Support device and adjustment method

Abstract

To provide a technology for easily and precisely adjusting a flatness of a mask support surface by a mask support body.SOLUTION: A support device is arranged in a chamber and supports a mask for film deposition. The support device has: a plate shaped first member connected to the chamber; a second member that is supported by the first member and has a mask support surface for supporting a mask; an adjustment tool that is inserted between the first member and the second member and adjusts a height of the mask support surface; and a control part for determining an insertion position of the adjustment tool and an adjustment amount of height adjusted by the adjustment tool inserted. The control part obtains a displacement magnitude measured at multiple positions of the second member, calculates a flatness of the second member based on the displacement magnitude, and determines an insertion position and an adjustment amount of the adjustment tool such that the flatness meets a predetermined standard.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a support device and an adjustment method. [Background technology]

[0002] Patent Document 1 describes a film deposition apparatus in which a film deposition material released from a film deposition source is deposited on a substrate supported by a substrate support, via a mask supported by a mask support. In the above film deposition apparatus, if the mask is distorted, it leads to a decrease in the degree of adhesion between the substrate and the mask, resulting in product defects.

[0003] With the increasing size of substrates in recent years, mask supports have also become larger, requiring considerable time and expense for machining to ensure flatness. Patent Document 1 provides a method for adjusting the flatness of a mask support that makes it possible to easily ensure the flatness of the mask support surface even with large mask supports. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2018-003144 [Overview of the project] [Problems that the invention aims to solve]

[0005] However, Patent Document 1 does not describe how to measure flatness or how to calculate the height adjustment amount for each position according to the flatness. As a result, multiple adjustments are required to adjust the mask support surface to the desired accuracy, which leads to the problem of prolonged flatness adjustment time.

[0006] The present invention has been made in view of the above problems, and its purpose is to provide a technique for accurately and easily adjusting the flatness of the mask support surface by a mask support. [Means for solving the problem]

[0007] This invention employs the following configuration: A support device positioned inside a chamber to support a mask for film deposition, A plate-shaped first member connected to the chamber, A second member is supported by the first member and has a mask support surface that supports the mask, An adjustment tool inserted between the first member and the second member to adjust the height of the mask support surface, A control unit that determines the insertion position of the adjusting device and the amount of height adjustment by the inserted adjusting device, It has, The control unit acquires the displacement amounts measured at multiple positions of the second member, calculates the flatness of the second member based on the displacement amounts, and determines the insertion position and adjustment amount of the adjuster so that the flatness meets a predetermined standard. This is a support device characterized by the following features.

[0008] The present invention also employs the following configuration: A method for adjusting a support device that is placed inside a chamber and supports a mask for film deposition, The support device comprises a plate-shaped first member connected to the chamber, a second member supported by the first member and having a mask support surface for supporting the mask, an adjustment tool inserted between the first member and the second member for adjusting the height of the mask support surface, and the insertion position of the adjustment tool. The device includes a control unit that determines the amount of height adjustment by the inserted adjustment device, The control unit performs the steps of obtaining displacement amounts measured at multiple positions of the second member and calculating the flatness of the second member based on the displacement amounts, The control unit performs the steps of determining the insertion position and adjustment amount of the adjuster so that the flatness satisfies a predetermined standard, This adjustment method is characterized by having [a certain feature]. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a technique for easily and accurately adjusting the flatness of the mask support surface by the mask support.

Brief Description of Drawings

[0010] [Figure 1] Schematic diagram of a part of an electronic device manufacturing apparatus [Figure 2] Schematic cross-sectional view of the inside of a film forming apparatus when film forming is performed [Figure 3] Schematic cross-sectional view of the inside of a film forming apparatus when alignment is performed [Figure 4] Exploded perspective view of a mask support [Figure 5] Explanation diagram regarding supply and discharge of a mask [Figure 6] Explanation diagram of a flatness measurement jig [Figure 7] Explanation diagram of the installation positions of a scale and a flatness measurement jig [Figure 8] Explanation diagram of the installation of a flatness measurement jig across a side [Figure 9] Explanation diagram of a correction coefficient curve of a height adjustment amount

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described in detail. However, the following embodiments are merely exemplary of preferred configurations of the present invention, and the scope of the present invention is not limited to those configurations. Also, in the following description, the hardware configuration, software configuration, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the apparatus are not intended to limit the scope of the present invention only to those, unless otherwise specifically described.

