Optoelectronics Configuration

Abstract

To monitor the space inside and / or outside a motor vehicle.SOLUTION: A monitoring system comprises a plurality of photoelectric sensor elements 30 adapted to generate a 3-dimensional mapping of objects in a space. The sensor elements are electrically connected to a substantially transparent carrier layer adapted to be disposed between first and second substantially transparent layers to form a substantially transparent laminate structure 20 for use in one or more windows and / or roof panel of a motor vehicle.SELECTED DRAWING: Figure 1

Description

【Technical Field】 【0001】 The present invention relates to glazing, in particular to optoelectronic arrangements in a substantially transparent laminated structure for use in vehicles. The present invention further relates to a photo - electronics sensor system for monitoring a space, in particular the interior and exterior of a motor vehicle, and for providing a 3D mapping of objects within the space. 【0002】 The present invention claims priority from German Patent Application No. 10 2019 133 448.9 (December 6, 2019), Danish Patent Application No. PA202070106 (February 21, 2020), German Patent Application No. 10 2020 123 227.6 (September 4, 2020), and German Patent Application No. 10 2020 123 229.2 (September 4, 2020), the entire disclosures of which are incorporated herein by reference. 【Background Art】 【0003】 Photo - electronics monitoring systems play an important role in today's automotive industry for safety applications and driver assistance. One area of interest is the monitoring of the vehicle cabin or interior, and also the determination of various characteristics of the driver. The problem with deploying sensor systems for such applications is to place the system within different interiors in a discrete yet well - sighted manner. 【0004】 In light of these problems, an object of the present invention is to provide a sensor system that can provide a 3D mapping of a space having a defined position regardless of the vehicle type. A further object is to provide such a sensor system that can be easily deployed in different vehicle types. 【0005】 In addition, there is a need to monitor and / or display information to vehicle occupants and external persons, and this need extends to other partially or fully enclosed spaces such as buildings. 【0006】 German Patent Application Publication No. 10 2017 122 852 discloses a cover for an automobile roof comprising a laminated structure. The laminated structure comprises a planar extending window glass, a planar extending film, and an adhesive layer disposed between the window glass and the film for fixing the film to the window glass. Multiple miniature light-emitting diodes are arranged in the adhesive layer. German Patent Application Publication No. 10 2017 122 852 also discloses an automobile including an automobile roof having such a cover. 【0007】 U.S. Patent Application Publication No. 2019 / 0248122 discloses a method for manufacturing composite window glass for automobiles. The method comprises providing a first window glass and a second window glass. The method further comprises placing a plastic film between the first window glass and the second window glass and placing light-emitting diodes (LEDs) on the surface of the plastic film. Furthermore, the method comprises locally liquefying the plastic film, at least in the area of ​​the LEDs, by means of a heating source positioned on or away from the outer surface of the first or second window glass. Additionally, the method comprises introducing the LEDs into the liquefied plastic film while displacing a predetermined volume of the plastic film, and the method comprises laminating the first window glass and the second window glass with the intervening plastic film after introducing the LEDs into the plastic film. 【0008】 International Publication No. 2019 / 186513 discloses a laminated automotive glazing comprising an outer glass layer, an inner glass layer, at least one plastic intermediate layer between the outer and inner glass layers, and at least one camera system, the camera system being laminated between the glass layers as an integral permanent component of the laminate. 【0009】 International Publication No. 2019 / 008493 discloses a vehicle laminate comprising an outer glass layer, at least an inner glass layer, at least one plastic bonding layer disposed between the outer and inner glass layers, and at least one LED embedded in the plastic bonding layer. Wires are substantially embedded within the plastic bonding layer, forming a circuit for supplying power to the LED. 【0010】 An object of the present invention is to provide an improved optoelectronic arrangement, in particular an at least partially transparent optoelectronic arrangement, that provides improved functionality. In some embodiments, the present invention also aims to integrate electronic or optoelectronic components, such as light sources and / or sensors, into at least partially transparent window glass, particularly in vehicles. [Overview of the project] [Problems that the invention aims to solve] 【0011】 The above and further objectives are achieved in the monitoring system defined in the attached items. 【0012】 More specifically, the present invention relates to a monitoring system for monitoring the interior and / or exterior space of an automobile, comprising a plurality of photoelectronic sensor elements adapted to generate a three-dimensional mapping of objects in the space, wherein the sensor elements are electrically connected to a substantially transparent carrier layer (90) adapted to be positioned between a first substantially transparent layer and a second substantially transparent layer, forming a substantially transparent laminated structure for use on one or more windows and / or roof panels of an automobile. 【0013】 Placing multiple sensors on a carrier, which can be integrated within a transparent laminate that functions as a window and / or roof panel, means that the sensor system can be spread out around the wide, clear surfaces of the vehicle. This then allows for optimal placement of sensors to see the position of occupants inside the vehicle for safety applications, to recognize the driver inside the vehicle to control vehicle starting, or to recognize the driver standing outside the vehicle to select the driver's preference and control door locks. 【0014】 According to a preferred embodiment of the present invention, if the sensor elements are arranged on the carrier layer in a two-dimensional configuration, the possible applications are further expanded. 【0015】 According to one embodiment of the present invention, the sensor element is configured to monitor space using at least one of triangulation, structured light, and Time of Flight (ToF). 【0016】 Preferably, the sensor elements are arranged to generate three-dimensional detection zones inside and / or outside the vehicle when mounted on the vehicle's stacked structure. 【0017】 In one preferred embodiment, the sensor element is mounted on the carrier layer. In an alternative embodiment, the sensor element is embedded in the carrier layer, which allows the resulting laminate to be thinner. 【0018】 A bonding layer may be provided between the carrier layer and at least one of the first and second layers. Alternatively, the carrier layer may act as a bonding layer between the first and second layers. 【0019】 Preferably, the carrier layer is flexible and includes wiring for the sensor's power supply and signal carrier. In this way, the sensor system can be easily deployed to different parts of the vehicle and adapted to different vehicle types. Also, the sensor system may occupy a large surface area if necessary. 【0020】 In one preferred embodiment, the sensor preferably includes a photoelectronic radiating element and a photoelectronic detector element, wherein each photoelectronic detector element preferably includes at least one lens configured to provide a directional field of view. 【0021】 In a more advantageous embodiment, the sensor includes image processing and control circuits for controlling at least one photoelectronic radiator element and / or photoelectronic detector element. Enabling the integration of image processing and control circuits in a stacked structure further simplifies the deployment of the system to different vehicle types. 【0022】 In one particularly preferred embodiment of the present invention, the sensor has dimensions of 500 μm or less, preferably 200 μm or less. By limiting the components to this size, it is ensured that they are virtually imperceptible to vehicle occupants and that the sensor can be placed at any position on the window or roof panel. 【0023】 The present invention further exists within a transparent laminated structure for use in the windows and / or roof panels of an automobile, configured as described above and equipped with a monitoring system as described later, and preferably within a motor having such a transparent laminated structure in at least two of the side windows, rear windows, front windows and roof panels of an automobile, ensuring sufficient coverage to enable effective 3D mapping of the interior. 【0024】 In some embodiments of the present invention, for example, an optoelectronic arrangement for use in a transparent glazing element of a vehicle is proposed. The optoelectronic device comprises a substantially transparent carrier layer, at least one conductive layer including a conductive path provided on at least one side of the carrier layer, at least a plurality of LEDs disposed on the carrier layer and electrically coupled to the conductive path on the conductive layer, and means for determining the temperature of at least one of the LEDs. 【0025】 In some embodiments, the optoelectronics arrangement comprises means for adjusting the operating parameters of the optoelectronic components and at least the LEDs in response to a determined temperature. For example, the adjustment means can modify the current supplied to the LEDs to correct or modify the color of the LEDs and / or extend the lifetime of the LEDs. 【0026】 In one embodiment of the optoelectronics, the means for determining the temperature of at least one LED comprises at least one temperature sensor arranged on at least one side of the carrier layer and electrically coupled to a conductor path on the conductor layer. 【0027】 In one embodiment, a reflector is arranged around the temperature sensor to reflect heat and / or light from the carrier layer. 【0028】 In one embodiment of the present invention, the distance between the temperature sensor and the at least one LED is at most 5 cm, preferably at most 1 cm, and even more preferably at most 0.5 cm. 【0029】 In one embodiment of the present invention, the means for determining the temperature of at least one LED includes means for measuring the forward voltage (Vf) of the at least one LED. 【0030】 In some embodiments of the present invention, the means for measuring the temperature of at least one LED includes means for measuring the conductivity of a conductor path in a conductive layer. 【0031】 In one embodiment of the present invention, the optoelectronic device includes at least one substantially transparent outer layer and at least one substantially transparent intermediate layer disposed between the carrier layer and the at least one outer layer. 【0032】 In one embodiment of the present invention, the carrier layer is thermally insulating. In a further embodiment of the present invention, the carrier layer comprises two layers separated by a thermally insulating layer. 【0033】 In one embodiment of the present invention, a plurality of LEDs are arranged on both sides of the carrier layer. 【0034】 In some embodiments of the present invention, at least one photodetector is mounted on at least one side of the carrier layer to provide a signal indicating the light intensity incident on the optoelectronic arrangement. 【0035】 In one embodiment of the present invention, the optoelectronic arrangement includes a directional structure positioned on a photodetector to channel light to the photodetector as a function of the direction of the received light. 【0036】 In some embodiments of the present invention, the optoelectronic device includes a directional structure positioned on at least one LED, the directional structure being configured to guide light from the LED in a predetermined direction. 