PCB work equipment

Abstract

To provide a board working device capable of accurately reproducing recognition processing using a stored image for recognition processing performed in the board working device during verification or the like.SOLUTION: A component mounting device 15 (board working device) includes a mounting head 154a that performs work on a substrate S, a board recognition imaging unit 154b and a component recognition imaging unit 157 that perform imaging for performing recognition processing, a calculation unit 158b that adjusts the images captured by the board recognition imaging unit 154b and the component recognition imaging unit 157 so as to adjust the amount of data before recognition processing, and a control unit 158 that performs recognition processing on the basis of the image adjusted by the calculation unit 158b.SELECTED DRAWING: Figure 4

Description

【Technical Field】 【0001】 This invention relates to a substrate working device Place . 【Background Art】 【0002】 Conventionally, a substrate working device has been known (for example, see Patent Document 1). 【0003】 In the above Patent Document 1, an inspection device (substrate working device) for performing an inspection operation on a substrate is disclosed. This inspection device inspects the substrate based on an image captured by an imaging unit, and then, without compressing the inspection area of the image, compresses the portions having a difference from the reference image of the non-inspection area to reduce the data amount of the image and saves the image. In this inspection device, when using the image saved with the reduced data amount for verification or the like, the compressed portions are decoded. 【Prior Art Documents】 【Patent Documents】 【0004】 【Patent Document 1】 Japanese Unexamined Patent Application Publication No. 2009-273005 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0005】 In the above-mentioned Patent Document 1, the substrate is inspected based on the captured image, and then the inspected area of ​​the image is not compressed, while the difference between the inspected area and the reference image in the non-inspected area is compressed to reduce the amount of image data, and the image is saved. Therefore, when using the saved image to verify the occurrence of defects in the substrate, the image that has been compressed once is used. As a result, since an uncompressed image is used during substrate inspection and a compressed image is used during verification, it is difficult to perform the same inspection as during substrate inspection. Therefore, it is difficult to accurately reproduce processes such as inspection processing and recognition processing using the image during verification. Thus, it is desirable to be able to accurately reproduce the processing using the saved image during verification and other processes in relation to the processing performed in the substrate handling equipment. 【0006】 This invention was made to solve the above-mentioned problems, and one of its objectives is to provide a circuit board processing device that can accurately reproduce recognition processing using saved images during verification, etc., for recognition processing performed in a circuit board processing device. Place It is about providing. [Means for solving the problem] 【0007】 To achieve the above objective, a substrate work apparatus according to the first aspect of this invention comprises a work unit that performs work on a substrate, an imaging unit that performs imaging for recognition processing, an image adjustment unit that adjusts the image captured by the imaging unit to adjust the amount of data before recognition processing, and a control unit that performs recognition processing based on the image adjusted by the image adjustment unit, wherein the image adjustment unit adjusts the image based on at least one of the following: the shape of the recognition mark on the substrate, the size of the recognition mark on the substrate, the shape of the component to be mounted on the substrate, the external size of the component to be recognized, the shape of the electrode, the size of the electrode, the pitch of the electrode, the tolerance of the size of the component, the allowable value of shape deformation, and the distribution state of brightness information. The image is adjusted by determining at least one of the following: the number of pixels to be removed in the pixel decimation process, the number of bits to be reduced in the bit depth reduction process, and the scaling rate of the resolution reduction process. Then, the image captured by the imaging unit is subjected to at least one of the following processes: pixel decimation, bit depth reduction, and resolution reduction, in order to reduce the amount of data in the image. . 【0008】 In the substrate handling apparatus according to the first aspect of this invention, as described above, an image adjustment unit is provided that adjusts the image captured by the imaging unit to adjust the amount of data before the recognition process, and a control unit is provided that performs recognition processing based on the image adjusted by the image adjustment unit. As a result, the image used for the recognition process and the image saved after the recognition process can be the same image, so that during verification, etc., the recognition process using the saved image can be accurately reproduced with respect to the recognition process performed in the substrate handling apparatus. 【0009】 Substrate work apparatus according to the first phase described above So, The image adjustment unit determines whether or not to perform image adjustment processing for recognition based on at least one of the following: the shape of the recognition mark on the substrate, the size of the recognition mark on the substrate, the shape of the components mounted on the substrate, the outer dimensions of the components to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the component size, the allowable value for shape deformation, and the distribution state of the brightness information. This Based on the shape of the recognition mark on the substrate, the size of the recognition mark on the substrate, the shape of the components mounted on the substrate, the outer dimensions of the components to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the component size, the allowable value of shape deformation, and the distribution state of brightness information, image adjustment processing can be performed on the image to be recognized if there is no impediment to the recognition process, thereby suppressing a decrease in the accuracy of the recognition process. 【0010】 In the substrate processing apparatus according to the first aspect described above, preferably, the image adjustment unit is provided on the imaging unit or image processing board, or is configured by software. With this configuration, image adjustment processing can be performed by adjusting the amount of data using the imaging unit, image processing board, or software, taking into consideration the balance of the processing load for image adjustment. 【0011】 Substrate work apparatus according to the first phase described above So,The image adjustment unit performs image adjustment on the image captured by the imaging unit by performing at least one of the following processes: pixel downsampling, bit depth reduction, resolution reduction, and image cropping, in order to reduce the amount of image data. This By taking into account the impact of recognition processing, the effect of reducing data volume, and processing time, it is possible to perform optimal processing to reduce the data volume of images. As a result, it is possible to suppress the large amount of data volume of images saved for verification purposes. 