Filtration equipment and electronic equipment

Abstract

The embodiments of this application relate to the field of terminal device technology, and in particular to a filtering device and an electronic device. The embodiments of this application are intended to solve the problem of poor sealing of the housing body caused by particulate matter in water easily damaging the waterproof membrane. In the filtering device and electronic device provided in the embodiments, a first filter layer is disposed on the outside of the outer surface of the housing body, a second filter layer is disposed between the outer surface and the first filter layer, and both the first filter layer and the second filter layer cover the functional hole of the housing body. In this way, the first filter layer and the second filter layer can filter the water entering the functional hole and prevent impurities such as particulate matter in the water from entering the functional hole. In a deep water environment, impurities such as particulate matter can be prevented from damaging the waterproof membrane, and as a result, the waterproof performance of the electronic device in the deep water environment is improved. That is, the ability of the electronic device to withstand water pressure is improved, and the underwater usable depth of the electronic device is increased.

Description

Technical Field

[0001] This application claims priority to Chinese Patent Application No. 202210611368.6, titled "Filtering Device and Electronic Device", filed with the State Intellectual Property Office of China on May 31, 2022, and incorporates it herein by reference in its entirety.

[0002] Embodiments of this application relate to the field of terminal device technology, and more particularly, to filtering devices and electronic devices.

Background Art

[0003] An electronic device (e.g., a smartwatch or a mobile phone) typically has a microphone arranged to collect external sound waves using a microphone. Specifically, the electronic device further includes a housing body and a waterproof membrane. The housing body has functional holes penetrating through the housing body, and the microphone is arranged on the housing body, facing the functional holes, and the functional holes are sealed by the waterproof membrane. During operation, sound waves pass through the functional holes and the waterproof membrane and are received by the microphone. The waterproof membrane can prevent external water from entering the functional holes, thus achieving the sealing of the housing body.

[0004] However, in a deep-water environment, the water pressure is relatively high. In this case, particulate matter in the water is likely to damage the waterproof membrane, and poor sealing of the housing body is likely to occur.

Summary of the Invention

[0005] Embodiments of this application provide a filtering device and an electronic device for solving the problem of poor sealing of the housing body caused by the fact that particulate matter in the water is likely to damage the waterproof membrane.

[0006] According to one aspect, an embodiment of this application provides a filtering device configured to be arranged on an electronic device.

[0007] Electronic devices are The housing body includes a housing body having an inner surface and an outer surface opposite to the inner surface, and having functional holes that penetrate the inner surface and the outer surface.

[0008] The filtration device comprises a first filter layer located on the outer surface and covering the functional holes, the first filter layer having a plurality of first mesh holes spaced apart, The device includes a second filter layer located between the outer surface and the first filter layer, covering the functional holes, and having a plurality of second mesh holes spaced apart.

[0009] In a cross-section parallel to the first filter layer, the cross-sectional area of ​​the first mesh holes is larger than the cross-sectional area of ​​the second mesh holes.

[0010] In some embodiments, which may include the embodiments described above, there are a plurality of second filter layers, which are stacked and arranged such that, in a cross section parallel to the first filter layer, the cross-sectional area of ​​the second mesh holes of each second filter layer gradually increases along the direction away from the outer surface.

[0011] In some embodiments that may include the embodiments described above, the filtration device further, The first bonding layer is positioned between a second filter layer close to the first filter layer and the first filter layer, and between adjacent second filter layers, and includes a first bonding layer provided with a first through-hole that communicates with a functional hole.

[0012] In some embodiments that may include the embodiments described above, the filtration device further, The first support layer is positioned between the second filter layer and the outer surface and attached to the outer surface, and includes a second through-hole that communicates with the functional hole.

[0013] In some embodiments that may include the embodiments described above, the first filter layer is a rigid filter layer.

[0014] In some embodiments, which may include the embodiments described above, there are two second filter layers, which are stacked, with a first filter layer located between the two second filter layers, and in a cross section parallel to the first filter layer, the cross-sectional area of ​​the second mesh holes of each second filter layer gradually increases along the direction away from the outer surface.

[0015] In some embodiments that may include the embodiments described above, the filtration device further, The first bonding layer is disposed between the first filter layer and the second filter layer and includes a first through-hole that communicates with the functional hole.

[0016] In some embodiments that may include the embodiments described above, the filtration device further, The present invention includes a cover plate that covers the outer surface, in which a first filter layer and a second filter layer are positioned between the cover plate and the outer surface, and a third through-hole that communicates with a functional hole is provided.

[0017] The cover plate is connected to the housing body.

[0018] In some embodiments that may include the embodiments described above, the filtration device further, The second bonding layer is positioned between the cover plate and the first filter layer and includes a second bonding layer having a fourth through-hole that communicates with the functional hole.

[0019] In some embodiments, which may include the embodiments described above, a first groove is provided on the surface of the cover plate facing the housing body, and at least a portion of the first filter layer is housed in the first groove.

[0020] In some embodiments, which may include the embodiments described above, a second groove is provided on the outer surface, and at least a portion of the second filter layer is housed in the second groove.

[0021] In some embodiments that may include the above-described embodiments, the electronic device further includes a sound module disposed on the inner surface, and the sound module is disposed in the functional hole.

[0022] According to another aspect, an embodiment of this application further includes a housing body having an inner surface and an outer surface opposite to the inner surface, and the housing body is provided with a functional hole penetrating through the inner surface and the outer surface, a waterproof assembly disposed in the functional hole, and the waterproof assembly is configured to prevent liquid from passing through the functional hole, the above-described filtering device, and provides an electronic device including the above.

[0023] In some embodiments that may include the above-described embodiments, the waterproof assembly is disposed on the inner surface, and the waterproof assembly is a waterproof membrane, a third bonding layer, a second support layer, and a fourth bonding layer laminated and disposed along a direction away from the inner surface. A fifth through-hole is provided in the third bonding layer, and a sixth through-hole is provided in the fourth bonding layer. Both the fifth through-hole and the sixth through-hole communicate with the functional hole, and includes a waterproof membrane, a third bonding layer, a second support layer, and a fourth bonding layer.

[0024] A plurality of first holes are provided at intervals in a region of the second support layer facing the functional hole.

[0025] In some embodiments that may include the above-described embodiments, the waterproof assembly further includes a buffer layer provided on a side not facing the inner surface of the fourth bonding layer, and a seventh through-hole communicating with the functional hole is provided in the buffer layer.

[0026] In some embodiments that may include the above-described embodiments, the waterproof assembly further includes a fifth bonding layer disposed between the waterproof membrane and the inner surface, and the fifth bonding layer is provided with an eighth through-hole communicating with the functional hole.

[0027] In some embodiments that may include the embodiments described above, the waterproof assembly further includes: The third support layer is positioned on the inner surface and includes a accommodating channel that communicates with the functional hole.

[0028] The waterproof membrane is housed in a housing channel, with the edges of the waterproof membrane attached to the sidewall of the housing channel, and a gap exists between the waterproof membrane and the inner surface.

[0029] In some embodiments, which may include the embodiments described above, the second support layer is in contact with the surface of the third support layer on the side that does not face the inner surface.

[0030] In some embodiments that may include the embodiments described above, the third support layer includes a silicone layer.

[0031] In some embodiments, which may include the embodiments described above, the second support layer and the third support layer are integrally structured.

[0032] In some embodiments, which may include the embodiments described above, a seal ring is positioned between the third support layer and the housing body, and the seal ring is positioned to surround the functional hole.

[0033] In some embodiments that may include the embodiments described above, the waterproof assembly further includes: The auxiliary support layer is positioned between the third support layer and the inner surface, and includes a plurality of second holes spaced apart in the region of the auxiliary support layer facing the functional holes, with a gap between the waterproof membrane and the auxiliary support layer.

[0034] In some embodiments, which may include the embodiments described above, the auxiliary support layer and the third support layer are integrally structured.

[0035] In some embodiments, which may include the embodiments described above, a sixth bonding layer is positioned between a third support layer and a second support layer, a ninth through-hole is provided in the sixth bonding layer, the third bonding layer is located within the ninth through-hole, and the third bonding layer is bonded to the wall of the ninth through-hole.

[0036] In some embodiments that may include the embodiments described above, the waterproof assembly further includes: The protective layer is placed on the surface of the waterproof membrane facing the inner surface and includes via holes that communicate with functional pores.

[0037] In some embodiments, which may include the embodiments described above, a first accommodating groove is provided on the inner surface, and a waterproof assembly is placed in the first accommodating groove.

[0038] In some embodiments that may include the embodiments described above, the waterproof assembly is located on the outer surface, and the waterproof assembly is The third bonding layer, waterproof membrane, and protective layer are arranged in a stacked manner along a direction away from the outer surface, and a fifth through-hole communicating with a functional hole is provided in the third bonding layer, and a via hole directly opposite the functional hole is provided in the protective layer.

[0039] In some embodiments, which may include the embodiments described above, the waterproof assembly further includes a second support layer positioned between the third bonding layer and the outer surface, wherein a plurality of first holes are spaced apart in the region of the second support layer facing the functional holes.

[0040] In some embodiments, which may include the embodiments described above, a second housing groove is provided on the outer surface, and a waterproof assembly is placed in the second housing groove.

[0041] In some embodiments that may include the embodiments described above, the electronic device further includes a sound module disposed on the inner surface, the sound module being located in a functional hole.

