Gaming machine

JP7873824B2Active Publication Date: 2026-06-15DAIICHI SHOKAI KK

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
DAIICHI SHOKAI KK
Filing Date
2023-08-22
Publication Date
2026-06-15

Smart Images

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Patent Text Reader

Abstract

To provide a game machine which can suppress deterioration of security against fraudulent acts on an electronic board.SOLUTION: A game machine includes a plurality of substrates each mounted with a plurality of electronic components, carries out a lottery on the basis of satisfaction of a start condition, and gives a privilege on the basis of a result of the lottery. The plurality of substrates includes a main control board which executes processing related to the lottery, and a plurality of performance boards related to control of multiple pieces of performance means on the basis of a signal from the main control board. A special performance board of the plurality of performance boards is mounted at least with a specific electronic component which controls specific performance means of the multiple pieces of performance means, and a special electronic component electrically connected with the specific electronic component. The special electronic component is arranged adjacently to the specific electronic component with an electronic component non-mountable area on which no electronic component can be mounted being between the special electronic component and the specific electronic component, and has an exterior of a special color different from colors of other electronic components mounted on the special performance board.SELECTED DRAWING: Figure 129
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Claims

[Claim 1] A gaming machine having multiple circuit boards on which multiple electronic components are mounted, Of the aforementioned plurality of substrates, a specific substrate is Beta Ground and Multiple test points used to inspect the electronic components to be installed, It comprises a plurality of connection points to which the connection terminals of the aforementioned electronic component are soldered, At least one of the front and back surfaces of the specified substrate is: An IC having two sets of opposing sides, A capacitor is mounted adjacent to the IC, on a specific side of the IC. A specific connection point among the connection points to which the connection terminals of the capacitor are soldered is connected to the ground plane of the specific substrate by a thermal pattern formed so as to be located around the specific connection point. The IC has a plurality of connection terminals formed along at least one of the two opposing sets of sides that does not include the specific side. Of the multiple connection points to which the multiple connection terminals of the IC are soldered, the special connection point to which the special connection terminals located on the special side opposite the specific side are soldered is connected to the ground plane of the specific substrate by a thermal pattern formed so as to be located around the special connection point. A specific test point among the plurality of test points is connected to the ground plane of the specific substrate by a thermal pattern formed to be located around the specific test point. Furthermore, the specified substrate has through-holes for ground planes that electrically connect the front ground plane on the front surface of the specified substrate and the back ground plane on the back surface of the specified substrate, and multiple such through-holes for ground planes are formed in close proximity to the specified test point without any electronic components or signal wiring patterns in between. A gaming machine characterized by the following features.