【0012】 In the substrate processing apparatus according to the first phase described above, The image adjustment unit determines at least one of the following based on the image target: the number of pixels to be downsampled in the pixel downsamplement process, the number of bits to be reduced in the bit depth reduction process, and the reduction rate of the scale of the resolution reduction process. This This allows for a reduction in the amount of image data to a degree that does not affect the recognition accuracy of the object being captured. 【0013】 the above In the first phase In a substrate processing apparatus, preferably, the image adjustment unit performs trimming, leaving only the portion necessary for the recognition process of the image target, and records the position information of the trimmed image in association with the adjusted image. With this configuration, the amount of image data can be reduced without degrading image quality through trimming. Furthermore, the position information of the trimmed image allows for easy identification of the position of the adjusted image. In addition, based on the position information, the trimmed image can be displayed in a position aligned with the original image. Moreover, by using an image with trimmed images that have been aligned with the original image, without any degradation in image quality, for verification and image processing, results can be obtained with high accuracy. 【0014】 the above In the first phase PCB work equipment So,The image adjustment unit selects an image adjustment processing method based on at least one of the following: the shape of the recognition mark on the substrate, the size of the recognition mark on the substrate, the shape of the components mounted on the substrate, the outer dimensions of the components to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the component size, the allowable value for shape deformation, and the distribution state of the brightness information. This Based on the shape of the recognition marks on the circuit board, the size of the recognition marks on the circuit board, the shape of the components mounted on the circuit board, the outer dimensions of the components to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the component size, the allowable value for shape deformation, or the distribution state of brightness information, it is possible to reduce the amount of image data using a processing method that does not significantly affect the recognition accuracy. 【0015】 In the substrate processing apparatus according to the first phase described above, The image adjustment unit determines at least one of the following based on the shape of the recognition mark on the substrate, the size of the recognition mark on the substrate, the shape of the component mounted on the substrate, the external size of the component to be recognized, the shape of the electrode, the size of the electrode, the pitch of the electrode, the tolerance of the component size, the allowable value of shape deformation, and the distribution state of brightness information: the number of pixels to be thinned out in the pixel thinning process, the number of bits to be reduced in the bit depth reduction process, and the reduction rate of the resolution reduction process. Based on this, the image adjustment unit performs at least one of the following on the image captured by the imaging unit: pixel thinning, bit depth reduction, and resolution reduction, in order to reduce the amount of image data. 【0016】 In a substrate work apparatus configured such that the image adjustment unit determines whether or not to perform image adjustment processing for recognition based on at least one of the following: the shape of the recognition mark on the substrate, the size of the recognition mark on the substrate, the shape of the component to be mounted on the substrate, the external dimensions of the component to be recognized, the shape of the electrode, the size of the electrode, the pitch of the electrode, the tolerance of the component size, the allowable value of shape deformation, and the distribution state of brightness information, preferably, the image adjustment unit determines whether or not to perform image adjustment processing for recognition based on at least one of the following: the setting of the component mounting operation mode, the setting of the substrate production program, the setting of component library data, and the state of the electrode pattern at the mounting position, and selects at least one of the following: 【0017】 In a substrate processing apparatus in which the image adjustment unit is provided on the imaging unit or image processing board, or is configured by software, preferably, when the image adjustment unit is provided on the imaging unit or image processing board, it acquires processing conditions for multiple images at once. With this configuration, the communication time for transmitting processing conditions to the imaging unit or image processing board can be minimized, thereby suppressing the time impact on the substrate processing. 【0018】 This invention 2The substrate working device according to the situation performs operations on the substrate, an imaging unit that performs imaging for recognition processing, an image adjustment unit that adjusts the image captured by the imaging unit to adjust the data volume before the recognition processing, and a control unit that performs recognition processing based on the image adjusted by the image adjustment unit. The control unit compares the recognition result based on the image adjusted by the image adjustment unit with the recognition result based on the image not adjusted by the image adjustment unit, and determines the conditions for performing the image adjustment processing by the image adjustment unit. As a result, the control unit can easily determine the conditions suitable for performing the image adjustment processing by the image adjustment unit. 【Effect of the Invention】 【0023】 According to the present invention, as described above, in verification and the like, the recognition processing using the saved image can be accurately reproduced with respect to the recognition processing performed in the substrate working device. 【Brief Description of the Drawings】 【0024】 [Figure 1] It is a block diagram showing an outline of a substrate working system according to an embodiment of the present invention. [Figure 2] It is a plan view showing the configuration of a component mounting device according to an embodiment of the present invention. [Figure 3] It is a block diagram showing a part of the control configuration of a component mounting device according to an embodiment of the present invention. [Figure 4] It is a diagram showing a first example of the flow of recognition processing by a component mounting device according to an embodiment of the present invention. [Figure 5] It is a diagram for explaining the binning processing of an image by a component mounting device according to an embodiment of the present invention. [Figure 6] It is a diagram for explaining the thinning processing of an image by a component mounting device according to an embodiment of the present invention. [Figure 7] It is a diagram for explaining the bit depth reduction processing of an image by a component mounting device according to an embodiment of the present invention. [Figure 8]This figure illustrates a first example of image trimming processing by a component mounting device according to an embodiment of the present invention. [Figure 9] This figure illustrates a second example of image trimming processing by a component mounting device according to an embodiment of the present invention. [Figure 10] This figure shows an example of the arrangement of lands on a substrate according to an embodiment of the present invention. [Figure 11] This figure shows the relationship between the lands on a substrate and the leads of components according to an embodiment of the present invention. [Figure 12] This figure shows a second example of the recognition process flow by a component mounting device according to an embodiment of the present invention. [Figure 13] This figure illustrates the image adjustment condition determination process by a component mounting device according to an embodiment of the present invention. [Modes for carrying out the invention] 【0025】 The following describes embodiments of the present invention based on the drawings. 