Processing apparatus and processing method

Abstract

To provide a processing device improved in convenience.MEANS: A processing device comprises: a first stage system which has a table (12) on which a work-piece (W) is placed and which moves the work-piece held on the table; a beam irradiation system (500) including a light collection optical system (530) that emits a beam LB; and a control device that controls the first stage system and the irradiation system. The control device controls the table and the irradiation system so that predetermined processing is applied to a target site of the work-piece while relatively moving the table and a beam from the light collection optical system, where at least either of a strength distribution of beams on a first surface (MP) at an emitting surface side of the light collection optical system and a strength distribution of beams on a second surface which is different in terms of a position in a direction of an optical axis (AX) of the light collection optical system from the first surface can be changed.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus and a processing method, and more particularly to a processing apparatus and a processing method for processing a workpiece by irradiating it with a beam. [Background technology]

[0002] In the field of machine tools, there is a strong desire for improvements in the convenience and performance of processing devices that use laser light or the like (see, for example, Patent Document 1) as machine tools. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] U.S. Patent Application Publication No. 2002 / 0017509 [Overview of the project]

[0004] According to a first aspect of the present invention, a processing apparatus for processing a workpiece by irradiating it with a beam is provided, comprising: a first holding system having a first holding member on which the workpiece is placed and which moves the workpiece held by the first holding member; a beam irradiation system including a focusing optical system for emitting the beam; and a control device for controlling the first holding system and the irradiation system, wherein the control device controls the first holding system and the irradiation system so that predetermined processing is performed on a target portion of the workpiece while relatively moving the first holding member and the beam from the focusing optical system, and the processing apparatus is provided in which at least one of the intensity distribution of the beam on a first surface on the emission surface side of the focusing optical system and the intensity distribution of the beam on a second surface where the position in the optical axis direction of the focusing optical system is different from that of the first surface can be changed.

[0005] Here, the first surface may be a virtual surface on which the target part of the workpiece should be aligned during machining. This predetermined surface may be, for example, a surface perpendicular to the optical axis of the focusing optical system. This predetermined surface may be the image plane of the focusing optical system or a surface near it, or the back focal plane or a surface near it.

[0006] According to a second aspect of the present invention, a processing apparatus for processing a workpiece by irradiating it with a beam is provided, comprising: a first holding system having a first holding member on which the workpiece is placed and which moves the workpiece held by the first holding member; a beam irradiation system including a focusing optical system for emitting the beam; and a control device for controlling the first holding system and the irradiation system, wherein the control device controls the first holding system and the irradiation system so that predetermined processing is performed on a target portion of the workpiece while relatively moving the beam irradiated from the focusing optical system to a first surface and the first holding member, and the beam irradiation system has an optical device capable of changing the cross-sectional intensity distribution of the beam emitted from the focusing optical system at the pupil plane of the focusing optical system.

[0007] According to a third aspect of the present invention, a processing apparatus is provided for processing a workpiece by irradiating it with a beam, comprising: a first holding system having a first holding member on which the workpiece is placed, and for moving the workpiece held by the first holding member; a beam irradiation system including a focusing optical system for emitting the beam; and a control device for controlling the first holding system and the irradiation system, wherein the control device controls the first holding system and the irradiation system so that predetermined processing is performed on a target portion of the workpiece while relatively moving the beam irradiated from the focusing optical system to a first surface and the first holding member, and the intensity distribution in the cross-section of the beam emitted from the focusing optical system is rotationally symmetric.

[0008] A fourth aspect of the present invention provides a processing method for processing a workpiece by irradiating it with a beam, comprising: holding the workpiece in a first holding member; and controlling the movement of the first holding member and the beam irradiation operation from the beam irradiation unit so that a predetermined processing is performed on a target portion of the workpiece while relatively moving the beam emitted from a beam irradiation unit including a focusing optical system and the first holding member holding the workpiece, wherein, during the processing, at least one of the beam intensity distribution on a first surface on the emission surface side of the focusing optical system and the beam intensity distribution on a second surface where the optical axis position of the focusing optical system is different from that of the first surface is provided.

[0009] A fifth aspect of the present invention provides a processing method for processing a workpiece by irradiating it with a beam, comprising: holding the workpiece in a first holding member; and controlling the movement of the first holding member and the beam irradiation operation from the beam irradiation unit so that predetermined processing is performed on a target portion of the workpiece while relatively moving the beam irradiated from a beam irradiation unit including a focusing optical system to a first surface and the first holding member holding the workpiece, wherein the processing method changes the intensity distribution of the beam emitted from the focusing optical system at the pupil plane of the focusing optical system during the processing.

[0010] According to a sixth aspect of the present invention, a processing method is provided for processing a workpiece by irradiating it with a beam, the method comprising: holding the workpiece in a first holding member; and controlling the movement of the first holding member and the beam irradiation operation from the beam irradiation unit so that predetermined processing is performed on a target portion of the workpiece while relatively moving the beam irradiated from a beam irradiation unit including a focusing optical system to a first surface and the first holding member holding the workpiece, wherein the intensity distribution in the cross-section of the beam emitted from the focusing optical system is rotationally symmetric. [Brief explanation of the drawing]

[0011] [Figure 1] This is a block diagram showing the overall configuration of a processing apparatus according to one embodiment. [Figure 2]FIG. is a diagram schematically showing the configuration of the first stage system together with the measurement system. [Figure 3] FIG. is a perspective view showing the first stage system on which the workpiece is mounted. [Figure 4] FIG. shows the beam irradiation system together with the mask stage provided with the mask and the table on which the workpiece is mounted. [Figure 5] FIG. is a plan view of the mask. [Figure 6] FIG. is a diagram showing an example of the configuration of the light source system included in the beam irradiation system. [Figure 7] FIG. shows a state in which a parallel beam from the light source system is irradiated onto the second mirror array, and reflected beams from each of the plurality of mirror elements are incident on the first partial illumination optical system. [Figure 8] FIG. shows a state in which a parallel beam from the first partial illumination optical system is irradiated onto the first mirror array, and reflected beams from each of the plurality of mirror elements are incident on the condenser optical system. [Figure 9] FIG. 9(A) is a diagram showing an enlarged view of the vicinity of the target surface of the workpiece when the beam is irradiated onto the target portion of the workpiece from the condenser optical system to form a slit-shaped irradiation region, and FIG. 9(B) is a diagram showing the relationship between the slit-shaped irradiation region shown in FIG. 9(A) and the scan direction. [Figure 10] FIG. 10(A) is an explanatory diagram of an example of a processing mode that can be set in the processing apparatus according to the present embodiment, FIG. 10(B) is a diagram for explaining processing using the optical cutting tools of mode 1, mode 2, mode 3, and mode 4, and FIG. 10(C) is a diagram for explaining processing using the optical cutting tools of mode 5 and mode 6. [Figure 11] FIG. is a diagram showing the arrangement of the measuring device on the table. [Figure 12] FIG. shows the components arranged inside the table that constitute the measuring device together with the measuring member. [Figure 13] FIG. 13(A) is a diagram showing the optical arrangement when measuring the intensity distribution of the beam on the image plane of the condenser optical system, and FIG. 13(B) is a diagram showing the optical arrangement when measuring the intensity distribution of the beam on the pupil plane. [Figure 14] This is a block diagram showing the input / output relationships of the control device, which forms the core of the control system for a processing machine. [Figure 15] This is a flowchart corresponding to a series of processing algorithms for a control device. [Figure 16] A flowchart showing an example of the subroutine in step S10 of Figure 6. [Figure 17] This diagram illustrates the various processes that can be performed by the processing equipment, in correspondence with the conventional machine tools used to perform each process. [Figure 18] This figure shows an example of a measuring device for measuring the beam intensity distribution on a processed surface. [Modes for carrying out the invention]

[0012] Hereinafter, one embodiment will be described with reference to Figures 1 to 18. Figure 1 shows the overall configuration of the processing apparatus 100 according to one embodiment in a block diagram.

[0013] The processing device 100 is a device that irradiates a workpiece (also called a workpiece) with a beam (usually a laser beam) to perform various processing operations, including material removal (equivalent to cutting, grinding, etc., which are performed as machining operations).

[0014] The processing apparatus 100 comprises four systems: a first stage system 200A, a second stage system 200B, a transport system 300, a measurement system 400, and a beam irradiation system 500, as well as a control device 600 that controls the entire processing apparatus 100, including these systems. Of these, the transport system 300, the measurement system 400, and the beam irradiation system 500 are arranged apart from each other in a predetermined direction. For convenience, in the following description, the transport system 300, the measurement system 400, and the beam irradiation system 500 will be assumed to be arranged apart from each other in the X-axis direction (see Figure 2), as will be described later.

[0015] Figure 2 schematically shows the configuration of the first stage system 200A together with the measurement system 400. Figure 3 shows the first stage system 200A with the workpiece W mounted on it in a perspective view. In the following explanation, the left-right direction within the plane of Figure 2 will be referred to as the Y-axis direction, the direction perpendicular to the plane of the paper as the X-axis direction, and the direction perpendicular to the X and Y axes as the Z-axis direction. The rotation (tilting) directions around the X, Y, and Z axes will be referred to as the θx, θy, and θz directions, respectively.

[0016] The first stage system 200A changes the position and orientation of the workpiece W. Specifically, the position of the workpiece W in the six degrees of freedom directions is changed by moving the table on which the workpiece W is mounted (described later) in the six degrees of freedom directions (X-axis, Y-axis, Z-axis, θx, θy, and θz directions). In this specification, the positions in the three degrees of freedom directions (θx, θy, and θz) of the table or workpiece are collectively referred to as "orientation," and the positions in the remaining three degrees of freedom directions (X-axis, Y-axis, and Z-axis directions) are collectively referred to as "position."

[0017] The first stage system 200A is equipped with a Stewart platform-type 6-degree-of-freedom parallel link mechanism as an example of a drive mechanism for changing the position and orientation of the table. However, the first stage system 200A is not limited to a mechanism that can drive the table in 6 degrees of freedom directions, nor is it limited to a parallel link mechanism.

[0018] The first stage system 200A (excluding the stator of the planar motor described later) is positioned on a base BS installed on the floor F so that its upper surface is approximately parallel to the XY plane, as shown in Figure 2. The first stage system 200A, as shown in Figure 3, has a slider 10 which is a regular hexagon in plan view and constitutes the base platform, a table 12 which constitutes the end effector, six extendable rods (links) 141 to 146 which connect the slider 10 and the table 12, and extension mechanisms 161 to 166 (not shown in Figure 3, see Figure 14) provided on each of the rods 141 to 146 to extend and retract each rod. The first stage system 200A has a structure that allows the movement of the table 12 to be controlled in three-dimensional space with 6 degrees of freedom by independently adjusting the length of each of the rods 141 to 146 with the extension mechanisms 161 to 166. The first stage system 200A is equipped with a Stewart platform type 6-degree-of-freedom parallel link mechanism as the drive mechanism for table 12, and therefore has features such as high precision, high rigidity, large support capacity, and ease of inverse kinematics calculation.

[0019] In the processing apparatus 100 according to this embodiment, the position and orientation of the workpiece W (table 12) are controlled by the beam irradiation system 500, more specifically by the beam from the illumination optical system described later, in order to perform the desired processing on the workpiece during processing. In principle, the opposite is also possible: the beam from the illumination optical system may be movable, or both the beam and the workpiece (table) may be movable. As the beam irradiation system 500 has a complex configuration as described later, it is simpler to move the workpiece.

[0020] Table 12, in this case, consists of a plate member shaped like an equilateral triangle with each vertex cut off. The workpiece W to be processed is mounted on the top surface of Table 12. Table 12 is provided with a chuck mechanism 13 (not shown in Figure 3, see Figures 4 and 14) for fixing the workpiece W. For example, a mechanical chuck or a vacuum chuck can be used as the chuck mechanism 13. Table 12 is also provided with a measuring device 110 (see Figures 11 and 12), which includes a measuring member 92 that is circular in plan view as shown in Figure 3. The measuring device 110 will be described in detail later. Note that Table 12 is not limited to the shape shown in Figure 3, but can be any shape, such as a rectangular plate or a disc.

[0021] In this case, as is clear from Figure 3, each of the rods 141 to 146 is connected to the slider 10 and the table 12, respectively, at both ends via the universal joint 18. Furthermore, rods 141 and 142 are connected near the location of one vertex of the triangle formed by the table 12, so that the slider 10 and these rods 141 and 142 form a roughly triangular structure. Similarly, rods 143, 144, and rods 145 and 146 are connected near the locations of the remaining vertices of the triangle formed by the table 12, so that the slider 10 and rods 143, 144, and rods 145 and 146 form a roughly triangular structure, respectively.

[0022] Each of these rods 141 to 146 has a first axial member 20 and a second axial member 22 that are relatively movable in their respective axial directions, as is typically shown for rod 141 in Figure 3. One end (lower end) of the first axial member 20 is attached to the slider 10 via a universal joint 18, and the other end (upper end) of the second axial member 22 is attached to the table 12 via a universal joint.

[0023] A stepped cylindrical hollow section is formed inside the first shaft member 20, and a bellows-type air cylinder, for example, is housed at the lower end of this hollow section. A pneumatic circuit and a pneumatic source (neither of which are shown) are connected to this air cylinder. By controlling the air pressure of the compressed air supplied from the pneumatic source via the pneumatic circuit, the internal pressure of the air cylinder is controlled, causing the piston of the air cylinder to reciprocate in the axial direction. In the air cylinder, the return stroke utilizes gravity acting on the piston when it is incorporated into a parallel link mechanism.

[0024] Furthermore, an armature unit (not shown) consisting of multiple armature coils arranged in a axial direction is positioned at the upper end of the hollow portion of the first shaft member 20.

[0025] On the other hand, one end (lower end) of the second shaft member 22 is inserted into the hollow portion of the first shaft member 20. A small-diameter portion is formed at one end of the second shaft member 22, which has a smaller diameter than the rest of the part, and a cylindrical movable element yoke made of a magnetic material is provided around this small-diameter portion. A hollow cylindrical magnet body, i.e., a cylindrical magnet body made of multiple permanent magnets of the same dimensions, is provided on the outer circumference of the movable element yoke. In this case, the movable element yoke and the magnet body constitute a hollow cylindrical magnet unit. In this embodiment, a shaft motor, which is a type of electromagnetic linear motor, is configured by the armature unit and the magnet unit. In the shaft motor configured in this way, by supplying a sinusoidal drive current of a predetermined period and amplitude to each coil of the armature unit, which is the stator, the second shaft member 22 is driven axially relative to the first shaft member 20 by the Lorentz force (driving force) generated by the electromagnetic interaction, which is a type of electromagnetic interaction between the magnet unit and the armature unit.

[0026] In other words, in this embodiment, the aforementioned telescopic mechanisms 161 to 166 (see Figure 14) are configured to extend and retract the rods 141 to 146, respectively, by driving the first shaft member 20 and the second shaft member 22 relative to each other in the axial direction using the air cylinder and shaft motor described above.

[0027] Furthermore, the magnet unit, which is the movable element of the shaft motor, is supported non-contact with the armature unit, which is the stator, via an air pad provided on the inner circumferential surface of the first shaft member 20.

[0028] Although not shown in Figure 3, each of the rods 141 to 146 is provided with an absolute-type linear encoder 241 to 246 that detects the axial position of the second shaft member 22 relative to the first shaft member 20, and the outputs of the linear encoders 241 to 246 are supplied to the control device 600 (see Figure 14). The axial position of the second shaft member 22 detected by the linear encoders 241 to 246 corresponds to the respective lengths of the rods 141 to 146.

[0029] Based on the outputs of linear encoders 241 to 246, the telescopic mechanisms 161 to 166 are controlled by the control device 600 (see Figure 14). Details of the configuration of the parallel link mechanism, similar to that of the first stage system 200A in this embodiment, are disclosed, for example, in U.S. Patent No. 6,940,582, and the control device 600 controls the position and orientation of the table 12 via the telescopic mechanisms 161 to 166 using inverse kinematic calculations in a manner similar to that disclosed in the above U.S. Patent.