[0042] In the filtration device and electronic equipment provided in the embodiments of this application, a first filter layer is disposed on the outer surface of a housing body, and a plurality of first mesh holes are provided in the first filter layer at intervals. A second filter layer is disposed between the outer surface and the first filter layer, and a plurality of second mesh holes are provided in the second filter layer at intervals, and both the first and second filter layers cover the functional holes of the housing body. Thus, the first and second filter layers filter the water entering the functional holes, preventing impurities such as particulate matter from entering the functional holes. In deep water environments, it is possible to prevent impurities such as particulate matter from damaging the waterproof membrane, and as a result, the waterproof performance of the electronic equipment in deep water environments is improved. That is, the ability of the electronic equipment to withstand water pressure is improved, and the usable depth of the electronic equipment underwater is increased. [Brief explanation of the drawing]

[0043] [Figure 1] This is a view of the back of the smartwatch. [Figure 2] This is a schematic diagram of the structure of a waterproof assembly in related technologies. [Figure 3] This is a schematic diagram 1 of the structure of an electronic device according to one embodiment of this application. [Figure 4] This is a schematic diagram 1 showing the connection between the first filter layer and the cover plate in a filtration device according to one embodiment of this application. [Figure 5] This is a magnified view of area A in Figure 4. [Figure 6] Figure 4 shows exploded views of the first and second filter layers. [Figure 7] This is a schematic diagram 2 of the structure of an electronic device according to one embodiment of this application. [Figure 8] This is a schematic diagram 2 of the connection between the first filter layer and the cover plate in a filtration device according to one embodiment of this application. [Figure 9] This is a magnified view of area B in Figure 8. [Figure 10] Figure 8 shows exploded views of the first and second filter layers. [Figure 11] This is a magnified view of area C in Figure 8. [Figure 12] This is a schematic diagram of the structure of a housing body in an electronic device according to one embodiment of this application. [Figure 13] This is a schematic diagram of a filtration device according to one embodiment of this application, in which a first filter layer is arranged between two second filter layers. [Figure 14] Figure 3 is a schematic diagram of the structure of an electronic device according to one embodiment of this application. [Figure 15] Figure 4 is a schematic diagram of the structure of an electronic device according to one embodiment of this application. [Figure 16] Figure 5 shows a schematic diagram of the structure of an electronic device according to one embodiment of this application. [Figure 17] Figure 6 shows a schematic diagram of the structure of an electronic device according to one embodiment of this application. [Figure 18] Figure 7 shows a schematic diagram of the structure of an electronic device according to one embodiment of this application. [Figure 19] Figure 8 shows a schematic diagram of the structure of an electronic device according to one embodiment of this application. [Explanation of symbols]

[0044] 10 Filtration device 101 First Filter Layer 102 Second Filter Layer 103 1st bonding layer 104 Second bonding layer 105 1st support layer 106 Cover Plate 1011 First Mesh Hole 1021 Second Mesh Hole 1031 First through hole 1041 Fourth through hole 1051 Second through hole 1061 Third through hole 1062 First groove 20 Housing Body 201 Inner self 202 Exterior 203 Functional holes 204 Adhesive storage groove 205 First storage groove 206 Second Groove 207 Second storage groove 2011 First Housing Wall 2021 Second Housing Wall 2051 Bottom of the first trench 2071 Bottom of the second trench 30 Waterproof Assembly 301 Waterproof Membrane 302 Third bonding layer 303 2nd support layer 304 4th bonding layer 305 Buffer Layer 306 5th bonding layer 307 Third support layer 308 Protective layer 3021 Fifth through hole 3023 6th bonding layer 3024 9th through hole 3031 First hole 3032 Auxiliary support layer 3033 Second hole 3034 7th bonding layer 3035 10th through hole 3041 Sixth through hole 3051 Seventh through hole 3061 8th Through Hole 3071 Access Channel 3072 Gap 3073 Seal Ring 3074 Ring groove 3081 Beer Hall 40 Sound Modules 401 Microphone 402 Speakers [Modes for carrying out the invention]

[0045] With the gradual development of terminal device technology, electronic devices such as mobile phones and smartwatches are widely used. To improve the performance of electronic devices, waterproof designs are often required. As shown in Figure 1, a smartwatch in the relevant technology includes a housing body 20, a microphone, and a waterproof assembly. A functional hole 203 is provided in the housing body 20, the microphone is positioned in the functional hole, and the waterproof assembly is configured to seal the functional hole 203 so as to prevent water from passing through while allowing sound waves to pass through.

[0046] Refer to Figure 2. The waterproof assembly 30 includes a waterproof membrane 301, a steel plate 310, and a foam 320 arranged in layers. Bonding layers 330 are placed between the waterproof membrane 301 and the housing body 20, between the waterproof membrane 301 and the steel plate 310, and between the steel plate 310 and the foam 320 to fix each film layer. Multiple holes are provided in the steel plate 310. Since the waterproof membrane 301 has a microporous structure, sound waves from the outside can pass through the microporous structure, sequentially through the holes and functional holes, and be received by the microphone. Water has surface tension, and it is difficult for water to pass through the microporous structure, and as a result, a seal is achieved between the housing body 20 and the outside. When electronic equipment is placed in water, the water pressure gradually increases as the water depth increases. In this case, impurities such as particulate matter in the water can damage the microporous structure, allowing water to pass through the waterproof membrane 301 and enter the housing, potentially causing a seal failure in the housing body 20 and a failure of the electronic equipment's waterproofing in a deep water environment.

[0047] To further clarify the purpose, technical solutions, and advantages of the embodiments of this application, the technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. It is obvious that the embodiments described are only a part of, and not all, of the embodiments of this application. All other embodiments that can be obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0048] Please refer to Figures 1 and 3. One embodiment of this application provides a filtration device 10 for use in an electronic device. The filtration device 10 is configured to be placed on an electronic device. For example, the electronic device may include a mobile phone, a smartwatch (as shown in Figure 1), a PC, a tablet computer, a VR, AR, or terminal device such as a headset. The electronic device is not limited to this embodiment.

[0049] The electronic device may include a housing body 20, which may be the housing of the electronic device, and which is positioned around a cavity and configured to house devices within the electronic device, such as a battery (not shown) and a circuit board (not shown). The housing body 20 has an inner surface 201 and an outer surface 202 that are opposite each other. It can be understood that the inner surface 201 may be a surface facing the interior of the electronic device (e.g., the cavity wall of the cavity), and correspondingly, the outer surface 202 is an exposed surface of the housing body 20. The housing body 20 is provided with a functional hole 203 that penetrates the inner surface 201 and the outer surface 202. The functional hole 203 may be a balance hole (e.g., the left functional hole 203 in Figure 3). The balance hole can balance the air pressure inside and outside the housing body so that the speaker and microphone can operate properly.

[0050] Certainly, the functional hole 203 may also be a hole through which sound waves pass (for example, the functional hole 203 on the right side of Figure 3). The electronic device further includes a sound module 40. The sound module 40 is located on the inner surface 201, i.e., the sound module 40 is located within the cavity, and the sound module 40 is located in the functional hole 203. For example, the sound module 40 may include a speaker. Correspondingly, the sound module 40 can send sound waves to the outside of the housing body 20 through the functional hole 203. Certainly, the sound module 40 may include a microphone. Correspondingly, the sound module 40 receives sound waves from outside the housing body 20 through the functional hole 203 and acquires an external sound signal. The sound module 40 is not limited to this embodiment.

[0051] Please refer to Figures 3 and 4. The filtration device 10 provided in this embodiment includes a first filter layer 101. The first filter layer 101 is located on the outside of the outer surface 202 (upper part in the direction shown in Figure 3) and has a plurality of spaced first mesh holes (not shown). The first filter layer 101 covers the functional holes 203, specifically the functional holes 203 are located inside the projection of the first filter layer 101 onto the outer surface 202, and as a result, the first filter layer 101 and its first mesh holes can filter the water entering the functional holes 203, preventing impurities such as particulate matter in the water from entering the functional holes 203.

[0052] Please refer to Figures 4 and 5. The filtration device 10 further includes a second filter layer 102. The second filter layer 102 is located between the outer surface 202 and the first filter layer 101, and has a plurality of spaced second mesh holes (not shown). The second filter layer 102 covers the functional holes 203, specifically, the functional holes 203 are located inside the projection of the second filter layer 102 onto the outer surface 202, and as a result, the second filter layer 102 and its second mesh holes can also filter the water entering the functional holes 203, further preventing impurities such as particulate matter in the water from entering the functional holes 203. Both the first filter layer 101 and the second filter layer 102 can filter the water entering the functional holes 203, preventing impurities such as particulate matter in the water from entering the functional holes 203.

[0053] Please refer to Figure 6. In the above implementation, in a cross-section parallel to the first filter layer 101, the cross-sectional area of ​​the first mesh holes 1011 is larger than the cross-sectional area of ​​the second mesh holes 1021. In other words, the projected area of ​​the first mesh holes 1011 onto the outer surface 202 is larger than the projected area of ​​the second mesh holes 1021 onto the outer surface 202. Thus, the first filter layer 101 can prevent impurities with relatively large particle sizes from passing through, and the second filter layer 102 can prevent impurities with relatively small particle sizes from passing through. Compared to the case where only one filter layer is provided, the accumulation of impurities with large particle sizes can be avoided, and therefore, clogging of the first filter layer 101 and the second filter layer 102 is avoided.