【0037】 The present invention further relates to a carrier layer for use in a vehicle including such an optoelectronic arrangement and in a method for operating an optoelectronic arrangement, in a substantially transparent laminated structure that forms a glazing element suitable for a vehicle. 【0038】 Embodiments of the present invention include an optoelectronic arrangement for use in, for example, a transparent glazing element of a vehicle, comprising at least one substantially transparent carrier layer, at least one conductor layer including a conductor path provided on at least one side of the carrier layer, at least one light-emitting element disposed on the carrier layer and electrically coupled to the conductor path on the conductor layer, and at least one proximity sensor and / or touch sensor disposed on at least one of the carrier layers, and further coupled to a control module for controlling the operation of at least one light-emitting element in response to information from at least one proximity sensor and / or touch sensor. By controlling one or more light-emitting elements in response to information from the proximity sensor and / or touch sensor, the optoelectronic arrangement becomes interactive, responding to movement toward the arrangement and possibly to touch of the arrangement. Such arrangements are applied to automotive glazing elements such as windshields, side windows or roof panels, but are also applied to static window advertisements or transparent information planes. 【0039】 In some embodiments, the proximity sensor includes at least one infrared emitter and at least one infrared detector. 【0040】 Preferably, the touch sensor includes a capacitive touch sensor. 【0041】 In one embodiment of the present invention, the optoelectronic arrangement includes at least one substantially transparent carrier layer having a conductive strip that functions as a capacitive touch sensor. 【0042】 In some embodiments of the present invention, the control unit is at least partially mounted on at least one carrier layer. 【0043】 In a preferred embodiment of the present invention, the light-emitting element includes an LED, preferably a microLED. 【0044】 In some embodiments of the present invention, the light-emitting element includes a laser. 【0045】 Preferably, the optoelectronic arrangement includes at least one ambient light detector mounted on at least one carrier layer, and the control unit is configured to control the illuminance of the light-emitting element in response to a signal from at least one ambient light detector. 【0046】 In some embodiments of the present invention, at least one light-emitting element and at least one proximity sensor are arranged in a group, and a control unit is configured to control the operation of each group of light-emitting elements in response to a signal from at least one proximity sensor in the group. 【0047】 In a preferred embodiment of the present invention, the group includes at least one ambient light detector, and the control unit is configured to control the illuminance of the group's light-emitting elements in response to signals from the ambient light detectors of the same group. 【0048】 In some embodiments of the present invention, the optoelectronic arrangement includes a lens structure positioned on at least one of the proximity sensors. 【0049】 In a preferred embodiment of the present invention, at least one optical layer is coupled to a carrier layer on a light-emitting element to diffuse light from each light-emitting element into a light patch with a substantially uniform illuminance and a diameter larger than that of the light-emitting element. 【0050】 In some embodiments, the optical layer includes an array of optical segments on the input surface and an array of optical segments on the output surface, where the segments on the output surface are larger than the segments on the input surface. 【0051】 Preferably, the side dimensions of the light-emitting element, proximity sensor, and touch sensor are ≤300 μm. 【0052】 In some embodiments, at least one carrier layer is flexible and preferably made of thermoplastic material. 【0053】 Preferably, at least one conductive layer is made of a substantially transparent metal oxide such as ITO. 【0054】 Another aspect of the present invention includes a vehicle having at least one optoelectronic arrangement claimed and described herein. 【0055】 In some embodiments, the optoelectronic arrangement, stacked structure, or monitoring system includes a carrier layer, also called a carrier film, and front and rear layers, also called cover layers or outer layers. The carrier layer may be positioned between two cover layers. The carrier layer may support at least one radiator element, also called an LED, and / or at least one detector element, also called a photodetector or temperature sensor. In some embodiments, at least one radiator element and / or detector element may be partially or completely embedded in the carrier layer. 【0056】 In some embodiments, the carrier layer is at least partially transparent and may contain or consist of materials such as high-grade or low-grade polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), (colorless) polyimide (PI), polyurethane (PU), poly(methyl methacrylate) (PMMA), polycyclic aromatic hydrocarbons (PAK), or any other suitable material. In particular, the carrier layer may contain or consist of at least partially transparent plastics, in particular at least partially transparent foils, in particular flexible foils. 【0057】 Each of the front and rear layers may be made from glass material, plastic material and / or any other suitable material. Each of the front and rear layers may contain only one layer or several layers of the same or different material. 【0058】 In some embodiments, the optoelectronic arrangement further comprises at least one laminated layer, also called a junction layer, which is a laminated structure or monitoring system. The first laminated layer may be located between the carrier layer and the front layer, and optionally, the second laminated layer may be located between the carrier layer and the back layer. 【0059】 At least one layer of the stacked material is Molten material layer, or Adhesive layers, especially hot melt adhesive layers, Resins such as ethylene vinyl acetate (EVA) and polyvinyl butyral (PVB), or It can be formed by one of the ionomer-based systems. 【0060】 In some embodiments, at least one laminate can encapsulate the carrier layer within the same layer. At least one laminate can have the same height as the carrier layer, but at least one laminate can also have a height that is different from the height of the carrier layer, particularly a much larger height. Since the carrier layer can be completely embedded in at least one laminate, at least one laminate can surround the carrier layer as well as circumferentially. 【0061】 In some embodiments, at least one laminated layer can be at least partially transparent. In some embodiments, at least one laminated layer can be blackened, resulting in a laminated layer that is at least partially transparent. If the optoelectronic arrangement includes two or more laminated layers, none of the laminated layers can be blackened, or one of the laminated layers, selected laminated layers, or all of the laminated layers can be blackened. 【0062】 In some embodiments, at least one radiator element, in particular an LED, and / or detector element can be less than 300 μm, and particularly less than 150 μm. These spatial extensions make at least one radiator element and / or detector element virtually invisible to the human eye. 【0063】 In some embodiments, at least one radiator element is an LED. The LED can be called a mini-LED, which is a small LED having a margin length in the range of less than 200 μm, especially less than 40 μm, and especially 200 μm to 10 μm. Another range is 150 μm to 40 μm. 【0064】 LEDs can also be called microLEDs (also called μLEDs) or μLED chips, especially when their edge length is in the range of 100 μm to 10 μm. In some embodiments, the LEDs may have a spatial dimension of 90 × 150 μm, or they may have a spatial dimension of 75 × 125 μm. 【0065】 In some embodiments, a mini-LED or μLED chip can be an unpackaged semiconductor chip. Being unpackaged may mean that the chip does not have a housing around its semiconductor layer, such as an unpackaged semiconductor die. In some embodiments, being unpackaged may mean that the chip does not contain organic materials. Therefore, an unpackaged device does not contain organic compounds containing carbon in covalent bonds. 【0066】 In some embodiments, each radiator element may include a mini-LED or μLED chip configured to emit light of a selected color. In some embodiments, each radiator element may include one or more mini-LEDs or μLEDs, such as an RGB pixel containing three mini-LEDs or μLEDs. An RGB pixel may emit light of, for example, red, green, and blue, as well as any mixed color. 【0067】 In some embodiments, the RGB pixels may further include one or more integrated circuits (ICs), particularly miniature integrated circuits, such as microintegrated circuits (μICs). 【0068】 In some embodiments, the optoelectronic arrangement, stacked structure, or monitoring system comprises at least one conductor wire, and preferably two conductor wires, also called conductor layers, to supply electrical energy and / or data signals, in particular, to at least one radiator element and / or detector element. 【0069】 In some embodiments, the carrier layer supports at least one conductor wire. However, in some embodiments, at least one laminated layer can support at least one conductor wire. 【0070】 In some embodiments, at least one conductor wire may be made of a conductive material such as copper. At least one conductor wire may be coated and / or blackened to reduce the reflectivity of the outer surface area of ​​the at least one conductor wire. The coating may be, for example, a palladium or molybdenum coating. In some embodiments, at least one conductor wire may have a width in the range of 5 μm to 50 μm. 【0071】 In some embodiments, at least one conductor wire can be formed as a conductive mesh, particularly a metal mesh. The mesh can be coated and / or blackened, in particular, to reduce the reflectivity of the outer surface area of ​​the conductive mesh. The coating can be, for example, a palladium or molybdenum coating. 【0072】 In some embodiments, the optoelectronic arrangement comprises a layer stack including a carrier layer and a first cover and a second cover. The carrier layer is, in particular, an intermediate layer located between the first cover layer and the second cover layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is located on the carrier layer, and at least one layer of the layer stack, and preferably all layers of the layer stack, is at least partially transparent. The layer stack includes at least one conductive layer, which is located between two adjacent layers of the layer stack or embedded within a layer. 【0073】 In some embodiments, the at least one conductive layer includes at least one conductive wire electrically connected to the contact pad of the optoelectronic light source. The at least one conductive layer can be a good electrically and thermally conductive material such as copper, silver, gold, and aluminum. The at least one conductive layer, and in particular the at least one conductive wire, can be coated and / or blackened to reduce the reflectivity of the outer surface area of ​​the at least one conductive wire. The coating can be, for example, a palladium or molybdenum coating. In some embodiments, the at least one wire can have a width in the range of 5 μm to 50 μm. 【0074】 At least one conductive layer may include a conductive mesh, such as a metal mesh, particularly a copper mesh. The mesh may have nodes and interconnections between the knots, preferably with at least a majority of the interconnections uninterrupted. Thus, at least one conductive layer may have a structure comprising multiple conductive wirings connected to one another. 【0075】 The mesh can have a regular or irregular pattern, and an irregular pattern can be preferred because it can increase the transparency of the conductive layer. This is because irregular patterns may be more difficult for the human eye to perceive. 【0076】 In some embodiments, the conductive mesh is coated and / or blackened, particularly to reduce the reflectivity of the outer surface area of ​​the conductive mesh. The coating may be, for example, a palladium or molybdenum coating. 