[0030] In the first stage system 200A, the telescopic mechanisms 161 to 166 provided on rods 141 to 146 each have air cylinders and shaft motors, which are a type of electromagnetic linear motor, arranged in series (or parallel) with each other. Therefore, the control device 600 can move the table 12 roughly and over a large area by pneumatic control of the air cylinders, and finely by the shaft motors. As a result, it becomes possible to control the position (i.e., position and orientation) of the table 12 in all six degrees of freedom directions accurately in a short amount of time.

[0031] Furthermore, since each of the rods 141 to 146 has an air pad that non-contactively supports the magnet unit, which is the movable element of the shaft motor, with respect to the armature unit, which is the stator, friction, which is a nonlinear component when controlling the extension and retraction of the rods by the telescopic mechanism, can be avoided, thereby enabling more precise control of the position and orientation of the table 12.

[0032] Furthermore, in this embodiment, a shaft motor is used as the electromagnetic linear motor constituting the telescopic mechanism 161-166. In this shaft motor, a magnetic unit with a cylindrical magnet on the movable element side is used, so magnetic flux (magnetic field) is generated in all directions of the radial direction of the magnet, and this magnetic flux in all directions can be used to generate a Lorentz force (driving force) due to electromagnetic interaction. This allows for the generation of a significantly larger thrust compared to, for example, a conventional linear motor, and is easier to miniaturize compared to hydraulic cylinders, etc.

[0033] Therefore, the first-stage system 200A, in which each rod includes a shaft motor, can simultaneously achieve miniaturization, weight reduction, and improved output, making it suitable for application to the processing apparatus 100.

[0034] Furthermore, the control device 600 can suppress low-frequency vibrations by controlling the air pressure of the air cylinders that constitute each of the telescopic mechanisms, and isolate high-frequency vibrations by controlling the current to the shaft motor.

[0035] The first stage system 200A further includes a planar motor 26 (see Figure 14). A movable element of the planar motor 26, consisting of a magnet unit (or coil unit), is provided on the bottom surface of the slider 10, and correspondingly, a stator of the planar motor 26, consisting of a coil unit (or magnet unit), is housed inside the base BS. Multiple air bearings (hydrostatic air bearings) are provided on the bottom surface of the slider 10, surrounding the movable element, and the slider 10 is suspended and supported by these multiple air bearings on the upper surface (guide surface) of the base BS, which is finished to a high degree of flatness, with a predetermined clearance (gap or gap). The slider 10 is driven in the XY plane without contact with the upper surface of the base BS by the electromagnetic force (Lorentz force) generated by the electromagnetic interaction between the stator and movable element of the planar motor 26. In this embodiment, as shown in Figure 1, the first stage system 200A allows the table 12 to move freely between the positions of the measurement system 400, the beam irradiation system 500, and the transport system 300. The first stage system 200A may also have multiple tables 12, each holding a workpiece W. For example, while processing is being performed on a workpiece held on one of the tables using the beam irradiation system 500, measurement may be performed on a workpiece held on another table using the measurement system 400. In this case as well, each table can move freely between the positions of the measurement system 400, the beam irradiation system 500, and the transport system 300. Alternatively, if a configuration is adopted in which a table is provided that holds a workpiece exclusively when measuring using the measurement system 400, and another table that holds a workpiece exclusively when processing using the beam irradiation system 500, and workpieces can be loaded and unloaded from these two tables by a workpiece transport system, then each slider 10 may be fixed on the base BS. Even when multiple tables 12 are provided, each table 12 is movable in six degrees of freedom directions, and its position in those six degrees of freedom directions can be controlled.

[0036] Furthermore, the planar motor 26 is not limited to an air levitation type; a magnetic levitation type planar motor may also be used. In the latter case, it is not necessary to provide an air bearing in the slider 10. In addition, either a moving magnet type or a moving coil type planar motor 26 can be used.

[0037] The control device 600 controls at least one of the magnitude and direction of the current supplied to each coil of the coil unit constituting the planar motor 26, thereby allowing the slider 10 to move freely in the X and Y two-dimensional directions on the base BS.

[0038] In this embodiment, the first stage system 200A includes a position measurement system 28 (see Figure 14) that measures positional information of the slider 10 in the X-axis and Y-axis directions. A two-dimensional absolute encoder can be used as the position measurement system 28. Specifically, a two-dimensional scale having a strip-shaped absolute code of a predetermined width extending along the entire length in the X-axis direction is provided on the upper surface of the base BS, and correspondingly, an X-head and a Y-head are provided on the bottom surface of the slider 10, each consisting of a light source such as a light-emitting element and a one-dimensional photodetector array arranged in the X-axis direction and a one-dimensional photodetector array arranged in the Y-axis direction, respectively, which receive reflected light from the two-dimensional scale illuminated by the light beam emitted from the light source. As the two-dimensional scale, for example, one is used in which a plurality of square reflective parts (marks) are arranged in two dimensions at a constant period along two mutually orthogonal directions (X-axis direction and Y-axis direction) on a non-reflective substrate (reflectance 0%), and the reflective characteristics (reflectance) of the reflective parts have gradations according to a predetermined rule. As a two-dimensional absolute encoder, for example, a configuration similar to the two-dimensional absolute encoder disclosed in U.S. Patent Application Publication No. 2014 / 0070073 may be adopted. An absolute two-dimensional encoder with a configuration similar to that of U.S. Patent Application Publication No. 2014 / 0070073 enables measurement of two-dimensional position information with the same high accuracy as a conventional incremental encoder. Because it is an absolute encoder, unlike an incremental encoder, origin detection is not required. The measurement information from the position measurement system 28 is sent to the control device 600.

[0039] In this embodiment, as will be described later, the measurement system 400 measures positional information (shape information in this embodiment) in three-dimensional space of at least a portion of the target surface (e.g., the top surface) on the workpiece W mounted on the table 12, and machining is performed on the workpiece W after the measurement. Here, the target surface means the surface on which the target part for machining is provided. Therefore, when the control device 600 measures the shape information of at least a portion of the target surface on the workpiece W, it associates the measurement result with the measurement results of the linear encoders 241 to 246 provided on the rods 141 to 146 and the measurement results of the position measurement system 28 at the time of measurement, thereby relating the position and orientation of the target part provided on the target surface on the workpiece W mounted on the table 12 to the reference coordinate system of the machining apparatus 100 (hereinafter referred to as the table coordinate system). As a result, thereafter, position control of the target part (target surface) on the workpiece W with respect to the target value in the six degrees of freedom directions is possible by open-loop control of the position of the table 12 in the six degrees of freedom directions based on the measurement results of the linear encoders 241 to 246 and the position measurement system 28. In this embodiment, absolute type encoders are used as linear encoders 241-246 and position measurement system 28, so resetting is easy as there is no need to set the origin. The aforementioned position information in three-dimensional space to be measured by the measurement system 400, which is used to enable position control in the six degrees of freedom directions with respect to the target value of the target part of the workpiece W by open-loop control of the position in the six degrees of freedom directions of the table 12, is not limited to shape, but is sufficient if it is three-dimensional position information of at least three points corresponding to the shape of the target surface.

[0040] In this embodiment, the case in which a planar motor 26 is used as the drive device for moving the slider 10 in the XY plane has been described, but a linear motor may be used instead of the planar motor 26. In this case, instead of the two-dimensional absolute encoder described above, a position measurement system that measures the position information of the slider 10 may be configured using an absolute type linear encoder. Furthermore, the position measurement system that measures the position information of the slider 10 may be configured using an interferometer system, not limited to an encoder.

[0041] Furthermore, in this embodiment, the mechanism for moving the table is illustrated by using a planar motor that moves a slider in the XY plane and a Stewart platform type 6-degree-of-freedom parallel link mechanism in which the slider forms the base platform. However, the mechanism for moving the table is not limited to this, and other types of parallel link mechanisms or mechanisms other than parallel link mechanisms may be used. For example, a slider that moves in the XY plane and a Z-tilt drive mechanism that moves the table 12 on the slider in the Z-axis direction and in the tilt direction relative to the XY plane may be employed. An example of such a Z-tilt drive mechanism is a mechanism that supports the table 12 from below at each vertex of a triangle via, for example, a universal joint or other joint, and has three actuators (such as voice coil motors) that can drive each support point independently in the Z-axis direction. However, the configuration of the mechanism for moving the table of the first stage system 200A is not limited to these, and any configuration that can drive the table (movable member) on which the workpiece is placed in at least five degrees of freedom directions, namely the three degrees of freedom directions in the XY plane, the Z axis direction, and the inclination direction relative to the XY plane, is sufficient, and it does not need to have a slider that moves in the XY plane. For example, the first stage system may be composed of a table and a robot that moves this table. In any configuration, resetting can be made easier if the measurement system for measuring the position of the table is configured using a combination of absolute linear encoders, or a combination of such linear encoders and absolute rotary encoders.

[0042] In addition, instead of the first stage system 200A, a system capable of driving the table 12 in at least five degrees of freedom directions, namely in three degrees of freedom directions in the XY plane, the Z axis direction, and the tilt direction (θx or θy) relative to the XY plane, may be employed. In this case, the table 12 itself may be supported by air levitation or magnetic levitation, floating on the upper surface of a support member such as a base BS with a predetermined clearance (gap or gap) between them (non-contact support). Adopting such a configuration is extremely advantageous in terms of positioning accuracy because the table moves without contact with the member supporting it, and greatly contributes to improving machining accuracy.

[0043] The measurement system 400 measures the three-dimensional position information of a workpiece, for example, its shape, in order to associate the position and orientation of the workpiece mounted on the table 12 with the table coordinate system. As shown in Figure 2, the measurement system 400 is equipped with a laser non-contact type three-dimensional measuring machine 401. The three-dimensional measuring machine 401 comprises a frame 30 installed on a base BS, a head unit 32 attached to the frame 30, a Z-axis guide 34 mounted on the head unit 32, a rotation mechanism 36 provided at the lower end of the Z-axis guide 34, and a sensor unit 38 connected to the lower end of the rotation mechanism 36.

[0044] The frame 30 consists of a horizontal member 40 extending in the Y-axis direction and a pair of column members 42 that support the horizontal member 40 from below at both ends in the Y-axis direction.

[0045] The head unit 32 is attached to the horizontal member 40 of the frame 30.

[0046] The Z-axis guide 34 is mounted on the head unit 32 so as to be movable in the Z-axis direction and is driven in the Z-axis direction by a Z-drive mechanism 44 (not shown in Figure 2, see Figure 14). The position of the Z-axis guide 34 in the Z-axis direction (or displacement from the reference position) is measured by a Z-encoder 46 (not shown in Figure 2, see Figure 14).

[0047] The rotation mechanism 36 can rotate the sensor unit 38 continuously (or in predetermined angular steps) around a rotation center axis parallel to the Z-axis within a predetermined angular range (for example, a range of 90 degrees (π / 2) or 180 degrees (π)) relative to the head unit 32 (Z-axis guide 34). In this embodiment, the rotation center axis of the sensor unit 38 by the rotation mechanism 36 coincides with the central axis of the line light emitted from the illumination unit, which will be described later, that constitutes the sensor unit 38. The rotation angle of the sensor unit 38 from the reference position by the rotation mechanism 36 (or the position of the sensor unit 38 in the θz direction) is measured by a rotation angle sensor 48 (not shown in Figure 2, see Figure 14), such as a rotary encoder.

[0048] The sensor unit 38 mainly consists of an irradiation unit 50 that irradiates a line of light onto the object to be inspected (workpiece W in Figure 2) placed on the table 12 for optical cutting, and a detection unit 52 that detects the surface of the object to be inspected where an optical cutting surface (line) appears due to the irradiation of the line of light. In addition, a calculation processing unit 610 that determines the shape of the object to be inspected based on the image data detected by the detection unit 52 is connected to the sensor unit 38. In this embodiment, the calculation processing unit 610 is included in a control device 600 that comprehensively controls each component of the processing apparatus 100 (see Figures 1 and 14).

[0049] The irradiation unit 50 is composed of a cylindrical lens (not shown) and a slit plate with a narrow strip-shaped cutout, and receives illumination light from a light source to generate a fan-shaped line of light 50a. As the light source, an LED, laser light source, or SLD (superluminescent diode) can be used. If an LED is used, the light source can be formed inexpensively. If a laser light source is used, since it is a point light source, it can produce line light with little aberration, has excellent wavelength stability and a small FWHM, and a filter with a small FWHM can be used to cut stray light, thus reducing the influence of disturbances. If an SLD is used, in addition to the characteristics of a laser light source, its coherence is lower than that of laser light, so the generation of speckle on the surface of the object under test can be suppressed. The detection unit 52 is for imaging the line of light 50a projected onto the surface of the object under test (work W) from a direction different from the light irradiation direction of the irradiation unit 50. The detection unit 52 is composed of an imaging lens and CCD (not shown), and as described later, the table 12 is moved to image the object under test (work W) each time the line of light 50a is scanned at predetermined intervals. The positions of the irradiation unit 50 and the detection unit 52 are determined such that the incident direction of the line light 50a on the surface of the object to be inspected (workpiece W) to the detection unit 52 and the light irradiation direction of the irradiation unit 50 form a predetermined angle θ. In this embodiment, the predetermined angle θ is set to, for example, 45 degrees.

[0050] Image data of the object under test (work W) captured by the detection unit 52 is sent to the arithmetic processing unit 610, where predetermined image calculation processing is performed to calculate the height of the surface of the object under test (work W) and to determine the three-dimensional shape (surface shape) of the object under test (work W). The arithmetic processing unit 610 calculates the height of the surface of the object under test (work W) from a reference plane using the principle of triangulation for each pixel in the longitudinal direction to which the light cross-section (line) (line light 50a) extends, based on the position information of the light cross-section (line) formed by the line light 50a which is deformed according to the unevenness of the object under test (work W) in the image of the object under test (work W), and performs calculation processing to determine the three-dimensional shape of the object under test (work W).

[0051] In this embodiment, the control device 600 moves the table 12 in a direction approximately perpendicular to the longitudinal direction of the line light 50a projected onto the workpiece (work W), thereby scanning the surface of the workpiece (work W) with the line light 50a. The control device 600 detects the rotation angle of the sensor unit 38 with the rotation angle sensor 48, and moves the table 12 in a direction approximately perpendicular to the longitudinal direction of the line light 50a based on the detection result. Thus, in this embodiment, the table 12 is moved when measuring the shape of the workpiece (work W), so as a prerequisite, when the workpiece W is held and moved below the sensor unit 38 of the measurement system 400, the position and orientation (position in the 6 degrees of freedom directions) of the table 12 are always set to a predetermined reference state. The reference state is, for example, when rods 141 to 146 are all at the length corresponding to the neutral point (or minimum length) of the extension stroke range. In this state, the positions of table 12 in the Z-axis, θx, θy, and θz directions (Z, θx, θy, θz) = (Z0, 0, 0, 0). In this reference state, the position (X,Y) of table 12 in the XY plane coincides with the X,Y positions of slider 10 measured by the position measurement system 28.

[0052] Subsequently, the aforementioned measurements of the workpiece (work W) are initiated. During and after these measurements, the position of the table 12 in the six degrees of freedom directions is managed by the control device 600 on the table coordinate system. Specifically, the control device 600 controls the position of the table 12 in the six degrees of freedom directions by controlling the planar motor 26 based on the measurement information from the position measurement system 28, and by controlling the telescopic mechanisms 161-166 based on the measurement values ​​from the linear encoders 241-246.

[0053] Incidentally, when using the light section method as in the 3D measuring machine 401 according to this embodiment, it is desirable to position the line light 50a irradiated from the irradiation unit 50 of the sensor unit 38 onto the workpiece (work W) in a direction perpendicular to the relative movement direction between the sensor unit 38 and the table 12 (workpiece (work W)). For example, in Figure 2, if the relative movement direction between the sensor unit 38 and the workpiece (work W) is set to the Y-axis direction, it is desirable to position the line light 50a along the X-axis direction. This is because, during measurement, relative movement with respect to the workpiece (work W) can be made by effectively utilizing the entire range of the line light 50a, and the shape of the workpiece (work W) can be measured optimally. A rotation mechanism 36 is provided so that the direction of the line light 50a and the relative movement direction described above can always be perpendicular.