【0026】 (Configuration of the circuit board work system) The configuration of the substrate work system 100 according to an embodiment of the present invention will be described with reference to Figures 1 to 13. 【0027】 The PCB assembly system 100 according to this embodiment is configured to mount components E onto a substrate S and produce a substrate S with components E mounted on it. As shown in Figure 1, the PCB assembly system 100 includes a production line 10 and a server 30. 【0028】 Multiple production lines 10 are provided. Production line 10 also includes a loader 11, a printing press 12, a print inspection machine 13, a dispenser device 14, multiple component mounting devices 15, a visual inspection device 16, a buffer device 17, a reflow device 18, a visual inspection device 19, and an unloader 20. Furthermore, in production line 10, substrates S are transported along the production line 10 from the upstream side (left side) to the downstream side (right side). Note that the printing press 12 is an example of a "substrate handling device" in the claims. Similarly, the dispenser device 14 is an example of a "substrate handling device" in the claims. Similarly, the component mounting device 15 is an example of a "substrate handling device" in the claims. 【0029】 (Production line configuration) Next, we will describe the configuration of each piece of equipment that makes up the production line 10. 【0030】 The loader 11 holds the circuit board S (wiring board) before the components E are mounted and also carries the circuit board S into the production line 10. The components E include small electronic components such as LSIs, ICs, transistors, capacitors, and resistors. 【0031】 The printing press 12 is located upstream of the component mounting device 15 and prints a bonding material (solder) for joining components E to the substrate S onto the substrate S. Specifically, the printing press 12 is a screen printing machine and has the function of printing solder paste for joining components E to the substrate S onto the mounting surface of the substrate S. 【0032】 The printing inspection machine 13 has the function of inspecting the condition of the solder paste printed by the printing machine 12. 【0033】 The dispenser device 14 is located upstream of the component mounting device 15 and applies a bonding material (solder or adhesive) to the substrate S for bonding components E to the substrate S. Specifically, the dispenser device 14 has the function of applying solder paste or adhesive to the mounting surface of the substrate S for bonding components E to the substrate S. 【0034】 The component mounting device 15 has the function of mounting (installing) components E at predetermined mounting positions on a substrate S on which solder paste has been printed. Multiple component mounting devices 15 are arranged along the transport direction of the substrate S. 【0035】 The visual inspection device 16 is located downstream of the multiple component mounting devices 15. The visual inspection device 16 has the function of inspecting the appearance of the substrate S on which components E have been mounted by the component mounting devices 15. 【0036】 The buffer device 17 is located downstream of the component mounting device 15 and upstream of the reflow device 18. The buffer device 17 is also capable of holding substrates S. Specifically, the buffer device 17 is provided to temporarily hold substrates S. Furthermore, the buffer device 17 is provided to allow defective substrates S or substrates S that require inspection by an operator to be removed from the production line 10. The buffer device 17 also has a function to move the removed substrates S out of the way so that subsequent substrates S can pass through. 【0037】 The reflow apparatus 18 is located downstream of the component mounting apparatus 15 and heats the substrate S. Specifically, the reflow apparatus 18 has the function of melting solder by heating and joining components E to the electrode portions of the substrate S. The reflow apparatus 18 also has the function of drying or curing adhesive by heating and joining components E to the substrate S. Furthermore, the reflow apparatus 18 is configured to perform heating while transporting the substrate S on a lane. 【0038】 The visual inspection device 19 is located downstream of the reflow apparatus 18. The visual inspection device 19 has the function of inspecting the appearance of the substrate S after it has been heat-treated by the reflow apparatus 18. 【0039】 The unloader 20 is responsible for removing the substrate S from the production line 10 after the components E have been mounted. 【0040】 Between the multiple production lines 10, passages are provided for workers and autonomous mobile robots to pass through and perform tasks. 【0041】 Server 30 manages information related to the production line 10. Server 30 also acquires and stores images captured for recognition processing at each device in the production line 10. Furthermore, Server 30 manages data related to the type and number of substrates S produced by the production line 10, the type of components E to be mounted, the inventory quantity of components E, and mounting data. Server 30 is also configured to communicate with each device in the production line 10 (loader 11, printer 12, print inspection machine 13, dispenser device 14, component mounting device 15, visual inspection device 16, buffer device 17, reflow machine 18, visual inspection device 19, unloader 20). Server 30 is composed of a computer having a control unit such as a CPU, a storage unit, and a communication unit. 【0042】 As shown in Figure 2, the component mounting device 15 has the function of mounting (mounting) components E at predetermined mounting positions on a substrate S on which solder has been printed. The component mounting device 15 comprises a base 151, a pair of conveyors 152, a component supply unit 153, a head unit 154, a support unit 155, a pair of rail units 156, a component recognition and imaging unit 157, and a control unit 158. The component recognition and imaging unit 157 is an example of the "imaging unit" in the claims. 【0043】 A pair of conveyors 152 are installed on a base 151 and are configured to transport the substrate S in the X direction. The pair of conveyors 152 are also configured to hold the substrate S in a stopped position during transport at the mounting work position. Furthermore, the pair of conveyors 152 are configured so that the distance between them in the Y direction can be adjusted to match the dimensions of the substrate S. 【0044】 The component supply unit 153 supplies component E to the mounting head 154a of the head unit 154. The component supply unit 153 is located on the outside (Y1 side and Y2 side) of the pair of conveyors 152. The component supply unit 153 also has a plurality of tape feeders 153a. The mounting head 154a is an example of the "working unit" in the claims. 【0045】 The tape feeder 153a holds a reel around which tape is wound, holding multiple components E at predetermined intervals. The tape feeder 153a is configured to supply components E from its tip by rotating the reel to feed out the tape holding the components E. 