【0077】 At least some embodiments of the optoelectronic arrangements, stacked structures, or monitoring systems described herein can be installed on non-flat or curved surfaces, for example, on the outside or inside of a vehicle or building. This is particularly possible because at least some embodiments of the optoelectronic arrangements, stacked structures, or monitoring systems described herein can be constructed based on a flexible layered structure. 【0078】 Therefore, the present invention also relates to a larger entity, such as a vehicle or building, having at least one optoelectronic arrangement, stacked structure, or monitoring system on its outer or inner surface, particularly on its outer or inner surface. 【0079】 The description using exemplary embodiments does not limit the invention thereto. Rather, the invention includes any new features and any combination of features, and in particular any combination of features in the claims, even if such features or combinations themselves are not expressly described in the claims or exemplary embodiments. [Brief explanation of the drawing] 【0080】 The present invention will be described in more detail with reference to the following drawings, which illustrate exemplary embodiments. [Figure 1] This is a schematic diagram of the sensor placement inside a vehicle according to one embodiment of the present invention. [Figure 2] A schematic representation of the detection field according to one embodiment of the present invention is shown below. [Figure 3] A schematic representation of a detection field according to a further embodiment of the present invention is shown below. [Figure 4] A schematic representation of a detection field according to yet another embodiment of the present invention is shown below. [Figure 5] A schematic representation of a substantially transparent laminate having a 3D sensor according to a first embodiment of the present invention is shown. [Figure 6] A schematic representation of a substantially transparent laminate having a 3D sensor according to a further embodiment of the present invention is shown. [Figure 7] A schematic representation of a substantially transparent laminate having a 3D sensor according to yet another embodiment of the present invention is shown. [Figure 8] The structures of the radiator element and receiver element according to the present invention are schematically shown. [Figure 9] A schematic representation of a substantially transparent laminate having a temperature sensor according to one embodiment of the present invention is shown. [Figure 10a] This is a schematic diagram of the placement of temperature sensors inside a car according to one embodiment of the present invention. [Figure 10b] This is a schematic diagram of the placement of temperature sensors inside a car according to one embodiment of the present invention. [Figure 11] A schematic portion of a substantially transparent laminate having a temperature sensor according to a further embodiment of the present invention is shown. [Figure 12] A schematic portion of a substantially transparent laminate having a temperature sensor according to a further embodiment of the present invention is shown. [Figure 13] A schematic portion of a substantially transparent laminate having a temperature sensor according to a further embodiment of the present invention is shown. [Figure 14] A schematic portion of a substantially transparent laminate having a temperature sensor according to a further embodiment of the present invention is shown. [Figure 15] A schematic portion of a substantially transparent laminate having a temperature sensor according to yet another embodiment of the present invention is shown. [Figure 16a] A schematic arrangement of a temperature sensor and a solar light detector according to one embodiment of the present invention is shown. [Figure 16b]A schematic arrangement of a temperature sensor and a solar light detector according to one embodiment of the present invention is shown. [Figure 17] An optoelectronic arrangement according to one embodiment of the present invention is schematically shown. [Figure 18] A schematic diagram of an optoelectronic arrangement structure according to a further embodiment of the present invention is shown. [Figure 19] An optoelectronic arrangement according to yet another embodiment of the present invention is schematically shown. [Figure 20a] The operating principle of an optoelectronic device according to one embodiment of the present invention is schematically shown. [Figure 20b] The operating principle of an optoelectronic device according to one embodiment of the present invention is schematically shown. [Figure 20c] The operating principle of an optoelectronic device according to one embodiment of the present invention is schematically shown. [Figure 21a] Further schematic explanations of the operating principles according to embodiments of the present invention are provided below. [Figure 21b] Further schematic explanations of the operating principles according to embodiments of the present invention are provided below. [Figure 21c] Further schematic explanations of the operating principles according to embodiments of the present invention are provided below. [Figure 22] A schematic diagram of a carrier layer having an optical segment structure is shown. [Figure 23] A schematic diagram of a laminated structure having optical segments as shown in Figure 22 is provided. [Figure 24] Figure 23 schematically shows the illumination pattern obtained with the layered structure. [Figure 25] A schematic representation of a laminated structure according to a further embodiment of the present invention is shown. [Figure 26] A schematic plan view of the laminated structure is shown in Figure 25. [Figure 27] A schematic diagram of a laminated structure according to one embodiment of the present invention is shown. [Figure 28] A schematic plan view of the laminated structure is shown in Figure 27. [Modes for carrying out the invention] 【0081】 Figure 1 schematically shows a plan view of the automobile 10. In the exemplary embodiment shown herein, the motor vehicle is a car, but the present invention is applicable to any vehicle with glass windows, including but not limited to buses, vans, and trucks. The vehicle 10 is conventionally fitted with front, rear, and side windows enclosing the interior space of the car. The vehicle may further include a glazed roof panel (not shown). The windows are made from substantially transparent laminated structures 20, as will be described in more detail below. The laminated structure 20 of each window further includes one or more sensors 30 that form part of a 3D sensor system, in particular a monitoring system. In the illustrated embodiment, the sensors 30 are directed toward the interior of the automobile, as indicated by triangles that form the conical field of view of each sensor. 【0082】 The sensor 30 comprises a photoelectronic radiator element 301 and a detector element 302 distributed on the surface of a stacked structure 30 and controlled to work together to detect objects and / or movement in the space being monitored. In the illustrated example, one sensor 30 can represent one or more photoelectronic radiators 301, one or more photoelectronic detectors 302, or a combination of one or more radiators and detectors. As a result, each sensor 30 can represent a single pixel or an array of pixels. The photoelectronic detector element 302 can be controlled to detect reflected or transmitted light. In the context of this disclosure, the term light refers to any wavelength between about 240 nm and about 900 nm, and thus encompasses ultraviolet light from the visible spectrum to infrared light. Thus, the photoelectronic radiator element 301 and the detector element 302 can operate at appropriate wavelengths within this range. 【0083】 Examples of radiator elements 301 include LEDs such as IREDs, or lasers such as VCSELs (Vertical Cavity Surface Emitting Lasers), configured to emit a spot or line of light. Detector elements 302 may include one or an array of photodiodes, photodetectors, image sensors such as CCD or CMOS sensors, or ToF cameras. The radiator elements 301 and detector elements 302 configured within the sensor system are configured and controlled to detect objects in three dimensions. This can be achieved using the principles of triangulation or structured light. Alternatively, the detector element 302 may comprise a Time of Flight (ToF) sensor or array that can work with a controlled radiator element to provide both 2D image and depth information by measuring either the phase shift between the emitted and received light signals, or the time difference between the emitted light pulses and the received signals. Preferably, the radiator and detector elements 301, 302 operate in invisible light, such as infrared, to minimize disturbance to vehicle occupants and mitigate interference from ambient lighting. 【0084】 Figure 2 schematically shows the arrangement of sensors 30 at different locations on the vehicle's windows to provide detection paths that intersect with the entire space. Each photoelectronic emitter 301 and detector 302 can be positioned to emit and detect conical light in a specific direction or orientation. In the figure, only the two light-emitting sensors 30 are shown. These sensors 30 are positioned on the side and front windows of the vehicle, respectively. The light emitted by these sensors 30 is detected by the detector elements 302 of the remaining sensors 30, which are located on the opposite side of the emitting window and on the adjacent window, as indicated by the optical path 40. By intelligently positioning the sensors 30, these optical paths substantially cover the space inside the vehicle, resulting in a three-dimensional detection zone. 【0085】 Figure 3 schematically shows an exemplary embodiment of a sensor arrangement including a ToF detector element 302 that operates in conjunction with a VCSEL radiator element 301 to monitor the interior of a vehicle. In this embodiment, the sensor 30 generates three-dimensional data about objects within a designated area, preferably a substantially conical detection zone, which is indicated by a shaded area 50. The overlapping detection zones 50 allow for complete monitoring of the interior space. 【0086】 Figure 4 shows a further embodiment of the sensor system using one or more ToF sensors 30 configured within the driver's side window and oriented outward, thus generating an external 3D detection zone 60. This application can be used for driver recognition to enable automatic unlocking of the vehicle. Those skilled in the art will understand that the ToF sensors 30 can be replaced with 3D sensors 30 using, for example, triangulation or structured light. 【0087】 In the illustrated embodiment, the sensor 30 is shown to be in substantially the same horizontal plane as the interior of the vehicle. However, it will be understood by those skilled in the art that the sensor 30, or at least the radiator element and / or detector elements 301, 302, may be positioned in different horizontal planes to ensure complete or more targeted monitoring of the space. In addition to the side windows, front window, and rear window, the sensor system described may be provided in a glass roof panel. Further possibilities include different sensor types incorporated within the same vehicle or the same laminated structure 20 that constitutes the windows. Thus, a ToF sensor positioned in the front windshield or the driver's side window may be used to recognize the driver inside the vehicle, and possibly outside the driver's door, while LEDs and photodetectors positioned in the same and other windows may be used to monitor the position of passengers using triangulation, structured light, or other mapping techniques. 【0088】 Next, referring to Figures 5, 6, and 7, different embodiments of portions of the transparent laminated structure 20 for use as a window or roof portion of an automobile incorporating the 3D sensor of the present invention are schematically shown. In these figures, similar figures indicate similar structures. The drawings are provided for illustrative purposes only, and the relative dimensions shown do not represent actual structures. 