[0054] For example, the cross-sections of the first mesh holes 1011 and the second mesh holes 1021 can be regular shapes such as rectangles or circles. Certainly, the cross-sections of the first mesh holes 1011 and the second mesh holes 1021 may be irregular shapes. In one implementation where the cross-sections of the first mesh holes 1011 and the second mesh holes 1021 are circular, the opening of the first mesh hole 1011 can be 0.1 mm to 0.5 mm (including 0.1 and 0.5), and the thickness of the first filter layer 101 can be 0.1 mm to 0.3 mm (including 0.1 and 0.3). Correspondingly, the opening of the second mesh hole can be 0.5 μm to 100 μm (including 0.5 μm and 100 μm), and the thickness of the second filter layer 102 can be 0.05 mm to 0.1 mm (including 0.05 and 0.1). Thus, a relatively good filtering effect is ensured, and the loss of sound waves passing through the first filter layer 101 and the second filter layer 102 is relatively small. In addition, the thickness of the first filter layer 101 and the second filter layer 102 are relatively small, which can improve the structural compactness of the electronic device.

[0055] In this embodiment, the first filter layer 101 can be a rigid filter layer. In other words, the first filter layer 101 can be made of a rigid material such as a steel mesh, a perforated steel sheet, or a perforated plastic plate. Since the first filter layer 101 is the outermost filter layer, it can be placed to filter out relatively hard and sharp impurities (such as sandstone and metallic particulate matter), thereby preventing impurities such as particulate matter from damaging the first filter layer 101. Furthermore, because the first filter layer 101 is rigid, it can support the second filter layer 102, etc., preventing wrinkles from forming in the second filter layer 102, etc. Correspondingly, the second filter layer 102 can be a flexible filter layer. For example, the second filter layer 102 may include a dust filter, the material of which may include polyethylene terephthalate (PET), poly(ether-ether-ketone) (PEEK), and similar materials.

[0056] Please also refer to Figure 3. From the above, it can be seen that in this embodiment, the electronic device further includes a waterproof assembly 30, which is located on the housing body 20 and seals the functional hole 203 to achieve a seal for the functional hole 203. The waterproof assembly 30 can be located on the inner surface 201 of the housing body 20, and the waterproof assembly 30 is located between the sound module 40 and the inner surface 201. The waterproof assembly 30 allows sound waves to pass through, while the waterproof assembly 30 prevents water from passing through. Certainly, the waterproof assembly 30 may also be located inside a balance hole (e.g., the functional hole 203 on the left side of Figure 3). In this case, the waterproof assembly 30 allows air to pass through, while preventing water from passing through. For example, the waterproof assembly 30 may include a waterproof and breathable membrane. The waterproof and breathable membrane has a microporous structure, through which some air can pass. Water has surface tension, making it difficult for water to pass through microporous structures. As a result, the waterproof assembly 30 can prevent water from passing through while allowing sound waves and air to pass through, thus achieving a seal. The material of the waterproof and breathable membrane may include expanded PTFE (e-PTFE) and similar materials. The pore size of the microporous structure of the waterproof and breathable membrane can be in the range of 0.05 μm to 10 μm, such as 0.085 μm or 0.1 μm. Thus, the waterproofing effect of the waterproof and breathable membrane can be improved, increasing the usable depth of electronic equipment underwater. Certainly, the waterproof and breathable membrane can also transmit sound waves from one side to the other through vibrations of the waterproof and breathable membrane.

[0057] Refer to Figure 7. Two functional holes 203 may be provided in the housing body 20. Correspondingly, the sound module 40 may include a speaker 402 and a microphone 401. The speaker 402 is positioned to face one functional hole 203, and the microphone 401 is positioned to face the other functional hole 203. In other words, the speaker 402 sends sound waves to the outside of the housing body 20 through the functional hole 203 corresponding to the speaker 402, and the microphone 401 receives external sound waves through the functional hole 203 corresponding to the microphone 401. Correspondingly, a waterproof assembly 30 is positioned between the speaker 402 and the inner surface 201, and between the microphone 401 and the inner surface 201, to implement a seal over the two functional holes 203.

[0058] It can be understood that, in the aforementioned implementation, the filtration device 10 can cover the two functional holes 203, specifically, both of the two functional holes 203 are located inside the projections of the first filter layer 101 and the second filter layer 102 onto the outer surface 202. Thus, the water entering the two functional holes 203 can be filtered using the first filter layer 101 and the second filter layer 102.

[0059] Certainly, in some implementations, there may be two filtration devices 10, one filtration device 10 positioned to correspond to one functional hole 203, and the other filtration device 10 positioned to correspond to the other functional hole 203. In other words, the first filter layer 101 and the second filter layer 102 in one filtration device 10 cover one functional hole 203, and the functional hole 203 is located inside the projection of the first filter layer 101 and the second filter layer 102 onto the outer surface 202. The first filter layer 101 and the second filter layer 102 in the other filtration device 10 cover the other functional hole 203, and the functional hole 203 is located inside the projection of the first filter layer 101 and the second filter layer 102 onto the outer surface 202. Thus, each filtration device 10 can filter the water entering the corresponding functional hole 203.

[0060] In the filtration device 10 provided in this embodiment of the application, a first filter layer 101 is disposed on the outer surface 202 of a housing body 20, and a plurality of first mesh holes 1011 are provided in the first filter layer 101 at intervals. A second filter layer 102 is disposed between the outer surface 202 and the first filter layer 101, and a plurality of second mesh holes 1021 are provided in the second filter layer 102 at intervals, so that both the first filter layer 101 and the second filter layer 102 cover the functional holes 203 of the housing body 20. Thus, in water, the first filter layer 101 and the second filter layer 102 filter the water entering the functional holes 203, preventing impurities such as particulate matter from entering the functional holes 203. In particular, in deep water environments, impurities such as particulate matter can be prevented from damaging the waterproof membrane 301, resulting in improved waterproof performance of electronic devices in deep water environments. That is, the ability of electronic devices to withstand water pressure is improved, and the usable depth of electronic devices underwater is increased.

[0061] Furthermore, the cross-sectional area of ​​the first mesh holes 1011 is larger than the cross-sectional area of ​​the second mesh holes 1021. Thus, the first filter layer 101 can prevent impurities with relatively large particle sizes from passing through, and the second filter layer 102 can prevent impurities with relatively small particle sizes from passing through. Compared to the case where only one filter layer is provided, the accumulation of impurities with large particle sizes can be avoided, and therefore, clogging of the filter layers can be avoided.

[0062] Please refer to Figures 8 and 9. In some embodiments, there may be multiple second filter layers 102, which are stacked and arranged between the first filter layer 101 and the outer surface 202. Thus, the multiple second filter layers 102 can further improve the effect of filtering out impurities such as particulate matter, further improve the waterproof performance of electronic equipment in deep water environments, and increase the usable depth of electronic equipment underwater.

[0063] Please refer to Figures 9 and 10. In some embodiments, in a cross section parallel to the first filter layer 101, the cross-sectional area of ​​the second mesh holes 1021 of each second filter layer 102 gradually increases along the direction away from the outer surface 202 (upward direction in Figure 10). Specifically, the cross-sectional area of ​​the second mesh holes 1021 of the second filter layer 102 closer to the first filter layer 101 is larger than the cross-sectional area of ​​the second mesh holes 1021 of the second filter layer 102 further away from the first filter layer 101. Thus, impurities with relatively large particle sizes remain on the second filter layer 102 closer to the first filter layer 101, and impurities with relatively small particle sizes remain on the second filter layer 102 further away from the first filter layer 101. As a result, it is possible to prevent impurities from accumulating on each second filter layer 102, and clogging of the second filter layer 102 is avoided. In other implementations, all second mesh holes 1021 of the second filter layer 102 may have the same cross-sectional area.

[0064] In this implementation, the number of second filter layers 102 can be two, three, or four, etc. The number of second filter layers 102 is not limited to this embodiment. As shown in Figure 9, there are two second filter layers 102, and the opening of the second mesh holes 1021 of the second filter layer 102 closer to the first filter layer 101 can be 50 μm. Correspondingly, the opening of the second mesh holes 1021 of the second filter layer 102 further away from the first filter layer 101 can be 25 μm. In this case, a relatively high filtration effect can be ensured, and the loss of sound waves when passing through the filtration device 10 can be reduced, thus improving the acoustic performance of the electronic equipment. Compared to the case where the filtration device 10 is not installed, the water pressure that the electronic equipment can withstand can reach 1.25 MPa (approximately 12.5 atm), that is, the usable depth of the electronic equipment underwater can reach 125 meters.

[0065] Please refer to Figure 9. In one implementation in which the filtration device 10 includes a plurality of stacked second filter layers 102, the filtration device 10 further includes a plurality of first bonding layers 103, and these first bonding layers 103 are first filter layer 101The first bonding layer 103 is positioned between the second filter layer 102 closest to the first filter layer 101 and the first filter layer 101, and between adjacent second filter layers 102. Thus, the first bonding layer 103 can achieve bonding between the second filter layer 102 closest to the first filter layer 101 and the first filter layer 101, and between adjacent second filter layers 102. Furthermore, the second filter layer 102 closest to the first filter layer 101 and the first filter layer 101, and adjacent second filter layers 102 are connected by the first bonding layer 103 to form a filter layer assembly, thereby enabling pre-installation of the filtration device 10. Subsequently, the filter layer assembly is mounted on the housing body 20, which facilitates the installation of electronic equipment.

