Gaming machine

JP7873825B2Active Publication Date: 2026-06-15DAIICHI SHOKAI KK

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
DAIICHI SHOKAI KK
Filing Date
2023-08-22
Publication Date
2026-06-15

AI Technical Summary

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【0009】 本発明の遊技機においては、信頼性の低下を抑制することができる。

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Patent Text Reader

Abstract

To provide a game machine which can suppress deterioration of security against fraudulent acts on an electronic board.SOLUTION: A game machine includes a plurality of substrates each mounted with a plurality of electronic components, carries out a lottery on the basis of satisfaction of a start condition, and gives a privilege on the basis of a result of the lottery. The plurality of substrates includes a main control board which executes processing related to the lottery, and a plurality of performance boards related to control of multiple pieces of performance means on the basis of a signal from the main control board. A special performance board of the plurality of performance boards is mounted at least with a specific electronic component which controls specific performance means of the multiple pieces of performance means, and a special electronic component electrically connected with the specific electronic component. The special electronic component is arranged adjacently to the specific electronic component with an electronic component non-mountable area on which no electronic component can be mounted being between the special electronic component and the specific electronic component, and has an exterior of a special color different from colors of other electronic components mounted on the special performance board.SELECTED DRAWING: Figure 129
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Claims

[Claim 1] A gaming machine having multiple circuit boards on which multiple electronic components are mounted, Of the aforementioned plurality of substrates, a specific substrate is Beta Ground and Multiple test points used to inspect the electronic components to be installed, It comprises a plurality of connection points to which the connection terminals of the aforementioned electronic component are soldered, At least one of the front and back surfaces of the specified substrate is: An IC having two sets of opposing sides, A capacitor is mounted adjacent to the IC, on a specific side of the IC. A specific connection point among the connection points to which the connection terminals of the capacitor are soldered is connected to the ground plane of the specific substrate by a thermal pattern formed so as to be located around the specific connection point. The IC has a plurality of connection terminals formed along at least one of the two opposing sets of sides that does not include the specific side. Of the multiple connection points to which the multiple connection terminals of the IC are soldered, the special connection point to which the special connection terminals located on the special side opposite the specific side are soldered is connected to the ground plane of the specific substrate by a thermal pattern formed so as to be located around the special connection point. A specific test point among the plurality of test points is connected to the ground plane of the specific substrate by a thermal pattern formed to be located around the specific test point. Furthermore, the aforementioned specific substrate is covered with a resist film over substantially the entire area of ​​the front substrate surface and the back substrate surface. Each of the thermal patterns formed to be located around the specific connection portion and the thermal patterns formed to be located around the special connection portion is covered at least in part with the resist film. A gaming machine characterized by the following features.