【0046】 The head unit 154 is positioned to move between the above a pair of conveyors 152 and the above a component supply unit 153. The head unit 154 also includes a plurality of mounting heads 154a, each with a nozzle attached to its lower end, and a substrate recognition imaging unit 154b. The substrate recognition imaging unit 154b is an example of the "imaging unit" in the claims. 【0047】 The mounting head 154a performs operations on the substrate S. Specifically, the mounting head 154a is configured to mount components E onto the substrate S. Specifically, the mounting head 154a is configured to be vertically movable (movable in the Z direction), and is configured to attract and hold components E supplied from the tape feeder 153a using negative pressure generated at the tip of the nozzle by the air pressure generating unit, and to attach (mount) the components E to the mounting position on the substrate S. 【0048】 The substrate recognition imaging unit 154b is configured to image the fiducial mark FM of the substrate S in order to recognize the position and orientation of the substrate S to be worked on. By imaging and recognizing the position of the fiducial mark FM, it is possible to accurately obtain the mounting position of components E on the substrate S. The substrate recognition imaging unit 154b is configured to image the substrate S from above (Z1 direction side). 【0049】 The support section 155 includes an X-axis motor 155a. The support section 155 is configured to move the head unit 154 along the support section 155 in the X direction by driving the X-axis motor 155a. The support section 155 is supported at both ends by a pair of rail sections 156. 【0050】 A pair of rail sections 156 are fixed on a base 151. The rail section 156 on the X1 side includes a Y-axis motor 156a. The rail section 156 is configured to move the support section 155 along the pair of rail sections 156 in the Y direction, which is perpendicular to the X direction, by driving the Y-axis motor 156a. The head unit 154 is movable in the X and Y directions because the head unit 154 is movable along the support section 155 in the X direction, and the support section 155 is movable along the rail section 156 in the Y direction. 【0051】 The component recognition imaging unit 157 is fixed to the upper surface of the base 151. The component recognition imaging unit 157 is positioned outside (Y1 side and Y2 side) of the pair of conveyors 152. The component recognition imaging unit 157 is configured to image the component E, which is held in place by the nozzle of the mounting head 154a, from below (Z2 direction side) in order to recognize the suction state (suction posture) of the component E prior to mounting the component E. This makes it possible to acquire the suction state of the component E held in place by the nozzle of the mounting head 154a. 【0052】 The control unit 158 ​​is configured to control the overall operation of the component mounting apparatus 15, including the transport operation of the substrate S by the pair of conveyors 152, the mounting operation by the head unit 154, and the imaging operation by the component recognition imaging unit 157 and the substrate recognition imaging unit 154b. The control unit 158 ​​is also configured to communicate with the server 30. The control unit 158 ​​is configured to send and receive information such as production information and component information with the server 30. 【0053】 Furthermore, as shown in Figure 3, the control unit 158 ​​includes a storage unit 158a, an arithmetic unit 158b, an image processing board 158d, and a drive control unit 158e. The arithmetic unit 158b has a CPU and memory and performs processing according to the program of the software 158c. The image processing board 158d processes images captured by the substrate recognition imaging unit 154b and the component recognition imaging unit 157. The drive control unit 158e controls the transport operation of the conveyor 152 and the mounting operation of the head unit 154. Specifically, it controls the drive of the motors for operating the conveyor 152 and the head unit 154. 【0054】 In this embodiment, the calculation unit 158b is configured to adjust the image captured by the substrate recognition imaging unit 154b or the component recognition imaging unit 157 in order to adjust the amount of data before the recognition process. The control unit 158 ​​is configured to perform the recognition process based on the image adjusted by the calculation unit 158b. The adjusted image after recognition processing by the control unit 158 ​​is transmitted to the server 30 for storage. In other words, as shown in Figure 4, first, an image of the substrate or component is captured by the substrate recognition imaging unit 154b or the component recognition imaging unit 157 in order to perform the recognition process. The captured image is then adjusted by the calculation unit 158b to adjust the amount of data. After that, the image with the adjusted amount of data is recognized by the control unit 158. After that, the component E is mounted (implemented) on the substrate S based on the recognition process. In parallel with the implementation of component E, the image with the adjusted amount of data used for the recognition process is stored on the server 30. 【0055】 Furthermore, the calculation unit 158b determines whether or not to perform image adjustment processing for recognition processing based on at least one of the following: the shape or size of the component E mounted on the substrate S, the shape or size of the recognition mark on the substrate S, the outer dimensions of the component E to be recognized, the shape of the electrodes (lands) on the substrate S, the size of the electrodes (lands), the pitch of the electrodes (lands), the tolerance of the size of the component E, the allowable value for shape deformation, and the distribution state of brightness information. 【0056】 For example, if the shape of component E is simple (such as a rectangle) or if the size of component E is relatively large, the image data size will be adjusted, but if the shape of component E is complex (such as an outline including curves) or if the size of component E is relatively small (such as a very small component), the image data size will not be adjusted. Similarly, if the shape of the recognition mark on the substrate S is simple or if the size of the recognition mark is relatively large, the image data size will be adjusted, but if the shape of the recognition mark is complex or if the size of the recognition mark is relatively small, the image data size will not be adjusted. Furthermore, if the outer dimensions of component E are relatively large, the image data size will be adjusted, but if the outer dimensions of component E are relatively small, the image data size will not be adjusted. Additionally, if the size of the electrodes on the substrate S is relatively large or the electrode pitch (distance between electrodes) is relatively large, the image data size will be adjusted, but if the size of the electrodes on the substrate S is relatively small or the electrode pitch (distance between electrodes) is relatively small, the image data size will not be adjusted. 【0057】 Furthermore, the arithmetic unit 158b performs at least one of the following processes on the image captured by the substrate recognition imaging unit 154b or the component recognition imaging unit 157: pixel downsampling, bit depth reduction, resolution reduction, and image trimming, thereby reducing the amount of image data. 【0058】 As shown in Figure 5, the binning process, which reduces the resolution of an image, works by combining the brightness values ​​of N pixels to generate a brightness value for one pixel, thereby reducing the amount of data in the image. 【0059】 As shown in Figure 6, the process of downsampling pixels in an image reduces the number of pixels in the image by downsampling N pixels. This reduces the amount of data in the image. 