[0066] A first through-hole 1031 is provided in the first bonding layer 103, and the first through-hole 1031 is configured to communicate with the functional hole 203. That is, the projection of the first through-hole 1031 onto the outer surface 202 covers at least a portion of the functional hole 203, and therefore the first filter layer 101 and the second filter layer 102 corresponding to the first through-hole 1031 can filter the water entering the functional hole 203, and sound waves and filtered water can enter the functional hole 203 through the first through-hole 1031.

[0067] It can be understood that the centerline of the first through-hole 1031 lies on the same axis as the centerline of the functional hole 203, and the projections of each first through-hole 1031 onto the outer surface 202 may completely overlap. In this case, the projection of the first through-hole 1031 onto the outer surface 202 may partially overlap or completely overlap with the projection of the functional hole 203. Certainly, the functional hole 203 may be located inside the projection of the first through-hole 1031 onto the outer surface 202. Thus, the loss of sound waves as they pass through the filtration device 10 can be reduced.

[0068] Please also refer to Figures 8 and 9. The filtration device 10 provided in this embodiment further includes a first support layer 105. The first support layer 105 is positioned between the second filter layer 102 and the outer surface 202 (as shown in Figure 7), and the first support layer 105 is attached to the outer surface 202, and a second through-hole 1051 is provided in the first support layer 105, configured to communicate with the functional hole 203. Thus, the second filter layer 102, which is closer to the outer surface 202, is supported on the outer surface 202 by the first support layer 105, thereby avoiding direct contact between the second filter layer 102 and the outer surface 202 and preventing damage to the second filter layer 102 caused by the outer surface pressing against it.

[0069] For example, the center line of the second through-hole 1051 can be on the same line as the center line of the first through-hole 1031, and the projection of the second through-hole 1051 onto the outer surface 202 can completely overlap with the projection of the first through-hole 1031 onto the outer surface 202, or the projection of the second through-hole 1051 onto the outer surface 202 can be located inside the projection of the first through-hole 1031 onto the outer surface 202. The first support layer 105 can be a silicone layer or a waterproof adhesive tape layer, or the first support layer 105 includes a waterproof adhesive tape layer and a steel plate arranged in a laminate manner along the direction away from the outer surface 202. Correspondingly, both the waterproof adhesive tape layer and the steel plate have holes that communicate with the functional holes 203, and as a result, a seal is achieved between the second filter layer 102 and the outer surface, and the first support layer 105 is ensured to have a support effect.

[0070] Please refer to Figures 7 and 8. In some embodiments, the filtration device 10 further includes a cover plate 106. The cover plate 106 covers the outer surface 202 of the housing body 20, and a first filter layer 101 and a second filter layer 102 are interposed between the cover plate 106 and the outer surface 202. In other words, the first filter layer 101 and the second filter layer 102 are arranged between the cover plate 106 and the outer surface 202. The first filter layer 101 and the second filter layer 102 may be fixed to the housing body 20 by using the cover plate 106.

[0071] For example, to secure the cover plate 106, the cover plate 106 may be joined to the outer surface 202 of the housing body 20 by using an adhesive. To facilitate the installation of the cover plate 106, the adhesive may be rubber cement or a similar material. Correspondingly, an adhesive-retaining groove 204 may be provided on the outer surface 202, and the adhesive-retaining groove 204 will contain the adhesive, thereby avoiding an excessively large distance between the cover plate 106 and the outer surface 202. Certainly, in order to remove the filtration device 10 from the housing body 20 for maintenance, the cover plate 106 may be connected to the housing body 20 in a detachable manner, such as by snap fastening or bolting. In some implementations, when the cover plate 106 is connected to the housing body 20 by bolting or snap fastening, an adhesive is also placed between the cover plate 106 and the housing body 20 to further improve sealing performance.

[0072] A third through-hole 1061 is provided in the cover plate 106, configured to communicate with the functional hole 203. That is, the center line of the third through-hole 1061 can be on the same line as the center line of the functional hole 203, and the functional hole 203 can be located inside the projection of the third through-hole 1061 onto the outer surface 202. Thus, external sound waves and water can pass through the third through-hole 1061 and then enter the housing body 20 through the functional hole 203 to be received by the sound module 40, or sound waves emitted by the sound module 40 can pass through the functional hole 203 and then propagate to the outside of the housing body 20 through the third through-hole 1061.

[0073] Please refer to Figure 9. A second bonding layer 104 may be placed between the cover plate 106 and the first filter layer 101, and a fourth through-hole 1041 configured to communicate with the functional hole 203 is provided in the second bonding layer 104. Thus, the second bonding layer 104 can fix the filtration device 10 onto the cover plate 106, enabling the pre-installation of the filtration device 10. Subsequently, the installation of the filtration device 10 can be completed by attaching the cover plate 106, which includes the first filter layer 101 and the second filter layer 102, to the housing body 20, thereby simplifying the installation process.

[0074] For example, the center line of the fourth through-hole 1041 may be collinear with the center line of the first through-hole 1031, the projection of the fourth through-hole 1041 onto the outer surface 202 may completely overlap with the projection of the first through-hole 1031 onto the outer surface 202, or the projection of the fourth through-hole 1041 onto the outer surface 202 may be located inside the projection of the first through-hole 1031 onto the outer surface 202.

[0075] Please refer to Figure 11. In the above implementation, a first groove 1062 may be provided on the surface of the cover plate 106 facing the outer surface 202, and accordingly, at least a portion of the first filter layer 101 is housed in the first groove 1062. In this way, the relatively large distance between the cover plate 106 and the outer surface 202 caused by the interposition of the first filter layer 101 and the second filter layer 102 between the cover plate 106 and the outer surface 202 can be avoided, and thus the structural compactness of the electronic device is improved and the volume of the electronic device is reduced.

[0076] For example, the first filter layer 101 may be completely housed in the first groove 1062. Certainly, in order to further improve the structural compactness of the electronic device and reduce its volume, at least a portion of the second filter layer 102 may also be housed in the first groove 1062.

[0077] Please refer to Figure 12. In this embodiment, a second groove 206 is provided on the outer surface 202, and correspondingly, at least a portion of the second filter layer 102 is housed in the second groove 206. Thus, the relatively large distance between the cover plate 106 and the outer surface 202 caused by the interposition of the first filter layer 101 and the second filter layer 102 between the cover plate 106 and the outer surface 202 can be avoided, and therefore the structural compactness of the electronic device is improved and the volume of the electronic device is reduced.

[0078] For example, to further improve the structural compactness of the electronic device and reduce its volume, both the first filter layer 101 and the second filter layer 102 may be housed in the second groove 206 when the cover plate 106 covers the outer surface 202. Certainly, in an implementation where the first groove 1062 is provided on the surface of the cover plate 106 facing the outer surface 202, a portion of the first filter layer 101 is housed in the first groove 1062, and correspondingly, the remaining portion of the first filter layer 101 and the second filter layer 102 are housed in the second groove 206. Thus, the first groove 1062 and the second groove 206 together house the filtration device 10, which avoids excessively large depths for the first groove 1062 and the second groove 206.

[0079] Refer to Figure 13. In one implementation where the first filter layer 101 is a rigid layer and the second filter layer 102 is a dust filter, there are two second filter layers 102, which are stacked and arranged, with the first filter layer 101 located between the two second filter layers 102, and the cross-sectional area of ​​the second mesh holes of each second filter layer 102 gradually increases in a cross section parallel to the first filter layer 101 along the direction away from the outer surface. Thus, the first filter layer 101 may be interposed between the two second filter layers 102, and as a result, exposure of the first filter layer 101 is avoided, and the decorative effect of the electronic device is improved. In this case, the cross-sectional area of ​​the first mesh holes of the first filter layer 101 may be larger than the cross-sectional area of ​​the second mesh holes of each second filter layer 102.

[0080] Please refer to Figure 13. The filtration device 10 further includes a first bonding layer 103 positioned between the first filter layer 101 and the second filter layer 102, and a first through-hole 1031 communicating with the functional hole 203 is provided in the first bonding layer 103. The first bonding layer 103 can provide a connection between the first filter layer 101 and each of the second filter layers 102, and can provide a seal between the first filter layer 101 and each of the second filter layers 102.

[0081] One embodiment of this application further provides electronic devices. These electronic devices may include mobile phones, smartwatches (as shown in Figure 1), PCs, tablet computers, VR, AR, headsets, and similar devices. The electronic devices are not limited to these embodiments.

[0082] As shown in Figure 3, the electronic device includes a housing body 20. The housing body 20 can be the housing of the electronic device and is positioned around a cavity configured to house devices within the electronic device, such as a battery and a circuit board. The housing body 20 has an inner surface 201 and an outer surface 202 that are opposite each other. It can be understood that the inner surface 201 is a surface facing the interior of the electronic device (e.g., the cavity wall of the cavity), and correspondingly, the outer surface 202 is an exposed surface of the housing body 20. The housing body 20 is provided with a functional hole 203 that penetrates the inner surface 201 and the outer surface 202. The functional hole 203 may be a balance hole (e.g., the functional hole 203 on the left in Figure 3). The balance hole can balance the air pressure inside and outside the housing body so that the speaker and microphone can operate properly. Certainly, the functional hole 203 may also be a hole for sound waves to pass through (e.g., the functional hole 203 on the right in Figure 3).

[0083] The filtration device 10 provided in any of the embodiments described above is placed on the outer surface 202 of the housing body 20 to filter the water flowing into the functional holes 203, thereby preventing impurities such as particulate matter from entering the functional holes 203.

