuki jackpot B performance. [Figure 68] This is a schematic diagram showing an overview of the Happy Big Hit A performance. [Figure 69] This is a schematic diagram showing an overview of the Happy Big Hit B performance. [Figure 70] FIG. 2 is a schematic diagram showing a basic screen during a round of play. [Figure 71] A conceptual diagram for explaining the configuration of the winning-related effects. [Figure 72] This is a schematic diagram showing an example of an over-winning effect. [Figure 73] This is a schematic diagram showing an example of a large prize slot count-up effect. [Figure 74] FIG. 10 is a schematic diagram showing an example of a bonus prize presentation. [Figure 75] This is a schematic diagram showing an example of a general winning slot count-up effect. [Figure 76] This is a time chart explaining the priority of the large prize slot count-up effect. [Figure 77] FIG. 10 is a schematic diagram illustrating an emphasis effect. [Figure 78] FIG. 10 is a schematic diagram illustrating types of errors in a gaming machine. [Figure 79] This is a time chart to explain whether or not the over prize effect will be executed at the end of a jackpot. [Figure 80] This is a time chart to explain whether or not a bonus prize presentation will be executed at the end of a jackpot. [Figure 81] This is a time chart showing the relationship between the detection state of the touch sensor and the over winning effect and the general winning effect. [Figure 82] 10 is a time chart showing the relationship between the game state in which the game start preparation effect is executed and the game state in which the over prize effect and the bonus prize effect are executed. [Figure 83] FIG. 10 is a schematic diagram showing a volume adjustment screen. [Figure 84] This is a time chart explaining the overlapping execution of the over prize effect and the bonus prize effect. [Figure 85] This is a time chart when over winnings and bonus winnings occur multiple times within a predetermined period. [Figure 86] This is a time chart of the prize ball signal when a game ball enters a general prize opening. [Figure 87] This is a time chart of the prize ball signal when a game ball enters the big prize opening. [Figure 88] 10 is a flowchart showing the main processing on the main control side. [Figure 89] This is a flowchart showing the control processing following Figure 88 of the main processing on the main control side. [Figure 90] 10 is a flowchart showing main control side timer interrupt processing. [Figure 91] 10 is a flowchart showing the winning monitoring process. [Figure 92] 10 is a flowchart showing a start port monitoring control process. [Figure 93] 10 is a flowchart showing a special pattern variation start monitoring control process. [Figure 94] 10 is a flowchart showing a special pattern variation start monitoring process. [Figure 95] 10 is a flowchart showing a special symbol control process. [Figure 96] 10 is a flowchart showing a general-purpose special symbol control process. [Figure 97] 10 is a flowchart showing the special pattern variation start processing. [Figure 98] 10 is a flowchart showing processing during special pattern variation. [Figure 99] 10 is a flowchart showing the processing during the display of the special symbol stop symbol. [Figure 100] 10 is a flowchart showing the special electric device control process. [Figure 101] This is a flowchart showing the control processing following Figure 100 of the special electric device control processing. [Figure 102] 10 is a flowchart showing a reset start process. [Figure 103] 10 is a flowchart showing the main processing on the performance control side. [Figure 104] 10 is a flowchart showing a command analysis process. [Figure 105] 10 is a flowchart showing a process for determining the content of a winning effect. [Figure 106] 10 is a flowchart showing a performance control command reception interrupt process. [Figure 107] A flowchart showing the performance control side timer interrupt processing. [Figure 108]10 is a flowchart showing an image control command transmission interrupt process. [Figure 109] FIG. 10 is a diagram showing a schematic diagram of a special symbol winning / losing lottery table in the third embodiment. [Figure 110] FIG. 10 is a schematic diagram showing a special symbol jackpot symbol table of the third embodiment. [Figure 111] A transition diagram of the game state and presentation mode in the third embodiment. [Figure 112] FIG. 11 is a schematic diagram showing a game status setting table of the third embodiment. [Figure 113] 10 is a comparison table of the variable time of special symbols in the third embodiment. [Figure 114] FIG. 10 is a schematic diagram illustrating the normal symbol lottery of the third embodiment. [Figure 115] FIG. 11 is a schematic diagram for explaining simultaneous fluctuation processing (fluctuation interruption processing, fluctuation forced stop processing) of the third embodiment. [Figure 116] FIG. 11 is a front view of a pachinko gaming machine according to a modified example of the third embodiment. [Figure 117] FIG. 10 is a front view showing the main control and display device of the fourth embodiment. [Figure 118] FIG. 13 is a schematic diagram showing an example of an emphasis effect according to the fourth embodiment. [Figure 119] FIG. 13 is a schematic diagram showing an emphasis effect pattern table according to the fourth embodiment. [Figure 120] 10 is a time chart showing the timing of execution of highlighting effects, special effect displays, and output of specific sound effects during execution of a jackpot game in the fourth embodiment. [Figure 121] A time chart showing the relationship between the execution time of the highlighting effect and the execution time of the jackpot end demo in the fourth embodiment. [Figure 122] 10 is a time chart showing the execution timing of highlighting effects, light emitting effects, and special effects in the fourth embodiment. [Figure 123] (A) is a time chart showing the execution timing of the role presentation during fluctuation in the fourth embodiment, and (B) is a time chart showing the execution timing of the role presentation during a jackpot in the fourth embodiment. [Figure 124]10A is a time chart when the execution of the emphasis effect of the fourth embodiment is restricted, and FIG. 10B is a time chart when the execution of the over winning effect of the fourth embodiment is restricted. [Figure 125] This is a time chart showing what happens when a power outage occurs during the execution of the jackpot type display in the fourth embodiment. [Figure 126] 10 is a time chart showing when a power outage occurs during execution of the round display in the fourth embodiment. [Figure 127] FIG. 10 is a control block diagram showing the control configuration of a gaming machine according to a fifth embodiment. [Figure 128] A functional block diagram of the main control board and the performance control board of the fifth embodiment. [Figure 129] FIG. 13 is a functional block diagram showing a power-on transition mode control unit and a performance information management unit according to a fifth embodiment. [Figure 130] FIG. 11 is a front view showing a main control board unit of the fifth embodiment. [Figure 131] FIG. 10 is a schematic diagram showing a performance display monitor according to a fifth embodiment. [Figure 132] FIG. 10 is a diagram showing basic game specifications of the fifth embodiment. [Figure 133] FIG. 10 is a schematic diagram showing a special symbol winning / losing lottery table in the fifth embodiment. [Figure 134] 10A is a schematic diagram showing a first special symbol jackpot symbol table of the fifth embodiment, and FIG. 10B is a schematic diagram showing a second special symbol jackpot symbol table of the fifth embodiment. [Figure 135] FIG. 13 is a diagram illustrating the relationship between power-on operations and transition modes in the fifth embodiment. [Figure 136] FIG. 13 is a schematic diagram showing an example of display of setting values ​​on a performance display monitor according to a fifth embodiment. [Figure 137] FIG. 10(A) is a diagram showing the notification content in the setting change mode of the fifth embodiment, and FIG. 10(B) is a diagram showing the notification content in the setting check mode of the fifth embodiment. [Figure 138] 10(A) is a schematic diagram showing a storage area of ​​a RAM of a main control board of the fifth embodiment, and FIG. 10(B) is a schematic diagram showing a performance information storage area of ​​the fifth embodiment. [Figure 139] FIG. 13 is a schematic diagram showing an example of displaying base values ​​for each section in the fifth embodiment. [Figure 140] FIG. 13 is a diagram showing the display contents displayed in the discrimination segment and the ratio segment for each management section (measurement section) in the fifth embodiment. [Figure 141] This is a time chart showing the first hit occurring in section A when the power is turned on in the fifth embodiment. [Figure 142] (A) is a time chart showing the initial display period when the game state when the power is restored after a power outage in the fifth embodiment is a special game state, and (B) is a time chart showing the initial display period when the game state when the power is restored after a power outage in the fifth embodiment is a normal game state. [Figure 143] This is a time chart when a prize ball error occurs during a jackpot game. [Figure 144] FIG. 13 is a front view of the game board of the sixth embodiment. [Figure 145] FIG. 13 is a schematic diagram showing a sub-control display device of a sixth embodiment. [Figure 146] FIG. 13 is a perspective view showing the effect button and cross key of the sixth embodiment. [Figure 147] FIG. 20 is a schematic diagram for explaining the flow of button effects in the sixth embodiment. [Figure 148] FIG. 20 is a schematic diagram showing types of button effects in the sixth embodiment. [Figure 149] FIG. 13 is a schematic diagram for explaining the timing of execution of the button vibration effect in the sixth embodiment. [Figure 150] FIG. 13 is a schematic diagram showing an example of the first button vibration effect α in the sixth embodiment. [Figure 151] FIG. 20 is a schematic diagram showing an example of the first button vibration effect β in the sixth embodiment. [Figure 152] FIG. 13 is a schematic diagram showing an example of the second button vibration effect in the sixth embodiment. [Figure 153] FIG. 152 is a schematic diagram showing an example of the second button vibration effect in the sixth embodiment (continuation of FIG. 152). [Fig. 154]FIG. 20 is a schematic diagram showing an example of the third button vibration effect in the sixth embodiment. [Figure 155] FIG. 154 is a schematic diagram showing an example of the vibration effect of the third button in the sixth embodiment. [Figure 156] FIG. 20 is a schematic diagram showing an execution pattern table for button vibration effects in the sixth embodiment. [Figure 157] 13 is a flowchart of an initialization operation process of a movable body according to the sixth embodiment. [Figure 158] A schematic diagram showing the flow of display screens displayed on the performance display device after the gaming machine of the sixth embodiment is turned on. [Figure 159] 13 is a time chart for explaining the relationship between the initialization operation of the movable body and the button vibration effect in the sixth embodiment. [Figure 160] 13 is a time chart for explaining the relationship between the initialization operation of the movable body and the first button effect in the sixth embodiment. [Figure 161] FIG. 20 is a schematic diagram showing an example of a special effect effect (collective effect effect) in the sixth embodiment. [Figure 162] 13 is a time chart showing a modified example of the relationship between the initialization operation of the movable body and the first button effect in the sixth embodiment. [Figure 163] 13 is a time chart for explaining the relationship between the initialization operation of the movable body and the second button effect in the sixth embodiment. [Fig. 164] FIG. 20 is a schematic diagram showing a display example of a left-handed hit notification image in the sixth embodiment. [Figure 165] This is a time chart explaining the execution timing of the left-hit notification effect in the sixth embodiment. [Figure 166] This is a time chart showing what happens when a power outage occurs during the execution of the left-hit notification effect in the sixth embodiment. [Figure 167] This is a time chart used to explain the predictive effect after transitioning from a high base state to a low base state in the sixth embodiment. [Figure 168] A schematic diagram for explaining the pending image display area and the changing image display area in the sixth embodiment. [Figure 169] (A) is a schematic diagram for explaining the pending image and changing image of the sixth embodiment, and (B) is a schematic diagram for explaining an example of the motion display (animation display) of the pending image and changing image of the sixth embodiment. [Figure 170] A schematic diagram showing examples of hold change suggestion effects and hold change effects in the sixth embodiment. [Figure 171] This is a time chart when variable displays A and B are executed as variable displays of the first special pattern in the sixth embodiment. [Fig. 172] 13 is a time chart showing a case where the display of a sound adjustment image and the initialization operation of a movable body are executed simultaneously after the power is restored from a power outage in the gaming machine of the sixth embodiment. [Figure 173] A time chart showing the relationship between the initialization operation of the movable parts after power is turned off and restored in the gaming machine of the sixth embodiment and the display content of the performance display device. [Fig. 174] 13 is a time chart showing the relationship between the performance operation (performance of the first movable role object) of the sixth embodiment and the display content of the performance display device. [Figure 175] 13A and 13B are schematic diagrams showing a first effect of an operation prompt effect according to a modified example of the sixth embodiment, in which (a) is a schematic diagram showing an image before a button is operated, and (b) is a schematic diagram showing an image after the button is operated. [Figure 176] 13A and 13B are schematic diagrams showing the second operation prompting effect of a modified example of the sixth embodiment, in which (a) is a diagram showing the image before freezing, and (b) is a diagram showing the image after freezing. [Figure 177] 13A and 13B are schematic diagrams showing the second operation prompting effect of a modified example of the sixth embodiment, in which (a) is an image after the freeze is released, and (b) is an image after a button is operated. [Figure 178] This shows various periods and states during the second operation promotion effect of a modified example of the sixth embodiment, compared with the first effect, where (a) is a timing chart of the first effect and (b) is a timing chart of the second effect. [Figure 179] 13A and 13B are schematic diagrams showing the second operation prompting effect of a modified example of the sixth embodiment, in which (a) is an image before a button operation at the time of reaching a winning point, and (b) is an image after the button operation. [Figure 180] This shows the second effect of the operation promotion effect in a modified example of the sixth embodiment, where (a) is a schematic diagram showing an image after freezing when a reach occurs, and (b) is a schematic diagram showing an image of the provocative effect when the reach develops. [Figure 181] 13A and 13B are schematic diagrams showing the second operation prompting effect of a modified example of the sixth embodiment, in which (a) is an image after the freeze is released, and (b) is an image after a button is operated. [Figure 182] FIG. 23 is a schematic diagram showing an operation prompting effect pattern table according to a modified example of the sixth embodiment. [Figure 183] FIG. 13 is a schematic diagram showing the configuration of the decorative pattern of the seventh embodiment. [Figure 184] FIG. 13 is a schematic diagram illustrating mode presentation (stage presentation) in the seventh embodiment. [Figure 185] FIG. 13 is a schematic diagram showing a display screen for a BGM selection effect in the seventh embodiment. [Figure 186] FIG. 20 is a schematic diagram illustrating a variable standby period according to the seventh embodiment. [Figure 187] A schematic diagram showing examples of standby operation presentations and standby presentations during fluctuations in the seventh embodiment. [Figure 188] This is a schematic diagram showing an example of the standby operation presentation and the standby presentation during fluctuation in the seventh embodiment (continuation of Figure 187). [Figure 189] This is a time chart showing the case where a game ball enters the starting hole during execution of a standby demo performance in a low base state in the seventh embodiment. [Figure 190] This is a time chart showing the case where a game ball enters the starting hole during the execution of the low base state fluctuation action presentation in the seventh embodiment. [Figure 191] This is a time chart showing the case where a game ball enters the starting hole during execution of a standby demo performance in a high base state in the seventh embodiment. [Figure 192] This is a time chart showing the case where a game ball enters the starting hole during the execution of the high base state variable action presentation in the seventh embodiment. [Figure 193] FIG. 13 is a schematic diagram for explaining the image transformation effect of the seventh embodiment. [Figure 194] FIG. 13 is a schematic diagram conceptually showing the layer structure of a frame image in a variable effect (when an image action effect is not being executed) in the seventh embodiment. [Figure 195] FIG. 20 is a schematic diagram conceptually showing the layer structure of a frame image in a variation effect (when an image transformation effect is being executed) of the seventh embodiment. [Figure 196] FIG. 20 is a schematic diagram for explaining an overview of button effects in the seventh embodiment. [Figure 197] FIG. 13 is a schematic diagram showing the notification mode of the effect button in the seventh embodiment. [Figure 198] FIG. 13 is a schematic diagram showing an example of a button effect including a weak operation trigger effect (dialogue preview effect) in the seventh embodiment. [Figure 199] FIG. 13 is a schematic diagram showing an example of a button effect including a strong operation trigger effect (cut-in advance notice effect) in the seventh embodiment. [Figure 200] FIG. 13 is a schematic diagram showing an example of a button effect including a specific type of operation trigger effect in the seventh embodiment. [Figure 201] FIG. 200 is a schematic diagram showing an example of a button effect including a specific type of operation trigger effect in the seventh embodiment (continuation of FIG. 200). [Figure 202] FIG. 20 is a schematic diagram showing an example of a button effect including a weak operation trigger effect (a failed decision effect) in the seventh embodiment. [Figure 203] FIG. 202 is a schematic diagram showing an example of a button effect including a weak operation trigger effect (failed decision effect) in the seventh embodiment (continuation of FIG. 202). [Figure 204] FIG. 13 is a schematic diagram for explaining the contents of various effect buttons in the seventh embodiment. [Figure 205] FIG. 13 is a schematic diagram showing a button image according to the seventh embodiment. [Figure 206] A schematic diagram showing an example of the button appearance preview effect in the seventh embodiment. [Figure 207] This is a time chart when the button effect is executed when the jackpot change display in the seventh embodiment branches into win or loss. [Figure 208] A functional block diagram of the main control board and performance control board of the eighth embodiment. [Figure 209] FIG. 13 is a diagram showing basic game specifications of the eighth embodiment. [Figure 210] 10A is a schematic diagram showing a first special symbol jackpot symbol table of the eighth embodiment, and FIG. 10B is a schematic diagram showing a second special symbol jackpot symbol table of the eighth embodiment. [Figure 211] 13(A) is a schematic diagram showing a storage area of ​​the RAM of the main control board of the eighth embodiment, and FIG. 13(B) is a schematic diagram showing a suppression function information storage area of ​​the eighth embodiment. [Figure 212] 13A and 13B are diagrams for explaining the increment and decrement numbers of the MY counter according to the eighth embodiment. [Figure 213] FIG. 20 is a diagram for explaining a method of updating a MY counter according to the eighth embodiment. [Figure 214] FIG. 20 is a diagram for explaining a method for initializing a MY counter in the eighth embodiment. [Figure 215] 13 is a time chart of a suppression function pre-activation signal and a suppression function activation signal according to the eighth embodiment. [Figure 216] A schematic diagram showing an example of the advance notification effect of the eighth embodiment. [Figure 217] A schematic diagram showing an example of the suppression notification display in the eighth embodiment. [Figure 218] This is a schematic diagram showing an example of a presentation in the eighth embodiment when the count value of the MY counter reaches a specified value while a jackpot game is not being executed. [Figure 219] This is a schematic diagram showing an example of a presentation (continuation of Figure 218) when the count value of the MY counter reaches a specified value while a jackpot game is not being executed in the eighth embodiment. [Figure 220] A schematic diagram showing an example of a presentation in which the advance notification presentation is canceled after the count value of the MY counter in the eighth embodiment reaches a predetermined value. [Figure 221] This is a schematic diagram showing an example of a presentation when the count value of the MY counter reaches a specified value during execution of a jackpot game in the eighth embodiment. [Figure 222] This is a time chart when the suppression function activation condition is met during the execution of the prize ball count-up effect in the eighth embodiment. [Figure 223] This is a time chart when the advance notification conditions are met during the execution of the prize ball count-up effect in the eighth embodiment. [Figure 224] 13 is a time chart showing a case where a suppression function activation condition is satisfied during execution of an emphasis effect in the eighth embodiment. [Figure 225] 13 is a time chart showing a case where the advance notification condition is satisfied during execution of the emphasis effect in the eighth embodiment. [Figure 226] 13 is a time chart showing the relationship between the execution time of the prize ball count-up effect and the execution time of the highlight effect in the eighth embodiment. [Figure 227] 13 is a time chart showing the eighth embodiment in which multiple game balls enter the big prize opening in succession. [Figure 228] FIG. 20 is a schematic diagram showing an example of a performance when a music selection performance and an emphasis performance are executed simultaneously in the eighth embodiment. [Figure 229] 13 is a time chart showing when the music is changed in the music selection effect in the eighth embodiment. [Figure 230] 13 is a time chart showing a case where a power outage occurs immediately before a suppression function activation condition is satisfied in the eighth embodiment. [Figure 231] 13 is a time chart showing a case where a power outage occurs immediately before an advance notification condition is satisfied in the eighth embodiment. [Figure 232] 13 is a time chart showing a case where a power outage occurs after a suppression function activation condition is satisfied in the eighth embodiment. [Figure 233] 13 is a time chart showing a case where a power outage occurs after an advance notification condition is satisfied in the eighth embodiment. [Figure 234] FIG. 13 is a front view of a controlled gaming machine according to a ninth embodiment. [Figure 235] FIG. 13 is a rear view of the controlled gaming machine of the ninth embodiment. [Figure 236] A block diagram showing the system configuration of a managed gaming machine of a ninth embodiment. [Figure 237]A diagram showing the communication procedure from power-on between the main control board and the frame control board in the managed gaming machine of the 9th embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the above drawings. [First embodiment] First, the slot machine according to the first embodiment will be described with reference to Figures 1 to 4. In the following, when the basic configuration of the slot machine is described with reference to Figures 1 to 3, the directions of the arrows shown in Figure 2 will be defined as the up-down direction, the front-rear direction, and the left-right direction, respectively.

[0010] <External configuration of slot machine> 1 to 3, the slot machine 1 according to this embodiment includes a box-shaped cabinet 5 (main body member) that is open at the front (forward), and a front door 2 that is attached so as to be able to open and close at the front opening of the cabinet 5. The front door 2 is attached so as to be able to open and close sideways at the front opening of the cabinet 5 using hinge mechanisms 6a to 6c that are arranged at the front of the left side plate 5a of the cabinet 5 when viewed from the front.

[0011] As shown in Figures 1 and 2, an upper panel assembly 10, a middle panel assembly 20, a lower panel assembly 30, and a tray assembly 40 are attached to the front surface of the front door 2, in that order from the top. A display screen 11a of a liquid crystal display device 11 disposed on the back side of the upper panel assembly 10 is disposed in the center thereof so as to face forward, and a first effect lamp 12 and second effect lamps 13a and 13b are disposed around the periphery. In addition, a pair of upper speakers 15a and 15b are disposed on the left and right sides below the front of the display screen 11a, and a decorative member 16 with a predetermined decoration is disposed in the center below the front of the display screen 11a.

[0012] The central panel CPL, located in the center of the middle panel assembly 20, is provided with a reel window W that faces the surfaces of the left reel 3a, middle reel 3b, and right reel 3c, which are arranged side by side inside the cabinet 5. Attached to the upper surface of an operation panel 21 provided below the reel window W are a medal insertion slot 22 for inserting game medals (game media), a BET switch unit 23 for betting game medals within a credited range, and an effect switch unit 24 for operating effects. Attached to the front surface of the operation panel 21 are a start lever (start switch) 25 operated to start the rotation of all reels 3a-3c, three stop switches 26a, 26b, and 26c for individually stopping the rotation of each reel 3a, 3b, and 3c, a reject switch 27 for returning game medals inserted through the medal insertion slot 22 and remaining therein, and a settlement switch 28 for returning credited game medals to a game medal storage tray 42, which will be described later. In addition, in the case of so-called smart gaming machines, in which the medium used for playing games is not gaming medals but an IC card storing information corresponding to the number of gaming medals (hereinafter referred to as "game medal information") is inserted into a dedicated unit and games are played using the gaming medal information stored on the IC card, a counting switch having the same function as the settlement switch 28 is provided. When this counting switch is turned on, the gaming medal information bet on the slot machine is returned to credit, and the credited gaming medal information is sent to the dedicated unit and added to the gaming medal information stored on the IC card. Hereinafter, the process executed when the settlement switch 28 (counting switch in so-called smart gaming machines) is operated will be referred to as the "return process."

[0013] The interior of the medal insertion slot 22 branches into an acceptance passage (leading to a hopper 51 described below) through which inserted game medals pass if they are validly accepted, and a return passage (leading to a medal payout outlet 41 described below) through which inserted game medals pass if they are not accepted, and a blocker is provided at the branching point. This blocker is configured to selectively open one of the acceptance passage and the return passage and close the other so that it guides game medals inserted into the medal insertion slot 22 to the acceptance passage during the period when inserted game medals are validly accepted, and guides game medals inserted into the medal insertion slot 22 to the return passage during other periods.

[0014] Also provided inside the medal insertion port 22 are two medal insertion sensors for detecting game medals that have been inserted into the medal insertion port 22 and validly accepted, and a medal passage sensor for monitoring the game medals inserted into the medal insertion port 22. The first medal insertion sensor is a transmission-type optical sensor capable of detecting game medals, and is located downstream of the position where the blocker is installed (closer to the hopper 51 described below). The second medal insertion sensor is also a transmission-type optical sensor capable of detecting game medals, and is located next to the downstream side of the first medal insertion sensor. The medal passage sensor is a contact-type sensor capable of detecting game medals, and is located downstream of the position where the blocker is installed and closest to the medal insertion port 22 (upstream of the two medal insertion sensors).

[0015] If the first and second medal insertion sensors detect the passage of game medals in this order, it means that the game medals have been inserted into the medal insertion port 22 and that the inserted game medals have been validly accepted. On the other hand, if the first and second medal insertion sensors detect the passage of game medals in the reverse order (second, first), it means that an abnormal passage has occurred, such as the game medals flowing backward. Furthermore, if the medal passage sensor (or at least one of the two medal insertion sensors) continues to detect game medals for more than a predetermined time, it means that an abnormality has occurred, such as the game medals being stuck in the acceptance passage or a foreign object (such as a tool for committing fraud) being inserted into the acceptance passage from the medal insertion port 22.

[0016] The reel window W is configured so that when the left reel 3a, center reel 3b, and right reel 3c all stop, three consecutive symbols on each reel are displayed visible to the player, for a total of nine symbols. Of the three symbols displayed on each reel in the reel window W, the uppermost symbol display position is referred to as the upper row, the lowermost symbol display position is referred to as the lower row, and the symbol display position between the upper and lower rows is referred to as the middle row. A pay line 29, which connects the symbol display areas of the middle rows of each of the reels 3a to 3c horizontally (in a straight line), is activated when a specified number of gaming medals are bet, and the presence or absence of a gaming combination is determined by the symbol combination stopped and displayed on the activated pay line 29.

[0017] Additionally, various indicator lamps, such as LED lamps, are arranged on the central panel CPL of the middle panel assembly 20. In this embodiment, the indicator lamps include a MAX-BET switch indicator lamp (not shown), a bet number indicator lamp 46b, an insert possible indicator (INSERT) lamp 46c, a game start indicator (START) lamp 46d, a replay indicator (REPLAY) lamp 46e, a status indicator (GAME OVER) lamp 46f, a credit number indicator (CREDIT) lamp 46h, and a payout number indicator (PAYOUT) lamp 46j. These indicator lamps are configured to be controlled by a main control board 110, which will be described later.

[0018] The MAX-BET switch indicator lamp (not shown) is lit when a bet of game medals is possible, and is disposed inside the MAX-BET switch (not shown) provided in the MAX-BET switch unit 23, and when lit, causes the MAX-BET switch to light up partially or entirely. The other indicator lamps are disposed on the sides or below the reel window W on the central panel CPL of the middle panel assembly 20.

[0019] The bet number indicator lamp 46b displays the number of gaming medals bet, and is composed of a 1-bet indicator lamp 46bC that lights up when one gaming medal is bet, a 2-bet indicator lamp 46bB that lights up when two gaming medals are bet, and a 3-bet indicator lamp 46bA that lights up when three gaming medals are bet. The insert possible indicator lamp 46c lights up when gaming medals can be inserted, and the game start indicator lamp 46d lights up when a game can be started by operating the start lever 25. The replay indicator lamp 46e lights up when a replay role is achieved in any game and gaming medals are automatically bet by the automatic bet process.

[0020] The status display lamp 46f is lit when the betted game medals and / or the stored game medals are settled. The stored number display lamp 46h is a 7-segment display that indicates the number of stored (credited) game medals, and the payout number display lamp 46j is a 7-segment display that indicates the number of game medals that will be paid out when a minor winning combination (a game combination that is configured to pay out a predetermined number of game medals when it is achieved) is achieved.

[0021] The payout number display lamp 46j is also configured to display letters (alphabet) or numbers (error code) indicating the type of error when some abnormality (error) occurs in the slot machine 1. Furthermore, the payout number display lamp 46j also has a function to display a navigation number (symbols or numbers) indicating the operation order (press order) of the stop switches 26a to 26c.

[0022] A transparent lower panel cover 31 is attached to the center of the lower panel assembly 30, and a pair of lower speakers 32a, 32b are arranged on the left and right sides of the lower panel cover 31. A translucent lower panel base with a predetermined design and a lower panel illumination lamp (neither of which are shown) are attached to the back side of the lower panel cover 31, and when the lower panel illumination lamp is turned on, the design on the lower panel base is illuminated from behind.