【0089】 In Figure 5, the transparent laminated structure 20 is composed of a front layer 70 and a rear layer 80 made of a substantially transparent material such as glass, polycarbonate, or acrylic (PMMA) plastic. An intermediate carrier layer or film 90 is interposed between these two layers 70, 80, and is bonded to the front and rear layers 70, 80, respectively, by a bonding layer 100. The bonding layer 100 is also substantially transparent and has its own adhesive properties, and may be composed of, for example, a thermoplastic resin. In the illustrated embodiment, only one front layer 70 and one rear layer 80 are shown, but these layers may be composed of further layers or films, for example, for UV protection. The carrier layer or film 90 is preferably made of a flexible, substantially transparent material such as a thermoplastic resin. Wiring (not shown) with connecting channels or vias as desired is provided on one or both sides to provide contacts to various components. 【0090】 In the illustrated example, the radiator and receiver elements 301 and 302 are arranged on the carrier layer 90 and electrically connected to the wiring. Located on the opposite side of the carrier layer 90, and similarly electrically connected to the wiring on that layer and to the radiator and receiver elements 301 and 302, is the image processing and control circuit 303 for controlling the operation of the radiator and detector elements 301 and 302 and for processing the received signals. The components 301, 302 and 303 may be directly bonded to the carrier layer 90, or they may be bonded or soldered to contacts in the wiring, and the wiring may be bonded to the carrier layer 90. 【0091】 The wiring on the carrier layer 90 serves to supply power to elements 301, 302, and 303. Depending on the application, it is possible to utilize wiring already present in the window stacking structure, such as that provided for window heating. The wiring also enables communication between the sensor elements 301, 302, and 303, and preferably between the image processing and control circuit 303 and further processing and control circuits not present on the carrier layer. This further circuit may be used for image processing and thus reduces the processing power required for the image processing and control circuit 303. Additionally or alternatively, this additional processing circuit may include, for example, a control unit for unlocking the vehicle in response to driver recognition, or for enabling starting in response to driver recognition or airbag deployment in response to the detected driver's position. 【0092】 The wiring and components 301, 302, and 303 present on the carrier layer 90 are preferably sized such that they are substantially imperceptible to the occupants of the vehicle, so that the laminated structure 30 is substantially transparent. To this end, all dimensions and wiring widths of the components 301, 302, and 303 are preferably less than 500 μm, and more preferably less than 200 μm. In this way, the radiator and receiver elements 301, 302 and associated processing and control circuits 303 can be distributed in a two-dimensional layout on the carrier layer, and therefore on the laminated structure 30 forming the windows and / or roof of the vehicle, without substantially affecting the transparency of the windows or glazing panels. 【0093】 In the embodiment shown in Figure 5, the radiator element 301 and the receiver element 302, as well as the processing and control circuit 303, are embedded within the bonding layer 100. This can be achieved by locally heating the bonding layer around these components to liquefy it before attaching the front layer 70 and the rear layer 80. 【0094】 In the exemplary embodiment shown herein, the radiator element 301 is grouped together with the receiver element 302 and the processing and control circuit 303. However, as those skilled in the art will understand, this configuration is for illustrative purposes only, and it is not necessary to arrange the radiator element and receiver elements 301, 302 in pairs, and furthermore, the processing and control circuit 303 can be associated with multiple radiator elements 301 and / or receiver elements 302. As described above, each radiator element and / or receiver element 301, 302 can represent a single pixel or an array of pixels. Furthermore, it is possible to package the radiator element 301 and receiver element 302 together as a single unit. 【0095】 During the manufacturing of the laminated structure 20, the sensor 30, i.e., the radiator and receiver elements 301, 302 and the image processing and control circuit 303, is mounted on the carrier layer 90, which already has wiring, and the front and rear layers 70, 80 are subsequently joined thereto. The carrier layer 90 can be further provided with wiring and components in the desired arrangement, and then cut or marked to the appropriate dimensions before assembling the laminated structure 30. 【0096】 Figure 6 shows an alternative arrangement of the stacked structure 30. This configuration differs from the configuration in Figure 5 in that the photoelectronic radiators and receiving components 301, 302, as well as the image processing and control circuit 303, are embedded within the carrier layer 90, so that the fronts of the radiator and receiving components 301, 302 are essentially coplanar or at the same level as the front of the carrier layer 90. The processing and control circuit 303 may be arranged as shown, i.e., coplanar with the rear surface of the carrier layer 90, or alternatively, at the same level as the front of this layer 90. 【0097】 Figure 7 shows yet another arrangement of the laminated structure 30. In this arrangement as well, the photoelectronic components 301, 302, and 303 are embedded in the carrier layer 90. However, no additional bonding layer is provided. Instead, there are front and rear layers 70 and 80 of the laminated structure that are to be directly attached on the carrier layer 90, with the carrier layer acting as the bonding material. 【0098】 Referring to Figure 8, the structures of the radiator element 301 and the receiver element 302 are shown in more detail. The photoelectronic radiator element 301 comprises a conventional semiconductor body 310 and a lens 311, depending on the type of device (μLED, IRED, VCSEL, etc.). Similarly, the detection element 302 comprises a semiconductor body 320 and a lens 321. The lenses 311 and 321 may be standard optical lenses. Alternatively, they may be formed as Fresnel lenses or composed of diffractive optical elements. The lenses 311 and 321 serve to limit the respective radiated electric field and field of view of the devices 310 and 320 below, thus allowing for more precise configuration of the required optical path and detection zone. Preferably, lens 311 limits the radiation to an angle of ±45° from the normal. Lens 321 of the photoelectronic detection element may limit the received light to a similar angle. 【0099】 Figure 9 shows an embodiment of an optoelectronic device according to another aspect of the present invention. Figure 9 shows a further laminated structure 200 that includes at least a number of LEDs 240, but which can locally measure temperature. This laminated structure 200 can be used for glazing of buildings or vehicles and can therefore form one or more windows or roof panels of a vehicle. It may also be used as a partially glazed cover for other surfaces such as the walls of a building or the dashboard of a vehicle. The illustrated laminated structure 200 is preferably substantially transparent, but may be colored or tinted to more or less filter light. 【0100】 The laminated structure 200 is substantially transparent and has a cover layer 210 made of glass or any suitable glazing material such as polycarbonate or acrylic (PMMA) plastic. This outer layer 210 may be colored or tinted. In this arrangement, the cover layer 210 forms the front of the laminated structure for display purposes. On the opposite surface of the laminated structure 200 is a carrier layer or film 230 on which optoelectronic elements including LEDs 240 are mounted, and which may further include dedicated components 250 for temperature determination. The carrier layer 230 may be flexible and preferably substantially transparent. The carrier layer is preferably made of a thermoplastic material, such as PET. Further comprising are electrical connections or contacts that supply power to the optoelectronic components 240, 250 and form a structured conductor layer 260 for bonding the optoelectronic elements 240, 250. The conductive layer 260 can be made of a metal such as silver or gold, or a substantially transparent conductive material such as a conductive oxide of indium tin oxide or ITO. In particular, when made of an opaque material, the conductive path can have a width small enough to be substantially imperceptible to the human eye at a distance of 0.5 m. In general, the conductive path width should be ≤300 nm. 【0101】 The carrier layer 230 may be made from a thermoplastic or other suitable flexible material that allows the carrier layer to conform to the shape of the outer layer. In other words, the shape of the laminated structure 200 can be substantially flat or curved, and can be defined primarily by the outer layer 210 or other layers. Other layers not shown may be present in the laminated structure 210. 【0102】 The optoelectronic component includes one or more light-emitting elements 240, which may be LEDs in a package that can include one or more semiconductor chips. Furthermore, one or more temperature sensors 250 may be provided, which may be thermistors (NTC or PTC), platinum resistance thermometers, etc. A further laminated layer 220 encloses the optoelectronic elements 240, 250 and bonds the outer layers together. 【0103】 Both the LED 240 and the temperature sensor 250 enable the determination of local temperature, i.e., the temperature immediately surrounding the component itself. The temperature sensor 250 provides a temperature-dependent signal according to the specific technique employed. The LED 240 also enables temperature determination, for example, by measuring the LED forward voltage Vf, which decreases with increasing temperature. Local temperature changes may also be determined by monitoring the conductivity of the conductor layer 260, which also changes with temperature. Monitoring of the LED forward voltage is preferably performed by an LED driver circuit or control circuit 280 that controls the operation of the LED 240. This control circuit 280 can also monitor the conductivity of the conductor paths in the conductor layer 260 near one or a group of LEDs 240. The control circuit 280 may also be coupled to the temperature sensor 250, if present. Alternatively, a separate circuit may be provided for monitoring and / or controlling the temperature sensor. The control circuit 280 may be outside the laminated structure and may be connected via contacts. Alternatively, the control circuit 280 may be mounted on the carrier layer 230 together with the optoelectronic elements 240 and 250 (not shown). In the latter arrangement, the control circuit 280 is kept small and, as a result, is preferably configured to control fewer LED chips, or a single LED chip, i.e., a single pixel. 【0104】 In this way, the determination of the forward voltage Vf for determining the temperature change may be performed for each LED chip. When measuring the conductivity of the conductive layer 260, the same level of resolution can be achieved. For example, the conductivity of the conductive paths within the conductive layer 260 can be measured between groups of LEDs 240 or groups of LED chips to obtain a smaller resolution for local temperature. If a dedicated temperature sensor 250 is used, the temperature resolution obtained depends on the distance between the temperature sensor 250 and the LEDs 240 or group of LEDs being monitored, and also on the area covered by the group of LEDs being monitored. To ensure optimal operating conditions, it is preferable that the temperature sensor be placed as close as possible to the LED chip or chip whose temperature is being determined. Therefore, the distance between the temperature sensor 250 and the LEDs 240 or group of LEDs, where the temperature is being determined, is 5 cm or less, preferably 1 cm or less, and more preferably 0.5 cm or less. Processing circuits for processing temperature signals from the temperature sensor 250, LEDs 240, and / or processing circuits for determining the conductivity of the conductive layer 260 may be located outside the laminated structure 210 or housed within the laminated structure 200, for example, mounted on the carrier layer 230 and electrically coupled to the conductive layer 260. 