[0012] The present invention is suitable for film deposition apparatuses that form thin films of a film deposition material on the surface of an object to be deposited, such as a substrate, by sputtering or vapor deposition. In particular, it is suitable for supports that support planar members such as masks used in film deposition. More specifically, it is suitable for mask supports used in film deposition apparatuses that deposit films while rotating the mask, in order to accurately flatten the mask support surface. The present invention can be considered as a mask support, a mask support device, a mask support method, a method for adjusting a mask support device, etc. The present invention is applicable to any apparatus that requires flattening of the support surface that supports a planar member, and the planar member is not limited to a mask, but may be a substrate, etc. Therefore, the present invention can also be considered simply as a support, a support device, a support method, or an adjustment method.

[0013] The present invention can also be understood as a film deposition apparatus, a method for adjusting a film deposition apparatus, an electronic device manufacturing apparatus, or a method for adjusting the same. The present invention can also be understood as a program that causes a computer to execute the adjustment method, or a storage medium that stores the program. The storage medium may be a non-temporary storage medium that can be read by a computer.

[0014] The present invention is preferably applicable to a film deposition apparatus that forms a thin film with a desired pattern on the surface of a substrate to be processed. Any substrate material can be used, such as glass, resin, metal, or silicon. Any film deposition material can be used, such as organic materials or inorganic materials (metals, metal oxides). The substrate may include one on which one or more films have already been deposited. The technology of the present invention is typically applied to manufacturing apparatuses for electronic devices and optical components. In particular, it is applicable to organic EL displays equipped with organic EL elements, and organic EL displays using the same. This invention is suitable for organic electronic devices such as apparatus. The present invention can also be used in thin-film solar cells and organic CMOS image sensors.

[0015] [Examples] (Overall structure) Figure 1 is a schematic top view showing part of the configuration of an electronic device manufacturing apparatus. The manufacturing apparatus in Figure 1 is used, for example, to manufacture display panels for organic EL display devices for smartphones. An electronic device manufacturing apparatus generally has a plurality of deposition chambers 111, 112 and a transport chamber 110. A transport robot 119 is provided in the transport chamber 110 to hold and transport the substrate 7. The transport robot 119 is a robot with a structure in which a robot hand for holding the substrate is attached to a multi-joint arm, and it is used to load and unload the substrate 7 into each deposition chamber. Each deposition chamber 111, 112 is equipped with a deposition apparatus (also called a vapor deposition apparatus). A series of deposition processes, such as the transfer of the substrate 7 to the transport robot 119, adjustment of the relative position of the substrate 7 and the mask (alignment), fixing the substrate 7 onto the mask, and deposition (vapor deposition), are performed automatically by the deposition apparatus.

[0016] Figure 2 is a schematic cross-sectional view showing the configuration of the film deposition apparatus 100 arranged in the film deposition chamber. In the following description, we will use an XYZ Cartesian coordinate system in which the vertical direction is defined as the Z direction, and the directions perpendicular to the Z direction and mutually perpendicular are defined as the XY directions. During film deposition, the substrate and mask are fixed in a state parallel to the horizontal plane (XY plane). The short side of the substrate (the direction parallel to the short side) is defined as the X direction, and the long side (the direction parallel to the long side) is defined as the Y direction. The rotation angle around the Z axis is represented by θ.

[0017] In Figure 2, the film deposition apparatus 100 is equipped with a vacuum chamber 9. The vacuum chamber 9 is a vacuum chamber, and its interior is maintained in a reduced-pressure atmosphere such as a vacuum, or an inert gas atmosphere such as nitrogen gas. Inside the vacuum chamber 9 are a substrate support 8 that supports the substrate 7, a mask support 2 that supports the film deposition mask 1, and a film deposition source 6 (evaporation source). In this configuration, the film deposition source 6 at the bottom of the chamber releases the film deposition material upward and adheres it to the substrate 7 via the mask 1, but the direction of release of the film deposition material is not limited to this.