[0023] The tray assembly 40 has a game medal payout outlet 41 for paying out game medals, and is provided with a game medal storage tray 42 for storing game medals, facing the game medal payout outlet 41. An ashtray 43 is provided on the left side of the game medal storage tray 42.

[0024] <Internal structure of a slot machine> As shown in FIG. 3, a medal payout device 50 is provided in the lower part of the cabinet 5 (above the bottom plate 5d) for paying out game medals acquired when a predetermined winning mode is achieved as a result of playing a game. The medal payout device 50 has a hopper 51 that physically stores (retains) game medals inserted through the medal insertion slot 22 and validly received, and an ejection port 52 that ejects the game medals stored in the hopper 51 one by one. An auxiliary storage 53 for storing game medals that overflow from the hopper 51 is provided near the medal payout device 50, and a fullness detection unit (not shown) is provided for detecting whether the auxiliary storage 53 is full (a state in which game medals may overflow from the auxiliary storage 53). In addition, a power supply device 55 is provided to the left of the medal payout device 50 for supplying power to various devices installed in the slot machine 1.

[0025] A middle plate 5f is provided in the center of the cabinet 5, spanning the left and right side plates 5a and 5b, and a reel unit 60 is mounted on the middle plate 5f. The reel unit 60 includes the three reels 3a, 3b, and 3c described above and three stepping motors (described below) for rotating the reels 3a to 3c. The left reel 3a, the center reel 3b, and the right reel 3c are each made of a translucent material, and a translucent reel tape bearing a variety of symbols is attached to their outer peripheries. Each of the reels 3a to 3c is also provided with a back lamp (described below). An external centralized terminal board 80 is mounted above the right side plate 5b, and outputs game-related information to an external hall computer or the like. The output game-related information includes, for example, the number of inserted medals, the number of payouts, and the number of bonus games and automatic time slot games that have started.

[0026] A main control device 100, which mainly controls the progress of the game, is provided at the top of the cabinet 5 (on the upper inner surface of the back panel 5e). For example, when a specified number of game medals (e.g., three) are inserted and the start lever 25 is operated, the main control device 100 performs a prize draw and starts the rotation of the reels 3a to 3c. When the stop switches 26a, 26b, and 26c are stopped, the main control device 100 controls the reels to stop based on the result of the prize draw. Here, the first stop switch operation performed when all the reels are spinning is referred to as the first stop operation. Furthermore, the second stop switch operation performed after the first stop operation and with the remaining two reels spinning is referred to as the second stop operation. Furthermore, the last stop switch operation performed after the second stop operation and with only one reel remaining spinning is referred to as the third stop operation. When all the reels have stopped, if a symbol combination of a small winning combination is aligned on the winning line 29 (a small winning combination is won), the medal payout device 50 is controlled to pay out medals in the number corresponding to the small winning combination.

[0027] <Front door rear configuration> FIG. 4 shows a front view of the front door 2 as seen from the rear. Since FIG. 4 illustrates the front door 2 as seen from the rear, the left and right directions of the arrows in FIG. 4 are reversed compared to FIG. 2. On the rear (back) side of the front door 2, a sub-controller 500 is provided above the reel window W. The sub-controller 500 controls various performance devices (such as the first performance lamp 12, the second performance lamps 13a and 13b, the liquid crystal display device 11, and the upper speakers 15a and 15b) based on various commands sent from the main control unit 100, thereby executing various performances to enhance the enjoyment of the game depending on the game situation. These functions are realized by various components mounted on a sub-control board (described later) housed in the sub-board case 501. The sub-controller 500 and main control unit 100 are electrically connected using a cable harness, and information can be transmitted between these devices in only one direction, from the main control unit 100 to the sub-controller 500.

[0028] A medal selector 650 is provided below and to the right of the reel window W to select whether or not a game medal inserted through the medal insertion port 22 can be validly accepted. If the game medal inserted through the medal insertion port 22 can be validly accepted, the medal selector 650 passes it through a receiving passage 71 leading to the hopper 51, and if the game medal cannot be validly accepted, the medal selector 650 causes it to flow down a return passage 72 leading to the game medal payout outlet 41. In addition, a medal passing port 73 is formed in the return passage 72 so as to be aligned with the game medal ejection port 52 provided in the medal payout device 50.

[0029] <Main control unit configuration> Next, the configuration of main control device 100 according to this embodiment will be described with reference to FIGS. 5 to 13. As shown in FIGS. 7 to 9, main control device 100 is configured to include main control board 110 and main board case 210 that houses main control board 110. As shown in FIG. 8, main control board 110 is configured to include control chip 121, information display lamp 156, multiple electrical connectors such as main board connector 161, and printed circuit board 111 on which these various components are mounted. The various components mounted on printed circuit board 111 are mounted on a surface FS (also referred to as a "first surface" or "board mounting surface") of printed circuit board 111. Therefore, when main control device 100 is installed on back plate 5e of housing 5 (see FIG. 3), surface FS faces forward and is aligned vertically. Details of main control board 110 will be described later.

[0030] As shown in FIGS. 7 to 9, main board case 210 has case body 211 and case lid 221, and is configured to be able to store main control board 110 inside the case formed by joining case body 211 and case lid 221. As shown in FIG. 8, case body 211 is formed from a transparent resin material in a generally rectangular box shape that opens forward, and multiple coupling grooves 212 are formed in each of the upper and lower wall portions. This coupling groove 212 is an L-shaped groove consisting of an insertion groove portion that opens forward and a locking groove portion that extends rightward from the rear of the insertion groove. Case lid 221 is formed from a transparent resin material in a generally rectangular box shape that opens rearward, and multiple engagement protrusions (not shown) are formed on the inner surfaces of the upper and lower wall portions at positions corresponding to the coupling grooves 212. This engagement protrusion is inserted from the front into the insertion groove of the coupling groove 212 of the case body 211, and the case lid 221 is slid to the right relative to the case body 211 to insert the engagement protrusion into the locking groove of the coupling groove 212, thereby restricting the movement of the case lid 221 in the forward / backward, up / down and rightward directions relative to the case body 211, and the case body 211 and the case lid 221 are configured to be coupled together.

[0031] As shown in FIGS. 8 and 10, the right side of the case body 211 is formed with a body-side coupling portion 213 and a first body-side sealing portion 214 to which a sealing cover 241 is attached. A lid crimping member (not shown) having a locking claw is attached inside the body-side coupling portion 213. Two case mounting protrusions 219 protruding to the right are formed on the right side surface of the first body-side sealing portion 214. The left side of the case body 211 is formed with a body-side temporary engaging portion 215 that can engage with a used body crimping member 340 (see FIG. 11) when recovering the main board case 210. A second body-side sealing portion 216 is formed at the bottom of the case body 211. A board support protrusion 217 is formed on the left front side of the case body 211 to support the main control board 110 so as not to bend.

[0032] 7 and 8, on the right side of case lid 221, when case body 211 and case lid 221 are joined as described above, lid-side coupling portion 223 is formed which is coupled with body-side coupling portion 213 of case body 211, and first lid-side sealing portion 224 which is coupled with first body-side sealing portion 214 of case body 211. When body-side coupling portion 213 and lid-side coupling portion 223 are joined, a locking claw of a lid crimping member (not shown) attached within body-side coupling portion 213 is inserted into a locking groove within lid-side coupling portion 223, thereby restricting sliding movement of case lid 221 to the left relative to case body 211 (in the direction in which case lid 221 is removed), and case lid 221 is fixed so that it cannot be removed from case body 211. A sealing sticker 242 is affixed across the first body-side sealing portion 214 and the first lid-side sealing portion 224, and a sealing cover 241 is configured to be attached by sliding it from the right to the first body-side sealing portion 214 and the first lid-side sealing portion 224 so as to cover the sealing sticker 242. After the sealing cover 241 is attached to the first body-side sealing portion 214 and the first lid-side sealing portion 224, a cutter member 243 is attached so that the cutting portion of the cutter member 243 is positioned inside the sealing cover 241. Therefore, when the sealing cover 241 is slid leftward to be removed, the sealing sticker 242 is cut by the cutting portion of the cutter member 243.

[0033] A cover portion 225 is formed on the left side of case lid 221. When case body 211 and case lid 221 are joined as described above, cover portion 225 receives and covers body-side temporary engagement portion 215 of case body 211. An upper portion of cover portion 225 is formed with upper-case fixing portion 225a that can be engaged with body crimping member 340 (see FIG. 11) described below and also face crimping-type member 345 (see FIG. 11) described below. A lower portion of cover portion 225 is formed with lower-case fixing portion 225b that can face crimping-type member 345 and also engage with body crimping member 340. A lid-side temporary engagement portion 225c is formed in the middle of cover portion 225. Cover portion 225 can engage with used body crimping member 340 while overlapping body-side temporary engagement portion 215 of case body 211.

[0034] A Nylatch-type upper temporary fastener 238a is formed at the upper left end of the case lid 221, which can be inserted into an upper temporary fastening hole 348a (see FIG. 11) of the bracket member 330, which will be described later. A Nylatch-type lower temporary fastener 238b is formed at the lower left end of the case lid 221, which can be inserted into a lower temporary fastening hole 348b (see FIG. 11) of the bracket member 330. A second lid-side seal 226 is formed at the bottom of the case lid 221, which is connected to the second body-side seal 216 of the case body 211. When the second body-side seal 216 and the second lid-side seal 226 are connected, a laser device or the like is used to print across the second body-side seal 216 and the second lid-side seal 226, thereby sealing the main board case 210.

[0035] A left-side connector exposing portion 227 that penetrates from front to back is formed on the left side of the front face of the case lid 221 to expose, to the front, the main board side connector 161 of the main control board 110 housed inside the case. A cable connector 192 provided at one end of a front door cable harness 191 can be fitted and connected to the main board side connector 161 exposed through the left-side connector exposing portion 227 (see FIG. 5).

[0036] A connector cover 246 that covers the left-side connector exposed portion 227 from the front is attached to the case lid 221. A groove-shaped first cover crimping attachment portion 229 is formed on the front surface of the case lid 221, and a first cover crimping member 228 having a locking claw can be attached by sliding it from above into the first cover crimping attachment portion 229. When the connector cover 246 is attached to the case lid 221, the first cover crimping member 228 attached to the first cover crimping attachment portion 229 is positioned inside the connector cover 246, and the locking claw of the first cover crimping member 228 is inserted into the locking groove in the connector cover 246. Therefore, the connector cover 246 is fixed so that it cannot be removed from the case lid 221 unless the connector cover 246 is destroyed to release the locking state with the first cover crimping member 228.

[0037] The lower front side of the case lid 221 is formed with first to fourth lower connector exposing portions 231 to 234 that penetrate forward and backward to expose the reel connector 162, the sub-board connector 163, the setting change device connector 164, and the collator connector 165 of the main control board 110 housed inside the case. The reel connector 162 exposed through the first lower connector exposing portion 231 is adapted to be mated with a connector of a cable harness (not shown) electrically connected to the reel control board (not shown). The sub-board connector 163 exposed through the second lower connector exposing portion 232 is adapted to be mated with a connector of a cable harness (not shown) electrically connected to the sub-control device 500. The setting change device connector 164 exposed through the third lower connector exposing portion 233 is adapted to be mated with a connector of a cable harness (not shown) electrically connected to the setting change device 350. The connector 165 for the collator exposed through the fourth lower connector exposure portion 234 can be fitted and connected to the connector of a cable harness (not shown) electrically connected to the collator (not shown).

[0038] A sticker attachment section 235 onto which a crimping usage record sticker 248 is attached is formed in the center of the front surface of the case lid 221. The sticker attachment section 235 is formed in a rectangular recessed shape that matches the outer periphery of the crimping usage record sticker 248. The crimping usage record sticker 248 is formed in the shape of a transparent sheet on which letters or figures are printed for recording the date when the main board case 210 was sealed, etc. (hereinafter referred to as the crimping usage record).

[0039] A recess 237 is formed on the inside of the case lid 221 at a portion of the case lid 221 that overlaps with the information display lamp 156 of the main control board 110. As shown in FIGS. 7 to 9, the recess 237 has a bottom 237e that is lower than the ceiling of the case lid 221, and an upper wall 237a, a lower wall 237b, a left wall 237c, and a right wall 237d that surround the front side of the bottom 237e from above, below, left, and right. The bottom 237e is formed in the shape of a flat plate that overlaps with and extends substantially parallel to the information display lamp 156 near the front of the information display lamp 156. The upper wall 237a, the lower wall 237b, and the left wall 237c are formed in the shape of walls that extend in the front-rear direction. Of the top, bottom, left and right walls 237a to 237d, the right wall 237d located farther from the hinge mechanisms 6a to 6c is formed in a wall shape that slopes to the right (farther from the hinge mechanisms 6a to 6c) as it extends forward.

[0040] As shown in FIG. 5, the main board case 210, which houses the main control board 110 inside the case, is attached to the upper part of the housing 5 (the upper inner surface of the back panel 5e) via a board case attachment mechanism 300. As shown in FIGS. 11 and 12, the board case attachment mechanism 300 is configured to include a left base member 310 attached to the upper left part of the back panel 5e, a right base member 320 attached to the upper right part of the back panel 5e, and a bracket member 330 attached to the left base member 310 so as to be swingable in the front-to-rear direction. The main board case 210 is attached to the inside of the bracket member 330, facing forward. The left end of the bracket member 330 is connected to the left base member 310 so as to be swingable in the front-to-rear direction. Meanwhile, the right end of the bracket member 330 is configured to be fixed to the right base member 320 using a lock member 360. As a result, the main board case 210 is swingably attached to the upper part of the housing 5 via the board case attachment mechanism 300.

[0041] The left-side base member 310 is formed in a block shape extending in the vertical direction and is attached to the upper left side of the back plate 5e of the housing 5 (near the lower side of the top plate 5c) using a mounting screw (not shown). The left-side base member 310 is formed with three base-side engaging portions 311, 312, and 313 aligned in the vertical direction, each having a hinge hole engageable with a bracket-side engaging portion 331, 332, and 333 of the bracket member 330. The right-side base member 320 is formed in a block shape extending in the vertical direction and is attached to the upper right side of the back plate 5e of the housing 5 (near the lower side of the top plate 5c) using a mounting screw (not shown). The right-side base member 320 is configured to be engageable with a locking protrusion (not shown) provided on the right side of the rear surface of the bracket member 330.

[0042] The bracket member 330 is formed using a transparent resin material in a generally rectangular box shape that is open forward, and is configured so that the main board case 210 is attached to the internal space of the bracket member 330 to support the main board case 210. Three bracket-side engaging portions 331, 332, and 333, each having a hinge shaft that can be rotatably engaged with the base-side engaging portions 311, 312, and 313 of the left base member 310, are formed side by side in the vertical direction on the outer surface of the left wall of the bracket member 330. As a result, the left end portion of the bracket member 330 is coupled to the left base member 310 so as to be swingable in the front-to-rear direction with the base-side engaging portions 311, 312, and 313 engaged with the bracket-side engaging portions 331, 332, and 333.

[0043] Upper and lower case crimping attachment sections 334, 335 are formed adjacent to the left wall within bracket member 330, to which main body crimping member 340 and crimping-type member 345 are attached. Main body crimping member 340 (or crimping-type member 345) having a locking claw is inserted and attached through an opening formed on the right side of upper case crimping attachment section 334. Crimping-type member 345 (or main body crimping member 340) without a locking claw is inserted and attached through an opening formed on the right side of lower case crimping attachment section 335.

[0044] An upper temporary fixing hole 348a into which the upper temporary fixing device 238a of the main board case 210 (case lid 221) can be inserted is formed at the upper left end portion within the bracket member 330. A lower temporary fixing hole 348b into which the lower temporary fixing device 238b of the main board case 210 (case lid 221) can be inserted is formed at the lower left end portion within the bracket member 330. In addition, a cable clamp 336 capable of fixing and holding the front door cable harness 191 described above is formed at the lower left end portion of the bracket member 330.

[0045] A locking member 360 for fixing the bracket member 330 to the right-side base member 320 is attached to the upper right portion of the bracket member 330. Furthermore, case mounting holes 339, 339 that open to the left are formed in a vertical line at the upper right portion of the bracket member 330. Case mounting protrusions 219, 219 of the main board case 210 (case main body 211) can be inserted into the case mounting holes 339, 339 from the left.

[0046] To mount main board case 210, which houses main control board 110 inside the case, on bracket member 330, case mounting protrusions 219, 219 of main board case 210 are inserted into case mounting holes 339, 339 of bracket member 330, and then upper and lower temporary fasteners 238a, 238b of main board case 210 are inserted into upper and lower upper temporary fastening holes 348a, 348b of bracket member 330, thereby inserting main board case 210 into bracket member 330. When main board case 210 is inserted into bracket member 330, main body crimping member 340 mounted on upper case crimping mounting portion 334 is positioned inside upper case fixing portion 225a of main board case 210, and the locking claw of main body crimping member 340 is inserted into the locking groove in upper case fixing portion 225a. At the same time, crimping member 345 attached to lower case crimping attachment portion 335 is positioned facing the inside of lower case fixing portion 225b of main board case 210. This fixes main board case 210 so that it cannot be removed from bracket member 330 unless upper case fixing portion 225a of main board case 210 is destroyed to release the engagement with main body crimping member 340.

[0047] In this way, main board case 210 is attached to bracket member 330 by first engaging the right portion of main board case 210 with bracket member 330, and then engaging the left portion. It is also possible to attach crimping member 345 to upper case crimping attachment portion 334 and position them facing each other inside upper case fixing portion 225a, and attach main body crimping member 340 to lower case crimping attachment portion 335 and position them inside lower case fixing portion 225b, so that the locking claws of main body crimping member 340 are inserted into the locking grooves in lower case fixing portion 225b. This allows main board case 210 to be attached to bracket member 330 twice by swapping the up-down positions of main body crimping member 340 and crimping member 345.

[0048] For example, when first mounting main board case 210 to bracket member 330, main body crimping member 340 is mounted to upper case crimping mounting portion 334, and crimping member 345 is mounted to lower case crimping mounting portion 335, and the locking claws of main body crimping member 340 are inserted into locking grooves in upper case fixing portion 225a of main board case 210. In this state, when removing main board case 210 from bracket member 330, upper case fixing portion 225a of main board case 210 is broken to release the locking state with main body crimping member 340. Next, when the removed main board case 210 is attached again to the bracket member 330, a crimping member 345 is attached to the upper case crimping attachment portion 334, and a main body crimping member 340 is attached to the lower case crimping attachment portion 335, and the locking claws of the main body crimping member 340 are inserted into the locking grooves in the lower case fixing portion 225b of the main board case 210. Then, when the main board case 210 is removed from the bracket member 330, the lower case fixing portion 225b of the main board case 210 is broken to release the locking state with the main body crimping member 340. Furthermore, when a manufacturer or the like collects main board case 210 that has been removed from bracket member 330, used body crimping member 340 that has been removed from lower case crimping attachment portion 335 (or upper case crimping attachment portion 334) is engaged with body-side temporary engagement portion 215 and lid-side temporary engagement portion 225c of main board case 210. This restricts sliding movement of case lid 221 to the left (in the direction of removing case lid 221) relative to case body 211 of main board case 210, making it possible to fix case lid 221 so that it cannot be removed from case body 211.

[0049] In addition to the main board case 210 being attached to the bracket member 330, the setting change device 350 is also attached to the bracket member 330. Specifically, the setting change device 350 is attached to the lower right portion of the bracket member 330. To the left of the setting change device 350 at the lower right portion of the bracket member 330, a cable cover 355 is attached to cover a cable harness (not shown) that extends from the setting change device 350 to and connects to the main control board 110 (setting change device connector 164) in the main board case 210. A groove-shaped second cover crimping attachment portion 338 is formed in the lower right portion of the bracket member 330, and a second cover crimping member 337 having a locking claw can be attached by sliding it from the right into the second cover crimping attachment portion 338. When cable cover 355 is attached to bracket member 330, second cover crimping member 337 attached to second cover crimping attachment portion 338 is disposed inside cable cover 355, and the locking claws of second cover crimping member 337 are inserted into locking grooves in cable cover 355. Therefore, cable cover 355 is fixed so that it cannot be removed from bracket member 330 unless cable cover 355 is destroyed to release the locked state with second cover crimping member 337.

[0050] The setting change device 350 is a device operated to change the setting values ​​(such as the probability of winning a game role) of the slot machine 1 that determine the player's advantage. When a setting change key (not shown) is inserted into a setting change key cylinder (not shown) provided on the setting change device 350 and rotated approximately 90 degrees clockwise, and the power switch of the power supply device 55 provided at the bottom of the cabinet 5 is turned ON, the setting change mode (a mode in which the setting values ​​can be changed) begins. Here, the setting change key cylinder and setting change key are collectively referred to as the setting key switch. The setting change device 350 switches the setting values ​​among six levels (1 to 6) each time the setting change switch (not shown) is pressed, and displays the setting values ​​on the setting indicator lamp 151 (see FIG. 13) provided on the main control board 110. When the start lever 25 provided on the front of the front door 2 is operated, the setting values ​​are confirmed. Returning the setting change key to its original position ends the setting change mode and transitions to normal mode. Furthermore, when the setting change key inserted into the setting change key cylinder is rotated approximately 90 degrees to the right (clockwise) in the normal mode, the main control board 110 starts the setting confirmation mode and displays the current setting value on the setting display lamp 151 on the main control board 110. When the setting change key is returned to its original position, the setting confirmation mode ends and the mode switches to normal mode.

[0051] <Main control board configuration> Next, a detailed configuration of the main control board 110 according to this embodiment will be described with reference to Fig. 13. As shown in Fig. 13, the main control board 110 is configured to include a control chip 121, a plurality of ICs (also referred to as "IC components" or "IC drivers"), a monitor lamp 141 also referred to as a monitor LED, a setting display lamp 151 also referred to as a setting display monitor, an information display lamp 156 also referred to as a role ratio monitor (corresponding to a performance display monitor in a pachinko gaming machine), a plurality of electrical connectors such as a main board side connector 161, and a printed circuit board 111 on which these are mounted. The main control board 110 is configured so that the drive circuits and the like operate in accordance with a control program stored in the ROM of the control chip 121, thereby controlling the progress of a game in the slot machine 1. Further, although detailed illustrations are omitted (some components are illustrated by numbering), main control board 110 has mounted on printed circuit board 111 a plurality of capacitors including film capacitor 171, ceramic capacitor 172, electrolytic capacitor 173, and general capacitor 174, a plurality of transistors 175, a plurality of diodes 176, a plurality of resistor arrays 177, and a plurality of resistors 178. The capacitors of main control board 110 are used, for example, to stabilize the power supply of each IC. The transistors of main control board 110 are used, for example, to drive each output circuit. The diodes of main control board 110 are used, for example, as static electricity countermeasures for each IC.

[0052] When the main control board 110 is housed in the main board case 210, all elements except for the electrical connectors, such as the control chip 121, the multiple ICs, the monitor lamp 141, the setting indicator lamp 151, and the information indicator lamp 156, which are mounted on the printed circuit board 111, are covered by the case lid 221 of the main board case 210. As described above, the main board case 210 is formed using a transparent resin material, and is configured so that the control chip 121, the multiple ICs, the monitor lamp 141, the setting indicator lamp 151, and the information indicator lamp 156 can be seen from the outside of the case lid 221.

[0053] A rectangular sticker-attaching area AS is set above the center of main control board 110 (printed circuit board 111). When viewed from outside case lid 221, sticker-attaching area AS is an area that may overlap with crimping usage record sticker 248 affixed to sticker-attaching portion 235 of case lid 221. A rectangular solvent inflow area BS extending vertically is set at the right end of main control board 110. Solvent inflow area BS is an area into which, when attempting to peel off sealing sticker 242 from main board case 210, the solvent used to peel off sealing sticker 242 may flow into main control board 110 inside the case. To the left and below sticker-attaching area AS on main control board 110, a placement restriction area CS extending in a substantially L-shape is set. The placement restriction area CS is an area in which the placement of the setting display lamp 151 and the information display lamp 156 is restricted because it is close to the left side wall portion 221a and the lower wall portion 221b (see Figure 8) of the case lid 221 and there is a risk of visibility being obstructed.

[0054] In addition, in the upper right portion of the printed circuit board 111, there is provided a drawing section 112 on which the name of the board manufacturer is printed using a laser device or the like to prove that the main control board 110 is not an unauthorized board. This drawing section 112 is also covered by the case lid 221 of the main board case 210 when the main control board 110 is housed in the main board case 210, and is configured so that the drawing section 112 can be seen from the outside of the case lid 221. The drawing section 112 on which the name of the board manufacturer is drawn is positioned outside the sticker attachment area AS so that the name of the board manufacturer can be easily identified. Note that the name of the board manufacturer is not limited to being composed of characters only, and may be, for example, a combination of characters and a corporate mark, or may be a configuration including at least one of characters and a graphic.

[0055] The information display lamp 156 (and setting display lamp 151) is thicker than the other electric elements, and if the drawing unit 112 is placed near the information display lamp 156 (and setting display lamp 151), it may be hidden in the shadow of the information display lamp 156 (and setting display lamp 151), reducing visibility. For this reason, the drawing unit 112 is placed at a distance from the information display lamp 156 (and setting display lamp 151) that does not impede the visibility of the drawing unit 112 when viewed from outside the case lid 221. The name of the board manufacturer is printed after all electric elements have been mounted on the printed circuit board 111. The soldered portions of the information display lamp 156 (and setting display lamp 151) have a relatively heat-sensitive and fragile structure. Therefore, when printing the name of the board manufacturer using a laser device, it is preferable to position the drawing unit 112 away from the information display lamp 156 (and the setting display lamp 151) in order to prevent the heat of the laser from affecting the information display lamp 156 (and the setting display lamp 151).

[0056] The control chip 121 is configured with a CPU that performs various arithmetic processing related to games, a ROM that is a read-only memory device that stores control programs and the like, and a RAM that is a memory device that can write and read information. The control chip 121 is mounted to the right of the center of the printed circuit board 111, i.e., on the side of the printed circuit board 111 far from the hinge mechanisms 6a to 6c. To make it easier to check whether or not tampering has been performed on the control chip 121, the control chip 121 is located in a position that is not a sticker attachment area AS. Note that the control chip 121 is preferably located in a position that is not a solvent inflow area BS to prevent adverse effects from the solvent. The control chip 121 is also located at a distance from the setting display lamp 151 and the information display lamp 156 that allows the first to third display control ICs 132A to 132C to be placed therein.

[0057] The multiple ICs include first to second oscillator ICs 131A to 131B, first to third display control ICs 132A to 132C, and first to eleventh main board ICs 133A to 133K. The first to second oscillator ICs 131A to 131B are electrically connected to the control chip 121 and configured to generate clocks used by the control chip 121. The first to second oscillator ICs 131A to 131B are mounted on the right side of the center of the printed circuit board 111. The first to second oscillator ICs 131A to 131B are arranged in positions near the bottom of the control chip 121 that do not constitute the sticker attachment area AS. Note that the first and second oscillator ICs 131A to 131B may be arranged in positions that constitute the sticker attachment area AS as long as they are near the control chip 121. This is because, unlike the control chip 121, there is less need to easily check whether or not any fraud has been committed.

[0058] The first to third display control ICs 132A to 132C are ICs for performing dynamic lighting control of the 7-segment LEDs of the stored number display lamp 46h, the dispensing number display lamp 46j, the setting display lamp 151, and the information display lamp 156. The first display control IC 132A is electrically connected to the control chip 121, and is also electrically connected to the main board side connector 161, the setting display lamp 151, and the information display lamp 156. The first display control IC 132A functions as a segment driver that sets (decodes) numbers and the like (numbers, alphabets, various symbols, etc.) to be displayed on the stored number display lamp 46h, the dispensing number display lamp 46j, the setting display lamp 151, and the information display lamp 156 in accordance with control signals transmitted from the control chip 121.