【0060】 As shown in Figure 7, the process of reducing the bit depth of an image involves reducing the bit depth (grayscale) of each pixel. For example, an 8-bit (256 grayscale) bit depth is changed to a lower bit depth such as 6-bit (64 grayscale), 4-bit (16 grayscale), or 1-bit (2 grayscale). This reduces the amount of data in the image. 【0061】 As shown in Figures 8 and 9, the image trimming process removes the area of ​​interest (ROI) necessary for recognition, while trimming the rest of the image. In this case, as shown in Figure 8, the area including the entire component may be retained. Alternatively, as shown in Figure 9, feature portions necessary for recognition (such as read portions) may be retained. In this case, the image with adjusted data volume is given positional information of the trimmed image (XY coordinates of the reference position, width, and height). In other words, the calculation unit 158b performs trimming while retaining the portion necessary for recognition processing of the imaged object, and records the positional information of the trimmed image in association with the adjusted image. 【0062】 The associated and recorded positional information is used when displaying a cropped image, positioning the cropped image in the same location as the original image. In other words, the cropped image is positioned within a background color (a single color such as white or black) to generate the displayed image. This makes it easy to understand the positional relationship of the cropped image. The image generated by positioning the cropped image in the corresponding location based on the positional information is then displayed on the display unit. 【0063】 Furthermore, the calculation unit 158b selects an image adjustment processing method based on at least one of the following: the shape of the recognition mark on the substrate S, the size of the recognition mark on the substrate S, the shape of the component E mounted on the substrate S, the external dimensions of the component E to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the size of the component E, the allowable value of shape deformation, and the distribution state of luminance information. Specifically, the calculation unit 158b selects an image adjustment processing method from the following processing methods: pixel downsampling, bit depth reduction, resolution reduction, and image trimming. 【0064】 Furthermore, the arithmetic unit 158b determines at least one of the following based on the image target: the number of pixels to be thinned out in the pixel thinning process, the number of bits to be reduced in the bit depth reduction process, and the scaling rate of the resolution reduction process. 【0065】 For example, if one side of the component's outer dimensions is less than A1, no adjustment is made to the image data size. If one side of the component's outer dimensions is A1 or greater but less than A2, the image data size is adjusted by reducing the image resolution (binning). If one side of the component's outer dimensions is A2 or greater but less than A3, the image data size is adjusted by downsampling the image pixels. If one side of the component's outer dimensions is A3 or greater, the image data size is adjusted by downsampling the image pixels and reducing the bit depth. 【0066】 Furthermore, if the size or pitch of the component's electrodes (leads) is less than B1, no adjustment is made to the image data size. If the size or pitch of the component's electrodes (leads) is between B1 and B2, the image data size is adjusted by a process that reduces the image resolution (binning). If the size or pitch of the component's electrodes (leads) is B2 or greater, the image data size is adjusted by a process that reduces the number of pixels in the image. 【0067】 Furthermore, if the terminals of component E are ball-shaped, reducing the image resolution or downsampling the image pixels will result in an uneven contour shape; therefore, the processes of reducing image resolution (binning) and downsampling the image pixels are not performed. Also, if the main body of component E is a light color (such as white), reducing the bit depth will reduce the grayscale resolution and make the contrast difference with the background unclear; therefore, the process of reducing the bit depth is not performed. 【0068】 Furthermore, the image data size is adjusted by increasing the data reduction rate when the component is large and decreasing it when the component is small. 【0069】 Furthermore, the arithmetic unit 158b determines at least one of the following based on at least one of the following: the shape of the recognition mark on the substrate S, the size of the recognition mark on the substrate S, the shape of the component E mounted on the substrate S, the external dimensions of the component E to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the size of the component E, the allowable value of shape deformation, and the distribution state of brightness information: the number of pixels to be thinned out in the pixel thinning process, the number of bits to be thinned out in the bit depth reduction process, and the scaling rate of the resolution reduction process. 【0070】 Specifically, when the tolerance of component E's size is large, the number of pixels to be decimated, the number of bits to be reduced in the bit depth reduction process, and the scaling rate of the resolution reduction process are reduced. When the tolerance of component E's size is small, the number of pixels to be decimated, the number of bits to be reduced in the bit depth reduction process, and the scaling rate of the resolution reduction process are increased. 【0071】 Furthermore, if the tolerance for shape deformation (deformation of electrode balls or bending of leads) is small, the number of pixels to be thinned during pixel thinning, the number of bits to be thinned during bit depth reduction, and the scaling rate of resolution reduction are reduced. Conversely, if the tolerance for shape deformation is large, the number of pixels to be thinned during pixel thinning, the number of bits to be thinned during bit depth reduction, and the scaling rate of resolution reduction are increased. 【0072】 Furthermore, when the luminance information distribution (contrast) is small, the number of pixels to be thinned during pixel thinning, the number of bits to be reduced during bit depth reduction, and the reduction rate of the resolution reduction are reduced. Conversely, when the luminance information distribution (contrast) is large, the number of pixels to be thinned during pixel thinning, the number of bits to be reduced during bit depth reduction, and the reduction rate of the resolution reduction are increased. 【0073】 Furthermore, for component E with a small lead pitch, the number of pixels to be decimated, the number of bits to be reduced in the bit depth reduction process, and the scaling rate of the resolution reduction process are reduced. Conversely, for component E with a large lead pitch, the number of pixels to be decimated, the number of bits to be reduced in the bit depth reduction process, and the scaling rate of the resolution reduction process are increased. 【0074】 Furthermore, the calculation unit 158b determines whether or not to perform image adjustment processing for recognition processing, and selects at least one of the following processing methods for image adjustment processing, based on at least one of the following: setting the mounting operation mode of component E, setting the board production program, setting component library data, and the state of the electrode pattern at the mounting position, with priority given to the shape of the recognition mark on the substrate S, the size of the recognition mark on the substrate S, the shape of the component E to be mounted on the substrate S, the external dimensions of the component E to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the size of component E, the allowable value of shape deformation, and the conditions of the distribution state of brightness information. 