[0018] The film deposition source 6 has a structure in which a nozzle 6b is provided on a film deposition source body 6a. The film deposition source body 6a includes a crucible (film deposition source container) in which the film deposition material is stored, a heater, a shutter, a film deposition rate monitor, etc. The heater heats the film deposition material in the film deposition source container, causing the film deposition material to fly out from the nozzle 6b. As the film deposition material, any desired material can be used depending on the type of film to be formed, for example, a metallic material for forming a metallic film or an organic material for forming an organic film can be used.

[0019] The film deposition apparatus 100 has a control unit 170. The control unit 170 controls a series of alignment and film deposition processes, including loading and unloading the substrate 7 and mask 1 into and out of the vacuum chamber 9, aligning the substrate 7 and mask 1, and controlling the film deposition source 6 to control the film thickness according to the measurement value of the film deposition rate monitor. The control unit 170 can be configured by a computer having, for example, a processor, memory, storage, I / O, etc. In this case, the functions of the control unit 170 are realized by the processor executing a program stored in memory or storage. If the manufacturing line includes multiple film deposition apparatuses, a control unit 170 may be provided for each film deposition apparatus, or one control unit 170 may control multiple film deposition apparatuses.

[0020] The substrate support 8 receives the substrate 7, which has been brought in by the transport robot 119 from outside the vacuum chamber 9, and moves it to a predetermined position. Then, by moving the substrate 7 in-plane with the mask 1 and the substrate facing each other, fine positional adjustments (alignment) are made between the substrate 7 and the mask 1.

[0021] Figure 3 shows the state of the vacuum chamber 9 when the substrate support 8 receives the substrate 7. Here, true The alignment mechanism 20, positioned on the top surface of the vacuum chamber 9, is a mechanism that includes a base support 21, an alignment base 22, and a base drive unit 23. The alignment base 22 is fixed to the top surface of the vacuum chamber 9 by the base support 21. The base drive unit 23 adjusts the position of the substrate in the XY plane and in the Z direction via the connection 10 and the substrate support 8. In other words, the base drive unit 23 is a drive mechanism that includes an in-plane movement mechanism for moving the substrate 7 in the XY direction and a Z-movement mechanism for moving it up and down in the Z direction.

[0022] In Figure 3, the substrate 7 received from the transport robot 119 is supported by the substrate support 8. The alignment mechanism 20 moves the substrate 7 in the Z direction to face the mask 1, and then moves the substrate 7 in-plane so that the substrate mark and mask mark are in a predetermined positional relationship in the image captured by the camera (not shown). Once the alignment is complete, the substrate 7 is lowered and placed on the mask 1. After that, the substrate support 8 and the connecting part 10 are moved to a position where they do not obstruct the rotation of the mask 1. This results in the state shown in Figure 2.

[0023] (Structure of the mask support) The mask support 2 has a configuration comprising a first member 3, a second member 4 provided on the first member 3, and a height adjuster 5 provided between the first member 3 and the second member 4. The first member 3 is a plate-shaped member that supports the second member 4. The second member 4 is a plate-shaped member having a mask support surface that supports the mask 1. Here, at least one of the first member 3 and the second member 4 is composed of multiple members. In addition, the height of the surface (mask support surface) of the second member 4 is adjusted by the height adjuster 5. The mask support 2 can also be considered as a support device that supports a mask for film formation. Alternatively, the mask support 2 and the control unit 170 can be considered together as a support device.

[0024] In addition, the mask 1, like the substrate 7, can be loaded into and unloaded from the vacuum chamber 9, and after the film deposition process is completed on a predetermined number of substrates 7, the mask is replaced under the control of the control unit 170. When supplying the mask 1 into the vacuum chamber, the mask 1 loaded using a loading robot may be transported using a mask transport unit 108 connected to the connection unit 10, which will be described later.

[0025] A rotating shaft support 15 is fixed to the top surface of the vacuum chamber 9. A rotating shaft 12 and a rotating shaft drive unit 16 are connected to the rotating shaft support 15. The rotating shaft 12 is a shaft-shaped member and is connected to the rotating shaft support 15 in a manner that allows it to rotate about the rotation center line N. The rotating shaft drive unit 16 is a drive mechanism equipped with a motor or the like, which rotates the rotating shaft 12. A connecting member 11 is connected to the end of the rotating shaft 12. The connecting member 11 includes a rotating shaft connecting part 11a having surfaces in the XY direction that are connected to the rotating shaft 12, and a mask connecting part 11b having multiple shafts in the Z direction that are connected to the mask support 2.