[0059] The second display control IC 132B is electrically connected to the control chip 121 and is also electrically connected to the main board connector 161 and the setting display lamp 151. The second display control IC 132B functions as a digit driver that switches whether to display numbers, etc. (set by the first display control IC 132A, which is a segment driver) on any of the digits (each digit) of the stored number display lamp 46h, the dispensed number display lamp 46j, and the setting display lamp 151 in response to a control signal transmitted from the control chip 121. The third display control IC 132C is electrically connected to the control chip 121 and is also electrically connected to the information display lamp 156. The third display control IC 132C functions as a digit driver that switches whether to display numbers, etc. (set by the first display control IC 132A, which is a segment driver) on any of the digits (each digit) of the information display lamp 156 in response to a control signal transmitted from the control chip 121.

[0060] The first to third display control ICs 132A to 132C are mounted on the left side of the center of the printed circuit board 111, i.e., on the side of the printed circuit board 111 closer to the hinge mechanisms 6a to 6c. The first display control IC 132A is disposed to the left of the eleventh main board IC 133K in a position that will become the sticker attachment area AS. The second display control IC 132B is disposed below the first display control IC 132A in a position that will not become the sticker attachment area AS. The third display control IC 132C is disposed above the first display control IC 132A in a position that will become the sticker attachment area AS. Note that all of the first to third display control ICs 132A to 132C may be disposed in positions that will become the sticker attachment area AS. This is because, like the first and second oscillator ICs 131A to 131B, there is little need to easily check whether or not tampering has occurred.

[0061] The other ICs, first to eleventh main board ICs 133A to 133K, are mounted on various portions of printed circuit board 111. For example, as shown in Fig. 13, the main board ICs mounted on the right side of printed circuit board 111 are designated as first main board IC 133A, second main board IC 133B, and third main board IC 133C. Also, for example, the main board ICs mounted on the upper central side of printed circuit board 111 are designated as fourth main board IC 133D, fifth main board IC 133E, sixth main board IC 133F, seventh main board IC 133G, eighth main board IC 133H, ninth main board IC 133I, tenth main board IC 133J, and eleventh main board IC 133K. Hereinafter, when the first to eleventh main board ICs 133A to 133K are referred to collectively, they will be called "main board ICs 133."

[0062] These main board ICs 133 include a driver IC that shapes the waveforms of the on / off signals (digital signals indicating the two states of a switch, on and off) of various switches input from outside, and a latching IC that houses multiple latch circuits that hold the on / off signals of various switches. The "various switches" mentioned above include the bet switch unit 23, start lever 25, stop switches 26a, 26b, and 26c, and adjustment switch 28 shown in FIG. 1, as well as the setting key switch and setting change switch of the setting change device 350 shown in FIG. 5. "Shaping the waveform" refers to, for example, restoring a high-level voltage value to a more appropriate voltage value when the high-level voltage value drops or a low-level voltage value rises, or restoring a signal's rising or falling edge to a sharper value when the signal's rising or falling edge becomes gradual.

[0063] The control chip 121 performs processing to progress the game in response to the ON / OFF signals of the various switches generated by the driver IC. For example, when a predetermined number of game medals have been bet (inserted), the control chip 121 performs processing to rotate the reels 3a, 3b, and 3c when the ON / OFF signal of the start lever 25 changes from OFF to ON. Furthermore, when the ON / OFF signal of the stop switch corresponding to a spinning reel changes from OFF to ON, the control chip 121 performs processing to stop that reel. Furthermore, when the ON / OFF signal of the setting change switch changes from OFF to ON in the setting change mode, the control chip 121 changes the setting value. Furthermore, when the ON / OFF signal of the setting key switch changes from OFF to ON while no game is being played, the control chip 121 displays the current setting value on the setting indicator lamp 151 on the main control board 110. Furthermore, when game medals have been credited and the ON / OFF signal of the settlement switch 28 changes from OFF to ON while no game is being played, the main control board 110 activates the medal payout device 50 to return the credited game medals.

[0064] The first main board IC 133A is arranged above and to the right of the control chip 121. The second main board IC 133B is arranged above the control chip 121 and to the left of the first main board IC 133A. The third main board IC 133C is arranged below and near the control chip 121 and near the left of the first and second oscillator ICs 131A to 131B. The first to third main board ICs 133A to 133C are also arranged in positions that do not constitute the sticker attachment area AS.

[0065] The fourth main board IC 133D is arranged above and to the left of the second main board IC 133B. The fifth main board IC 133E is arranged to the left of the fourth main board IC 133D. The sixth main board IC 133F is arranged below the fifth main board IC 133E. The seventh main board IC 133G is arranged below the sixth main board IC 133F. The eighth main board IC 133H is arranged below the seventh main board IC 133G. The ninth main board IC 133I is arranged to the left of the fifth main board IC 133E. The tenth main board IC 133J is arranged below the ninth main board IC 133I and to the left of the sixth main board IC 133F. The eleventh main board IC 133K is placed below the tenth main board IC 133J and to the left of the seventh main board IC 133G. The fourth to eleventh main board ICs 133D to 133K are placed in positions that will become sticker attachment areas AS.

[0066] The monitor lamp 141 is composed of 20 LED elements 142 arranged in two rows of 10 LEDs on the left and right, and illuminates according to the operating status of each part of the slot machine 1. The monitor lamp 141 is used to check for malfunctions. For example, some of the 20 LED elements 142 constituting the monitor lamp 141 illuminate when each of the reels 3a to 3c of the reel unit 60 is not positioned (or positioned) at a predetermined rotation reference position. For example, other parts of the 20 LED elements 142 illuminate when the start lever 25 is not in an operating state (or in an operating state). The monitor lamp 141 is mounted on the lower central portion of the printed circuit board 111 (below the fourth to eleventh main board ICs 133D to 133K). To make it easy to check the illumination status (on or off) of each LED element 142, the monitor lamp 141 is positioned outside the sticker attachment area AS. In order to avoid adverse effects of the solvent, the monitor lamp 141 is preferably placed in a position that does not become the solvent inflow area BS. Furthermore, since the monitor lamp 141 is electrically connected to the main board side connector 161, it is preferably placed in the vicinity of the main board side connector 161.

[0067] The multiple electrical connectors include a main board connector 161, a reel connector 162, a sub-board connector 163, a setting change device connector 164, and a collator connector 165. The main board connector 161 is mounted on the left end of the printed circuit board 111, that is, on the side of the printed circuit board 111 closer to the hinge mechanisms 6a to 6c than the first to third display control ICs 132A to 132C, the setting display lamp 151, and the information display lamp 156. As described above, the main board connector 161 is adapted to be fitted and connected to the cable connector 192 provided at one end of the front door cable harness 191 (see FIG. 5).

[0068] The front door cable harness 191 is also electrically connected to a central display board 196 (see FIG. 5) disposed in the center of the rear side (rear side) of the front door 2. As shown in FIGS. 5 and 6, the front door cable harness 191 is wired from the housing 5 toward the front door 2 using a cable clamp 336 of the bracket member 330 and a plurality of cable clamps 194 disposed on the inner side of the left side plate 5a of the housing 5 (located on the side where the hinge mechanisms 6a to 6c are provided). At this time, the front door cable harness 191 is wired downward from the main board-side connector 161 toward the cable clamp 336 of the bracket member 330 so as not to cover the front of the information display lamp 156 (and the setting display lamp 151) disposed near the main board-side connector 161 and impede visibility. However, the front door cable harness 191 may cover the cover portion 225 of the case lid 221 located to the left of the main board-side connector 161, potentially obstructing the visibility of the first and second case crimping members 340, 345, etc. Therefore, as described above, it is preferable that the upper case fixing portion 225a engageable with the main body crimping member 340 be located above the lower case fixing portion 225b and the lid-side temporary engagement portion 225c of the cover portion 225. In this embodiment, the front door cable harness 191 is indicated by a two-dot chain line in FIGS. 5 and 6 to facilitate explanation of its positional relationship with other components. Also, on the inner surface of the left side plate 5a, above the cable clamp 194, a sticker (hereinafter referred to as a "monitor LED list sticker LST") is affixed. The sticker lists part numbers identifying the LED elements 142 constituting the monitor lamp 141 and the various switches and sensors corresponding to each LED element 142. The contents of this monitor LED list sticker LST will be explained in detail later.

[0069] The central display board 196 is electrically connected to a left relay board 197 and a right relay board 198, etc., provided on the left and right rear sides of the reel window W. Various indicator lamps (BET number indicator lamp 46b, deposit possible indicator lamp 46c, game start indicator lamp 46d, replay indicator lamp 46e, status indicator lamp 46f, stored number indicator lamp 46h, payout number indicator lamp 46j, etc.) arranged in the reel window W are mounted on or electrically connected to the left relay board 197 and the right relay board 198. As a result, control signals for controlling the operation of the various indicator lamps are transmitted from the main control board 110 to the left relay board 197 and the right relay board 198 via the front door cable harness 191 and the central display board 196, and the operation of the various indicator lamps is controlled by the main control board 110.

[0070] Each of the relay boards described above, together with a cover that covers the relay board, is attached directly to the rear side of the front door 2 with a mounting screw, but the position of the mounting screw is determined so that it is not located directly above the board-mounted connector that mates with the cable harness described above on each relay board. Since the pins of a board-mounted connector are generally not covered with an insulating coating or the like (i.e., the pins are exposed), by shifting the position of the mounting screw, if the mounting screw comes loose for some reason, the loose screw will not short-circuit the pins of the board-mounted connector.

[0071] As mentioned above, the control signals for controlling the operation of the stored number indicator lamp 46h and the payout number indicator lamp 46j are configured to be output from the main board side connector 161 via the control chip 121, the first display control IC 132A, and the second display control IC 132B of the main control board 110. Control signals for controlling the operation of the BET number indicator lamp 46b, the deposit possible indicator lamp 46c, the game start indicator lamp 46d, the re-play indicator lamp 46e, etc. are also configured to be output from the main board side connector 161 via the control chip 121, the first display control IC 132A, and the second display control IC 132B of the main control board 110.

[0072] The reel connector 162 is mounted on the left side of the lower end of the printed circuit board 111. As described above, the reel connector 162 is adapted to be mated with a connector of a cable harness (not shown) electrically connected to a reel control board (not shown). The sub-board connector 163 is mounted in the center of the lower end of the printed circuit board 111. As described above, the sub-board connector 163 is adapted to be mated with a connector of a cable harness (not shown) electrically connected to a sub-control board (not shown). The setting change device connector 164 is mounted on the left side of the lower end of the printed circuit board 111. As described above, the setting change device connector 164 is adapted to be mated with a connector of a cable harness (not shown) electrically connected to the setting change device 350. The collator connector 165 is mounted on the left side of the lower end of the printed circuit board 111 alongside the setting change device connector 164. As described above, the connector 165 for the collator is adapted to be fitted and connected to the connector of the cable harness (not shown) electrically connected to the collator (not shown).

[0073] As described above, the setting display lamp 151 displays a setting value of the slot machine 1 that determines the degree of advantage for the player in seven segments. The setting display lamp 151 is configured using a seven-segment LED that can display one-digit numbers. The setting display lamp 151 is mounted to the left of the center of the printed circuit board 111, that is, on the side of the printed circuit board 111 that is closer to the hinge mechanisms 6a to 6c than the control chip 121. To make it easier to check the setting value displayed by the setting display lamp 151, the setting display lamp 151 is placed between the first display control IC 132A and the main board side connector 161, in a position that does not fall within the sticker attachment area AS or the placement restriction area CS.

[0074] The information display lamp 156 displays information related to the bonus feature ratio in seven segments. The information display lamp 156 is configured using a seven-segment LED capable of displaying four-digit numbers, etc. As information related to the bonus feature ratio, for example, the information display lamp 156 can display a four-digit number combining a two-digit identifier symbol indicating the type of bonus feature ratio, etc. (bonus feature ratio, consecutive bonus feature ratio, advantageous period ratio, etc.) and a two-digit ratio corresponding to the identifier symbol. The information display lamp 156 is mounted to the left of the center of the printed circuit board 111, i.e., on the side of the printed circuit board 111 closer to the hinge mechanisms 6a to 6c than the control chip 121. To make it easier to check the information related to the bonus feature ratio displayed by the information display lamp 156, the information display lamp 156 is positioned between the first display control IC 132A and the third display control IC 132C, outside the sticker attachment area AS and the placement restriction area CS. It is not preferable to place the information display lamp 156 adjacent to the sticker affixing area AS, because there is a possibility that the information display lamp 156 will be blocked by the usage record sticker 248 when viewed from diagonally forward. Therefore, it is preferable to place the information display lamp 156 at a distance to the left of the sticker affixing area AS that allows the information display lamp 156 to be seen without being blocked by the crimped usage record sticker 248 even from diagonally forward right.

[0075] Furthermore, unlike the control chip 121, the information display lamp 156 (and the setting display lamp 151) are reusable components. Therefore, when attempting to peel off the sealing seal 242 from the main board case 210, if the solvent used to peel off the sealing seal 242 flows into the main control board 110 inside the case, it is preferable that the solvent does not adhere to the information display lamp 156 (and the setting display lamp 151). For this reason, the information display lamp 156 (and the setting display lamp 151) is arranged in a position that does not become the solvent inflow area BS.

[0076] In order to efficiently form the conductor pattern on the printed circuit board 111 (without making it complicated), it is preferable to mount the information display lamp 156 on the path of the conductor pattern between the first and third display control ICs 132A and 132C and the main board side connector 161. Therefore, the information display lamp 156 is disposed near the first and third display control ICs 132A and 132C and near the main board side connector 161. The information display lamp 156 is electrically connected to the first and third display control ICs 132A and 132C and is spaced sufficiently close from the first and third display control ICs 132A and 132C that other electrical elements (ICs, etc.) on the main control board 110 are not provided. The information display lamp 156 is also spaced sufficiently close from the main board side connector 161 that other electrical elements (ICs, etc.) on the main control board 110 are not provided. If other electrical elements (ICs, etc.) are provided between the information display lamp 156 and the first and third display control ICs 132A, 132C or the main board side connector 161, it will be necessary to bypass them, making it difficult to form the conductor pattern efficiently.

[0077] As described above, the first display control IC 132A serves as both the segment driver for the setting indicator lamp 151 and the segment driver for the information indicator lamp 156. In order to efficiently form a conductor pattern on the printed circuit board 111, it is preferable to mount the information indicator lamp 156 near the setting indicator lamp 151. Therefore, the information indicator lamp 156 is disposed near and above the setting indicator lamp 151. The information indicator lamp 156 is spaced from the setting indicator lamp 151 close enough to prevent other electrical elements (ICs, etc.) from being disposed on the main control board 110. However, in order to prevent the numbers, etc. displayed by the setting indicator lamp 151 and the information indicator lamp 156 from being mistaken for a series of (five-digit) numbers, etc., it is preferable that the setting indicator lamp 151 and the information indicator lamp 156 are disposed so as not to be aligned horizontally.

[0078] The light emitted by each LED element 142 of the monitor lamp 141 is relatively bright light. Therefore, if the information display lamp 156 is placed near the monitor lamp 141, the light emitted from each LED element 142 may reach the information display lamp 156, potentially reducing the visibility of the information related to the role ratio displayed by the information display lamp 156. Therefore, the information display lamp 156 is placed at a distance from the monitor lamp 141 that prevents the light from each LED element 142 from reaching the information display lamp 156. If other electrical elements are placed so as to block the light from each LED element 142, the distance between the information display lamp 156 and the monitor lamp 141 may be a distance that allows the light from each LED element 142 to reach the information display lamp 156. Note that the information display lamp 156 can also be placed near the monitor lamp 141. In this case, the information related to the role ratio displayed by the information display lamp 156 and the light-emitting state of each LED element 142 can be simultaneously viewed, thereby reducing the effort required for checking.

[0079] If the main board side connector 161 is positioned above the information display lamp 156, the front door cable harness 191 electrically connected to the main board side connector 161 may hang down, covering the front of the information display lamp 156 and impairing visibility. For this reason, the main board side connector 161 is positioned near the left of the information display lamp 156, excluding the area above the information display lamp 156. For the same reason, other electrical connectors such as the reel connector 162, the auxiliary board connector 163, the setting change device connector 164, and the collator connector 165 are also positioned in positions excluding the area above the information display lamp 156. Furthermore, even if electrical connectors such as the main board side connector 161 are positioned in a position excluding the area above the information display lamp 156, if there is a possibility that the cable harness will cover the front of the information display lamp 156 and impair visibility, it is preferable to position them in a position that avoids this area.

[0080] The left side portion of main board case 210, from which main board connector 161 is exposed, is fixed to bracket member 330 by first and second case crimping members 340, 945. When attempting to break upper case fixing portion 225a of main board case 210 to release the engagement with main body crimping member 340 (for example, when burning it off with a hot cutter), it is preferable that information display lamp 156 inside the case is not accidentally broken. For this reason, information display lamp 156 is disposed to the right of upper case fixing portion 225a of main board case 210, at a distance sufficient to accommodate other electrical elements (main board connector 161, etc.) on main control board 110.

[0081] As described above, the connector cover 246 is attached to the case lid 221 of the main board case 210 by the first cover crimping member 228. When attempting to destroy the connector cover 246 to release the engagement with the first cover crimping member 228 (for example, when burning it off with a hot cutter), it is preferable that the information display lamp 156 inside the case is not destroyed by mistake. For this reason, the information display lamp 156 is arranged in a position (a position away from the first cover crimping member 228) that does not overlap with the first cover crimping attachment portion 229 of the case lid 221 when viewed from outside the case lid 221.

[0082] If the distance between the case lid 221 of the main board case 210 and the information display lamp 156 is too large, the visibility of the information display lamp 156 may be reduced depending on the viewing angle due to the influence of light reflection on the case lid 221, etc. For this reason, the recess 237 is formed in the portion of the case lid 221 of the main board case 210 that overlaps with the information display lamp 156, as described above. This recess 237 makes it possible to reduce the distance between the case lid 221 (recess 237) of the main board case 210 and the information display lamp 156, thereby suppressing the influence of light reflection on the case lid 221, etc., and improving the visibility of the information display lamp 156. Also, as described above, the right wall portion 237d of the recess 237 is formed in a wall shape that slopes to the right (farther from the hinge mechanisms 6a to 6c) as it extends forward. This right wall portion 237d allows the information display lamp 156 to be seen through the recess 237 (bottom 237e) of the case lid 221 without interfering with the ceiling portion of the case lid 221, even when the main board case 210 inside the housing 5 is viewed from the diagonally front right side where the front door 2 opens.

[0083] The distance between the bottom 237e of the recess 237 and the information indicator lamp 156 is preferably about 0.5 mm. By ensuring a gap between the case lid 221 (recess 237) of the main board case 210 and the information indicator lamp 156 in this way, it is possible to ensure the visibility of the information indicator lamp 156 while preventing actions such as trying to destroy the information indicator lamp 156 by pushing the case lid 221 from the outside or trying to destroy the information indicator lamp 156 by generating static electricity. Furthermore, when the distance between the bottom 237e of the recess 237 and the information indicator lamp 156 is about 0.5 mm, it is preferable that the length and width of the bottom 237e be larger than the information indicator lamp 156 by about 1 mm on each side in order to ensure the visibility of the information indicator lamp 156.

[0084] In main control device 100 configured as described above, to check the components of main control board 110 housed in main board case 210, front door 2 is opened and main board case 210 mounted in housing 5 is viewed from the front or diagonally forward right. Information display lamp 156 is positioned outside sticker area AS on main control board 110 (printed circuit board 111), allowing information about the role ratio displayed by information display lamp 156 to be viewed through recess 237 (bottom 237e) of case lid 221 without being obstructed by crimped usage record sticker 248. Similarly, setting display lamp 151 is positioned outside sticker area AS on main control board 110, allowing the setting value displayed by setting display lamp 151 to be viewed through case lid 221 without being obstructed by crimped usage record sticker 248. Monitor lamp 141 is also arranged in a position that is not in sticker attachment area AS on main control board 110, so it is possible to check the light emission state of each LED element 142 that constitutes monitor lamp 141 through case lid 221 without being obstructed by crimped usage record sticker 248. Control chip 121 is also arranged in a position that is not in sticker attachment area AS on main control board 110, so it is possible to check through case lid 221 whether or not tampering has been done to control chip 121 without being obstructed by crimped usage record sticker 248.

[0085] <Modification> In this embodiment, when a common main control board is used by multiple board manufacturers, the main control board may be provided with multiple drawing sections corresponding to the number of board manufacturers, and the main control board may be configured so that only one drawing section printed with the name of the board manufacturer that actually produced the main control board is left and the other drawing sections can be removed from the main control board. For example, as shown in Fig. 14, when a common main control board 110A is used by two board manufacturers, two drawing sections 112A and 112B may be provided in the upper right corner of printed circuit board 111, on which the names of the two board manufacturers are printed using a laser device or the like.

[0086] The first and second drawing units 112A and 112B are arranged side by side along the outer periphery of the main control board 110A (printed circuit board 111). The first and second drawing units 112A and 112B are connected to the printed circuit board 111 via perforated joints and are configured to be able to be individually removed from the printed circuit board 111. This allows the first and second drawing units 112A and 112B to be removed from the main control board 110A, leaving only the drawing unit on which the name of the board manufacturer that actually manufactured the main control board 110A is printed, while the other drawing unit is removed from the main control board 110A. Therefore, even when a common main control board 110 is used by multiple (two) board manufacturers, the main control board 110A can be provided with a drawing unit on which the name of the board manufacturer that manufactured the main control board 110A is printed.

[0087] As in the above-described embodiment, the first and second drawing sections 112A and 112B are positioned outside the sticker attachment area AS so that the name of the board manufacturer can be easily identified. As in the above-described embodiment, the first and second drawing sections 112A and 112B are positioned at a distance from the information display lamp 156 (and the setting display lamp 151) that does not impede the visibility of each drawing section when viewed from outside the case lid 221. Furthermore, when removing one of the first and second drawing sections 112A and 112B from the main control board 110 while leaving the other, it is preferable that the first and second drawing sections 112A and 112B be positioned away from the information display lamp 156 (and the setting display lamp 151) to prevent the force acting during the removal from affecting the information display lamp 156 (and the setting display lamp 151).

[0088] Other characteristic configurations applicable to the above-described main control boards 110 and 110A will be described below with additional reference to FIGS. 15 to 27. Below, the characteristic configurations will be described using a main control board 410 that is different from the main control boards 110 and 110A. This main control board 410 can be used in the slot machine 1 in place of the main control boards 110 and 110A. The characteristic configurations of the main control board 410 described below can also be applied to the main control boards 110 and 110A. Furthermore, the above-described configurations of the main control boards 110 and 110A can also be applied to the main control board 410.

[0089] Furthermore, the characteristic configuration described below is not limited to the slot machine of this embodiment, but can be combined with a pachinko game machine or other embodiments. In the following description, the directions indicated by the arrows in Figures 15 to 18 will be described as the up-down direction and the left-right direction, respectively. These directions are consistent with the up-down direction and the left-right direction indicated by the arrows in Figure 2.

[0090] <Aspects of lead wires of electrical elements mounted on a substrate> The main control board 410 is mainly composed of a printed circuit board 411 and a plurality of electric elements (electronic components) mounted on a surface portion (also referred to as a "first surface portion") FS of the printed circuit board 411. As shown in FIG. 15, a plurality of types of electric elements are mounted in a predetermined area (an area within a rectangular frame FB10 indicated by a solid line) on the surface portion FS of the printed circuit board 411. Specifically, the plurality of types of electric elements include one IC driver 420A arranged horizontally (with the longitudinal direction of the component parallel to the left-right direction), four resistors 430A arranged side by side in the left-right direction in the vertically oriented state (with the longitudinal direction of the component parallel to the up-down direction), two resistors 430B arranged side by side in the up-down direction in the horizontally oriented state, an IC socket 440A to which one control chip 450A is attached in the horizontally oriented state, and four ceramic capacitors 460A arranged side by side in the left-right direction in the vertically oriented state.

[0091] 15 shows five rectangular frame lines FB11 to FB15, each drawn with a two-dot chain line. These rectangular frame lines FB11 to FB15 are illustrated for the sake of convenience in order to explain the area where electrical elements are mounted on the front surface FS of the printed circuit board 411; they are not actually formed on the front surface FS by printing or the like. The rectangular frame line FB11 indicates the area where the IC driver 420A is mounted, and the rectangular frame line FB12 indicates the area where four resistors 430A are mounted. Similarly, the rectangular frame line FB13 indicates the area where two resistors 430B are mounted, the rectangular frame line FB14 indicates the area where the control chip 450A is mounted via the IC socket 440A, and the rectangular frame line FB15 indicates the area where four ceramic capacitors 460A are mounted.

[0092] The IC driver 420A includes a rectangular parallelepiped package portion (also referred to as a "main body") 421 and a plurality of lead wires (also referred to as "legs" or "terminals") 422 extending from the package portion 421 (in this example, 18 on each side of the package portion 421 along the longitudinal direction, for a total of 36). Each lead wire 422 is formed so that its tip is thinner than its base (the portion close to the package portion 421), and is inserted into and soldered to a plurality of predetermined through-holes (not shown) formed in the printed circuit board 411. The resistors 430A and 430B include a cylindrical package portion 431 and two lead wires 432 extending from both longitudinal ends of the package portion 431, and each lead wire 432 is inserted into and soldered to a plurality of predetermined through-holes formed in the printed circuit board 411.

[0093] The control chip 450A has a rectangular parallelepiped package portion 451 and a plurality of lead wires 452 (in this example, 36 on each side of the package portion 451 along the longitudinal direction, for a total of 72) extending from the package portion 451. The IC socket 440A has a receiving frame portion 441 that receives the package portion 451 of the control chip 450A and a plurality of lead wires 442 (72, the same number as the lead wires 452 of the control chip 450A) extending from the receiving frame portion 441 (see FIG. 16). Each lead wire 442 of the IC socket 440A is electrically connected to each lead wire 452 of the control chip 450A, and is inserted into a predetermined plurality of through holes formed in the printed circuit board 411 and soldered thereto. Ceramic capacitor 460A comprises an elliptical plate-shaped package portion 461 and two lead wires 462 extending from package portion 461, with each lead wire 462 being inserted into a predetermined number of through holes formed in printed circuit board 411 and soldered thereto.

[0094] Fig. 16 shows main control board 410 as viewed from the front side from the back surface RS (also referred to as the "second surface") of printed circuit board 411. Rectangular frame line FB20 shown by a solid line in Fig. 16 corresponds to rectangular frame line FB10 shown in Fig. 15 (showing an area at the same position and of the same size on front surface FS and back surface RS of printed circuit board 411), and five rectangular frame lines FB21 to FB25 shown by two-dot chain lines in Fig. 16 correspond to the five rectangular frame lines FB11 to FB15 shown in Fig. 15. Like rectangular frame lines FB11 to FB15, rectangular frame lines FB21 to FB25 are frame lines shown for convenience in order to explain the areas where electrical elements are mounted, and are not actually formed on back surface RS by printing or the like.

[0095] 16, a large number of lead wires are soldered to the printed circuit board 411 in the area within the rectangular frame line FB20 on the back surface RS of the printed circuit board 411. Specifically, a total of 32 lead wires 422 are soldered to the area within the rectangular frame line FB21, and a total of 8 lead wires 432 are soldered to the area within the rectangular frame line FB22. Furthermore, a total of 4 lead wires 432 are soldered to the area within the rectangular frame line FB23, a total of 72 lead wires 442 are soldered to the area within the rectangular frame line FB24, and a total of 8 lead wires 462 are soldered to the area within the rectangular frame line FB25.

[0096] The 32 lead wires 422 in the area within rectangular frame line FB21 and the 8 lead wires 432 in the area within rectangular frame line FB22 are arranged relatively close to each other in the left-right direction on the back surface RS of the printed circuit board 411. The 32 lead wires 422 in the area within rectangular frame line FB21 are divided into two rows, one above the other, and arranged so that the lead wires 422 in each row are aligned in the left-right direction, and the 8 lead wires 432 in the area within rectangular frame line FB22 are also divided into two rows, one above the other, and arranged so that the lead wires 432 in each row are aligned in the left-right direction, so that in this respect the two are similar. However, the arrangement pitch (the distance between adjacent lead wires 422) of the lead wires 422 aligned in the left-right direction in the area within rectangular frame line FB21 is different from the arrangement pitch of the lead wires 432 aligned in the left-right direction in the area within rectangular frame line FB22 (the former arrangement pitch is shorter than the latter arrangement pitch). Furthermore, the distance between the lead wire 422 located at the top right corner in the area within the rectangular frame line FB21 and the lead wire 432 located at the top left corner in the area within the rectangular frame line FB22 (also referred to as the "shortest distance between the lead wire 422 in the area within the rectangular frame line FB21 and the lead wire 432 in the area within the rectangular frame line FB22") is different from the left-right arrangement pitch of each lead wire 422 in the area within the rectangular frame line FB21 and the left-right arrangement pitch of each lead wire 432 in the area within the rectangular frame line FB22 (the former distance is longer than the latter two arrangement pitches).