[0054] The three-dimensional measuring machine 401 described above is configured similarly to the shape measuring device disclosed, for example, in U.S. Patent Application Publication No. 2012 / 0105867. However, the scanning of the line light with respect to the object in directions parallel to the X and Y planes is performed by the movement of the sensor unit in the device described in U.S. Patent Application Publication No. 2012 / 0105867, whereas in this embodiment, it is performed by the movement of the table 12. In this embodiment, when scanning the line light with respect to the object in directions parallel to the Z axis, either the Z-axis guide 34 or the table 12 may be driven.

[0055] In the measurement method using the 3D measuring machine 401 according to this embodiment, a linear projection pattern consisting of a single line of light is projected onto the surface of the object to be examined using the light section method. Each time the linear projection pattern is scanned over the entire surface of the object to be examined, the linear projection pattern projected onto the object is imaged from an angle different from the projection direction. Then, the height of the object's surface from a reference plane is calculated for each pixel in the longitudinal direction of the linear projection pattern using the principle of triangulation or the like, and the 3D shape of the object's surface is determined.

[0056] In addition, as a three-dimensional measuring instrument constituting the measurement system 400, a device with a configuration similar to that of the optical probe disclosed in U.S. Patent No. 7,009,717 can also be used. This optical probe consists of two or more optical groups and includes two or more field directions and two or more projection directions. Each optical group includes one or more field directions and one or more projection directions, with at least one field direction and at least one projection direction differing between optical groups, and the data obtained by the field directions is generated only from patterns projected by the projection directions of the same optical group.

[0057] The measurement system 400 may include, in place of, or in addition to, the three-dimensional measuring machine 401 described above, a mark detection system 56 (see Figure 14) that optically detects alignment marks. The mark detection system 56 can, for example, detect alignment marks formed on a workpiece. The control device 600 calculates the position and orientation of the workpiece (or table 12) by accurately detecting the center positions (three-dimensional coordinates) of at least three alignment marks using the mark detection system 56. Such a mark detection system 56 may include, for example, a stereo camera.

[0058] In this embodiment, the control device 600 scans the surface (target surface) of the workpiece W using the 3D measuring machine 401 as described above and acquires its surface shape data. The control device 600 then uses this surface shape data to perform least-squares processing and associates the 3D position and orientation of the target surface on the workpiece with respect to the table coordinate system. Here, including during the measurement of the object under test (workpiece W) as described above, the position of the table 12 in the 6 degrees of freedom directions is managed by the control device 600 on the table coordinate system. Therefore, after the 3D position and orientation of the workpiece are associated with the table coordinate system, including during machining, the control of the position (i.e., position and orientation) of the workpiece W in the 6 degrees of freedom directions can all be performed by open-loop control of the table 12 according to the table coordinate system.

[0059] Figure 4 shows the beam irradiation system 500 along with a mask stage 15, which serves as a holding member for the mask M, and a table 12 on which the workpiece W is mounted.

[0060] A mask stage 15, which constitutes part of the second stage system 200B, holds a mask M as an aperture material having multiple apertures (aperture patterns). Alternatively, a mask with through-holes as apertures may be used, or a mask may be formed by depositing a light-shielding material such as chromium onto the upper or lower surface of a beam-transmitting substrate (such as synthetic quartz) so that the apertures are formed thereon. In this embodiment, the mask M is permanently mounted on the mask stage 15, but a configuration in which the mask on the mask stage 15 can be replaced may also be adopted. The second stage system 200B can change the position of the mask M relative to the focusing optical system 530 by moving the mask stage 15, as will be described later. Specifically, the position of the mask M in the four degrees of freedom directions is changed by moving the mask stage 15, on which the mask M is permanently mounted, in the four degrees of freedom directions (X-axis, Y-axis, Z-axis, and θz direction) using the mask stage drive system 17 (not shown in Figure 4, see Figure 14). The positional information of the mask stage 15 in the X-axis, Y-axis, θz-axis, and Z-axis directions is measured with a resolution of approximately 0.25 to 1 nm by a mask stage position measurement system 19 (not shown in Figure 4, see Figure 14), which consists of, for example, an interferometer system. The mask stage position measurement system 19 may also be configured with an encoder system or other sensors.

[0061] The mask stage drive system 17 is configured, for example, by a magnetic levitation type planar motor. However, it is not limited to a planar motor; for example, the mask stage drive system may be configured by a linear motor system capable of driving the mask stage 15 in the Z-axis direction in addition to the X-axis and Y-axis directions. The mask stage drive system 17 is configured to move the mask stage 15 in four degrees of freedom directions, but it may also be configured to move the mask stage 15 in six degrees of freedom directions, or the mask stage 15 may be configured to move only in the X-axis direction or the Y-axis direction, as long as the opening can be changed.

[0062] In this embodiment, a film-like or plate-like mask is used as the mask M. A stencil mask can also be used as the mask M. The mask M may be made of a material with low thermal expansion. The mask stage 15 has through holes 15a in the vertical direction (Z-axis direction) that serve as beam passages, as shown in the cross-sectional view in Figure 4, and the mask M is positioned above these through holes 15a. Figure 5 shows a plan view of the mask M. As shown in Figure 5, the mask M has multiple types (for example, four types) of slit-like openings that extend in the X-axis direction, each having the same line width (for example, 10 μm) and different lengths in the X-axis direction, multiple types (for example, four types) of slit-like openings that extend in the Y-axis direction, each having the same line width (for example, 10 μm) and different lengths in the Y-axis direction, multiple types (for example, four types) of circular openings (pinhole-like openings) with different diameters, and multiple types (for example, four types) of square openings with different side lengths. In Figure 5, openings PAa and PAb are, for example, slit-shaped openings with a line width of 10 μm and a length of 10 mm. Similarly, opening PAc is, for example, a pinhole-shaped opening with a diameter of 10 μm. It goes without saying that the shape of the openings is not limited to slits, circles, or squares; other shapes such as rectangles and polygons are also acceptable, and it is not necessary to have at least one of the slit, circular, or square openings. Furthermore, the number (types) of each opening shape is not limited to four; for example, there may be one circular opening and three square openings.

[0063] As shown in Figure 4, the beam irradiation system 500 includes a light source system 510, an illumination optical system 520 that irradiates the mask M with a beam emitted from the light source system, and a focusing optical system 530 that focuses the beam that has passed through the mask M onto the target surface of the workpiece W.

[0064] As shown in Figure 6, the light source system 510 includes a light source unit 60, a light guide fiber 62 connected to the light source unit 60, a double fly-eye optical system 64 positioned on the exit side of the light guide fiber 62, and a condenser lens system 66.

[0065] The light source unit 60 comprises a housing 68 and a plurality of laser units 70 housed inside the housing 68 and arranged in a matrix parallel to each other. The laser units 70 can be various lasers that perform pulsed or continuous wave oscillation, such as carbon dioxide lasers, Nd:YAG lasers, fiber lasers, or GaN-based semiconductor lasers. Furthermore, the lasers used as laser units 70 may be nanosecond lasers, picosecond lasers, or femtosecond lasers.

[0066] The light guide fiber 62 is a fiber bundle composed of a large number of optical fiber strands randomly bundled together, and has a plurality of entrance ports 62a individually connected to the exit ends of a plurality of laser units 70, and an exit section 62b having a number of exit ports greater than the number of entrance ports 62a. The light guide fiber 62 receives the plurality of laser beams (hereinafter abbreviated as "beams" as appropriate) emitted from each of the plurality of laser units 70 through each entrance port 62a and distributes them to a plurality of exit ports, and emits at least a portion of each laser beam from a common exit port. In this way, the light guide fiber 62 mixes and emits the beams emitted from each of the plurality of laser units 70. As a result, the total output can be increased in proportion to the number of laser units 70 compared to when a single laser unit is used. However, if sufficient output can be obtained with a single laser unit, it is not necessary to use multiple laser units.

[0067] Here, the ejection section 62b has a cross-sectional shape similar to the overall shape of the incident end of the first fly-eye lens system, which constitutes the incident end of the double fly-eye optical system 64 described next, and the ejection ports are provided within its cross-section at a nearly uniform arrangement. For this reason, the light guide fiber 62 also serves as a shaping optical system that shapes the beam mixed as described above so that it resembles the overall shape of the incident end of the first fly-eye lens system.

[0068] The double fly-eye optical system 64 is designed to uniformize the cross-sectional intensity distribution of the beam (illumination light) and consists of a first fly-eye lens system 72, a lens system 74, and a second fly-eye lens system 76, which are sequentially arranged on the beam path (optical path) of the laser beam behind the light guide fiber 62. An aperture is provided around the second fly-eye lens system 76.

[0069] In this case, the incident surface of the first fly-eye lens system 72 and the incident surface of the second fly-eye lens system 76 are set to be optically conjugate to each other. Furthermore, the exit-side focal surface of the first fly-eye lens system 72 (where a surface light source described later is formed), the exit-side focal surface of the second fly-eye lens system 76 (where a surface light source described later is formed), and the pupil surface (entry pupil) PP2 of the condensing optical system 530 are set to be optically conjugate to each other.

[0070] The beam mixed by the light guide fiber 62 is incident on the first fly-eye lens system 72 of the double fly-eye optical system 64. This forms a surface light source, i.e., a secondary light source consisting of numerous light source images (point light sources), at the exit-side focal plane of the first fly-eye lens system 72. Laser light from each of these numerous point light sources is incident on the second fly-eye lens system 76 via the lens system 74. This forms a surface light source (tertiary light source) at the exit-side focal plane of the second fly-eye lens system 76, in which numerous minute light source images are uniformly distributed within a predetermined shaped area. Note that the exit-side focal plane of the first fly-eye lens system 72 may be a plane located away from the exit surface of the first fly-eye lens system 72 toward the beam exit side in order to reduce the possibility of the first fly-eye lens system 72 being damaged by the beam. In this case, the secondary light source from the first fly-eye lens system 72 is formed at a position away from the exit surface of the first fly-eye lens system 72. Similarly, the exit-side focal plane of the second fly-eye lens system 76 may be a plane that is located away from the exit surface of the second fly-eye lens system 76 toward the beam exit side. In this case, the tertiary light source provided by the second fly-eye lens system 76 is formed at a position away from the exit surface of the second fly-eye lens system 76.

[0071] The condenser lens system 66 has a front focal point positioned at or near the emission surface of the second fly-eye lens system 76, and emits the laser light emitted from the tertiary light source as a beam with a uniform illuminance distribution.

[0072] Furthermore, by optimizing the area of ​​the incident end of the second fly-eye lens system 76 and the focal length of the condenser lens system 66, the beam emitted from the condenser lens system 66 can be considered a parallel beam.

[0073] The light source system 510 of this embodiment includes an illumination uniformization optical system comprising a light guide fiber 62, a double fly-eye optical system 64, and a condenser lens system 66. Using this illumination uniformization optical system, beams emitted from multiple laser units 70 are mixed to generate a parallel beam with a uniform cross-sectional illumination distribution. It should be noted that uniformizing the cross-sectional illumination distribution may also include ensuring that the illumination distribution in the beam cross-section of the beam emitted from the illumination uniformization optical system is closer to uniform than the illumination distribution in the beam cross-section of the beam incident on the illumination uniformization optical system.

[0074] Furthermore, the illumination uniformity optical system is not limited to the configuration described above. An illumination uniformity optical system may also be constructed using a rod integrator, a collimator lens system, or the like.

[0075] The light source unit 60 of the light source system 510 is connected to the control device 600 (see Figure 14), and the control device 600 individually controls the on / off state of the multiple laser units 70 that make up the light source unit 60. This adjusts the amount of light (laser output) of the laser beam irradiated from the focusing optical system 530 onto the workpiece W (the target surface above) via the illumination optical system 520 (and mask M).

[0076] As shown in Figure 4, the illumination optical system 520 includes optical devices 78, a first partial illumination optical system 79, a mirror array 80, and a second partial illumination optical system 82, which are sequentially arranged along the optical path of a parallel beam from the light source system 510 (condenser lens system 66).

[0077] The optical device 78 can change the intensity distribution of the cross-section of the parallel beam from the light source system 510 (condenser lens system 66). In this embodiment, the optical device 78 is composed of a mirror array, which is a type of spatial light modulator (SLM). Here, a spatial light modulator is a general term for an element that spatially modulates the amplitude (intensity), phase, or polarization state of light traveling in a predetermined direction. Hereafter, the optical device 78 will also be called the second mirror array 78. The second mirror array 78 can change the cross-sectional intensity distribution (and illumination shape) of the parallel beam from the light source system 510 at the pupil surface PP1 of the illumination optical system 520. Hereafter, in order to distinguish it from the second mirror array 78, the mirror array 80 described above will be referred to as the first mirror array 80 (it may also be referred to as the optical device 80).

[0078] The second mirror array 78, as shown in Figure 7, comprises a base member 78A having a surface on one side that forms a 45-degree angle (π / 4) with respect to the XY and XZ planes (hereinafter referred to as the reference plane for convenience), and, for example, K (=I×J) mirror elements 81 arranged in a matrix of, for example, I rows and J columns on the reference plane of the base member 78A. i,j (i=1~I, j=1~J) and each mirror element 81 i,j It has a drive unit 78B (not shown in Figure 7, see Figure 14) which includes K actuators (not shown) that move each of the components individually.

[0079] Each mirror element 81 of the second mirror array 78 i,j For example, each mirror element 81 i,j It is configured to be rotatable around a rotation axis parallel to one of the diagonals, and the inclination angle of its reflective surface relative to the reference plane can be set to any angle within a predetermined angle range. The angle of the reflective surface of each mirror element is detected by a sensor that detects the rotation angle of the rotation axis, such as a rotary encoder 83. i,j (Not shown in Figure 7, see Figure 14) is used for measurement.

[0080] The drive unit 78B includes, for example, an electromagnet or a voice coil motor as an actuator, and individual mirror elements 81 i,jIt is driven by an actuator and operates with very high responsiveness.

[0081] Each of the plurality of mirror elements 81 constituting the second mirror array 78 i,j is illuminated by a parallel beam from the light source system 5,10, emits a plurality of reflected beams (parallel beams) LB in a direction corresponding to the tilt angle of its reflecting surface, and makes them enter the first partial illumination optical system 79 (see Fig. 7). The first partial illumination optical system 79 includes a plurality of lenses including relay lenses, etc., and for example, the pupil plane PP1 of the illumination optical system 520 is disposed inside it. The first partial illumination optical system 79 has a partial optical system 791 between the second mirror array 78 and the pupil plane PP1. The partial optical system 791 is arranged such that its front focal position is located on or near the plane where the second mirror array 78 is disposed, and its rear focal position is located on or near the pupil plane PP1, and distributes the plurality of reflected beams LB on the pupil plane PP1 according to the traveling direction of the plurality of reflected beams LB from the second mirror array 78. That is, the second mirror array 78 can set or change the cross-sectional intensity distribution of the beam on the pupil plane PP1 by adjusting the tilt angle of each reflecting surface of the plurality of mirror elements 81 i,j Therefore, the second mirror array 78 can set or change the cross-sectional shape (which may also be called the illumination shape) of the beam on the pupil plane PP1 by adjusting the tilt angle of each reflecting surface of the plurality of mirror elements 81 i,j Here, the pupil plane PP1 is a conjugate plane of the pupil plane (entrance pupil plane) PP2 of the condensing optical system 530.

[0082] The partial optical system 791 can also be considered as an optical system that converts the angle of the incident beam to its position on the exit side. Furthermore, the optical device 78 is not limited to a spatial light modulator such as a mirror array, but can also be configured by, for example, an illumination system aperture diaphragm plate in which multiple types of aperture diaphragms are formed on a rotatable disc member, and these multiple types of aperture diaphragms can be interchanged and placed along the beam's optical path. This illumination system aperture diaphragm plate may be placed on or near the pupil surface PP1 in the first partial illumination optical system 79, or on or near the pupil surface PP2 of the focusing optical system 530. In this case, the optical device 78 may not be provided. The second mirror array 78 is located on or near a plane conjugate to the image plane (processing surface MP) of the focusing optical system 530, and it is also possible to prevent a portion of the parallel beam from the light source system 510 (for example, a parallel beam from some mirror elements (also referred to as mirrors as appropriate)) from being incident on the illumination optical system 520, so that the intensity or intensity distribution of the processing beam at the image plane (processing surface MP) of the focusing optical system 530 can be adjusted. For example, at the image plane (processing surface MP) of the focusing optical system 530, the intensity distribution within the irradiation area of ​​the processing beam from the focusing optical system 530 can be adjusted.