[0026] The first member 3 of the mask support 2 is suspended from the top surface of the vacuum chamber 9 via a rotating shaft 12 and a connecting member 11. The second member 4 of the mask support 2 is supported by the first member 3 and also supports the mask 1. With this configuration, when the rotating shaft 12 rotates, the mask support 2 also rotates. As a result, the mask 1 and the substrate 7 on which it is placed also rotate. By performing film deposition while rotating the mask 1 using such a rotary deposition apparatus, it becomes possible to uniformly deposit a film on the substrate 7. Note that the method of fixing the first member 3 is not limited to suspension; it is sufficient if it is connected to the vacuum chamber 9 in a rotatable manner. For example, the mask support 2 may be installed on a rotating shaft protruding from the bottom surface of the chamber.

[0027] Thus, in the film deposition apparatus 100 of this embodiment, film deposition is performed while the mask support 2 is rotated. Therefore, each component of the mask support 2 and each component of the connecting member 11 are rotated during the process. The structure must be designed so as not to interfere with other components. Specifically, the rotational axis connecting portion 11a of the connecting member 11 is connected to only one of the two pairs of opposing sides included in the four sides of the first member 3 of the mask support 2. Hereafter, the side to which the rotational axis connecting portion 11a is connected will be called the connecting side, and the side to which the rotational axis connecting portion 11a is not connected will be called the unconnected side. Furthermore, in order to avoid interference with other components, the rotational axis connecting portion 11a is positioned only in the center of the connecting side, as shown in Figure 2. As a result, both ends of the first member 3 have a cantilever structure.

[0028] In other words, as shown in Figure 3, the first member 3 includes a double-ended support region 3f supported at both ends and a cantilever region 3g supported at only one end. The double-ended support region 3f is structurally stable and deforms little even when the weight of the mask 1 and substrate 7 is applied. However, the cantilever region 3g, which has one free end, is relatively easy to deform. If deformation occurs in the first member 3, deformation is also likely to occur in the second member 4 placed on top of it, leading to a decrease in the flatness of the mask support surface that supports the mask 1. In this embodiment, a roughly rectangular mask support 2 was used, but even if a mask support 2 of a shape other than rectangular is used, a cantilever structure may occur because the arrangement of the connecting member 11 is restricted to avoid interference when the mask is rotated.

[0029] The inventors considered the problems with the cantilevered mask support 2 described above. For example, in Patent Document 1, the first member 3 of the mask support has a structure in which both ends are suspended and supported from the top surface, so the stability of the first member 3 is generally high. Therefore, when a height adjuster 5 of height h is inserted between the first member 3 and the second member 4, the mask support surface of the second member 4 rises by the amount of height h. On the other hand, in this embodiment, the first member 3 of the mask support has a cantilevered region 3g. In such a configuration, when a height adjuster 5 of height h is inserted between the cantilevered region 3g and the second member 4, the force is divided into a force that pushes up the second member 4 and a force that pushes down the cantilevered region 3g, so the amount the mask support surface rises becomes less than the height h. Therefore, in this embodiment, it is necessary to make adjustments that take the cantilevered structure into account.

[0030] Figure 4 shows an exploded perspective view of the mask support 2 of this embodiment. The lower first member 3 is molded in the shape of a rectangular frame (picture frame). Alternatively, the first member 3 and the shafts of the mask connecting part 11b may be assembled to the first member 3, or the first member 3 and the mask connecting part 11b may be molded as a single integrated body. The upper second member 4 is composed of multiple members (partial members 4a to 4d). When the multiple partial members are combined to form the second member 4, the second member as a whole is a rectangular frame (picture frame) that is slightly smaller than the first member 3. The mask 1 of this embodiment has a structure in which a mask foil is stretched over a frame, and each partial member of the second member 4 supports each side of the mask frame.