[0097] Furthermore, the vertical positions of the lead wires 422 lined up in the left-right direction in the upper row in the area within the rectangular frame line FB21 are different from the vertical positions of the lead wires 432 lined up in the left-right direction in the upper row in the area within the rectangular frame line FB22 (the former are located higher than the latter). Similarly, the vertical positions of the lead wires 422 lined up in the left-right direction in the lower row in the area within the rectangular frame line FB21 are different from the vertical positions of the lead wires 432 lined up in the left-right direction in the upper row in the area within the rectangular frame line FB22 (the former are located lower than the latter). In this way, based on the difference between the arrangement pitch of each lead wire 422 in the area within rectangular frame line FB21 and the arrangement pitch of each lead wire 432 in the area within rectangular frame line FB22, and the shortest distance between the lead wires 422 in the area within rectangular frame line FB21 and the lead wires 432 in the area within rectangular frame line FB22, and also based on the difference between the vertical position of each lead wire 422 lined up in the left-right direction in each row in the area within rectangular frame line FB21 and the vertical position of each lead wire 432 lined up in the left-right direction in each row in the area within rectangular frame line FB22, it can be inferred that the type of electrical element having each lead wire 422 in the area within rectangular frame line FB21 is different from the type of electrical element having each lead wire 432 in the area within rectangular frame line FB22. By focusing on similar points, it can be inferred that the type of electrical element having each lead wire 432 in the area within rectangular frame line FB23 is different from the type of electrical element having each lead wire 422 in the area within rectangular frame line FB21 and the type of electrical element having each lead wire 442 in the area within rectangular frame line FB24, and that the type of electrical element having each lead wire 442 in the area within rectangular frame line FB24 is different from the type of electrical element having each lead wire 462 in the area within rectangular frame line FB25.

[0098] As described above, the 32 lead wires 422 in the area within the rectangular frame line FB21 are divided into two rows, one above the other, with 16 lead wires 422 in each row, arranged side by side in the horizontal direction. The arrangement pitch of the lead wires 422 arranged side by side in the horizontal direction is significantly shorter than the distance between the two rows. Furthermore, (the tip of) each lead wire 422 protrudes linearly from the solder portion (the portion formed by the hardened solder material) SLR by a predetermined length in a position perpendicular to the back surface RS. From the characteristics of each lead wire 422 (such as the number of lead wires, the arrangement pitch of the lead wires, the arrangement of the lead wires, the distance between the rows of the lead wires, the shape (position) of the lead wires, and the protruding length of the lead wires), it is possible to infer, when viewed from the back surface RS side of the printed circuit board 411, that each lead wire 422 soldered in the area within the rectangular frame line FB21 is an IC driver (IC driver 420A in this example) arranged horizontally, among multiple types of electrical elements.

[0099] As described above, the eight lead wires 432 in the region within the rectangular frame line FB22 are also divided into two upper and lower rows, with four lead wires 432 in each row arranged in the left-right direction. The arrangement pitch of the lead wires 432 arranged in the left-right direction is shorter than the distance between the two upper and lower rows, but longer than the arrangement pitch of the lead wires 422 arranged in the left-right direction in the region within the rectangular frame line FB21. From this, it can be inferred that of the eight lead wires 432 soldered in the region within the rectangular frame line FB22, each lead wire 432 in the upper row forms a pair (set) with each lead wire 432 in the lower row, and that the pair of upper and lower lead wires 432 may belong to a single electric element. Based on this assumption, and focusing on the pair of upper and lower lead wires, the upper lead wire 432 extends a predetermined length from the back surface portion RS in a position where it bends diagonally downward and left from the solder portion SLR, and the lower lead wire 432 extends a predetermined length from the back surface portion RS in a position where it bends diagonally upward and left from the solder portion SLR. In other words, in a state where the back surface portion RS of the printed circuit board 411 is viewed from the front as shown in Fig. 16, the upper lead wire 432 is inclined to the left by an angle of about 10° with respect to an imaginary line segment (not shown) connecting the root portion of the upper lead wire 432 (the portion extending from the solder portion SLR) and the root portion of the lower lead wire 432, and the lower lead wire 432 is also inclined to the left by an angle of about 10°.

[0100] From the characteristics of the configuration of each lead wire 432 (the number of lead wires, the arrangement pitch of the lead wires, the arrangement of the lead wires, the distance between the rows of arranged lead wires, the shape (posture) of the lead wires, the way the lead wires are bent, etc.), it can be inferred from the back surface RS side of the printed circuit board 411 that the eight lead wires 432 soldered in the area within the rectangular frame line FB22 are paired (set) with each lead wire 432 in the upper row and each lead wire 432 in the lower row, and that each pair of lead wires 432 is a resistor (resistor 430A in this example) arranged vertically among multiple types of electrical elements.

[0101] Furthermore, the four lead wires 432 in the region within the rectangular frame line FB23 are divided into two left and right rows, with two lead wires 432 in each row arranged vertically. The arrangement pitch of the vertically arranged lead wires 432 is shorter than the distance between the two left and right rows, but is longer than the arrangement pitch of the lead wires 422 arranged horizontally in the region within the rectangular frame line FB21. From this, it can be inferred that of the four lead wires 432 soldered in the region within the rectangular frame line FB23, each lead wire 432 in the left row forms a pair (set), and that each pair of left and right lead wires 432 may belong to a single electrical element. Based on this inference, and focusing on the pair of left and right lead wires, the left lead wire 432 extends from the solder portion SLR in a manner that bends diagonally downward to the right, and the two lead wires 432 in the right row extend from the solder portion SLR in a manner that bends diagonally downward to the left. In other words, when the back surface RS of the printed circuit board 411 is viewed from the front, the left lead wire 432 is inclined downward by an angle of about 10° with respect to an imaginary line segment (not shown) connecting the base portion of the left lead wire 432 and the base portion of the right lead wire 432, and the right lead wire 432 is also inclined downward by an angle of about 10°.

[0102] From the characteristics of the configuration of each lead wire 432 (number of lead wires, arrangement pitch of the lead wires, arrangement of the lead wires, shape (posture) of the lead wires, bending of the lead wires, etc.), it is possible to infer from the back surface RS side of the printed circuit board 411 that the four lead wires 432 soldered in the area within the rectangular frame line FB23 are paired (set) with each lead wire 432 in the left column and each lead wire 432 in the right column, and that each pair of lead wires 432 is a resistor (resistor 430B in this example) arranged horizontally among multiple types of electrical elements.

[0103] The 72 lead wires 442 in the area within the rectangular frame line FB24 are divided into four upper and lower rows, with 18 lead wires 442 in each row arranged side by side in the left-right direction. The distance between the first and second rows from the top and the distance between the third and fourth rows from the top are significantly shorter than the distance between the second and third rows from the top. The lead wires 442 in the first row from the top and the lead wires 442 in the second row from the top are arranged alternately in the left-right direction, and the lead wires 442 in the third row from the top and the lead wires 442 in the fourth row from the top are also arranged alternately in the left-right direction. The arrangement pitch of the lead wires 442 arranged side by side in each row is significantly narrower than the distance between the second and third rows from the top. The (tip of) each lead wire 442 linearly protrudes a predetermined length from the solder portion SLR in a position perpendicular to the back surface portion RS. From the characteristics of each lead wire 422 (number of lead wires, arrangement pitch of the lead wires, arrangement of the lead wires, distance between rows of arranged lead wires, shape (posture) of the lead wires, protruding length of the lead wires, etc.), it is possible to infer, from looking at it from the back surface RS side of the printed circuit board 411, that each lead wire 442 soldered to the area within the rectangular frame line FB24 is an IC socket (IC socket 440A in this example) among multiple types of electrical elements, and that a control chip (control chip 450A in this example) is attached to the IC socket.

[0104] Furthermore, the eight lead wires 462 in the region within the rectangular frame line FB25 are divided into two upper and lower rows, with four lead wires 462 in each row arranged side by side in the left-right direction. The arrangement pitch of the lead wires 462 arranged side by side in the left-right direction is narrower than the distance between the two upper and lower rows, but wider than the arrangement pitch of the lead wires 422 arranged side by side in the left-right direction in the region within the rectangular frame line FB21. From this, it can be inferred that the eight lead wires 462 soldered in the region within the rectangular frame line FB25 are paired (set) with each lead wire 462 in the upper row and each lead wire 462 in the lower row, and that each pair of upper and lower lead wires 462 may belong to a single electrical element. Based on this inference, focusing on the pair of upper and lower lead wires, the upper lead wire 462 extends from the solder portion SLR in a bent diagonally upward to the right, and the lower lead wire 462 extends from the solder portion SLR in a bent diagonally downward to the left. In other words, when the back surface RS of the printed circuit board 411 is viewed from the front, the upper lead wire 462 is inclined to the right by an angle of approximately 160° and the lower lead wire 462 is inclined to the left by an angle of approximately 160° relative to an imaginary line segment (not shown) connecting the base portion of the upper lead wire 462 and the base portion of the lower lead wire 462.

[0105] From the characteristics of the configuration of each lead wire 462 (the number of lead wires, the arrangement pitch of the lead wires, the arrangement of the lead wires, the distance between the rows of arranged lead wires, the shape (posture) of the lead wires, the way the lead wires are bent, etc.), it can be inferred from the back surface RS side of the printed circuit board 411 that the eight lead wires 462 soldered in the area within the rectangular frame line FB25 are paired (set) with each lead wire 462 in the upper row and each lead wire 462 in the lower row, and that each pair of lead wires 462 is a ceramic capacitor (ceramic capacitor 460A in this example) arranged vertically among multiple types of electrical elements.

[0106] 17, multiple types of electric elements are also mounted in another predetermined region (region within a rectangular frame FB30 indicated by a solid line) on the front surface FS of the printed circuit board 411. Specifically, the multiple types of electric elements mounted thereon include one information display lamp 470A arranged horizontally, one resistor array 480A arranged horizontally, and one independently arranged LED element 490A.

[0107] 17 shows three rectangular frame lines FB31 to FB33, which are dashed two-dot lines. These rectangular frame lines FB31 to FB33 are frame lines shown for convenience in order to explain the area where electrical elements are mounted on the front surface FS of the printed circuit board 411, and are not actually formed on the front surface FS by printing or the like. The rectangular frame line FB31 indicates the area where the information display lamp 470A is mounted, the rectangular frame line FB32 indicates the area where the resistor array 480A is mounted, and the rectangular frame line FB33 indicates the area where the LED element 490A is mounted.

[0108] The information display lamp 470A includes a rectangular parallelepiped package 471 (having, on its front surface, a 7-segment LED capable of displaying information such as a four-digit number related to the role ratio) and a plurality of lead wires 472 (12 in this example, see FIG. 18) extending from the package 471. Each lead wire 472 is inserted into and soldered to a predetermined plurality of through-holes (not shown) formed in the main control board 410. The resistor array 480A includes a rounded rectangular parallelepiped package 481 and a plurality of lead wires 482 (9 in this example, see FIG. 18) extending from the package 481, and each lead wire 482 is inserted into and soldered to a predetermined plurality of through-holes formed in the printed circuit board 411. The LED element 490A comprises a round-shaped, translucent package portion 491 and two lead wires 482 (see Figure 18) extending from the package portion 491, and each lead wire 492 is inserted into two predetermined through holes formed in the printed circuit board 411 and soldered thereto.

[0109] Fig. 18 shows main control board 410 as viewed from the front from the back surface RS side of printed circuit board 411. Rectangular frame line FB40 shown by a solid line in Fig. 18 corresponds to rectangular frame line FB30 shown in Fig. 17 (showing an area at the same position and of the same size on front surface FS and back surface RS of printed circuit board 411), and three rectangular frame lines FB41 to FB43 shown by two-dot chain lines in Fig. 18 correspond to the three rectangular frame lines FB31 to FB33 shown in Fig. 17. Like rectangular frame lines FB31 to FB33, rectangular frame lines FB41 to FB43 are frame lines shown for convenience in order to explain the areas where electrical elements are mounted, and are not actually formed on back surface RS by printing or the like.

[0110] 18, in the area within rectangular frame line FB40 on the back surface RS of the printed circuit board 411, a plurality of lead wires are soldered to the printed circuit board 411. Specifically, a total of 12 lead wires 472 are soldered to the area within rectangular frame line FB41, a total of 9 lead wires 482 are soldered to the area within rectangular frame line FB42, and a total of 2 lead wires 432 are soldered to the area within rectangular frame line FB43.

[0111] The twelve lead wires 472 in the region within the rectangular frame line FB41 are divided into two upper and lower rows, with six lead wires 472 in each row, aligned horizontally. The arrangement pitch of the lead wires 472 aligned horizontally is slightly narrower than the distance between the two upper and lower rows. Each lead wire 472 (or its tip) linearly protrudes a predetermined length from the solder portion SLR in a position perpendicular to the back surface RS. From these characteristics of each lead wire 472 (such as the number of lead wires, the arrangement pitch of the lead wires, the arrangement of the lead wires, the distance between the rows of the lead wires, the shape (position) of the lead wires, and the protruding length of the lead wires), it is possible to infer, when viewed from the back surface RS side of the printed circuit board 411, that each lead wire 472 soldered in the region within the rectangular frame line FB41 is a horizontally positioned information indicator lamp (information indicator lamp 470A in this example) among multiple types of electrical elements.

[0112] The nine lead wires 482 in the region within the rectangular frame line FB42 are arranged in a row in the left-right direction. The arrangement pitch of the lead wires 482 is approximately the same as the arrangement pitch of the lead wires 472 arranged in the left-right direction in the region within the rectangular frame line FB41. Of the nine lead wires 482, the three lead wires 482 at the left end and the three lead wires 482 at the right end protrude linearly from the solder portion SLR by a predetermined length from the back surface portion RS in an orientation perpendicular to the back surface portion RS. On the other hand, of the nine lead wires 482, the three lead wires 482 in the center extend from the solder portion SLR by a predetermined length from the back surface portion RS in an orientation such that they are bent upward or downward. Specifically, of the three lead wires 482 in the center, the two lead wires 482 on the right side extend from the back surface portion RS in a position where they are bent downward from the solder portion SLR, and the one lead wire 482 on the left side extend from the back surface portion RS in a position where they are bent upward from the solder portion SLR. From the characteristics of the state of each lead wire 482 (the number of lead wires, the arrangement pitch of the lead wires, the arrangement of the lead wires, the shape (attitude) of the lead wires, the manner in which the lead wires are bent, etc.), it is possible to infer, when viewed from the back surface portion RS of the printed circuit board 411, that the nine lead wires 482 soldered in the area within the rectangular frame line FB42 are a resistor array (resistor array 480A in this example) arranged horizontally among multiple types of electric elements.

[0113] Furthermore, the two lead wires 492 in the region within the rectangular frame line FB43 are arranged in a vertical line. The arrangement pitch of the lead wires 492 is approximately the same as the arrangement pitch of the lead wires 472 arranged in the horizontal direction in the region within the rectangular frame line FB41. The two lead wires 492 extend a predetermined length from the solder portion SLR while bending to the right or downward. More specifically, of the two lead wires 492, the upper lead wire 492 extends from the back surface portion RS while bending to the right from the solder portion SLR, and the lower lead wire 492 extends from the back surface portion RS while bending to the downward from the solder portion SLR. From the characteristics of each lead wire 492 (number of lead wires, arrangement pitch of lead wires, arrangement of lead wires, shape (posture) of lead wires, bending of lead wires, etc.), it is possible to infer, by looking at it from the back surface RS side of printed circuit board 411, that the two lead wires 492 soldered in the area within rectangular frame line FB43 may be LED elements (LED element 490A in this example) among multiple types of electrical elements.

[0114] In this way, when viewed from the rear surface RS side of printed circuit board 411, it is possible to infer what type of electrical element is arranged, at what position, and in what orientation, based on the state of each lead wire soldered to printed circuit board 411. Therefore, the arrangement of the various electrical elements mounted on the front surface side can be confirmed simply by viewing main control board 410 from the rear surface side and visually checking the state of each lead wire. Furthermore, when inspecting main control board 410 (an inspection performed before main control board 410 is placed in the main board case or after being removed from the main board case), if a defect such as a crack in a solder joint or the like is found in a predetermined region (position) of rear surface RS of printed circuit board 411 when viewing main control board 410 from the rear surface side, it is possible to quickly infer what type of electrical element is causing the defect by visually checking the state of each lead wire in that region, thereby smoothly carrying out work to correct the discovered defect (e.g., replacing the electrical element, etc.). The lead wire aspects are exemplified by the number of lead wires, the arrangement pitch of the lead wires, the arrangement of the lead wires, the distance between rows of the lead wires, the shape (posture) of the lead wires, the bending of the lead wires, and the protruding length of the lead wires, but are not limited to these. The lead wire aspects may also include aspects related to the strength of the lead wires, such as the thickness and cross-sectional shape of the lead wires (the shape of the lead wires when viewed from the axial direction).

[0115] In some cases, three or more electric elements of the same type (same kind and same model) are mounted side by side on the front surface FS of the printed circuit board 411. In such cases, even if the electric elements are of the same type, the lead wires of the electric elements on the back surface RS of the printed circuit board 411 may have different configurations. For example, when three or more IC drivers of the same type are lined up, the lead wires of the IC drivers arranged at both ends of the line may be arranged to protrude linearly from the back surface RS by a predetermined length in a perpendicular orientation to the back surface RS, whereas the lead wires of the IC driver arranged in the center may be arranged to protrude from the back surface RS in a tilted orientation with respect to the back surface RS. By taking such points into consideration, it becomes easier to estimate what type of electric element is arranged, at what position, and in what orientation, based on the configuration of each lead wire soldered to the printed circuit board 411 when viewed from the back surface RS side of the printed circuit board 411.

[0116] <Relationship between the distance between conductive layers of the substrate and the thickness of the gaming medal> FIG. 19 schematically illustrates the layer structure (cross-sectional structure in the thickness direction of the board) of a printed circuit board 411. As illustrated, the printed circuit board 411 is a double-sided board (also referred to as a "two-layer board") and is mainly composed of a board main body 412 made of an insulating plate material, a first conductive layer 413 formed on the front surface 412a of the board main body 412 using a conductive thin film material such as copper foil, and a second conductive layer 414 formed on the back surface 412b of the board main body 412 using a conductive thin film material such as copper foil. The first conductive layer 413 forms, on the front surface 412a of the board main body 412, conductive patterns for the wiring circuit section and soldering lands formed around through holes. Similarly, the second conductive layer 414 forms, on the back surface 412b of the board main body 412, conductive patterns for the wiring circuit section and soldering lands.

[0117] 19 to 21, the thicknesses of the first conductive layer 413 and the second conductive layer 414 are illustrated much larger than their actual proportions to make them easier to see. Furthermore, although a solder resist layer, a silk screen printing layer, and the like are actually formed on the front surface 412a and the back surface 412b of the board main body 412, these layers are not shown in the drawings. In this embodiment, the front surface 412a of the board main body 412, the first conductive layer 413, the solder resist layer, the silk screen printing layer, and the like are collectively referred to as the front surface FS (first surface) of the printed circuit board 411 (or the main control board 410). Similarly, the back surface 412b of the board main body 412, the second conductive layer 414, the solder resist layer, the silk screen printing layer, and the like are collectively referred to as the back surface RS (second surface) of the printed circuit board 411 (or the main control board 410).

[0118] As shown in FIG. 19, the printed circuit board 411 is configured so that the interlayer distance DS1 (the shortest distance between the two layers) between the first conductive layer 413 and the second conductive layer 414 is greater than the thickness TH1 of one game medal ML (DS1>TH1). Therefore, as shown in FIG. 20, even if a situation occurs during inspection of the main control board 410 where the side edge of the game medal ML abuts against the peripheral edge of the printed circuit board 411, the first conductive layer 413 and the second conductive layer 414 will not be electrically connected via the game medal ML. This prevents the first conductive layer 413 and the second conductive layer 414 from being electrically short-circuited via the game medal ML, which could cause malfunctions in electrical elements, etc. It should be noted that the first conductive layer 413 and the second conductive layer 414 are rarely formed to a position that reaches the peripheral edge of the printed circuit board 411. However, if the printed circuit board 411 is damaged and a part of it is missing, or if a part of the printed circuit board 411 is cut off (for example, if an unexpected crack occurs in the board when the above-mentioned drawing portion is cut off), the first conductive layer 413 and the second conductive layer 414 may become exposed at the edge of the printed circuit board 411.

[0119] 21, the interlayer distance DS1 between the first conductive layer 413 and the second conductive layer 414 on the printed circuit board 411 is less than half the radius of curvature CR1 of the pachinko ball PCB. Therefore, even if the surface (outer periphery) of the pachinko ball PCB abuts against the edge of the printed circuit board 411 during inspection of the main control board 410, the first conductive layer 413 and the second conductive layer 414 will not be electrically connected via the pachinko ball PCB. This prevents the first conductive layer 413 and the second conductive layer 414 from being electrically shorted via the pachinko ball PCB, which could cause malfunctions in electrical elements. The same relationship may also hold true for medal components other than the game medals ML used in games, such as currency, and spherical components other than the pachinko ball PCB, and similar effects can be obtained in such cases.

[0120] <Position and protruding height of lead wires of electrical elements mounted on the back side of the board> Figure 22 illustrates several types of electrical elements mounted on the front surface FS of the printed circuit board 411 of the main control board 410, and also illustrates the orientation and protruding height of the lead wires of each electrical element on the back surface side of the board. The illustrated electrical elements are an IC driver 420B, a resistor 430C, an IC socket 440B equipped with a control chip 450B, and a ceramic capacitor 460B. In Figure 22, these electrical elements are illustrated in a simplified form. Also, the double-headed arrow DL1 shown in Figure 22 indicates the direction perpendicular to the back surface RS (front surface FS) of the printed circuit board 411.

[0121] In the IC driver 420B, each lead wire 422 (only two are shown) extending from the package part 421 passes through each predetermined through-hole (not shown) formed in the printed circuit board 411 and protrudes from the back surface RS of the printed circuit board 411 in an attitude that is approximately perpendicular to the back surface RS (perpendicular (90°) or with an error angle from perpendicular within a few degrees (for example, 5°)). In other words, (the axis of) the lead wire 422 of the part protruding from the back surface RS of the printed circuit board 411 is approximately perpendicular to the back surface RS and is approximately parallel to the direction perpendicular to the back surface RS.

[0122] The resistor 430C has two lead wires 432 extending from both ends of the package part 431, which are bent and pass through predetermined through-holes (not shown) formed in the printed circuit board 411, and protrude from the back surface RS of the printed circuit board 411 at a predetermined inclination angle TA1 (for example, an angle in the range of 20° to 85°) with respect to a direction perpendicular to the back surface RS. In other words, the lead wires 432 protruding from the back surface RS of the printed circuit board 411 are greatly inclined with respect to a direction perpendicular to the back surface RS.

[0123] In the IC socket 440B on which the control chip 450B is mounted, each lead wire 442 (only four wires are shown) extending from the receiving frame portion 441 passes through each predetermined through-hole (not shown) formed in the printed circuit board 411 and protrudes from the back surface RS of the printed circuit board 411 in a position that is approximately perpendicular to the back surface RS. In other words, the (axis of) the lead wire 442 in the portion protruding from the back surface RS of the printed circuit board 411 is approximately perpendicular to the back surface RS and is approximately parallel to the direction perpendicular to the back surface RS.

[0124] Ceramic capacitor 460B has two lead wires 462 each extending from package portion 461, which are bent and pass through predetermined through-holes (not shown) formed in printed circuit board 411, and protrude from back surface portion RS of printed circuit board 411 at a predetermined inclination angle TA2 (for example, an angle within a range of 20° to 85°) with respect to a direction perpendicular to back surface portion RS. In other words, the lead wires 462 protruding from back surface portion RS of printed circuit board 411 are largely inclined with respect to a direction perpendicular to back surface portion RS.

[0125] Lead wire 422 of IC driver 420B is stronger than lead wire 432 of resistor 430C, lead wire 442 of IC socket 440B, and lead wire 462 of ceramic capacitor 460B because it is formed thicker and / or made of a stronger material. Also, a protruding height OH1 of lead wire 422 of IC driver 420B from rear surface RS of printed circuit board 411 (the shortest distance from rear surface RS to the tip of lead wire 422) is greater than a protruding height OH2 of lead wire 432 of resistor 430C, a protruding height OH3 of lead wire 442 of IC socket 440B, and a protruding height OH4 of lead wire 462 of ceramic capacitor 460B (in this example, OH1>OH2>OH3>OH4, but the magnitude relationship among OH2, OH3, and OH4 is not limited to this).

[0126] Therefore, when main control board 410 is placed on an inspection table or the like during inspection of main control board 410, lead wire 422 of IC driver 420B abuts against the inspection table before the lead wires of other electric elements, preventing the lead wires of other electric elements from contacting the inspection table. Furthermore, when lead wire 422 of IC driver 420B abuts against the inspection table, IC driver 420B supports main control board 410, allowing main control board 410 to stand on its own. On the other hand, if lead wires such as lead wire 432 of resistor 430C and lead wire 462 of ceramic capacitor 460B are relatively weak and have portions protruding from rear surface RS of printed circuit board 411 that are significantly inclined with respect to the direction perpendicular to rear surface RS, they may be deformed when abutted, causing a malfunction.

[0127] Furthermore, if the main control board 410 is accidentally dropped during inspection of the main control board 410, the lead wires 422 of the IC driver 420B are likely to come into contact with the inspection table or floor before the lead wires of the other electrical elements. Therefore, while an impact is applied to the lead wires 422 of the IC driver 420B, the possibility of an impact being applied to the lead wires of the other electrical elements can be reduced. Because the lead wires 422 of the IC driver 420B are strong, an impact can cause cracks or the like in the soldered portion of the lead wires 422, which has the advantage of making it easy to visually identify a malfunction. On the other hand, even if an impact is applied to a lead wire with low strength, the lead wires are merely deformed, and it is unlikely that cracks or the like will occur in the soldered portion or the like. Therefore, there is a risk that the malfunction may be overlooked.

[0128] In this embodiment, the lead wires of the IC driver are configured to contact the inspection table or floor surface earlier than the lead wires of other electric elements, but the lead wires of other electric elements may be configured to contact the inspection table or floor surface earlier than the lead wires of other electric elements. In this case, it is preferable that the lead wires of the other electric elements have higher strength than the lead wires of other electric elements.

[0129] <Component name printed on the surface of the board> As shown in Fig. 23, multiple types of electrical elements are mounted in a predetermined region (the region within a rectangular frame FB50 indicated by a solid line) on the front surface FS of the printed circuit board 411. The rectangular frame FB50 indicates the same region as the region indicated by the rectangular frame FB30 in Fig. 17, but Fig. 23 illustrates a larger number of multiple types of electrical elements mounted in the region than in Fig. 17. That is, in addition to the information display lamp 470A, resistor array 480A, and LED element 490A illustrated in the region within the rectangular frame FB30 in Fig. 17, the region within the rectangular frame FB50 in Fig. 23 also includes an IIC driver 420C arranged in a horizontal position, a resistor 430D arranged in a horizontal position, a resistor 430E arranged in a vertical position, ceramic capacitors 460D and 460E arranged in a vertical position, and a transistor 495A.