[0083] In this embodiment, a parallel beam passing through an optical device (for example, a second mirror array) 78 is irradiated onto the mask M via a first partial illumination optical system 79, a first mirror array 80, and a second partial illumination optical system 82, as described later, and enters the focusing optical system 530 through the aperture of the mask M. By changing the cross-sectional intensity distribution of the parallel beam from the light source system 510 using the optical device (for example, a second mirror array) 78, it is possible to change the beam intensity distribution at the pupil surface PP1 of the illumination optical system 520 and the pupil surface (entry pupil) PP2 of the focusing optical system 530, i.e., the cross-sectional shape of the beam.

[0084] Furthermore, since the optical device 78 is positioned conjugate to or near the image plane (processing surface MP) of the focusing optical system 530, it is possible to substantially change the intensity distribution of the beam emitted from the focusing optical system 530 on the image plane of the focusing optical system 530 by using the optical device 78 to transform the cross-sectional intensity distribution of the parallel beam from the light source system 510. For example, by setting the tilt angle of some of the mirrors in the second mirror array 78 so that the beam reflected by those mirrors does not enter the illumination optical system 520, the intensity distribution of the beam within the irradiation area on the image plane (processing surface MP) can be changed. Also, since the optical device 78 is positioned conjugate to or near the plane on which the aperture of the mask M is located, it is possible to substantially change or adjust the beam intensity distribution on the mask M by using the optical device 78 to transform the cross-sectional intensity distribution of the parallel beam from the light source system 510. For example, it is possible to give the beam incident on the aperture of the mask M a non-uniform intensity distribution.

[0085] Each mirror element 81 of the second mirror array 78 is on the pupil surface PP1 of the illumination optical system 520. i,j Multiple reflected beams (parallel beams) LB are incident on the pupil surface PP1, emitted in a direction corresponding to the tilt angle of the reflecting surface, and the cross-sectional intensity distribution (i.e., cross-sectional shape, illumination shape) at the pupil surface PP1 is reflected by each mirror element 81 of the second mirror array 78. i,j The angle is set according to the inclination angle of the reflective surface. The first partial illumination optical system 79 irradiates a beam having the set cross-sectional intensity distribution onto the first mirror array 80, which is positioned at or near a position conjugate to the pupil surface PP1 of the illumination optical system 520.

[0086] The first mirror array 80, as shown in Figure 8, comprises a base member 80A having a surface on one side that forms a 45-degree angle (π / 4) with respect to the XY and XZ planes (hereinafter referred to as the reference plane for convenience), and, for example, M (=P×Q) mirror elements 81 arranged in a matrix of, for example, P rows and Q columns on the reference plane of the base member 80A. p,q (p=1~P, q=1~Q) and each mirror element 81 p,qIt has a drive unit 80B (not shown in Figure 4, see Figure 14) which includes M actuators (not shown) that move each of the mirrors individually, and is configured similarly to the second mirror array 78, although the orientation is reversed left to right.

[0087] Among the multiple mirror elements constituting the first mirror array 80, the mirror element 81 illuminated by the parallel beam from the first partial illumination optical system 79 p,q Each of these emits multiple reflective beams (parallel beams) LB in a direction corresponding to the inclination angle of its reflective surface, and directs them into the second partial illumination optical system 82. The beam emitted from the second partial illumination optical system 82 can be focused onto the mask M in any size and shape (e.g., spot or slit). The front focal position of the second partial illumination optical system 82 is located at or near the position of the first mirror array 80, and the rear focal position is located at or near the position of the mask M (e.g., the plane on which the aperture of the mask M is located). Therefore, in this embodiment, by adjusting the position of the mask M in the XY plane, it is possible to illuminate only a portion of the area on the mask M that includes any one aperture. Thus, in this embodiment, the beam from the illumination optical system 520 can be efficiently directed into the focusing optical system 530 via the mask M. Note that if the beam is directed into the aperture of the mask M, the first mirror array 80 does not need to be provided.

[0088] In this embodiment, the focusing optical system 530 is a low-aberration optical system with a high numerical aperture (NA) of, for example, 0.5 or more, preferably 0.6 or more. In this embodiment, a reduction projection lens with an NA of 0.75, a projection magnification of 1 / 10, and a maximum field of view of 1 mm square is used as the focusing optical system 530.

[0089] In this embodiment, the focusing optical system 530 has a large aperture, low aberration, and high numerical aperture, so it can focus multiple beams that are irradiated onto the mask M from the first mirror array 80 via the second partial illumination optical system 82 and have passed through one aperture of the mask M to at least one position or region on the image plane. As will be described in detail later, in this embodiment, the beam irradiation system 500 can focus the beam emitted from the focusing optical system 530 into, for example, a spot shape or a slit shape, depending on the shape of the aperture of the mask M. In this embodiment, it can also be said that the focusing optical system 530 can reduce and project the aperture pattern on the mask M onto the image plane to form a reduced image of the aperture pattern on the image plane. Note that on the image plane of the focusing optical system 530, the image of the aperture (the beam irradiation region) may be formed on the optical axis of the focusing optical system 530 or at a position offset from the optical axis. In this case, the aperture of the mask M used for processing should be positioned off-axis from the optical axis of the focusing optical system 530, so that the beam from the first mirror array 80 is directed onto the aperture.

[0090] Furthermore, by moving the mask stage 15 and changing the aperture used for processing, the size and shape of the beam irradiation area on the image plane (processing surface MP) of the focusing optical system 530 can be changed. Therefore, the mask stage 15 may be considered as part of a mechanism that changes the beam intensity distribution on the image plane (processing surface MP) of the focusing optical system 530.

[0091] Furthermore, since the focusing optical system 530 is composed of one or more lenses (Figures 4 and 8 show a single lens as a representative example), the area of ​​incident light can be increased, thereby allowing for the capture of a larger amount of light energy compared to when using a focusing optical system with a small numerical aperture (NA). Consequently, the beam focused by the focusing optical system 530 according to this embodiment is extremely sharp and has a high energy density, which directly leads to improved machining accuracy when processing workpieces.

[0092] In this embodiment, as will be described later, the table 12 is moved in a scanning direction parallel to the XY plane (in Figure 4, for example, the Y-axis direction) to bring the machining target surface (also referred to as the target surface) TAS of the workpiece W, where the target portion is located, into a state parallel to or perpendicular to the XY plane, and machining (machining process) is performed while the beam and the workpiece W are scanned in the scanning direction. It goes without saying that during machining, the table 12 may also be moved in at least one of the X-axis direction, Z-axis direction, θx direction, θy direction, and θz direction while the table 12 is moving in the Y-axis direction.

[0093] In the processing apparatus 100 according to this embodiment, in order to achieve high-throughput processing that makes the most of the total output (laser power) of the laser which has been greatly increased by the method described above, as described later, an image of a slit-shaped aperture on the mask M, for example the aforementioned slit-shaped aperture PAa or PAb, that is, the irradiation area of ​​a slit-shaped beam (see the symbol LS in Figure 9(B)), is formed on the image plane (hereinafter referred to as the processing surface) MP (see, for example, Figures 4 and 9(A)) of the focusing optical system 530, and the desired processing (e.g., removal processing) can be performed while the workpiece W is scanned relative to the beam forming the irradiation area LS in a direction perpendicular to its longitudinal direction. As a result, a significantly larger area (for example, several to tens of times larger) can be processed at once, for example, removal processing, compared to when scanning the workpiece with a spot-shaped beam.

[0094] Figures 4 and 9 show an example of material removal on a workpiece W, where the position of the workpiece W is controlled so that the processed surface MP coincides with the processed surface of the workpiece W (the surface after a portion of the workpiece W has been removed by the beam). In this case, as is clear from Figures 4 and 9, the surface of the workpiece W before processing (the target surface TAS) is shifted by ΔZ in the +Z direction from the image plane (processed surface MP). This ΔZ may be determined based on at least one of the beam intensity, the material of the workpiece W, and the relative scanning speed between the beam and the workpiece.

[0095] Furthermore, if possible with the desired removal process, the machined surface MP does not need to coincide with the machined surface of the workpiece W. For example, the position of the workpiece W may be controlled so that the target surface TAS of the workpiece W and the machined surface MP are approximately in coincidence.

[0096] In the processing apparatus 100 of this embodiment, the three-dimensional intensity distribution of the beam on the first surface on the exit side of the focusing optical system 530 and its vicinity can be changed by combining the cross-sectional intensity distribution of the parallel beam from the light source system 510 (cross-sectional intensity distribution at the pupil surface PP2 of the focusing optical system 530) with the aperture on the mask M, which is set using the second mirror array 78. This will be described in detail below. In this embodiment, the first surface on the exit side of the focusing optical system 530 is the surface on which the image of the aperture on the mask M is formed, and refers to the processing surface MP when a part of the surface of the workpiece is removed by the beam from the focusing optical system 530. In this embodiment, the processing surface MP is the image plane of the focusing optical system 530 (see, for example, Figures 4 and 9(A)), but the processing surface MP may be a surface in the vicinity of the image plane. Also, in this embodiment, the processing surface MP is perpendicular to the optical axis AX on the exit side of the focusing optical system 530, but it does not have to be perpendicular. Furthermore, in this embodiment, the beam LB irradiated onto the processing surface MP can be said to function similarly to a cutting tool used when performing cutting operations on the workpiece W. Therefore, the tip of the beam is also referred to as an optical cutting tool in this specification.

[0097] Figure 10(A) shows an explanatory diagram of an example of a processing mode that can be set in the processing apparatus 100 according to this embodiment. Here, six modes, from Mode 1 to Mode 6, will be described. In Figure 10(A), the "Illumination Shape" diagram shows a virtual axis perpendicular to the center of the pupil plane (optical axis) as a dashed line. In Figure 10(A), the "Illumination Shape" is the cross-sectional intensity distribution (cross-sectional shape) of the beam at the pupil plane PP1 of the illumination optical system 520, but it can also be said to be the cross-sectional intensity distribution (cross-sectional shape) of the beam at the pupil plane PP2 of the focusing optical system 530.

[0098] Furthermore, in Figure 10(A), the "front view" and "side view" of the beam tip (optical cutting edge) show the shape of the beam tip (optical cutting edge) between the image plane (processing surface MP) and a virtual plane perpendicular to the optical axis between the focusing optical system 530 and the image plane (processing surface MP). Note that even when using a laser beam in the invisible wavelength band, it can be explained using Figure 10(A) by assuming it is visible.

[0099] Mode 1 is a processing mode in which a uniform intensity distribution is set, a circular illumination shape centered on the optical axis (also called normal illumination) is set, and a slit-shaped aperture with a line width of 10 μm and a length of 10 mm, i.e., the aforementioned aperture PAa or PAb, is selected as the aperture on the mask M. In this specification, selecting an aperture includes using the first mirror array 80 to form (set) an illumination field (illumination area of ​​illumination light) in which illumination light is irradiated only to a part of the mask M that includes the selected aperture. The reason for using the first mirror array 80 to form an illumination field only to a part of the mask M that includes the selected aperture is to minimize the loss of laser power by concentrating the entire beam emitted from the light source system 510 onto the selected pattern portion.

[0100] In Mode 1, the shape of the optical cutting tool is as shown in Figure 10(A). When viewed from the front, it is an inverted isosceles trapezoid with a cutting edge length of 1 mm, and when viewed from the side, it is an inverted isosceles triangle with a cutting edge dimension of 1 μm. In Figure 10(A), the coordinate axes shown in the front and side views of the optical cutting tool indicate the scanning direction of the workpiece during machining. In Mode 1, if aperture PAa is selected, the scanning direction is the X-axis direction, and if aperture PAb is selected, the scanning direction is the Y-axis direction.

[0101] Mode 2 is a processing mode in which the aforementioned slit-shaped aperture PAa or PAb is selected as the aperture on the mask M, and a semicircular illumination shape with a straight section corresponding to the longitudinal direction of the selected aperture is set. The illumination shape in Mode 2 has an edge along a virtual axis extending in the left-right direction of the paper in Figure 10(A), and in the pupil plane, the beam is distributed in one of the two regions divided by this virtual axis. The semicircular illumination shape in Mode 2 can be described as an illumination shape that is rotationally symmetric with respect to the center of the pupil plane (optical axis). In Mode 2, the virtual axis extending in the left-right direction of the paper corresponds to a direction perpendicular to the scanning direction of the workpiece in the image plane (XY plane).

[0102] In Mode 2, as shown in Figure 10(A), the shape of the optical cutting tool, when viewed from the front, is an inverted isosceles trapezoid shape, similar to Mode 1, with a cutting edge length of 1 mm. However, when viewed from the side, it is a right-angled triangle, which is half the inverted isosceles triangle of Mode 1. In Mode 2, if aperture PAa is selected, the scanning direction is the X-axis direction, and if aperture PAb is selected, the scanning direction is the Y-axis direction. In Mode 2, as shown in the side view, the optical cutting tool (the tip of the beam) has an outer edge that is substantially contained within a plane parallel to the optical axis of the focusing optical system 530 on the side of the direction of optical cutting tool's movement (opposite to the scanning direction of the workpiece). The workpiece and the optical cutting tool move relative to each other in a direction approximately perpendicular to the plane containing this outer edge (parallel to the scanning direction). In addition, in the illumination shape of Mode 2, there is an edge along a virtual axis extending in the left-right direction of the paper, and in the pupil plane, the beam is distributed in one of the two regions (lower side) that are divided by this virtual axis, but there may be another mode in which the beam is distributed in the other side (upper side).

[0103] Mode 3 is a processing mode in which the aforementioned slit-shaped opening PAa or PAb is selected as the opening on the mask M, and a semicircular illumination shape is set that has a straight section corresponding to the direction perpendicular to the longitudinal direction of the selected opening. The illumination shape in Mode 3 has an edge along a virtual axis extending in the vertical direction of the paper in Figure 10(A), and in the pupil plane, the beam is distributed in one of the two regions divided by this virtual axis. The semicircular illumination shape in Mode 3 can be described as an illumination shape that is rotationally symmetric with respect to the center (optical axis) of the pupil plane. In Mode 3, the virtual axis extending in the vertical direction of the paper corresponds to the scanning direction of the workpiece in the image plane (XY plane). In Mode 3, the shape of the optical cutting tool, as shown in Figure 10(A), when viewed from the front, is a trapezoidal shape like the inverted isosceles trapezoid in Mode 1 with the right-angled triangular portion at the right end cut off, one leg is perpendicular to the upper and lower bases, and the length of the cutting edge is 1 mm, the same as in Modes 1 and 2. Viewed from the side, it has an isosceles triangle shape similar to Mode 1, with a cutting edge dimension of 1 μm. In Mode 3, when aperture PAa is selected, the scanning direction is the X-axis direction, and when aperture PAb is selected, the scanning direction is the Y-axis direction. In Mode 3, as shown in the front view, the optical cutting tool (beam tip) has an outer edge that is substantially contained within a plane parallel to the optical axis of the focusing optical system 530, and the workpiece and the optical cutting tool move relative to each other in a direction parallel to the plane containing this outer edge (parallel to the scanning direction). In the illumination shape of Mode 3, there is an edge along a virtual axis extending in the vertical direction of the paper, and in the pupil plane, the beam is distributed in one of the two regions (left side) divided by this virtual axis, but there may be another mode in which the beam is distributed in the other side (right side).