【0105】 Preferably, the optoelectronic components 240, 250, and any associated drive and processing circuits implemented within the stacked structure have edge dimensions of 300 μm or less. As previously mentioned, at a distance of 0.5 m, the human eye can no longer perceive objects with dimensions of 300 μm or less. Therefore, the stacked structure is essentially transparent to the human eye unless the LED 240 is illuminated. In some embodiments, micro-LEDs (also called μLEDs) or μLED chips can be used as optoelectronic components. μLEDs are small LEDs, for example, with edge lengths of less than 70 μm, particularly less than 20 μm, and especially in the range of 1 μm to 10 μm. Another range is 10 to 60 μm. This can result in a surface area of ​​several hundred μm² to several tens of μm². For example, a μ-LED can have a surface area of ​​about 2500 μm² and an edge length of about 50 μm. In some cases, a μ-LED may have an edge length of 5 μm or less, resulting in a surface area size of less than 30 μm². The typical height of such μ-LEDs is, for example, in the range of 1.5 μm to 10 μm. 【0106】 Microlight-emitting diode (LED) chips, also known as μLED chips, can be used as optoelectronic components. These microlight-emitting diodes can form pixels or subpixels and emit light of a selected color. 【0107】 When the LED240 is used as a temperature measuring means, it is preferable that it simultaneously provides other functions, for example, as a display means for illumination, or as a radiator in a radiator / detector proximity sensor. 【0108】 When operated at a constant current, the lumen output of the LED240 changes as a function of junction temperature. The color output of an LED also typically changes with temperature. This temperature dependence is also a function of the semiconductor material used. For example, AlInGaP LEDs, typically used for red and amber light, vary more with temperature than InGaN LEDs, which are used for blue, green, and cyan. In RGB LED configurations or similar combined color configurations, the balance of colors also changes with temperature. LEDs and other photoelectronic components will also have a shorter lifespan if they are operated outside their rated temperature. In LEDs used in vehicle glazing or buildings, the danger is typically high temperatures due to the heating effect of sunlight hitting the windows and internal heating. 【0109】 The effect of increasing local temperature can be mitigated according to the present invention by adjusting operating parameters, i.e., by reducing power dissipation of the affected LEDs by changing the current throughput under the control of the control circuit 280. Similarly, a determined temperature drop may trigger a power reduction to the LEDs by the control circuit 280. In some embodiments, the temperature of all LEDs can be determined at vehicle startup and optionally periodically, and the LED operation can be calibrated or adjusted to optimize operation and / or lifespan. In some embodiments, excessive local temperature changes can generate an alert to trigger an adjustment of the operating parameters of the affected LEDs to mitigate the effects of the temperature change. 【0110】 In some embodiments, the determined temperature can be used to adjust the operating parameters of other optoelectronic or electronic components included in the laminated structure, such as current and / or voltage. Relevant components include photodetectors such as photodiodes, CCD or CMOS cameras, TOF cameras, and lasers. 【0111】 In the configuration shown in Figure 9, the temperature measured by the temperature-sensing optoelectronic elements 240, 250 represents the temperature of the laminated structure 200 and is therefore influenced by the temperatures on both sides of this structure. 【0112】 In some embodiments of the present invention, the thermal insulating layer can be positioned on the underside of the structure shown in Figure 1, i.e., adjacent to the carrier layer 230. Temperature measurement by the optoelectronic elements 240, 250 can thereby be limited to the opposite side of the laminated structure 200. In some embodiments, local temperature determination can be used to adjust the air conditioning and / or heating in a local manner, for example, using a window 20 or glaze region that represents a local temperature resolution. In this case, temperature readings from each monitoring region can be relayed or signaled by the control circuit 280 to a separate air conditioning control unit in the vehicle or building. 【0113】 Next, referring to Figures 10a and 10b, one example of the arrangement of the laminated structure used in a vehicle is shown in a side view and a top view, respectively. The vehicle is an automobile 10, but the laminated structure 200 can similarly be used in any vehicle having glazing including mirrors, or any vehicle having other surfaces to which the laminated structure can be applied, such as elements of a dashboard. The illustrated vehicle 10 has front and rear windshields and side windows, all of which are at least partially constructed by the laminated structure 200 as described herein. In some embodiments, the laminated structure 200 may be used on only some of the glazed windows of the vehicle 10. Optoelectronic components, including LEDs 240, and optionally dedicated temperature sensors 250, are also dispersed on the surface of the glazed windows. Each optoelectronic component can provide information about the local temperature. As described above, optionally, the local temperature around the optoelectronic component may be determined by measuring the change in conductivity of the conductive layer 260. 【0114】 In the vehicle 10 shown in Figure 10, four temperature locations can be defined based on the front and rear windshields and the four side windows 20. Furthermore, it is possible to monitor and control the temperature separately based on the front and rear side windows 20. In this way, the interior temperature of the vehicle can be maintained at an essentially uniform level regardless of different external conditions such as sunlight and wind direction. 【0115】 Next, referring to Figure 11, a further embodiment of the laminated structure 200 is shown, in which the LED 240 is positioned to provide light on both sides of the structure. As in the arrangement in Figure 9, the LED 240 and the temperature sensor 250 are positioned on the carrier layer 230 in electrical contact with the conductor layer 260 deposited on the carrier layer 230. 【0116】 However, in this configuration, the carrier layer is essentially double-sided, having an additional conductive layer 260 on its opposing side. The LEDs 240 and temperature sensor 250 are shown mounted on the underside of the carrier layer, electrically in contact with the second conductive layer 260. The conductive layer 260 may be separate or connected, for example, by vias through the carrier layer. On both sides of the carrier layer 230, a cover layer 210 is bonded by means of a bonding layer 220, in the same manner as described in relation to Figure 9. As in the previously described embodiments, additional intermediate or outer layers may be present within the structure 200. In this embodiment and subsequent embodiments of the laminated structure 200, the control circuits 280 are omitted for clarity, but it should be understood that one or more control circuits 280 are provided as part of the laminated structure 200 or connected thereto. In the configuration of Figure 11, the temperature of each LED chip or group of LED chips may be determined by monitoring the forward voltage to the LED or LED, by determining the conductivity of the contacts on the conductive layer 260, or by using a dedicated temperature sensor 250 such as an NTC. Similar to the arrangement shown in Figure 9, a flexible, substantially transparent carrier layer 260 is provided with a structured conductor layer 260 to which the LEDs 240 and optionally one or more temperature sensors 250 are attached. However, in the arrangement of Figure 11, conductor layers 260 are provided on both sides of the carrier layer, and the optoelectronic components are also bonded to this conductive layer 260 below the carrier layer. The optoelectronic components 240, 250 on both sides of the carrier layer 260 are encapsulated within the laminate layer 220, similar to the arrangement shown in Figure 9. Two substantially transparent outer layers 210 form the outer surface of the laminate structure. With respect to the arrangement of Figure 9, these outer layers are made of glass or any suitable glazing material such as polycarbonate or acrylic (PMMA) plastic, and one or both of the outer layers 210 may be colored or tinted. The laminate structure 200 may include other layers not shown. The carrier layer 230 is thermally insulating so that the optoelectronic components 240 and 250 on one side do not depend at least partially on temperature fluctuations on the other side. 【0117】 Figure 12 shows a further variation of the double-sided laminated structure of Figure 11, where the temperature can be measured and adjusted independently for either side. In this arrangement, the carrier layer consists of two carrier layer portions 230' separated by a thermal insulating layer 232 sandwiched between them. Each carrier layer portion 230' comprises a conductive layer 260 to provide a double-sided carrier layer structure to which optoelectronic elements can be connected. The thermal insulating layer 232 is preferably a material that reflects and / or blocks the transmission of IR radiation to reduce localized heating of the laminated structure 200. 【0118】 Figure 13 shows another variation of a double-sided laminated structure configured to provide separate temperature determination on each side, and thus enable separate internal and external temperature determination within a vehicle or building. This configuration is similar to that shown in Figure 11, with similar reference numerals given to similar elements, and will not be described further here. This structure differs from that shown in Figure 11 by reflecting light and infrared radiation away from the underside of the laminated structure, and therefore away from the lower layer temperature sensor, by directional reflectors 252 formed on the underside and around the four side walls of the temperature sensor 250. The reflectors 252 are preferably reflective structures formed on the carrier layer 230 or the conductor layer 260 and embedded within the laminated layer. The reflective structures 252 may include mirrors, metal coatings, and / or dielectric coatings such as distributed Bragg reflectors. Preferably, the reflectors 252 are configured to reflect light and infrared radiation back toward the outer surface of the laminated structure, i.e., the outer surface of a vehicle window or building. This arrangement is particularly effective when temperature differences are caused by sunlight shining from the outside onto windows or other glazed structures. 【0119】 Further variations of the double-sided laminated structure are shown in Figure 14. This configuration has a laminated structure similar to that shown in Figure 13. However, in this arrangement, additional optoelectronic elements in the form of photodetectors 270 are mounted on the carrier layer and electrically coupled to the conductor layer 230. The photodetectors 270 are preferably located near the LEDs, and optionally a temperature sensor is also located there. In the illustrated arrangement, the photodetectors 270 are mounted on both sides of the carrier layer 230, but the laminated structure 200 may include one or more photodetectors 270 on only one side. The photodetectors may be photodiodes or the like, and are preferably suitable for detecting visible light or white light in order to detect the level of sunlight irradiating the laminated structure. The light intensity signal from the photodetectors 270 is received and processed by a control circuit 280 (see Figure 9) or other circuit modules that communicate with the control circuit 280. The temperatures of the optoelectronic components 240, 250 within the laminated structure 200 are always affected by the length and intensity of the sunlight hitting the structure. Therefore, the photodetector 270 makes it possible to take into account the effects of sunlight. In some embodiments, it may be possible to adjust for temperature fluctuations using only measurements from one or more photodetectors. 