[0130] On the surface FS of printed circuit board 411, component names are silk-screened in white near each mounted electrical element to identify each electrical element. Specifically, component names "R15," "SEG2," "RA3," and "IC11" are printed near resistor 430D, information display lamp 470A, resistor array 480A, and IIC driver 420C, respectively. Additionally, component names "C27," "C29," "Q7," "R22," and "LED1" are printed near ceramic capacitor 460D, ceramic capacitor 460E, transistor 495A, resistor 430E, and LED element 490A, respectively. The letters in each component name indicate the type of electrical element or component of the electrical element. For example, "R" stands for resistor, "SEG" for segment lamp, "RA" for resistor array, "IC" for integrated circuit, "C" for ceramic capacitor, "Q" for transistor, and "LED" for LED element. When multiple component names are printed near a certain electrical element, the component name that is printed closest to the certain electrical element and that includes letters that match the type of the certain electrical element can basically be determined to be the component name of that certain electrical element. The silkscreen printing that forms the component name and the component frame line (described later) is only applied to the front surface FS of the printed circuit board 411, and not to the back surface RS. Furthermore, the component names are silkscreened so that they do not overlap each other.

[0131] Note that FIG. 23 corresponds to a front view of the surface FS of the printed circuit board 411 (main control board 410). That is, FIG. 23 corresponds to a view when a worker, such as a game parlor clerk, looks straight at the main control board 410 installed inside the cabinet 5 with the front door 2 (see FIG. 6) of the slot machine 1 open, without tilting his / her head left or right. Therefore, in FIG. 23, the up, down, left, and right directions from the worker's viewpoint (the up, down, left, and right directions indicated in parentheses on each arrow in FIG. 23) coincide with the up, down, left, and right directions in space (the up, down, left, and right directions indicated without parentheses on each arrow in FIG. 23). Here, the up, down, left, and right directions from the worker's viewpoint refer to the direction in which the worker's eyes are aligned (left eye side is left) and the direction perpendicular to the left and right directions (top of the worker's head is up).

[0132] As shown in FIG. 23 , when the front surface FS of the printed circuit board 411 is viewed from the front, the component names "R15," "SEG2," "RA3," and "IC11" printed on the front surface FS have their constituent characters arranged in a left-to-right order. That is, when the front surface FS of the printed circuit board 411 is viewed from the front, these component names are arranged on the front surface FS in a horizontal writing format (left-to-right writing) in which the characters are arranged from left to right. In contrast, when the front surface FS of the printed circuit board 411 is viewed from the front, the component names "C27," "C29," "Q7," "R22," and "LED1" printed on the front surface FS have their constituent characters arranged in a bottom-to-top order. That is, when the front surface FS of the printed circuit board 411 is viewed from the front, these component names are arranged on the front surface FS in a horizontal writing format (characters (strings) written left-to-right are rotated 90 degrees to the left (counterclockwise)) in which the characters are arranged from bottom to top. In this way, when the surface portion FS is viewed from the front, any part name printed on the surface portion FS is arranged in such an order that the characters constituting the part name are either arranged in an order from left to right, or in an order from bottom to top.

[0133] Therefore, when the front door 2 of the slot machine 1 is open and the operator looks directly at the main control board 410 without tilting his / her head left or right, the characters constituting the component names "R15," "SEG2," "RA3," and "IC11" appear to be arranged in a natural order that can be read from left to right as seen by the operator (from the operator's perspective), as shown in FIG. 23 . Therefore, these component names are easy for the operator to read and recognize. In contrast, the characters constituting the component names "C27," "C29," "Q7," "R22," and "LED1" appear to be arranged in a order that requires the operator to read them from bottom to top as seen by the operator (from the operator's perspective).

[0134] On the other hand, Figure 24 corresponds to a state in which, with the front door 2 of the slot machine 1 open, an operator places his or her body on the open end side of the front door 2 or on the front side of the main control board 410 (the front side of the cabinet 5), and looks at the main control board 410 while tilting his or her head (90°) to the left (towards the hinge end of the front door 2) from the operator's viewpoint. Therefore, in Figure 24, the up, down, left, and right directions from the operator's viewpoint (the up, down, left, and right directions shown in parentheses on each arrow in Figure 24) do not match (are shifted by 90°) the up, down, left, and right directions in space (the up, down, left, and right directions shown without parentheses on each arrow in Figure 24).

[0135] When the front door 2 of the slot machine 1 is open and an operator positions himself / herself at the open end of the front door 2 or in front of the main control board 410 and tilts his / her head to the left from the operator's viewpoint while looking at the main control board 410, the characters that make up the part names "C27," "C29," "Q7," "R22," and "LED1" appear to be arranged in a natural order that can be read from left to right as seen by the operator (from the operator's viewpoint), as shown in Figure 24. This makes these part names easy to read and see for the operator.

[0136] The same applies when main control board 410 is installed on the back side of front door 2 so as to face housing 5. That is, when front door 2 is open and an operator looks straight at main control board 410 installed on the back side of front door 2 without tilting his / her head left or right, the component names "R15," "SEG2," "RA3," and "IC11" appear to be arranged in a natural order, as if the characters constituting those component names were read from left to right, from the operator's perspective. Also, when front door 2 is open and an operator places his / her body in front of main control board 410 (in front of the back side of front door 2) and tilts his / her head to the left (toward the open end of front door 2) from the operator's perspective, the component names "C27," "C29," "Q7," "R22," and "LED1" appear to be arranged in a natural order, as if the characters constituting those component names were read from left to right, from the operator's perspective.

[0137] When main control board 410 is installed on the rear surface side of front door 2 so as to face housing 5, an operator may position his / her body on the open end side of front door 2 and tilt his / her head to the right (toward the hinge end of front door 2) from the operator's viewpoint while looking at main control board 410. In this case, the characters that make up the part names "C27," "C29," "Q7," "R22," and "LED1" appear upside down and in order from right to left from the operator's viewpoint.

[0138] Therefore, when the main control board 410 is installed on the back side of the front door 2, if the worker wants to check the part names, the occurrence of such a situation can be avoided by not looking in the manner described above (tilting one's head toward the hinge end of the front door 2). The sub-control board in the slot machine 1 is installed on the back side of the front door 2 so as to face the cabinet 5, and the arrangement of the characters constituting each part name is the same as that of the main control board 410. Therefore, a situation similar to that when the main control board 410 is installed on the back side of the front door 2 can occur. However, by taking advantage of this situation, it is possible to distinguish whether the board the worker is looking at by tilting his / her head toward the hinge end of the front door 2 is the main control board 410 installed inside the cabinet 5 or the sub-control board installed on the back side of the front door 2, based on the arrangement of the characters constituting the part names.

[0139] As shown in FIG. 23, the area within the rectangular frame FB50 on the surface FS of the printed circuit board 411 has characters ("NAME BANGOU33-X" in this example) indicating the manufacturer's name, board name (number), etc. written on it. Unlike the component names, these characters (also referred to as "board name characters") are not silk-printed but are formed of copper foil or the like that constitutes the conductive layer. Therefore, they are less noticeable than the component names silk-printed in white. On the other hand, if an attempt is made to scrape off the board name characters, the surface FS of the printed circuit board 411 will be scratched, making them more noticeable. This has the effect of deterring fraudulent acts such as scraping off the board name characters.

[0140] Each component name is printed in a position that excludes the land portion around the through-hole formed on the printed circuit board 411 and the solder portion formed on the through-hole and the land portion by soldering, so as not to overlap these areas. For example, as shown in FIG. 25(A), when the component name "LED" is printed near a through-hole (not shown), it is printed so as not to overlap the land portion LND and the solder portion SLR. This allows the component name to be clearly recognized. In contrast, as shown in FIG. 25(B), if the component name "LED" is printed so as to overlap partially with the land portion LND or the solder portion SLR, some of the characters may be missing, making it difficult to identify the printed characters as "LED." That is, in the example shown in FIG. 25(B), there is a risk that the "L" in the component name "LED" may be mistaken for an "I," and the "E" may be mistaken for an "F." Even when the component name is printed so as to overlap partially with the land portion LND or the solder portion SLR, it is preferable to limit the overlap to a level that prevents such misrecognition. Here, the component name "LED" has been used as an example for explanation, but the same applies to any other component name.

[0141] <Component borders printed on the surface of the board> 23 , component frame lines corresponding to the outlines of the mounted electrical elements are silk-screened in white within a rectangular frame line FB50 on the front surface FS of the printed circuit board 411. Specifically, a component frame line PB1 for the resistor 430D, a component frame line PB2 for the resistor 430E, a component frame line PB3 for the ceramic capacitor 460D, a component frame line PB4 for the ceramic capacitor 460E, a component frame line PB5 for the transistor 495A, a component frame line PB6 for the resistor array 480A, and a component frame line PB7 for the LED element 490A are printed. Component frame lines for the information display lamp 470A and the IIC driver 420C are also printed but are not shown.

[0142] Each component frame line is printed in a position that excludes the land portions around the through-holes formed in the printed circuit board 411 and the solder portions formed on the through-holes and the land portions by soldering, so as not to overlap these areas. For example, as shown in FIG. 26, if the land portion LND and the solder portion SLR to which the lead wires (not shown) of the transistor 495A are soldered are located near the location where the transistor 495A is mounted, the component frame line PB5 for the transistor 495A is printed so as not to overlap the land portion LND and the solder portion SLR. Here, the component frame line PB5 for the transistor 495A is used as an example, but the same applies to any other component frame line. Note that each component frame line is preferably printed slightly away from the land portion LND so as not to contact the land portion LND, as in the component frame line PB5 shown in FIG. 26. This prevents the silk-screen paint from adhering to the land portion LND and the through-hole portion.

[0143] <Ensuring visibility of information display lamps> As shown in FIG. 23, the LED element 490A is mounted relatively close to the information display lamp 470A. Furthermore, as shown in FIG. 27, when the surface FS of the printed circuit board 411 is used as a height reference, the height HT1 of the information display lamp 470A is higher than the height HT2 of the LED element 490A (HT1>HT2). Furthermore, the light emitted by the LED element 490A is relatively bright. Therefore, there is a risk that the light emitted from the LED element 490A reaches the information display lamp 470A and is reflected by the side surface of the package 471 of the information display lamp 470A, reducing the visibility of the information displayed by the information display lamp 470A. Therefore, the side surface of the package 471 of the information display lamp 470A is matte printed (e.g., white) to reduce light reflection. Specifically, the light reflectance of the side surface of the package 471 is configured to be lower than the light reflectance of the lead wire 472 of the information display lamp 470A. This ensures that even when LED element 490A emits light, the visibility of the information displayed by information display lamp 1070 is maintained. When mounting the setting display lamp on front surface FS of printed circuit board 411, it is preferable to apply the same treatment to the side surface of the package part of the setting display lamp.

[0144] Furthermore, it is desirable not to arrange components that are taller than the information display lamp 470A and the control chip 450A around the information display lamp 470A and the control chip 450A. Specifically, it is desirable that the height of the component arranged closest to the information display lamp 470A and the control chip 450A (referred to as the "closest component") be such that even if the closest component is tilted for some reason, it will not come into contact with the information display lamp 470A and the control chip 450A. More preferably, the height of the closest component should be such that even if the closest component is tilted, the main body will not obscure all or part of the display of the information display lamp 470A or the model sticker (a sticker listing the model name of the slot machine in which the control chip 450A is mounted) affixed to the package of the control chip 450A.

[0145] Furthermore, when placing tall components near information display lamp 470A and control chip 450A, it is preferable to place a DIP (dual in-line package) type IC chip or a lead component whose body abuts against the board (hereinafter referred to as a "board-contacting component") between the component and information display lamp 470A or control chip 450A. Here, a "tall component (hereinafter also referred to as a "tall component")" refers to a lead component whose height is such that if the component were to tilt for some reason, it would obscure all or part of the display on information display lamp 470A or the type sticker affixed to control chip 450A. The DIP type IC chips and board-contacting components described above are extremely unlikely to tilt. Therefore, by arranging the components as described above, even if the tall component tilts, it will be prevented from tilting further by abutting against the DIP-type IC chip or the board abutting component, thereby preventing the tall component from obscuring all or part of the display of the information display lamp 470A or the information on the model sticker affixed to the control chip 450A.

[0146] <Configuration of sub-controller and power supply unit> Next, the configurations of the sub-controller 500 and the power supply unit 55 according to this embodiment will be described with reference to FIGS.

[0147] (Configuration of sub-controller) 4, the sub-controller 500 is attached to the rear side of the front door 2 and above the reel window W. Similar to the main controller 100, the sub-controller 500 is configured by accommodating a sub-controller board 502 on which various components are mounted inside a sub-board case 501 consisting of a case body and a case lid.

[0148] FIG. 28 shows a front view of the slot machine 1 viewed from the rear to the front with the sub-controller 500 installed on the front door 2 and the case lid of the sub-board case 501 removed. The up, down, left, and right directions indicated by arrows in FIG. 28 correspond to the directions of the arrows in FIGS. 2 and 4. As shown in FIG. 28, the sub-controller board 502 is composed of a sub-main board 510 and a sub-sub-board 520. When the sub-controller 500 is installed on the front door 2, the component mounting surfaces of the sub-main board 510 and the sub-sub-board 520 face rearward and are aligned vertically. The component occupancy rate of the sub-controller board 502 (the ratio of the total area of ​​all mounted components (the total area of ​​each component when the component mounting surface of the board is viewed in plan) to the area of ​​the board) is approximately 50%.

[0149] Sub-main board 510 is rectangular in shape, and various electronic components (electronic elements) are mounted on its component mounting surface, including integrated circuits such as sub-CPU 511, sub-ROM 512, sub-RAM 513, and three-terminal regulator 514, active elements such as transistors and LEDs, and passive elements such as resistors, ceramic capacitors, electrolytic capacitors, and toroidal coils. Also, a connector 515 is disposed in the center of the left edge of sub-main board 510, which is electrically connected to connector 528 of sub-sub board 520. Furthermore, a plurality of electrical connectors 516, 516, ... are disposed on the upper, right, and lower edges of sub-main board 510, respectively.

[0150] The sub-substrate 520 is rectangular in shape, and its component mounting surface is mounted with integrated circuits such as an image processing CPU 521, an image ROM 522, a VIDEORAM 523, an audio processing substrate 524 on which an audio ROM storing audio data and a sound source IC are mounted, a logic IC 525, and various electronic components (electronic elements) including active elements such as transistors and LEDs, and passive elements such as resistors, ceramic capacitors, electrolytic capacitors, and toroidal coils, as well as electrical components such as a connector 526 and a slide switch 527. A connector 528 electrically connected to the connector 515 of the sub-main substrate 510 is disposed in the center of the right edge of the sub-substrate 520. The sub-main substrate 510 and the sub-substrate 520 are electrically connected by connecting the connector 515 of the sub-main substrate 510 to the connector 528 of the sub-substrate 520.

[0151] (Power supply configuration) The power supply unit 55 converts external AC power input into DC and converts it to a predetermined voltage (e.g., +5V, +12V, etc.) and outputs it to various devices installed inside the cabinet 5. The power supply unit 55 has a roughly rectangular parallelepiped shape and is attached to the lower part of the cabinet 5 (above the bottom plate 5d) with its left side abutting the left side plate 5a of the cabinet 5, as shown in FIG. 3. The front of the power supply unit 55 is a resin front panel equipped with a power switch for turning on the slot machine 1, and the top, bottom, rear, left, and right sides are made of metal plates. The metal plates on the top, bottom, rear, and left sides are molded as a single, integrally formed member, and the front panel is attached to the front of this member. Furthermore, the metal plate on the right side is removable, and by removing the metal plate on the right side, a power supply board 550 (described later) can be accommodated inside the power supply unit 55.

[0152] FIG. 29 shows a front view of the slot machine 1 viewed from right to left with the power supply device 55 installed on the bottom plate 5d inside the housing 5 and with the metal plate on the right side of the power supply device 55 removed. The up, down, front, and back directions indicated by the arrows in FIG. 29 correspond to the directions of the arrows in FIG. 2. As shown in FIG. 29, a power supply board 550 is provided inside the power supply device 55, and when the power supply device 55 is installed inside the housing 5, the component mounting surface of the power supply board 550 faces right and is aligned in the up and down direction. The component occupancy rate on the power supply board 550 is approximately 50%.

[0153] Power supply board 550 is rectangular, and its component mounting surface is mounted with various electronic components (electronic elements), including integrated circuits such as logic IC 551 and three-terminal regulators 552a, 552b, and 552c, active elements such as transistors and LEDs, and passive elements such as resistors, ceramic capacitors, electrolytic capacitors, toroidal coils, and varistors. The electrolytic capacitors mounted on the various boards (main control board 111, sub-control board 502, and power supply board 550) of this embodiment are divided into three types: small electrolytic capacitors with a rated voltage of 50 V and a capacity of up to 270 μF (external dimensions of 8 mm diameter and 20 mm height); medium-sized electrolytic capacitors with a rated voltage of 50 V and a capacity of more than 270 μF and up to 1000 μF (external dimensions of 12 mm diameter and 25 mm height); and large electrolytic capacitors with a rated voltage of 50 V and a capacity of more than 1000 μF and up to 4700 μF (external dimensions of 18 mm diameter and 40 mm height). Further, provided on the upper edge of the power supply board 550 are a power supply input connector 553 for inputting AC power from outside, and power supply output connectors 554a, 554b, and 554c for outputting power of various voltages generated in the power supply board 550 to various devices installed inside the housing 5. Further, provided on the front edge of the power supply board 550 is a panel connector 555 for electrically connecting to a power switch (not shown) attached to the front panel 55a.

[0154] Openings are provided on the top surface 55b of the power supply device 55 so that connectors of various power cables can be fitted to the power input connector 553 and the power output connectors 554a, 554b, and 554c. A number of round heat dissipation holes (not shown) are provided on the bottom surface 55c of the power supply device 55 for dissipating heat from inside the power supply device 55 to the outside. A spacer SP attached to the bottom surface 55c provides a gap TH2 between the bottom plate 5d of the housing 5 and the bottom surface 55c to allow the heat dissipated from these heat dissipation holes to escape to the outside.

[0155] The size of this gap TH2 (the distance between the bottom plate 5d and the bottom surface 55c) is larger than the thickness of one gaming medal but smaller than the thickness of two gaming medals. By providing the gap TH2 between the bottom plate 5d and the bottom surface 55c, heat generated inside the power supply device 55 is released into the housing 5 through the bottom surface 55c, making it less likely that a rise in temperature inside the power supply device 55 will adversely affect the various components mounted on the power supply board 550. Furthermore, because the size of the gap TH2 is larger than the thickness of one gaming medal, a gap is maintained between the bottom plate 5d and the bottom surface 55c, while eliminating the risk of a gaming medal becoming trapped in this gap. For example, if the size of the gap TH2 were approximately the same as the thickness of one gaming medal, gaming medals spilling from the hopper 51 of the medal payout device 50 would become trapped between the bottom plate 5d and the bottom surface 55c, making it difficult to remove the trapped gaming medals.

[0156] Furthermore, by making the size of the gap TH2 larger than the thickness of one gaming medal, even if a gaming medal gets stuck between the bottom plate 5d and the bottom surface 55c, it can be easily removed. In addition, by making the size of the gap TH2 smaller than the thickness of two gaming medals, it is possible to eliminate the risk of two gaming medals overlapping and getting caught between the bottom plate 5d and the bottom surface 55c, and it is also possible to reduce the risk of foreign objects other than gaming medals getting stuck between the bottom plate 5d and the bottom surface 55c. Furthermore, for example, when transporting the slot machine 1, even if a strong vertical impact is applied when lowering the slot machine 1 from the bed of a transport truck to the ground, the gap between the bottom plate 5d and the bottom surface 55c provides room for the bottom surface 55c of the power supply device 55 to flex, and the flexing of the bottom surface 55c is expected to lessen the impact transmitted to the power supply board 550.

[0157] (Layout of components mounted on the sub-control board and power supply board) Next, the arrangement of various components mounted on sub-control board 502 and power supply board 550 will be described with reference to Figures 30 to 32. Figure 30 shows a state in which a component having lead wires extending from the component body, which is soldered to the board with the component body floating above the surface of the board (i.e., with a gap between the component body and the board surface), has tilted for some reason. Possible causes of the component tilting here include, for example, an impact when slot machine 1 is lowered to the ground, being pushed by a wire inserted through a gap in the board case or the like due to fraud, or an operator accidentally touching a component on the board when attaching the board to the board case.

[0158] Figures 30(a-1) to (a-3) show a tilted state of the components attached to area BS1 of the sub-substrate 520 shown in Figure 28. Here, Figure 30(a-1) shows the state when area BS1 is viewed from right to left, Figure 30(a-2) shows the state when area BS1 is viewed from bottom to top (the direction of arrow A in Figure 30(a-1)), and Figure 30(a-3) shows the state when area BS1 is viewed from back to front (the direction of arrow B in Figure 30(a-1)). The directions of the arrows shown in Figures 30(a-1) to (a-3) correspond to the directions of the arrows shown in Figure 2.

[0159] In area BS1, the bodies of LEDs Ls1 and Ls2 are mounted side by side in the horizontal direction, floating above the surface of the sub-substrate 520, with resistor Rs1 mounted below them. Figures 30(a-1) to 30(a-3) show LED Ls1 tilted downward. In this state, the body (light-emitting portion) of LED Ls1 abuts the body of resistor Rs1, so the lead wires extending from the body of LED Ls1 do not come into contact with the lead wires of resistor Rs1. For example, when silk-screening the unique component numbers assigned to various components on the board, it is preferable to perform the silk-screening in a position where the component numbers displayed by the silk-screening will not be obscured by tilted components. For example, if LED Ls1 has the component number "D1" and LED Ls2 has the component number "D2," LED Ls1 and Ls2 are tilted vertically as shown in Figure 30(a-3). Therefore, it is preferable to perform the silk-screening SLK representing these component numbers on the right or left side of LED Ls1 and Ls2. Alternatively, when printing the component number on the top and bottom of LEDLs1 and Ls2, it is preferable to print the silkscreen at a position far enough away from LEDLs1 and Ls2 that the silkscreened component number will not be hidden even if LEDLs1 and Ls2 are tilted (for example, at a position a distance equal to the length of the lead wire floating above the board plus the height of the component body).

[0160] Figures 30(b-1) to (b-3) show a state in which the components attached to region BP1 of power supply board 550 shown in Figure 29 are tilted. Here, Figure 30(b-1) shows the state when region BP1 is viewed from the front to the rear, Figure 30(b-2) shows the state when region BP1 is viewed from the bottom to the top (the direction of arrow A in Figure 30(b-1)), and Figure 30(b-3) shows the state when region BP1 is viewed from the right to the left (the direction of arrow B in Figure 30(b-1)). The directions of the arrows shown in Figures 30(b-1) to (b-3) are the same as those shown in Figure 2.

[0161] In region BP1, the body of medium-sized electrolytic capacitor Cp1 is mounted in a state where it is floating above the surface of power supply substrate 550, with resistor Rp1 mounted below it. Figures 30(b-1) to (b-3) show the medium-sized electrolytic capacitor Cp1 tilted downward. In this state, the body of medium-sized electrolytic capacitor Cp1 abuts against the body of resistor Rp1, so the lead wires extending from the body of medium-sized electrolytic capacitor Cp1 do not come into contact with the lead wires of resistor Rp1. Here, for example, if medium-sized electrolytic capacitor Cp1 and resistor Rp1 are mounted near the lower periphery of power supply substrate 550, the medium-sized electrolytic capacitor Cp1 may be mounted so that its top does not protrude from the lower periphery of the substrate when it tilts downward and abuts against the body of resistor Rp1.

[0162] Figures 30(c-1) to (c-3) show a state in which the components attached to region BP2 of power supply board 550 shown in Figure 29 are tilted. Here, Figure 30(c-1) shows the state when region BP2 is viewed from the front to the rear, Figure 30(c-2) shows the state when region BP2 is viewed from the top to the bottom (the direction of arrow A in Figure 30(c-1)), and Figure 30(c-3) shows the state when region BP2 is viewed from the right to the left (the direction of arrow B in Figure 30(c-1)). The directions of the arrows shown in Figures 30(c-1) to (c-3) are the same as those shown in Figure 2.

[0163] In region BP2, the body of fuse Fp1 is mounted in a state where it is floating above the surface of power supply board 550, with ceramic capacitor Cp2 mounted above it, and Figures 30(c-1) to (c-3) show a state in which fuse Fp1 is tilted upward. In this state, the body of fuse Fp1 abuts against the body of ceramic capacitor Cp2, so the lead wires extending from the body of fuse Fp1 do not come into contact with the lead wires of ceramic capacitor Cp2.

[0164] As shown in Figure 30(c-2), the lead wire of ceramic capacitor Cp2 has a roughly S-shaped bend bd (encircled by a dashed line in the figure) located near the component body. This means that even if vertical force is applied to ceramic capacitor Cp2, the force is absorbed by the bend bd, and it is expected that the force applied to the lead wire located near the board surface will be reduced. This makes the lead wire less likely to break, making the component less likely to malfunction.

[0165] In this embodiment, even if a component mounted above the board tilts for some reason, the body of the tilted component abuts against the body of another component or the surface of the board, preventing further tilting, and the lead wires of the components do not come into contact with each other. Therefore, even if a component mounted above the board tilts, the lead wires of that component will not come into contact with the lead wires of a nearby component and cause a short circuit, making it less likely for components mounted on the board to malfunction. In other words, making it less likely for components to malfunction reduces the risk of the gaming machine stopping, allowing players to play smoothly.

[0166] Here, it would be desirable to provide sufficient spacing between components so that they do not come into contact with surrounding components even when tilted. However, the limited space available for installing devices inside the housing 5 makes it difficult to increase the size of the board. Furthermore, if a connector is located on the board, placing components near it could damage the component when connecting or disconnecting a harness from the connector, so it is desirable not to place components around the connector. Furthermore, LEDs and fuses require space to ensure the visibility of the light-emitting elements and fuses. For these reasons, it is difficult to ensure sufficient space for each component to avoid contact with surrounding components even when tilted. Therefore, in such cases, a component is positioned so that its body comes into contact with the body or lead wires of surrounding components when tilted, thereby preventing the lead wires of the components from coming into contact with each other.

[0167] Next, Figure 31 shows a component having lead wires extending from the component body, which is soldered to the board with the component body floating above the surface of the board (i.e., with a gap between the component body and the board surface), and in which the component mounted near the edge of the board has become tilted for some reason.

[0168] Figures 31(a-1) to (a-3) show a tilted state of the components attached to region BS2 of the sub-substrate 520 shown in Figure 28. Here, Figure 31(a-1) shows the state when region BS2 is viewed from right to left, Figure 31(a-2) shows the state when region BS2 is viewed from bottom to top (the direction of arrow A in Figure 31(a-1)), and Figure 31(a-3) shows the state when region BS2 is viewed from back to front (the direction of arrow B in Figure 31(a-1)). The directions of the arrows shown in Figures 31(a-1) to (a-3) correspond to the directions of the arrows shown in Figure 2.

[0169] In region BS2, the body of medium-sized electrolytic capacitor Cs1 is mounted in a state where it is floating above the surface of sub-substrate 520, and Figures 31(a-1) to (a-3) show the medium-sized electrolytic capacitor Cs1 tilted downward. Here, the tilt of medium-sized electrolytic capacitor Cs1 stops when the peripheral edge of the bottom of the body abuts against the surface of the substrate (see the area surrounded by the dashed line in the figure), but medium-sized electrolytic capacitor Cs1 is mounted in a position where the body of medium-sized electrolytic capacitor Cs1 (more specifically, the head of the body) does not protrude from the peripheral edge of the substrate at this time (see the dashed line in the figure).

[0170] Figures 31(b-1) to (b-3) show a state in which the components attached to area BP2 of the power supply board 550 shown in Figure 29 are tilted. Here, Figure 31(b-1) shows the state when area BP2 is viewed from the front to the rear, Figure 31(b-2) shows the state when area BP2 is viewed from below to above (the direction of arrow A in Figure 31(b-1)), and Figure 31(b-3) shows the state when area BP2 is viewed from the right to the left (the direction of arrow B in Figure 31(b-1)). The directions of the arrows shown in Figures 31(b-1) to (b-3) also correspond to the directions of the arrows shown in Figure 2.