[0084] The electronic device may further include a sound module 40, which may be a device that emits sound waves, such as a speaker. Certainly, the sound module 40 may also be a device that receives sound waves, such as a microphone. This embodiment is not limited to the sound module 40.

[0085] The sound module 40 is positioned on the inner surface 201 and is positioned so as to face the functional hole 203, so that the sound module 40 emits sound waves to the outside through the functional hole 203 or receives sound waves from outside the housing body 20 through the functional hole 203.

[0086] As shown in Figure 3, the electronic device further includes a waterproof assembly 30. The waterproof assembly 30 is positioned on the housing body 20. The waterproof assembly 30 is positioned in conjunction with the sound module 40, allowing sound waves to pass through while preventing water from passing through. Certainly, the waterproof assembly 30 can also be positioned inside a balance hole (for example, the functional hole 203 on the left side of Figure 3). In this case, the waterproof assembly 30 allows air to pass through while preventing water from passing through, thereby achieving a seal over the functional hole 203.

[0087] In this embodiment, the waterproof assembly 30 can be arranged in multiple positions and in multiple structures, as long as water is prevented from passing through and gases are allowed to pass through. The structures and placement locations of the waterproof assembly 30 in multiple scenarios are described below.

[0088] Scenario 1

[0089] As shown in Figure 14, in this scenario, the waterproof assembly 30 can be positioned on the inner surface 201, and accordingly, the waterproof assembly 30 must be located between the housing body 20 and the sound module 40, or the waterproof assembly 30 can be positioned to correspond to the balance hole and implement the seal of the functional hole 203. Accordingly, the waterproof assembly 30 may include a waterproof membrane 301, a third bonding layer 302, a second support layer 303, and a fourth bonding layer 304, which are stacked and arranged along the direction away from the inner surface 201. The third bonding layer 302 is provided with a fifth through hole 3021, and the fourth bonding layer 304 is provided with a sixth through hole 3041, both of which are provided to communicate with the functional hole 203. That is, the centerlines of the fifth through-hole 3021 and the sixth through-hole 3041 can be on the same line as the centerline of the functional hole 203, the projections of the fifth through-hole 3021 and the sixth through-hole 3041 onto the inner surface 201 can completely overlap, the functional hole 203 can be located inside the projections of the fifth through-hole 3021 and the sixth through-hole 3041 onto the inner surface 201, or the functional hole 203 may completely overlap the projections of the fifth through-hole 3021 and the sixth through-hole 3041 onto the inner surface 201 so as to prevent the third bonding layer 302 and the fourth bonding layer 304 from obstructing the propagation of sound waves.

[0090] The waterproof assembly 30 further includes a buffer layer 305. The buffer layer 305 is positioned on the side of the fourth bonding layer 304 that does not face the inner surface 201. The buffer layer 305 is provided with a seventh through-hole 3051 that communicates with the functional hole 203. The buffer layer 305 can support the entire waterproof assembly 30.

[0091] The waterproof membrane 301 has a microporous structure, allowing some air to pass through. Water has surface tension, making it difficult for water to pass through the microporous structure. Therefore, the waterproof assembly 30 can prevent water from passing through while allowing sound waves to pass through, resulting in a seal. In this case, the corresponding waterproof assembly 30 is placed in a balance hole or positioned to correspond to the sound module 40. The material of the waterproof membrane 301 can include stretched PTFE, and the pore diameter range of the microporous structure of the waterproof membrane 301 can be from 0.05 μm to 10 μm, such as 0.085 μm or 0.1 μm. As a result, the water pressure that the waterproof membrane 301 can withstand can reach 1.25 MPa, the usable depth underwater can reach 125 meters, providing a permeable amount, and the sound insulation amount is 5 dB or less at audible frequencies from 100 Hz to 10000 Hz. In related technologies, the waterproof assembly includes a polymer film that has undergone hydrophobic modification, and the polymer film is a dense film, meaning that the polymer film does not allow gas to pass through, and sound wave transmission is achieved on both sides of the polymer film through vibration of the polymer film. The elastic modulus of the polymer film is 2000 MPa to 8000 MPa. At audible frequencies from 100 Hz to 10000 Hz, the sound cutoff is 1.5 dB to 6 dB, and the surface energy of the polymer film is lower than 50 mN / m. As a result, electronic devices using the polymer film can withstand water pressures exceeding 1 MPa, and the usable depth underwater can reach 100 meters. However, since the polymer film does not allow gas to pass through, when the external air pressure changes, the polymer film is easily deformed (e.g., bulging or denting) under the action of internal and external air pressure, and sound wave transmission is affected. In comparison, in this embodiment, the waterproof assembly 30 uses a waterproof membrane 301. Since the waterproof membrane 301 has a microporous structure, it can be ensured that the waterproof membrane 301 can withstand relatively high water pressure (e.g., 1.25 MPa) without affecting the transmission of sound waves due to changes in external air pressure.It can be understood that in one implementation where the waterproof assembly 30 is positioned to accommodate a speaker, a breathable membrane such as a waterproof membrane 301 with a microporous structure may be used. In one implementation where the waterproof assembly 30 is positioned to accommodate a microphone, a waterproof membrane 301 with a microporous structure or a dense film may be used. When the waterproof assembly 30 is configured to seal a balance hole, the corresponding waterproof membrane 301 must be a breathable film such as a waterproof membrane 301 with a microporous structure.

[0092] Multiple first holes 3031 are provided at intervals in the region of the second support layer 303 facing the functional holes 203. In other words, the functional holes 203 are located within the projection of their region onto the inner surface 201, or the functional holes 203 completely overlap with the projection of their region onto the inner surface 201. During use, air can pass through the second support layer 303 via the first holes 3031.

[0093] As shown in Figure 14, the projections of the fifth through-hole 3021, the sixth through-hole 3041, and the seventh through-hole 3051 onto the inner surface 201 can completely overlap with the region where the multiple first holes 3031 are provided, and the functional holes 203 are located within the projections of the fifth through-hole 3021, the sixth through-hole 3041, and the seventh through-hole 3051 onto the inner surface 201.

[0094] In the aforementioned implementation, the second support layer 303 can be rigid. For example, the material of the second support layer 303 may include stainless steel, copper, and similar materials so that the second support layer 303 can better support the waterproof membrane 301.

[0095] Please refer to Figure 14. The housing body 20 is provided with a first housing groove 205, and the waterproof assembly 30 is housed in the first housing groove 205. Thus, the structural compactness of the electronic device can be improved and the volume of the electronic device can be reduced. It can be understood that, in this case, the inner surface 201 of the housing body 20 includes the first groove bottom 2051 of the first housing groove 205 and the portion of the first housing wall 2011 outside the first housing groove 205.

[0096] Please refer to Figure 14. The waterproof assembly 30 further includes a fifth bonding layer 306. The fifth bonding layer 306 is positioned between the waterproof membrane 301 and the inner surface 201 (i.e., between the waterproof membrane 301 and the bottom of the first groove 2051). The fifth bonding layer 306 is provided with an eighth through-hole 3061 that communicates with the functional hole 203. The fifth bonding layer 306 can provide a connection between the waterproof membrane 301 and the housing body 20, and the fifth bonding layer 306 can also provide a seal between the waterproof membrane 301 and the housing body 20.

[0097] For example, the center line of the eighth through-hole 3061 can be on the same line as the center line of the fifth through-hole 3021, and the projection of the eighth through-hole 3061 onto the inner surface 201 can perfectly overlap with the projection of the fifth through-hole 3021 onto the inner surface 201, and as a result, sound waves can be transmitted through the eighth through-hole 3061 to the waterproof membrane 301.

[0098] Please refer to Figure 14. In this scenario, the material of the buffer layer 305 may include polyurethane foam, silicone, polyethylene foam adhesive, and similar materials, such that the buffer layer 305 has a specific amount of compression. In the process of installing the waterproof assembly 30, by appropriately compressing the buffer layer 305 (for example, by compressing it by about 60%), a specific preload can be applied between the film layers, improving the sealing performance between adjacent film layers and improving the sealing performance between the waterproof assembly 30 and the housing body 20. Thus, the waterproof performance of the electronic equipment in deep water environments is improved, that is, the ability of the electronic equipment to withstand water pressure is improved, and the usable depth of the electronic equipment underwater is increased. For example, the third bonding layer 302, the fourth bonding layer 304, and the fifth bonding layer 306 are all ring-shaped, with an outer circle diameter of 4 mm and an inner circle diameter of 1.75 mm, and when the buffer layer 305 is compressed by only 50%, the resulting preload can meet the sealing requirements for a usable depth of 50 meters underwater. To fill water depths exceeding 125 meters, the buffer layer 305 of the same material needs to be compressed to more than 80% to obtain sufficient pre-pressure.

[0099] It can be understood that excessively high preload can easily cause wrinkles in the waterproof membrane 301, affecting its acoustic performance. Excessively low preload can easily result in excessively low adhesion between the bonding layers, leading to insufficient sealing. In response, by using a buffer layer 305 with a relatively smooth stress-strain curve, relatively small changes in thickness can prevent excessively large changes in preload.

[0100] In some implementations, by appropriately increasing the elastic modulus of the buffer layer 305, the deformation of the buffer layer 305 can be reduced so that the deformation of the buffer layer 305 remains within the usable range when the same preload is achieved (e.g., 50% compression).