[0031] In this embodiment, when the upper second member 4 is composed of multiple members, the height of each of the multiple members can be adjusted using the height adjustment device 5. In this embodiment, a thin plate-shaped shim is used as the height adjustment device 5. That is, the height of the multiple members of the second member 4 can be adjusted by using the presence or absence of shims and the difference in their thickness. In this embodiment, multiple height adjustment devices 5 can be applied to each of the partial members 4a to 4d. This allows the height to be adjusted at each position within each partial member. When adjusting the thickness of the shims at each position, the number of shims of the same thickness may be changed, or the thickness of the shims themselves may be changed.

[0032] This allows the mask 1 to be supported on the surface of multiple members whose heights have been finely adjusted separately, making it possible to support the mask 1 in a flat plane without distortion.

[0033] The second member 4 in this embodiment is composed of multiple plate-shaped sub-members for each side. The second member 4 in this embodiment includes sub-members 4a and 4c corresponding to two opposing long sides, and sub-members 4b and 4d corresponding to two opposing short sides.

[0034] As described above, the first member 3 is installed suspended inside the vacuum chamber 9 via a connecting member. The first member 3 is then stacked with the second member 4, and the height is adjusted using the height adjustment device 5. This height adjustment is typically performed during initial setup of the film deposition apparatus, periodic maintenance, and troubleshooting.

[0035] As shown in Figure 4, the partial members 4a and 4c, which correspond to the long side of the second member 4, are provided with notches 201. These notches 201 are positioned to avoid interference with the mask transport unit 108 when supplying and discharging the mask 1 onto the second member 4. That is, as shown in Figure 5(b), the mask transport unit 108 has a mask receiving surface 108a that receives the mask 1, and a receiving surface connecting part 108b that connects the mask receiving surface 108a to the connecting part 10. When the mask transport unit 108 receives the mask 1 that has been brought into the vacuum chamber 9 with the mask receiving surface 108a, it is supplied with a driving force in the Z direction via the receiving surface connecting part 108b and the connecting part 10, and places the mask 1 onto the second member 4. Figure 5(a) illustrates this process, where the mask receiving surface 108a moves downward while fitting into the notch 201, thereby transferring the mask 1 (shown as a dotted line in the figure), supported by the mask receiving surface 108a, to the second member 4. However, the mask supply means is not limited to this; for example, a transport mechanism that moves along a rail using rollers may be used. In that case, the notch 201 is not necessarily required.

[0036] In this embodiment, the second member 4 is composed of multiple sub-members. However, the present invention is not limited to this, and the first member 3 may be composed of multiple sub-members, or both the first member 3 and the second member 4 may be composed of multiple sub-members. At least one of the first member 3 and the second member 4 is composed of multiple members, and the mask 1 is supported on the surface of the second member 4 whose height is adjusted by the height adjuster 5.

[0037] (Flatness measurement jig) Referring to Figure 6, a method for measuring the flatness of the surface of the second member 4 using the flatness measuring jig 106 in this embodiment will be described. The flatness measuring jig 106 is a jig configured in which a spirit level 101 is sandwiched between a measuring plate 102 and a fixing plate 103, and the measuring plate 102 and the fixing plate 103 are connected by a fixing column 104. Lower members 105 are provided at two locations on the left and right of the lower part of the measuring plate 102. In this embodiment, a digital spirit level 101 is used.

[0038] A concave shape 107 is formed by the lower surface 102a of the measuring plate 102 and the sides 105a of each of the two lower members 105. The lower surface 102a and the two sides 105a together form a measuring surface. When using the flatness measuring jig 106, the measurement is performed while the measuring surface is in contact with the surface of the second member 4. The distance between the sides 105a of the lower members 105 is set to a measuring interval that matches the arrangement of the height adjuster 5, and in this embodiment, it is set to 140 mm.

[0039] (Flatness measurement method) The planarity of the second member 4 is confirmed by recording the value of the spirit level 101, which is attached to the flatness measuring jig 106, at predetermined measurement intervals. In Figure 7, the multiple planned installation positions 109 are the planned locations for installing the flatness measuring jig 106, and in this embodiment, they are provided at 140 mm intervals. First, a scale 125 is placed on the surface of the second member 4. Markings 125a are inscribed on the scale 125 at each measurement interval to serve as markers for the installation of the flatness measuring jig 106.