[0171] As described above, in region BP2, the fuse Fp1 body is disposed so as to be floating above the surface of the power supply substrate 550, with the ceramic capacitor Cp2 disposed above it. Figures 31(b-1) to 31(b-3) show the fuse Fp1 tilted downward. The tilt of the fuse Fp1 body stops when the side of the body abuts the surface of the substrate (see the area surrounded by the dashed line in the figure). However, the fuse Fp1 is mounted in a position such that the fuse Fp1 body (more specifically, the head of the fuse body) does not extend beyond the periphery of the substrate (see the dashed-dotted line in the figure). In this way, when the fuse Fp1 is tilted upward, as described above, the lead wires of the fuse Fp1 do not come into contact with the lead wires of the ceramic capacitor Cp1, and when the fuse Fp1 is tilted downward, the fuse Fp1 is mounted in a position such that the fuse body does not extend beyond the periphery of the substrate.

[0172] Figures 31(c-1) to (c-3) show a state in which the components attached to region BP3 of power supply board 550 shown in Figure 29 are tilted. Here, Figure 31(c-1) shows the state when region BP3 is viewed from the front to the rear, Figure 31(c-2) shows the state when region BP3 is viewed from the bottom to the top (the direction of arrow A in Figure 31(c-1)), and Figure 31(c-3) shows the state when region BP3 is viewed from the right to the left (the direction of arrow B in Figure 31(c-1)). The directions of the arrows shown in Figures 31(c-1) to (c-3) are the same as those shown in Figure 2.

[0173] In region BP3, the bodies of LEDs Lp1 and Lp2 are mounted side by side in the left-right direction while floating above the surface of power supply board 550, and resistor Rp2 is mounted above LED Lp1, and Figures 31(c-1) to (c-3) show a state in which LED Lp1 is tilted downward. At this time, the tilt of the body (light-emitting portion) of LED Lp1 stops when the peripheral portion of the bottom surface of the body abuts against the surface of the board (see the area surrounded by the dashed line in the figure), but LED Lp1 is mounted in a position such that the body of LED Lp1 (more specifically, the head of the body) does not protrude from the peripheral edge of the board at this time (see the dashed line in the figure).

[0174] In this embodiment, even if a component mounted above the board tilts for some reason, the body of the tilted component abuts the surface of the board, preventing any part of the component from protruding beyond the edge of the board. Therefore, even if a component mounted above the board tilts, there is no risk of the component being damaged by hitting the board case or the wall of the device body that houses the board. Therefore, by making it less likely for components mounted on the board to malfunction, the risk of the gaming machine stopping operation can be reduced, allowing players to play smoothly.

[0175] However, due to the aforementioned circumstances, it is difficult to ensure that each component has sufficient space to avoid contact with surrounding components even when tilted. In particular, when the component occupancy rate on the board is high, there are cases where the components have to be placed near the periphery of the board. Therefore, even in such cases, the components are placed so that part of their body does not extend beyond the periphery of the board when they tilt.

[0176] Next, with reference to Figures 32 and 33, the directions of the multiple lead wires extending from the components mounted on the board will be described. First, Figures 32(a-1) and (a-2) show the mounted state of the components attached to area BP4 of power supply board 550 shown in Figure 29. Here, Figure 32(a-1) shows the state when area BP4 is viewed from the front to the rear, and Figure 32(a-2) shows the state when area BP4 is viewed from the right to the left (the direction of arrow A in Figure 31(a-1)). Note that the directions of the arrows shown in Figures 32(a-1) and (a-2) correspond to the directions of the arrows shown in Figure 2.

[0177] A large electrolytic capacitor Cp2 is mounted in region BP4. As shown in Fig. 29, two large electrolytic capacitors are mounted behind the large electrolytic capacitor (Cp2) mounted in region BP4, and these large electrolytic capacitors are also the same size as the large electrolytic capacitor Cp2 shown in Figs. 32(a-1) and (a-2). As shown in Figs. 32(a-1) and (a-2), two lead wires LN1 and LN2 extend from the bottom surface of the large electrolytic capacitor Cp2, and the large electrolytic capacitor Cp2 is mounted on the board so that the lead wires LN1 and LN2 are aligned vertically (in other words, the line connecting the lead wires LN1 and LN2 is aligned vertically).

[0178] 32(b-1) and (b-2) show the mounting state of components attached to region BP5 of the power supply board 550 shown in FIG. 29. Here, FIG. 32(b-1) shows the state when region BP5 is viewed from the front to the rear, and FIG. 32(b-2) shows the state when region BP5 is viewed from the right to the left (the direction of arrow A in FIG. 31(b-1)). The directions of the arrows shown in FIGS. 32(b-1) and (b-2) correspond to the directions of the arrows shown in FIG. 2. LED Lp3 is mounted in region BP5, and as shown in FIGS. 32(b-1) and (b-2), two lead wires LN3 and LN4 extend from the bottom surface of LED Lp3. LED Lp3 is mounted on the board so that lead wires LN3 and LN4 are aligned vertically (in other words, the direction of the line connecting lead wires LN3 and LN4 is vertical).

[0179] Figures 32(c-1) and (c-2) show the mounting state of components attached to area BS3 of sub-main board 510 shown in Figure 28. Here, Figure 32(c-1) shows the state when area BS3 is viewed from right to left, and Figure 32(c-2) shows the state when area BS3 is viewed from rear to front (the direction of arrow A in Figure 31(c-1)). The directions of the arrows shown in Figures 32(c-1) and (c-2) correspond to the directions of the arrows shown in Figure 2.

[0180] A fuse Fs1 held by fuse clips Fh1 and Fh2 is mounted in region BS3. Terminals LN5a and LN5b are protruding from the bottom of the fuse clip Fh1, and terminals LN6a and LN6b are protruding from the bottom of the fuse clip Fh2, and are also protruding from the bottom of the fuse clip Fh2, and are also protruding from the bottom of the fuse clip Fh2, and are also protruding from the bottom of the fuse clip Fh1. The fuse clips Fh1 and Fh2 are soldered to the power supply board 550 with the terminals LN5a, LN5b, LN6a, and LN6b arranged vertically and spaced apart to hold the fuse Fs1.

[0181] In Figures 32(c-1) and (c-2), the fuse Fs1 is held by fuse clips Fh1 and Fh2, but a fuse having lead wires extending from both ends of the fuse body, such as the fuse Fp1 shown in Figures 30(c-1) to (c-3), may also be mounted on a board so that the lead wires are aligned vertically (in other words, the line connecting the two lead wires is aligned vertically).

[0182] For example, if a large vertical impact is applied when the slot machine 1 is lowered to the ground during transportation, the impact may cause the body of a component mounted on the circuit board to tilt vertically. In particular, large electrolytic capacitors have large component bodies. Therefore, if a large electrolytic capacitor is mounted on a circuit board with two lead wires aligned horizontally, a large vertical impact may easily bend the lead wires, causing the component body to tilt vertically. This may result in a large load being applied to the lead wires, potentially causing them to break. Therefore, as shown in each diagram in FIG. 33 , in this embodiment, components are mounted on a circuit board so that multiple lead wires extending from the component are aligned vertically. This prevents the component body from tilting vertically, even if a large vertical impact is applied to the slot machine 1, causing a large vertical force to act on the component body. This reduces the likelihood of the lead wires of the component mounted on the circuit board breaking due to the applied impact. In this way, reducing the likelihood of component malfunction reduces the risk of the gaming machine shutting down, allowing players to play smoothly. The lead wires of small and medium-sized electrolytic capacitors, which are less susceptible to shock than large electrolytic capacitors, may be mounted on the board so that they are aligned in the left-right direction.

[0183] The orientation of the lead wires of components mounted on the board is not limited to the large electrolytic capacitor, LED, and fuse shown in FIG. 32, but can also be applied to other components. For example, the lead wires of fuse Fp1 in region BP2 shown in FIGS. 30(c-1)-(c-1) and 31(b-1)-(b-3) may be mounted on the board so that they are aligned vertically. In this case, when fuse Fp1 is tilted upward as described above, the lead wires of fuse Fp1 do not come into contact with the lead wires of ceramic capacitor Cp1, and when tilted downward, the fuse body does not protrude from the periphery of the board. This also makes it less likely that the lead wires will break due to an impact applied to slot machine 1.

[0184] Furthermore, as shown in Figures 33(a-1) to (a-3), the orientation of the component lead wires shown in Figure 32 can also be applied to the toroidal coil TLp1 attached to region BP6 of the power supply board 550 shown in Figure 29. Here, Figure 33(a-1) shows the state when region BP6 is viewed from the front to the rear, Figure 33(a-2) shows the state when region BP6 is viewed from the right to the left, and Figure 33(a-3) shows the state when region BP6 is viewed from the bottom to the top. Note that the directions of the arrows shown in Figures 33(a-1) to (a-3) correspond to the directions of the arrows shown in Figure 2.

[0185] In the toroidal coil TLp1, one end LN7 and the other end LN8 of the winding wound around the toroidal core tc, which is a ring-shaped body with a rectangular cross section, serve as lead wires. When the toroidal coil TLp1 is viewed from the front to the rear as shown in FIG. 33(a-1), one end LN7 of the winding extends from the upper side of the toroidal core tc, and the other end LN8 extends from the lower side of the toroidal core tc. When the toroidal coil TLp1 is viewed from the right to the left as shown in FIG. 33(a-1), the one end LN7 and the one end LN8 of the winding extend from the center position of the toroidal core tc in the front-to-back direction. Therefore, the toroidal coil TLp1 is mounted on a substrate so that the one end LN7 and the one end LN8 of the winding are aligned vertically (in other words, the line connecting the lead wires LN7 and LN8 is aligned vertically).

[0186] Furthermore, in the power supply device 55 of this embodiment, the power supply board 550 is housed in a housing consisting of a resin front panel and a metal box, but it may also be housed in a transparent resin board case such as the main board case 210 shown in FIG. 7. In this case, the power switch that was previously installed on the resin front panel may be mounted on the power supply board 550, and an opening for the power switch may be provided in the lid of the board case so that it can be turned on and off from the outside. Even in such a configuration, the orientation of the lead wires of the components mounted on the board shown in FIG. 32 can be applied.

[0187] As an example, Figures 33(b-1) and (b-2) show a state in which a power switch is mounted on a power supply board 550'. Figure 33(b-1) shows the power supply board 550' as seen from the front to the rear, and Figure 33(b-2) shows the power supply board 550' as seen from the right to the left. The directions of the arrows in Figures 33(b-1) and (b-2) correspond to the directions of the arrows in Figure 2.

[0188] The power switch SW1 shown in Figures 33(b-1) and (b-2) has four terminals: terminals LN9a and LN9b, and terminals LN10a and LN10b, which are spaced apart in the vertical direction. Furthermore, as shown in Figure 33(b-2), the terminals LN9a and LN9b and the terminals LN10a and LN10b are arranged side by side in the front-to-back direction on the power switch SW1. In this case, the power switch SW1 is mounted on the power supply board 550' so that the terminals LN9a and LN9b and the terminals LN10a and LN10b are positioned vertically.

[0189] 30 to 33 have been described using the components mounted on the sub-control board 502 and the power supply board 550 as examples, but they can also be applied to components mounted on the main control board 111. Furthermore, the component arrangements on the boards shown in FIGS. 30 to 33 are not limited to boards mounted on slot machines, but can also be applied to boards mounted on pachinko gaming machines.

[0190] <Reel unit configuration> Next, the structure of the reel unit 60 shown in FIG. 3 will be described with reference to FIGS. 34 to 40. As shown in FIG. 34, the reel unit 60 is configured to include first to third reel modules 600a to 600c, a reel module mounting member 61, a relay board 65, and a board cover 66. The reel module mounting member 61 is made of a resin material and is formed in a box shape that is open on the front and right sides, and is configured to be able to accommodate the first to third reel modules 600a to 600c lined up in the left-right direction (see the arrows in FIG. 2). That is, the reel module mounting member 61 has three storage positions defined: left, center, and right, and the first reel module 600a is accommodated in the left storage position, the second reel module 600b in the center storage position, and the third reel module 600c in the right storage position.

[0191] An upper flange portion 62 is formed above the opening of the reel module mounting member 61, and an upper bracket coupling portion 602 formed on the upper part of the reel bracket 601 of each of the first to third reel modules 600a to 600c is coupled to the upper flange portion 62 by a bracket coupling member 641. A lower flange portion 62 is formed below the opening of the reel module mounting member 61, and a lower bracket coupling portion 608 formed on the lower part of the reel bracket 601 of each of the first to third reel modules 600a to 600c is coupled to the lower flange portion 62 by a bracket coupling member 641.

[0192] A board mounting portion 64 is formed on the top of the reel module mounting member 61. A relay board 65 and a board cover 66 are attached to the board mounting portion 64. The relay board 65 is attached and fixed to the board mounting portion 64 with fixing means (not shown) such as screws. The relay board 65 is electrically connected to the main control device 100 and controls the operation of the first to third reel modules 600a to 600c in response to reel control signals transmitted from the main control device 100. The relay board 65 also relays various commands transmitted from the main control device 100 to the sub-control device 500 and signals exchanged between the main control device 100 and the medal payout device 50. The board cover 66 is made of a transparent resin material and is formed in a box shape capable of covering the relay board 65 from above. The board cover 66 is connected and attached to the board mounting portion 64 by a cover connecting member (not shown).

[0193] (Reel module configuration) Next, the first to third reel modules 600a to 600c will be described with reference to Figures 35 and 36. The second reel module 600b has the same configuration as the first reel module 600a except that it uses a second reel 3b with a different pattern from the left reel 3a, and so detailed illustrations and descriptions will be omitted. The third reel module 600c has the same configuration as the first reel module 600a except that it includes a right reel 3c with a different pattern from the left reel 3a (and center reel 3b), and so detailed illustrations and descriptions will be omitted.

[0194] As shown in Figures 35 and 36, the first reel module 600a is configured to include a left reel 3a, a reel bracket 601, a reel sensor 621, a back lamp unit 650, a stepping motor 680, and a reel connecting member 690. The reel bracket 601 is formed into a plate shape using a resin material, and the stepping motor 680, the back lamp unit 650, and the reel sensor 621 (see Figure 36) are attached to the left side of the reel bracket 601. Here, the reel sensor 621 is a sensor that detects a detection piece (index) formed on a reel wheel 721 (described later), and the position where the reel sensor 621 detects the index becomes the rotation reference position described above.

[0195] A plate-shaped upper bracket coupling portion 602 is formed on the upper front side of the reel bracket 601. The upper bracket coupling portion 602 is coupled to the left side of the middle portion of the upper flange portion 502 (see FIG. 34) of the reel module mounting member 61 using a bracket coupling member 641. A plate-shaped lower bracket coupling portion 608 is formed on the lower front side of the reel bracket 601. The lower bracket coupling portion 608 is coupled to the left side of the middle portion of the lower flange portion 508 (see FIG. 34) of the reel module mounting member 61 using the bracket coupling member 641. The bracket coupling member 641 is configured using a Nylatch or the like.

[0196] An upper connector mounting portion 603 is formed on the left side of the upper bracket joining portion 602. A first motor cable connector 606 (see FIG. 34) is attached to the upper connector mounting portion 603. A bifurcated motor cable (not shown) is connected to the stepping motor 680 and the reel sensor 621. The first motor cable connector 606 is connected to the reel relay board 65 (see FIG. 34) via a cable. Guide pin engagement holes 604 are formed on both sides of the upper connector mounting portion 603, into which guide pins 607 (see FIG. 34) of the first motor cable connector 606 engage. The first motor cable connector 606 attached to the upper connector mounting portion 603 is adapted to mate with and be electrically connected to a reel relay connector (not shown) disposed at the front of the reel relay board 65 when the first reel module 600a is accommodated in the reel module mounting member 61.

[0197] One of the forked ends of the motor cable is electrically connected to the motor connector 675 of the stepping motor 680, and the other is electrically connected to a sensor connector (not shown) of the reel sensor 621. In addition, a cable insertion portion 605 is cut out and formed in the lower right part of the upper bracket joining portion 602, and the motor cable extending toward the stepping motor 680 and the reel sensor 621 is inserted through it.

[0198] A rear connector mounting portion 613 is formed on the upper rear side of the reel bracket 601. A first lamp cable connector 616 is attached to the rear connector mounting portion 613. The first lamp cable connector 616 is provided at one end of a lamp cable (not shown) that is electrically connected to a back lamp board 653 (see FIG. 38) on which a plurality of high-brightness LEDs are mounted. Guide pin engagement holes 614 that engage with guide pins 617 of the first lamp cable connector 616 are formed on both sides of the rear connector mounting portion 613. When the first reel module 600a is accommodated in the reel module mounting member 61, the first lamp cable connector 616 attached to the rear connector mounting portion 613 is fitted with a lamp relay connector (not shown) arranged on the lamp relay board, thereby being electrically connected to the back lamp board 653.

[0199] When the first reel module 600a is accommodated in the reel module mounting member 61, the first motor cable connector 606 (see FIG. 34) fits and is electrically connected to a reel relay connector (not shown) arranged on the reel relay board 65, and the first lamp cable connector 616 fits and is electrically connected to a lamp relay connector (not shown) arranged on the lamp relay board. Thus, simply by performing the work of accommodating and attaching the first reel module 600a in the reel module mounting member 61, the stepping motor 680 and the reel sensor 621 can be electrically connected to the reel relay board 65, and the back lamp board 653 can be electrically connected to the lamp relay board (not shown). Therefore, it is no longer necessary to use individually prepared cables as in the conventional method to separately electrically connect the stepping motor 680 and the reel relay board 65, the reel sensor 621 and the reel relay board 65, and the back lamp board 653 and the lamp relay board (not shown), and the assembly work of the reel unit 200 can be carried out efficiently.

[0200] The stepping motor 680 rotates the left reel 3a and is fixed to the motor mounting portion 631 of the reel bracket 601. The output shaft of the stepping motor 680 is inserted into a through-hole provided at the rotation center of the left reel 3a, and the left reel 3a is fixed to the output shaft of the stepping motor 680 by a reel connecting member 690.

[0201] (Back lamp unit configuration) Next, the configuration of the back lamp unit 650 will be described with reference to Figure 37. Here, Figure 37(a) is a perspective view of the back lamp unit 650, and Figure 37(b) is a front view of the back lamp unit 650. The back lamp unit 650 is composed of a back lamp house 651 attached to the reel bracket 601, and a back lamp board 653 (see Figure 38) attached to the back side of the back lamp house 651.

[0202] The back lamp board 653 is mounted with a plurality of LED elements for illuminating the three symbols displayed in the upper, middle, and lower rows of the reel window W from inside the reels. In this embodiment, six LED elements (18 in total) are mounted corresponding to each of the three symbols displayed in the reel window W. Specifically, six LED elements 654a for illuminating the symbols in the upper row of the reel window W, six LED elements 654b for illuminating the symbols in the middle row of the reel window W, and six LED elements 654c for illuminating the symbols in the lower row of the reel window W are mounted on one back lamp board 653. The six LED elements corresponding to the upper, middle, and lower rows, respectively, are arranged in a matrix of two rows and three columns at predetermined intervals.

[0203] The back lamp house 651 is made of a resin material, and an attachment arm portion 652 for attaching the back lamp house 651 to the reel bracket 601 is formed on the right side of the back lamp house 651. Also, three pattern illumination areas 661a, 661b, and 661c for illuminating the upper, middle, and lower patterns are formed on the back lamp house 651. Here, the pattern illumination area 661a is an area for illuminating the upper pattern, the pattern illumination area 661b is an area for illuminating the middle pattern, and the pattern illumination area 661c is an area for illuminating the lower pattern.

[0204] The symbol illumination area 661a is formed by an LED exposed surface 663a and a shade portion 664a. The LED exposed surface 663a is a rectangular surface facing the inner circumferential surface of the reel. The LED exposed surface 663a is provided with openings 662a (six in total) for exposing the light-emitting surfaces of the LED elements 654a, one for each of the six LED elements 654a. The shade portion 664a has a cylindrical shape extending from the top, bottom, left, and right peripheral edges of the LED exposed surface 663a toward the inner circumferential surface of the reel. The inner surface of the shade portion 664a is inclined so that the opening of the symbol illumination area 661a gradually widens from the LED exposed surface 663a toward the inner circumferential surface of the reel. The symbol illumination area 661b is also formed by an LED exposed surface 663b and a shade portion 664b similar to the LED exposed surface 663a and the shade portion 664a of the symbol illumination area 661a. The pattern illumination area 661c is also formed by an LED exposed surface 663c and a shade portion 664c similar to the LED exposed surface 663a and the shade portion 664a of the pattern illumination area 661a. The LED exposed surfaces 663a, 663b, and 663c and the shade portions 664a, 664b, and 664c are white, which allows more light from the six LED elements 654a to be reflected. For reference, the LED exposed surface 663a is indicated by diagonal lines slanting upward to the right in Figure 37(b).

[0205] The symbol lighting area 661a and the symbol lighting area 661b are separated by a partition plate 665a having a thickness of TH3. The symbol lighting area 661b and the symbol lighting area 661c are separated by a partition plate 665b having a thickness of TH3. Here, the top plate portion 650a and the bottom plate portion 650b of the back lamp house 651 protrude further forward (toward the reel 3a) than the partition plates 665a and 665b. The thickness TH4 of the top plate portion 650a and the bottom plate portion 650b of the back lamp house 651 is thicker than the thickness TH3 of the partition plates 665a and 665b. Furthermore, the width of the symbol lighting area 661b in the rotation direction of the reel 3a is narrower than the widths of the symbol lighting areas 661a and 661c. By configuring the back lamp house 651 in this manner, the light from the LED elements 654a, 654b, and 654c is less likely to leak from the back lamp house 651.

[0206] The six openings formed in each of the LED exposed surfaces 663a, 663b, 663c are provided to match the mounting positions of the six LED elements 654a when the back lamp board 653 is attached to the back side of the back lamp unit 650. The top, bottom, left, and right surfaces forming each of the shade portions 664a, 664b, 664c are inclined so that the openings gradually widen from the corresponding LED exposed surface 663a, 663b, 663c toward the inner circumferential surface of the reel.

[0207] Although six openings 662a, 662b, 662c corresponding to six LED elements are provided on the LED exposed surfaces 663a, 663b, 663c of the back lamp house 651 shown in Fig. 37, the shape of the openings is not limited to this. Modified examples of the openings provided on the LED exposed surfaces will now be described with reference to Fig. 38. In Fig. 38, the same components as those in Fig. 37 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0208] Openings 662a', 662b', and 662c' provided in LED exposed surfaces 663a, 663b, and 663c of a back lamp house 651' shown in Fig. 38 are not provided corresponding to the six LED elements individually, but are a single opening that encompasses all of the light-emitting surfaces of the six LED elements. Here, the LED exposed surfaces 663a, 663b, and 663c and shade portions 664a, 664b, and 664c of the back lamp house 651' shown in Fig. 38 are white in color, similar to the back lamp house 651 in Fig. 37, but the surface of the back lamp substrate 653 exposed from the openings 662a', 662b', and 662c' in the LED exposed surfaces 663a, 663b, and 663c is also colored white.

[0209] In this way, by forming one large opening for the six LED elements, it becomes easy to align the six LED elements with one opening when attaching the back lamp board 653 to the back side of the back lamp house 651, thereby reducing the workload of assembling the back lamp unit 650. In addition, the height of the left and right side walls of the back lamp house 651 extends to the position of the front ends of the partition plates 664a and 664b. This reduces the light leaking to the outside from the side walls of the back lamp house 651, allowing the pattern to be illuminated more brightly.

[0210] (Reel structure) Next, the structures of the reels 3a to 3c will be described with reference to FIG. 39. Because the reels 3a to 3c have the same structure, the following description will use the left reel 3a as an example to describe their structure. As shown in FIG. 39, the left reel 3a is configured to include a reel tape 711, a reel wheel 721, and a reel frame 731. The reel tape 711 is formed into a ring shape with multiple designs (20 designs in this embodiment) drawn on its outer periphery by joining the ends of a thin strip of film material with a reel width RW, as shown in FIG. 39. The right edge of the reel tape 711 is wound around the outer periphery 732 of the reel frame 731, and the left edge of the reel tape 711 is wound around the outer periphery 722 of the reel wheel 721. This results in a cylindrical shape with the wheel 721 and reel frame 731 as the bottom and the reel tape 711 as the side.

[0211] As shown in Fig. 40, the reel tape 711 is divided into 20 equal lengths DL (indicated by dashed lines in Fig. 40) in its longitudinal direction (i.e., the circumferential direction of the reel 3a), and 20 symbol display areas are defined, and one symbol is displayed in each symbol display area. Fig. 40 shows, as an example, seven symbols (from top to bottom in the figure, "watermelon", "bell", "replay", "cherry", "seven", "bar", "bell", and "replay") out of the 20 symbols displayed on the left reel 3a.

[0212] The area of ​​each of the 20 symbol display areas is the same (= reel width RW × length of one section DL), but the size of the symbol displayed in each symbol display area varies depending on the type of symbol. Therefore, the spacing between the symbols displayed on the reel tape 711 is not uniform. In this embodiment, as shown in FIG. 40, the spacing DGmin between the "Seven" symbol and the "Bar" symbol is the narrowest spacing (hereinafter, the "spacing DGmin" will be referred to as the "minimum symbol spacing DGmin"). Of these symbols, the "Seven" symbol has a transparent region LT that transmits light from the backup lamp without diffusing it (i.e., you can see through the reel tape 711 to the other side). In addition, in the "Seven" symbol, the color of the colored areas other than the transparent region LT is red, and the transparent region LT is also colored red.

[0213] The length of the minimum symbol interval DGmin is longer than the movement distance Ad of the symbols when the stepping motor 680 shown in Fig. 36 rotates by one step. This makes it less likely that the illumination of the symbols by the back lamp will be adversely affected even if the stopping positions of the symbols vary when the rotation of the reel 3a stops.

[0214] 39, the reel wheel 721 is formed in a generally disk-like shape using a resin material and has an outer ring portion 722 formed in an annular shape, a hub portion 723 connected to the output shaft of the stepping motor 680, and four spokes 724 connecting the outer ring portion 722 and the hub portion 723. The outer ring portion 722 is formed with an outer surface portion 725 around which the left peripheral edge of the reel tape 711 is attached and wound. A wheel rim portion 726 with a width Wr is formed on the right end of the outer surface portion 725 and extends radially inward from the outer ring portion 224 (in other words, toward the center of rotation of the left reel 3a).

[0215] 39, the reel frame 731 is formed in an annular shape using a resin material. An outer peripheral surface portion 732 is formed on the outer periphery of the reel frame 731, around which the right peripheral edge of the reel tape 711 is attached and wound. A frame rim portion 733 with a width Wr is formed on the left end of the outer peripheral surface portion 732, extending radially inward of the reel frame 731 (in other words, toward the center of rotation of the left reel 3a).

[0216] <Relationship between the back lamp house and the reel> The following describes the characteristics of the relationship between the back lamp house 651 and the reels 3a, 3b, and 3c. (Relationship between the back lamp house and the reel symbols) In this embodiment, the sizes of the LED exposed surfaces 663a, 663b, and 663c shown in Figures 37 and 38 are each smaller than the size of the symbol display area shown in Figure 40. More specifically, the ranges of the LED exposed surfaces 663a, 663b, and 663c are sized to fit within the range of the symbol display area. More preferably, the ranges of the LED exposed surfaces 663a, 663b, and 663c are configured to fit within the outline of the largest symbol among the symbols displayed on the reel tape 711.

[0217] As described above, for example, the shade portion 664a is inclined so that the opening of the symbol illumination area 661a gradually widens from the LED exposed surface 663a toward the periphery of the reel contents (the same applies to the shade portions 664b and 664c). Here, if the shape of the LED exposed surface 663a is too large, the above-mentioned inclination of the shade portion 664a becomes gentler, and the light illuminating the reel symbols becomes more likely to be uneven. Therefore, by configuring the sizes of the LED exposed surfaces 663a, 663b, and 663c to satisfy the above-mentioned relationship, the light illuminating the reel symbols is less likely to be uneven, and the symbols can be clearly illuminated. This improves the visibility of the symbols, allowing players to play smoothly.