【0120】 The photodetector 270 may also be combined with a directional structure 272 formed around the upper surface of the photodiode and embedded within the laminated layer 220. A modified example of this laminated structure is shown in Figure 15. The directional structure 272 is configured to collect light in a specific directional portion or propagation channel depending on the direction in which the light is received. It may be formed from a material having a higher refractive index than the surrounding material. Preferably, the difference in refractive index should be greater than 0.02. Light incident perpendicular to the laminated structure is collected by all portions of the directional structure 272, while light incident on the laminated structure surface at a larger or smaller angle is collected by fewer portions of the directional structure. Thus, the received intensity is a function of the direction in which the light is received, and the impact of sunlight on the laminated structure can be determined according to the angle of incidence. 【0121】 Alternatively, one or more LEDs 240 may be provided with a similar directional beamforming structure 242 to allow the emitted light to be guided in a specific direction instead of being uniformly emitted within the cone. In this way, the light can be clearly seen at a given viewing angle but not at other angles. 【0122】 Examples of applications of a laminated structure incorporating a photodetector 270 are shown in Figures 16a and 16b. Figures 16a and 16b show an automobile in a side view and a top view, respectively. The automobile 10 has front and rear windshields and side windows 20, all of which are at least partially formed by a laminated structure 200 as described herein. Optoelectronic elements in the form of one or more LEDs 240 are placed within all windows, as indicated by dots. The laminated structure 200 forming at least a portion of the front windshield further includes a photodetector 270 associated with a directional structure 272 (not shown). The directional structure 272 channels light from different directions, as indicated by a conical directional beam shape 274 shown in the figure. This allows the photodetector to determine the degree of shading, which depends on the intensity of the incident radiation or the sum of the radiation through different beam directions. 【0123】 Similar to the earlier embodiments described herein, the carrier layers 230, 230' can be provided as a single unit having a single or double conductive layer 260, optoelectronic elements 240, 250, 270, a reflector 252 if present, and optionally a control circuit 280 mounted thereon. This element can then be incorporated into the laminated structure 200 by coupling it to an intermediate laminated layer 220 having a directional structure 272, and to an outer layer, i.e., layer 210. 【0124】 Figure 17 schematically illustrates an optoelectronic arrangement according to a further aspect of the present invention. Figure 17 shows a laminated structure 400 including an optoelectronic arrangement for interactively providing information, specifically information in the form of illuminated symbols, to a user. The laminated structure includes a carrier layer 410 having electrical connections or contacts that form a conductor layer 411 for supplying power to the optoelectronic components. The conductor layer 260 can be made of a substantially transparent conductive material such as a metal such as silver, gold, or copper, or a conductive oxide such as indium tin oxide or ITO. In particular, if made of an opaque material, the conductor path can have a width small enough to be substantially imperceptible to the human eye at a distance of 0.5 m. Generally, the conductor path width should be ≤300 nm. Electrically coupled to this conductor layer 411 are a number of optoelectronic components, specifically an LED radiator 408 that emits one or more visible colors, an infrared radiator (IR radiator) 404, and an infrared detector (IR detector) 406. 【0125】 The carrier layer 410 is preferably made of a flexible and substantially transparent material, and may be a thermoplastic material such as PET or similar. 【0126】 As in the embodiments described herein, the optoelectronic components 404, 406, 408, and any associated drive and processing circuits mounted within the stacked structure are virtually imperceptible to the human eye when viewed from a distance of 1 m. Preferably, these components have edge dimensions of less than 300 μm. Thus, the stacked structure is essentially transparent to the human eye unless illuminated by the LED 240. 【0127】 In some embodiments, micro-LEDs (also called μLEDs) or μLED chips can be used as optoelectronic components. A μLED is a small LED, for example, with a margin length of less than 70 μm, particularly less than 20 μm, and especially in the range of 1 μm to 10 μm. Another range is 10 to 60 μm. This can result in a surface area of ​​several hundred μm² to several tens of μm². For example, a μ-LED can have a surface area of ​​approximately 2500 μm² and a margin length of approximately 50 μm. In some cases, a μ-LED has a margin length of 5 μm or less, resulting in a surface area size of less than 30 μm². A typical height of such a μ-LED is, for example, in the range of 1.5 μm to 10 μm. 【0128】 Microlight-emitting diode (LED) chips, also known as μLED chips, can be used as optoelectronic components. These microlight-emitting diodes can form pixels or subpixels and emit light of a selected color. 【0129】 The carrier layer 410 is bonded to the outer layer 420 using an intrinsically transparent bonding layer 430, which may be, for example, PVA. The outer layer 420 forms the outer surface of the laminated structure. The outer layer 420 is substantially transparent, but may be colored or tinted, and may be made from glass, or any suitable glazing material such as polycarbonate or acrylic (PMMA) plastic. The laminated structure 400 may include additional intermediate layers not shown. The illustrated laminated structure 400 is suitable for use as a glazing element for vehicle or building window glass or mirrors. However, the optoelectronic arrangements described herein may alternatively be used to provide interactive lighting arrangements on unglazed and / or opaque surfaces, such as the dashboard, glove box, or other interior surfaces of a vehicle, or any suitable surface of a building. Thanks to one or more flexible carrier layers 410, 410', the laminated structure can be applied as a substantially invisible coating or skin to multiple surfaces, including plastics or metals. In this configuration, one of the outer layers 420 can be omitted. 【0130】 The IR radiator 404 and the IR detector 406 together form a proximity sensor having an IR detector that detects reflected IR radiation from objects located in the vicinity of the stacked structure 400. Typically, objects are detected within a range of 30 cm or less, preferably 20 cm or less, from the stacked structure 400 to eliminate the detection of randomly passing objects. In some cases, the IR radiator 404 and IR detector 406 are configured to detect only objects within a very close distance of 5 mm or less, so that relatively small changes in the object's position can be detected. This allows for the detection of hand movement. The IR radiator 404, IR detector 406, and LED 408 are connected to a control circuit or control unit 440 located on the carrier layer 410 and thus forming part of the stacked structure, but located outside the stacked structure in the illustrated configuration. The control unit 440 controls the operation of the IR radiator so that it can be triggered, for example, when the vehicle is stationary, or alternatively, when the vehicle is unlocked and starting. The control unit 440 further receives signals from the IR detector and, in response to detected objects near the stacked structure 400, drives the LED 408 to generate light in a specific pattern and / or color to provide information to the observer. The control unit may also control other functions of the vehicle or building, such as unlocking doors or lowering windows, either directly or by communicating with further control circuits outside the stacked structure 400. 【0131】 Referring next to Figure 18, an alternative interactive laminated structure 400 according to the present invention is shown. This arrangement is similar to that shown in Figure 17, and similar reference numbers are used for similar elements. Thus, the structure 400 includes a carrier layer 410 having a conductive layer 411 and two outer layers 420 bonded to the inner layer using a bonding layer 430. An LED radiator 408 is mounted on the carrier layer 410 and electrically coupled to the conductive layer 411. However, this structure differs from that in Figure 17 by providing an additional carrier layer 410' with a conductive layer 411' arranged in a conductive strip to form a capacitive touch sensor. A control unit 440 in this configuration is connected to the LED 408 and the capacitive touch sensor 411' either wired or wirelessly and selectively controls the current to the LED in response to an increase in output capacitance from the touch sensor 411' to generate a specific pattern and / or color and provide information to the observer. With respect to the arrangement in Figure 17, the control unit can further control other functions of the vehicle or building. 【0132】 Next, referring to Figure 19, further embodiments of the optoelectronic arrangement are shown with different stacked structures 400. Here again, the same reference numerals are used to designate the same elements, so a detailed description of these elements is omitted. In this arrangement, the stacked structure comprises both proximity sensors in the form of an IR radiator 404 and an IR detector 406, and capacitive touch sensors in the form of a conductive layer 411' formed on a strip on an additional carrier layer 410'. Thus, the control unit 440 controls the operation of the LED 408 and, optionally, other functions of the vehicle or building, in response to both the proximity sensors 406, 408 and the capacitive touch sensors 410', 411'. 【0133】 It will be understood that the stacked structure 400 shown in Figures 17-19 may include any desired arrangement of multiple proximity sensors and / or multiple capacitive touch sensors 411' and LEDs 408. Optoelectronic elements 404, 406, 408, and 411' may also be placed at any position and in any arrangement within the glazing structure, and are not limited to the edges of the window. 【0134】 The functionality of the optoelectronic arrangement shown in Figures 17-19 is shown in Figures 20a-20c. Figures 20a-20c show a partial profile of an automobile 10 having a window, at least one of which includes a laminated structure 400 having the optoelectronic arrangement according to the present invention. In Figure 17a, the window and the laminated structure 400 are transparent and no information is displayed. As a user approaches the window, proximity sensors 404, 406 detect the approach, as symbolized by the illustrated hand, and transmit this signal to the control unit 440, which drives an LED 408 to produce light in the form of a symbol 401 on the front side window. This symbol 401 may be a first color or a specific first shape. When the hand moves forward and touches the laminated structure 400, this is detected by a capacitive sensor 411' and the control unit 440, which then drives the LED 408 to correct the displayed information. For example, the control unit may drive an LED to change the color of the displayed symbol from red to green, as shown, for example, by the change from the normal symbol 401 to the thick symbol 402 in Figures 20b and 20c. 【0135】 Modified functionality of the optoelectronics arrangement is shown in Figures 21a-21c. Figures 21a-21c show displayed controls for adjusting the height of the window. Figures 21a-21c each show a partial side view of another vehicle 10 having a front side window including a laminated structure 400. In Figure 21a, there are no objects close to the laminated structure 400, the window is substantially transparent, and there are no visible objects. As shown in Figure 21b, when the illustrated hand approaches the window within a detectable distance, it is detected by proximity sensors 404, 406, and the control unit 440 drives LED 408 to display desired information, in this case the scale represents the slide control unit 403 for the window position. Finally, in Figure 21c, the user can adjust the height of the window to the desired position by sliding or tapping their finger on the slide control. The hand movement is detected by a capacitive touch sensor 411', or by one or more proximity sensors 404, 406, or a combination of both, and the information is relayed to the control unit 440. The control unit 440 may then respond by changing the current to the LED 408 to perform a change in the shape and / or color of the display. For example, the displayed slide control 402 may change color as a finger passes over it to indicate a desired opening of the window, as shown by the dark area on the symbol 403 in Figure 20c. Furthermore, the control unit 440 may generate signals to control the opening and closing of the window to a specified position. 