Wiring circuit board and method for manufacturing the same
JP7875059B2Active Publication Date: 2026-06-17NITTO DENKO CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- NITTO DENKO CORP
- Filing Date
- 2022-07-07
- Publication Date
- 2026-06-17
AI Technical Summary
Benefits of technology
【0038】 本発明によれば、配線回路基板に対する接続対象物の取り付け状態を容易に把握することが可能になる。
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Smart Images
Figure 0007875059000001 
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Figure 0007875059000003
Abstract
To provide a wiring circuit board and a manufacturing method thereof capable of easily grasping an attachment state of a connection object.SOLUTION: A connection portion 29 of an object 2 to be connected is connected to a portion 139 to be connected of a wiring circuit board 1. The wiring circuit board 1 includes a base insulating layer 20 and a first conductive layer 50 formed on the base insulating layer 20. The first conductive layer 50 constitutes first wiring portions b1 and b2. A second insulating layer 60 is formed on the first insulating layer 50 so as to cover at least one portion of the first wiring portions b1 and b2. A second conductive layer 60 is further formed on the second insulating layer 60. The second conductive layer 60 has a contact point AA1 that faces a different part from the connection portion 29 of the object 2 to be connected in a status where the connection portion 29 of the object 2 to be connected is attached on the portion 139 to be connected.SELECTED DRAWING: Figure 4
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