[0104] Mode 4 is a processing mode in which the aforementioned slit-shaped aperture PAa or PAb is selected as the aperture on the mask M, and a quadrant-shaped illumination shape is set, having two linear sections corresponding to the longitudinal direction of the selected aperture and in a direction perpendicular to the longitudinal direction, respectively. The illumination shape in Mode 4 has an edge along a virtual axis extending in the left-right direction of the paper in Figure 10(A), and an edge along a virtual axis extending in the up-down direction of the paper, and on the pupil plane, the beam is distributed in one of the four regions divided by these two virtual axes. In Mode 4, the shape of the optical cutting tool is a trapezoid when viewed from the front, similar to Mode 3, as shown in Figure 10(A), and a right-angled triangle when viewed from the side, similar to Mode 2. In Mode 4, if pattern PAa is selected, the scanning direction is the X-axis direction, and if pattern PAb is selected, the scanning direction is the Y-axis direction. The quadrant-shaped illumination shape in Mode 4 can be described as an illumination shape that is rotationally symmetric with respect to the center of the pupil plane (optical axis). In Mode 4, similar to Mode 2, the optical blade (the tip of the beam) has a first outer edge that is substantially contained within a plane parallel to the optical axis of the focusing optical system 530 on the side of the direction of the optical blade's movement (opposite to the scanning direction of the workpiece), and the workpiece and the optical blade move relative to each other in a direction substantially perpendicular to the plane containing this first outer edge (parallel to the scanning direction). Furthermore, in Mode 4, similar to Mode 3, the optical blade (the tip of the beam) has a second outer edge that is substantially contained within a plane parallel to the optical axis of the focusing optical system 530, and the workpiece and the optical blade move relative to each other in a direction substantially parallel to the plane containing this second outer edge (parallel to the scanning direction). In Mode 4, the illumination shape has edges along a virtual axis extending horizontally across the paper and edges along a virtual axis extending vertically across the paper. In the pupil plane, the beam is distributed in one of the four regions (quadrants) divided by these two virtual axes (the third quadrant). However, there may be other modes in which the beam is distributed in other regions (quadrants) of the four regions (quadrants), for example, the first quadrant.

[0105] Mode 5 is a machining mode in which a small circular illumination shape (also called small σ illumination) with a diameter centered on the optical axis is set at the center of the pupil plane, and a pinhole-shaped aperture PAc with a diameter of 10 μm is selected as the aperture on the mask M. In Mode 5, the shape of the optical cutting tool is a straight line extending vertically (in the Z-axis direction) with a diameter of 1 μm, as shown in Figure 10(A), whether viewed from the front or the side. In this case, the optical cutting tool is a rod-shaped object with a circular cross-section, and in a side view, it is a straight line extending vertically (in the Z-axis direction) with a diameter of 1 μm, regardless of the direction from which it is viewed. Therefore, in Mode 5, the scanning direction can be set to any direction.

[0106] Mode 6 is a processing mode in which normal illumination is set as the illumination shape, and a pinhole-shaped aperture PAc with a diameter of 10 μm is selected as the aperture on the mask M. In Mode 6, the shape of the optical cutting tool is an inverted isosceles triangle, as shown in Figure 10(A), whether viewed from the front or the side, similar to the side view in Mode 1. In this case, the optical cutting tool is a cone with a circular cross-section, and in side view, it is the same inverted isosceles triangle shape regardless of the direction. Therefore, in Mode 6, the scanning direction can be set to any direction.

[0107] Furthermore, using the same aperture and illumination shape of the mask M as in Mode 2, the workpiece and beam may be moved relative to each other in directions intersecting the X and Y axes within the image plane (XY plane). Similarly, using the same aperture and illumination shape of the mask M as in Mode 3, the workpiece and beam may be moved relative to each other in directions intersecting the X and Y axes within the image plane (XY plane). Similarly, using the same aperture and illumination shape of the mask M as in Mode 4, the workpiece and beam may be moved relative to each other in directions intersecting the X and Y axes within the image plane (XY plane).

[0108] Figure 10(B) shows examples of target areas of a workpiece suitable for machining using Mode 1, Mode 2, Mode 3, and Mode 4 optical cutting tools, respectively, and Figure 10(C) shows examples of target areas of a workpiece suitable for machining using Mode 5 and Mode 6 optical cutting tools, respectively.

[0109] The Mode 1 optical cutting tool is particularly suitable for surface removal of a workpiece, as shown, for example, in the front and side views of the optical cutting tool in Figure 10(A) and in Figure 10(B). The Mode 2, Mode 3, and Mode 4 optical cutting tools are also suitable for surface removal of grooves when forming grooves of a predetermined depth on the surface of a workpiece, as shown, for example, in the front and side views of the optical cutting tool in Figure 10(A) and in Figure 10(B). Mode 4 is particularly suitable for surface removal of the corner portions of grooves.

[0110] Furthermore, as is clear from the front view and side view of the optical blade in Figure 10(A), the Mode 5 optical blade is suitable for cutting, for example, a plate-shaped member into an arbitrary curved or straight line. In Figure 10(C), "mode5" indicates that a gourd-shaped workpiece is produced as a result of cutting a plate-shaped member with the Mode 5 optical blade, and that the side surface of the workpiece is the cut surface made by the Mode 5 optical blade.

[0111] Furthermore, as is clear from the front view and side view of the optical blade in Figure 10(A) and Figure 10(C), the Mode 6 optical blade is particularly suitable for forming fine groove patterns of arbitrary shapes, such as micro-chip channels, on the workpiece surface.

[0112] The processing apparatus 100 is also equipped with a liquid supply device 540 (see Figure 14). The liquid supply device 540 can be used, for example, for hardening using a beam from the focusing optical system 530. The liquid supply device 540 has a supply port for supplying coolant (cooling water) and supplies the coolant to the object to be cooled. The liquid supply device 540 is connected to the control device 600 (see Figure 14). During hardening, the control device 600 controls the light source unit 60 to adjust the thermal energy of the beam from the focusing optical system 530 that is irradiated onto the workpiece to a value appropriate for hardening. The control device 600 then irradiates the surface of the workpiece held on the table 12 with the beam to raise the temperature, and then, while the workpiece is still held on the table 12, sprays coolant from the liquid supply device 540 onto the high-temperature part to rapidly cool it, thereby performing hardening.

[0113] The processing apparatus 100 according to this embodiment is provided with a measuring device 110 (see Figure 11) that receives a beam from the focusing optical system 530 and performs measurement processing. For example, the measuring device 110 can receive the beam from the focusing optical system 530 and measure the optical properties of the beam. In this embodiment, the measuring device 110 can be used, for example, to manage the beam intensity distribution. In this embodiment, the measuring device 110 can measure at least one of the beam intensity distribution at the image plane of the focusing optical system 530 (which in this embodiment coincides with the processing surface MP) and the beam intensity distribution at the pupil plane PP2 of the focusing optical system 530. The beam intensity distribution at the pupil plane PP2 of the focusing optical system 530 can also be considered as the angular intensity distribution of the beam at the image plane of the focusing optical system 530.

[0114] As shown in Figure 11, the measuring device 110 has a measuring member 92 that forms part of the upper surface of the table 12 and the remaining components housed inside the table 12.

[0115] Figure 12 shows a perspective view of a part of the measuring device 110, including the components located inside the table 12, along with the measuring member 92. As shown in Figure 12, the measuring device 110 comprises the measuring member 92, the first optical system 94, the optical system unit 95, and the light receiver 96.

[0116] The measuring member 92 is positioned within a circular opening formed on the upper surface of the table 12, with its upper surface being flush (on the same plane) with the rest of the table 12. The measuring member 92 has a substrate made of, for example, synthetic quartz, which is capable of transmitting the beam from the focusing optical system 530. A light-shielding film, which also serves as a reflective film, is formed on the surface of the substrate by vapor deposition of a metal such as chromium, and a circular opening 92a is formed in the center of the light-shielding film. Therefore, the upper surface of the measuring member 92 includes the surface of the light-shielding film and the surface of the substrate within the opening 92a. The light-shielding film is formed to be very thin, and in the following description, it will be assumed that the surface of the light-shielding film and the surface of the substrate within the opening 92a are located on the same plane. Furthermore, it is not necessary to form a light-shielding film, but by forming one, it is possible to expect the effect of suppressing the effects of flare and other factors during measurement.

[0117] The first optical system 94 is positioned below the measuring member 92. The beam passing through the aperture 92a of the measuring member 92 enters the first optical system 94. In this embodiment, the first optical system 94 is a collimator optical system, but it does not have to be a collimator optical system.

[0118] The optical system unit 95 has a circular rotating plate 101 with a rotation axis 101a at its center. An aperture 97 and a lens (second optical system) 98 are arranged on the rotating plate 101 at predetermined angular intervals around the rotation axis 101a. By rotating the rotation axis 101a, i.e., the rotating plate 101, either the aperture 97 or the lens 98 can be selectively positioned on the optical path of light through the first optical system 94 (a position corresponding to the optical axis AX1). The rotation of the rotation axis 101a is performed by a drive device 102 (not shown in Figure 12, see Figure 14) under the direction of a control device 600.

[0119] The aperture 97 allows parallel light emitted from the first optical system 94 to pass through directly. By positioning this aperture 97 on the optical path of the beam via the focusing optical system 530, and by moving the first optical system 94, or at least one optical element constituting the first optical system 94, the photodetector 96 can measure the intensity distribution of the beam at the pupil plane (entry pupil) of the focusing optical system 530. Note that the measuring device 110 does not need to be able to measure the intensity distribution at the pupil plane (entry pupil) of the focusing optical system 530. In this case, the lens 98 may be fixed.

[0120] The lens 98, together with the first optical system 94, constitutes a relay optical system, optically conjugating the upper surface of the measuring member 92, where the aperture 92a is formed, and the light-receiving surface of the light-receiving element (described later) of the photodetector 96.

[0121] The photodetector 96 includes a photodetector element (hereinafter referred to as "CCD" as appropriate) 96a, which consists of a two-dimensional CCD or the like, and an electrical circuit 96b, such as a charge transfer control circuit. It goes without saying that a CMOS image sensor may also be used as the photodetector element 96a. The photodetector 96 outputs the light reception result (received light data) to the control device 600 (see Figure 14). The CCD 96a has an area sufficient to receive all of the parallel light that enters the first optical system 94 through the aperture 92a, is emitted from the first optical system 94, and passes through the aperture 97. Furthermore, the light-receiving surface of the CCD 96a is optically conjugate to the upper surface of the measuring member 92 (the surface forming the aperture 92a) by a relay optical system composed of the first optical system 94 and the lens 98. In addition, each pixel of the CCD 96a has a size that includes multiple pixels within the irradiation area of ​​the beam focused via the relay optical system described above. The CCD96a has one or more reference pixels, and the positional relationship between these reference pixels and the reference points of the table 12, such as the center point, is known. Therefore, the control device 600 can determine the positional relationship between the beam incident on the CCD96a and the reference pixels from the output of the photodetector 96, and can obtain positional information of the beam within the table coordinate system (for example, beam focusing position information).

[0122] Furthermore, the light-receiving surface of the CCD 96a is conjugate to the pupil surface of the focusing optical system 530 when the upper surface (substrate surface) of the measuring member 92 coincides with the image plane (processed surface MP) of the focusing optical system 530, and the aperture 97 is positioned on the optical path of the beam via the aperture 92a and the first optical system 94.

[0123] Alternatively, instead of the aperture 97, the optical system (optical components) may be placed on the rotating plate 101, so that the light-receiving surface of the CCD 96a and the pupil surface of the condensing optical system 530 are conjugate. Furthermore, during measurement, the upper surface of the measuring component 92 may be positioned offset from the image plane of the condensing optical system 530 in the direction of the optical axis AX.

[0124] Furthermore, the optical system unit 95 is not limited to those described above. For example, instead of using the rotating plate 101, the lens 98 may be held by a movable member, and the lens 98 may be inserted and removed by moving the movable member perpendicular to the optical axis (for example, along the X-axis).

[0125] As is clear from the above description, in this embodiment, the measuring device 110 including the measuring member 92 is mounted on a table 12 that can move freely in the six degrees of freedom directions. Therefore, the measuring member 92, which functions as a light receiving unit of the measuring device 110, can receive the beam from the focusing optical system 530 while moving in at least one direction in the Z-axis direction parallel to the optical axis AX on the emission surface side of the focusing optical system 530, the X-axis perpendicular to the optical axis AX, and the Y-axis direction.

[0126] Here, although the explanation is out of order, we will describe the measurement using the measuring device 110. The measurement of the beam intensity distribution in the image plane of the focusing optical system 530 and its vicinity (the plane in the vicinity with respect to the Z-axis direction) is performed, for example, as follows.

[0127] First, the control device 600 controls the planar motor 26 and the telescopic mechanisms 161-166 based on the measured values ​​of the position measurement system 28 and the linear encoders 241-246, moving the table 12 based on known target values ​​(such as design information), and positioning the aperture 92a of the measuring member 92 on the optical axis AX of the focusing optical system 530.

[0128] Furthermore, the control device 600 rotates the rotating plate 101 via the drive device 102, positioning the lens 98 on the optical path of the beam through the aperture 92a and the first optical system 94. In this state, the control device 600 measures the beam intensity distribution on the image plane of the focusing optical system 530 based on the received data (referred to as LRD1, see Figure 14), which is the result of receiving the beam that has been focused onto the light-receiving surface of the CCD 96a by the lens 98.

[0129] Figure 13(A) shows the optical arrangement for measuring the beam intensity distribution on the image plane of the focusing optical system 530, laid out along the optical axis AX1 of the measuring device 110 and the optical axis AX of the focusing optical system 530 (however, the portion upstream of the focusing optical system 530 is omitted from the illustration). When measuring the beam intensity distribution, for example, the positioning of the mask M in one of the modes 1 to 6 described above and each mirror element 81 of the second mirror array 78 i,j The reflective surface is set, and furthermore, each mirror element 81 of the first mirror array 80 p,q The reflective surface is set at a design angle such that the desired beam intensity distribution (shape, size, position, etc. of the beam irradiation area) can be obtained on the mask M.

[0130] Under the above preconditions, in the optical arrangement shown in Figure 13(A), when the control device 600 causes a laser beam to oscillate from at least one laser unit 70 of the light source unit 60, and a parallel beam is emitted from the light source system 510, the parallel beam is irradiated onto the first mirror array 80 via the second mirror array 78 and the first partial illumination optical system 79, and multiple mirror elements 81 of the first mirror array 80 p,q Each beam is reflected by the other, becoming multiple parallel beams that illuminate a larger area surrounding the selected aperture of the mask M via the second partial illumination optical system 82. The multiple beams that enter the focusing optical system 530 through the aperture of the mask M are focused by the focusing optical system 530 onto the image plane and incident on the aperture 92a located on or near the image plane.

[0131] Light passing through aperture 92a is focused by a relay optical system consisting of the first optical system 94 and lens 98 onto the optical conjugate surface of the measuring member 92, i.e., the light-receiving surface of the CCD 96a. Therefore, the intensity distribution on the light-receiving surface of the CCD 96a becomes the intensity distribution of the beam within the upper surface of the measuring member 92. The CCD 96a receives the beam with this intensity distribution, and the received data LRD1 obtained by photoelectric conversion is transmitted from the photodetector 96 (electrical circuit 96b) to the control device 600 (see Figure 14).

[0132] Therefore, the control device 600 acquires the light-receiving data LRD1 while stepping the table 12 in the Z-axis direction via the telescopic mechanisms 161 to 166 based on the measured values ​​of the linear encoders 241 to 246, and based on the acquired light-receiving data LRD1, it finds the Z-axis position in which the area of ​​the beam-irradiated region formed on the light-receiving surface of the CCD 96a is minimized. The area of ​​the beam-irradiated region formed on the light-receiving surface of the CCD 96a is minimized when the upper surface of the measuring member 92 coincides with the image plane of the focusing optical system 530, and the sharpest beam-irradiated region is formed within the aperture 92a. Accordingly, based on the light-receiving data LRD1 from the light receiver 96, the control device 600 can determine that the Z position of the table 12 in which the number of pixels that receive the beam is minimized is the Z position in which the upper surface of the measuring member 92 coincides with the image plane. In this embodiment, since the image plane is the processing plane MP, the control device 600 can determine the beam intensity distribution (shape, size, position, etc. of the beam irradiation area) on the processing plane MP based on the light-receiving data LRD1 at its Z position. In this embodiment, the control device 600 can determine the three-dimensional beam intensity distribution between the image plane (processing plane MP) and the nearby (+Z side) plane (the aforementioned virtual plane) based on the light-receiving data LRD1 acquired at each step position in the Z-axis direction during the process of determining the Z position of the table 12 where the upper surface of the measurement member 92 and the image plane coincide. Determining the three-dimensional beam intensity distribution can also be said to determine the shape of the optical cutting tool. Therefore, if the three-dimensional beam intensity distribution (for example, the cross-sectional intensity distribution on the +Z side plane near the image plane) differs from the desired state, the control device 600 can, for example, adjust the multiple mirror elements 81 of the second mirror array 78.i,j By adjusting at least some of the angles, the three-dimensional intensity distribution of the beam is adjusted to the desired state. Adjusting the three-dimensional intensity distribution of the beam can also be described as adjusting the shape of the optical blade.