【0136】 It will be understood that the light-emitting element or light source 408, whether an LED or another component, can be arranged on the carrier layer 410 and therefore within the stacked structure (400) in any desired configuration. In other words, the light source 408 forms a single light spot and may therefore be zero-dimensional, or alternatively, arranged in a one-dimensional or two-dimensional configuration. One-dimensional means that a single light spot is perceived by the observer, which may be generated by a group of LEDs 408 of different colors, or by one of the LEDs 408 in this group. 【0137】 Referring next to Figure 22, a beamforming micro-optical element 450 that can be integrated within a laminated structure 400 is shown. As shown in Figure 23, this micro-optical element 450 is essentially a film or layer that can be sandwiched in a laminated structure between a carrier layer 410 to which a light source 456, which may be an LED or a laser, is attached, and an outer layer 420, possibly through one or more intermediate layers. The micro-optical element 450 is formed with optical segments or cells 452, 454 on both sides. In the illustrated example, the micro-optical element 450 has segments in a two-dimensional configuration for channeling light from a single light source and diffusing it into a two-dimensional field. However, it will be understood that such a beamforming element can also be used to create a one-dimensional beam. The segment 454 on the front or receiving side of the optical element 450 is smaller than the segment 452 on the light output side. The segments 454, 452 are further adapted to the size and divergence of the light source 456. The micro-optical element 450 has a refractive index that is preferably at least 0.02 higher than the surrounding material. The combination of input / output segments 454, 452 and the layers between them diffuses the light from the light source 456, deflecting it into a substantially uniform light patch larger than the size of the light source 456. This is shown in Figure 24, illustrating the uniform illumination achievable with the micro-optical element 450. The micro-optical element may be combined with any one of the embodiments described herein to facilitate the generation of desired light symbols while limiting the number of required light sources and associated circuits, and thus to improve the transparency of the laminated structure 400. 【0138】 The micro-optical element 450 may be manufactured by a roll-to-roll method or by lithography and UV molding on top of an outer layer substrate. 【0139】 Figures 25 and 26 show further embodiments of the optoelectronic arrangement in cross-sectional and plan views, respectively, where the sensor 406 and light source 408 are arranged in a two-dimensional array that functions as a basic interactive camera. In the illustrated stacked structure, the light source 408, which may be an LED, and the proximity sensor 406 are grouped together so that an object detected by a group of proximity sensors 406 can trigger adjustment of the light source 408 within the same group. The proximity sensor preferably includes an IR radiator 404 and an IR detector 406, but may alternatively or additionally include an RGB detector for detecting ambient light levels. In this way, the illuminance of the light source 408 can be adjusted according to the local ambient light, and thus can take into account direct sunlight or shadows, as well as be dimmed to adjust for low-light conditions at night. 【0140】 Modified configurations of the optoelectronic arrangement in Figures 25 and 26 are shown in Figures 27 and 28. In the cross-sectional view shown in Figure 25, it can be seen that the lens structure 460 is formed above each proximity sensor, specifically above the IR detector. These lens structures may also be formed above the RGB or ambient light detector, if present. The lens 460 may be pre-structured within the bonding layer 430 before the assembly of the stacked structure 400. The lens 460 works to limit the spatial range of the sensor 406, thus ensuring higher accuracy and more precise control in detecting local obstacles for each group of proximity sensors 406 and light sources 408. 【0141】 In the arrangements shown in Figures 25 to 28, the proximity sensor 406 and / or ambient light detector are mounted near the light sources 408 of the same group, and the special range of the proximity sensor is preferably limited to the group area or just larger than the group area to avoid overlap with adjacent groups. 【0142】 The following lists various devices and configurations, as well as methods for manufacturing, processing, and operating them. These items present various aspects and implementations of the proposed principles and concepts, which can be combined in different ways. Such combinations are not limited to those listed below. 【0143】 Item 1: A monitoring system for monitoring the interior and / or exterior space of an automobile, comprising a plurality of photoelectronic sensor elements (30) adapted to generate a three-dimensional mapping of objects in the space, wherein the sensor elements (30) are electrically connected to a substantially transparent carrier layer (90) adapted to be positioned between a first substantially transparent layer (70) and a second substantially transparent layer (80) to form a substantially transparent laminated structure (20) for use on one or more windows and / or roof panels of the automobile. 【0144】 Item 2: The monitoring system according to Item 1, wherein the sensor elements (30) are arranged in a two-dimensional configuration on the carrier layer (90). 【0145】 Item 3: The monitoring system according to item 1 or 2, wherein the carrier layer (90) is flexible. 【0146】 Item 4: The monitoring system according to any one of items 1 to 3, wherein the sensor element (30) is configured to monitor space using at least one of triangulation, structured light, and ToF (Time of Flight). 【0147】 Item 5: The monitoring system according to any one of Items 1 to 4, wherein the sensor element (30) is arranged to generate three-dimensional detection zones (40, 50, 60) inside and / or outside the vehicle when mounted on the stacked structure (20) of the vehicle. 【0148】 Item 6: The monitoring system according to any one of items 1 to 5, wherein the sensor elements (30; 301, 302, 303) are mounted on the carrier layer (90). 【0149】 Item 7: The monitoring system described in any one of items 1 to 6, wherein the sensor elements (30; 301, 302, 303) are embedded in the carrier layer (90). 【0150】 Item 8: A monitoring system according to any one of items 1 to 7, wherein a bonding layer (100) is provided between the carrier layer (90) and at least one of the first and second layers (70, 80). 【0151】 Item 9: The monitoring system according to any one of items 1 to 8, wherein the carrier layer (90) comprises wiring for the power supply and signal carrier of the sensor (30). 【0152】 Item 10: The monitoring system according to Item 9, wherein the sensor is joined to the carrier layer (90) via the wiring. 【0153】 Item 11: The monitoring system according to any one of items 1 to 10, wherein the sensor (30) comprises a photoelectronic radiator element (301) and a photoelectronic detector element (302). 【0154】 Item 12: The monitoring system according to Item 11, wherein each of the photoelectronic radiator element (301) and photoelectronic detector element (302) comprises at least one lens (311, 321) configured to provide a directional field of view. 【0155】 Item 13: The monitoring system according to Item 10 or 11, wherein the sensor (30) further comprises an image processing and control circuit (330) for controlling at least one photoelectronic radiator element (301) and / or a photoelectronic detector element (302). 【0156】 Item 14: The monitoring system according to any one of items 1 to 13, wherein the sensor (30) has dimensions of 500 μm or less, preferably 200 μm or less. 【0157】 Item 15: The monitoring system described in any one of items 1 to 14, wherein the sensor (30) operates at infrared wavelengths. 【0158】 Item 16: A transparent laminated structure for use in automotive windows and / or roof panels, including a monitoring system as described in any one of items 1 through 15. 【0159】 Item 17: A vehicle containing a transparent laminated structure as described in Item 16. 【0160】 Item 18: The vehicle according to Item 17, wherein the transparent laminated structure includes at least two of the side windows, rear windows, front windows, and roof panels of the automobile. 【0161】 Item 19: An optoelectronic arrangement for use in, for example, a transparent glazing element of a vehicle, comprising: a substantially transparent carrier layer (230); at least one conductor layer (260) including a conductor path provided on at least one side of the carrier layer; at least a plurality of LEDs (240) disposed on the carrier layer (230) and electrically coupled to the conductor path on the conductor layer; and means (250; 280) for determining the temperature of at least one of the LEDs. 【0162】 Item 20: The optoelectronic arrangement according to Item 19, further comprising means (280) for adjusting the operating parameters of the optoelectronic components and at least the LED(240) in accordance with the temperature determined above. 【0163】 Item 21: The optoelectronic arrangement according to Item 19 or 20, wherein the means for determining the temperature of at least one LED comprises at least one temperature sensor (250) disposed on at least one side of the carrier layer (230) and electrically coupled to a conductor path on the conductor layer (230). 【0164】 Item 22: The optoelectronic arrangement according to Item 21, further comprising a reflector (252) positioned around the temperature sensor (250) to reflect heat and / or light from the carrier layer (230). 【0165】 Item 23: The optoelectronic arrangement according to Item 20, wherein the distance between the temperature sensor (250) and the at least one LED (240) is a maximum of 5 cm, preferably a maximum of 1 cm, and more preferably a maximum of 0.5 cm. 【0166】 Item 24: The optoelectronic arrangement according to any one of items 19 to 23, wherein the means for determining the temperature of at least one LED comprises means (280) for measuring the forward voltage (Vf) of at least one LED (240). 【0167】 Item 25: The optoelectronic arrangement according to any one of items 19 to 24, wherein the means for determining the temperature of at least one LED comprises means (280) for measuring the conductivity of a conductive path within the conductive layer (260). 【0168】 Item 26: The optoelectronic arrangement according to any one of items 19 to 25, further comprising at least one substantially transparent outer layer (210) and at least one substantially transparent intermediate layer (220) disposed between the carrier layer (230) and the at least one outer layer (210). 【0169】 Item 27: The optoelectronic arrangement according to any one of items 19 to 26, wherein the carrier layer (230) is thermally insulating. 【0170】 Item 28: The optoelectronic arrangement according to any one of items 19 to 23, wherein the carrier layer (230) comprises two layers (230') separated by a thermal insulating layer (232). 【0171】 Item 29: The optoelectronic arrangement according to any one of items 19 to 28, wherein the plurality of LEDs (230) are arranged on both sides of the carrier layer (230). 【0172】 Item 30: The optoelectronic arrangement according to any one of items 19 to 29, further comprising at least one photodetector (270) mounted on at least one side of the carrier layer to provide a signal indicating the light intensity incident on the optoelectronic arrangement. 【0173】 Item 31: The optoelectronic arrangement according to item 30, further comprising a directional structure (242) positioned on the photodetector (270) and guiding the light to the photodetector as a function of the direction of the received light. 