【0075】 Specifically, when the mounting operation mode of component E can be switched between normal mode and high-precision mode, if high-precision mode is selected, the image data size for recognition processing will not be adjusted in order to perform the recognition process accurately. Alternatively, a processing method that enables accurate recognition processing will be selected to perform the image adjustment process. Furthermore, if there is a required accuracy level for the recognition process in the board production program, a decision will be made on whether or not to adjust the image data size based on the required accuracy level. In other words, if the required accuracy level is high and adjusting the image data size would not meet the required accuracy, the image data size for recognition processing will not be adjusted. Alternatively, a processing method that enables accurate recognition processing will be selected to perform the image adjustment process. 【0076】 Furthermore, if the component library data containing information about component E indicates that accurate recognition is required, the image data size for the recognition process for component E will not be adjusted. Alternatively, an image adjustment process will be performed by selecting a processing method that enables accurate recognition. 【0077】 Furthermore, as shown in Figure 10, if the electrode patterns (lands) at the mounting positions on the substrate S are dense, no adjustment is made to the amount of data in the image used for recognition processing. Alternatively, an image adjustment process is performed by selecting a processing method that allows for accurate recognition processing. On the other hand, if the electrode patterns (lands) at the mounting positions on the substrate S are sparse, the amount of data in the image used for recognition processing may be adjusted according to other conditions. The state of the electrode patterns (lands) may be automatically determined by the substrate recognition imaging unit 154b imaging the substrate S and measuring the clearance of the electrode patterns. 【0078】 Furthermore, as shown in Figure 11, if the clearance between the lead of component E and the land on the substrate S is small, no adjustment is made to the amount of data in the image to be processed for recognition. Alternatively, an image adjustment process is performed by selecting a processing method that allows for accurate recognition. On the other hand, if the clearance between the lead of component E and the land on the substrate S is large, the amount of data in the image to be processed for recognition may be adjusted according to other conditions. 【0079】 The adjustment of the image data volume may be performed by the substrate recognition imaging unit 154b, the component recognition imaging unit 157, the image processing board 158d, or the software 158c of the calculation unit 158b. Alternatively, the adjustment of the image data volume may be performed by other hardware or software of the control unit 158. 【0080】 When the amount of image data is adjusted by the substrate recognition imaging unit 154b, the component recognition imaging unit 157, or the image processing board 158d, processing conditions for multiple images are acquired collectively. For example, as shown in Figure 12, when components E are picked up by multiple mounting heads 154a of the head unit 154, and then each component E is recognized by the multiple mounting heads 154a and mounted on the substrate S, the processing conditions for the multiple components E picked up by the multiple mounting heads 154a are transmitted from the control unit 158 ​​of the component mounting device 15 to the component recognition imaging unit 157 or the image processing board 158d. 【0081】 As shown in Figure 12, a component E is attracted to each of the multiple mounting heads 154a of the head unit 154. The imaging conditions and image adjustment conditions for each component E are then transmitted from the control unit 158 ​​to the component recognition imaging unit 157 or image processing board 158d, which performs the adjustment processing. An image of the component is then captured by the component recognition imaging unit 157 for recognition processing. The captured image is then subjected to data volume adjustment processing by the component recognition imaging unit 157 or image processing board 158d. The image with adjusted data volume is then transmitted from the component recognition imaging unit 157 or image processing board 158d to the control unit 158. Subsequently, the image with adjusted data volume is recognized by the control unit 158. After that, the component E is mounted (mounted) onto the substrate S based on the recognition processing. In parallel with the mounting of the component E, the image with adjusted data volume used for the recognition processing is stored in the server 30. 【0082】 Furthermore, the control unit 158 ​​performs a process to determine the conditions for performing the image data adjustment process. Specifically, as shown in Figure 13, the control unit 158 ​​compares the recognition result based on the image adjusted by the calculation unit 158b with the recognition result based on the image not adjusted by the calculation unit 158b, and determines the conditions for the image adjustment process performed by the calculation unit 158b. 【0083】 In the image adjustment condition determination process, first, the substrate recognition imaging unit 154b or the component recognition imaging unit 157 images the object to be recognized. Then, the control unit 158 ​​performs recognition processing based on the image before adjustment. For example, the position and orientation (rotation angle) of component E are calculated through the recognition processing. In addition, the captured image is subjected to data volume adjustment processing according to predetermined conditions. Then, the control unit 158 ​​performs recognition processing based on the adjusted image. After that, the control unit 158 ​​determines whether the difference in recognition results is within an acceptable range based on the recognition results from the image before adjustment and the recognition results from the image after adjustment. The control unit 158 ​​determines the conditions for adjusting the image data volume based on the conditions under which the difference in recognition results falls within an acceptable range. In this case, conditions may be searched for by starting with conditions that have a large data volume reduction rate and changing the conditions until the difference in recognition results falls within an acceptable range. Alternatively, conditions may be searched for by starting with conditions that have a small data volume reduction rate and changing the conditions until the difference in recognition results falls outside an acceptable range. 【0084】 (Effects of this embodiment) In this embodiment, the following effects can be obtained. 【0085】 In this embodiment, as described above, a calculation unit 158b is provided that adjusts the image captured by the substrate recognition imaging unit 154b or the component recognition imaging unit 157 to adjust the amount of data before the recognition process, and a control unit 158 ​​performs recognition processing based on the image adjusted by the calculation unit 158b. This makes it possible to use the same image for the recognition process and the image saved after the recognition process, so that the recognition process using the saved image can be accurately reproduced for the recognition process performed in the component mounting device 15 during verification, etc. 