[0101] In this scenario, the projected area of ​​the third bonding layer 302, the fourth bonding layer 304, and the fifth bonding layer 306 on the inner surface 201 can be further increased, thereby appropriately increasing the projected area of ​​the waterproof membrane 301 on the inner surface 201 in order to improve the sealing performance of the third bonding layer 302, the fourth bonding layer 304, and the fifth bonding layer 306. Consequently, during assembly, the preload on the buffer layer 305 can be reduced, thereby avoiding damage to the buffer layer 305. Furthermore, it is further prevented that the waterproof membrane 301 will wrinkle due to excessive force, which would affect sound wave transmission.

[0102] It can be understood that the waterproof membrane 301 may have a regular shape, such as a circle or a rectangle.

[0103] Certainly, the housing body 20 generally includes structures such as bolts. To avoid adhesion to structures such as bolts, the waterproof membrane 301 may have an irregular shape. The shape of the waterproof membrane 301 is not limited in this embodiment. Correspondingly, the outer edges of the third bonding layer 302, the fourth bonding layer 304, and the fifth bonding layer 306 are coplanar with the outer edge of the waterproof membrane 301. Specifically, the projections of the third bonding layer 302, the fourth bonding layer 304, and the fifth bonding layer 306 onto the inner surface 201 completely overlap. The projected area of ​​the third bonding layer 302, the fourth bonding layer 304, and the fifth bonding layer 306 onto the inner surface 201 is 10 mm². 2 From 40mm 2 (For example, 10mm) 2 , 14mm 2 , 20mm 2 , or 40mm 2 (and so on). Furthermore, it is necessary to ensure that the bonding width of the third bonding layer 302 (the width between the outer edge of the third bonding layer 302 and the hole wall of the fifth through hole 3021) is 1.2 mm to 3 mm (for example, 1.2 mm, 2 mm, or 3 mm). Thus, when each bonding layer has sufficient adhesive strength to ensure sufficient sealing performance, the preload can be reduced to avoid damage to the buffer layer 305, and furthermore, it is possible to prevent the waterproof membrane 301 from wrinkling due to excessive force, which would affect the transmission of sound waves.

[0104] In this scenario, during assembly, the fifth bonding layer 306, the waterproof membrane 301, the third bonding layer 302, the second support layer 303, the fourth bonding layer 304, and the buffer layer 305 can be attached to the housing body 20 in sequence to assemble the waterproof assembly 30. Certainly, instead, the fourth bonding layer 304, the second support layer 303, the third bonding layer 302, the waterproof membrane 301, and the fifth bonding layer 306 can be attached to the buffer layer 305 in sequence to form a pre-assembled assembly, which can then be assembled as a whole to the housing body 20 to complete the assembly of the waterproof assembly 30, thereby simplifying the assembly of the electronic device.

[0105] Scenario 2

[0106] Refer to Figure 15. In this scenario, the waterproof assembly 30 can be positioned on the inner surface 201, and accordingly, the waterproof assembly 30 must be located between the housing body 20 and the sound module 40, or the waterproof assembly 30 can be positioned to correspond to the balance hole and implement the seal of the functional hole 203. Accordingly, the waterproof assembly 30 may include a waterproof membrane 301, a third bonding layer 302, a second support layer 303, a fourth bonding layer 304, and a buffer layer 305, which are stacked and arranged along the direction away from the inner surface 201. The third bonding layer 302 is provided with a fifth through hole 3021, the fourth bonding layer 304 is provided with a sixth through hole 3041, and the buffer layer 305 is provided with a seventh through hole 3051, and the fifth through hole 3021, the sixth through hole 3041, and the seventh through hole 3051 are all configured to communicate with the functional hole 203. In other words, the centerlines of the fifth through-hole 3021, the sixth through-hole 3041, and the seventh through-hole 3051 can be collinear with the centerline of the functional hole 203, and the projections of the fifth through-hole 3021, the sixth through-hole 3041, and the seventh through-hole 3051 onto the inner surface 201 can completely overlap. Furthermore, the functional hole 203 can be located inside the projections of the fifth through-hole 3021, the sixth through-hole 3041, and the seventh through-hole 3051 onto the inner surface 201, or the functional hole 203 can completely overlap with the projections of the fifth through-hole 3021, the sixth through-hole 3041, and the seventh through-hole 3051 onto the inner surface 201. This prevents the third bonding layer 302, the fourth bonding layer 304, and the buffer layer 305 from obstructing the propagation of sound waves.

[0107] The waterproof membrane 301 may have a microporous structure, through which some air can pass. Water has surface tension, making it difficult for water to pass through the microporous structure. Therefore, the waterproof assembly 30 can prevent water from passing through while allowing sound waves to pass through, resulting in a seal. The material of the waterproof membrane 301 may include stretched PTFE.

[0108] Multiple first holes 3031 are provided at intervals in the region of the second support layer 303 facing the functional holes 203. In other words, the functional holes 203 are located within the projection of their region onto the inner surface 201, or the functional holes 203 completely overlap with the projection of their region onto the inner surface 201. During use, air can pass through the second support layer 303 via the first holes 3031.

[0109] As shown in Figure 15, the projections of the fifth through-hole 3021, the sixth through-hole 3041, and the seventh through-hole 3051 onto the inner surface 201 can completely overlap with the region where the multiple first holes 3031 are provided, and the functional holes 203 are located within the projections of the fifth through-hole 3021, the sixth through-hole 3041, and the seventh through-hole 3051 onto the inner surface 201.

[0110] In the aforementioned implementation, the second support layer 303 can be rigid. For example, the material of the second support layer 303 may include stainless steel, copper, and similar materials so that the second support layer 303 can better support the waterproof membrane 301.

[0111] Refer to Figure 15. The housing body 20 is provided with a first housing groove 205, and the waterproof assembly 30 is housed in the first housing groove 205. Thus, the structural compactness of the electronic device can be improved and the volume of the electronic device can be reduced. It can be understood that, in this case, the inner surface 201 of the housing body 20 includes the first groove bottom 2051 of the first housing groove 205 and the portion of the first housing wall 2011 outside the first housing groove 205.

[0112] Please refer to Figure 15. The waterproof assembly 30 further includes a third support layer 307. The third support layer 307 is positioned on the inner surface 201 (i.e., the bottom of the first groove 2051), and a housing channel 3071 communicating with the functional hole 203 is provided in the third support layer 307. The waterproof membrane 301 is housed in the housing channel 3071, and the waterproof membrane 301 is attached to the side wall of the housing channel 3071, with a gap 3072 between the waterproof membrane 301 and the inner surface 201 (i.e., the bottom of the first groove 2051) (forming a U-shaped cavity structure). Thus, the third support layer 307 is supported between the second support layer 303 and the housing body 20, with a gap 3072 between the waterproof membrane 301 and the inner surface (i.e., the bottom of the first groove 2051). When preload is applied to the housing body 20 by using the buffer layer 305 during the installation process, this preload acts on the third support layer 307, preventing wrinkles from forming in the waterproof membrane 301, and thus avoiding any impact on acoustic performance caused by wrinkles.

[0113] In the aforementioned implementation, the second support layer 303 can contact the surface of the third support layer 307 on the side not facing the inner surface 201. In other words, the second support layer 303 contacts the surface of the third support layer 307 on the side not facing the bottom of the first groove 2051. Correspondingly, the third support layer 307 may include a silicone layer. Thus, a seal between the second support layer 303 and the housing body 20 can be achieved, ensuring a specific support effect. The water pressure that the electronic equipment can withstand can reach 1 MPa (approximately 10 atm), meaning that the usable depth of the electronic equipment underwater can reach 100 meters. Certainly, the third support layer 307 may be made of other rubber layers or the like.

[0114] Please refer to Figure 15. During assembly, the fourth bonding layer 304, the second support layer 303, the third bonding layer 302, the waterproof membrane 301, and the fifth bonding layer 306 can be attached in order to the buffer layer 305 to form a pre-assembled assembly, which is then assembled as a whole to the housing body 20 to complete the assembly of the waterproof assembly 30, thereby simplifying the assembly of the electronic device. Certainly, instead, the fourth bonding layer 304, the second support layer 303, the third bonding layer 302, and the third support layer 307 can be attached in order to the buffer layer 305, and then the waterproof membrane 301 and the fifth bonding layer 306 can be attached in order to the second support layer 303 to form a pre-installed assembly, which is then assembled as a whole to the housing body 20.

[0115] Please refer to Figure 15. The third bonding layer 302 may be a waterproof adhesive tape. Since there is a gap 3072 between the waterproof membrane 301 and the bottom of the first groove 2051, only the third bonding layer 302 needs to be activated during assembly. During use, water pressure acts on the waterproof membrane 301, compressing the third bonding layer 302, and thus the bonding between the waterproof membrane 301 and the second support layer 303 can be achieved automatically.

[0116] Please refer to Figure 16. In another implementation, the third support layer 307 and the second support layer 303 may be an integrated structure. In this method, the integrated structure is formed by a stamping process or an injection molding process, which simplifies the structure of the waterproof assembly 30 and facilitates the assembly of the waterproof assembly 30.

[0117] Please refer to Figure 16. A seal ring (O-ring) 3073 is positioned between the third support layer 307 and the housing body 20, and the seal ring 3073 is positioned surrounding the functional hole 203, that is, the seal ring 3073 surrounds the outside of the functional hole 203. Thus, the sealing performance between the third support layer 307 and the housing body 20, and consequently the waterproof performance of the electronic equipment in deep water environments, is improved, that is, the ability of the electronic equipment to withstand water pressure is improved, and the usable depth of the electronic equipment underwater is increased. For example, when the waterproof assembly 30 shown in Figure 16 is used, the water pressure that the electronic equipment can withstand can reach 1 MPa (approximately 10 atm), that is, the usable depth of the electronic equipment underwater can reach 100 meters.