[0040] Next, the zero point of the spirit level 101 attached to the flatness measuring jig 106 is checked. Then, as shown in Figure 7, the flatness measuring jig 106 is placed at the installation location 109a, which is one of several planned installation locations 109 on the sub-member 4a corresponding to the long side of the second member 4 and is closer to the sub-member 4b corresponding to the short side of the second member 4. At this time, the mark of the scale 125 Using the King 125a makes installation easier. Then, record the value of the spirit level 101.

[0041] Next, the flatness measuring jig 106 is moved along the surface of the second member 4 so that it approaches the sub-member 4d corresponding to another short side of the second member 4. At this time, by using the marking 125a of the scale 125, it is easy to move it by the measurement interval. By sequentially moving the flatness measuring jig 106 along the markings and taking measurements, the entire sub-member 4a can be measured.

[0042] Furthermore, the flatness is measured in the same manner for the sub-members 4b to 4d. In this embodiment, measurements are taken at a total of 36 locations: 11 locations on sub-member 4a, 7 locations on sub-member 4b, 11 locations on sub-member 4c, and 7 locations on sub-member 4d.

[0043] To reduce measurement errors, it is preferable to measure the flatness of each side of the second member 4 twice at each location. If the difference between the first and second measurements is 0.05 mm or more, the measurement should be repeated only at the location where the error occurred. The value obtained after the remeasurement, when the measurement error is within 0.05 mm, should be recorded. For example, if the first measurement at a certain planned installation location 109 is 0.50 mm and the second measurement is 0.64 mm, the measurement should be repeated. If the third measurement is 0.64 mm, the second and third measurements should be used. On the other hand, if the third measurement is 0.48 mm, the first and third measurements should be used.

[0044] Once measurements of all sides of the second member 4 are completed, the measured flatness is evaluated as flatness using a spreadsheet program that automatically calculates flatness. The evaluation of flatness is performed by the control unit 170 or another computer. In this embodiment, flatness is a value that is uniquely determined for the entire second member 4 and indicates the flatness of the support surface of the mask 1. The adjustment amount indicates the degree of height adjustment required to make the support surface of the mask 1 have the desired flatness, and is indicated by the position and height at which adjustment by the height adjustment tool 5 is required. In this embodiment, the spreadsheet program has the calculation formula described in the flatness adjustment method pre-set, and by entering the measured values ​​into the measurement value input field, the flatness and adjustment amount can be calculated automatically. Once all the measurement values ​​for each side of the second member 4 are entered, the flatness is displayed in the flatness display field, and if the value displayed in the flatness display field has the desired accuracy, the adjustment is complete. If the desired accuracy is not achieved, the flatness adjustment described below is performed. In this way, the control unit 170 determines the insertion position of the adjustment tool and the amount of height adjustment by the inserted adjustment tool.

[0045] (Flatness adjustment method) In this embodiment, the feasibility of adjustment is determined based on the flatness calculated from the planar state of the sub-members 4a and 4c corresponding to the two long sides of the second member 4, and the sub-members 4b and 4d corresponding to the two short sides of the second member 4. If adjustment is necessary, the required number of height adjustment devices 5 are prepared based on the value displayed in the adjustment amount display field, and the adjustment is performed by inserting them between the first member 3 and the second member 4.

[0046] To calculate the adjustment amount of the height adjustment device 5, we will first explain how to calculate the flatness of the second member 4. In calculating the flatness, the displacement amount for each measurement position is calculated based on the values ​​obtained by measuring the surface of each sub-member 4a to 4d of the second member 4 with the flatness measuring jig 106. In this example, it is assumed that two measurements are obtained for each location, as described above. In the following explanation, the displacement amount D indicates the displacement amount at a certain measurement location, with D1 being the displacement amount at the first location and D being the displacement amount at the nth location. n Let's assume that the first measurement at the first location is M 11 , the second measurement was M 12Let the first measured value at the nth position be M n1 and the second measured value be M n2 . Also, let the measurement interval be G (mm).

[0047] At this time, the displacement amount D1 at the first position is calculated by the following formula (1). D1 = (M 11 + M 12 ) ÷ 2 × G …(1) Also, the displacement amount D n at the nth position is calculated by the following formula (2). D n = (M n1 + M n2 ) ÷ 2 × G + D n-1 …(2) By accumulating the displacement amounts for each measurement location, it becomes possible to obtain a value representing the displacement amount across the entire plane.