[0218] In this embodiment, the color of the area other than the design displayed on the reel tape 711 (hereinafter also referred to as the "background color of the reel tape") is different from the color of the LED exposed surfaces 663a, 663b, 663c and the side surfaces of the shade portions 664a, 664b, 664c visible through the transparent region LT shown in FIG. 40. In addition, the background color of the reel tape is different from the color of the end surfaces of the partition plates 665a, 665b and the shade portions 664a, 664b, 664c visible through the transparent region LT (surfaces indicated by diagonal lines slanting downward to the right in FIG. 37(b)). Here, examples of "different colors" include when one color is achromatic and the other is chromatic, or when the other color is a color other than a similar hue to the other color (more preferably, the other color is an opposite hue to the other color). The background color of the reel tape, the color of the LED exposed surfaces 663a, 663b, and 663c when viewed directly, and the color of the LED exposed surfaces 663a, 663b, and 663c when viewed through the transparent region LT may be different colors regardless of whether the LED elements 654a, 654b, and 654c are lit or unlit. Furthermore, when the LED elements 654a, 654b, and 654c are not lit, the positions of the LED elements 654a, 654b, and 654 cannot be identified through the transparent region LT.

[0219] By configuring it in this way, it is possible to prevent the transparent area LT of the visible symbol from blending into the background color of the reel tape and reducing its visibility. Also, even if the LED elements mounted on the back lamp board 653 malfunction and are unable to illuminate the symbol, the visibility of the light-transmitting area LT is less likely to be reduced, making it easier to press the buttons, allowing the player to play smoothly.

[0220] In addition, in this embodiment, the thickness TH3 of the partition plates 665a, 665b shown in Figures 37 and 38 is smaller than the minimum symbol interval DGmin shown in Figure 40. With this configuration, the partition plates 665a, 665b can prevent the lights illuminating the symbols in the upper, middle, and lower rows of the reel window W from interfering with each other, and the light illuminating the symbols can illuminate the entire symbols without being blocked by the partition plates 665a, 665b, improving the visibility of the symbols and allowing the player to play smoothly.

[0221] (Relationship between the back lamp house and the reel structure) In this embodiment, as shown in Figure 36, the reel 3a is fixed to the output shaft of the stepping motor 680 with the back lamp module 650 sandwiched between a wheel rim portion 726 formed on the reel wheel 721 and a frame rim portion 733 (see Figure 39) formed on the reel frame 731. At this time, the wheel rim portion 726 and the frame rim portion 733 extend toward the rotation center of the reel 3a beyond the position of the opening of the back lamp house 651. Therefore, the opening of the back lamp house 651 is surrounded by the wheel rim portion 726 of the reel wheel 721, the reel tape 711, and the frame rim portion 733 of the reel frame 731.

[0222] As a result, even if the reel connecting member 690 comes off, either the wheel rim portion 726 or the frame rim portion 733 will catch on the back lamp house 651, preventing the reel 3a from falling off the reel module 600a, thereby reducing the risk of damage to the reel 3a.

[0223] Furthermore, for example, if the wheel rim portion 726 and the frame rim portion 733 are made of a material that does not transmit light, or if they are made of a material that transmits light but are painted in a color that does not transmit light (for example, black), the light leaking from the side wall of the back lamp house 651 can be blocked by the wheel rim portion 726 and the frame rim portion 733. This allows more light to be irradiated onto the symbols, improving their visibility and allowing the player to play smoothly.

[0224] <Countermeasures against fraud> Next, the relationship between the color of the material of the cabinet 5 and the paint color will be described with reference to Figure 41. Figure 41(a) is a right side view of the slot machine 1 installed in the gaming machine rack MC in the hall, and Figure 41(b) is a cross-sectional view of the screw holes provided in the right side plate 5b. The directions of the arrows shown in Figures 41(a) and (b) correspond to the directions of the arrows shown in Figure 2.

[0225] In this embodiment, the cabinet 5 shown in FIGS. 2 and 6 is made of light brown particle board. The left side panel 5a, right side panel 5b, and top panel 5c of the cabinet 5 are painted black, while the bottom panel 5d and back panel 5e are unpainted. As shown in FIG. 3, a medal payout device 50 is installed on the bottom panel 5d inside the cabinet 5. Due to the size of the medal payout device 50, the length of the bottom panel 5d in the front-to-back direction is longer than the length of the top panel 5c. Therefore, the left side panel 5a and right side panel 5b are shaped like a rectangular trapezoid, with the back panel 5e at a right angle. When a cabinet 5 having this shape is installed in a gaming machine rack MC in a hall, a portion of the right side panel 5b (and left side panel 5a) (the portion indicated by diagonal lines in FIG. 41(a)) must be exposed to the outside in order to enable the front door 2 to be opened and closed.

[0226] For example, if someone were to commit fraud by drilling a hole in the exposed part of the right panel 5b, the side of the hole would turn light brown, the color of the particle board material. Therefore, a light brown area would appear on the surface of the right panel 5b against the black paint background, making it easy to notice that the housing 5 has been damaged.

[0227] 41(a), screw holes SRH are provided in the exposed portion of the right side plate 5b for attaching various devices and components to the inside of the housing 5. As shown in FIG. 41(b), these screw holes SRH are countersunk holes to prevent the heads of the screws SCR from protruding from the surface of the housing, and the countersunk surfaces CHF are also painted black. As a result, if the countersunk surfaces CHF are damaged, for example, in an attempt to commit fraud, a light brown area will appear on the black painted background, making it easy to notice that the countersunk surfaces CHF have been damaged.

[0228] Next, with reference to Figure 42, the signal paths exchanged between the various devices installed inside the housing 5 will be described. Figure 42 shows the signal paths exchanged between the main control device 100 and the stop switches 26a, 26b, and 26c, the medal payout device 50, and the external centralized terminal board 80. As shown in Figure 42, the main control device 100 and the stop switches 26a, 26b, and 26 are electrically connected by signal line sg1, and the main control device 100 and the reel relay board 65 are electrically connected by signal lines sg2 and sg3. The reel relay board 65 and the medal payout device 50 are electrically connected by signal line sg4, and the reel relay board 65 and the external centralized terminal board 80 are electrically connected by signal line sg5.

[0229] With this signal path, for example, a stop operation signal output from stop switches 26a, 26b, and 26c to main control device 100 is input directly to main control device 100 via signal line sg1. This allows main control device 100 to control the stops of reels 3a, 3b, and 3c. Furthermore, if a minor winning combination results as a result of main control device 100 performing stop control for all reels, it outputs a medal payout signal to medal payout device 50 to pay out a predetermined number of medals. This medal payout signal is first output to reel relay board 65 via signal line sg2, and then output from reel relay board 65 to medal payout device 50 via signal line sg4. This allows medal payout device 50 to output a payout completion signal to main control device 100 each time it pays out a medal.

[0230] This payout completion signal is first output to the reel relay board 65 via signal line sg4, and then output from the reel relay board 65 to the main control unit 100 via signal line sg2. The main control unit 100 then counts the number of times the payout completion signal has been input, and stops outputting the medal payout signal when the number of medals corresponding to the winning minor combination has been paid out. Furthermore, when the main control unit 100 outputs a game information signal indicating the number of inserted medals, the number of paid out medals, etc. to the external centralized terminal board 80, the signal is first transmitted to the reel relay board 65 via signal line sg3, and then transmitted from the reel relay board 65 to the external centralized terminal board 80 via signal line sg5. The external centralized terminal board 80 then outputs the input game information signal to an external device such as a hall computer.

[0231] Here, for example, when stop switches 26a, 26b, and 26c transmit a stop operation signal to main control device 100 via reel relay board 65, there is a risk of fraudulent activity in which an unauthorized board having the following function is attached to reel relay board 65. First, when stop switches 26a, 26b, and 26c output a stop operation signal to reel relay board 65, the unauthorized board uses the stop operation signal as a trigger to prevent a payout completion signal from being output to main control device 100 for a predetermined time, even if the payout completion signal is output from medal payout device 50. Furthermore, during this time, even if a game information signal is output from main control device 100, the unauthorized board prevents the game information signal from being output to external centralized terminal board 80.

[0232] As a result, when a medal payout signal is output from the main control unit 100 to the medal payout device 50 via the reel relay board 65 during the aforementioned predetermined time, the medal payout device 50 begins paying out medals in response, but the fraudulent board prevents the payout completion signal from being output to the main control unit 100 until the aforementioned predetermined time has elapsed. As a result, the main control unit 100 is unable to count the number of medals paid out, and so the main control unit 100 continues to output the medal payout signal, resulting in the improper payment of medals. Furthermore, during this time, no game information signal is output to the external centralized terminal board 80, so the hall computer is unable to recognize that an unnatural payout is occurring.

[0233] Therefore, in this embodiment, the signal path shown in Figure 42 is adopted, and the stop operation signal that triggers the above-mentioned fraudulent behavior is output directly to the main control device 100 without going through the reel relay board 65, thereby making it possible to nullify the above-mentioned fraudulent behavior.

[0234] <Information display lamp (role ratio monitor) display content> Next, the display contents of the information display lamp 156 shown in Fig. 13 will be described in detail with reference to Fig. 43. As shown in Fig. 43(a), the information display lamp 156 is composed of a four-digit seven-segment LED, with the seven-segment LED of the upper two digits being an identification segment 156a and the seven-segment LED of the lower two digits being a ratio segment 156b. The identification segment 156a displays information (hereinafter also referred to as an "identifier") indicating the type of numerical value (ratio) displayed in the ratio segment 156b, and the ratio segment 156b displays a numerical value (ratio) corresponding to the identifier displayed in the identification segment 156a. There are six types of ratios displayed on the information display lamp 156: (1) instructed role ratio or advantageous zone ratio, (2) consecutive role ratio (6000 games), (3) role ratio (6000 games), (4) consecutive role ratio (cumulative), (5) role ratio (cumulative), and (6) role etc. state ratio. These ratios are displayed on the information display lamp 156 in a sequential and cyclical manner together with an identifier consisting of a single digit and a single alphabetic character.

[0235] Next, the six types of ratios mentioned above will be explained with reference to Figure 43(b). (1) Regarding the instruction-based feature ratio or advantageous zone ratio, the advantageous zone ratio is a numerical value expressed as a two-digit percentage representing the proportion of games played in advantageous zones (game states in which the order in which the stop switches should be pressed can be announced) out of the total number of games played (actually 175,000 games), and its identifier is "7U." The instruction-based feature ratio is a numerical value expressed as a two-digit percentage representing the proportion of medals paid out during games and features in which the order in which the stop switches should be pressed is announced to the player (first-class special feature (RB), second-class special feature (CB), and normal feature (CB)) out of the total number of medals paid out in the total number of games played (actually 175,000 games), and its identifier is "7P." Either the instruction-based feature ratio or the advantageous zone ratio is displayed depending on the specifications of the slot machine.

[0236] (2) The consecutive win ratio (6000 games) is, in principle, a number that expresses as a double-digit percentage the ratio of the number of medals paid out during the operation of the first-class special role device to the number of medals paid out during the most recent 6000 games, and its identifier is "6y." (3) The winning ratio (6000 games) is, in principle, a number that expresses as a double-digit percentage the ratio of the number of medals paid out during the operation of the first-class special role device, second-class special role device, and normal role device to the number of medals paid out during the most recent 6000 games, and its identifier is "7y."

[0237] (4) The consecutive role ratio (cumulative) is, in principle, a number expressed as a double-digit percentage of the number of medals paid out during the operation of a first-class special role device, out of the total number of medals paid out during the most recent 17,500 games, and its identifier is "6A." (5) The role ratio (cumulative) is, in principle, a number expressed as a double-digit percentage of the number of medals paid out during the operation of a first-class special role device, a second-class special role device, and a normal role device, out of the total number of medals paid out during the most recent 17,500 games, and its identifier is "7A." (6) The role status ratio is, in principle, a number expressed as a double-digit percentage of the total number of games played during the operation of a role device (first-class special role device, second-class special role device, normal role device, role continuous operation device), out of 175,000 games (cumulative number of games), and its identifier is "5H."

[0238] The information display lamp 156 displays the above-mentioned various information in a cyclical manner in the following order: (1) Indicated role ratio (or advantageous zone ratio) → (2) Consecutive role ratio (6000 games) → (3) Role ratio (6000 games) → (4) Consecutive role ratio (cumulative) → (5) Role ratio (cumulative) → (6) Role status ratio, etc., and each piece of information is displayed for 5 seconds (tolerance ±10%). Also, when the above-mentioned information is displayed on the information display lamp 156, the segment DP (see FIG. 43(a)) representing the decimal point is lit in the 7-segment LED on the lower digit side of the identification segment 156a. As a result, the identification segment 156a will transition as follows: "7P." (or "7U.") → "6y." → "7y." → "6A." → "7A." → "5H." → "7P." (or "7U.") → ..., and the ratio segment 156b will display the percentage value corresponding to the displayed identifier.

[0239] The ratio segment 156b displays a percentage value corresponding to each of the display items (1) to (6) described above within a range of "00" to "99." The percentage value displayed in the ratio segment 156b is a value with decimal points discarded, and when the calculated ratio is 100%, "99" is displayed in the ratio segment 156b. As shown in FIG. 43(b), a ratio threshold is set for each display item. The ratio thresholds are 70% for (1) the instructed role ratio or advantageous zone ratio, (3) the role ratio (6000 games), and (5) the role ratio (cumulative), 60% for (2) the consecutive role ratio (6000 games) and (4) the consecutive role ratio (cumulative), and 50% for (6) the role status ratio. When displaying each display item, if the ratio of that display item is equal to or greater than the corresponding ratio threshold, the number displayed in the ratio segment 156b flashes.

[0240] In addition, for each of the display items (1) to (6), if the total number of games is less than the corresponding reference number of games because, for example, the slot machine has only recently started operating, the identifier displayed in the identification segment 156a flashes. The reference number of games for each display item is, as shown in Figure 43(b), 175,000 games for (1) instructed role ratio or advantageous zone ratio and (6) role etc. state ratio, 6,000 games for (2) consecutive role ratio (6,000 games) and (3) role ratio (6,000 games), and 17,500 games for (4) consecutive role ratio (cumulative) and (5) role ratio (cumulative). In addition, when the identification segment 156a and the ratio segment 156b flash, the total time of the on period and off period is 0.6 seconds (tolerance ±10%), and the duty ratio of the on period is 50%, resulting in an on period of approximately 0.3 seconds and an off period of approximately 0.3 seconds.

[0241] <Monitor LED list sticker> Next, the monitor LED list sticker LST shown in Fig. 6 will be described with reference to Fig. 44. Fig. 44(a) is an enlarged view of the area around 141 (more specifically, the area MON in Fig. 45(a) to be referred to later) of the main control board 110 shown in Fig. 13. Fig. 44(b) is a view showing the contents of the monitor LED list written on the monitor LED list sticker LST. As mentioned above, the main control board 110 is mounted with a monitor lamp 141 consisting of 20 LED elements 142 (reference numbers are assigned to only some of the LED elements to avoid cluttering the illustration), and the component numbers (D1 to D20) assigned to each LED element 142 are silk-screened on the component mounting surface of the main control board 110, as shown in Fig. 44(a).

[0242] Specifically, of the 20 LED elements 142 arranged in two rows, one above the other, the ten LED elements 142 in the bottom row are indicated by the silkscreen print SLK1 with component numbers D1 to D10, starting from left to right. The ten LED elements 142 in the top row are indicated by the silkscreen print SLK2, which collectively lists the component numbers D11 to D20 for each LED element 142, because there is no space on the component mounting surface for silkscreen printing corresponding to each LED element 142. This silkscreen print SLK2 indicates that the ten LED elements 142 in the top row are assigned the component numbers D11 to D20, starting from left to right.

[0243] Next, with reference to FIG. 44(b), the contents of the monitor LED list written on the monitor LED list sticker LST will be described. The monitor LED list is a table that lists the part numbers of the above-mentioned LED elements 142 and the names of the switches and sensors corresponding to each part number. For example, in the monitor LED list shown in FIG. 44(b), "start lever" is written for part number "D4," which indicates that the LED element 142 with part number "D4" (the fourth LED element 142 from the left in the bottom row in FIG. 44(a)) corresponds to the start lever 25. Therefore, the LED element 142 with part number "D4" will light up or go out depending on the operation of the start lever 25.

[0244] In this way, by attaching the monitor LED list sticker LST to the inside of the cabinet 5 (specifically, the left side panel 5a), when checking whether the various switches and sensors of the slot machine are operating normally, it is possible to save the trouble of memorizing the correspondence between the 20 LED elements 142 and each switch or sensor, or preparing a service manual that describes the correspondence between the LED elements 142 and each switch or sensor. Furthermore, it is less likely to confuse the correspondence between the LED elements 142 and each switch or sensor, allowing for accurate checking. Furthermore, because the monitor LED list is indicated by a sticker rather than engraved on the inside of the cabinet 5, the slot machine cabinet can be recycled by peeling off the monitor LED list sticker. Furthermore, even if, for example, the correspondence between the LED elements 142 and each switch or sensor is changed, the monitor LED list sticker can be easily updated.

[0245] In contrast, for the display contents of the information display lamp 156 described above (role ratio including instructions (or advantageous zone ratio), consecutive role ratio (6000 games), role ratio (6000 games), consecutive role ratio (cumulative), role ratio (cumulative), and role etc. state ratio), no list equivalent to the monitor LED list sticker LST is affixed to the inside of the cabinet 5. This is because, since the number of items displayed on the information display lamp 156 is only six, it is considered that the display contents of the information display lamp 156 can be easily understood without the need to take the trouble of clearly indicating a list. Furthermore, the display contents of the information display lamp 156 can be considered a type of gaming history information that indicates the proportion of advantageous states for the player and the proportion of profits awarded to the player in advantageous states, and therefore can be considered information of a nature that should be kept secret from persons other than those involved (such as the player). Therefore, if the display content of the information display lamp 156 is clearly written on the inside of the cabinet 5, for example, when the front door 2 is opened in a place where a player is present to deal with a problem such as a medal jam while the slot machine is in operation or to replenish medals, there is a risk that the display content of the information display lamp 156 may be known to the player, etc., so this can be avoided.

[0246] The part numbers (D1 to D20) assigned to each LED element 142 and the display content (identifier and ratio) displayed on the information display lamp 156 are different information. Specifically, the information display lamp 156 is designed not to display a string consisting of the letter "D" and the numbers "1" to "20." This is because if the same information were displayed, there is a risk that the identifier content displayed on the information display lamp 156 would be mistakenly identified based on the information on the monitor LED list sticker LST. By providing different information in this way, the content displayed on the information display lamp 156 will not be misinterpreted.

[0247] Furthermore, to avoid similar misidentification, it is preferable not to use the character strings used for the part numbers of each LED element 142 (such as "D1" through "D20," which are character strings consisting of the letter "D" and the numbers "1" through "20") as character strings to be written on crimping usage record labels, as identifier character strings to be displayed in the identification segment 156a, or as character strings indicating error codes. Similarly, it is preferable not to use the identifier character strings to be displayed in the identification segment 156a as character strings to be written on crimping usage record labels, as character strings indicating part numbers of electronic components or the like indicated by silk screen printing on a circuit board, or as character strings indicating error codes.

[0248] <Areas where electronic components cannot be mounted> Next, the mounting areas of electronic components on various boards of this embodiment will be described with reference to Fig. 45. Fig. 45 shows the component mounting surface (surface portion FS) of main control board 110 as viewed from the front, with Fig. 45(a) showing the entire main control board 110 and Fig. 45(b) showing an enlarged view of area A (around the upper right through-hole th2) surrounded by a dashed line in main control board 110 shown in Fig. 45(a).

[0249] As shown in FIG. 45(a), four through-holes th are provided at the four corners of the main control board 110 for fixing the main control board 110 to the case body 211 with mounting screws (not shown). When referring to the four through-holes separately, they are referred to as the upper-left through-hole th1, the upper-right through-hole th2, the lower-left through-hole th3, and the lower-right through-hole th4. In this embodiment, as shown in FIG. 45(b), a circular area of ​​radius r from the center thc of the upper-right through-hole th2 is designated as an area where electronic components are not mounted (a non-mountable area). Here, the length of radius r is the length of the mounting screws. Similarly, circular areas of radius r from the center thc of the through-holes around the upper-left through-hole th1, the lower-left through-hole th3, and the lower-right through-hole th4 are also designated as non-mountable areas.

[0250] In this way, by designating a circular area of ​​radius r (the length of the mounting screw) from the center thc of the through hole as an area where mounting is not possible, even if the mounting screw is bent, for example, because the mounting screw is not screwed in completely and the case lid 221 is attached to the case body 211 with the head of the screw floating above the board mounting surface, it is possible to prevent the bent mounting screw from shorting out electronic components on the main control board 110 to ground or shorting out the lead wires of adjacent electronic components.

[0251] In the example described above, main control board 110 is screwed to case body 211, but the above-described non-mountable area may also be applied when main control board 110 is screwed to case lid 221. Here, with reference to Figure 46, a structure that allows main control board 110 to be screwed to case body 211 and a structure that allows main control board 110 to be screwed to case lid 221 will be described. Figure 46 is a view of main board case 210 shown in Figure 45, viewed from the right side to the left side as indicated by the arrow in Figure 45(a), and shows cross sections of case body 211 and case lid 221.

[0252] 46(a) shows a structure that allows the main control board 110 to be screwed to the case body 211, and FIG. 46(b) shows a structure that allows the main control board 110 to be screwed to the case lid 221. Note that in FIGS. 46(a) and (b), common parts are given the same reference numerals. In FIGS. 46(a) and (b), the bottom plate Bp (which is also the case body 211) of the board case 210 is shown installed facing the inner surface of the back plate 5e of the housing 5, and therefore the up-down, front-rear, and rear directions are indicated by the arrows in FIG. 46. Therefore, the top plate Tp of the board case 210 is the front side, and the bottom plate Bp is the rear side.

[0253] 46(a), four bosses BSL are formed on the inner surface of case body 211, aligned with the positions of four through-holes th provided in main control board 110. These bosses BSL have a cylindrical shape, and pilot holes for threading mounting screws scr are formed in the front end faces. Therefore, when storing main control board 110 in board case 210, the pilot holes formed in the four bosses BSL are aligned with the positions of the four through-holes th of main control board 110, and the main control board 110 is fastened with mounting screws scr from the component mounting surface side.

[0254] In contrast, the structure of board case 210 shown in Figure 46(b) has four bosses BSc formed on the inner surface of case lid 221, aligned with the positions of four through-holes th of main control board 110. As a result, when storing main control board 110 inside board case 210, the positions of the four through-holes th of main control board 110 are aligned with the pilot holes formed in the four bosses BSc, and main control board 110 is fastened with mounting screws scr from the solder side of main control board 110. Here, even when fastening with mounting screws scr from the solder side of main control board 110, it is desirable to provide the non-mounting area shown in Figure 45(b). This means that even if, for example, the mounting screw is not screwed in completely and the case lid 221 is attached to the case body 211 with the head of the screw floating above the board mounting surface, causing the mounting screw to bend when the case lid 221 is attached to the case body 211, it is possible to prevent the bent mounting screw from shorting out the lands formed on the solder surface of the main control board 110 or the lead wires of electronic components protruding from the solder surface, or from shorting out the lead wires of electronic components mounted next to each other.

[0255] The distance between control chip 121, setting indicator lamp 151, and information indicator lamp 156 mounted on main control board 110 and case lid 221 is wider than the overall length of the mounting screws used to screw main control board 110 to case body 211 and the longitudinal length of the bodies of the various lead components mounted on main control board 110. In this case, lead components or mounting screws that have fallen off main control board 110 for some reason will not become caught between control chip 121, setting indicator lamp 151, and information indicator lamp 156 and case lid 221. Here, in the following description, "falling off" refers to the body of a lead component being detached from the board due to, for example, the lead wire of the lead component being broken.

[0256] On the other hand, if the distance between the control chip 121, setting display lamp 151, and information display lamp 156 and the case lid 221 is narrower than the overall length of the mounting screws and the longitudinal length of the main body of the various lead components, there will be no room for lead components or mounting screws that have fallen off the main control board 110 for some reason to get between the control chip 121, setting display lamp 151, and information display lamp 156 and the case lid 221.

[0257] Although the above description has been given using main control board 110 as an example, similar mount-prohibited areas may also be provided for sub-control board 502, power supply board 550, and various other relay boards. Also, although the length of radius r of the mount-prohibited area is set to the length of the mounting screw, it may be longer than the length of the mounting screw.

[0258] <Relationship between the size of the heat dissipation holes and the size of the electronic components and mounting screws> Next, with reference to FIGS. 47 and 48, the relationship between the heat dissipation capacity of the board case and the size of the electronic components and mounting screws on the board housed in the board case will be described. The following explanation will be given using the sub-board case 501 and sub-control board 502 of the sub-controller 500 as an example. FIGS. 47(a) to 47(c) illustrate the sub-board case 501 of the sub-controller 500 when attached to the rear side of the front door 2. FIG. 47(a) is a schematic diagram showing the appearance of the sub-controller 500 and a portion of the lower left side of the sub-board case 501 as viewed from diagonally downward to the left. FIG. 47(b) is a partial cross-sectional view of the sub-board case 501 as viewed from above. In this figure, various components mounted on the sub-control board 502 are omitted. FIG. 47(c) is a partial front view of the sub-board case 501. 48(a) to 48(d) are perspective views showing the appearance of various components attached to the sub-control board 502. FIG.

[0259] FIG. 47(a) shows a part of the left side plate SpL, the bottom side plate SpD, and the top plate Tp of the sub-board case 501. A plurality of heat dissipation holes wh are provided at the corner where the bottom side plate SpD and the top plate Tp contact. The heat dissipation hole wh is a hole for discharging the heat generated in the sub-board case 501 and is a continuous long hole extending from the bottom side plate SpD to the top plate Tp. Here, the size of the heat dissipation hole wh will be described with reference to FIGS. 47(b) and (c). As shown in FIG. 47(b), the size of the heat dissipation hole wh in the bottom side plate SpD is a rectangular long hole with a width W and a length L (W < L). In this figure, the top plate Tp of the sub-board case 501 is shown in cross section. Also, as shown in FIG. 47(c), the size of the heat dissipation hole wh in the top plate Tp is a rectangular long hole with a width W and a height H (W < H), and the height H of the heat dissipation hole wh is larger than the length L of the heat dissipation hole wh in the bottom side plate SpD.

[0260] Next, with reference to FIG. 48, the size of the above-described heat dissipation hole wh, various lead components (electronic components having lead wires extending from the component body as terminals) mounted on the sub-control board, and the mounting screws will be described. FIGS. 48(a) to (c) show the shapes of the main types of lead components among the various electronic components mounted on the sub-control board 502. FIG. 48(a) shows the appearance of an axial lead component (a lead component having lead wires extending from both ends of the body) having a cylindrical body like a resistor. Dimensions representing the size of such an axial lead component having a cylindrical body are the diameter d1 and the length L1. In this embodiment, the length L1 > the diameter d1.

[0261] Figure 48(b) shows the appearance of a radial lead component (a lead component with a lead wire extending from one end of the body) with a cylindrical body, such as an electrolytic capacitor. Dimensions that represent the size of such a radial lead component with a cylindrical body include diameter d2 and height h2. In this embodiment, height h2 > diameter d2. Figure 48(c) shows the appearance of a radial lead component with a rectangular parallelepiped body (strictly speaking, a rectangular parallelepiped with rounded corners and edges), such as a ceramic capacitor. Dimensions that represent the size of such a radial lead component with a rectangular parallelepiped body include length L3, height h3, and thickness t3. In this embodiment, length L3 > height h3 > thickness t3.

[0262] 48(d) shows the appearance of the mounting screw for screwing the sub-control board 502 to the board case 501, and the dimensions that represent the size of this mounting screw include the diameter dk4 of the screw head, the total length of the screw (height of the screw head + length of the threaded portion) L4, and the nominal screw diameter da4. In this embodiment, the total length of the screw L4 > diameter dk4 of the screw head > nominal screw diameter da4.

[0263] Here, the minimum dimension of the shape of the heat dissipation hole wh (width W in this embodiment) is desirably smaller than the minimum dimensions (diameter d1, diameter d2, thickness t3) of the various lead components described above. For example, various lead components and mounting screws mounted on the sub-control board 502 may fall off the sub-control board 502 due to a combination of factors such as poor soldering of the lead components, impacts during transport of the slot machine 1, and opening and closing of the front door 2. To prevent such a situation, the width W of the heat dissipation hole wh is set smaller than the maximum dimensions of the various lead components and mounting screws. This prevents lead components that fall off the sub-control board 502 from falling out of the sub-board case 501 and adversely affecting other devices installed inside the housing 5 (e.g., the hopper 51 and the power supply 55). To prevent mounting screws that fall off the sub-control board 502 from falling out of the sub-board case 501, the minimum dimension of the shape of the heat dissipation hole wh should be smaller than the diameter dk4 of the screw head of the mounting screw.