[0118] It can be understood that a ring groove 3074 may be provided on the inner surface 201 (i.e., the bottom of the first groove 2051), and a seal ring 3073 may be positioned within the ring groove 3074, with a portion of the seal ring 3073 protruding from the ring groove 3074. One end of the third support layer 307 facing the inner surface 201 (i.e., the bottom of the first groove 2051) contacts the seal ring 3073 located outside the ring groove 3074. Certainly, the ring groove 3074 may be provided on both the inner surface 201 and one end of the third support layer 307 facing the inner surface 201 (i.e., the bottom of the first groove 2051). Correspondingly, a portion of the seal ring 3073 is located within the ring groove 3074 on the inner surface 201 (i.e., the bottom of the first groove 2051), and the remaining portion of the seal ring 3073 is located within the ring groove 3074 on the third support layer 307.

[0119] Please refer to Figure 16. During assembly, the fourth bonding layer 304 and the second support layer 303 are first attached to the buffer layer 305, and then the third bonding layer 302 and the waterproof membrane 301 are first attached to the second support layer 303 to form a pre-installed assembly. This assembly is then mounted to the housing body 20, thereby simplifying the assembly of the electronic device.

[0120] Please refer to Figure 16. The third bonding layer 302 may be a waterproof adhesive tape. Since there is a gap 3072 between the waterproof membrane 301 and the bottom of the first groove 2051, only the third bonding layer 302 needs to be activated during assembly. During use, water pressure acts on the waterproof membrane 301, compressing the third bonding layer 302, and thus the bonding between the waterproof membrane 301 and the second support layer 303 can be achieved automatically.

[0121] Refer to Figure 17. In this scenario, the waterproof assembly 30 may further include an auxiliary support layer 3032. The auxiliary support layer 3032 is positioned between the third support layer 307 and the housing body 20 (i.e., the bottom of the first groove 2051). Multiple second holes 3033 are spaced apart in the region of the auxiliary support layer 3032 facing the functional holes 203, so that sound waves can pass through the auxiliary support layer 3032 through the second holes 3033. Thus, the interposition of the waterproof membrane 301 between the second support layer 303 and the auxiliary support layer 3032 can improve the effect of supporting the waterproof membrane 301.

[0122] Accordingly, a gap 3072 is located between the waterproof membrane 301 and the auxiliary support layer 3032 to avoid contact between the waterproof membrane 301 and the auxiliary support layer 3032, and as a result, it is possible to prevent the waterproof membrane 301 from wrinkling by withstanding force.

[0123] It can be understood that the functional hole 203 may be located inside the projection onto the housing body 20 of the region where the second hole 3033 is provided, such that the region where the second hole 3033 is provided faces the functional hole 203, or the functional hole 203 may completely overlap with the projection onto the housing body 20 of the region where the second hole 3033 is provided.

[0124] In the aforementioned implementation, the auxiliary support layer 3032 and the third support layer 307 may be an integrated structure, and this integrated structure may be formed by stamping or injection molding, thereby simplifying the structure of the waterproof assembly 30 and facilitating the assembly of the waterproof assembly 30.

[0125] Please refer to Figure 17. A seventh bonding layer 3034 may be positioned between the auxiliary support layer 3032 and the inner surface 201 (i.e., the bottom of the first groove 2051). Correspondingly, a tenth through-hole 3035 communicating with the functional hole 203 is provided in the seventh bonding layer 3034. It can be understood that the functional hole 203 may be located within the projection of the tenth through-hole 3035 onto the inner surface 201, or the functional hole 203 may completely overlap with the projection of the tenth through-hole 3035 onto the inner surface 201. Thus, by using the seventh bonding layer 3034, the auxiliary support layer 3032 can be fixed to the housing body 20, thereby fixing the waterproof assembly 30. Furthermore, a seal can be achieved between the auxiliary support layer 3032 and the housing body 20.

[0126] Please refer to Figure 17. A sixth bonding layer 3023 is positioned between the third support layer 307 and the second support layer 303, and a ninth through-hole 3024 is provided in the sixth bonding layer 3023. The waterproof membrane 301 can be coplanar with the surface of the third support layer 307 on the side not facing the inner surface 201. The third bonding layer 302 is located within the ninth through-hole 3024 and is bonded to the hole wall of the ninth through-hole 3024. Thus, the connection between the third support layer 307 and the second support layer 303 can be made using the sixth bonding layer 3023, and when preload is applied by using the buffer layer 305, the sixth bonding layer 3023 between the second support layer 303 and the third support layer 307 bears the force. In this case, the third bonding layer 302 does not bear any force, and as a result, wrinkles are prevented from forming in the third bonding layer 302 and the waterproof membrane 301 on the third bonding layer 302 by the force being resisted. In addition, by bonding the third bonding layer 302 to the sixth bonding layer 3023, the sealing performance between the third support layer 307 and the second support layer 303 can be improved.

[0127] Certainly, in another implementation, the waterproof membrane 301 may partially protrude from the housing channel 3071. This is not limited to this embodiment.

[0128] Please refer to Figure 17. During assembly, the fourth bonding layer 304, the second support layer 303, the sixth bonding layer 3023, the third bonding layer 302, the waterproof membrane 301, the third support layer 307, and the seventh bonding layer 3034 are first attached to the buffer layer 305 to form a pre-installed assembly, which is then assembled as a whole into the housing body 20, thereby simplifying the assembly of the electronic equipment. Furthermore, in order to realize the modularization of the electronic equipment, the pre-installed assembly may be transported separately.

[0129] For example, using the waterproof assembly 30 shown in Figure 17, the water pressure that the electronic equipment can withstand can reach 1 MPa (approximately 10 atm), meaning that the usable depth of the electronic equipment underwater can reach 100 meters.

[0130] Please refer to Figure 17. The third bonding layer 302 may be waterproof adhesive tape. Since there is a gap 3072 between the waterproof membrane 301 and the auxiliary support layer 3032, only the third bonding layer 302 needs to be activated during assembly. During use, water pressure acts on the waterproof membrane 301, compressing the third bonding layer 302, and thus the bonding between the waterproof membrane 301 and the second support layer 303 can be achieved automatically.

[0131] Please refer to Figures 15 to 17. In this scenario, the waterproof assembly 30 further includes a protective layer 308. The protective layer 308 is positioned on the surface of the waterproof membrane 301 facing the inner surface 201 (i.e., the bottom of the first groove 2051), and via holes 3081 communicating with the functional holes 203 are provided in the protective layer 308. It can be understood that the functional holes 203 may be located within the projection of the via holes 3081 onto the inner surface 201, or the functional holes 203 may completely overlap with the projection of the via holes 3081 onto the inner surface 201.

[0132] Correspondingly, a gap 3072 is located between the protective layer 308 and the inner surface 201 (i.e., the bottom of the first groove 2051). Thus, under the action of water pressure, the protective layer 308 allows the waterproof membrane 301 to withstand relatively uniform forces and avoids wrinkling. The protective layer 308 can also serve as a support to prevent the edges of the waterproof membrane 301 from becoming inclined. For example, the material of the protective layer 308 may include polyethylene glycol terephthalate (PET) and similar materials.

[0133] Scenario 3

[0134] Refer to Figure 18. The difference between this scenario and scenarios 1 and 2 lies in the placement of the waterproof assembly 30. The waterproof assembly 30 may be placed on the outer surface 202, and correspondingly, the waterproof assembly 30 needs to be located between the housing body 20 and the filter 10 to prevent impurities such as particulate matter in the water from coming into contact with the waterproof assembly 30.

[0135] Please refer to Figure 18. The housing body 20 is provided with a second accommodating groove 207, and correspondingly, the second groove bottom 2071 of the second accommodating groove 207 and 2nd Storage groove 207 The outer second housing wall 2021 and the outer surface 202 form the outer surface 202. The waterproof assembly 30 2nd Storage groove 207By being placed internally, it improves the structural compactness of electronic devices and reduces their overall volume.

[0136] The waterproof assembly 30 includes a third bonding layer 302, a waterproof membrane 301, and a protective layer 308, which are laminated together along a direction away from the outer surface 202 (i.e., the bottom of the second groove 2071). A fifth through-hole 3021 communicating with the functional hole 203 is provided in the third bonding layer 302, and a via hole 3081 communicating with the functional hole 203 is provided in the protective layer 308. Thus, by using the third bonding layer 302, the waterproof membrane 301 is fixed to the housing body 20, and a seal between the waterproof membrane 301 and the housing body 20 can be achieved. Furthermore, during use, water pressure acts on the protective layer 308 and then on the third bonding layer 302, further improving the sealing performance between the waterproof membrane 301 and the housing body 20. Therefore, during assembly, the waterproof membrane 301 can be installed without applying preload, or with only a relatively small preload, thereby preventing the waterproof membrane 301 from wrinkling due to excessive force.

[0137] In the aforementioned implementation, the protective layer 308 allows the waterproof membrane 301 to receive relatively uniform force, thereby preventing wrinkles caused by uneven force. Furthermore, the protective layer 308 can serve as a support to prevent the edges of the waterproof membrane 301 from becoming inclined.

