Gaming machine
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- DAIICHI SHOKAI KK
- Filing Date
- 2023-08-22
- Publication Date
- 2026-06-12
AI Technical Summary
【0009】 本発明の遊技機においては、信頼性の低下を抑制することができる。
Smart Images

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Abstract
Claims
[Claim 1] A gaming machine having multiple circuit boards on which multiple electronic components are mounted, Of the aforementioned plurality of substrates, a specific substrate is Beta Ground and Multiple test points used to inspect the electronic components to be installed, It comprises a plurality of connection points to which the connection terminals of the aforementioned electronic component are soldered, At least one of the front and back surfaces of the specified substrate is: An IC having two sets of opposing sides, A capacitor is mounted adjacent to the IC, on a specific side of the IC. A specific connection point among the connection points to which the connection terminals of the capacitor are soldered is connected to the ground plane of the specific substrate by a thermal pattern formed so as to be located around the specific connection point. The IC has a plurality of connection terminals formed along at least one of the two opposing sets of sides that does not include the specific side. Of the multiple connection points to which the multiple connection terminals of the IC are soldered, the special connection point to which the special connection terminals located on the special side opposite the specific side are soldered is connected to the ground plane of the specific substrate by a thermal pattern formed so as to be located around the special connection point. A specific test point among the plurality of test points is connected to the ground plane of the specific substrate by a thermal pattern formed to be located around the specific test point. Furthermore, the aforementioned specific substrate is covered with a resist film over substantially the entire area of the front substrate surface and the back substrate surface. The thermal pattern formed to be located around the special connection portion is covered at least in part with the resist film. Furthermore, the aforementioned specific substrate is provided with a plurality of circular specific test points. A through-hole for a ground plane is formed on the front surface of the specified substrate to electrically connect the front ground plane and the back ground plane on the back surface of the specified substrate, and multiple such through-holes for a ground plane are formed in the vicinity of at least one of the specified test points without any electronic components or signal wiring patterns in between. A gaming machine characterized by the following features.