[0133] Furthermore, the control device 600 can also adjust the beam intensity distribution (shape, size, position, etc. of the beam irradiation area) on the processing surface MP to a desired state by considering only the measurement results of the beam intensity distribution on the image plane (processing surface MP) without considering the three-dimensional intensity distribution of the beam. Furthermore, since the first mirror array 80 is positioned conjugate to or near the pupil plane PP2 of the focusing optical system 530, the mirror element 81 i,j The three-dimensional intensity distribution of the beam may be adjusted by adjusting at least some of its angles.

[0134] Furthermore, if the beam intensity distribution on the image plane (processing surface MP) of the focusing optical system 530 differs from the desired state, the control device 600 adjusts the position of the mask M (aperture) and adjusts the multiple mirror elements 81 of the second mirror array 78. i,j Perform at least one of the angle adjustments of at least a portion of it.

[0135] Furthermore, the mask M (aperture) may be deformed to change the beam intensity distribution on the image plane (processed surface MP) of the focusing optical system 530. In addition, the focusing optical system 530 may be adjusted (for example, by moving some of the optical elements of the focusing optical system 530) to change the size of the aperture image or to distort the aperture image.

[0136] Furthermore, when the upper surface of the measuring element 92 coincides with the image plane of the focusing optical system 530, the position of the beam irradiation area on the processed surface MP (image plane of the focusing optical system 530) on the table coordinate system can be determined from the beam intensity distribution on the light-receiving surface of the CCD 96a and the positional relationship with one or more reference pixels.

[0137] In this embodiment, the control device 600 measures at least one of the beam intensity distribution (shape, size, position, etc. of the beam irradiation area) on the processing surface MP and the beam intensity distribution on the nearby surface, and then measures the beam intensity distribution on the pupil (entry pupil) PP2 of the focusing optical system 530, which will be described next. Note that the measurement of the beam intensity distribution on the pupil PP2 may be performed before the measurement of the beam intensity distribution on the image plane (processing surface MP). Furthermore, the measurement of the beam intensity distribution on the pupil PP2 and the measurement of the beam intensity distribution on the image plane (processing surface MP) do not have to be performed consecutively.

[0138] The beam intensity distribution at the pupil (entry pupil) of the focusing optical system 530 is measured, for example, as follows:

[0139] After the measurement of the beam intensity distribution on the processing surface MP described above is completed, the control device 600 rotates the rotating plate 101 via the drive device 102 while maintaining the position of the table 12 so that the upper surface of the measuring member 92 (the surface forming the aperture 92a) is on the optical axis AX of the focusing optical system 530 and at the same height as the processing surface MP, thereby positioning the aperture 97 on the optical path of the beam through the aperture 92a and the first optical system 94. In this state, the beam intensity distribution at the pupil plane PP2 is measured. The measurement of the beam intensity distribution at the pupil plane PP2 of the focusing optical system 530 can also be said to be the measurement of the cross-sectional shape of the beam at the pupil plane PP2. Furthermore, since the pupil plane PP1 of the illumination optical system 520 is conjugate to the pupil plane PP2 of the focusing optical system 530, the measurement of the intensity distribution at pupil plane PP2 can also be said to be the measurement of the intensity distribution at pupil plane PP1. The measurement of the intensity distribution at pupil plane PP1 of the illumination optical system 520 can also be said to be the measurement of the cross-sectional shape (illumination shape) of the beam at pupil plane PP1.

[0140] Figure 13(B) shows the optical arrangement when measuring the beam intensity distribution at the pupil plane, unfolded along the optical axis AX1 of the measuring device 110 and the optical axis AX of the focusing optical system 530 (however, the portion upstream of the focusing optical system 530 is omitted from the illustration). As shown in Figure 13(B), in this state, since the aperture 97 is located in the optical path of the beam, the parallel light passing through the first optical system 94 is directly incident on the CCD 96a that constitutes the photodetector 96. In this case, the photodetector surface of the CCD 96a can be considered to be located in a position conjugate to the pupil plane of the focusing optical system 530, and it is possible to receive the light beam corresponding to the beam intensity distribution at the pupil plane. The control device 600 then takes in the photodetector 96's received data (referred to as LRD2, see Figure 14) and determines the beam intensity distribution at the pupil plane based on the received data LRD2. The control device then stores the determined intensity distribution data in memory.

[0141] Based on the measurement results of the beam intensity distribution at the pupil plane, the control device 600, for example, controls multiple mirror elements 81 of the second mirror array 78. i.j At least a portion of the angles can be adjusted. The beam intensity distribution at the image plane (processing surface MP) and the beam intensity distribution at the pupil plane PP2 may be considered as the three-dimensional beam intensity distribution. That is, the three-dimensional beam intensity distribution (shape of the optical cutting tool) can be determined from the beam intensity distribution at the image plane (processing surface MP) and the beam intensity distribution at the pupil plane PP2 measured using the measuring device 110, and based on the result, at least a portion of the angles of at least one of the first mirror array 80 and the second mirror array 78 can be adjusted.

[0142] Returning to Figure 1, the control device 600 includes a higher-level system linkage unit 620 connected online to a higher-level system including a host computer via, for example, a local area network (LAN), and a recipe creation unit 630. The higher-level system linkage unit 620 acquires CAD data of the workpiece before and after processing from the higher-level system online based on the operator's instructions. The recipe creation unit 630 creates recipe data (control information for each part of the processing device 100 during processing, which instructs a series of procedures) for use in processing by the processing device 100, based on the CAD data of the workpiece before and after processing acquired by the higher-level system linkage unit 620. In other words, with the processing device 100, the operator can acquire a recipe for use in processing by the processing device 100 simply by instructing the creation of recipe data (hereinafter abbreviated as "recipe" as appropriate).

[0143] Figure 14 shows a block diagram illustrating the input / output relationships of the control device 600, which forms the central control system of the processing apparatus 100. The control device 600 includes a workstation (or microcomputer), etc., and provides comprehensive control of all components of the processing apparatus 100.

[0144] The processing apparatus 100 according to this embodiment, configured as described above, can perform various processes on a workpiece using a beam from the focusing optical system 530, such as removal processing to remove a part of the workpiece and cutting processing to cut the workpiece. The workpiece is fed into the processing apparatus 100 and discharged from the processing apparatus 100 after processing. The series of operations performed by the processing apparatus 100 are automated, and workpieces can be supplied in lot units, with a fixed amount grouped on a pallet considered as one lot.

[0145] Figure 15 shows a flowchart corresponding to a series of processing algorithms of the control device 600. Each step in the following flowchart (including decision-making) is performed by the control device 600; however, unless specifically required, further explanation of the control device 600 will be omitted below.

[0146] As a prerequisite, it is assumed that, in response to the operator's instructions for creating a recipe, at least one recipe has already been created by the higher-level system linkage unit 620 and the recipe creation unit 630 of the control device 600, and is stored as a recipe database in a storage device (not shown). When the operator instructs the control device 600 to select a desired recipe, processing according to the flowchart in Figure 15 begins.

[0147] First, in step S2, the count value n of the counter indicating the work number within the lot is initialized (n ← 1).

[0148] In the next step S4, a pallet (not shown) loaded with one lot of workpieces before processing is brought in from the outside to a predetermined loading / unloading position inside the processing device 100. This loading is performed by a loading / unloading device (not shown) according to instructions from the control device 600. Here, one lot is, for example, i × j pieces, and the i × j workpieces are loaded on the pallet in an i x j matrix arrangement. That is, the loading positions (placement positions) of the workpieces are defined on the top surface of the pallet in an i x j matrix arrangement, and workpieces are loaded (placed) at each loading position. For example, each loading position is marked, and the position of each mark on the pallet is known. In the following, one lot is assumed to be 4 × 5 = 20 pieces as an example, and the top surface of the pallet is marked in a 4 x 5 matrix arrangement, with workpieces loaded on top of each mark. For example, the first to fifth workpieces in a lot are positioned in rows 1 to 15, the sixth to tenth workpieces are positioned in rows 2 to 25, the eleventh to fifteenth workpieces are positioned in rows 3 to 35, and the sixteenth to twentyth workpieces are positioned in rows 4 to 45.

[0149] In the next step, S6, the nth workpiece in the lot is removed from the pallet and placed on the table 12. At this time, the first stage system 200A is assumed to be in a loading / unloading position set near the location where the transport system 300 within the processing device 100 is installed. Also, at this time, the table 12 is in the aforementioned reference state (Z, θx, θy, θz) = (Z0, 0, 0, 0), and its XY position matches the X, Y position of the slider 10 measured by the position measurement system 28.

[0150] Specifically, the control device 600 refers to the count value n to identify the position (i,j) of the workpiece to be picked up on the pallet, and instructs the transport system 300 to pick up the workpiece at the identified position (ij). In response to this instruction, the transport system 300 picks up the workpiece from the pallet and places it on the table 12. For example, if n=1, the workpiece located in the first row and first column on the pallet is picked up and placed on the table 12.

[0151] Next, in step S7, the table 12 on which the workpiece is mounted is moved below the measurement system 400 (sensor unit 38). This movement of the table 12 is performed by the control device 600 controlling the planar motor 26 based on the measurement information of the position measurement system 28 to move the first stage system 200A on the base BS in the X-axis direction (and Y-axis direction). During this movement, the table 12 maintains the aforementioned reference state.

[0152] In the next step, S8, the measurement system 400 is used to measure the positional information (in this embodiment, 3D shape information) of at least a portion of the target surface on the workpiece mounted on the table 12 in a reference state within three-dimensional space. From this point onward, based on these measurement results, the position of the target surface on the workpiece in the six degrees of freedom directions can be managed by open-loop control on the table coordinate system (reference coordinate system).

[0153] In the next step S9, the table 12, on which the workpiece for which the positional information (shape information) of at least a portion of the target surface has been measured, is moved below the beam irradiation system 500 in the same manner as the downward movement of the measurement system 400 described above.

[0154] In the next step, subroutine S10, machining is performed on the workpiece on table 12 according to the recipe. For the sake of simplicity, it is assumed that the same machining mode is specified only once for the same recipe.

[0155] In the subroutine of step S10, as shown in Figure 16, first, in step S102, predetermined settings corresponding to the next processing mode specified in the selected recipe (however, for the first time, the first processing mode will be used) are made, namely the setting of the illumination shape and the selection setting of the opening on the mask M. Here, it is assumed that one of the modes 1 to 6 mentioned above has been selected. For example, if mode 1 is selected first, normal illumination is set as the illumination shape, and the opening specified in the recipe is selected. As an example, a slit-shaped opening PAa is selected.

[0156] In the next step, S104, the three-dimensional intensity distribution of the beam (shape of the optical cutting tool) on and near the processing surface MP is measured according to the procedure described above, and adjustments are made based on the measurement results. These adjustments include, for example, adjusting the angles of at least some of the mirror elements of the first mirror array 80, adjusting the angles of at least some of the mirror elements of the second mirror array 78, adjusting the focusing optical system 530 (including adjustments to the position and tilt of some of the lenses), and adjusting the position of the mask M (aperture). It goes without saying that adjustments based on the measurement of the three-dimensional intensity distribution of the beam (shape of the optical cutting tool) are performed only when necessary. Furthermore, the position of the processing surface MP may be determined based on the measurement results in step S104, and the positional relationship between the processing surface MP and the table 12 may also be determined.

[0157] In the next step, S106, the beam intensity distribution at the pupil plane PP2 of the focusing optical system 530 is measured (which can also be described as the illumination shape), and adjustments are made based on the measurement results. These adjustments include, for example, adjusting the angles of at least some of the mirror elements of the first mirror array 80, and adjusting the angles of at least some of the mirror arrays of the second mirror array 78. In this case as well, it goes without saying that the adjustments based on the measurement results of the beam intensity distribution at the pupil plane PP2 are performed only when necessary. In this way, the necessary preparatory work is completed. Note that at least one of steps S104 and S106 may be omitted.

[0158] In the next step S108, the first stage system 200A and the beam irradiation system 500 are controlled to perform machining on the workpiece W. Machining of the workpiece (for example, surface removal using a Mode 1 optical cutting tool in Mode 1) is performed according to the recipe, while the table 12 is scanned in the scanning direction relative to the beam. The relative movement speed between the workpiece and the beam (in this case, the movement speed of the table 12) is controlled by the control device 600. This relative speed may be determined based on the material of the workpiece W, the type of machining, etc. Alternatively, the relative movement speed may be determined according to the intensity distribution (intensity) on the machining surface MP measured earlier. Here, the control of the position and orientation of the target surface (and target area) on the workpiece during machining is performed considering the position information of the target surface (shape information in this embodiment) measured earlier using the measurement system 400. For example, the position information (shape information) of the target surface TAS (see Figure 9(A)) of the workpiece W acquired using the measurement system 400 is used to move the target area TA (see Figure 9(A)) on the target surface TAS of the workpiece W and the beam irradiation area on the processing surface MP in a desired positional relationship.

[0159] In the next step, S110, it is determined whether there are any remaining modes specified by the recipe that have not yet been completed. If this determination is denied, i.e., if there are remaining modes that have not yet been completed, the process returns to step S102. From there, the loop processing (including the determination) of steps S102→S104→S106→S108→S110 is repeated until the determination in step S110 is made. This ensures that the workpiece is processed sequentially according to the recipe in all processing modes specified by the recipe. Once all processing specified by the recipe is completed, the determination in step S110 is affirmed, and the process returns to step S12 of the main routine. Note that even if the determination in step S110 is denied, at least one of steps S104 and S106 after step S102 may be omitted.

[0160] Incidentally, it is conceivable that a workpiece W may be used in which a workpiece placed on the table 12 has an inclined surface that is tilted at a predetermined angle with respect to the upper surface of the table 12 (for example, a surface parallel to the XY plane), and that it is necessary to perform a removal process, for example, on that inclined surface. However, the processing apparatus 100 according to this embodiment is equipped with a first stage system 200A that can arbitrarily set the position of the table 12 on which the workpiece is mounted in the six degrees of freedom directions. In such a case, the control device 600 can easily align the target surface (inclined surface) of the workpiece with the processing surface MP by controlling the first stage system 200A based on the three-dimensional shape of the workpiece measured using the measurement system 400. Naturally, it is also easy to form the aforementioned inclined surface on a workpiece of any shape placed on the table 12.

[0161] In step S12, the table 12 on which the machined workpiece is mounted is moved to the aforementioned loading / unloading position.

[0162] In the next step, S14, the nth workpiece in the processed lot, which is loaded on the table 12, is returned to the pallet. Specifically, the control device 600 refers to the count value n to determine its position on the pallet and instructs the transport system 300 to return the workpiece to the specified position on the pallet. In response to this instruction, the transport system 300 removes the processed workpiece from the table 12 and returns it to the specified position on the pallet.

[0163] Once the process in step S14 is executed, the process moves to step S16. At this point, there are no workpieces on table 12. In step S16, the counter value n is incremented by 1 (n ← n+1).

[0164] In the next step, S18, it is determined whether the count value n exceeds N (where N is the number of workpieces in one lot; in this embodiment, N=20). If the determination in step S18 is negative, that is, if there are workpieces in the lot that have not yet been processed, the process returns to step S6, and steps S6 to S18 (including the determination) are repeated until the determination in step S18 is confirmed. This ensures that the above-described series of processes (including the determination) are performed on the second and subsequent workpieces in the lot. Once all workpieces in the lot have been processed and the determination in step S18 is confirmed, the process proceeds to step S20, where an unloading / unloading device (not shown) is instructed to unload the pallet containing the processed workpieces from the device, and then the series of processes in this routine ends.