[0138] It can be understood that the centerlines of the via hole 3081 and the fifth through hole 3021 may be collinear with the centerline of the functional hole 203, and the functional hole 203 may be located within the projection of the via hole 3081 and the fifth through hole 3021 onto the second groove bottom 2071, or the functional hole 203 may perfectly overlap with the projection of the via hole 3081 and the fifth through hole 3021 onto the second groove bottom 2071.

[0139] Refer to Figure 19. The waterproof assembly 30 further includes a second support layer 303, which is positioned between the third bonding layer 302 and the outer surface 202, and has a plurality of spaced first holes 3031 in the region of the second support layer 303 facing the functional holes 203. The second support layer 303 can support the waterproof membrane 30. It can be understood that an adhesive layer (not shown) may be placed between the second support layer 303 and the outer surface 202 to fix the second support layer 303 and seal the second support layer 303 and the outer surface 202.

[0140] In the electronic device provided in this embodiment of the application, a first filter layer 101 of the filtration device 10 is disposed on the outer surface 202 of the housing body 20, and a plurality of first mesh holes are provided at intervals in the first filter layer 101. A second filter layer 102 is disposed between the outer surface 202 and the first filter layer 101, and a plurality of second mesh holes are provided at intervals in the second filter layer 102, so that both the first filter layer 101 and the second filter layer 102 cover the functional holes 203 of the housing body 20. Thus, in water, the first filter layer 101 and the second filter layer 102 can filter the water entering the functional holes 203, preventing impurities such as particulate matter in the liquid from entering the functional holes 203. In particular, in deep water environments, it is possible to prevent impurities such as particulate matter from damaging the waterproof membrane 301 of the waterproof assembly 30, and as a result, the waterproof performance of the electronic device in deep water environments is improved. In other words, the ability of electronic devices to withstand water pressure is improved, and the usable depth of electronic devices underwater increases.

[0141] It should be noted that, in the description of the embodiments of this application, unless otherwise specified or limited, the terms “communicate” and “connect.” For example, they may refer to a fixed connection, an integrated connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, or a communication connection between two components. Those skilled in the art will be able to understand the specific meaning of these terms in the embodiments of this application based on the specific circumstances.

[0142] Finally, it should be noted that the embodiments described above are not intended to limit the embodiments of this application, but are used solely to illustrate the technical solutions of the embodiments of this application. While the embodiments of this application are described in detail with reference to the embodiments described above, it will be understood by those skilled in the art that modifications can still be made to the technical solutions described in the embodiments described above, or equivalent substitutions can be made to some or all of the technical features thereof, without departing from the scope of the technical solutions of the embodiments of this application.

Claims

1. A filtration device configured to be placed on an electronic device, wherein the electronic device has a housing body, and the filtration device is A first filter layer configured to cover a functional hole provided in the housing body, wherein the functional hole penetrates the inner and outer surfaces of the housing body, the first filter layer is located outside the outer surface, and the first filter layer has a plurality of first mesh holes spaced apart. A second filter layer located between the outer surface and the first filter layer and covering the functional holes, the second filter layer having a plurality of second mesh holes spaced apart, It has, In a cross-section parallel to the first filter layer, the cross-sectional area of ​​the first mesh holes is larger than the cross-sectional area of ​​the second mesh holes. The filtration device is configured to filter the liquid flowing through it. Filtration device.

2. The filtration apparatus according to claim 1, wherein there are a plurality of second filter layers, the plurality of second filter layers are arranged in a stack, and in a cross section parallel to the first filter layer, the cross-sectional area of ​​the second mesh holes of each second filter layer gradually increases along the direction away from the outer surface.

3. The filtration device further, A first bonding layer is disposed between the second filter layer near the first filter layer and the first filter layer, and between adjacent second filter layers, and is provided with a first through-hole that communicates with the functional hole. A filtration apparatus according to claim 2, having the following features.

4. The filtration device further, A first support layer disposed between the second filter layer and the outer surface and attached to the outer surface, the first support layer having a second through hole that communicates with the functional hole, A filtration apparatus according to claim 1, having the following features.

5. The filtration apparatus according to claim 1, wherein the first filter layer is a rigid filter layer.

6. The filtration apparatus according to claim 5, wherein there are two second filter layers, the two second filter layers are stacked and arranged, the first filter layer is located between the two second filter layers, and in a cross section parallel to the first filter layer, the cross-sectional area of ​​the second mesh holes on each second filter layer gradually increases along the direction away from the outer surface.

7. The filtration device further, A first bonding layer disposed between the first filter layer and the second filter layer, the first bonding layer having a first through-hole that communicates with the functional hole, A filtration apparatus according to claim 6, having the following features.

8. The filtration device further, A cover plate that covers the outer surface, wherein the first filter layer and the second filter layer are located between the cover plate and the outer surface, and a third through-hole communicating with the functional hole is provided on the cover plate. It has, The cover plate is connected to the housing body. The filtration apparatus according to claim 1.

9. The filtration device further, A second bonding layer disposed between the cover plate and the first filter layer, the second bonding layer having a fourth through-hole that communicates with the functional hole, A filtration apparatus according to claim 8, having the following features.

10. The filtration apparatus according to claim 8, wherein a first groove is provided on the surface of the cover plate facing the housing body, and at least a portion of the first filter layer is housed in the first groove.

11. The filtration apparatus according to claim 8, wherein a second groove is provided on the outer surface, and at least a portion of the second filter layer is housed in the second groove.

12. The filtration device according to claim 1, wherein the electronic device further comprises a sound module disposed on the inner surface, the sound module being disposed in the functional hole.

13. A housing body having an inner surface and an outer surface opposite to the inner surface, wherein a functional hole is provided that penetrates the inner surface and the outer surface, A waterproof assembly disposed in the functional hole, configured to prevent liquid from passing through the functional hole, A filtration apparatus according to any one of claims 1 to 12, A powerful electronic device.

14. The waterproof assembly is positioned on the inner surface, and the waterproof assembly is A waterproof membrane, a third bonding layer, a second support layer, and a fourth bonding layer are arranged in a stacked manner along the direction away from the inner surface, the third bonding layer is provided with a fifth through-hole, the fourth bonding layer is provided with a sixth through-hole, and both the fifth and sixth through-holes communicate with the functional holes. It has, A plurality of first holes are provided at intervals in the region of the second support layer facing the functional holes. The electronic device according to claim 13.

15. The electronic device according to claim 14, wherein the waterproof assembly further has a buffer layer provided on the side of the fourth bonding layer that does not face the inner surface, and a seventh through-hole communicating with the functional hole is provided in the buffer layer.

16. The aforementioned waterproof assembly further, A fifth bonding layer disposed between the waterproof membrane and the inner surface, the fifth bonding layer having an eighth through-hole that communicates with the functional hole, The electronic device according to claim 14, having the following features.

17. The aforementioned waterproof assembly further, A third support layer disposed on the inner surface, the third support layer having a accommodating channel that communicates with the functional hole, It has, The waterproof membrane is housed in the housing channel, the edge of the waterproof membrane is attached to the side wall of the housing channel, and a gap exists between the waterproof membrane and the inner surface. The electronic device according to claim 14.

18. The electronic device according to claim 17, wherein the second support layer is in contact with the surface of the third support layer on the side not facing the inner surface.

19. The electronic device according to claim 18, wherein the third support layer has a silicone layer.

20. The electronic device according to claim 18, wherein the second support layer and the third support layer are integrally structured.

21. The electronic device according to claim 20, wherein a seal ring is disposed between the third support layer and the housing body, and the seal ring is disposed surrounding the functional hole.

22. The aforementioned waterproof assembly further, An auxiliary support layer disposed between the third support layer and the inner surface, wherein a plurality of second holes are provided at intervals in the region of the auxiliary support layer facing the functional hole, and the gap is located between the waterproof membrane and the auxiliary support layer. The electronic device according to claim 17, having the following features.

23. The electronic device according to claim 22, wherein the auxiliary support layer and the third support layer are integrally structured.

24. The electronic device according to claim 22, wherein a sixth bonding layer is disposed between the third support layer and the second support layer, a ninth through-hole is provided in the sixth bonding layer, the ninth through-hole is located below the housing channel provided in the third support layer and overlaps with the housing channel, the third bonding layer is located on the second support layer within the ninth through-hole, and the third bonding layer is bonded to the hole wall of the ninth through-hole.

25. The aforementioned waterproof assembly further, A protective layer disposed on the surface of the waterproof membrane on the side facing the inner surface, the protective layer having via holes that communicate with the functional holes, The electronic device according to claim 14, having the following features.

26. The electronic device according to claim 13, wherein a first housing groove is provided on the inner surface, and the waterproof assembly is disposed within the first housing groove.

27. The waterproof assembly is positioned on the outer surface, and the waterproof assembly is A third bonding layer, a waterproof membrane, and a protective layer are arranged in a stack along a direction away from the outer surface, wherein a fifth through-hole communicating with the functional hole is provided in the third bonding layer, and a via hole directly opposite the functional hole is provided in the protective layer. The electronic device according to claim 13, having the following features.

28. The electronic device according to claim 27, wherein the waterproof assembly further comprises a second support layer disposed between the third bonding layer and the outer surface, and a plurality of first holes are spaced apart in the region of the second support layer facing the functional holes.

29. The electronic device according to claim 27, wherein a second housing groove is provided on the outer surface, and the waterproof assembly is disposed in the second housing groove.

30. The electronic device according to claim 13, further comprising a sound module disposed on the inner surface, the sound module being disposed in the functional hole.

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