[0048] Here, the second member 4 is composed of a plurality of plate-like members for each side. Therefore, it is necessary to take into account the connection of the sides in the calculation of the displacement amount. Thus, in this embodiment, as shown in FIG. 8, an installation planned position 109c is provided in such a form as to straddle the adjacent partial members 4a and 4b of the second member 4. Thereby, it is possible to connect and measure between the long side portion and the short side portion with the flatness measurement jig 106. Similarly, installation planned positions 109d, 109e, and 109f are provided at the joints of the sides. Thereby, it is possible to measure the flatness of the entire second member 4 composed of a plurality of members.

[0049] Next, the displacement amount at each measurement position and a plane are calculated from the measurement positions using the least squares method (hereinafter referred to as the least squares plane). Then, the maximum value and the minimum value of the displacement amount with respect to the least squares plane as the reference plane are obtained, and the difference between the maximum value and the minimum value is calculated as the flatness. If the flatness satisfies a predetermined standard, the mask support surface is sufficiently flat, but if the flatness does not satisfy the standard, height adjustment is required.

[0050] (Calculation of adjustment amount) Next, we will explain how to calculate the adjustment amount for the height adjuster 5. In order to adjust the surface of the second member 4 from a state where the height adjuster 5 is not inserted between the first member 3 and the second member 4 to a state where the surface has the desired flatness, it is necessary to insert the height adjuster 5 at the lower points where the displacement is small, using the higher points where the displacement is large as a reference. Therefore, the difference between the displacement at the insertion point and the maximum value of the measurement data is calculated as the adjustment amount by the height adjuster 5. Note that the adjustment amount should be sufficient to bring the flatness to the required level.

[0051] If both ends of the mask support 2 are not cantilevered, the flatness of the second member 4 can be adjusted to the desired accuracy using only the adjustment amount obtained from the difference between the maximum and minimum values ​​of the measurement data. However, if both ends of the mask support 2 are cantilevered, inserting the height adjustment device 5 between the first member 3 and the second member 4 will deform not only the second member 4 but also the first member 3. In other words, when the height adjustment device 5 is inserted in the cantilevered region 3g, the surface of the second member 4 is lifted upward while the surface of the first member 3 is lowered, so the mask support surface does not rise to the desired position. Therefore, in a cantilevered mask, the flatness of the second member 4 cannot be adjusted to the desired accuracy using only the adjustment amount obtained from the difference with the maximum value of the measurement data.

[0052] In light of the above, in this embodiment, as shown in Figure 9, a correction coefficient is calculated from the stiffness value of the first member 3 and the stiffness value of the second member 4 for each position in which the height adjustment tool 5 is inserted, and a height adjustment tool 5 with a thickness obtained by multiplying the adjustment amount by the correction coefficient is prepared. The stiffness value described here is the force required to deform the member at the position in which the height adjustment tool 5 is inserted, and its unit is, for example, (N / m). Note that even for the same member, if the shape of the member changes (for example, if a notch 201 is provided in the middle), the calculated stiffness value will differ for each position in which the height adjustment tool 5 is inserted.

[0053] In this embodiment, the stiffness values ​​of the first member 3 and the second member 4 were calculated by simulation. Specifically, the simulation was performed using only members with constraints at the support or bolted-on points. A load was applied to the position where the height adjuster 5 is inserted, and the reaction force when the height adjuster 5 is sandwiched was represented. The stiffness value was calculated based on the ratio of the applied load to the displacement of the member at the point of load application. More preferably, the simulation should include the first member 3 and the second member 4, as well as structures that contribute to deformation, such as the support. Stiffness values ​​may be determined experimentally rather than through simulation. Furthermore, if there are predetermined values ​​specific to the device, such as those published by the manufacturer, these may be used.

[0054] The correction factor is calculated using the following formula (3), where A is the stiffness value of the first member 3 and B is the stiffness value of the second member 4. Correction factor = (A + B) ÷ B …(3)

[0055] In this embodiment, the mask support 2 has a cantilever structure, and the second member 4 has a notch 201 on its long side. Therefore, the rigidity value of the second member 4 decreases on the tip side of the notch 201. As a result, the correction coefficient curve is as shown in Figure 9. For example, at the height adjuster 5a on the tip side close to the notch 201, the rigidity values ​​between the first member 3 and the second member 4 become almost equal, so the correction coefficient approaches 2 (2.1 in this embodiment). Here, predetermined correction coefficients are shown in a graph, but they may also be shown numerically for each position of the height adjuster 5.