[0165] In the subroutine of step S10 described above, the measurement of the beam intensity distribution at the pupil plane is performed after the measurement of the three-dimensional beam intensity distribution. However, this is not limited to this, and the measurement of the beam intensity distribution at the pupil plane may be performed before the measurement of the beam intensity distribution at the image plane (machined surface MP). Furthermore, the measurement of the three-dimensional beam intensity distribution and the measurement of the beam intensity distribution at the pupil plane do not have to be performed consecutively. Also, the frequency of measurement of the three-dimensional beam intensity distribution and the frequency of measurement of the beam intensity distribution at the image plane (machined surface MP) may differ.

[0166] Furthermore, if, as a result of adjustments based on the measurement results of the beam intensity distribution at the pupil plane described above, there is a risk that at least one of the beam intensity distribution at the processing surface MP (image plane) or the three-dimensional beam intensity distribution may change, the control device 600 may measure the beam intensity distribution and the three-dimensional intensity distribution at the processing surface MP again, or make adjustments based on the results.

[0167] Furthermore, although steps S104 and S106 described above are performed each time a mode is set, regardless of which of modes 1 to 6 is set, the process is not limited to this, and steps S104 and S106 may be performed only for some of the modes from modes 1 to 6.

[0168] In the above explanation, after the processing of the workpiece W is completed, the table 12 on which the processed workpiece W is mounted is moved to the loading / unloading position in order to return the processed workpiece to the pallet. However, after the processing of the workpiece is completed, the table 12 on which the processed workpiece W is mounted may be moved below the measuring system 400, and the shape of the workpiece on the table 12 may be inspected using the 3D measuring machine 401 of the measuring system 400. For example, the dimensional error of the processed part may be determined based on the measured shape information (a type of 3D position information). In this case, the dimensional error may be used to further determine whether the processing is acceptable or unacceptable. Among the workpieces that are determined to be unacceptable as a result of the acceptance / rejection determination, workpieces with a positive dimensional error (workpieces that can be corrected by removal processing, etc.) may have the necessary corrective processing performed by the beam irradiation system 500 while they are still mounted on the table 12 (held on the table 12 by the chuck mechanism 13) based on that dimensional error. Alternatively, after the machining of the workpiece is complete, the table 12 carrying the machined workpiece W may be moved below the measuring system 400, the shape of the workpiece on the table 12 may be inspected using the 3D measuring machine 401 of the measuring system 400, and regardless of the inspection result, the machined workpiece may be moved to the loading / unloading position to be returned to the pallet without performing any corrective machining. In this case, the shape inspection result data may be sent by the control device 600 to an external device, such as a higher-level device.

[0169] As described in detail above, according to the processing apparatus 100 and the processing method performed by the processing apparatus 100 according to this embodiment, the three-dimensional intensity distribution of the beam near the image plane on the exit side of the focusing optical system 530 can be changed by combining the cross-sectional intensity distribution of the beam at the pupil plane PP2 of the focusing optical system 530 (cross-sectional intensity distribution at the pupil plane of the illumination optical system 520 (illumination shape)) and the intensity distribution of the beam at the processing surface MP (image plane) (aperture on the mask M). In other words, the shape of the optical cutting tool can be changed. Therefore, as described earlier for modes 1 to 6, it is possible to process workpieces using optical cutting tools of various shapes. Modes 1 to 6 are just examples, and the processing apparatus 100 can be configured with a wide variety of processing modes. By adding types of apertures on the mask M or adding types of illumination shapes to be set, even more types of processing modes can be configured. In this case, the adjustment based on the measurement results described above may be performed representatively for one selected aperture for each mode, or it may be performed for each aperture.

[0170] Figure 17 shows the various processes that can be performed by the processing device 100, in correspondence with the conventional machine tools used to perform each process.

[0171] The processing equipment 100 can handle three main types of processing: material removal, heat treatment, and measurement. Of these, the main role of the processing equipment 100 is material removal, which changes the shape of the workpiece. This material removal can be classified into conventional processes such as surface cutting, surface grinding, cylindrical cutting, cylindrical grinding, drilling and cutting, drilling and grinding, surface polishing, cutting, engraving or marking of letters or patterns, transfer of free shapes using metal molds, and generation of fine shapes. Until now, the machine tools listed in the conventional machine tool column in Figure 17 have been used for each of these processes.

[0172] As described above, the processing apparatus 100 according to this embodiment can handle all types of processing on a workpiece, including surface processing (grinding, cutting, etc.), groove processing (cutting during groove formation, surface grinding after formation, etc.), cutting of arbitrary shapes, and formation of micro-processing patterns, all with a single unit. Furthermore, while there may be limitations on the depth that can be processed when machining holes, cylinders, and grooves, the processing apparatus 100 can perform each process with high precision. In particular, regarding the patterning of fine patterns such as biochip channels and microreactors, it is possible to perform processing that is on a different level from conventional machine tools in terms of the fineness of the line width that can be formed, the positional accuracy, and the degree of freedom of the pattern shape that can be formed. In addition, it is possible to generate fine shapes that were previously performed using low-end exposure equipment, etc., by direct processing of the workpiece without the need for development, etching, or layer division. It can also handle three-dimensional shapes. The processing apparatus 100 can also handle surface modification treatments such as heat treatment, and three-dimensional shape inspection of objects.

[0173] Although not shown in Figure 17, the beam from the focusing optical system 530 may also be used for joining processes such as welding, or for additive processing (3D fabrication) using the beam from the focusing optical system 530. In this case, the processing device 100 may be equipped with a device for supplying material for joining or additive processing to the vicinity of the image plane. If additive processing is possible, the additive processing may be performed on the surface of the workpiece after removal processing, or removal processing (processing to remove at least a part of the added portion) may be performed on the surface of the workpiece after additive processing. Furthermore, when performing joining or additive processing, the optimal combination of the beam intensity distribution at the pupil plane and the beam intensity distribution at the image plane (mask aperture) should be set.

[0174] Furthermore, the material of the workpiece processed by the processing device 100 may be metal or resin.

[0175] Furthermore, with the processing apparatus 100 according to this embodiment, the reaction force associated with processing is virtually nonexistent. Therefore, unlike machine tools such as machining centers where the fixed state of the workpiece directly affects processing accuracy and finish, there is no need to firmly fix the workpiece on the table 12. In addition, since the processing apparatus 100 is equipped with a measurement system 400, even if the workpiece is placed somewhat roughly on the table 12 by the transport system 300, the position relative to the coordinate system is later determined by the measurement system 400, so there is no problem. Because three-dimensional shape measurement (a form of three-dimensional alignment) is performed by this measurement system 400, a series of operations including loading the workpiece onto the table 12 and unloading the processed workpiece from the table 12 by the transport system 300 can be automated, enabling efficient production.

[0176] Furthermore, according to the processing apparatus 100 and the processing method performed by the processing apparatus 100 according to this embodiment, during processing of the workpiece, the position of the workpiece (table 12) relative to the beam is controlled based on the target position. However, in order to minimize positional errors relative to the target position due to the control response characteristics and control accuracy of the table 12, tracking control of the mask M (mask stage 15) relative to the workpiece W may be performed in at least one direction of the X, Y, and Z axes based on the position information of the table 12 and the measurement information of the mask stage position measurement system 19. This makes it possible to accurately control the relative positional relationship between the target area of ​​the workpiece W and the beam irradiation area through the aperture of the mask M. Therefore, submicron or finer processing can be achieved, for example, even if the position control accuracy of the table 12 is on the order of microns or higher.

[0177] Furthermore, according to the processing apparatus 100 of this embodiment, the light source system 510 of the beam irradiation system 500 combines multiple laser beams output from each of the multiple laser units 70 to form a large-diameter parallel beam, which is then emitted toward the illumination optical system 520. This makes it possible to increase the total power without damaging individual components such as lenses.

[0178] Furthermore, according to the processing apparatus 100 of this embodiment, during processing, a first mirror array 80 is used to form (set) an illumination field (illumination light irradiation area) in which the beam (illumination light) is irradiated only to a portion of the mask M containing the selected pattern. By concentrating the entire beam emitted from the light source system 510 onto the selected pattern portion, the loss of laser power is minimized. The beam that has passed through the selected aperture of the mask M is then irradiated onto the workpiece via a focusing optical system 530 consisting of a reduction projection lens with a large numerical aperture. Therefore, on the target surface of the workpiece, the field size can be expanded to about 1 mm while maintaining a high energy density, dramatically increasing the processing area per unit time compared to conventional laser processing apparatuses that use a spot beam with a diameter of about 10 μm. In addition, by employing a short-wavelength pulsed laser, it becomes possible to generate a beam with a small spot size and high energy density on the target surface, thereby ensuring a high absorption rate by metals.

[0179] Furthermore, according to the processing apparatus 100 of this embodiment, there is no need to provide a robust chuck on the table 12 that can withstand reaction forces. Also, with the workpiece placed on the table 12, the shape of the workpiece can be measured by the measurement system 400, and the position of the workpiece can be controlled based on the measurement results, thus eliminating the need for jigs for determining the position of the workpiece, setup jigs, etc. In addition, with the processing apparatus 100, the control device 600 automatically generates a recipe from the CAD data of the workpiece before and after processing, so there is no need for an engineer to program to create a recipe in CAD based on drawings. Furthermore, during processing, the operator only needs to instruct the selection of an already created recipe, so there is no need for the operator to manually input the tool trajectory in front of the device.

[0180] According to the processing apparatus 100 and the processing method performed by the processing apparatus 100 of this embodiment, the three-dimensional shape of the target surface of the workpiece can be measured by the measurement system 400 while the workpiece remains mounted on the table 12 without being removed from the table 12. Based on the measurement results, it is possible to determine, for example, whether the shape after processing is acceptable or unacceptable (OK / NG). If the workpiece is unacceptable, it is possible to correct the workpiece using the beam irradiation system 500 while it remains mounted on the table 12, which is extremely efficient.

[0181] Furthermore, in the process of mass-producing parts, manufacturing parts and performing dimensional inspections on-site is extremely convenient for controlling quality. This is because the precision of the equipment is subject to drift due to various factors. By performing inspections on-site, the control device 600 can sense this drift tendency and provide feedback to the processing accuracy based on the results. In other words, the control device 600 can determine the drift tendency of the equipment during processing based on the position information (shape information) of the target surface of the workpiece acquired using the measurement system 400, and adjust at least one of the measurement system 400, the beam irradiation system 500, and the first stage system 200A according to the determined results. This makes it possible to suppress dimensional fluctuations and improve yield and quality variability.

[0182] Furthermore, the control device 600 may not only determine the drift tendency of the device during processing, but may also adjust at least one of the measurement system 400, the beam irradiation system 500, and the first stage system 200A based on positional information (shape information) of the target surface of the workpiece acquired using the measurement system 400. In this case, the workpiece includes both the workpiece after processing and the workpiece after corrective processing. Adjustment of the beam irradiation system also includes adjusting the beam intensity distribution on the processing surface MP.

[0183] Up to this point, we have described the case in which multiple beams are incident on the focusing optical system 530 via a mask M, and these multiple beams are focused onto the image plane (processing surface MP) by the focusing optical system 530 (forming an image of the aperture of the mask M on the image plane (processing surface MP)). However, in the processing apparatus 100, it is not always necessary to use a mask M.

[0184] The reason for this is that, as a method for setting or changing the beam intensity distribution on the processing surface MP (for example, by forming a slit-shaped illumination area on the processing surface MP as described above), the first mirror array 80 can control the beam focusing position or focusing area on the object surface of the focusing optical system 530.

[0185] Furthermore, the focusing optical system may be configured such that its pupil plane (entry pupil) and the front focal plane coincide, or such that its pupil plane (entry pupil) and the front focal plane are located in close proximity. In this case as well, without using a mask (aperture), for example, by using the first mirror array 80, the focusing position at the rear focal plane of each of the multiple parallel beams incident on the focusing optical system can be accurately and easily controlled by changing the incident angle of the multiple parallel beams incident on the focusing optical system. When using a focusing optical system with this configuration, the rear focal plane of the focusing optical system can be the machined surface MP. Even when using this type of focusing optical system, the beam intensity distribution at at least one of the following surfaces can be measured using the measuring device 110 described above: the rear focal plane (machined surface MP), a surface near the rear focal plane, the pupil plane, and a surface near the pupil plane.

[0186] Furthermore, in this embodiment, a slit-shaped or spot-shaped irradiation area is formed using only light passing through the same focusing optical system 530. Therefore, compared to the case where light from separate optical systems is focused into the same area to form a beam spot (laser spot), it is possible to form a higher quality beam spot.

[0187] Furthermore, in this embodiment, the control device 600 uses the aforementioned rotary encoder to detect the state of each mirror element (in this case, the tilt angle of the reflective surface), thereby monitoring the state of each mirror element in real time, and thus accurately controlling the tilt angle of the reflective surface of each mirror element in the mirror arrays 78 and 80.

[0188] In the processing apparatus 100 according to this embodiment, the control device 600 can use the measuring device 110 to measure the three-dimensional intensity distribution of the beam, the intensity distribution of the beam within the processing surface MP, etc., at appropriate intervals using the method described above, and perform necessary calibration. For example, the control device 600 can adjust the three-dimensional intensity distribution of the beam, the intensity distribution of the beam within the processing surface MP, etc., based on the measurement results using the measuring device 110.

[0189] Furthermore, the control device 600 may use the measuring device 110 to measure at least one of the beam intensity distribution within the processing surface MP and the beam intensity distribution on a surface different from the processing surface MP, for example, prior to processing the workpiece, and adjust at least one of the beam irradiation system 500 and the first stage system 200A during the processing based on the measurement results. The surface different from the processing surface MP (image surface) includes a surface near the processing surface MP (image surface) or the pupil surface (PP2).

[0190] In this case, a typical example of adjustment (control) of the first stage system 200A is the position control of table 12.

[0191] Furthermore, the adjustment (control) of the beam irradiation system 500 includes all of the various control contents of the beam irradiation system that were previously described as methods for setting or changing the beam intensity distribution on the processing surface, such as the shape, size, and position of the beam irradiation area formed on the processing surface.

[0192] Furthermore, if, for example, the beam intensity distribution on the processing surface MP cannot be measured at once with the light receiver 96 while the table 12 is stationary, such as when a mask M is not used and the beam irradiation area on the processing surface MP is wide, the beam intensity distribution on the processing surface MP is measured while the table 12 (the opening 92a of the measurement member 92) is moved in at least one direction in the X-axis direction and the Y-axis direction within the XY plane.

[0193] In this embodiment, the processing apparatus 100 has all the components of the measuring device 110 on the table 12. However, this is not limited to this configuration. As long as the optical conjugate relationship between the light-receiving surface of the CCD 96a and the forming surface of the aperture 92a of the measuring member 92, which functions as a light-receiving part, is maintained, the components of the measuring device 110 other than the measuring member 92 may be provided outside the table 12.

[0194] Furthermore, a movable member, similar to the measuring device 110 described above, which can move independently of the table 12, may be provided separately from the table 12. In this case, the movable member only needs to be movable in the three axes of X, Y, and Z, and the control device 600 may be configured to control (manage) the position of the movable member and the sensor on the table coordinate system. The control device 600 can use the sensor device to measure the beam intensity distribution as described above. In this case as well, the control device 600 may adjust at least one of the beam irradiation system 500 and the first stage system 200A described above during the processing based on the beam intensity distribution measured using the sensor device. In addition, the control device 600 can measure the beam intensity distribution as described above using the sensor device in parallel with measuring the workpiece on the table 12 using the measuring system 400.

[0195] As can be seen from the above explanation, the measuring device 110 can also be used as a uniformity sensor to detect uniformity (intensity distribution) of beam intensity within the irradiation area.