[0264] However, it is unlikely that lead components or mounting screws that have fallen off the sub-control board 502 will remain upright on the lower plate SpD of the board case 501. Here, "upright" refers to a position in which the length L1 coincides with the vertical direction in the case of an axial lead component having a cylindrical body as shown in FIG. 48(a). Also, in the case of a radial lead component having a cylindrical body as shown in FIG. 48(b), it refers to a position in which the height h2 coincides with the vertical direction. Also, in the case of a radial lead component having a rectangular parallelepiped body as shown in FIG. 48(c), it refers to a position in which the length L3 or height h3 coincides with the vertical direction. Furthermore, in the case of a mounting screw as shown in FIG. 48(d), it refers to a position in which the overall length L4 of the screw coincides with the vertical direction.

[0265] Therefore, the minimum dimension (width W in this embodiment) of the shape of the heat dissipation hole wh may be set to a size that prevents lead components and mounting screws that have fallen off the sub-control board 502 from falling to the outside through the heat dissipation hole wh when they are in a position where they remain stably on the lower plate SpD of the board case 501.

[0266] Here, "a stable position" refers to a position in which the side of the body contacts the lower plate SpD in the case of an axial lead component having a cylindrical body as shown in FIG. 48(a). Also, in the case of a radial lead component having a cylindrical body as shown in FIG. 48(b), it refers to a position in which the side of the body contacts the lower plate SpD. Furthermore, in the case of a radial lead component having a rectangular parallelepiped body as shown in FIG. 48(c), it refers to a position in which the largest surface of the component body contacts the lower plate SpD. Furthermore, in the case of the mounting screw as shown in FIG. 48(d), it refers to a position in which the mounting screw contacts the lower plate SpD in a horizontal position.

[0267] Although the heat dissipation holes wh described above are continuous elongated holes extending from the lower plate SpD to the top plate Tp of the sub-board case 501, the present invention is not limited to this. Heat dissipation holes may be provided on only one of the lower plate SpD, top plate Tp, left side plate SpL, upper plate, and right side plate of the sub-board case 501, or on two adjacent adjacent surfaces, or on all surfaces. Furthermore, the shape of the heat dissipation holes is not limited to rectangular, but may also be circular or oval. Regardless of how the heat dissipation holes are provided in the board case 501, determining the dimensions of each heat dissipation hole as described above can prevent lead components or mounting screws that fall off the sub-control board 502 from falling out of the sub-board case 501.

[0268] Furthermore, lead components include LED elements, diodes, resistors, and various capacitors including ceramic capacitors and electrolytic capacitors, and any one or more of these lead components may be designated as "predetermined lead components," and the dimensions of the heat dissipation holes may be determined as described above taking into account the shape and dimensions of the predetermined lead components to prevent them from falling out of the sub-board case 501. Electrolytic capacitors in particular tend to become larger and heavier depending on the rated voltage and capacity, increasing the risk of them falling off the board, so it is preferable to determine the dimensions of the heat dissipation holes taking into account the dimensions and weight of such large electrolytic capacitors.

[0269] <Gap between the board and the board case> Next, with reference to Figures 47(c) and 49, the relationship between the distance between the board and the board case and the size of the electronic components and mounting screws on the board will be described. Here, Figure 49(a) is a schematic diagram of a partial cross section of the sub-board case 501 of the sub-controller 500 when viewed from the side in a state in which the board case 501 is attached to the rear side of the front door 2. In this figure, the bottom plate Btp of the sub-board case 502 (which is also the main body of the sub-board case 502) faces the rear side of the front door 2, and the top plate Tp of the sub-board case 502 (which is also part of the lid of the sub-board case 502) is oriented so as to face the inside of the housing 5. In addition, the component mounting surface of the sub-control board 502 housed in the sub-board case 502 is fastened with mounting screws (not shown) to bosses (not shown) formed on the bottom plate Btp of the sub-board case 502 while facing the inside of the housing 5. 49(b) and (c) are diagrams each showing a schematic representation of the positional relationship between the sub-substrate case 501 and the sub-control board 502 when the top plate Tp of the sub-substrate case 502 is viewed from the front with the sub-substrate case 501 of the sub-control device 500 attached to the rear side of the front door 2. In FIGS. 49(a) to (c), the same components as those shown in FIGS. 47(a) to (c) are designated by the same reference numerals, and detailed explanations will be omitted.

[0270] As mentioned above, in the case where the various lead components and mounting screws mounted on the sub-control board 502 in the sub-board case 501 fall off from the sub-control board 502, in order to prevent the fallen lead components and mounting screws from adversely affecting the various components mounted on the sub-board case 501, in this embodiment, the size of the distance dg from the lower end edg of the sub-control board 502 shown in Figure 47(c) to the inner surface Ms of the lower plate SpD is defined as follows.

[0271] The size of the above-mentioned distance dg is preferably equal to or greater than the maximum dimensions (length L1, height h2, length L3) of the various lead components shown in Figures 48(a) to 48(c). By setting the distance dg equal to or greater than the maximum dimensions of the various lead components, lead components that fall off the sub-control board 502 will not come into contact with the sub-control board 502 after falling onto the lower plate SpD. This prevents the leads of lead components that fall onto the lower plate SpD from shorting out electronic components on the sub-control board 502 to ground or shorting out the leads of adjacent electronic components. Furthermore, as shown in Figure 49(a), a space K for holding fallen lead components is formed below the sub-board case 501, so that lead components that fall off the sub-control board 502 can be safely held within the space K. To prevent a mounting screw that has fallen off the sub-control board 502 from coming into contact with the sub-control board 502 after falling onto the lower plate SpD and to form space K that can safely accommodate the dropped mounting screw, the size of the gap dg should be set to be equal to or greater than the total length L4 of the mounting screw. By setting the size of the gap dg in this way, the same advantages as those in the case of the lead component described above can be obtained.

[0272] However, as mentioned above, it is unlikely that lead components or mounting screws that have fallen off the sub-control board 502 will remain upright on the lower plate SpD of the board case 501, so the length of the gap dg may be set to a length that will prevent the lead components or mounting screws that have fallen off the sub-control board 502 from coming into contact with the lower end edg of the sub-control board 502 when they are in a position where they remain stably on the lower plate SpD of the board case 501.

[0273] The shape of the space K capable of accommodating lead components and mounting screws that have fallen off the sub-control board 502 varies depending on the shape of the sub-board case 501, but for example, as shown in Figure 49(b), a single space K extending across the entire width of the sub-board case 501 may be formed below the sub-board case 501, or multiple (two in Figure 49(b)) divided spaces K1, K2 may be formed below the sub-board case 501 across the entire width of the sub-board case 501, as shown in Figure 49(b).

[0274] (Variation) Next, a modified example of the distance dg will be described with reference to FIG. 50. Here, FIGS. 50(a) and 50(b) are both diagrams that schematically show the positional relationship between the sub-substrate case 501 and the sub-control substrate 502 when the sub-substrate case 501 of the sub-control device 500 is attached to the rear side of the front door 2 and the top plate Tp of the sub-substrate case 502 is viewed from the front. Note that in this figure, the same components as those in FIGS. 47 and 49 are given the same reference numerals, and detailed descriptions thereof will be omitted. Also shown in FIGS. 50(a) and 50(b) is the lowest component PML that is attached to the lowest side on the sub-control substrate 502. This lowest component PML is not limited to electronic components such as lead components and chip components, but may also be components such as connectors, switches, and fuses.

[0275] In the above explanation, the distance dg from the inner surface Ms of the lower plate SpD to the lower end edg of the sub-control board 502 as shown in Figure 50(a) was described, but in this modified example, the length of the distance dpml from the inner surface Ms of the lower plate SpD to the lowermost component PML shown in Figure 50(b) is set to the same length as the distance dg described above. By setting the length of the distance dpml to the same length as the distance dg in this way, it is not possible to form the space K described above below the sub-control board 502, but it is possible to prevent the leads of lead components or mounting screws that have fallen onto the lower plate SpD from shorting out electronic components on the sub-control board 502 to ground or the lead wires of adjacent electronic components from shorting out.

[0276] <Differences in characteristics depending on the mounting angle of the board case> The differences in characteristics depending on the angle at which the auxiliary board case 501 described with reference to Figures 47 to 50 is attached to the rear side of the front door 2 will be described with reference to Figures 51 and 52. Figures 51 and 52 show side views of the slot machine 1 as seen from the right side, with Figure 51 showing a state in which the auxiliary board case 501 is attached to the rear side of the front door 2 while tilting forward (towards the front door 2), and Figure 52 showing a state in which the auxiliary board case 501 is attached to the rear side of the front door 2 while tilting backward (towards the interior of the cabinet 5). In these figures, the same components as those shown in Figures 47 to 50 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0277] First, with reference to Figures 51(a) and (b), the characteristics of the case where the sub-board case 501 is attached to the rear side of the front door 2 in a forward tilted position will be described. Here, Figure 51(a) is a side view of the slot machine 1 as seen from the right side, in which the position (attachment position) in which the sub-board case 501 is attached to the rear side of the front door 2 is indicated by a dashed line. Also, Figure 51(b) is a schematic diagram of a partial cross section of the sub-board case 501 as seen from the right side in the attachment position of the sub-board case 501 shown in Figure 51(a).

[0278] As shown in FIG. 51(a), the sub-board case 501, indicated by a dashed line, is attached in a forward-leaning position relative to the rear side of the front door 2. Here, the "forward-leaning position" refers to a position in which the board case 501 is attached to the front door 2 so that the bottom plate Btp (which is also the case body of the sub-control board 502) of the sub-board case 501 faces the rear side of the front door 2, and when the front door 2 is closed, the upper part of the sub-board case 501 (more precisely, the bottom plate Btp) approaches the front door 2 and the lower part of the sub-board case 501 moves away from the front door 2 in the vertical direction VT. Also, as shown in FIG. 51(b), the solder side SMF of the sub-control board 502 faces the bottom plate Btp of the sub-board case 501 inside the sub-board case 501 and is fixed parallel to it, so that the sub-control board 502 is also in a forward-leaning position. The back side of the solder side SMF is a component mounting surface (surface portion) FS, but the various mounted components are not shown.

[0279] 51(b), when the sub-board case 501 is attached to the rear side of the front door 2 in a forward-inclined position, even if a lead part or mounting screw falls off the sub-control board 502 and onto the lower plate SpD of the sub-board case 501, the lower plate SpD is inclined downward toward the front door 2, so that the lead part or mounting screw that has fallen onto the lower plate SpD is likely to roll toward the sub-control board 502. Therefore, since the lead part or mounting screw that has fallen onto the lower plate SpD is unlikely to block the heat dissipation hole wh, there is less risk of heat being trapped inside the sub-board case 501 and adversely affecting the various electronic components mounted on the sub-control board 502.

[0280] Furthermore, even if lead components or mounting screws that fall onto the lower plate SpD roll toward the sub-control board 502, as explained with reference to Figures 49 and 50, if the distance dg from the lower end edg of the sub-control board 502 to the inner surface Ms of the lower plate SpD and the distance dpml from the inner surface Ms of the lower plate SpD to the lowest component PML are determined based on the dimensions of each of the various lead components and mounting screws, it is possible to prevent the various lead components and mounting screws that fall off the sub-control board 502 from adversely affecting the various components mounted on the sub-control board 502.

[0281] In addition, taking into consideration that lead components and mounting screws that have fallen onto the lower plate SpD may roll toward the sub-control board 502, the length of the distance dw (see FIG. 51(b)) from the component mounting surface FS of the sub-control board 502 to the heat dissipation holes wh in the lower plate SpD may be determined based on the dimensions of each of the lead components and mounting screws. For example, when determining the length of the distance dw based on the dimensions of each of the lead components, it is desirable that the distance dw be equal to or greater than the maximum dimensions (length L1, height h2, length L3) of each of the lead components shown in FIGS. 48(a) to 48(c). In this way, by setting the distance dw to be equal to or greater than the maximum dimensions of each of the lead components, even if a lead component that has fallen off the sub-control board 502 falls onto the lower plate SpD and rolls until it comes into contact with the component mounting surface FS of the sub-control board 502, the lead component that has come into contact with the component mounting surface FS can be less likely to reach the position of the heat dissipation holes wh. In other words, the possibility of the dropped lead component falling out of the sub-board case 501 through the heat dissipation holes wh can be reduced. To reduce the possibility that a mounting screw that has fallen off the sub-control board 502 will land on the lower plate SpD and then reach the position of the heat dissipation hole wh, the size of the distance dw should be set to be equal to or greater than the total length L4 of the mounting screw. By setting the size of the distance dw in this way, the same advantages as those in the case of the lead component described above can be obtained.

[0282] However, normally, when a lead component or mounting screw that has fallen off the sub-control board 502 falls onto the lower plate SpD and rolls until it comes into contact with the component mounting surface FS of the sub-control board 502, the size of the gap dw may be determined based on the dimensions of the lead component or mounting screw in a state in which the lead component that has come into contact with the component mounting surface FS is in a stable position. Here, the "stable position" is, for example, a position in which the longest part (length L1, height h2, length L3) of the dimensions of the various lead components shown in Figures 48(a) to 48(c) is in contact with the sub-control board 502. To reduce the possibility of the various lead components reaching the position of the heat dissipation hole wh in this position, if the axial type lead component shown in Figure 48(a) is assumed to have fallen off, the size of the spacing dw should be set to a diameter of d1 or greater; if the radial type lead component shown in Figure 48(b) is assumed to have fallen off, the size of the spacing dw should be set to a diameter of d2 or greater; and if the radial type lead component shown in Figure 48(c) is assumed to have fallen off, the size of the spacing dw should be set to a height of h3 or greater.

[0283] Next, with reference to Figures 52(a) and (b), the characteristics of the case where the sub-board case 501 is attached to the rear side of the front door 2 in a backward tilted position will be described. Here, Figure 52(a) is a side view of the slot machine 1 as seen from the right side, in which the position (attachment position) in which the sub-board case 501 is attached to the rear side of the front door 2 is indicated by a dashed line. Also, Figure 52(b) is a schematic diagram of a partial cross section of the sub-board case 501 as seen from the right side in the attachment position of the sub-board case 501 shown in Figure 52(a).

[0284] As shown in FIG. 52(a), the sub-board case 501, indicated by a dashed line, is attached in a forward-leaning position relative to the rear side of the front door 2. Here, the "backward-leaning position" refers to a position in which the board case 501 is attached to the front door 2 so that the bottom plate Btp (which is also the case body of the sub-control board 502) of the sub-board case 501 faces the rear side of the front door 2, and when the front door 2 is closed, the upper part of the sub-board case 501 (more precisely, the bottom plate Btp) is away from the front door 2 and the lower part of the sub-board case 501 is close to the front door 2 in the vertical direction VT. Furthermore, inside the sub-board case 501, the sub-control board 502 is fixed parallel to the bottom plate Btp of the sub-board case 501, and therefore the sub-control board 502 is also in a backward-leaning position. The back side of the solder surface SMF is the component mounting surface (surface portion) FS, but the various mounted components are not shown in the figure.

[0285] 52(b), when the sub-board case 501 is attached to the rear side of the front door 2 in a backward tilted position, even if a lead part or mounting screw falls off the sub-control board 502 and onto the lower plate SpD of the sub-board case 501, the lead part or mounting screw that falls onto the lower plate SpD is likely to roll towards the heat dissipation hole wh because the lower plate SpD is tilted downward toward the inside of the housing 5. Therefore, the lead part or mounting screw that falls onto the lower plate SpD is less likely to roll towards the sub-control board 502, and therefore it is possible to reduce the risk that the lead part or mounting screw that falls off the sub-control board 502 will adversely affect the various components mounted on the sub-control board 502.

[0286] Furthermore, even if the lead parts or mounting screws that have fallen onto the lower plate SpD roll toward the sub-control board 502, as explained with reference to Figure 47, by appropriately determining the dimensions of the width W, length L and height H of the heat dissipation hole wh, it is possible to prevent the lead parts that have fallen off the sub-control board 502 from falling outside the sub-board case 501 and adversely affecting other devices installed inside the housing 5 (for example, the hopper 51 or the power supply unit 55).

[0287] In the above explanation with reference to Figures 47 to 52, the sub-board case and sub-control board 502 have been given as examples, but the same may also be applied to the main control board 110 and power supply board 550, as well as various other relay boards and the cases for those boards.

[0288] In the above-described embodiments, a slot machine (reel-type gaming machine) that uses gaming medals as gaming value has been described as an example of a gaming machine to which the present invention is applied, but the present invention is not limited to this, and can be similarly applied to, for example, pachinko gaming machines that use gaming balls as gaming value, reel-type gaming machines that use gaming balls as gaming value, reel-type gaming machines and pachinko gaming machines that use information recorded on an electronic recording medium as gaming value, mahjong ball gaming machines, arrange ball machines, etc. The present invention can also be similarly applied to slot machines with four or more reels, and can be similarly effective.

[0289] <Operating voltage and temperature ranges for the control chip and main board IC> As explained with reference to Figure 13, the main control board 110 is mounted with a control chip 121 and a main board IC 133. As mentioned above, the main board IC 133 includes a driver IC that shapes the waveforms of on / off signals input from outside for various switches, and the operating voltage ranges and operating temperature ranges of this driver IC and control chip 121 are as shown in Figure 53(a). Here, the operating voltage range refers to the range of power supply voltages (more precisely, voltages supplied to the driver IC and control chip 121) within which the driver IC and control chip 121 can each stably operate. The operating temperature range refers to the range of ambient temperatures within which the driver IC and control chip 121 can each stably operate.

[0290] (Operating voltage range of control chip and main board IC) As shown in Figure 53(a), the operating voltage range of the control chip 121 is 3.0V to 4.5V, and the operating voltage range of the driver IC is 1V to 5V. The waveforms of the on / off signals of the various switches are as shown in Figures 53(b-1) and (b-2). Figure 53(b-1) shows that the off state ("0") of the switch is represented by a high-level voltage V H and the on state ("1") is represented by a low-level voltage V L 53(b-2) shows the waveform of the on / off signal when the switch is in the off state ("0"), represented by a low-level voltage V L and the on state ("1") is represented by a high-level voltage V H 1 shows the waveform of an on / off signal when the on / off signal is expressed as follows (i.e., active high). In this embodiment, the on / off signals are active low, but some or all of them may be made active high as appropriate.

[0291] As shown in Figure 53(b-1), when the on / off state of the switch is expressed as active low, a high-level voltage V is applied to the driver IC when the switch is off. H is input. This voltage V H is set to a voltage value higher than the lower limit and lower than the upper limit of the operating voltage range of the driver IC, regardless of whether it is the BET switch unit 23, the start lever 25, the stop switches 26a, 26b, 26c, the settlement switch 28 (a counting switch in a so-called smart gaming machine), or the setting key switch and setting change switch provided in the setting change device 350 (in the case of the stop switches 26a, 26b, 26c, in any of the first stop operation to the third stop operation). Also, as shown in Figure 53 (b-2), when the on / off state of the switch is expressed by active high, a high-level voltage V is applied to the driver IC when the switch is on. H is input. This voltage V His set to a voltage value higher than the lower limit and lower than the upper limit of the operating voltage range of the driver IC for any of the switches, namely, the BET switch unit 23, the start lever 25, the stop switches 26a, 26b, 26c, the adjustment switch 28, and the setting key switches and setting change switches provided on the setting change device 350 (for the stop switches 26a, 26b, 26c, in any of the first to third stop operations). H does not exceed the operating voltage range of the driver IC, the driver IC can reliably input high-level voltages for the on / off signals of various switches and shape their waveforms.

[0292] The on / off signals of the various switches shaped by the driver IC are ultimately input to an I / O port of the control chip 121. The control chip 121 reads the on / off signals of the various switches input to the I / O port during timer interrupt processing and performs game control processing based on the read on / off signals. The control chip 121 repeatedly executes the timer interrupt processing described above at predetermined time intervals during execution of the game control program. In this embodiment, the timer interrupt processing is executed every 1.49 milliseconds. Therefore, one interrupt time is 1.49 milliseconds. In addition to input port processing for reading the on / off signals of the various switches input to the I / O port, this timer interrupt processing also executes power-off processing when the power supply voltage supplied to the slot machine 1 is cut off, timer measurement processing for timing a set time, rotation control processing for the three stepping motors 680 (see FIG. 35) provided corresponding to each reel 3a, 3b, and 3c, and control command transmission processing for transmitting control commands to the sub-control board 502.

[0293] Here, when the on / off signals of various switches shaped by the driver IC change from off to on, it is desirable that the time required for the change be less than one interrupt time (1.49 milliseconds) as mentioned above. For example, as shown in Figure 53(b-1), if the on / off state of a switch is expressed as active low, when the switch changes from off to on, the voltage level of the on / off signal becomes voltage V H to voltage V L At this time, the control chip 121 drops to the voltage V ONL If the switch is considered to be on when the voltage level of the on / off signal is V H to voltage V ONL It is desirable that the time Δt required for the voltage to fall to 0 V is less than one interrupt time (1.49 milliseconds). In FIG. 53(b-1), the voltage V ONL is the voltage V that indicates the switch is in the on / off state L Although it is higher than the voltage V ONL and voltage V L may have the same voltage value as

[0294] Also, as shown in Figure 53(b-2), if the on / off state of the switch is expressed as active high, when the switch changes from off to on, the voltage level of the on / off signal becomes voltage V L to voltage V H At this time, the control chip 121 rises to the voltage V ONH If the switch is considered to be on when the voltage level of the on / off signal is V L to voltage V ONH It is desirable that the time Δt required for the voltage to rise to 1 is less than one interrupt time (1.49 milliseconds). In FIG. 53(b-2), the voltage V ONH is the voltage V that indicates the switch is in the on / off state H Although it is lower than the voltage V ONH and voltage V H may have the same voltage value as

[0295] The power-off process executed in the timer interrupt process described above is executed when the power supply voltage supplied to the slot machine 1 is cut off. Whether the power supply voltage has been cut off is determined by a power supply voltage monitoring circuit mounted on the main control board 110. The main control board 110 is supplied with an 11V power supply voltage from the power supply device 55, and the power supply voltage monitoring circuit monitors fluctuations in the 11V power supply voltage. When the 11V power supply voltage drops to 6V, the power supply voltage monitoring circuit outputs a power-off signal, the waveform of which is shaped by the driver CI and output to the control chip 121. The voltage value of the power-off signal is low (e.g., 0.2V) when the 11V power supply voltage exceeds 6V (power normal; logic "0"), but rises to high (e.g., 4V) when the 11V power supply voltage drops to 6V (power cut off; logic "1").

[0296] The control chip 121 performs power-off processing when the voltage value of the power-off signal output from the power supply voltage monitoring circuit changes from low to high. The power-off processing involves saving registers, saving stack pointers, saving interrupt states, etc. In addition, the control chip 121 also performs processing such as retaining information about the winning combination results and game state stored in a specified memory area, stopping the stepping motor 680, calculating a checksum, and storing the calculation results.

[0297] Here, the voltage value (11V) of the power supply voltage monitored by the power supply voltage monitoring circuit is higher than the voltage value (4V) when the power interruption signal indicates "1," and the voltage value (6V) of the power supply voltage at which the power supply voltage monitoring circuit outputs the power interruption signal "1" (power interruption) is higher than the upper limit (5V) of the operating voltage range of the driver IC. Also, as mentioned above, the lower limit (1V) of the operating voltage range of the driver IC is lower than the lower limit (3.0V) of the operating voltage range of the control chip 121. Furthermore, the upper limit (5V) of the operating voltage range of the driver IC is higher than the upper limit (4.5V) of the operating voltage range of the control chip 121.

[0298] In this way, even if the power supply voltage monitoring circuit determines that the power supply has been cut off (the voltage supplied to the main control board 110 drops to 6V) and the power cutoff signal becomes "1" (power cutoff), the voltage supplied to the driver IC exceeds the upper limit (5V) of the driver IC's operating voltage range, so the driver IC can operate without hindrance. Also, because the operating voltage range of the driver IC is wider than the operating voltage range of the control chip 121, the control chip 121 can execute power cutoff processing without hindrance even if the power cutoff signal becomes "1" (power cutoff).

[0299] (Operating temperature range of control chip and main board IC) Returning to FIG. 53(a), the operating temperature ranges are −45°C to 85°C for the driver IC and 0°C to 83°C for the control chip 121. When the main control board 110 is housed in the main board case 210, the main board case 210 is attached to the cabinet 5, and the slot machine 1 is installed in an arcade. The temperature range inside the main board case 210 is 40°C to 50°C when the slot machine 1 is in operation (see the “Ambient temperature range during operation” column in FIG. 53(a)). The surface temperature of the package of the control chip 121 is within the range of 45°C to 50°C from the time when all the reels start to rotate until a notification is issued that the stop switch operation is acceptable. Therefore, the lower limit of the operating temperature range of the driver IC (−45°C) is lower than the lower limit of the ambient temperature range during operation (40°C), and the upper limit of the operating temperature range of the driver IC (85°C) is higher than the upper limit of the ambient temperature range during operation (50°C). In addition, the lower limit (-45°C) of the operating temperature range of the driver IC is lower than the lower limit (0°C) of the operating temperature range of the control chip 121. Furthermore, the upper limit (85°C) of the operating temperature range of the driver IC is almost the same as the upper limit (83°C) of the operating temperature range of the control chip 121, but the difference is no more than 5°C.

[0300] In this way, the operating temperature range of the control chip 121 (0°C to 83°C) is a temperature range that includes the ambient temperature range during operation (40°C to 50°C) and the surface temperature (45°C to 50°C) of the package of the control chip 121 when the reels have rotated and the stop switch is ready to be operated, so that the control chip 121 can operate stably while the slot machine 1 is in operation. Also, the operating temperature range of the driver IC (-40°C to 85°C) includes the operating temperature range of the control chip 121 (0°C to 83°C), so that it is possible to avoid a situation where the driver IC cannot operate stably in an environment where the control chip 121 operates stably.

[0301] <Stepping motor rotation control using a control chip>...

Claims

[Claim 1] A main control board that controls games; a signal receiving integrated circuit mounted on the main control board for shaping an input waveform; A game control integrated circuit mounted on the main control board and storing a control program for controlling a game; a power supply voltage monitoring circuit for monitoring the power supply voltage supplied to the main control board; Multiple reels with multiple symbols on them, a liquid crystal display device provided closer to the player than the plurality of reels and having a display area capable of displaying images; the display area has a symbol visible area in which symbols of the plurality of reels can be visually recognized, the light transmittance of the pattern visible area at a first timing in a state where power is not supplied to the liquid crystal display device is a first light transmittance; the symbols on the reels through the symbol visible area are more difficult to see at a specific timing after the supply of power to the gaming machine is stopped while the reels are rotating and before the reels have completely stopped, than the symbols on the reels through the symbol visible area when no abnormality has occurred and the reels can be stopped while rotating, When a rotation start operation is received in a state where a predetermined condition is satisfied even if the light transmittance of the symbol visible area is the first light transmittance, the plurality of reels are rotated; the signal receiving integrated circuit operates stably when a power supply voltage supplied to the signal receiving integrated circuit is within a range from a first voltage value to a second voltage value; the game control integrated circuit operates stably when the power supply voltage supplied to the game control integrated circuit is within a range from a third voltage value to a fourth voltage value; When the voltage value input to the game control integrated circuit is a fifth voltage value, the input value is represented as 0; When the voltage value input to the game control integrated circuit is a sixth voltage value, the input value is represented as 1; When the power supply voltage supplied to the power supply voltage monitoring circuit drops from a seventh voltage value to an eighth voltage value, the power supply voltage monitoring circuit outputs a power interruption signal to the game control integrated circuit; the first voltage value is lower than the sixth voltage value, and the second voltage value is higher than the sixth voltage value; A gaming machine characterized in that the seventh voltage value is higher than the sixth voltage value, and the eighth voltage value is higher than the second voltage value.

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