【0086】 Furthermore, in this embodiment, as described above, the calculation unit 158b determines whether or not to perform image adjustment processing for recognition based on at least one of the following: the shape of the recognition mark on the substrate S, the size of the recognition mark on the substrate S, the shape of the component E mounted on the substrate S, the external dimensions of the component E to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the size of the component E, the allowable value of shape deformation, and the distribution state of brightness information. As a result, image adjustment processing for recognition can be performed based on the shape of the recognition mark on the substrate S, the size of the recognition mark on the substrate S, the shape of the component E mounted on the substrate S, the external dimensions of the component E to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the size of the component E, the allowable value of shape deformation, and the distribution state of brightness information, if there is no impediment to the recognition process, thereby suppressing a decrease in the accuracy of the recognition process. 【0087】 Furthermore, in this embodiment, as described above, the calculation unit 158b performs adjustment processing on the image captured by the substrate recognition imaging unit 154b or the component recognition imaging unit 157 by performing at least one of the following: pixel downsampling, bit depth reduction, resolution reduction, and image trimming, in order to reduce the amount of image data. This allows for optimal processing to reduce the amount of image data, taking into account the impact of the recognition process, the effect of reducing the amount of data, and the processing time. As a result, it is possible to suppress the large amount of image data that is saved for verification purposes. 【0088】 Furthermore, in this embodiment, as described above, the calculation unit 158b selects a processing method for image adjustment based on at least one of the following: the shape of the recognition mark on the substrate S, the size of the recognition mark on the substrate S, the shape of the component E mounted on the substrate S, the external dimensions of the component E to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the size of the component E, the allowable value for shape deformation, and the distribution state of brightness information. This allows the processing to reduce the amount of image data by using a processing method that does not significantly affect the recognition accuracy, based on the shape of the recognition mark on the substrate S, the size of the recognition mark on the substrate S, the shape of the component E mounted on the substrate S, the external dimensions of the component E to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the size of the component E, the allowable value for shape deformation, and the distribution state of brightness information. 【0089】 Furthermore, in this embodiment, as described above, the arithmetic unit 158b determines at least one of the following based on the image target: the number of pixels to be thinned out in the pixel thinning process, the number of bits to be reduced in the bit depth reduction process, and the reduction rate of the scale of the resolution reduction process. This makes it possible to reduce the amount of image data to an extent that does not affect the recognition accuracy of the image target. 【0090】 Furthermore, in this embodiment, as described above, the calculation unit 158b determines at least one of the following based on at least one of the following: the shape of the recognition mark on the substrate S, the size of the recognition mark on the substrate S, the shape of the component E mounted on the substrate S, the external dimensions of the component E to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the size of the component E, the allowable value for shape deformation, and the distribution state of brightness information: the number of pixels to be thinned out in the pixel thinning process, the number of bits to be thinned out in the bit depth reduction process, and the scaling rate of the resolution reduction process. As a result, based on the shape of the recognition mark on the substrate S, the size of the recognition mark on the substrate S, the shape of the component E mounted on the substrate S, the external dimensions of the component E to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the size of the component E, the allowable value for shape deformation, and the distribution state of brightness information, the amount of image data can be reduced by decreasing the amount of image data when recognition accuracy is required, and by increasing the amount of image data when recognition accuracy is relatively low. 【0091】 Furthermore, in this embodiment, as described above, the calculation unit 158b performs trimming, leaving only the portion necessary for the recognition process of the image target, and records the position information of the trimmed image in association with the adjusted image. This makes it possible to reduce the amount of image data without degrading image quality through trimming. In addition, the position information of the trimmed image makes it easy to determine the position of the adjusted image. 【0092】 Furthermore, in this embodiment, as described above, the calculation unit 158b, prioritizing the shape of the recognition mark on the substrate S, the size of the recognition mark on the substrate S, the shape of the component E to be mounted on the substrate S, the external size of the component E to be recognized, the shape of the electrodes, the size of the electrodes, the pitch of the electrodes, the tolerance of the size of the component E, the allowable value of shape deformation, and the conditions of the distribution state of brightness information, determines whether or not to perform image adjustment processing for recognition processing, and selects at least one of the processing methods for image adjustment processing, based on at least one of the following: setting the mounting operation mode of the component E, setting the substrate production program, setting the component library data, and the state of the electrode pattern at the mounting position. As a result, when mounting components with high precision, image adjustment processing is not performed, or image adjustment processing is performed using a processing method that does not significantly affect the recognition accuracy, so that recognition processing can be performed with high accuracy based on the image. 【0093】 Furthermore, in this embodiment, as described above, the image adjustment process is performed by the substrate recognition imaging unit 154b, the component recognition imaging unit 157, and the software 158c of the image processing board 158d or the calculation unit 158b. This allows the image adjustment process to be performed in such a way that the amount of image data is adjusted by the software 158c of the substrate recognition imaging unit 154b, the component recognition imaging unit 157, and the image processing board 158d or the calculation unit 158b, taking into consideration the balance of the processing load for image adjustment. 【0094】 Furthermore, in this embodiment, when the image adjustment process is performed by the substrate recognition imaging unit 154b, the component recognition imaging unit 157, or the image processing board 158d, as described above, processing conditions for multiple images are acquired collectively. This minimizes the communication time required to transmit processing conditions to the substrate recognition imaging unit 154b, the component recognition imaging unit 157, or the image processing board 158d, thereby suppressing any temporal impact on the work performed on the substrate S. 