[0196] Alternatively, the measuring device 110 may be used to measure aberrations of the focusing optical system 530, such as wavefront aberration. For example, a microlens array may be arranged in a matrix in the empty area of ​​the rotating plate 101 shown in Figure 12, for example, in the area within the circle of the dashed line in Figure 12, in which multiple microlenses are arranged in a matrix to optically conjugate the surface of the aperture 92a and the light-receiving surface of the CCD 96a. In this case, by rotating the rotating plate 101 to position the microlens array on the optical path of the parallel light emitted from the first optical system 94, selecting the pinhole pattern of the mask M, and focusing the beam through the second partial illumination optical system 82 onto that pinhole pattern, it is also possible to configure a Shack-Hartmann type wavefront aberration measuring instrument capable of measuring the wavefront aberration of the focusing optical system 530. If a configuration capable of measuring wavefront aberration is adopted, even if the position of the image plane of the focusing optical system 530 changes, the position of the image plane of the focusing optical system 530 after the change can be measured from the wavefront aberration measurement results, and based on this, the position of the processed surface MP can be changed or the position of the upper surface of the measuring member 92 during the measurement process by the measuring device 110 can be adjusted. Furthermore, if a configuration capable of measuring wavefront aberration is adopted, the optical characteristics of the focusing optical system 530 may also be made adjustable. For example, the focusing optical system 530 may be composed of multiple lenses, and some of these lenses may be made capable of being driven in the direction of the optical axis AX and in the tilt direction with respect to a plane perpendicular to the optical axis AX by a driving element such as a piezoelectric element. In such a case, the optical characteristics of the focusing optical system 530 can be adjusted by moving the movable lens in at least one of the directions of the axis AX and the tilt direction.

[0197] In addition, instead of the measuring device 110 described above, the aforementioned light receiver 96 may be placed on the upper surface of the table 12, as shown in Figure 18, such that the light-receiving surface of the CCD 96a is flush with (on the same plane as) the rest of the table 12, or conjugate to the rest of the table 12. The light receiver 96 may then be used to measure, for example, the beam intensity distribution on the processing surface MP. In this case as well, by enabling scan measurement to measure the beam intensity distribution while the table 12 is moving, not just when the table 12 is stationary, the influence of the finite number of pixels of the CCD and mirror array can be eliminated, and accurate measurement results can be obtained. In this way, by measuring the beam intensity distribution with a sensor that receives the beam from the focusing optical system 530, it becomes possible to manage the beam intensity distribution while taking into account fluctuating factors such as thermal aberration of the focusing optical system 530. Furthermore, by making adjustments based on the results, the beam intensity distribution on the processing surface MP (image plane, etc.) of the focusing optical system 530 can be set to the desired state with high accuracy.

[0198] Alternatively, as the measuring device 110, a slit-scanning type spatial image measuring device, such as the one disclosed in U.S. Patent Application Publication No. 2002 / 0041377, may be used.

[0199] As described above, the processing apparatus 100 according to this embodiment is characterized by its numerous advantages and solutions that meet the demands of actual parts manufacturing sites (processing sites) compared to conventional machine tools that use tools.

[0200] In the above embodiment, as an example, a case was described in which a fixed amount grouped on a pallet is considered one lot and the workpieces are processed in lot units. However, the invention is not limited to this, and the workpieces may be processed one by one. In this case, the transport system 300 loads the workpieces before processing, received from the external transport system, onto the table 12, and unloads the workpieces after processing from the table and passes them to the external transport system.

[0201] In the above embodiment, a case was described in which a transmissive mask having multiple openings is used as the mask M, but a reflective mask may be used instead.

[0202] Furthermore, in the above embodiment, the mask M was moved using the mask stage 15 so that the beam from the illumination optical system 520 irradiated at least one of the multiple apertures on the mask M. However, the first mirror array 80 may be used to control the irradiation of at least one of the multiple apertures on the mask M. In this case, the position of the mask M may be fixed or movable. In this case, by changing the aperture used for processing, the size and shape of the beam irradiation area on the image plane (processing surface MP) of the focusing optical system 530 can be changed. Therefore, the first mirror array 80 may be considered as part of a mechanism for changing the beam intensity distribution on the image plane (processing surface MP) of the focusing optical system 530.

[0203] Furthermore, when using multiple apertures on the mask M (for example, when forming multiple beam irradiation areas on the image plane (machining surface MP), in other words, when forming images of multiple apertures on the image plane (machining surface MP)), the beam may be irradiated only to a portion of the area containing the multiple apertures. In this case, the beam may be irradiated to multiple areas on the mask M that are far apart from each other.

[0204] In the above embodiment, a light source unit 60 that generates a beam with wavelengths in the visible to infrared region was used. However, instead, an ultraviolet light source such as an excimer laser that generates a beam with wavelengths in the ultraviolet region, or an X-ray light source that generates a beam with wavelengths in the extreme ultraviolet region, may be used.

[0205] In the above embodiment, the case in which the first and second mirror arrays 80 and 78 are used as spatial light modulators has been described. However, instead, a large-area digital mirror device consisting of a large number of Digital Micromirror Devices (DMD®) fabricated by MEMS technology arranged in a matrix may be used. In such a case, it becomes difficult to measure the state of each mirror element (e.g., tilt angle) with an encoder or the like. In such a case, a detection system may be used that irradiates the surface of the large-area digital mirror device with detection light, receives the reflected light from the numerous mirror elements constituting the digital mirror device, and detects the state of each mirror element based on the intensity distribution. In this case, the detection system may detect the state of each of the numerous mirror elements based on image information obtained by capturing an image formed by the digital mirror device with an imaging means. Furthermore, instead of the first and second mirror arrays 80 and 78, an adaptive mirror that can actively change the surface shape of the reflective surface may be used, or a transmission optical member that can locally and actively change the refractive index may be used.

[0206] Furthermore, although the above embodiment described a case in which the first mirror array 80 is placed at or near the pupil position of the illumination optical system 520, the first mirror array 80 may also be placed at or near a position conjugate to the illuminated surface of the illumination optical system (the surface on which the mask M is placed). Also, although the above embodiment described a case in which the second mirror array 78 is placed at or near a position conjugate to the illuminated surface of the illumination optical system (the surface on which the mask M is placed), the second mirror array may also be placed at or near the pupil position of the illumination optical system.

[0207] In the above embodiment, the case in which the optical path is bent by 90 degrees by the first and second mirror arrays 80 and 78 was described. However, the bending angle of the optical path by the first and second mirror arrays 80 and 78 is not limited to 90 degrees, and can be any angle such as 110 to 175 degrees (where the incident light and the emitted light form an acute angle of 5 to 80 degrees) or 5 to 80 degrees (where the incident light and the emitted light form an obtuse angle of 120 to 175 degrees).

[0208] In the above embodiment, a detector may be provided to detect the intensity of the beam from the light source unit 60. For example, a portion of the beam may be branched upstream of the focusing optical system 530, and the branched beam that does not enter the focusing optical system 530 may be received by the detector. For example, the intensity (energy) of the beam entering the focusing optical system 530 can be determined from the output of this detector, and the focusing position in the Z-axis direction of the beam toward the processing surface MP (position in the Z-axis direction of the image plane) may be estimated using the output from this detector. Then, the focusing optical system 530 may be controlled using the estimated result so that the focusing position (position in the Z-axis direction of the image plane) becomes a desired position.

[0209] In the processing apparatus 100 according to the above embodiment, for example, a rotary encoder 83 p,q In addition, a detection system 89, shown by dashed lines in Figure 14, may also be used. This detection system 89 irradiates the surface of the first mirror array 80 with detection light and detects a number of mirror elements 81 that constitute the first mirror array 80. p,q The reflected light from is received, and based on its intensity distribution, each mirror element 81 p,q A detection system can be used to detect the state of the rotary encoder 83. For example, a system with a configuration similar to that disclosed in U.S. Patent No. 8,456,624 can be used as the detection system. i,j In addition, the detection system 89 may be used.

[0210] Furthermore, in the above embodiment, each mirror element 81 i,j or 81 p,qThe examples given use mirror arrays 78 and 80 of the type in which the inclination angle of the reflective surface with respect to the reference plane can be changed. However, the examples are not limited to these, and a mirror array may be adopted in which each mirror element is tiltable with respect to the reference plane and displaceable in a direction perpendicular to the reference plane. Furthermore, each mirror element does not necessarily have to be tiltable with respect to the reference plane. Such a mirror array that is displaceable in a direction perpendicular to the reference plane is disclosed, for example, in U.S. Patent No. 8,456,624. In addition, a type of mirror array may be adopted in which each mirror element is rotatable around two mutually orthogonal axes parallel to the reference plane (i.e., the inclination angle in the two orthogonal directions can be changed). Such a mirror array in which the inclination angle in two orthogonal directions can be changed is disclosed, for example, in U.S. Patent No. 6,737,662. In these cases as well, the state of each mirror element can be detected using the detection system disclosed in U.S. Patent No. 8,456,624.

[0211] Furthermore, detection light is irradiated onto the surface of the mirror array 78 or 80, and the numerous mirror elements 81 that make up the mirror array 78 and 80 respectively i,j or 81 p,q A detection system that receives reflected light from the mirrors may be used. Alternatively, as a detection system, sensors that individually detect the tilt angle and spacing of each mirror element relative to the reference plane (base) may be provided on the mirror array (optical device).

[0212] Furthermore, it is not necessary for all of the incident angles of the multiple beams incident on the focusing optical system 530 to be controllable (changeable). Therefore, when using a mirror array as in the above embodiment, it is not necessary for all mirror elements to have their reflective surface state (at least one of the position and tilt angle of the reflective surface) changeable. Alternatively, the mirror array may allow the reflective surface state of multiple mirror elements to be changed individually, or it may allow it to be changed in groups. The former includes the case where the control device 600 changes the reflective surface state of the mirror array in groups.

[0213] Furthermore, instead of the mirror array in the above embodiment, a spatial light modulator (non-emissive image display element) described below may be used. Examples of transmissive spatial light modulators include electrochromic displays (ECDs) in addition to transmissive liquid crystal displays (LCDs). Examples of reflective spatial light modulators include reflective liquid crystal displays, electrophoretic displays (EPDs), electronic paper (or electronic ink), grating light valves, and diffractive optical elements, in addition to the micromirror arrays described above.

[0214] It goes without saying that in the above embodiment, the beam's cross-sectional intensity distribution may be a binary intensity distribution or a multi-value intensity distribution with three or more values. Furthermore, the beam intensity distribution, the beam's cross-sectional shape (e.g., illumination shape), etc., may be defined within a range that provides sufficient intensity for workpiece processing at that cross-section.

[0215] Furthermore, although the above embodiment described a case where the illuminance distribution of the beam irradiated onto the aperture on the mask M is uniform, the illuminance distribution of the beam irradiated onto the aperture on the mask M may be non-uniform.

[0216] Furthermore, as mentioned above, it is desirable for the focusing optical system 530 to have a large aperture, but a focusing optical system with a numerical aperture (NA) smaller than 0.5 may also be used. Alternatively, immersion machining may be performed, in which the space between the focusing optical system 530 and the workpiece is filled with liquid. In this case, the numerical aperture (NA) of the focusing optical system may be higher than 1.0. Also, the atmosphere between the focusing optical system 530 and the workpiece may be a vacuum.

[0217] Furthermore, in the above embodiment, instead of completely eliminating the aberration of the condensing optical system 530, a predetermined amount of aberration may remain.

[0218] In the above embodiment, as an example, a case was described in which the control device 600 controls each component of the first stage system 200A, the second stage system 200B, the transport system 300, the measurement system 400, and the beam irradiation system 500. However, the control device for the processing system may be composed of multiple hardware components, each including a processing unit such as a microprocessor. In this case, each of the first stage system 200A, the second stage system 200B, the transport system 300, the measurement system 400, and the beam irradiation system 500 may have its own processing unit, or it may be a combination of a first processing unit that controls at least two of the first stage system 200A, the second stage system 200B, the transport system 300, the measurement system 400, and the beam irradiation system 500, and a second processing unit that controls the remaining system, or it may be a combination of a first processing unit that controls two of the four systems, and second and third processing units that individually control the remaining two systems. In any case, each processing unit will be responsible for a part of the functions of the control device 600 described above. Alternatively, the control system for the processing system may be configured with multiple processing units, such as microprocessors, and a host computer that centrally manages these processing units.

[0219] Furthermore, the processing device 100 does not necessarily need to be equipped with a measurement system 400.

[0220] The multiple components of the above-described embodiment can be combined as appropriate. Therefore, some of the above-described multiple components may not be used. [Industrial applicability]

[0221] As described above, the processing apparatus and processing method according to the present invention are suitable for processing workpieces. [Explanation of symbols]

[0222] 10...Slider, 12...Table, 13...Chuck mechanism, 15...Mask stage, 161~166...Telescopic mechanism, 17...Mask stage drive system, 19...Mask stage position measurement system, 241~246...Linear encoder, 26...Planar motor, 28...Position measurement system, 62...Light guide fiber, 64...Double fly-eye optical system, 70...Laser unit, 78...Second mirror array, 80...First mirror array, 80 p,q ...mirror element, 83 p,q ...Rotary encoder, 89...Detection system, 92...Measurement component, 92a...Aperture, 100...Processing device, 96...Light receiver, 110...Measurement device, 200A...First stage system, 200B...Second stage system, 300...Transport system, 400...Measurement system, 401...3D measuring machine, 500...Beam irradiation system, 520...Illumination optical system, 530...Focusing optical system, 600...Control device, BS...Base, LB...Beam, M...Mask, MP...Processing surface, PAa~PAc...Aperture pattern, TA...Target area, W...Workpiece.

Claims

1. A mounting device on which the workpiece is placed, A beam irradiation system that irradiates the surface of the workpiece with a beam from a focusing optical system and removes at least a portion of the workpiece while scanning the beam and the workpiece relative to each other, A measuring device that receives a beam emitted from the aforementioned focusing optical system with a light receiving unit, A control device that controls the focusing position of the beam based on at least one of the following: the beam intensity measured by the measuring device, the material of the workpiece, and the relative scanning speed between the beam and the workpiece. Equipped with, The control device controls the focusing position to focus the beam at a focusing position that is shifted parallel to the direction from which the beam is irradiated, based on at least one of the intensity, the material of the workpiece, and the relative scanning speed between the beam and the workpiece.

2. The processing apparatus according to claim 1, wherein the surface of the workpiece is located between the focusing position and the beam irradiation system.

3. The processing apparatus according to claim 2, wherein the removal process is performed by aligning the surface of the workpiece after the removal process with the light-gathering position using the control device.

4. The processing apparatus according to any one of claims 1 to 3, wherein the control device controls the relative movement between the aforementioned mounting device and the irradiation position of the beam.

5. The processing apparatus according to claim 4, wherein the control device controls the relative movement by the movement of the previously described mounting device.

6. The processing apparatus according to claim 5, wherein the control device determines the light-gathering position based on the moving speed of the aforementioned device.

7. The processing apparatus according to any one of claims 1 to 6, wherein the control device determines the focusing position based on the properties of the beam.

8. The processing apparatus according to claim 7, wherein the properties of the beam include at least one of the intensity of the beam and the scanning speed of the beam.

9. The processing apparatus according to any one of claims 1 to 8, wherein the control device determines the focusing position based on the characteristics of the workpiece.

10. The processing apparatus according to any one of claims 1 to 9, wherein the focusing position is changed by the optical system of the beam irradiation system.

11. The processing apparatus according to any one of claims 1 to 10, wherein the mounting device comprises a mechanism for holding the workpiece.

12. The processing apparatus according to any one of claims 1 to 11, wherein the light receiving unit of the measuring device is provided in the above-described mounting device.

13. A machining method comprising irradiating a workpiece placed on a mounting device with a beam and machining the workpiece while scanning the beam and the workpiece relative to each other, Receiving the beam irradiated onto the aforementioned workpiece, Based on at least one of the following: the intensity of the beam, the material of the workpiece, and the relative scanning speed between the beam and the workpiece, the focusing position of the beam irradiating the workpiece is set to a position offset from the surface of the workpiece in the direction of beam irradiation. A processing method comprising irradiating the surface of the workpiece with the beam so as to focus it at the set focusing position, thereby removing at least a portion of the workpiece.

14. The above setting includes setting the focusing position to be located inside the workpiece, rather than on the surface of the workpiece before processing. The processing method according to claim 13.

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