【0174】 Item 32: The optoelectronic apparatus according to any one of items 19 to 31, further comprising a directional structure positioned on at least one LED(240), wherein the directional structure is configured to guide light from the LED in a predetermined direction. 【0175】 Item 33: The means for monitoring the lateral dimensions and temperature of the LED is an optoelectronic arrangement as described in any one of items 19 to 32, wherein the lateral dimensions are ≤300 μm. 【0176】 Item 34: A carrier layer (230) for use in a substantially transparent laminated structure for forming a glazing element suitable for a vehicle, for example, comprising a conductor layer having a conductive path on at least one side, a plurality of LEDs (240) mounted on at least one side and electrically coupled to the conductive path on the conductor layer (260), and means (250; 280) for determining the temperature of at least one of the LEDs. 【0177】 Item 35: The carrier layer according to item 34, further comprising means (280) for adjusting the operation of the LED (240) according to the temperature determined above. 【0178】 Item 36: The carrier layer according to item 34 or 35, wherein the means for determining the temperature of at least one LED comprises at least one temperature sensor (250) disposed on at least one side of the carrier layer (230) and electrically coupled to a conductor path on the conductor layer (230). 【0179】 Item 37: A vehicle that includes at least one optoelectronic arrangement as described in any one of items 19 through 33. 【0180】 Item 38: The vehicle according to item 37, further comprising a controller for controlling the internal temperature of the vehicle according to the determined temperature of the LED(240). 【0181】 Item 39: A method for operating an optoelectronic arrangement described in any one of items 19 to 33, comprising determining the temperature of at least one LED and adjusting the operating parameters of the at least one LED to modify the color of the light produced by the LED. 【0182】 Item 40: The method according to Item 39, further comprising determining the temperature of at least one LED and adjusting the operating parameters of the at least one LED to extend the lifespan of the LED. 【0183】 Item 41: The method according to Item 39 or 40, comprising determining the temperature of at least one LED and signaling the determined temperature to an external air conditioning controller applied to regulate the temperature near the LED. 【0184】 Item 42: An optoelectronic arrangement for use in a transparent glazing element of a vehicle, for example, comprising at least one substantially transparent carrier layer (410), at least one conductor layer (411) including a conductor path provided on at least one side of the carrier layer, at least one light-emitting element (408) disposed on the carrier layer (410) and electrically coupled to the conductor path on the conductor layer (411), and at least one proximity sensor and / or touch sensor (404, 406, 411') disposed on at least one of the carrier layers (410, 410'), further connectable to a control module (440) for controlling the operation of the at least one light-emitting element in response to information from the at least one proximity sensor and / or touch sensor. 【0185】 Item 43: The proximity sensor comprises at least one infrared emitter and at least one infrared detector, an optoelectronic arrangement identified in Item 42. 【0186】 Item 44: The touch sensor is an optoelectronic arrangement identified in Item 42 or 43, which includes a capacitive touch sensor (411'). 【0187】 Item 45: An optoelectronic arrangement identified in any one of the preceding items 42 to 44, wherein at least one carrier layer (410') includes a conductive strip (411') that functions as a capacitive touch sensor. 【0188】 Item 46: The control unit (440) is at least partially mounted on at least one carrier layer (410) and is an optoelectronic arrangement identified in any one of items 42 to 45. 【0189】 Item 47: An optoelectronic arrangement identified in any one of items 42 to 46, further comprising a plurality of light-emitting elements arranged in a one-dimensional, preferably two-dimensional, array, wherein at least one light-emitting element is individually controllable by the control unit (440). 【0190】 Item 48: The at least one light-emitting element is an optoelectronic arrangement identified in any one of items 42 to 47, which includes an LED(480), preferably a microLED. 【0191】 Item 49: An optoelectronic arrangement identified in any one of items 42 to 48, wherein the light-emitting element includes a laser (456). 【0192】 Item 50: An optoelectronic arrangement identified in any one of items 42 to 49, further comprising at least one ambient light detector mounted on the at least one carrier layer (410), wherein the control unit (440) is configured to control the illuminance of the light source in response to signals from the at least one ambient light detector. 【0193】 Item 51: An optoelectronic arrangement identified in any one of items 42 to 50, wherein at least one light-emitting element (408) and at least one proximity sensor (408) are arranged in a group, and the control unit is configured to control the operation of each group of light-emitting elements in response to a signal from at least one proximity sensor in the same group. 【0194】 Item 52: An optoelectronic arrangement identified in Item 50, wherein each group includes at least one ambient light detector, and a control unit (440) is configured to control the illuminance of a group of light-emitting elements in response to signals from ambient light detectors of the same group. 【0195】 Item 53: The ambient light detector is a photodiode, preferably an RGB photodiode, in an optoelectronic arrangement identified in Item 49 or 51. 【0196】 Item 54: An optoelectronic arrangement identified in any one of the preceding items 42 to 53, further comprising a lens structure positioned on at least one of the proximity sensors (406). 【0197】 Item 55: An optoelectronic arrangement identified in any one of items 42 to 54, further comprising at least one optical layer (450) bonded to the carrier layer (410) on the light source (456) and diffusing the light from each light-emitting element (456) into a light patch having substantially uniform illumination and a diameter larger than the light source. 【0198】 Item 56: The optoelectronic arrangement identified in Item 54, wherein the optical layer includes an array of optical segments (454) on an input surface and an array of optical segments (452) on an output surface, the segments (452) on the output surface being larger than the segments (454) on the input surface. 【0199】 Item 57: The optoelectronic arrangement identified in Item 54, wherein the array of optical segments is one-dimensional, preferably two-dimensional. 【0200】 Item 58: An optoelectronic arrangement identified in any one of items 42 to 57, wherein the lateral dimensions of the light-emitting element, proximity sensor, and touch sensor are ≤300 μm. 【0201】 Item 59: An optoelectronic arrangement identified in any one of items 42 to 58, wherein the at least one carrier layer (410) is flexible and preferably made from a thermoplastic material such as PET. 【0202】 Item 60: The optoelectronic arrangement according to any one of items 42 to 59, wherein the at least one conductive layer (411, 411') is a substantially transparent metal oxide such as ITO. 【0203】 Item 61: An optoelectronic arrangement identified in any one of items 42 to 60, further comprising at least one outer layer (420), the outer layer being bonded to the at least one carrier layer by a bonding layer (430), the outer layer being preferably made of glass, polycarbonate, or PMMA. 【0204】 Item 62: A vehicle having at least one optoelectronic arrangement identified in any one of items 42 through 58. [Explanation of Symbols] 【0205】 10. Automobiles 20 Transparent laminated structure 30 Photoelectronics Sensors 40 light path 50 detection zones 60 detection zones 70 Front layer 80 Posterior layer 90 Career Level 100 bonding layer 200 Laminated structure 210 Cover layer 220 laminated layer 230 Career Level 230 Career Level 232 Thermal insulation layer 240 LED 242 Directional structure 250 Temperature Sensor 252 Reflector 260 Conductor layer 270 Photodetectors 272 Directional structure 274 Directional beam 280 Control circuits 301 Radiator element 302 Detection element 303 Image Processing Circuit 310 Semiconductor main unit 311 Lens 320 Semiconductor main unit 321 Lens 400 laminated structure 401 Light Symbol 402 Bold Light Symbol 403 Slide control symbol 404 IR radiator 406 IR detector 408 LED radiator 410 Career Level 410 Career Level 411 Conductor layer 411 Conductor layer 420 Outer layer 430 Bonding layer 440 Control Unit 450 Micro Optical Elements 452 Optical Segments 454 Optical Segments 456 Light source 460 lens

Claims

[Claim 1] A monitoring system for monitoring the interior and / or exterior space of an automobile, comprising a plurality of photoelectronic sensor elements (30) adapted to generate a three-dimensional mapping of objects in the space, wherein the sensor elements (30) are electrically connected to a substantially transparent carrier layer (90) adapted to be positioned between a substantially transparent first layer (70) and a substantially transparent second layer (80) to form a substantially transparent laminated structure (20) for use on one or more windows and / or roof panels of the automobile. [Claim 2] The monitoring system according to claim 1, wherein the sensor elements (30) are arranged in a two-dimensional configuration on the carrier layer (90). [Claim 3] The monitoring system according to claim 1 or 2, wherein the carrier layer (90) is flexible. [Claim 4] The monitoring system according to any one of claims 1 to 3, wherein the sensor element (30) is configured to monitor space using at least one of triangulation, structured light, and Time of Flight (ToF). [Claim 5] The monitoring system according to any one of claims 1 to 4, wherein the sensor element (30) is arranged to generate three-dimensional detection zones (40, 50, 60) inside and / or outside the automobile when attached to the stacked structure (20) of the automobile. [Claim 6] The monitoring system according to any one of claims 1 to 5, wherein the sensor elements (30; 301, 302, 303) are mounted on the carrier layer (90). [Claim 7] The monitoring system according to any one of claims 1 to 3, wherein the sensor elements (30; 301, 302, 303) are embedded in the carrier layer (90). [Claim 8] The monitoring system according to any one of claims 1 to 7, wherein the bonding layer (100) is provided between the carrier layer (90) and at least one of the first and second layers (70, 80). [Claim 9] The monitoring system according to any one of claims 1 to 8, wherein the carrier layer (90) comprises wiring for the power supply and signal carrier of the sensor element (30). [Claim 10] The monitoring system according to claim 9, wherein the sensor element (30) is joined to the carrier layer (90) via the wiring. [Claim 11] The monitoring system according to any one of claims 1 to 10, wherein the sensor element (30) comprises a photoelectronic radiator element (301) and a photoelectronic detector element (302). [Claim 12] The monitoring system according to claim 11, wherein each of the photoelectronic radiator element (301) and photoelectronic detector element (302) comprises at least one lens (311, 321) configured to provide a directional field of view. [Claim 13] The monitoring system according to claim 10 or 11, wherein the sensor element (30) further comprises an image processing and control circuit (303) for controlling at least one photoelectronic radiator element (301) and / or a photoelectronic detector element (302). [Claim 14] The monitoring system according to any one of claims 1 to 13, wherein the sensor element (30) operates at infrared wavelengths. [Claim 15] A transparent laminated structure for use in the windows and / or roof panels of an automobile, comprising a monitoring system according to any one of claims 1 to 14. [Claim 16] A vehicle comprising the transparent laminated structure described in claim 15. [Claim 17] The vehicle according to claim 16, wherein the transparent laminated structure includes at least two of the side windows, rear windows, front windows, and roof panels of the automobile.

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