[0056] Next, based on the correction coefficient curve, a height adjustment tool 5 is prepared with a thickness obtained by multiplying the value displayed in the adjustment amount display column by the correction coefficient. The prepared height adjustment tool 5 is then inserted between the first member 3 and the second member 4 to perform the adjustment. Once the adjustment is complete, the flatness of the second member 4 is checked again using the flatness measuring jig 106, and if the desired accuracy is achieved, the adjustment is complete.

[0057] As described above, according to the present invention, in a mask support 2 that supports the mask 1 using a first member 3 and a second member 4, the flatness of the mask support surface can be easily measured, and the amount of height adjustment at each position to achieve the desired flatness can be calculated. Furthermore, by making at least one of the first member 3 and the second member 4 from multiple members, even if the overall structure is large, each member constituting the first member 3 or the second member 4 can be made small enough to be used in a commercially available small processing device. Therefore, it is possible to shorten the working time and reduce costs in flattening. In addition, by making fine adjustments using the height adjustment tool 5, even if there are some slightly uneven parts when the first member 3 and the second member 4 are overlapped, the surface of the second member 4 (mask support surface) can be flattened with high accuracy. In particular, in the present invention, even when the mask support has a cantilever structure, such as in a rotary film deposition apparatus, it is possible to correct the amount of height adjustment and achieve high-precision flattening. [Explanation of symbols]

[0058] 1: Mask, 2: Mask support, 3: First component, 4: Second component, 5: Height adjuster, 9: Vacuum chamber, 170: Control unit

Claims

1. A support device positioned inside a chamber to support a mask for film deposition, A plate-shaped first member connected to the chamber, A second member is supported by the first member and has a mask support surface that supports the mask, An adjustment tool inserted between the first member and the second member to adjust the height of the mask support surface, A control unit that determines the insertion position of the adjusting device and the amount of height adjustment by the inserted adjusting device, It has, The control unit acquires the displacement amounts measured at multiple positions of the second member, calculates the flatness of the second member based on the displacement amounts, and determines the insertion position and adjustment amount of the adjuster so that the flatness meets a predetermined standard. A support device characterized by the following features.

2. The control unit determines the adjustment amount based on the difference between the displacement at the insertion position and the maximum value among the displacements measured at multiple positions, and corrects the adjustment amount based on the stiffness values ​​of the first member and the second member at the insertion position. The support device according to feature 1.

3. The control unit corrects the adjustment amount based on a predetermined correction coefficient for each position, based on the rigidity values ​​of the first member and the second member. The support device according to feature 2.

4. The first member has a cantilevered region that is supported by a cantilever structure. The support device according to claim 2 or 3.

5. The support device is connected to the chamber by a rotating shaft, and in the chamber, the support device rotates while a film is deposited on the substrate via the mask. The support device according to feature 4.

6. The second member is provided with a notch. The support device according to claim 2 or 3.

7. The displacement amount obtained by the control unit is the displacement amount measured by a jig equipped with a spirit level while moving it to multiple positions on the surface of the second member. The support device according to any one of claims 1 to 3.

8. At least one of the first member and the second member is composed of multiple sub-members. The support device according to any one of claims 1 to 3.

9. A method for adjusting a support device that is placed inside a chamber and supports a mask for film deposition, The support device comprises a plate-shaped first member connected to the chamber, a second member supported by the first member and having a mask support surface for supporting the mask, an adjusting tool inserted between the first member and the second member for adjusting the height of the mask support surface, and a control unit that determines the insertion position of the adjusting tool and the amount of height adjustment by the inserted adjusting tool. The control unit performs the steps of obtaining displacement amounts measured at multiple positions of the second member and calculating the flatness of the second member based on the displacement amounts, The control unit performs the steps of determining the insertion position and adjustment amount of the adjuster so that the flatness satisfies a predetermined standard, A method of adjustment characterized by having the following features.

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