【0095】 Furthermore, in this embodiment, as described above, the control unit 158 ​​compares the recognition result based on the image adjusted by the calculation unit 158b with the recognition result based on the image not adjusted by the calculation unit 158b, and determines the conditions for the image adjustment processing performed by the calculation unit 158b. This makes it easy for the control unit 158 ​​to determine suitable conditions for the image adjustment processing performed by the calculation unit 158b. 【0096】 (modified version) It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than by the description of the embodiments above, and further includes all modifications (exceptions) within the meaning and scope equivalent to the claims. 【0097】 For example, the above embodiment shows an example of applying the substrate processing apparatus of the present invention to a component mounting apparatus, but the present invention is not limited thereto. In the present invention, any apparatus that performs recognition processing based on an image captured by an imaging unit may be applied as the substrate processing apparatus of the present invention. For example, a printing press or a dispenser apparatus may be applied as the substrate processing apparatus of the present invention. 【0098】 Furthermore, while this embodiment shows an example of a component mounting device as a substrate work apparatus having a plurality of mounting heads (working parts) arranged in a straight line, the present invention is not limited to this. In the present invention, the component mounting device as a substrate work apparatus may have a plurality of mounting heads (working parts) arranged to be rotatable in a ring shape. 【0099】 Furthermore, while this embodiment shows an example of a configuration in which recognition processing is performed based on an image with adjusted data size, followed by component mounting processing and image saving processing in parallel, the present invention is not limited to this. In the present invention, image saving processing may be performed in parallel with recognition processing after adjusting the data size of the image. Also, these processes may be performed sequentially. 【0100】 Furthermore, although the above embodiment shows an example of a circuit board work system that includes multiple component mounting devices, the present invention is not limited thereto. In the present invention, the circuit board work system may include a single component mounting device. 【0101】 Furthermore, although the above embodiment shows an example of a configuration in which multiple production lines are provided in the substrate work system, the present invention is not limited thereto. In the present invention, the substrate work system may be provided with only one production line. [Explanation of symbols] 【0102】 12. Printing machine (circuit board processing equipment) 14. Dispenser device (circuit board handling device) 15. Component mounting equipment (PCB work equipment) 30 servers 100 PCB assembly system 154a Mounting head (working section) 154b Substrate Recognition and Imaging Unit (Imaging Unit, Image Adjustment Unit) 157 Component Recognition and Imaging Unit (Imaging Unit, Image Adjustment Unit) 158 Control Unit 158b Arithmetic unit (image adjustment unit) 158c Software (Image Adjustment Section) 158d Image Processing Board (Image Adjustment Section) E parts S substrate

Claims

[Claim 1] A work unit for performing work on a substrate, An imaging unit that takes images for recognition processing, Before recognition processing, an image adjustment unit adjusts the image captured by the imaging unit to adjust the amount of data, The system comprises a control unit that performs recognition processing based on an image adjusted by the image adjustment unit, The image adjustment unit determines at least one of the following based on the shape of the recognition mark on the substrate, the size of the recognition mark on the substrate, the shape of the component to be mounted on the substrate, the outer dimensions of the component to be recognized, the shape of the electrode, the size of the electrode, the pitch of the electrode, the tolerance of the component size, the allowable value of shape deformation, and the distribution state of brightness information: the number of pixels to be thinned out in the pixel thinning process, the number of bits to be reduced in the bit depth reduction process, and the reduction rate of the scale of the resolution reduction process. The image adjustment unit then performs at least one of the following on the image captured by the imaging unit to reduce the amount of data in the image: pixel thinning, bit depth reduction, and resolution reduction process, thereby performing an image adjustment process to reduce the amount of data in the image. [Claim 2] The substrate processing apparatus according to claim 1, wherein the image adjustment unit is provided on the imaging unit or image processing board, or is configured by software. [Claim 3] The substrate processing apparatus according to claim 1, wherein the image adjustment unit performs a trimming process, leaving the portion necessary for recognition processing of the image target, and records the position information of the trimmed image in association with the adjusted image. [Claim 4] The substrate work apparatus according to claim 1, wherein the image adjustment unit selects a processing method for image adjustment based on at least one of the following: the shape of the recognition mark on the substrate, the size of the recognition mark on the substrate, the shape of the component to be mounted on the substrate, the outer dimensions of the component to be recognized, the shape of the electrode, the size of the electrode, the pitch of the electrode, the tolerance of the size of the component, the allowable value of shape deformation, and the distribution state of brightness information. [Claim 5] The substrate work apparatus according to claim 4, wherein the image adjustment unit determines whether or not to perform image adjustment processing for recognition processing and selects a processing method for image adjustment processing, based on at least one of the following: setting of the component mounting operation mode, setting of the substrate production program, setting of component library data, and the state of the electrode pattern at the mounting position, with priority given to the shape of the recognition mark on the substrate, the size of the recognition mark on the substrate, the shape of the component to be mounted on the substrate, the external dimensions of the component to be recognized, the shape of the electrode, the size of the electrode, the pitch of the electrode, the tolerance of the size of the component, the allowable value of shape deformation, and the conditions of the distribution state of brightness information. [Claim 6] The substrate processing apparatus according to claim 2, wherein the image adjustment unit, when provided in the imaging unit or the image processing board, acquires processing conditions for multiple images at once. [Claim 7] A work area where work is performed on the circuit board, An imaging unit that takes images for recognition processing, Before recognition processing, an image adjustment unit adjusts the image captured by the imaging unit to adjust the amount of data, The system comprises a control unit that performs recognition processing based on an image adjusted by the image adjustment unit, A substrate processing apparatus in which the control unit compares the recognition result based on the image adjusted by the image adjustment unit with the recognition result based on the image not adjusted by the image adjustment unit, and determines the conditions for performing the image adjustment process by the image adjustment unit.

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